CERAMIC CHIP INDUCTORS C1HQ SERIES 1. PART NO. EXPRESSION : C 1 H Q - 1 N 0 S - □□ (a) (c) (b) (d) (e) (a) Series code (d) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10% (b) Category Code (e) 10: Standard 11 ~ 99 : Internal control number (c) Inductance code : 1N0 = 1.0nH 2. C0NFIGURATION & DIMENSIONS : A D B C L H G Recommended PC Board Pattern Unit:m/m A B C D 1.00± 0.05 0.60± 0.10 0.50± 0.05 0.175± 0.075 L 1.55 Ref. G H 0.50~0.55 0.60~0.70 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) (a) Body : ceramic ( Pb Free ) (b) Termination : ( Pb Free ) Sn(100%)-3.0um(min.) 5. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +105° C ( including self-temperature. rise ) b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C1HQ SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Inductance Test Frequency Q (nH) ( MHz ) Min Q(Typ.) Frequency(MHz) 300 800 900 1500 1800 Rated Current DC Resistance (Ω) SRF ( MHz ) (mA) Max Typ. Max. Typ. 0.07 >13000 10000 Min. C1HQ-1N0S-10 1.0 100 8 53 129 147 217 244 710 0.014 C1HQ-1N2S-10 1.2 100 8 45 97 110 156 177 710 0.016 0.07 >13000 10000 C1HQ-1N5S-10 1.5 100 8 35 69 76 104 116 710 0.030 0.07 >13000 8000 C1HQ-1N8S-10 1.8 100 8 32 61 66 92 100 710 0.035 0.07 11000 6000 C1HQ-2N0S-10 2.0 100 8 38 68 73 94 103 660 0.035 0.08 10500 6000 C1HQ-2N2S-10 2.2 100 8 37 67 71 92 101 660 0.040 0.08 10000 6000 C1HQ-2N4S-10 2.4 100 8 34 54 59 74 86 630 0.050 0.09 9600 6000 6000 C1HQ-2N7S-10 2.7 100 8 30 49 52 67 73 630 0.060 0.09 9200 C1HQ-3N0S-10 3.0 100 8 31 51 54 70 76 570 0.070 0.11 8700 6000 C1HQ-3N3S-10 3.3 100 8 32 54 57 72 79 540 0.075 0.12 8300 6000 C1HQ-3N6S-10 3.6 100 8 33 53 56 71 77 500 0.080 0.14 7800 5000 C1HQ-3N9S-10 3.9 100 8 34 53 56 70 76 490 0.085 0.15 7300 4000 C1HQ-4N3S-10 4.3 100 8 29 47 50 64 71 470 0.090 0.16 6900 4000 C1HQ-4N7S-10 4.7 100 8 30 48 51 65 72 450 0.095 0.17 6400 4000 C1HQ-5N1S-10 5.1 100 8 30 48 51 64 71 430 0.110 0.19 6300 4000 30 48 51 65 71 420 0.120 0.20 6200 4000 C1HQ-5N6S-10 5.6 100 8 C1HQ-6N2S-10 6.2 100 8 31 49 52 66 72 400 0.130 0.22 6100 3900 C1HQ-6N8S-10 6.8 100 8 28 44 49 59 64 390 0.130 0.23 6000 3900 C1HQ-7N5S-10 7.5 100 8 28 45 50 60 65 370 0.135 0.25 5500 3700 C1HQ-8N2S-10 8.2 100 8 29 46 50 62 66 360 0.140 0.27 5000 3600 C1HQ-9N1S-10 9.1 100 8 29 45 49 59 62 350 0.150 0.29 4800 3400 3200 C1HQ-10NS-10 10 100 8 28 45 48 57 60 330 0.165 0.31 4500 26 40 45 51 52 300 0.165 0.39 4300 2700 25 38 42 49 51 280 0.190 0.45 4100 2300 C1HQ-12NS-10 12 100 8 C1HQ-15NS-10 15 100 8 Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10% NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C1HQ SERIES 7. CHARACTERISTICS CURVES : Impedance v.s. Frequency Characteristics HCI1005 HQ Z VS Fr eq. IMPEDANCE(Ohm) 1000 100 15n 8.2n 10 4.7n 1 2.7n 1.5n 0. 1 1 10 100 1000 10000 FREQUENCY(MHz) Inductance v.s. Frequency Characteristics HCI1005HQ L VS Freq. INDUCTANCE(nH) 100 15n 8.2n 10 4.7n 2.7n 1.5n 1 1 10 100 1000 10000 FREQUENCY(MHz) Q v.s. Frequency Characteristics HCI1005HQ Q VS Freq. Q 100 1.5n 10 15n 4.7n 1 1 10 100 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C1HQ SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern Unit:m/m L H G L G H 1.55 0.50~0.55 0.60~0.70 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 8-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that a soldering iron must be employed the following precautions are reCommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350° C tip temperature (max) f) Limit soldering time to 4 ~ 5 secs. c) Never Contact the ceramic with the iron tip Soldering Natural Cooling 20~40s TP(26 0° C/40 s max.) 217 200 150 60~150s 60~180s 25 4 80s max. Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Soldering Within 4~5s Natural Cooling 350 150 Time(sec.) O ve r 1min. Figure 1. Re-flow Soldering : 3 times max G rad ual C0oling Figure 2. Hand Soldering : 1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C1HQ SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Minimum fillet height = soldering thickness + 25% product height Upper limit t ReC0mmendable Figure 3 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C1HQ SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension COVER TAPE ØC D B 2.0± 0.5 A Type A(mm) B(mm) C(mm) D(mm) 7" x 8mm 10± 1.5 50 or more 13± 0.2 178.0± 2.0 EMBOSSED CARRIER 9-2 Tape Dimension / 8mm Material : Paper Po:4± 0.1 D:1.56+0.1-0.05 Bo Ao P Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) C1HQ 1.15± 0.10 0.75± 0.10 0.80 max 2.0± 0.05 0.80 max W:8.0± 0.1 t F:3.5± 0.1 E:1.75± 0.1 P2:2± 0.10 Ko 9-3. Packaging Quantity Chip Size C1HQ Chip / Reel 10000 Inner Box 50000 Middle Box 250000 Carton 500000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C1HQ SERIES 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° C to 180° C Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7