dsPIC30F5011/5013 Data Sheet High-Performance, 16-Bit Digital Signal Controllers © 2007 Microchip Technology Inc. DS70116G Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70116G-page ii © 2007 Microchip Technology Inc. dsPIC30F5011/5013 dsPIC30F5011/5013 High-Performance Digital Signal Controllers Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). High-Performance Modified RISC CPU: • • • • • • • • • • Modified Harvard architecture C compiler optimized instruction set architecture Flexible addressing modes 83 base instructions 24-bit wide instructions, 16-bit wide data path 66 Kbytes on-chip Flash program space 4 Kbytes of on-chip data RAM 1 Kbyte of nonvolatile data EEPROM 16 x 16-bit working register array Up to 30 MIPS operation: - DC to 40 MHz external clock input - 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x) • Up to 41 interrupt sources: - 8 user selectable priority levels - 5 external interrupt sources - 4 processor traps DSP Features: • Dual data fetch • Modulo and Bit-Reversed modes • Two 40-bit wide accumulators with optional saturation logic • 17-bit x 17-bit single cycle hardware fractional/ integer multiplier • All DSP instructions are single cycle - Multiply-Accumulate (MAC) operation • Single cycle ±16 shift © 2007 Microchip Technology Inc. Peripheral Features: • High-current sink/source I/O pins: 25 mA/25 mA • Five 16-bit timers/counters; optionally pair up 16-bit timers into 32-bit timer modules • 16-bit Capture input functions • 16-bit Compare/PWM output functions • Data Converter Interface (DCI) supports common audio codec protocols, including I2S and AC’97 • 3-wire SPI modules (supports 4 Frame modes) • I2C™ module supports Multi-Master/Slave mode and 7-bit/10-bit addressing • Two addressable UART modules with FIFO buffers • Two CAN bus modules compliant with CAN 2.0B standard Analog Features: • 12-bit Analog-to-Digital Converter (ADC) with: - 200 ksps conversion rate - Up to 16 input channels - Conversion available during Sleep and Idle • Programmable Low-Voltage Detection (PLVD) • Programmable Brown-out Detection and Reset generation Special Microcontroller Features: • Enhanced Flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100K (typical) • Data EEPROM memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1M (typical) • Self-reprogrammable under software control • Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Flexible Watchdog Timer (WDT) with on-chip lowpower RC oscillator for reliable operation DS70116G-page 1 dsPIC30F5011/5013 Special Microcontroller Features (Cont.): CMOS Technology: • Fail-Safe Clock Monitor operation: - Detects clock failure and switches to on-chip low-power RC oscillator • Programmable code protection • In-Circuit Serial Programming™ (ICSP™) programming capability • Selectable Power Management modes: - Sleep, Idle and Alternate Clock modes • • • • Low-power, high-speed Flash technology Wide operating voltage range (2.5V to 5.5V) Industrial and Extended temperature ranges Low power consumption dsPIC30F5011/5013 Controller Family Program Memory dsPIC30F5013 80 DS70116G-page 2 66K 66K 22K 22K 4096 4096 1024 1024 5 5 8 8 CAN 64 I2C™ dsPIC30F5011 Output SRAM EEPROM Timer Input Codec A/D 12-bit Comp/Std Bytes Bytes 16-bit Cap Interface 200 ksps Bytes Instructions PWM SPI Pins UART Device 8 AC’97, I2S 16 ch 2 2 1 2 8 I2S 16 ch 2 2 1 2 AC’97, © 2007 Microchip Technology Inc. dsPIC30F5011/5013 Pin Diagrams 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 CSDO/RG13 CSDI/RG12 CSCK/RG14 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VSS OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 64-Pin TQFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 dsPIC30F5011 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 EMUC1/SOSCO/T1CK/CN0/RC14 EMUD1/SOSCI/T4CK/CN1/RC13 EMUC2/OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKI VDD SCL/RG2 SDA/RG3 EMUC3/SCK1/INT0/RF6 U1RX/SDI1/RF2 EMUD3/U1TX/SDO1/RF3 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 COFS/RG15 T2CK/RC1 T3CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 AN1/VREF-/CN3/RB1 AN0/VREF+/CN2/RB0 Note: For descriptions of individual pins, see Section 1.0 “Device Overview”. © 2007 Microchip Technology Inc. DS70116G-page 3 dsPIC30F5011/5013 Pin Diagrams (Continued) IC5/RD12 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 OC7/CN15/RD6 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 OC8/CN16/RD7 C1TX/RF1 C1RX/RF0 VDD VSS CSCK/RG14 CN23/RA7 CN22/RA6 C2RX/RG0 C2TX/RG1 CSDI/RG12 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 CSDO/RG13 80-Pin TQFP 60 EMUC1/SOSCO/T1CK/CN0/RC14 59 EMUD1/SOSCI/CN1/RC13 58 EMUC2/OC1/RD0 57 56 IC4/RD11 IC3/RD10 6 55 IC2/RD9 IC1/RD8 COFS/RG15 1 T2CK/RC1 2 T3CK/RC2 3 T4CK/RC3 T5CK/RC4 SCK2/CN8/RG6 4 5 7 54 SDO2/CN10/RG8 8 53 INT4/RA15 MCLR 9 52 SS2/CN11/RG9 VSS 10 51 INT3/RA14 VSS 11 50 VDD 12 49 OSC2/CLKO/RC15 OSC1/CLKI INT1/RA12 13 48 VDD 14 47 SCL/RG2 15 46 SDA/RG3 SDI2/CN9/RG7 INT2/RA13 AN5/CN7/RB5 dsPIC30F5013 Note: 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 AVSS AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 IC7/CN20/RD14 IC8/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5 U1TX/RF3 AN8/RB8 41 AVDD 20 25 U1RX/RF2 PGD/EMUD/AN0/CN2/RB0 24 EMUD3/SDO1/RF8 42 VREF+/RA10 43 19 23 18 VREF-/RA9 AN2/SS1/LVDIN/CN4/RB2 PGC/EMUC/AN1/CN3/RB1 21 SDI1/RF7 22 EMUC3/SCK1/INT0/RF6 44 AN7/RB7 45 AN6/OCFA/RB6 16 17 AN4/CN6/RB4 AN3/CN5/RB3 For descriptions of individual pins, see Section 1.0 “Device Overview”. DS70116G-page 4 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 CPU Architecture Overview........................................................................................................................................................ 13 3.0 Memory Organization ................................................................................................................................................................. 23 4.0 Address Generator Units............................................................................................................................................................ 35 5.0 Interrupts .................................................................................................................................................................................... 41 6.0 Flash Program Memory.............................................................................................................................................................. 47 7.0 Data EEPROM Memory ............................................................................................................................................................. 53 8.0 I/O Ports ..................................................................................................................................................................................... 59 9.0 Timer1 Module ........................................................................................................................................................................... 65 10.0 Timer2/3 Module ........................................................................................................................................................................ 69 11.0 Timer4/5 Module ....................................................................................................................................................................... 75 12.0 Input Capture Module................................................................................................................................................................. 79 13.0 Output Compare Module ............................................................................................................................................................ 83 14.0 SPI Module................................................................................................................................................................................. 87 15.0 I2C Module ................................................................................................................................................................................. 91 16.0 Universal Asynchronous Receiver Transmitter (UART) Module ................................................................................................ 99 17.0 CAN Module ............................................................................................................................................................................. 107 18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 119 19.0 12-bit Analog-to-Digital Converter (ADC) Module .................................................................................................................... 129 20.0 System Integration ................................................................................................................................................................... 139 21.0 Instruction Set Summary .......................................................................................................................................................... 155 22.0 Development Support............................................................................................................................................................... 163 23.0 Electrical Characteristics .......................................................................................................................................................... 167 24.0 Packaging Information.............................................................................................................................................................. 207 Index .................................................................................................................................................................................................. 213 The Microchip Web Site ..................................................................................................................................................................... 219 Customer Change Notification Service .............................................................................................................................................. 219 Customer Support .............................................................................................................................................................................. 219 Reader Response .............................................................................................................................................................................. 220 Product Identification System ............................................................................................................................................................ 221 © 2007 Microchip Technology Inc. DS70116G-page 5 dsPIC30F5011/5013 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70116G-page 6 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 1.0 DEVICE OVERVIEW Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual“ (DS70157). © 2007 Microchip Technology Inc. This document contains specific information for the dsPIC30F5011/5013 Digital Signal Controller (DSC) devices. The dsPIC30F5011/5013 devices contain extensive Digital Signal Processor (DSP) functionality within a high-performance 16-bit microcontroller (MCU) architecture. Figure 1-1 and Figure 1-2 show device block diagrams for dsPIC30F5011 and dsPIC30F5013, respectively. DS70116G-page 7 dsPIC30F5011/5013 FIGURE 1-1: dsPIC30F5011 BLOCK DIAGRAM Y Data Bus X Data Bus 16 16 Interrupt Controller PSV & Table Data Access 24 Control Block 8 16 Data Latch Y Data RAM (2 Kbytes) Address Latch 16 24 16 24 Address Latch Data EEPROM (1 Kbyte) Data Latch X Data RAM (2 Kbytes) Address Latch 16 AN0/VREF+/CN2/RB0 AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/IC7/CN6/RB4 AN5/IC8/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 16 16 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Program Memory (66 Kbytes) 16 Effective Address 16 Data Latch ROM Latch PORTB 16 24 IR 16 16 x 16 W Reg Array Decode PORTC Instruction Decode & Control 16 16 Control Signals to Various Blocks OSC1/CLKI Power-up Timer DSP Engine EMUC2/OC1/RD0 EMUD2/OC2/RD1 OC3/RD2 OC4/RD3 OC5/IC5/CN13/RD4 OC6/IC6/CN14/RD5 OC7/CN15/RD6 OC8/CN16/RD7 IC1/INT1/RD8 IC2/INT2/RD9 IC3/INT3/RD10 IC4/INT4/RD11 Divide Unit Oscillator Start-up Timer Timing Generation ALU<16> POR/BOR Reset MCLR VDD, VSS AVDD, AVSS CAN1, CAN2 T2CK/RC1 T3CK/RC2 EMUD1/SOSCI/T4CK/CN1/RC13 EMUC1/SOSCO/T1CK/CN0/RC14 OSC2/CLKO/RC15 16 Watchdog Timer Low-Voltage Detect 12-bit ADC Timers Input Capture Module DCI 16 16 PORTD Output Compare Module I2C™ SPI1, SPI2 UART1, UART2 C1RX/RF0 C1TX/RF1 U1RX/SDI1/RF2 EMUD3/U1TX/SDO1/RF3 U2RX/CN17/RF4 U2TX/CN18/RF5 EMUC3/SCK1/INT0/RF6 PORTF C2RX/RG0 C2TX/RG1 SCL/RG2 SDA/RG3 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 SS2/CN11/RG9 CSDI/RG12 CSDO/RG13 CSCK/RG14 COFS/RG15 PORTG DS70116G-page 8 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 1-2: dsPIC30F5013 BLOCK DIAGRAM CN22/RA6 CN23/RA7 VREF-/RA9 VREF+/RA10 INT1/RA12 INT2/RA13 INT3/RA14 INT4/RA15 Y Data Bus X Data Bus Interrupt Controller PSV & Table Data Access 24 Control Block 8 16 16 16 Data Latch Y Data RAM (2 Kbytes) Address Latch 16 24 16 24 Address Latch Data EEPROM (1 Kbyte) Data Latch X Data RAM (2 Kbytes) Address Latch 16 16 PORTA PGD/EMUD/AN0/CN2/RB0 PGC/EMUC/AN1/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 AN6/OCFA/RB6 AN7/RB7 AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 16 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Program Memory (66 Kbytes) 16 Effective Address 16 Data Latch ROM Latch 16 24 PORTB T2CK/RC1 T3CK/RC2 T4CK/RC3 T5CK/RC4 EMUD1/SOSCI/CN1/RC13 EMUC1/SOSCO/T1CK/CN0/RC14 OSC2/CLKO/RC15 IR 16 16 16 x 16 W Reg Array Decode Instruction Decode & Control Control Signals to Various Blocks OSC1/CLKI Power-up Timer DSP Engine EMUC2/OC1/RD0 EMUD2/OC2/RD1 OC3/RD2 OC4/RD3 OC5/CN13/RD4 OC6/CN14/RD5 OC7/CN15/RD6 OC8/CN16/RD7 IC1/RD8 IC2/RD9 IC3/RD10 IC4/RD11 IC5/RD12 IC6/CN19/RD13 IC7/CN20/RD14 IC8/CN21/RD15 Divide Unit Oscillator Start-up Timer Timing Generation ALU<16> POR/BOR Reset MCLR VDD, VSS AVDD, AVSS CAN1, CAN2 PORTC 16 16 Watchdog Timer Low-Voltage Detect 12-bit ADC Timers 16 16 PORTD Input Capture Module DCI Output Compare Module I2C™ SPI1, SPI2 UART1, UART2 C1RX/RF0 C1TX/RF1 U1RX/RF2 U1TX/RF3 U2RX/CN17/RF4 U2TX/CN18/RF5 EMUC3/SCK1/INT0/RF6 SDI1/RF7 EMUD3/SDO1/RF8 PORTF C2RX/RG0 C2TX/RG1 SCL/RG2 SDA/RG3 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 SS2/CN11/RG9 CSDI/RG12 CSDO/RG13 CSCK/RG14 COFS/RG15 PORTG © 2007 Microchip Technology Inc. DS70116G-page 9 dsPIC30F5011/5013 Table 1-1 provides a brief description of device I/O pinouts and the functions that may be multiplexed to a port pin. Multiple functions may exist on one port pin. When multiplexing occurs, the peripheral module’s functional requirements may force an override of the data direction of the port pin. TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Type Buffer Type AN0-AN15 I Analog Pin Name Description Analog input channels. AN0 and AN1 are also used for device programming data and clock inputs, respectively. AVDD P P AVSS P P CLKI I ST/CMOS CLKO O — CN0-CN23 I ST Input change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. COFS CSCK CSDI CSDO I/O I/O I O ST ST ST — Data Converter Interface Frame Synchronization pin. Data Converter Interface Serial Clock input/output pin. Data Converter Interface Serial data input pin. Data Converter Interface Serial data output pin. C1RX C1TX C2RX C2TX I O I O ST — ST — CAN1 Bus Receive pin. CAN1 Bus Transmit pin. CAN2 Bus Receive pin. CAN2 Bus Transmit pin EMUD EMUC EMUD1 I/O I/O I/O ST ST ST EMUC1 EMUD2 EMUC2 EMUD3 I/O I/O I/O I/O ST ST ST ST EMUC3 I/O ST ICD Primary Communication Channel data input/output pin. ICD Primary Communication Channel clock input/output pin. ICD Secondary Communication Channel data input/output pin. ICD Secondary Communication Channel clock input/output pin. ICD Tertiary Communication Channel data input/output pin. ICD Tertiary Communication Channel clock input/output pin. ICD Quaternary Communication Channel data input/output pin. ICD Quaternary Communication Channel clock input/output pin. IC1-IC8 I ST Capture inputs 1 through 8. INT0 INT1 INT2 INT3 INT4 I I I I I ST ST ST ST ST External interrupt 0. External interrupt 1. External interrupt 2. External interrupt 3. External interrupt 4. LVDIN I Analog MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active low Reset to the device. OCFA OCFB OC1-OC8 I I O ST ST — Compare Fault A input (for Compare channels 1, 2, 3 and 4). Compare Fault B input (for Compare channels 5, 6, 7 and 8). Compare outputs 1 through 8. Positive supply for analog module. Ground reference for analog module. External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. Low-Voltage Detect Reference Voltage input pin. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input DS70116G-page 10 Analog = Analog input O = Output P = Power © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type OSC1 I ST/CMOS OSC2 I/O — Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. PGD PGC I/O I ST ST In-Circuit Serial Programming™ data input/output pin. In-Circuit Serial Programming clock input pin. RA6-RA7 RA9-RA10 RA12-RA15 I/O I/O I/O ST ST ST PORTA is a bidirectional I/O port. Pin Name Description RB0-RB15 I/O ST PORTB is a bidirectional I/O port. RC1-RC4 RC13-RC15 I/O I/O ST ST PORTC is a bidirectional I/O port. RD0-RD15 I/O ST PORTD is a bidirectional I/O port. RF0-RF8 I/O ST PORTF is a bidirectional I/O port. RG0-RG3 RG6-RG9 RG12-RG15 I/O I/O I/O ST ST ST PORTG is a bidirectional I/O port. SCK1 SDI1 SDO1 SS1 SCK2 SDI2 SDO2 SS2 I/O I O I I/O I O I ST ST — ST ST ST — ST Synchronous serial clock input/output for SPI1. SPI1 Data In. SPI1 Data Out. SPI1 Slave Synchronization. Synchronous serial clock input/output for SPI2. SPI2 Data In. SPI2 Data Out. SPI2 Slave Synchronization. SCL SDA I/O I/O ST ST Synchronous serial clock input/output for I2C™. Synchronous serial data input/output for I2C. SOSCO SOSCI O I — ST/CMOS T1CK T2CK T3CK T4CK T5CK I I I I I ST ST ST ST ST Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. Timer4 external clock input. Timer5 external clock input. U1RX U1TX U1ARX U1ATX U2RX U2TX I O I O I O ST — ST — ST — UART1 Receive. UART1 Transmit. UART1 Alternate Receive. UART1 Alternate Transmit. UART2 Receive. UART2 Transmit. VDD P — Positive supply for logic and I/O pins. VSS P — Ground reference for logic and I/O pins. VREF+ I Analog Analog Voltage Reference (High) input. VREF- I Analog Analog Voltage Reference (Low) input. 32 kHz low-power oscillator crystal output. 32 kHz low-power oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input © 2007 Microchip Technology Inc. Analog = Analog input O = Output P = Power DS70116G-page 11 dsPIC30F5011/5013 NOTES: DS70116G-page 12 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 2.0 CPU ARCHITECTURE OVERVIEW Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). 2.1 Core Overview This section contains a brief overview of the CPU architecture of the dsPIC30F. For additional hardware and programming information, please refer to the “dsPIC30F Family Reference Manual” (DS70046) and the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157), respectively. The core has a 24-bit instruction word. The Program Counter (PC) is 23 bits wide with the Least Significant bit (LSb) always clear (refer to Section 3.1 “Program Address Space”), and the Most Significant bit (MSb) is ignored during normal program execution, except for certain specialized instructions. Thus, the PC can address up to 4M instruction words of user program space. An instruction prefetch mechanism is used to help maintain throughput. Program loop constructs, free from loop count management overhead, are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The working register array consists of 16 x 16-bit registers, each of which can act as data, address or offset registers. One working register (W15) operates as a software Stack Pointer for interrupts and calls. The data space is 64 Kbytes (32K words) and is split into two blocks, referred to as X and Y data memory. Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely through the X memory, AGU, which provides the appearance of a single unified data space. The Multiply-Accumulate (MAC) class of dual source DSP instructions operate through both the X and Y AGUs, splitting the data address space into two parts (see Section 3.2 “Data Address Space”). The X and Y data space boundary is device specific and cannot be altered by the user. Each data word consists of 2 bytes, and most instructions can address data either as words or bytes. © 2007 Microchip Technology Inc. There are two methods of accessing data stored in program memory: • The upper 32 Kbytes of data space memory can be mapped into the lower half (user space) of program space at any 16K program word boundary, defined by the 8-bit Program Space Visibility Page (PSVPAG) register. This lets any instruction access program space as if it were data space, with a limitation that the access requires an additional cycle. Moreover, only the lower 16 bits of each instruction word can be accessed using this method. • Linear indirect access of 32K word pages within program space is also possible using any working register, via table read and write instructions. Table read and write instructions can be used to access all 24 bits of an instruction word. Overhead-free circular buffers (modulo addressing) are supported in both X and Y address spaces. This is primarily intended to remove the loop overhead for DSP algorithms. The X AGU also supports bit-reversed addressing on destination effective addresses to greatly simplify input or output data reordering for radix-2 FFT algorithms. Refer to Section 5.0 “Address Generator Units” for details on modulo and bit-reversed addressing. The core supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct, Register Indirect, Register Offset and Literal Offset Addressing modes. Instructions are associated with predefined Addressing modes, depending upon their functional requirements. For most instructions, the core is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, 3-operand instructions are supported, allowing C = A + B operations to be executed in a single cycle. A DSP engine has been included to significantly enhance the core arithmetic capability and throughput. It features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits right, or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC class of instructions can concurrently fetch two data operands from memory while multiplying two W registers. To enable this concurrent fetching of data operands, the data space has been split for these instructions and linear for all others. This has been achieved in a transparent and flexible manner, by dedicating certain working registers to each address space for the MAC class of instructions. DS70116G-page 13 dsPIC30F5011/5013 The core does not support a multi-stage instruction pipeline. However, a single stage instruction prefetch mechanism is used, which accesses and partially decodes instructions a cycle ahead of execution, in order to maximize available execution time. Most instructions execute in a single cycle with certain exceptions. The core features a vectored exception processing structure for traps and interrupts, with 62 independent vectors. The exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. Each interrupt is prioritized based on a user assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest), in conjunction with a predetermined ‘natural order’. Traps have fixed priorities ranging from 8 to 15. 2.2 Programmer’s Model The programmer’s model is shown in Figure 2-1 and consists of 16 x 16-bit working registers (W0 through W15), 2 x 40-bit accumulators (AccA and AccB), STATUS register (SR), Data Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and REPEAT registers (DOSTART, DOEND, DCOUNT and RCOUNT) and Program Counter (PC). The working registers can act as data, address or offset registers. All registers are memory mapped. W0 acts as the W register for file register addressing. Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The shadow register is used as a temporary holding register and can transfer its contents to or from its host register upon the occurrence of an event. None of the shadow registers are accessible directly. The following rules apply for transfer of registers into and out of shadows. • PUSH.S and POP.S W0, W1, W2, W3, SR (DC, N, OV, Z and C bits only) are transferred. • DO instruction DOSTART, DOEND, DCOUNT shadows are pushed on loop start, and popped on loop end. 2.2.1 SOFTWARE STACK POINTER/ FRAME POINTER The dsPIC® DSC devices contain a software stack. W15 is the dedicated software Stack Pointer (SP), and will be automatically modified by exception processing and subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all other W registers. This simplifies the reading, writing and manipulation of the Stack Pointer (e.g., creating stack frames). Note: In order to protect against misaligned stack accesses, W15<0> is always clear. W15 is initialized to 0x0800 during a Reset. The user may reprogram the SP during initialization to any location within data space. W14 has been dedicated as a Stack Frame Pointer as defined by the LNK and ULNK instructions. However, W14 can be referenced by any instruction in the same manner as all other W registers. 2.2.2 STATUS REGISTER The dsPIC DSC core has a 16-bit STATUS register (SR), the LSB of which is referred to as the SR Low byte (SRL) and the MSB as the SR High byte (SRH). See Figure 2-1 for SR layout. SRL contains all the MCU ALU operation status flags (including the Z bit), as well as the CPU Interrupt Priority Level status bits, IPL<2:0> and the Repeat Active Status bit, RA. During exception processing, SRL is concatenated with the MSB of the PC to form a complete word value which is then stacked. The upper byte of the STATUS register contains the DSP Adder/Subtracter status bits, the DO Loop Active bit (DA) and the Digit Carry (DC) Status bit. 2.2.3 PROGRAM COUNTER The program counter is 23 bits wide; bit 0 is always clear. Therefore, the PC can address up to 4M instruction words. When a byte operation is performed on a working register, only the Least Significant Byte (LSB) of the target register is affected. However, a benefit of memory mapped working registers is that both the Least and Most Significant Bytes (MSBs) can be manipulated through byte wide data memory space accesses. DS70116G-page 14 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 2-1: PROGRAMMER’S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer SPLIM AD39 Stack Pointer Limit Register AD15 AD31 AD0 AccA DSP Accumulators AccB PC22 PC0 Program Counter 0 0 7 TABPAG TBLPAG 7 Data Table Page Address 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH © 2007 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C STATUS Register SRL DS70116G-page 15 dsPIC30F5011/5013 2.3 Divide Support The dsPIC DSC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/ 16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The following instructions and data sizes are supported: 1. 2. 3. 4. 5. DIVF - 16/16 signed fractional divide DIV.sd - 32/16 signed divide DIV.ud - 32/16 unsigned divide DIV.sw - 16/16 signed divide DIV.uw - 16/16 unsigned divide The divide instructions must be executed within a REPEAT loop. Any other form of execution (e.g., a series of discrete divide instructions) will not function correctly because the instruction flow depends on RCOUNT. The divide instruction does not automatically set up the RCOUNT value and it must, therefore, be explicitly and correctly specified in the REPEAT instruction as shown in Table 2-1 (REPEAT will execute the target instruction {operand value+1} times). The REPEAT loop count must be setup for 18 iterations of the DIV/ DIVF instruction. Thus, a complete divide operation requires 19 cycles. The 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. TABLE 2-1: Note: The divide flow is interruptible. However, the user needs to save the context as appropriate. DIVIDE INSTRUCTIONS Instruction Function DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1 DIV.sd Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1 DIV.sw or DIV.s Signed divide: Wm/Wn → W0; Rem → W1 DIV.ud Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1 DIV.uw or DIV.u Unsigned divide: Wm/Wn → W0; Rem → W1 DS70116G-page 16 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 2.4 DSP Engine The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). The DSP engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. These instructions are ADD, SUB and NEG. The dsPIC30F is a single-cycle instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources may be used concurrently by the same instruction (e.g., ED, EDAC). TABLE 2-2: The DSP engine has various options selected through various bits in the CPU Core Configuration register (CORCON), as listed below: 1. 2. 3. 4. 5. 6. Fractional or integer DSP multiply (IF). Signed or unsigned DSP multiply (US). Conventional or convergent rounding (RND). Automatic saturation on/off for AccA (SATA). Automatic saturation on/off for AccB (SATB). Automatic saturation on/off for writes to data memory (SATDW). Accumulator Saturation mode selection (ACCSAT). 7. Note: For CORCON layout, see Table 3-3. A block diagram of the DSP engine is shown in Figure 2-2. DSP INSTRUCTION SUMMARY Instruction Algebraic Operation CLR A=0 ED A = (x – y)2 ACC WB? Yes No 2 EDAC A = A + (x – y) No MAC A = A + (x * y) Yes MAC A = A + x2 No No change in A Yes A=x*y No A=–x*y No A=A–x*y Yes MOVSAC MPY MPY.N MSC © 2007 Microchip Technology Inc. DS70116G-page 17 dsPIC30F5011/5013 FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 16 X Data Bus Barrel Shifter 40 Y Data Bus Sign-Extend 32 16 Zero Backfill 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array DS70116G-page 18 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 2.4.1 MULTIPLIER The 17 x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17 x 17-bit multiplier/scaler is a 33-bit value which is sign-extended to 40 bits. Integer data is inherently represented as a signed two’s complement value, where the MSB is defined as a sign bit. Generally speaking, the range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including ‘0’. For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,645 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement fraction, where the MSB is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including ‘0’ and has a precision of 3.01518x10-5. In Fractional mode, the 16x16 multiply operation generates a 1.31 product which has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed, unsigned and mixed sign multiplies. 2.4.2.1 The adder/subtracter is a 40-bit adder with an optional zero input into one side and either true, or complement data into the other input. In the case of addition, the carry/borrow input is active high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active low and the other input is complemented. The adder/subtracter generates overflow status bits SA/SB and OA/OB, which are latched and reflected in the STATUS register: • Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. • Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block which controls accumulator data saturation, if selected. It uses the result of the adder, the overflow status bits described above, and the SATA/B (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. Six STATUS register bits have been provided to support saturation and overflow; they are: 1. 2. The MUL instruction may be directed to use byte or word sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 3. 2.4.2 4. DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/ subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. Adder/Subtracter, Overflow and Saturation 5. 6. OA: AccA overflowed into guard bits OB: AccB overflowed into guard bits SA: AccA saturated (bit 31 overflow and saturation) or AccA overflowed into guard bits and saturated (bit 39 overflow and saturation) SB: AccB saturated (bit 31 overflow and saturation) or AccB overflowed into guard bits and saturated (bit 39 overflow and saturation) OAB: Logical OR of OA and OB SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATE, OVBTE) in the INTCON1 register (refer to Section 4.0 “Interrupts”) is set. This allows the user to take immediate action, for example, to correct system gain. © 2007 Microchip Technology Inc. DS70116G-page 19 dsPIC30F5011/5013 The SA and SB bits are modified each time data passes through the adder/subtracter but can only be cleared by the user. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The overflow and saturation status bits can optionally be viewed in the STATUS register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). This allows programmers to check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This would be useful for complex number arithmetic which typically uses both the accumulators. The device supports three Saturation and Overflow modes: 1. 2. 3. Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF), or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. This is referred to as ‘super saturation’ and provides protection against erroneous data, or unexpected algorithm problems (e.g., gain calculations). Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF), or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. When this Saturation mode is in effect, the guard bits are not used (so the OA, OB or OAB bits are never set). Bit 39 Catastrophic Overflow: The bit 39 overflow Status bit from the adder is used to set the SA or SB bit which remain set until cleared by the user. No saturation operation is performed and the accumulator is allowed to overflow (destroying its sign). If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. DS70116G-page 20 2.4.2.2 Accumulator ‘Write Back’ The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following Addressing modes are supported: 1. 2. W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. [W13]+=2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 2.4.2.3 Round Logic The round logic is a combinational block which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16bit, 1.15 data value which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. Conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the ACCxH word (bits 16 through 31 of the accumulator). If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. If this is the case, the LSb (bit 16 of the accumulator) of ACCxH is examined. If it is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus (subject to data saturation, see Section 2.4.2.4 “Data Space Write Saturation”). Note that for the MAC class of instructions, the accumulator write back operation will function in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 2.4.2.4 Data Space Write Saturation 2.4.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space may also be saturated but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. The barrel shifter is capable of performing up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators, or the X bus (to support multi-bit shifts of register or memory data). If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly, For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The MSb of the source (bit 39) is used to determine the sign of the operand being tested. The barrel shifter is 40-bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positions 0 to 16 for left shifts. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value will shift the operand right. A negative value will shift the operand left. A value of ‘0’ will not modify the operand. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. © 2007 Microchip Technology Inc. DS70116G-page 21 dsPIC30F5011/5013 NOTES: DS70116G-page 22 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 3.0 MEMORY ORGANIZATION FIGURE 3-1: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). PROGRAM SPACE MEMORY MAP Reset - GOTO Instruction Reset - Target Address 000000 000002 000004 Vector Tables Interrupt Vector Table Program Address Space The program address space is 4M instruction words. It is addressable by a 24-bit value from either the 23-bit PC, table instruction Effective Address (EA), or data space EA, when program space is mapped into data space as defined by Table 3-1. Note that the program space address is incremented by two between successive program words in order to provide compatibility with data space addressing. User Memory Space 3.1 User program space access is restricted to the lower 4M instruction word address range (0x000000 to 0x7FFFFE) for all accesses other than TBLRD/TBLWT, which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, Program Space Address Construction, bit 23 allows access to the Device ID, the User ID and the Configuration bits. Otherwise, bit 23 is always clear. Reserved Alternate Vector Table User Flash Program Memory (22K instructions) Reserved (Read ‘0’s) Data EEPROM (1 Kbyte) 00007E 000080 000084 0000FE 000100 00AFFE 00B000 7FFBFE 7FFC00 7FFFFE 800000 Configuration Memory Space Reserved UNITID (32 instr.) 8005BE 8005C0 8005FE 800600 Reserved Device Configuration Registers F7FFFE F80000 F8000E F80010 Reserved DEVID (2) © 2007 Microchip Technology Inc. FEFFFE FF0000 FFFFFE DS70116G-page 23 dsPIC30F5011/5013 TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION Program Space Address Access Space Access Type <23> <22:16> <15> <14:1> Instruction Access User TBLRD/TBLWT User (TBLPAG<7> = 0) TBLPAG<7:0> Data EA<15:0> TBLRD/TBLWT Configuration (TBLPAG<7> = 1) TBLPAG<7:0> Data EA<15:0> Program Space Visibility User FIGURE 3-2: <0> PC<22:1> 0 0 PSVPAG<7:0> 0 Data EA<14:0> DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION 23 bits Using Program Counter Program Counter 0 Select Using Program Space Visibility 0 1 0 EA PSVPAG Reg 8 bits 15 bits EA Using Table Instruction 1/0 User/ Configuration Space Select Note: DS70116G-page 24 TBLPAG Reg 8 bits 16 bits 24-bit EA Byte Select Program space visibility cannot be used to access bits <23:16> of a word in program memory. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 3.1.1 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS A set of table instructions are provided to move byte or word sized data to and from program space. 1. This architecture fetches 24-bit wide program memory. Consequently, instructions are always aligned. However, as the architecture is modified Harvard, data can also be present in program space. There are two methods by which program space can be accessed: via special table instructions, or through the remapping of a 16K word program space page into the upper half of data space (see Section 3.1.2 “Data Access from Program Memory Using Program Space Visibility”). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the least significant word of any address within program space, without going through data space. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8 bits of a program space word can be accessed as data. 2. 3. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit word wide address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space which contains the least significant data word, and TBLRDH and TBLWTH access the space which contains the Most Significant data Byte. 4. TBLRDL: Table Read Low Word: Read the lsw of the program address; P<15:0> maps to D<15:0>. Byte: Read one of the LSBs of the program address; P<7:0> maps to the destination byte when byte select = 0; P<15:8> maps to the destination byte when byte select = 1. TBLWTL: Table Write Low (refer to Section 6.0 “Flash Program Memory” for details on Flash Programming) TBLRDH: Table Read High Word: Read the most significant word of the program address; P<23:16> maps to D<7:0>; D<15:8> will always be = 0. Byte: Read one of the MSBs of the program address; P<23:16> maps to the destination byte when byte select = 0; The destination byte will always be = 0 when byte select = 1. TBLWTH: Table Write High (refer to Section 6.0 “Flash Program Memory” for details on Flash Programming) Figure 3-2 shows how the EA is created for table operations and data space accesses (PSV = 1). Here, P<23:0> refers to a program space word, whereas D<15:0> refers to a data space word. FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD) PC Address 0x000000 0x000002 0x000004 0x000006 23 16 8 0 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (read as ‘0’) © 2007 Microchip Technology Inc. TBLRDL.W TBLRDL.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) DS70116G-page 25 dsPIC30F5011/5013 FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE) TBLRDH.W PC Address 0x000000 0x000002 0x000004 0x000006 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDH.B (Wn<0> = 0) Program Memory ‘Phantom’ Byte (read as ‘0’) 3.1.2 TBLRDH.B (Wn<0> = 1) DATA ACCESS FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word program space page. This provides transparent access of stored constant data from X data space without the need to use special instructions (i.e., TBLRDL/H, TBLWTL/H instructions). Program space access through the data space occurs if the MSb of the data space EA is set and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON). The functions of CORCON are discussed in Section 2.4, DSP Engine. Data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. Note that the upper half of addressable data space is always part of the X data space. Therefore, when a DSP operation uses program space mapping to access this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas X data space should typically contain coefficient (constant) data. Although each data space address, 0x8000 and higher, maps directly into a corresponding program memory address (see Figure 3-5), only the lower 16 bits of the 24-bit program word are used to contain the data. The upper 8 bits should be programmed to force an illegal instruction to maintain machine robustness. Refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157) for details on instruction encoding. DS70116G-page 26 Note that by incrementing the PC by 2 for each program memory word, the Least Significant 15 bits of data space addresses directly map to the Least Significant 15 bits in the corresponding program space addresses. The remaining bits are provided by the Program Space Visibility Page register, PSVPAG<7:0>, as shown in Figure 3-5. Note: PSV access is temporarily disabled during table reads/writes. For instructions that use PSV which are executed outside a REPEAT loop: • The following instructions will require one instruction cycle in addition to the specified execution time: - MAC class of instructions with data operand prefetch - MOV instructions - MOV.D instructions • All other instructions will require two instruction cycles in addition to the specified execution time of the instruction. For instructions that use PSV which are executed inside a REPEAT loop: • The following instances will require two instruction cycles in addition to the specified execution time of the instruction: - Execution in the first iteration - Execution in the last iteration - Execution prior to exiting the loop due to an interrupt - Execution upon re-entering the loop after an interrupt is serviced • Any other iteration of the REPEAT loop will allow the instruction accessing data, using PSV, to execute in a single cycle. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION Data Space Program Space 0x000100 0x0000 PSVPAG(1) 0x01 8 15 EA<15> = 0 Data 16 Space 15 EA EA<15> = 1 0x8000 15 Address Concatenation 23 23 15 0 0x008000 Upper Half of Data Space is Mapped into Program Space 0x017FFF 0xFFFF BSET MOV MOV MOV CORCON,#2 #0x01, W0 W0, PSVPAG 0x8000, W0 ; PSV bit set ; Set PSVPAG register ; Access program memory location ; using a data space access Data Read Note: 3.2 PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines the page in program space to which the upper half of data space is being mapped). Data Address Space The core has two data spaces. The data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. © 2007 Microchip Technology Inc. 3.2.1 DATA SPACE MEMORY MAP The data space memory is split into two blocks, X and Y data space. A key element of this architecture is that Y space is a subset of X space, and is fully contained within X space. In order to provide an apparent linear addressing space, X and Y spaces have contiguous addresses. DS70116G-page 27 dsPIC30F5011/5013 When executing any instruction other than one of the MAC class of instructions, the X block consists of the 64Kbyte data address space (including all Y addresses). When executing one of the MAC class of instructions, the X block consists of the 64 Kbyte data address space excluding the Y address block (for data reads only). In other words, all other instructions regard the entire data memory as one composite address space. The MAC class instructions extract the Y address space FIGURE 3-6: from data space and address it using EAs sourced from W10 and W11. The remaining X data space is addressed using W8 and W9. Both address spaces are concurrently accessed only with the MAC class instructions. The data space memory map is shown in Figure 3-6. The X data space is used by all instructions and supports all Addressing modes, as shown in Figure 3-7. DATA SPACE MEMORY MAP MSB Address MSB 2 Kbyte SFR Space LSB Address 16 bits LSB 0x0000 0x0001 SFR Space 0x07FE 0x0800 0x07FF 0x0801 8 Kbyte Near Data Space X Data RAM (X) 4 Kbyte SRAM Space Y Data RAM (Y) 0x17FF 0x1801 0x17FE 0x1800 0x1FFF 0x1FFE 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF DS70116G-page 28 0x0FFE 0x1000 0x0FFF 0x1001 0xFFFE © 2007 Microchip Technology Inc. dsPIC30F5011/5013 DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE SFR SPACE SFR SPACE X SPACE FIGURE 3-7: Y SPACE UNUSED X SPACE (Y SPACE) X SPACE UNUSED UNUSED Non-MAC Class Ops (Read/Write) MAC Class Ops (Write) Indirect EA using any W © 2007 Microchip Technology Inc. MAC Class Ops (Read) Indirect EA using W8, W9 Indirect EA using W10, W11 DS70116G-page 29 dsPIC30F5011/5013 3.2.2 DATA SPACES 3.2.3 X data space is used by all instructions and supports all Addressing modes. There are separate read and write data buses. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space. It is also the X address space data path for the dual operand read instructions (MAC class). The X write data bus is the only write path to data space for all instructions. The X data space also supports modulo addressing for all instructions, subject to Addressing mode restrictions. Bit-reversed addressing is only supported for writes to X data space. The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. No writes occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always address Y data space, independent of X data space, whereas W8 and W9 always address X data space. Note that during accumulator write back, the data address space is considered a combination of X and Y data spaces, so the write occurs across the X bus. Consequently, the write can be to any address in the entire data space. The Y data space can only be used for the data prefetch operation associated with the MAC class of instructions. It also supports modulo addressing for automated circular buffers. Of course, all other instructions can access the Y data address space through the X data path as part of the composite linear space. The boundary between the X and Y data spaces is defined as shown in Figure 3-6 and is not user programmable. Should an EA point to data outside its own assigned address space, or to a location outside physical memory, an all zero word/byte will be returned. For example, although Y address space is visible by all non-MAC instructions using any Addressing mode, an attempt by a MAC instruction to fetch data from that space using W8 or W9 (X space pointers) will return 0x0000. TABLE 3-2: EFFECT OF INVALID MEMORY ACCESSES Attempted Operation Data Returned EA = an unimplemented address 0x0000 W8 or W9 used to access Y data space in a MAC instruction 0x0000 W10 or W11 used to access X data space in a MAC instruction 0x0000 DATA SPACE WIDTH The core data width is 16 bits. All internal registers are organized as 16-bit wide words. Data space memory is organized in byte addressable, 16-bit wide blocks. 3.2.4 DATA ALIGNMENT To help maintain backward compatibility with PIC® MCU devices and improve data space memory usage efficiency, the dsPIC30F instruction set supports both word and byte operations. Data is aligned in data memory and registers as words, but all data space EAs resolve to bytes. Data byte reads will read the complete word which contains the byte, using the LSb of any EA to determine which byte to select. The selected byte is placed onto the LSB of the X data path (no byte accesses are possible from the Y data path as the MAC class of instruction can only fetch words). That is, data memory and registers are organized as two parallel byte wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register which matches the byte address. As a consequence of this byte accessibility, all effective address calculations (including those generated by the DSP operations which are restricted to word sized data) are internally scaled to step through word aligned memory. For example, the core would recognize that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws+1 for byte operations and Ws+2 for word operations. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error trap will be generated. If the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. In either case, a trap will then be executed, allowing the system and/or user to examine the machine state prior to execution of the address fault. FIGURE 3-8: 15 DATA ALIGNMENT MSB 87 LSB 0 0001 Byte1 Byte 0 0000 0003 Byte3 Byte 2 0002 0005 Byte5 Byte 4 0004 All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes or 32K words. DS70116G-page 30 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 All byte loads into any W register are loaded into the LSB. The MSB is not modified. A sign-extend (SE) instruction is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, users can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. Although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including the DSP instructions, operate only on words. 3.2.5 NEAR DATA SPACE An 8 Kbyte ‘near’ data space is reserved in X address memory space between 0x0000 and 0x1FFF, which is directly addressable via a 13-bit absolute address field within all memory direct instructions. The remaining X address space and all of the Y address space is addressable indirectly. Additionally, the whole of X data space is addressable using MOV instructions, which support memory direct addressing with a 16-bit address field. There is a Stack Pointer Limit register (SPLIM) associated with the Stack Pointer. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to ‘0’ because all stack operations must be word aligned. Whenever an effective address (EA) is generated using W15 as a source or destination pointer, the address thus generated is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a Stack Error Trap will not occur. The Stack Error Trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a Stack Error Trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value 0x1FFE. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800, thus preventing the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. FIGURE 3-9: 3.2.6 SOFTWARE STACK 0x0000 CALL STACK FRAME 15 0 The Stack Pointer always points to the first available free word and grows from lower addresses towards higher addresses. It pre-decrements for stack pops and post-increments for stack pushes as shown in Figure 3-9. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: Stack Grows Towards Higher Address The dsPIC DSC devices contain a software stack. W15 is used as the Stack Pointer. PC<15:0> 000000000 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] A PC push during exception processing will concatenate the SRL register to the MSB of the PC prior to the push. 3.2.7 DATA RAM PROTECTION FEATURE The dsPIC30F5011/5013 devices support data RAM protection features which enable segments of RAM to be protected when used in conjunction with Boot and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM segment for RAM) is accessible only from the Secure Segment Flash code when enabled. See Table 3-3 for the BSRAM and SSRAM SFRs. © 2007 Microchip Technology Inc. DS70116G-page 31 SFR Name CORE REGISTER MAP Address (Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State W0 0000 W0 / WREG 0000 0000 0000 0000 W1 0002 W1 0000 0000 0000 0000 W2 0004 W2 0000 0000 0000 0000 W3 0006 W3 0000 0000 0000 0000 W4 0008 W4 0000 0000 0000 0000 W5 000A W5 0000 0000 0000 0000 W6 000C W6 0000 0000 0000 0000 W7 000E W7 0000 0000 0000 0000 © 2007 Microchip Technology Inc. W8 0010 W8 0000 0000 0000 0000 W9 0012 W9 0000 0000 0000 0000 W10 0014 W10 0000 0000 0000 0000 W11 0016 W11 0000 0000 0000 0000 W12 0018 W12 0000 0000 0000 0000 W13 001A W13 0000 0000 0000 0000 W14 001C W14 0000 0000 0000 0000 W15 001E W15 0000 1000 0000 0000 SPLIM 0020 SPLIM 0000 0000 0000 0000 ACCAL 0022 ACCAL 0000 0000 0000 0000 ACCAH 0024 ACCAH 0000 0000 0000 0000 ACCAU 0026 ACCBL 0028 ACCBL 0000 0000 0000 0000 ACCBH 002A ACCBH 0000 0000 0000 0000 ACCBU 002C PCL 002E PCH 0030 — — — — — — — — TBLPAG 0032 — — — — — — — — TBLPAG 0000 0000 0000 0000 PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000 RCOUNT 0036 RCOUNT DCOUNT 0038 DCOUNT DOSTARTL 003A DOSTARTH 003C DOENDL 003E DOENDH 0040 — — — — — — — — — SR 0042 OA OB SA SB OAB SAB DA DC IPL2 Legend: Sign-Extension (ACCA<39>) ACCAU Sign-Extension (ACCB<39>) 0000 0000 0000 0000 ACCBU 0000 0000 0000 0000 PCL 0000 0000 0000 0000 — PCH 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu DOSTARTL — — — — — — — — — uuuu uuuu uuuu uuu0 0 uuuu uuuu uuuu uuu0 DOSTARTH 0000 0000 0uuu uuuu DOENDL u = uninitialized bit 0 DOENDH IPL1 IPL0 RA N 0000 0000 0uuu uuuu OV Z C 0000 0000 0000 0000 dsPIC30F5011/5013 DS70116G-page 32 TABLE 3-3: © 2007 Microchip Technology Inc. TABLE 3-3: SFR Name CORE REGISTER MAP (CONTINUED) Address (Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 EDT DL2 DL1 DL0 SATA SATB Bit 5 Bit 4 Bit 2 Bit 1 Bit 0 Reset State IPL3 PSV RND IF 0000 0000 0010 0000 CORCON 0044 — — — US MODCON 0046 XMODEN YMODEN — — XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0 XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1 YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0 YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1 XBREV 0050 BREN DISICNT 0052 — — BSRAM 0750 — — — — — — — — — — — — — IW_BSR IR_BSR RL_BSR 0000 0000 0000 0000 0752 — — — — — — — — — — — — — IW_SSR IR_SSR RL_SSR 0000 0000 0000 0000 SSRAM Legend: BWM<3:0> SATDW ACCSAT Bit 3 YWM<3:0> XWM<3:0> XB<14:0> 0000 0000 0000 0000 uuuu uuuu uuuu uuuu DISICNT<13:0> 0000 0000 0000 0000 u = uninitialized bit Note: Refer to “dsPIC30F Family Reference ManuaI” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 33 dsPIC30F5011/5013 NOTES: DS70116G-page 34 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 4.0 INTERRUPTS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The dsPIC30F Sensor and General Purpose Family has up to 41 interrupt sources and 4 processor exceptions (traps) which must be arbitrated based on a priority scheme. The CPU is responsible for reading the Interrupt Vector Table (IVT) and transferring the address contained in the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus into the program counter via a 24-bit wide multiplexer on the input of the program counter. The Interrupt Vector Table (IVT) and Alternate Interrupt Vector Table (AIVT) are placed near the beginning of program memory (0x000004). The IVT and AIVT are shown in Figure 4-1. The interrupt controller is responsible for preprocessing the interrupts and processor exceptions prior to them being presented to the processor core. The peripheral interrupts and traps are enabled, prioritized and controlled using centralized Special Function Registers: • IFS0<15:0>, IFS1<15:0>, IFS2<15:0> All interrupt request flags are maintained in these three registers. The flags are set by their respective peripherals or external signals, and they are cleared via software. • IEC0<15:0>, IEC1<15:0>, IEC2<15:0> All interrupt enable control bits are maintained in these three registers. These control bits are used to individually enable interrupts from the peripherals or external signals. • IPC0<15:0>... IPC10<7:0> The user assignable priority level associated with each of these 41 interrupts is held centrally in these twelve registers. • IPL<3:0> The current CPU priority level is explicitly stored in the IPL bits. IPL<3> is present in the CORCON register, whereas IPL<2:0> are present in the STATUS register (SR) in the processor core. • INTCON1<15:0>, INTCON2<15:0> Global interrupt control functions are derived from these two registers. INTCON1 contains the control and status flags for the processor exceptions. The INTCON2 register controls the external interrupt request signal behavior and the use of the alternate vector table. © 2007 Microchip Technology Inc. • INTTREG<15:0> The associated interrupt vector number and the new CPU interrupt priority level are latched into vector number (VECNUM<5:0>) and interrupt level (ILR<3:0>) bit fields in the INTTREG register. The new interrupt priority level is the priority of the pending interrupt. Note: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. All interrupt sources can be user assigned to one of 7 priority levels, 1 through 7, via the IPCx registers. Each interrupt source is associated with an interrupt vector, as shown in Table 4-1. Levels 7 and 1 represent the highest and lowest maskable priorities, respectively. Note: Assigning a priority level of ‘0’ to an interrupt source is equivalent to disabling that interrupt. If the NSTDIS bit (INTCON1<15>) is set, nesting of interrupts is prevented. Thus, if an interrupt is currently being serviced, processing of a new interrupt is prevented even if the new interrupt is of higher priority than the one currently being serviced. Note: The IPL bits become read-only whenever the NSTDIS bit has been set to ‘1’. Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupton-change, etc. Control of these features remains within the peripheral module which generates the interrupt. The DISI instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the DISI bit (INTCON2<14>) remains set. When an interrupt is serviced, the PC is loaded with the address stored in the vector location in program memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Table 4-1). These vectors are contained in locations 0x000004 through 0x0000FE of program memory (refer to Table 4-1). These locations contain 24-bit addresses and in order to preserve robustness, an address error trap will take place should the PC attempt to fetch any of these words during normal execution. This prevents execution of random data as a result of accidentally decrementing a PC into vector space, accidentally mapping a data space address into vector space or the PC rolling over to 0x000000 after reaching the end of implemented program memory space. Execution of a GOTO instruction to this vector space will also generate an address error trap. DS70116G-page 35 dsPIC30F5011/5013 4.1 Interrupt Priority The user assignable interrupt priority (IP<2:0>) bits for each individual interrupt source are located in the Least Significant 3 bits of each nibble within the IPCx register(s). Bit 3 of each nibble is not used and is read as a ‘0’. These bits define the priority level assigned to a particular interrupt by the user. Note: The user selectable priority levels start at 0 as the lowest priority and level 7 as the highest priority. Natural order priority is determined by the position of an interrupt in the vector table, and only affects interrupt operation when multiple interrupts with the same user assigned priority become pending at the same time. Table 4-1 lists the interrupt numbers and interrupt sources for the dsPIC DSC device and their associated vector numbers. Note 1: The natural order priority scheme has 0 as the highest priority and 53 as the lowest priority. 2: The natural order priority number is the same as the INT number. The ability for the user to assign every interrupt to one of seven priority levels implies that the user can assign a very high overall priority level to an interrupt with a low natural order priority. For example, the PLVD (LowVoltage Detect) can be given a priority of 7. The INT0 (External Interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. TABLE 4-1: INT Number INTERRUPT VECTOR TABLE Vector Number Interrupt Source Highest Natural Order Priority 0 8 INT0 – External Interrupt 0 1 9 IC1 – Input Capture 1 2 10 OC1 – Output Compare 1 3 4 5 6 7 8 9 10 11 12 13 11 12 13 14 15 16 17 18 19 20 21 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 T1 – Timer 1 IC2 – Input Capture 2 OC2 – Output Compare 2 T2 – Timer 2 T3 – Timer 3 SPI1 U1RX – UART1 Receiver U1TX – UART1 Transmitter ADC – ADC Convert Done NVM – NVM Write Complete SI2C – I2C™ Slave Interrupt MI2C – I2C Master Interrupt Input Change Interrupt INT1 – External Interrupt 1 IC7 – Input Capture 7 IC8 – Input Capture 8 OC3 – Output Compare 3 OC4 – Output Compare 4 T4 – Timer 4 T5 – Timer 5 INT2 – External Interrupt 2 U2RX – UART2 Receiver U2TX – UART2 Transmitter SPI2 C1 – Combined IRQ for CAN1 IC3 – Input Capture 3 IC4 – Input Capture 4 IC5 – Input Capture 5 IC6 – Input Capture 6 OC5 – Output Compare 5 OC6 – Output Compare 6 OC7 – Output Compare 7 OC8 – Output Compare 8 INT3 – External Interrupt 3 INT4 – External Interrupt 4 38 46 C2 – Combined IRQ for CAN2 39-40 47-48 Reserved 41 49 DCI – Codec Transfer Done 42 50 LVD – Low-Voltage Detect 43-53 51-61 Reserved Lowest Natural Order Priority DS70116G-page 36 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 4.2 Reset Sequence A Reset is not a true exception, because the interrupt controller is not involved in the Reset process. The processor initializes its registers in response to a Reset which forces the PC to zero. The processor then begins program execution at location 0x000000. A GOTO instruction is stored in the first program memory location immediately followed by the address target for the GOTO instruction. The processor executes the GOTO to the specified address and then begins operation at the specified target (start) address. 4.2.1 4.3 Traps Traps can be considered as non-maskable interrupts indicating a software or hardware error, which adhere to a predefined priority as shown in Figure 4-1. They are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. Note: RESET SOURCES In addition to external Reset and Power-on Reset (POR), there are 6 sources of error conditions which ‘trap’ to the Reset vector. • Watchdog Time-out: The watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. • Uninitialized W Register Trap: An attempt to use an uninitialized W register as an address pointer will cause a Reset. • Illegal Instruction Trap: Attempted execution of any unused opcodes will result in an illegal instruction trap. Note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. • Brown-out Reset (BOR): A momentary dip in the power supply to the device has been detected which may result in malfunction. • Trap Lockout: Occurrence of multiple trap conditions simultaneously will cause a Reset. Note that many of these trap conditions can only be detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap exception processing. If the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. There are 8 fixed priority levels for traps: Level 8 through Level 15, which implies that the IPL3 is always set during processing of a trap. If the user is not currently executing a trap, and sets the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all interrupts are disabled, but traps can still be processed. 4.3.1 TRAP SOURCES The following traps are provided with increasing priority. However, since all traps can be nested, priority has little effect. Math Error Trap: The Math Error trap executes under the following four circumstances: 1. 2. 3. 4. © 2007 Microchip Technology Inc. If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the RESET instruction. If, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated. If an attempt is made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. If enabled, a Math Error trap will be taken when an arithmetic operation on either accumulator A or B causes an overflow from bit 31 and the accumulator guard bits are not utilized. If enabled, a Math Error trap will be taken when an arithmetic operation on either accumulator A or B causes a catastrophic overflow from bit 39 and all saturation is disabled. If the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. DS70116G-page 37 dsPIC30F5011/5013 Address Error Trap: 4.3.2 This trap is initiated when any of the following circumstances occurs: It is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). In such a case, the fixed priority shown in Figure 4-2 is implemented, which may require the user to check if other traps are pending, in order to completely correct the fault. 1. 2. 3. 4. A misaligned data word access is attempted. A data fetch from an unimplemented data memory location is attempted. A data access of an unimplemented program memory location is attempted. An instruction fetch from vector space is attempted. Note: 5. 6. In the MAC class of instructions, wherein the data space is split into X and Y data space, unimplemented X space includes all of Y space, and unimplemented Y space includes all of X space. Execution of a “BRA #literal” instruction or a “GOTO #literal” instruction, where literal is an unimplemented program memory address. Executing instructions after modifying the PC to point to unimplemented program memory addresses. The PC may be modified by loading a value into the stack and executing a RETURN instruction. Stack Error Trap: HARD AND SOFT TRAPS ‘Soft’ traps include exceptions of priority level 8 through level 11, inclusive. The arithmetic error trap (level 11) falls into this category of traps. ‘Hard’ traps include exceptions of priority level 12 through level 15, inclusive. The address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. Each hard trap that occurs must be acknowledged before code execution of any type may continue. If a lower priority hard trap occurs while a higher priority trap is pending, acknowledged, or is being processed, a hard trap conflict will occur. The device is automatically Reset in a hard trap conflict condition. The TRAPR Status bit (RCON<15>) is set when the Reset occurs, so that the condition may be detected in software. FIGURE 4-1: TRAP VECTORS 1. 2. The Stack Pointer is loaded with a value which is greater than the (user programmable) limit value written into the SPLIM register (stack overflow). The Stack Pointer is loaded with a value which is less than 0x0800 (simple stack underflow). Decreasing Priority This trap is initiated under the following conditions: IVT Oscillator Fail Trap: This trap is initiated if the external oscillator fails and operation becomes reliant on an internal RC backup. AIVT DS70116G-page 38 Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector Reserved Reserved Reserved Oscillator Fail Trap Vector Stack Error Trap Vector Address Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector 0x000000 0x000002 0x000004 0x000014 0x00007E 0x000080 0x000082 0x000084 0x000094 0x0000FE © 2007 Microchip Technology Inc. dsPIC30F5011/5013 4.4 Interrupt Sequence 4.5 All interrupt event flags are sampled in the beginning of each instruction cycle by the IFSx registers. A pending interrupt request (IRQ) is indicated by the flag bit being equal to a ‘1’ in an IFSx register. The IRQ will cause an interrupt to occur if the corresponding bit in the Interrupt Enable (IECx) register is set. For the remainder of the instruction cycle, the priorities of all pending interrupt requests are evaluated. If there is a pending IRQ with a priority level greater than the current processor priority level in the IPL bits, the processor will be interrupted. The processor then stacks the current program counter and the low byte of the processor STATUS register (SRL), as shown in Figure 4-2. The low byte of the STATUS register contains the processor priority level at the time prior to the beginning of the interrupt cycle. The processor then loads the priority level for this interrupt into the STATUS register. This action will disable all lower priority interrupts until the completion of the Interrupt Service Routine. FIGURE 4-2: Stack Grows Towards Higher Address 0x0000 15 INTERRUPT STACK FRAME 0 Alternate Vector Table In program memory, the Interrupt Vector Table (IVT) is followed by the Alternate Interrupt Vector Table (AIVT), as shown in Figure 4-1. Access to the alternate vector table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes. AIVT is not a protected section and may be freely programmed by the user. 4.6 Fast Context Saving A context saving option is available using shadow registers. Shadow registers are provided for the DC, N, OV, Z and C bits in SR, and the registers W0 through W3. The shadows are only one level deep. The shadow registers are accessible using the PUSH.S and POP.S instructions only. When the processor vectors to an interrupt, the PUSH.S instruction can be used to store the current value of the aforementioned registers into their respective shadow registers. PC<15:0> SRL IPL3 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] If an ISR of a certain priority uses the PUSH.S and POP.S instructions for fast context saving, then a higher priority ISR should not include the same instructions. Users must save the key registers in software during a lower priority interrupt if the higher priority ISR uses fast context saving. PUSH: [W15++] 4.7 Note 1: The user can always lower the priority level by writing a new value into SR. The Interrupt Service Routine must clear the interrupt flag bits in the IFSx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. 2: The IPL3 bit (CORCON<3>) is always clear when interrupts are being processed. It is set only during execution of traps. The RETFIE (return from interrupt) instruction will unstack the program counter and STATUS registers to return the processor to its state prior to the interrupt sequence. © 2007 Microchip Technology Inc. External Interrupt Requests The interrupt controller supports up to five external interrupt request signals, INT0-INT4. These inputs are edge sensitive; they require a low-to-high or a high-tolow transition to generate an interrupt request. The INTCON2 register has five bits, INT0EP-INT4EP, that select the polarity of the edge detection circuitry. 4.8 Wake-up from Sleep and Idle The interrupt controller may be used to wake-up the processor from either Sleep or Idle modes, if Sleep or Idle mode is active when the interrupt is generated. If an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. At the same time, the processor will wake-up from Sleep or Idle and begin execution of the Interrupt Service Routine (ISR) needed to process the interrupt request. DS70116G-page 39 SFR Name ADR INTERRUPT CONTROLLER REGISTER MAP Bit 15 INTCON1 0080 NSTDIS Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR Bit 2 Bit 1 STKERR OSCFAIL Bit 0 Reset State — 0000 0000 0000 0000 INTCON2 0082 ALTIVT DISI — — — — — — — — — INT4EP INT3EP INT2EP INT1EP IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000 IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IFS2 0088 — — — — — LVDIF DCIIF — — C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IEC2 0090 — — — — — LVDIE DCIIE — — C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000 IPC0 0094 — T1IP<2:0> — IPC1 0096 — T31P<2:0> IPC2 0098 — ADIP<2:0> IPC3 009A — IPC4 009C IPC5 OC1IP<2:0> — IC1IP<2:0> — — T2IP<2:0> — U1TXIP<2:0> — OC2IP<2:0> — U1RXIP<2:0> CNIP<2:0> — MI2CIP<2:0> — — OC3IP<2:0> — IC8IP<2:0> 009E — INT2IP<2:0> — IPC6 00A0 IPC7 00A2 — C1IP<2:0> — IC6IP<2:0> IPC8 00A4 — OC8IP<2:0> IPC9 00A6 — — — IPC10 00A8 — — INTTREG 00B0 — — Legend: INT0EP 0000 0000 0000 0000 INT0IP<2:0> 0100 0100 0100 0100 — IC2IP<2:0> 0100 0100 0100 0100 — SPI1IP<2:0> 0100 0100 0100 0100 SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100 — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100 T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100 — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100 — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100 — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100 — — C2IP<2:0> — INT41IP<2:0> — INT3IP<2:0> 0000 0100 0100 0100 — — — LVDIP<2:0> — — — ILR<3:0> — DCIIP<2:0> — u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. — — VECNUM<5:0> — — 0000 0100 0100 0000 0000 0000 0000 0000 dsPIC30F5011/5013 DS70116G-page 40 TABLE 4-2: © 2007 Microchip Technology Inc. dsPIC30F5011/5013 5.0 ADDRESS GENERATOR UNITS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The dsPIC DSC core contains two independent address generator units: the X AGU and Y AGU. The Y AGU supports word sized data reads for the DSP MAC class of instructions only. The dsPIC DSC AGUs support three types of data addressing: • Linear Addressing • Modulo (Circular) Addressing • Bit-Reversed Addressing FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register W0, which is denoted as WREG in these instructions. The destination is typically either the same file register, or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space during file register operation. 5.1.2 MCU INSTRUCTIONS The three operand MCU instructions are of the form: Linear and Modulo Data Addressing modes can be applied to data space or program space. Bit-reversed addressing is only applicable to data space addresses. 5.1 5.1.1 Instruction Addressing Modes The addressing modes in Table 5-1 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions are somewhat different from those in the other instruction types. Operand 3 = Operand 1 <function> Operand 2 where Operand 1 is always a working register (i.e., the addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. The result location can be either a W register or an address location. The following addressing modes are supported by MCU instructions: • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified 5-bit or 10-bit Literal Note: TABLE 5-1: Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode Description File Register Direct The address of the File register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the EA. Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. Register Indirect with Literal Offset © 2007 Microchip Technology Inc. The sum of Wn and a literal forms the EA. DS70116G-page 41 dsPIC30F5011/5013 5.1.3 MOVE AND ACCUMULATOR INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (register offset) field is shared between both source and destination (but typically only used by one). In summary, the following addressing modes are supported by move and accumulator instructions: • • • • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: 5.1.4 Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, utilize a simplified set of addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. The 2 source operand prefetch registers must be a member of the set {W8, W9, W10, W11}. For data reads, W8 and W9 will always be directed to the X RAGU and W10 and W11 will always be directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: In summary, the following addressing modes are supported by the MAC class of instructions: • • • • • Register Indirect Register Indirect Post-Modified by 2 Register Indirect Post-Modified by 4 Register Indirect Post-Modified by 6 Register Indirect with Register Offset (Indexed) 5.1.5 OTHER INSTRUCTIONS Besides the various addressing modes outlined above, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. 5.2 Modulo Addressing Modulo addressing is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for modulo addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can only be configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers) based upon the direction of the buffer. The only exception to the usage restrictions is for buffers that have a power-of-2 length. As these buffers satisfy the start and end address criteria, they may operate in a Bidirectional mode (i.e., address boundary checks are performed on both the lower and upper address boundaries). Register indirect with register offset addressing is only available for W9 (in X space) and W11 (in Y space). DS70116G-page 42 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 5.2.1 START AND END ADDRESS 5.2.2 The modulo addressing scheme requires that a starting and an ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 3-3). Note: Y space modulo addressing EA calculations assume word sized data (LSb of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register MODCON<15:0> contains enable flags as well as a W register field to specify the W address registers. The XWM and YWM fields select which registers will operate with modulo addressing. If XWM = 15, X RAGU and X WAGU modulo addressing is disabled. Similarly, if YWM = 15, Y AGU modulo addressing is disabled. The X Address Space Pointer W register (XWM), to which modulo addressing is to be applied, is stored in MODCON<3:0> (see Table 3-3). Modulo addressing is enabled for X data space when XWM is set to any value other than ‘15’ and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM), to which modulo addressing is to be applied, is stored in MODCON<7:4>. Modulo addressing is enabled for Y data space when YWM is set to any value other than ‘15’ and the YMODEN bit is set at MODCON<14>. FIGURE 5-1: MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x1100 MOV MOV MOV MOV MOV MOV #0x1100,W0 W0,XMODSRT #0x1163,W0 W0,MODEND #0x8001,W0 W0,MODCON MOV #0x0000,W0 ;W0 holds buffer fill value MOV #0x1110,W1 ;point W1 to buffer DO MOV AGAIN,#0x31 W0,[W1++] ;fill the 50 buffer locations ;fill the next location ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words © 2007 Microchip Technology Inc. DS70116G-page 43 dsPIC30F5011/5013 5.2.3 MODULO ADDRESSING APPLICABILITY Modulo addressing can be applied to the Effective Address (EA) calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than, or greater than, the upper (for incrementing buffers), and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes may, therefore, jump beyond boundaries and still be adjusted correctly. Note: 5.3 The modulo corrected effective address is written back to the register only when PreModify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (e.g., [W7 + W2]) is used, modulo address correction is performed but the contents of the register remain unchanged. Bit-Reversed Addressing Bit-reversed addressing is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 5.3.1 2. 3. XB<14:0> is the bit-reversed address modifier or ‘pivot point’ which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: BWM (W register selection) in the MODCON register is any value other than ‘15’ (the stack cannot be accessed using bit-reversed addressing) and the BREN bit is set in the XBREV register and the addressing mode used is Register Indirect with Pre-Increment or Post-Increment. FIGURE 5-2: All bit-reversed EA calculations assume word sized data (LSb of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, bit-reversed addressing will only be executed for register indirect with pre-increment or post-increment addressing and word sized data writes. It will not function for any other addressing mode or for byte sized data, and normal addresses will be generated instead. When bit-reversed addressing is active, the W address pointer will always be added to the address modifier (XB) and the offset associated with the Register Indirect Addressing mode will be ignored. In addition, as word sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-reversed addressing is enabled when: 1. If the length of a bit-reversed buffer is M = 2N bytes, then the last ‘N’ bits of the data buffer start address must be zeros. Modulo addressing and bit-reversed addressing should not be enabled together. In the event that the user attempts to do this, bit-reversed addressing will assume priority when active for the X WAGU, and X WAGU modulo addressing will be disabled. However, modulo addressing will continue to function in the X RAGU. If bit-reversed addressing has already been enabled by setting the BREN (XBREV<15>) bit, then a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-word Bit-Reversed Buffer DS70116G-page 44 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 5-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address A3 A2 A1 A0 Bit-Reversed Address Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 TABLE 5-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value 2048 0x0400 1024 0x0200 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 8 0x0004 4 0x0002 2 0x0001 © 2007 Microchip Technology Inc. DS70116G-page 45 dsPIC30F5011/5013 NOTES: DS70116G-page 46 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 6.0 FLASH PROGRAM MEMORY 6.2 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. 2. 6.1 6.3 Run-Time Self-Programming (RTSP) In-Circuit Serial Programming (ICSP) Table Instruction Operation Summary The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in Word or Byte mode. In-Circuit Serial Programming (ICSP) The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can access program memory in Word or Byte mode. dsPIC30F devices can be serially programmed while in the end application circuit. This is simply done with two lines for Programming Clock and Programming Data (which are named PGC and PGD, respectively), and three other lines for Power (VDD), Ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. FIGURE 6-1: Run-Time Self-Programming (RTSP) A 24-bit program memory address is formed using bits<7:0> of the TBLPAG register and the effective address (EA) from a W register specified in the table instruction, as shown in Figure 6-1. ADDRESSING FOR TABLE AND NVM REGISTERS 24 bits Using Program Counter Program Counter 0 0 NVMADR Reg EA Using NVMADR Addressing 1/0 NVMADRU Reg 8 bits 16 bits Working Reg EA Using Table Instruction User/Configuration Space Select © 2007 Microchip Technology Inc. 1/0 TBLPAG Reg 8 bits 16 bits 24-bit EA Byte Select DS70116G-page 47 dsPIC30F5011/5013 6.4 RTSP Operation The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instructions, or 96 bytes. Each panel consists of 128 rows, or 4K x 24 instructions. RTSP allows the user to erase one row (32 instructions) at a time and to program four instructions at one time. RTSP may be used to program multiple program memory panels, but the table pointer must be changed at each panel boundary. Each panel of program memory contains write latches that hold 32 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the panel write latches. The data to be programmed into the panel is loaded in sequential order into the write latches: instruction 0, instruction 1, etc. The instruction words loaded must always be from a group of 32 boundary. The basic sequence for RTSP programming is to set up a table pointer, then do a series of TBLWT instructions to load the write latches. Programming is performed by setting the special bits in the NVMCON register. 32 TBLWTL and four TBLWTH instructions are required to load the 32 instructions. If multiple panel programming is required, the table pointer needs to be changed and the next set of multiple write latches written. All of the table write operations are single-word writes (2 instruction cycles), because only the table latches are written. A programming cycle is required for programming each row. The Flash Program Memory is readable, writable and erasable during normal operation over the entire VDD range. 6.5 The four SFRs used to read and write the program Flash memory are: • • • • NVMCON NVMADR NVMADRU NVMKEY 6.5.1 NVMCON REGISTER The NVMCON register controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. 6.5.2 NVMADR REGISTER The NVMADR register is used to hold the lower two bytes of the effective address. The NVMADR register captures the EA<15:0> of the last table instruction that has been executed and selects the row to write. 6.5.3 NVMADRU REGISTER The NVMADRU register is used to hold the upper byte of the effective address. The NVMADRU register captures the EA<23:16> of the last table instruction that has been executed. 6.5.4 NVMKEY REGISTER NVMKEY is a write-only register that is used for write protection. To start a programming or an erase sequence, the user must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 6.6 “Programming Operations” for further details. Note: DS70116G-page 48 Control Registers The user can also directly write to the NVMADR and NVMADRU registers to specify a program memory address for erasing or programming. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 6.6 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. A programming operation is nominally 2 msec in duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 6.6.1 4. 5. PROGRAMMING ALGORITHM FOR PROGRAM FLASH The user can erase or program one row of program Flash memory at a time. The general process is: 1. 2. 3. Read one row of program Flash (32 instruction words) and store into data RAM as a data “image”. Update the data image with the desired new data. Erase program Flash row. a) Setup NVMCON register for multi-word, program Flash, erase and set WREN bit. b) Write address of row to be erased into NVMADRU/NVMDR. c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set the WR bit. This will begin erase cycle. f) CPU will stall for the duration of the erase cycle. g) The WR bit is cleared when erase cycle ends. EXAMPLE 6-1: 6. Write 32 instruction words of data from data RAM “image” into the program Flash write latches. Program 32 instruction words into program Flash. a) Setup NVMCON register for multi-word, program Flash, program, and set WREN bit. b) Write ‘55’ to NVMKEY. c) Write ‘AA’ to NVMKEY. d) Set the WR bit. This will begin program cycle. e) CPU will stall for duration of the program cycle. f) The WR bit is cleared by the hardware when program cycle ends. Repeat steps 1 through 5 as needed to program desired amount of program Flash memory. 6.6.2 ERASING A ROW OF PROGRAM MEMORY Example 6-1 shows a code sequence that can be used to erase a row (32 instructions) of program memory. ERASING A ROW OF PROGRAM MEMORY ; Setup NVMCON for erase operation, multi word ; program memory selected, and writes enabled MOV #0x4041,W0 ; ; MOV W0,NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR),W0 ; ; MOV W0,NVMADRU MOV #tbloffset(PROG_ADDR),W0 ; MOV W0, NVMADR ; DISI #5 ; ; MOV #0x55,W0 ; MOV W0,NVMKEY MOV #0xAA,W1 ; ; MOV W1,NVMKEY BSET NVMCON,#WR ; NOP ; NOP ; © 2007 Microchip Technology Inc. write Init NVMCON SFR Initialize PM Page Boundary SFR Intialize in-page EA[15:0] pointer Initialize NVMADR SFR Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted DS70116G-page 49 dsPIC30F5011/5013 6.6.3 LOADING WRITE LATCHES Example 6-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 TBLWTL and 32 TBLWTH instructions are needed to load the write latches selected by the table pointer. EXAMPLE 6-2: LOADING WRITE LATCHES ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000,W0 ; ; Initialize PM Page Boundary SFR MOV W0,TBLPAG MOV #0x6000,W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0,W2 ; MOV #HIGH_BYTE_0,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] ; Write PM high byte into program latch TBLWTH W3,[W0++] ; 1st_program_word MOV #LOW_WORD_1,W2 ; MOV #HIGH_BYTE_1,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] TBLWTH W3,[W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2,W2 ; MOV #HIGH_BYTE_2,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] • • • ; 31st_program_word MOV #LOW_WORD_31,W2 ; MOV #HIGH_BYTE_31,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] Note: In Example 6-2, the contents of the upper byte of W3 has no effect. 6.6.4 INITIATING THE PROGRAMMING SEQUENCE For protection, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs. EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70116G-page 50 ; ; ; ; ; ; ; ; ; Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 6-1: File Name NVM REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 NVMCON 0760 WR WREN WRERR NVMADR 0762 NVMADRU 0764 — — — — — — — — NVMADR<23:16> 0000 0000 uuuu uuuu 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000 NVMKEY Legend: Bit 12 Bit 11 Bit 10 — — — Bit 9 — Bit 8 Bit 7 TWRI — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 PROGOP<6:0> NVMADR<15:0> Bit 1 Bit 0 All RESETS 0000 0000 0000 0000 uuuu uuuu uuuu uuuu u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 51 dsPIC30F5011/5013 NOTES: DS70116G-page 52 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 7.0 DATA EEPROM MEMORY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The Data EEPROM Memory is readable and writable during normal operation over the entire VDD range. The data EEPROM memory is directly mapped in the program memory address space. The four SFRs used to read and write the program Flash memory are used to access data EEPROM memory as well. As described in Section 6.5 “Control Registers”, these registers are: • • • • NVMCON NVMADR NVMADRU NVMKEY The EEPROM data memory allows read and write of single words and 16-word blocks. When interfacing to data memory, NVMADR in conjunction with the NVMADRU register are used to address the EEPROM location being accessed. TBLRDL and TBLWTL instructions are used to read and write data EEPROM. The dsPIC30F devices have up to 8 Kbytes (4K words) of data EEPROM with an address range from 0x7FF000 to 0x7FFFFE. Control bit WR initiates write operations similar to program Flash writes. This bit cannot be cleared, only set, in software. They are cleared in hardware at the completion of the write operation. The inability to clear the WR bit in software prevents the accidental or premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and rewrite the location. The address register NVMADR remains unchanged. Note: 7.1 Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be cleared in software. Reading the Data EEPROM A TBLRD instruction reads a word at the current program word address. This example uses W0 as a pointer to data EEPROM. The result is placed in register W4 as shown in Example 7-1. EXAMPLE 7-1: MOV MOV MOV TBLRDL DATA EEPROM READ #LOW_ADDR_WORD,W0 ; Init Pointer #HIGH_ADDR_WORD,W1 W1,TBLPAG [ W0 ], W4 ; read data EEPROM A word write operation should be preceded by an erase of the corresponding memory location(s). The write typically requires 2 ms to complete but the write time will vary with voltage and temperature. A program or erase operation on the data EEPROM does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time before initiating another data EEPROM write/erase operation. Attempting to read the data EEPROM while a programming or erase operation is in progress results in unspecified data. © 2007 Microchip Technology Inc. DS70116G-page 53 dsPIC30F5011/5013 7.2 7.2.1 Erasing Data EEPROM ERASING A BLOCK OF DATA EEPROM In order to erase a block of data EEPROM, the NVMADRU and NVMADR registers must initially point to the block of memory to be erased. Configure NVMCON for erasing a block of data EEPROM, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in Example 7-2. EXAMPLE 7-2: DATA EEPROM BLOCK ERASE ; Select data EEPROM block, ERASE, WREN bits MOV #0x4045,W0 ; Initialize NVMCON SFR MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete 7.2.2 ERASING A WORD OF DATA EEPROM The NVMADRU and NVMADR registers must point to the block. Select erase a block of data Flash, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase, as shown in Example 7-3. EXAMPLE 7-3: DATA EEPROM WORD ERASE ; Select data EEPROM word, ERASE, WREN bits MOV #0x4044,W0 MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete DS70116G-page 54 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 7.3 Writing to the Data EEPROM To write an EEPROM data location, the following sequence must be followed: 1. 2. 3. Erase data EEPROM word. a) Select word, data EEPROM erase and set WREN bit in NVMCON register. b) Write address of word to be erased into NVMADR. c) Enable NVM interrupt (optional). d) Write ‘55’ to NVMKEY. e) Write ‘AA’ to NVMKEY. f) Set the WR bit. This will begin erase cycle. g) Either poll NVMIF bit or wait for NVMIF interrupt. h) The WR bit is cleared when the erase cycle ends. Write data word into data EEPROM write latches. Program 1 data word into data EEPROM. a) Select word, data EEPROM program, and set WREN bit in NVMCON register. b) Enable NVM write done interrupt (optional). c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set the WR bit. This will begin program cycle. f) Either poll NVMIF bit or wait for NVM interrupt. g) The WR bit is cleared when the write cycle ends. EXAMPLE 7-4: The write will not initiate if the above sequence is not exactly followed (write 0x55 to NVMKEY, write 0xAA to NVMCON, then set WR bit) for each word. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in NVMCON must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code execution. The WREN bit should be kept clear at all times except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect the current write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the Nonvolatile Memory Write Complete Interrupt Flag bit (NVMIF) is set. The user may either enable this interrupt or poll this bit. NVMIF must be cleared by software. 7.3.1 WRITING A WORD OF DATA EEPROM Once the user has erased the word to be programmed, then a table write instruction is used to write one write latch, as shown in Example 7-4. DATA EEPROM WORD WRITE ; Point to data memory MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1,TBLPAG MOV #LOW(WORD),W2 TBLWTL W2,[ W0] ; The NVMADR captures last table access address ; Select data EEPROM for 1 word op MOV #0x4004,W0 MOV W0,NVMCON ; Operate key to allow write operation DISI #5 ; Init pointer ; Get data ; Write data ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 MOV W1,NVMKEY ; Write the 0xAA key BSET NVMCON,#WR ; Initiate program sequence NOP NOP ; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete © 2007 Microchip Technology Inc. DS70116G-page 55 dsPIC30F5011/5013 7.3.2 WRITING A BLOCK OF DATA EEPROM To write a block of data EEPROM, write to all sixteen latches first, then set the NVMCON register and program the block. EXAMPLE 7-5: DATA EEPROM BLOCK WRITE MOV MOV MOV MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV MOV DISI #5 #LOW_ADDR_WORD,W0 #HIGH_ADDR_WORD,W1 W1,TBLPAG #data1,W2 W2,[ W0]++ #data2,W2 W2,[ W0]++ #data3,W2 W2,[ W0]++ #data4,W2 W2,[ W0]++ #data5,W2 W2,[ W0]++ #data6,W2 W2,[ W0]++ #data7,W2 W2,[ W0]++ #data8,W2 W2,[ W0]++ #data9,W2 W2,[ W0]++ #data10,W2 W2,[ W0]++ #data11,W2 W2,[ W0]++ #data12,W2 W2,[ W0]++ #data13,W2 W2,[ W0]++ #data14,W2 W2,[ W0]++ #data15,W2 W2,[ W0]++ #data16,W2 W2,[ W0]++ #0x400A,W0 W0,NVMCON MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70116G-page 56 ; Init pointer ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Get 1st data write data Get 2nd data write data Get 3rd data write data Get 4th data write data Get 5th data write data Get 6th data write data Get 7th data write data Get 8th data write data Get 9th data write data Get 10th data write data Get 11th data write data Get 12th data write data Get 13th data write data Get 14th data write data Get 15th data write data Get 16th data write data. The NVMADR captures last table access address. Select data EEPROM for multi word op Operate Key to allow program operation Block all interrupts with priority <7 for next 5 instructions ; Write the 0x55 key ; Write the 0xAA key ; Start write cycle © 2007 Microchip Technology Inc. dsPIC30F5011/5013 7.4 Write Verify Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. 7.5 Protection Against Spurious Write There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, the WREN bit is cleared, and the Power-up Timer prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction. © 2007 Microchip Technology Inc. DS70116G-page 57 dsPIC30F5011/5013 NOTES: DS70116G-page 58 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 8.0 I/O PORTS Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. An example is the INT4 pin. All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared between the peripherals and the parallel I/O ports. The format of the registers for PORTA are shown in Table 8-1. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 8.1 The TRISA (Data Direction Control) register controls the direction of the RA<7:0> pins, as well as the INTx pins and the VREF pins. The LATA register supplies data to the outputs and is readable/writable. Reading the PORTA register yields the state of the input pins, while writing the PORTA register modifies the contents of the LATA register. Parallel I/O (PIO) Ports When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin may be read but the output driver for the parallel port bit will be disabled. If a peripheral is enabled but the peripheral is not actively driving a pin, that pin may be driven by a port. A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pad cell. Figure 8-2 shows how ports are shared with other peripherals and the associated I/O cell (pad) to which they are connected. Table 8-2 through Table 8-9 show the formats of the registers for the shared ports, PORTB through PORTG. All port pins have three registers directly associated with the operation of the port pin. The Data Direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a ‘1’, then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx), read the latch. Writes to the latch, write the latch (LATx). Reads from the port (PORTx), read the port pins and writes to the port pins, write the latch (LATx). FIGURE 8-1: Note: The actual bits in use vary between devices. BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE Dedicated Port Module Read TRIS I/O Cell TRIS Latch Data Bus D WR TRIS CK Q Data Latch D WR LAT + WR Port Q I/O Pad CK Read LAT Read Port © 2007 Microchip Technology Inc. DS70116G-page 59 dsPIC30F5011/5013 FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE Output Multiplexers Peripheral Module Peripheral Input Data Peripheral Module Enable I/O Cell Peripheral Output Enable 1 Output Enable 0 Peripheral Output Data 1 PIO Module Output Data 0 Read TRIS I/O Pad Data Bus D WR TRIS CK Q TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port 8.2 Configuring Analog Port Pins The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. When reading the Port register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. DS70116G-page 60 8.2.1 I/O PORT WRITE/READ TIMING One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be a NOP. EXAMPLE 8-1: MOV 0xFF00, W0 MOV NOP W0, TRISB btss PORTB, #13 PORT WRITE/READ EXAMPLE ; ; ; ; Configure PORTB<15:8> as inputs and PORTB<7:0> as outputs additional instruction cycle ; bit test RB13 and skip if set © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 8-1: SFR Name Addr. PORTA REGISTER MAP FOR dsPIC30F5013 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 — Bit 9 TRISA10 TRISA9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State — TRISA7 TRISA6 — — — — — — 1111 0110 1100 0000 TRISA 02C0 PORTA 02C2 RA15 RA14 RA13 RA12 — RA10 RA9 — RA7 RA6 — — — — — — 0000 0000 0000 0000 LATA 02C4 LATA15 LATA14 LATA13 LATA12 — LATA10 LATA9 — LATA7 LATA6 — — — — — — 0000 0000 0000 0000 Legend: u = uninitialized bit Note: PORTA is not implemented in the dsPIC30F5011 device. Bit 4 Bit 3 Bit 1 Bit 0 TABLE 8-2: SFR Name Addr. TRISA15 TRISA14 TRISA13 TRISA12 Bit 10 PORTB REGISTER MAP FOR dsPIC30F5011/5013 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 2 TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000 LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000 Legend: 1111 1111 1111 1111 u = uninitialized bit TABLE 8-3: SFR Name TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 Reset State Addr. PORTC REGISTER MAP FOR dsPIC30F5011 Bit 15 Bit 14 Bit 13 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 02CC — — — — — — — — — — TRISC2 TRISC1 — 1110 0000 0000 0110 PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — RC2 RC1 — 0000 0000 0000 0000 LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — LATC2 LATC1 — 0000 0000 0000 0000 Legend: u = uninitialized bit SFR Name Addr. PORTC REGISTER MAP FOR dsPIC30F5013 Bit 15 Bit 14 Bit 13 TRISC15 TRISC14 TRISC13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISC 02CC — — — — — — — — TRISC4 TRISC3 TRISC2 TRISC1 — 1110 0000 0001 1110 PORTC 02CE RC15 RC14 RC13 — — — — — — — — RC4 RC3 RC2 RC1 — 0000 0000 0000 0000 LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — LATC4 LATC3 LATC2 LATC1 — 0000 0000 0000 0000 Legend: u = uninitialized bit DS70116G-page 61 dsPIC30F5011/5013 TRISC TABLE 8-4: TRISC15 TRISC14 TRISC13 Bit 12 PORTD REGISTER MAP FOR dsPIC30F5011 SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 TRISD 02D2 — — — — PORTD 02D4 — — — — RD11 RD10 RD9 LATD 02D6 — — — — LATD11 LATD10 LATD9 Legend: Bit 10 Bit 9 TRISD11 TRISD10 TRISD9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISD8 TRISD7 TRISD6 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 0000 1111 1111 1111 u = uninitialized bit TABLE 8-6: SFR Name Bit 11 Addr. PORTD REGISTER MAP FOR dsPIC30F5013 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000 LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000 Legend: TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111 u = uninitialized bit TABLE 8-7: PORTF REGISTER MAP FOR dsPIC30F5011 SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TRISF 02DE — — — — — — — — — TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111 PORTF 02E0 — — — — — — — — — RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000 LATF 02E2 — — — — — — — — — LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000 Legend: Reset State u = uninitialized bit TABLE 8-8: PORTF REGISTER MAP FOR dsPIC30F5013 © 2007 Microchip Technology Inc. SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISF 02DE — — — — — — — TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111 PORTF 02E0 — — — — — — — RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000 LATF 02E2 — — — — — — — LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000 Legend: u = uninitialized bit TABLE 8-9: SFR Name Addr. PORTG REGISTER MAP FOR dsPIC30F5011/5013 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISG 02E4 — — TRISG9 TRISG8 TRISG7 TRISG6 — — TRISG3 TRISG2 TRISG1 TRISG0 1111 0011 1100 1111 PORTG 02E6 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 0000 0000 0000 0000 LATG 02E8 LATG15 LATG14 LATG13 LATG12 — — LATG9 LATG8 LATG7 LATG6 — — LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000 Legend: TRISG15 TRISG14 TRISG13 TRISG12 u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 62 TABLE 8-5: dsPIC30F5011/5013 8.3 Input Change Notification Module The input change notification module provides the dsPIC30F devices the ability to generate interrupt requests to the processor, in response to a change of state on selected input pins. This module is capable of detecting input change of states even in Sleep mode, when the clocks are disabled. There are up to 24 external signals (CN0 through CN23) that may be selected (enabled) for generating an interrupt request on a change of state. TABLE 8-10: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F5011 (BITS 15-8) SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000 CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000 CNPU1 00C4 CN9PUE CN8PUE 0000 0000 0000 0000 CNPU2 00C6 — — 0000 0000 0000 0000 Legend: u = uninitialized bit TABLE 8-11: CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE — — — — — — INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F5011 (BITS 7-0) SFR Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CNEN2 00C2 — — — — — CN18IE CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CNPU2 00C6 — — — — — Legend: u = uninitialized bit TABLE 8-12: Bit 2 Bit 1 Bit 0 Reset State CN1IE CN0IE 0000 0000 0000 0000 CN17IE CN16IE 0000 0000 0000 0000 CN1PUE CN0PUE 0000 0000 0000 0000 CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000 INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F5013 (BITS 15-8) SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000 CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000 CNPU1 00C4 CN9PUE CN8PUE 0000 0000 0000 0000 CNPU2 00C6 — — 0000 0000 0000 0000 Legend: u = uninitialized bit TABLE 8-13: CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE — — — — — — Reset State INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F5013 (BITS 7-0) SFR Name Addr. CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CNEN2 00C2 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CNPU2 00C6 Legend: u = uninitialized bit Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State CN1IE CN0IE 0000 0000 0000 0000 CN17IE CN16IE 0000 0000 0000 0000 CN1PUE CN0PUE 0000 0000 0000 0000 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000 Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. © 2007 Microchip Technology Inc. DS70116G-page 63 dsPIC30F5011/5013 NOTES: DS70116G-page 64 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 9.0 TIMER1 MODULE These operating modes are determined by setting the appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1 presents a block diagram of the 16-bit timer module. Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). 16-bit Timer Mode: In the 16-bit Timer mode, the timer increments on every instruction cycle up to a match value preloaded into the Period register PR1, then resets to ‘0’ and continues to count. This section describes the 16-bit General Purpose (GP) Timer1 module and associated operational modes. Figure 9-1 depicts the simplified block diagram of the 16-bit Timer1 module. When the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T1CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. The following sections provide a detailed description including setup and control registers, along with associated block diagrams for the operational modes of the timers. 16-bit Synchronous Counter Mode: In the 16-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. The Timer1 module is a 16-bit timer that can serve as the time counter for the real-time clock or operate as a free-running interval timer/counter. The 16-bit timer has the following modes: When the CPU goes into the Idle mode, the timer will stop incrementing unless the respective TSIDL bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. • 16-bit Timer • 16-bit Synchronous Counter • 16-bit Asynchronous Counter Further, the following operational characteristics are supported: 16-bit Asynchronous Counter Mode: In the 16-bit Asynchronous Counter mode, the timer increments on every rising edge of the applied external clock signal. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. • Timer gate operation • Selectable prescaler settings • Timer operation during CPU Idle and Sleep modes • Interrupt on 16-bit Period register match or falling edge of external gate signal FIGURE 9-1: When the timer is configured for the Asynchronous mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing if TSIDL = 1. 16-BIT TIMER1 MODULE BLOCK DIAGRAM PR1 Equal Comparator x 16 TSYNC 1 Reset Sync TMR1 0 T1IF Event Flag 0 1 Q D Q CK TCS TGATE TGATE TON SOSCO/ T1CK © 2007 Microchip Technology Inc. TCKPS<1:0> 2 1x LPOSCEN SOSCI TGATE Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 DS70116G-page 65 dsPIC30F5011/5013 9.1 Timer Gate Operation The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit TGATE (T1CON<6>) must be set to enable this mode. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). When the CPU goes into the Idle mode, the timer will stop incrementing unless TSIDL = 0. If TSIDL = 1, the timer will resume the incrementing sequence upon termination of the CPU Idle mode. 9.2 Timer Prescaler The input clock (FOSC/4 or external clock) to the 16-bit Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits TCKPS<1:0> (T1CON<5:4>). The prescaler counter is cleared when any of the following occurs: • a write to the TMR1 register • a write to the T1CON register • device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the timer prescaler cannot be reset since the prescaler clock is halted. TMR1 is not cleared when T1CON is written. It is cleared by writing to the TMR1 register. 9.3 9.4 Timer Interrupt The 16-bit timer has the ability to generate an interrupt on period match. When the timer count matches the Period register, the T1IF bit is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The timer interrupt flag, T1IF, is located in the IFS0 Control register in the interrupt controller. When the Gated Time Accumulation mode is enabled, an interrupt will also be generated on the falling edge of the gate signal (at the end of the accumulation cycle). Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. 9.5 Real-Time Clock Timer1, when operating in Real-Time Clock (RTC) mode, provides time of day and event time-stamping capabilities. Key operational features of the RTC are: • • • • Operation from 32 kHz LP oscillator 8-bit prescaler Low power Real-Time clock interrupts These operating modes are determined by setting the appropriate bit(s) in the T1CON Control register. FIGURE 9-2: RECOMMENDED COMPONENTS FOR TIMER1 LP OSCILLATOR RTC Timer Operation During Sleep Mode During CPU Sleep mode, the timer will operate if: • The timer module is enabled (TON = 1) and • The timer clock source is selected as external (TCS = 1) and • The TSYNC bit (T1CON<2>) is asserted to a logic ‘0’ which defines the external clock source as asynchronous. C1 SOSCI 32.768 kHz XTAL dsPIC30FXXXX SOSCO C2 R When all three conditions are true, the timer will continue to count up to the Period register and be reset to 0x0000. When a match between the timer and the Period register occurs, an interrupt can be generated if the respective timer interrupt enable bit is asserted. DS70116G-page 66 C1 = C2 = 18 pF; R = 100K © 2007 Microchip Technology Inc. dsPIC30F5011/5013 9.5.1 RTC OSCILLATOR OPERATION When TON = 1, TCS = 1 and TGATE = 0, the timer increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the Period register and is then reset to ‘0’. The TSYNC bit must be asserted to a logic ‘0’ (Asynchronous mode) for correct operation. Enabling LPOSCEN (OSCCON<1>) will disable the normal Timer and Counter modes and enable a timer carry-out wake-up event. 9.5.2 RTC INTERRUPTS When an interrupt event occurs, the respective interrupt flag, T1IF, is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The respective Timer interrupt flag, T1IF, is located in the IFS0 Status register in the interrupt controller. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. When the CPU enters Sleep mode, the RTC will continue to operate provided the 32 kHz external crystal oscillator is active and the control bits have not been changed. The TSIDL bit should be cleared to ‘0’ in order for RTC to continue operation in Idle mode. © 2007 Microchip Technology Inc. DS70116G-page 67 SFR Name Addr. TIMER1 REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 TMR1 0100 Timer1 Register PR1 0102 Period Register 1 T1CON 0104 Legend: TON — TSIDL — — — — — — TGATE Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State uuuu uuuu uuuu uuuu 1111 1111 1111 1111 TCKPS1 TCKPS0 u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. — TSYNC TCS — 0000 0000 0000 0000 dsPIC30F5011/5013 DS70116G-page 68 TABLE 9-1: © 2007 Microchip Technology Inc. dsPIC30F5011/5013 10.0 TIMER2/3 MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the 32-bit General Purpose (GP) Timer module (Timer2/3) and associated operational modes. Figure 10-1 depicts the simplified block diagram of the 32-bit Timer2/3 module. Figure 10-2 and Figure 10-3 show Timer2/3 configured as two independent 16-bit timers, Timer2 and Timer3, respectively. The Timer2/3 module is a 32-bit timer (which can be configured as two 16-bit timers) with selectable operating modes. These timers are utilized by other peripheral modules, such as: • Input Capture • Output Compare/Simple PWM The following sections provide a detailed description, including setup and control registers, along with associated block diagrams for the operational modes of the timers. The 32-bit timer has the following modes: • Two independent 16-bit timers (Timer2 and Timer3) with all 16-bit operating modes (except Asynchronous Counter mode) • Single 32-bit timer operation • Single 32-bit synchronous counter Further, the following operational characteristics are supported: • • • • • ADC event trigger Timer gate operation Selectable prescaler settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit period register match These operating modes are determined by setting the appropriate bit(s) in the 16-bit T2CON and T3CON SFRs. For 32-bit timer/counter operation, Timer2 is the least significant word and Timer3 is the most significant word of the 32-bit timer. Note: For 32-bit timer operation, T3CON control bits are ignored. Only T2CON control bits are used for setup and control. Timer2 clock and gate inputs are utilized for the 32-bit timer module but an interrupt is generated with the Timer3 interrupt flag (T3IF) and the interrupt is enabled with the Timer3 interrupt enable bit (T3IE). 16-bit Timer Mode: In the 16-bit mode, Timer2 and Timer3 can be configured as two independent 16-bit timers. Each timer can be set up in either 16-bit Timer mode or 16-bit Synchronous Counter mode. See Section 9.0 “Timer1 Module”, Timer1 Module for details on these two Operating modes. The only functional difference between Timer2 and Timer3 is that Timer2 provides synchronization of the clock prescaler output. This is useful for high frequency external clock inputs. 32-bit Timer Mode: In the 32-bit Timer mode, the timer increments on every instruction cycle, up to a match value preloaded into the combined 32-bit Period register PR3/PR2, then resets to ‘0’ and continues to count. For synchronous 32-bit reads of the Timer2/Timer3 pair, reading the least significant word (TMR2 register) will cause the most significant word to be read and latched into a 16-bit holding register, termed TMR3HLD. For synchronous 32-bit writes, the holding register (TMR3HLD) must first be written to. When followed by a write to the TMR2 register, the contents of TMR3HLD will be transferred and latched into the MSB of the 32-bit timer (TMR3). 32-bit Synchronous Counter Mode: In the 32-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in the combined 32-bit period register PR3/PR2, then resets to ‘0’ and continues. When the timer is configured for the Synchronous Counter mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. © 2007 Microchip Technology Inc. DS70116G-page 69 dsPIC30F5011/5013 FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM Data Bus<15:0> TMR3HLD 16 16 Write TMR2 Read TMR2 16 Reset TMR3 TMR2 MSB LSB Sync ADC Event Trigger Equal Comparator x 32 PR3 PR2 0 T3IF Event Flag 1 Q D Q CK TGATE (T2CON<6>) TCS TGATE TGATE (T2CON<6>) TON T2CK Note: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer Configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control bits are respective to the T2CON register. DS70116G-page 70 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM PR2 Equal Reset T2IF Event Flag Comparator x 16 TMR2 Sync 0 1 Q D Q CK TGATE TCS TGATE TGATE TON T2CK FIGURE 10-3: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER3 BLOCK DIAGRAM PR3 ADC Event Trigger Equal Comparator x 16 TMR3 Reset 0 1 Q D Q CK TGATE T3CK TGATE TCS TGATE T3IF Event Flag Sync TON 1x 01 TCY © 2007 Microchip Technology Inc. TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 00 DS70116G-page 71 dsPIC30F5011/5013 10.1 Timer Gate Operation The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit TGATE (T2CON<6>) must be set to enable this mode. When in this mode, Timer2 is the originating clock source. The TGATE setting is ignored for Timer3. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). The falling edge of the external signal terminates the count operation but does not reset the timer. The user must reset the timer in order to start counting from zero. 10.2 ADC Event Trigger When a match occurs between the 32-bit timer (TMR3/ TMR2) and the 32-bit combined period register (PR3/ PR2), or between the 16-bit timer TMR3 and the 16-bit period register PR3, a special ADC trigger event signal is generated by Timer3. 10.3 10.4 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will not operate because the internal clocks are disabled. 10.5 Timer Interrupt The 32-bit timer module can generate an interrupt on period match or on the falling edge of the external gate signal. When the 32-bit timer count matches the respective 32-bit period register, or the falling edge of the external “gate” signal is detected, the T3IF bit (IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is used as the source of the interrupt. The T3IF bit must be cleared in software. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T3IE (IEC0<7>). Timer Prescaler The input clock (FOSC/4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64, and 1:256, selected by control bits TCKPS<1:0> (T2CON<5:4> and T3CON<5:4>). For the 32-bit timer operation, the originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The prescaler counter is cleared when any of the following occurs: • a write to the TMR2/TMR3 register • a write to the T2CON/T3CON register • device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the Timer 2 prescaler cannot be reset since the prescaler clock is halted. TMR2/TMR3 is not cleared when T2CON/T3CON is written. DS70116G-page 72 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 10-1: TIMER2/3 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu PR2 010C Period Register 2 1111 1111 1111 1111 PR3 010E Period Register 3 T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 Legend: u = uninitialized bit 1111 1111 1111 1111 Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 73 dsPIC30F5011/5013 NOTES: DS70116G-page 74 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 11.0 TIMER4/5 MODULE • The Timer4/5 module does not support the ADC event trigger feature • Timer4/5 can not be utilized by other peripheral modules, such as input capture and output compare Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The operating modes of the Timer4/5 module are determined by setting the appropriate bit(s) in the 16-bit T4CON and T5CON SFRs. This section describes the second 32-bit General Purpose (GP) Timer module (Timer4/5) and associated operational modes. Figure 11-1 depicts the simplified block diagram of the 32-bit Timer4/5 module. Figure 11-2 and Figure 11-3 show Timer4/5 configured as two independent 16-bit timers, Timer4 and Timer5, respectively. For 32-bit timer/counter operation, Timer4 is the least significant word and Timer5 is the most significant of the 32-bit timer. Note: The Timer4/5 module is similar in operation to the Timer2/3 module. However, there are some differences which are listed as follows: FIGURE 11-1: For 32-bit timer operation, T5CON control bits are ignored. Only T4CON control bits are used for setup and control. Timer4 clock and gate inputs are utilized for the 32-bit timer module but an interrupt is generated with the Timer5 interrupt flag (T5IF) and the interrupt is enabled with the Timer5 interrupt enable bit (T5IE). 32-BIT TIMER4/5 BLOCK DIAGRAM Data Bus<15:0> TMR5HLD 16 16 Write TMR4 Read TMR4 16 Reset Equal TMR5 TMR4 MSB LSB Sync Comparator x 32 PR5 PR4 0 T5IF Event Flag 1 Q Q D TGATE (T4CON<6>) CK TCS TGATE TGATE (T4CON<6>) TON T4CK Note: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer Configuration bit T32 (T4CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control bits are respective to the T4CON register. © 2007 Microchip Technology Inc. DS70116G-page 75 dsPIC30F5011/5013 FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM PR4 Equal Reset TMR4 Sync 0 1 Q D Q CK TGATE TCS TGATE T4IF Event Flag Comparator x 16 TGATE TON T4CK FIGURE 11-3: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER5 BLOCK DIAGRAM PR5 ADC Event Trigger Equal Reset TMR5 0 1 Q D Q CK TGATE TCS TGATE T5IF Event Flag Comparator x 16 TGATE T5CK TON Sync 1x 01 TCY Note: TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 00 In the dsPIC30F5011 device, there is no T5CK pin. Therefore, in this device the following modes should not be used for Timer5: 1: TCS = 1 (16-bit counter) 2: TCS = 0, TGATE = 1 (gated time accumulation) DS70116G-page 76 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 11-1: SFR Name Addr. TIMER4/5 REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TMR4 0114 Timer 4 Register uuuu uuuu uuuu uuuu TMR5HLD 0116 Timer 5 Holding Register (for 32-bit operations only) uuuu uuuu uuuu uuuu TMR5 0118 Timer 5 Register uuuu uuuu uuuu uuuu PR4 011A Period Register 4 1111 1111 1111 1111 PR5 011C Period Register 5 T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T45 — TCS — 0000 0000 0000 0000 0120 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 T5CON Legend: 1111 1111 1111 1111 u = uninitialized dsPIC30F5011/5013 DS70116G-page 77 dsPIC30F5011/5013 NOTES: DS70116G-page 78 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 12.0 INPUT CAPTURE MODULE 12.1 Simple Capture Event Mode The simple capture events in the dsPIC30F product family are: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). • • • • • This section describes the input capture module and associated operational modes. The features provided by this module are useful in applications requiring frequency (period) and pulse measurement. Figure 12-1 depicts a block diagram of the input capture module. Input capture is useful for such modes as: Capture every falling edge Capture every rising edge Capture every 4th rising edge Capture every 16th rising edge Capture every rising and falling edge These simple Input Capture modes are configured by setting the appropriate bits ICM<2:0> (ICxCON<2:0>). 12.1.1 • Frequency/Period/Pulse Measurements • Additional Sources of External Interrupts CAPTURE PRESCALER There are four input capture prescaler settings specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the capture channel is turned off, the prescaler counter will be cleared. In addition, any Reset will clear the prescaler counter. The key operational features of the input capture module are: • Simple Capture Event mode • Timer2 and Timer3 mode selection • Interrupt on input capture event These operating modes are determined by setting the appropriate bits in the ICxCON register (where x = 1,2,...,N). The dsPIC DSC devices contain up to 8 capture channels (i.e., the maximum value of N is 8). FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM From GP Timer Module T3_CNT T2_CNT 16 1 ICx pin Prescaler 1, 4, 16 3 Clock Synchronizer Edge Detection Logic 16 0 ICTMR FIFO R/W Logic ICM<2:0> Mode Select ICxBUF ICBNE, ICOV ICI<1:0> ICxCON Data Bus Note: Interrupt Logic Set Flag ICxIF Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture channels 1 through N. © 2007 Microchip Technology Inc. DS70116G-page 79 dsPIC30F5011/5013 12.1.2 CAPTURE BUFFER OPERATION Each capture channel has an associated FIFO buffer which is four 16-bit words deep. There are two status flags which provide status on the FIFO buffer: • ICBFNE – Input Capture Buffer Not Empty • ICOV – Input Capture Overflow The ICBFNE will be set on the first input capture event and remain set until all capture events have been read from the FIFO. As each word is read from the FIFO, the remaining words are advanced by one position within the buffer. In the event that the FIFO is full with four capture events and a fifth capture event occurs prior to a read of the FIFO, an overflow condition will occur and the ICOV bit will be set to a logic ‘1’. The fifth capture event is lost and is not stored in the FIFO. No additional events will be captured until all four events have been read from the buffer. If a FIFO read is performed after the last read and no new capture event has been received, the read will yield indeterminate results. 12.1.3 TIMER2 AND TIMER3 SELECTION MODE The input capture module consists of up to 8 input capture channels. Each channel can select between one of two timers for the time base, Timer2 or Timer3. Selection of the timer resource is accomplished through SFR bit, ICTMR (ICxCON<7>). Timer3 is the default timer resource available for the input capture module. 12.1.4 HALL SENSOR MODE When the input capture module is set for capture on every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture logic: • The input capture interrupt flag is set on every edge, rising and falling. • The interrupt on Capture mode setting bits, ICI<1:0>, is ignored since every capture generates an interrupt. • A capture overflow condition is not generated in this mode. 12.2 Input Capture Operation During Sleep and Idle Modes An input capture event will generate a device wake-up or interrupt, if enabled, if the device is in CPU Idle or Sleep mode. Independent of the timer being enabled, the input capture module will wake-up from the CPU Sleep or Idle mode when a capture event occurs if ICM<2:0> = 111 and the interrupt enable bit is asserted. The same wakeup can generate an interrupt if the conditions for processing the interrupt have been satisfied. The wake-up feature is useful as a method of adding extra external pin interrupts. 12.2.1 INPUT CAPTURE IN CPU SLEEP MODE CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode, the ICI<1:0> bits are not applicable and the input capture module can only function as an external interrupt source. The capture module must be configured for interrupt only on rising edge (ICM<2:0> = 111) in order for the input capture module to be used while the device is in Sleep mode. The prescale settings of 4:1 or 16:1 are not applicable in this mode. 12.2.2 INPUT CAPTURE IN CPU IDLE MODE CPU Idle mode allows input capture module operation with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable, as well as the 4:1 and 16:1 capture prescale settings which are defined by control bits ICM<2:0>. This mode requires the selected timer to be enabled. Moreover, the ICSIDL bit must be asserted to a logic ‘0’. If the input capture module is defined as ICM<2:0> = 111 in CPU Idle mode, the input capture pin will serve only as an external interrupt pin. 12.3 Input Capture Interrupts The input capture channels have the ability to generate an interrupt based upon the selected number of capture events. The selection number is set by control bits ICI<1:0> (ICxCON<6:5>). Each channel provides an interrupt flag (ICxIF) bit. The respective capture channel interrupt flag is located in the corresponding IFSx Status register. Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The capture interrupt enable bit is located in the corresponding IEC Control register. DS70116G-page 80 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 12-1: SFR Name Addr. IC1BUF 0140 IC1CON 0142 IC2BUF 0144 IC2CON 0146 IC3BUF 0148 IC3CON 014A IC4BUF 014C IC4CON 014E IC5BUF 0150 IC5CON 0152 IC6BUF 0154 IC6CON 0156 IC7BUF 0158 IC7CON 015A IC8BUF 015C IC8CON 015E Legend: INPUT CAPTURE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 — — ICSIDL — — — — Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> Input 1 Capture Register — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR — ICSIDL — — — — — ICTMR 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 8 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 7 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 6 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 5 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 4 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 3 Capture Register — Reset State uuuu uuuu uuuu uuuu Input 2 Capture Register — Bit 0 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 81 dsPIC30F5011/5013 NOTES: DS70116G-page 82 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 13.0 OUTPUT COMPARE MODULE The key operational features of the output compare module include: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the output compare module and associated operational modes. The features provided by this module are useful in applications requiring operational modes, such as: • Generation of Variable Width Output Pulses • Power Factor Correction Figure 13-1 depicts a block diagram of the output compare module. FIGURE 13-1: • • • • • • Timer2 and Timer3 Selection mode Simple Output Compare Match mode Dual Output Compare Match mode Simple PWM mode Output Compare During Sleep and Idle modes Interrupt on Output Compare/PWM Event These operating modes are determined by setting the appropriate bits in the 16-bit OCxCON SFR (where x = 1, 2, 3,..., N). The dsPIC DSC devices contain up to 8 compare channels (i.e., the maximum value of N is 8). OCxRS and OCxR in Figure 13-1 represent the Dual Compare registers. In the Dual Compare mode, the OCxR register is used for the first compare and OCxRS is used for the second compare. OUTPUT COMPARE MODE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output Logic OCxR 3 1 OCTSEL 0 1 Note: OCx OCFA (for x = 1, 2, 3 or 4) or OCFB (for x = 5, 6, 7 or 8) From GP Timer Module TMR2<15:0 Output Enable OCM<2:0> Mode Select Comparator 0 S Q R TMR3<15:0> T2P2_MATCH T3P3_MATCH Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels 1 through N. © 2007 Microchip Technology Inc. DS70116G-page 83 dsPIC30F5011/5013 13.1 Timer2 and Timer3 Selection Mode Each output compare channel can select between one of two 16-bit timers, Timer2 or Timer3. The selection of the timers is controlled by the OCTSEL bit (OCxCON<3>). Timer2 is the default timer resource for the output compare module. 13.2 Simple Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 001, 010 or 011, the selected output compare channel is configured for one of three simple Output Compare Match modes: • Compare forces I/O pin low • Compare forces I/O pin high • Compare toggles I/O pin Dual Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 100 or 101, the selected output compare channel is configured for one of two Dual Output Compare modes, which are: • Single Output Pulse mode • Continuous Output Pulse mode 13.3.1 For the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): TCY. • Determine instruction cycle time • Calculate desired pulse width value based on TCY. • Calculate time to start pulse from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS Compare registers (x denotes channel 1, 2,...,N). • Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. • Set OCM<2:0> = 100. • Enable timer, TON (TxCON<15>) = 1. To initiate another single pulse, issue another write to set OCM<2:0> = 100. DS70116G-page 84 • Determine instruction cycle time TCY. • Calculate desired pulse value based on TCY. • Calculate timer to start pulse width from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS (x denotes channel 1, 2,..., N) Compare registers, respectively. • Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. • Set OCM<2:0> = 101. • Enable timer, TON (TxCON<15>) = 1. Simple PWM Mode When control bits OCM<2:0> (OCxCON<2:0>) = 110 or 111, the selected output compare channel is configured for the PWM mode of operation. When configured for the PWM mode of operation, OCxR is the main latch (read-only) and OCxRS is the secondary latch. This enables glitchless PWM transitions. The user must perform the following steps in order to configure the output compare module for PWM operation: 1. 2. 3. SINGLE PULSE MODE CONTINUOUS PULSE MODE For the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required: 13.4 The OCxR register is used in these modes. The OCxR register is loaded with a value and is compared to the selected incrementing timer count. When a compare occurs, one of these Compare Match modes occurs. If the counter resets to zero before reaching the value in OCxR, the state of the OCx pin remains unchanged. 13.3 13.3.2 4. Set the PWM period by writing to the appropriate period register. Set the PWM duty cycle by writing to the OCxRS register. Configure the output compare module for PWM operation. Set the TMRx prescale value and enable the Timer, TON (TxCON<15>) = 1. 13.4.1 INPUT PIN FAULT PROTECTION FOR PWM When control bits OCM<2:0> (OCxCON<2:0>) = 111, the selected output compare channel is again configured for the PWM mode of operation with the additional feature of input Fault protection. While in this mode, if a logic ‘0’ is detected on the OCFA/B pin, the respective PWM output pin is placed in the high impedance input state. The OCFLT bit (OCxCON<4>) indicates whether a Fault condition has occurred. This state will be maintained until both of the following events have occurred: • The external Fault condition has been removed. • The PWM mode has been reenabled by writing to the appropriate control bits. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 13.4.2 PWM PERIOD When the selected TMRx is equal to its respective period register, PRx, the following four events occur on the next increment cycle: The PWM period is specified by writing to the PRx register. The PWM period can be calculated using Equation 13-1. • TMRx is cleared. • The OCx pin is set. - Exception 1: If PWM duty cycle is 0x0000, the OCx pin will remain low. - Exception 2: If duty cycle is greater than PRx, the pin will remain high. • The PWM duty cycle is latched from OCxRS into OCxR. • The corresponding timer interrupt flag is set. EQUATION 13-1: PWM period = [(PRx) + 1] • 4 • TOSC • (TMRx prescale value) PWM frequency is defined as 1 / [PWM period]. See Figure 13-2 for key PWM period comparisons. Timer3 is referred to in Figure 13-2 for clarity. FIGURE 13-2: PWM OUTPUT TIMING Period Duty Cycle TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = Duty Cycle (OCxR) 13.5 Output Compare Operation During CPU Sleep Mode When the CPU enters Sleep mode, all internal clocks are stopped. Therefore, when the CPU enters the Sleep state, the output compare channel will drive the pin to the active state that was observed prior to entering the CPU Sleep state. For example, if the pin was high when the CPU entered the Sleep state, the pin will remain high. Likewise, if the pin was low when the CPU entered the Sleep state, the pin will remain low. In either case, the output compare module will resume operation when the device wakes up. 13.6 Output Compare Operation During CPU Idle Mode When the CPU enters the Idle mode, the output compare module can operate with full functionality. The output compare channel will operate during the CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at logic ‘0’ and the selected time base (Timer2 or Timer3) is enabled and the TSIDL bit of the selected timer is set to logic ‘0’. © 2007 Microchip Technology Inc. TMR3 = Duty Cycle (OCxR) 13.7 Output Compare Interrupts The output compare channels have the ability to generate an interrupt on a compare match, for whichever Match mode has been selected. For all modes except the PWM mode, when a compare event occurs, the respective interrupt flag (OCxIF) is asserted and an interrupt will be generated if enabled. The OCxIF bit is located in the corresponding IFS Status register and must be cleared in software. The interrupt is enabled via the respective compare interrupt enable (OCxIE) bit located in the corresponding IEC Control register. For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and an interrupt will be generated if enabled. The IF bit is located in the IFS0 Status register and must be cleared in software. The interrupt is enabled via the respective timer interrupt enable bit (T2IE or T3IE) located in the IEC0 Control register. The output compare interrupt flag is never set during the PWM mode of operation. DS70116G-page 85 SFR Name Addr. OC1RS 0180 OC1R 0182 OC1CON 0184 OUTPUT COMPARE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Output Compare 1 Secondary Register — OCSIDL — — — — — — — Reset State 0000 0000 0000 0000 Output Compare 1 Main Register — Bit 0 0000 0000 0000 0000 — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC2RS 0186 Output Compare 2 Secondary Register OC2R 0188 Output Compare 2 Main Register OC2CON 018A OC3RS 018C Output Compare 3 Secondary Register OC3R 018E Output Compare 3 Main Register OC3CON 0190 OC4RS 0192 Output Compare 4 Secondary Register OC4R 0194 Output Compare 4 Main Register OC4CON 0196 OC5RS 0198 Output Compare 5 Secondary Register OC5R 019A Output Compare 5 Main Register OC5CON 019C OC6RS 019E Output Compare 6 Secondary Register OC6R 01A0 Output Compare 6 Main Register OC6CON 01A2 OC7RS 01A4 Output Compare 7 Secondary Register OC7R 01A6 Output Compare 7 Main Register OC7CON 01A8 OC8RS 01AA Output Compare 8 Secondary Register 0000 0000 0000 0000 OC8R 01AC Output Compare 8 Main Register 0000 0000 0000 0000 OC8CON 01AE Legend: u = uninitialized bit — — — — — — — — — — — — — — OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 — — OCFLT OCFLT © 2007 Microchip Technology Inc. Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. OCTSEL OCTSEL OCM<2:0> OCM<2:0> 0000 0000 0000 0000 0000 0000 0000 0000 dsPIC30F5011/5013 DS70116G-page 86 TABLE 13-1: dsPIC30F5011/5013 14.0 SPI MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating with other peripheral devices, such as EEPROMs, shift registers, display drivers and A/D converters, or other microcontrollers. It is compatible with Motorola's SPI and SIOP interfaces. 14.1 Operating Function Description Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates various status conditions. The serial interface consists of 4 pins: SDIx (serial data input), SDOx (serial data output), SCKx (shift clock input or output) and SSx (active low slave select). In Master mode operation, SCK is a clock output but in Slave mode, it is a clock input. A series of eight (8) or sixteen (16) clock pulses shift out bits from the SPIxSR to SDOx pin and simultaneously shift in data from SDIx pin. An interrupt is generated when the transfer is complete and the corresponding interrupt flag bit (SPI1IF or SPI2IF) is set. This interrupt can be disabled through an interrupt enable bit (SPI1IE or SPI2IE). The receive operation is double-buffered. When a complete byte is received, it is transferred from SPIxSR to SPIxBUF. If the receive buffer is full when new data is being transferred from SPIxSR to SPIxBUF, the module will set the SPIROV bit indicating an overflow condition. The transfer of the data from SPIxSR to SPIxBUF will not be completed and the new data will be lost. The module will not respond to SCL transitions while SPIROV is ‘1’, effectively disabling the module until SPIxBUF is read by user software. Transmit writes are also double-buffered. The user writes to SPIxBUF. When the master or slave transfer is completed, the contents of the shift register (SPIxSR) are moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPIxSR. The received data is thus placed in SPIxBUF and the transmit data in SPIxSR is ready for the next transfer. Note: In Master mode, the clock is generated by prescaling the system clock. Data is transmitted as soon as a value is written to SPIxBUF. The interrupt is generated at the middle of the transfer of the last bit. In Slave mode, data is transmitted and received as external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SSx control is enabled, then transmission and reception are enabled only when SSx = low. The SDOx output will be disabled in SSx mode with SSx high. The clock provided to the module is (FOSC/4). This clock is then prescaled by the primary (PPRE<1:0>) and the secondary (SPRE<2:0>) prescale factors. The CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice versa. The CKP bit selects the Idle state (high or low) for the clock. 14.1.1 WORD AND BYTE COMMUNICATION A control bit, MODE16 (SPIxCON<10>), allows the module to communicate in either 16-bit or 8-bit mode. 16-bit operation is identical to 8-bit operation except that the number of bits transmitted is 16 instead of 8. The user software must disable the module prior to changing the MODE16 bit. The SPI module is reset when the MODE16 bit is changed by the user. A basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the SPIxSR for 8-bit operation, and data is transmitted out of bit15 of the SPIxSR for 16-bit operation. In both modes, data is shifted into bit 0 of the SPIxSR. 14.1.2 SDOx DISABLE A control bit, DISSDO, is provided to the SPIxCON register to allow the SDOx output to be disabled. This will allow the SPI module to be connected in an input only configuration. SDO can also be used for general purpose I/O. 14.2 Framed SPI Support The module supports a basic framed SPI protocol in Master or Slave mode. The control bit FRMEN enables framed SPI support and causes the SSx pin to perform the frame synchronization pulse (FSYNC) function. The control bit SPIFSD determines whether the SSx pin is an input or an output (i.e., whether the module receives or generates the frame synchronization pulse). The frame pulse is an active high pulse for a single SPI clock cycle. When frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the SPI clock. Both the transmit buffer (SPIxTXB) and the receive buffer (SPIxRXB) are mapped to the same register address, SPIxBUF. © 2007 Microchip Technology Inc. DS70116G-page 87 dsPIC30F5011/5013 FIGURE 14-1: SPI BLOCK DIAGRAM Internal Data Bus Read Write SPIxBUF SPIxBUF Receive Transmit SPIxSR SDIx bit 0 SDOx SSx Shift Clock Clock Control SS & FSYNC Control Edge Select Secondary Prescaler 1:1 – 1:8 SCKx Primary Prescaler 1, 4, 16, 64 FCY Enable Master Clock Note: x = 1 or 2. FIGURE 14-2: SPI MASTER/SLAVE CONNECTION SPI Master SPI Slave SDOx SDIy Serial Input Buffer (SPIxBUF) SDIx Shift Register (SPIxSR) MSb Serial Input Buffer (SPIyBUF) LSb Shift Register (SPIySR) MSb SCKx PROCESSOR 1 SDOy Serial Clock LSb SCKy PROCESSOR 2 Note: x = 1 or 2, y = 1 or 2. DS70116G-page 88 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 14.3 Slave Select Synchronization The SSx pin allows a Synchronous Slave mode. The SPI must be configured in SPI Slave mode with SSx pin control enabled (SSEN = 1). When the SSx pin is low, transmission and reception are enabled and the SDOx pin is driven. When SSx pin goes high, the SDOx pin is no longer driven. Also, the SPI module is resynchronized, and all counters/control circuitry are reset. Therefore, when the SSx pin is asserted low again, transmission/reception will begin at the MSb even if SSx had been de-asserted in the middle of a transmit/receive. 14.4 14.5 SPI Operation During CPU Idle Mode When the device enters Idle mode, all clock sources remain functional. The SPISIDL bit (SPIxSTAT<13>) selects if the SPI module will stop or continue on Idle. If SPISIDL = 0, the module will continue to operate when the CPU enters Idle mode. If SPISIDL = 1, the module will stop when the CPU enters Idle mode. SPI Operation During CPU Sleep Mode During Sleep mode, the SPI module is shutdown. If the CPU enters Sleep mode while an SPI transaction is in progress, then the transmission and reception is aborted. The transmitter and receiver will stop in Sleep mode. However, register contents are not affected by entering or exiting Sleep mode. © 2007 Microchip Technology Inc. DS70116G-page 89 SPI1 REGISTER MAP SFR Name Addr. Bit 15 SPI1STAT 0220 SPI1CON 0222 SPI1BUF 0224 Legend: u = uninitialized bit TABLE 14-2: SFR Name Bit 14 Bit 13 Bit 12 SPIEN — SPISIDL — — FRMEN SPIFSD — Bit 11 Bit 10 — — DISSDO MODE16 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 Transmit and Receive Buffer 0000 0000 0000 0000 0000 0000 0000 0000 SPI2 REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0226 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000 SPI2CON 0228 — FRMEN SPIFSD — CKE SSEN CKP MSTEN SPRE2 PPRE1 PPRE0 0000 0000 0000 0000 SPI2BUF 022A SPI2STAT Legend: DISSDO MODE16 SMP Transmit and Receive Buffer u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. SPRE1 SPRE0 0000 0000 0000 0000 dsPIC30F5011/5013 DS70116G-page 90 TABLE 14-1: © 2007 Microchip Technology Inc. dsPIC30F5011/5013 15.0 I2C MODULE 15.1.1 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). VARIOUS I2C MODES The following types of I2C operation are supported: • • • I2C slave operation with 7-bit address I2C slave operation with 10-bit address I2C master operation with 7 or 10-bit address See the I2C programmer’s model in Figure 15-1. 2 The Inter-Integrated Circuit (I C) module provides complete hardware support for both Slave and MultiMaster modes of the I2C serial communication standard, with a 16-bit interface. This module offers the following key features: • I2C interface supporting both master and slave operation. • I2C Slave mode supports 7 and 10-bit address. • I2C Master mode supports 7 and 10-bit address. • I2C port allows bidirectional transfers between master and slaves. • Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control). • I2C supports multi-master operation; detects bus collision and will arbitrate accordingly. 15.1 Operating Function Description The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7 and 10-bit addressing. Thus, the I2C module can operate either as a slave or a master on an I2C bus. 15.1.2 I2C has a 2-pin interface: the SCL pin is clock and the SDA pin is data. 15.1.3 I2C REGISTERS I2CCON and I2CSTAT are control and status registers, respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read-only. The remaining bits of the I2CSTAT are read/write. I2CRSR is the shift register used for shifting data, whereas I2CRCV is the buffer register to which data bytes are written, or from which data bytes are read. I2CRCV is the receive buffer as shown in Figure 15-1. I2CTRN is the transmit register to which bytes are written during a transmit operation, as shown in Figure 15-2. The I2CADD register holds the slave address. A Status bit, ADD10, indicates 10-bit Address mode. The I2CBRG acts as the Baud Rate Generator (BRG) reload value. In receive operations, I2CRSR and I2CRCV together form a double-buffered receiver. When I2CRSR receives a complete byte, it is transferred to I2CRCV and an interrupt pulse is generated. During transmission, the I2CTRN is not double-buffered. Note: FIGURE 15-1: PIN CONFIGURATION IN I2C MODE Following a Restart condition in 10-bit mode, the user only needs to match the first 7-bit address. PROGRAMMER’S MODEL I2CRCV (8 bits) Bit 7 Bit 0 Bit 7 Bit 0 I2CTRN (8 bits) I2CBRG (9 bits) Bit 8 Bit 0 I2CCON (16 bits) Bit 15 Bit 0 Bit 15 Bit 0 I2CSTAT (16 bits) I2CADD (10 bits) Bit 9 © 2007 Microchip Technology Inc. Bit 0 DS70116G-page 91 dsPIC30F5011/5013 FIGURE 15-2: I2C™ BLOCK DIAGRAM Internal Data Bus I2CRCV Read SCL Shift Clock I2CRSR LSB SDA Addr_Match Match Detect Write I2CADD Read Start and Stop bit Detect I2CSTAT Write Control Logic Start, Restart, Stop bit Generate Write I2CCON Collision Detect Acknowledge Generation Clock Stretching Read Read Write I2CTRN LSB Shift Clock Read Reload Control BRG Down Counter DS70116G-page 92 Write I2CBRG FCY Read © 2007 Microchip Technology Inc. dsPIC30F5011/5013 15.2 I2C Module Addresses The I2CADD register contains the Slave mode addresses. The register is a 10-bit register. If the A10M bit (I2CCON<10>) is ‘0’, the address is interpreted by the module as a 7-bit address. When an address is received, it is compared to the 7 LSbs of the I2CADD register. If the A10M bit is ‘1’, the address is assumed to be a 10-bit address. When an address is received, it will be compared with the binary value ‘11110 A9 A8’ (where A9 and A8 are two Most Significant bits of I2CADD). If that value matches, the next address will be compared with the Least Significant 8 bits of I2CADD, as specified in the 10-bit addressing protocol. TABLE 15-1: 0x00 Reserved Hs mode Master codes 0x04-0x77 Valid 7-bit addresses 0x78-0x7b Valid 10-bit addresses (lower 7 bits) 0x7c-0x7f Reserved I2C 7-bit Slave Mode Operation Once enabled (I2CEN = 1), the slave module will wait for a Start bit to occur (i.e., the I2C module is ‘Idle’). Following the detection of a Start bit, 8 bits are shifted into I2CRSR and the address is compared against I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0> are compared against I2CRSR<7:1> and I2CRSR<0> is the R_W bit. All incoming bits are sampled on the rising edge of SCL. If an address match occurs, an Acknowledgement will be sent, and the slave event interrupt flag (SI2CIF) is set on the falling edge of the ninth (ACK) bit. The address match does not affect the contents of the I2CRCV buffer or the RBF bit. 15.3.1 If the RBF flag is set, indicating that I2CRCV is still holding data from a previous operation (RBF = 1), then ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the I2CRSR are not loaded into the I2CRCV. Note: General call address or start byte 0x04-0x07 SLAVE TRANSMISSION If the R_W bit received is a ‘1’, then the serial port will go into Transmit mode. It will send ACK on the ninth bit and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL bit, and 8 bits of data are shifted out. Data bits are shifted out on the falling edge of SCL, such that SDA is valid during SCL high. The interrupt pulse is sent on the falling edge of the ninth clock pulse, regardless of the status of the ACK received from the master. © 2007 Microchip Technology Inc. SLAVE RECEPTION If the R_W bit received is a ‘0’ during an address match, then Receive mode is initiated. Incoming bits are sampled on the rising edge of SCL. After 8 bits are received, if I2CRCV is not full or I2COV is not set, I2CRSR is transferred to I2CRCV. ACK is sent on the ninth clock. 7-BIT I2C™ SLAVE ADDRESSES SUPPORTED BY dsPIC30F 0x01-0x03 15.3 15.3.2 15.4 The I2CRCV will be loaded if the I2COV bit = 1 and the RBF flag = 0. In this case, a read of the I2CRCV was performed but the user did not clear the state of the I2COV bit before the next receive occurred. The Acknowledgement is not sent (ACK = 1) and the I2CRCV is updated. I2C 10-bit Slave Mode Operation In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the criteria for address match is more complex. The I2C specification dictates that a slave must be addressed for a write operation with two address bytes following a Start bit. The A10M bit is a control bit that signifies that the address in I2CADD is a 10-bit address rather than a 7-bit address. The address detection protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is compared against a literal ‘11110’ (the default 10-bit address) and I2CRSR<2:1> are compared against I2CADD<9:8>. If a match occurs and if R_W = 0, the interrupt pulse is sent. The ADD10 bit will be cleared to indicate a partial address match. If a match fails or R_W = 1, the ADD10 bit is cleared and the module returns to the Idle state. The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs, the interrupt pulse is generated and the ADD10 bit is set, indicating a complete 10-bit address match. If an address match did not occur, the ADD10 bit is cleared and the module returns to the Idle state. DS70116G-page 93 dsPIC30F5011/5013 15.4.1 10-BIT MODE SLAVE TRANSMISSION Once a slave is addressed in this fashion with the full 10-bit address (we will refer to this state as “PRIOR_ADDR_MATCH”), the master can begin sending data bytes for a slave reception operation. 15.4.2 10-BIT MODE SLAVE RECEPTION Once addressed, the master can generate a Repeated Start, Reset the high byte of the address and set the R_W bit without generating a Stop bit, thus initiating a slave transmit operation. 15.5 Automatic Clock Stretch In the Slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 15.5.1 Clock stretching takes place following the ninth clock of the receive sequence. On the falling edge of the ninth clock at the end of the ACK sequence, if the RBF bit is set, the SCLREL bit is automatically cleared, forcing the SCL output to be held low. The user’s ISR must set the SCLREL bit before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the I2CRCV before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring. Note 1: If the user reads the contents of the I2CRCV, clearing the RBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software regardless of the state of the RBF bit. The user should be careful to clear the RBF bit in the ISR before the next receive sequence in order to prevent an overflow condition. TRANSMIT CLOCK STRETCHING Both 10-bit and 7-bit Transmit modes implement clock stretching by asserting the SCLREL bit after the falling edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty. In Slave Transmit modes, clock stretching is always performed irrespective of the STREN bit. 15.5.4 Clock synchronization takes place following the ninth clock of the transmit sequence. If the device samples an ACK on the falling edge of the ninth clock and if the TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’ will assert the SCL line low. The user’s ISR must set the SCLREL bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN before the master device can initiate another transmit sequence. Clock stretching takes place automatically during the addressing sequence. Because this module has a register for the entire address, it is not necessary for the protocol to wait for the address to be updated. Note 1: If the user loads the contents of I2CTRN, setting the TBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software, regardless of the state of the TBF bit. 15.5.2 RECEIVE CLOCK STRETCHING The STREN bit in the I2CCON register can be used to enable clock stretching in Slave Receive mode. When the STREN bit is set, the SCL pin will be held low at the end of each data receive sequence. 15.5.3 CLOCK STRETCHING DURING 7-BIT ADDRESSING (STREN = 1) CLOCK STRETCHING DURING 10-BIT ADDRESSING (STREN = 1) After the address phase is complete, clock stretching will occur on each data receive or transmit sequence as was described earlier. 15.6 Software Controlled Clock Stretching (STREN = 1) When the STREN bit is ‘1’, the SCLREL bit may be cleared by software to allow software to control the clock stretching. The logic will synchronize writes to the SCLREL bit with the SCL clock. Clearing the SCLREL bit will not assert the SCL output until the module detects a falling edge on the SCL output and SCL is sampled low. If the SCLREL bit is cleared by the user while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all other devices on the I2C bus have de-asserted SCL. This ensures that a write to the SCLREL bit will not violate the minimum high time requirement for SCL. If the STREN bit is ‘0’, a software write to the SCLREL bit will be disregarded and have no effect on the SCLREL bit. When the STREN bit is set in Slave Receive mode, the SCL line is held low when the buffer register is full. The method for stretching the SCL output is the same for both 7 and 10-bit Addressing modes. DS70116G-page 94 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 15.7 Interrupts The I2C module generates two interrupt flags, MI2CIF (I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on completion of a master message event. The SI2CIF interrupt flag is activated on detection of a message directed to the slave. 15.8 Slope Control The I2C standard requires slope control on the SDA and SCL signals for Fast mode (400 kHz). The control bit, DISSLW, enables the user to disable slew rate control if desired. It is necessary to disable the slew rate control for 1 MHz mode. 15.9 IPMI Support The control bit, IPMIEN, enables the module to support Intelligent Peripheral Management Interface (IPMI). When this bit is set, the module accepts and acts upon all addresses. 15.10 General Call Address Support The general call address can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledgement. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R_W = 0. The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<7> = 1). Following a Start bit detection, 8 bits are shifted into I2CRSR and the address is compared with I2CADD, and is also compared with the general call address which is fixed in hardware. If a general call address match occurs, the I2CRSR is transferred to the I2CRCV after the eighth clock, the RBF flag is set and on the falling edge of the ninth bit (ACK bit), the master event interrupt flag (MI2CIF) is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the I2CRCV to determine if the address was device specific or a general call address. 15.11 I2C Master Support As a master device, six operations are supported: 15.12 I2C Master Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate receive bit. Serial data is received via SDA while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an ACK bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. 15.12.1 I2C MASTER TRANSMISSION Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should only write to I2CTRN when the module is in a Wait state. This action will set the Buffer Full Flag (TBF) and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. The Transmit Status Flag, TRSTAT (I2CSTAT<14>), indicates that a master transmit is in progress. 15.12.2 I2C MASTER RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (I2CCON<3>). The I2C module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin ACK and data are shifted into the I2CRSR on the rising edge of each clock. • Assert a Start condition on SDA and SCL. • Assert a Restart condition on SDA and SCL. • Write to the I2CTRN register initiating transmission of data/address. • Generate a Stop condition on SDA and SCL. • Configure the I2C port to receive data. • Generate an ACK condition at the end of a received byte of data. © 2007 Microchip Technology Inc. DS70116G-page 95 dsPIC30F5011/5013 15.12.3 BAUD RATE GENERATOR 2 In I C Master mode, the reload value for the BRG is located in the I2CBRG register. When the BRG is loaded with this value, the BRG counts down to ‘0’ and stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded when the SCL pin is sampled high. As per the I2C standard, FSCK may be 100 kHz or 400 kHz. However, the user can specify any baud rate up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal. EQUATION 15-1: I2CBRG = 15.12.4 SERIAL CLOCK RATE CY ( FFSCK – FCY 1,111,111 ) –1 CLOCK ARBITRATION Clock arbitration occurs when the master deasserts the SCL pin (SCL allowed to float high) during any receive, transmit, or Restart/Stop condition. When the SCL pin is allowed to float high, the Baud Rate Generator is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of I2CBRG and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device. 15.12.5 MULTI-MASTER COMMUNICATION, BUS COLLISION, AND BUS ARBITRATION Multi-master operation support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA by letting SDA float high while another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the MI2CIF pulse and Reset the master portion of the I2C port to its Idle state. If a transmit was in progress when the bus collision occurred, the transmission is halted, the TBF flag is cleared, the SDA and SCL lines are de-asserted and a value can now be written to I2CTRN. When the user services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set), the user can resume communication by asserting a Start condition. If a Start, Restart, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are de-asserted and the respective control bits in the I2CCON register are cleared to ‘0’. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins, and if a Stop condition occurs, the MI2CIF bit will be set. A write to the I2CTRN will start the transmission of data at the first data bit regardless of where the transmitter left off when bus collision occurred. In a multi-master environment, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the I2CSTAT register, or the bus is Idle and the S and P bits are cleared. 15.13 I2C Module Operation During CPU Sleep and Idle Modes 15.13.1 I2C OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a transmission and the state machine is partially into a transmission as the clocks stop, then the transmission is aborted. Similarly, if Sleep occurs in the middle of a reception, then the reception is aborted. 15.13.2 I2C OPERATION DURING CPU IDLE MODE For the I2C, the I2CSIDL bit selects if the module will stop on Idle or continue on Idle. If I2CSIDL = 0, the module will continue operation on assertion of the Idle mode. If I2CSIDL = 1, the module will stop on Idle. DS70116G-page 96 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 15-2: SFR Name Addr. I2C REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State I2CRCV 0200 — — — — — — — — Receive Register 0000 0000 0000 0000 I2CTRN 0202 — — — — — — — — Transmit Register 0000 0000 1111 1111 I2CBRG 0204 — — — — — — — I2CCON 0206 I2CEN — A10M DISSLW SMEN GCEN STREN GCSTAT ADD10 IWCOL I2COV I2CSIDL SCLREL IPMIEN I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL I2CADD 020A — — — — — — Legend: u = uninitialized bit Baud Rate Generator 0000 0000 0000 0000 ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000 D_A P S R_W RBF TBF 0000 0000 0000 0000 Address Register 0000 0000 0000 0000 Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 97 dsPIC30F5011/5013 NOTES: DS70116G-page 98 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 16.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) MODULE 16.1 The key features of the UART module are: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the Universal Asynchronous Receiver/Transmitter Communications module. • • • • • • • • • • • FIGURE 16-1: UART Module Overview Full-duplex, 8 or 9-bit data communication Even, odd or no parity options (for 8-bit data) One or two Stop bits Fully integrated Baud Rate Generator with 16-bit prescaler Baud rates range from 38 bps to 1.875 Mbps at a 30 MHz instruction rate 4-word deep transmit data buffer 4-word deep receive data buffer Parity, framing and buffer overrun error detection Support for interrupt only on address detect (9th bit = 1) Separate transmit and receive interrupts Loopback mode for diagnostic support UART TRANSMITTER BLOCK DIAGRAM Internal Data Bus Control and Status bits Write UTX8 Write UxTXREG Low Byte Transmit Control – Control TSR – Control Buffer – Generate Flags – Generate Interrupt Load TSR UxTXIF UTXBRK Data Transmit Shift Register (UxTSR) ‘0’ (Start) UxTX ‘1’ (Stop) Parity Parity Generator 16 Divider 16x Baud Clock from Baud Rate Generator Control Signals Note: x = 1 or 2. © 2007 Microchip Technology Inc. DS70116G-page 99 dsPIC30F5011/5013 FIGURE 16-2: UART RECEIVER BLOCK DIAGRAM Internal Data Bus 16 Write Read Read Read UxMODE Write UxSTA URX8 UxRXREG Low Byte Receive Buffer Control – Generate Flags – Generate Interrupt – Shift Data Characters 0 · Start bit Detect · Parity Check · Stop bit Detect · Shift Clock Generation · Wake Logic Load RSR to Buffer Receive Shift Register (UxRSR) Control Signals FERR UxRX 8-9 PERR LPBACK From UxTX 1 16 Divider 16x Baud Clock from Baud Rate Generator UxRXIF DS70116G-page 100 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 16.2 16.2.1 Enabling and Setting Up UART ENABLING THE UART The UART module is enabled by setting the UARTEN bit in the UxMODE register (where x = 1 or 2). Once enabled, the UxTX and UxRX pins are configured as an output and an input respectively, overriding the TRIS and LATCH register bit settings for the corresponding I/O port pins. The UxTX pin is at logic ‘1’ when no transmission is taking place. 16.2.2 16.3 16.3.1 Disabling the UART module resets the buffers to empty states. Any data characters in the buffers are lost and the baud rate counter is reset. 1. 2. 3. 4. All error and status flags associated with the UART module are reset when the module is disabled. The URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and UTXBF bits are cleared, whereas RIDLE and TRMT are set. Other control bits, including ADDEN, URXISEL<1:0>, UTXISEL, as well as the UxMODE and UxBRG registers, are not affected. Clearing the UARTEN bit while the UART is active will abort all pending transmissions and receptions and reset the module as defined above. Reenabling the UART will restart the UART in the same configuration. 16.2.3 SETTING UP DATA, PARITY AND STOP BIT SELECTIONS Control bits PDSEL<1:0> in the UxMODE register are used to select the data length and parity used in the transmission. The data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. The STSEL bit determines whether one or two Stop bits will be used during data transmission. The default (power-on) setting of the UART is 8 bits, no parity and 1 Stop bit (typically represented as 8, N, 1). TRANSMITTING IN 8-BIT DATA MODE The following steps must be performed in order to transmit 8-bit data: DISABLING THE UART The UART module is disabled by clearing the UARTEN bit in the UxMODE register. This is the default state after any Reset. If the UART is disabled, all I/O pins operate as port pins under the control of the latch and TRIS bits of the corresponding port pins. Transmitting Data 5. Set up the UART: First, the data length, parity and number of Stop bits must be selected. Then, the transmit and receive interrupt enable and priority bits are setup in the UxMODE and UxSTA registers. Also, the appropriate baud rate value must be written to the UxBRG register. Enable the UART by setting the UARTEN bit (UxMODE<15>). Set the UTXEN bit (UxSTA<10>), thereby enabling a transmission. Write the byte to be transmitted to the lower byte of UxTXREG. The value will be transferred to the Transmit Shift register (UxTSR) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. Alternatively, the data byte may be written while UTXEN = 0, following which, the user may set UTXEN. This will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. A transmit interrupt will be generated, depending on the value of the interrupt control bit UTXISEL (UxSTA<15>). 16.3.2 TRANSMITTING IN 9-BIT DATA MODE The sequence of steps involved in the transmission of 9-bit data is similar to 8-bit transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the UxTXREG register. 16.3.3 TRANSMIT BUFFER (UXTXB) The transmit buffer is 9 bits wide and 4 characters deep. Including the Transmit Shift register (UxTSR), the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF Status bit (UxSTA<9>) indicates whether the transmit buffer is full. If a user attempts to write to a full buffer, the new data will not be accepted into the FIFO, and no data shift will occur within the buffer. This enables recovery from a buffer overrun condition. The FIFO is reset during any device Reset but is not affected when the device enters or wakes up from a Power-Saving mode. © 2007 Microchip Technology Inc. DS70116G-page 101 dsPIC30F5011/5013 16.3.4 TRANSMIT INTERRUPT The transmit interrupt flag (U1TXIF or U2TXIF) is located in the corresponding interrupt flag register. The transmitter generates an edge to set the UxTXIF bit. The condition for generating the interrupt depends on the UTXISEL control bit: a) b) If UTXISEL = 0, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR). This implies that the transmit buffer has at least one empty word. If UTXISEL = 1, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR) and the transmit buffer is empty. Switching between the two Interrupt modes during operation is possible and sometimes offers more flexibility. 16.3.5 TRANSMIT BREAK 16.4.2 RECEIVE BUFFER (UXRXB) The receive buffer is 4 words deep. Including the Receive Shift register (UxRSR), the user effectively has a 5-word deep FIFO buffer. URXDA (UxSTA<0>) = 1 indicates that the receive buffer has data available. URXDA = 0 implies that the buffer is empty. If a user attempts to read an empty buffer, the old values in the buffer will be read and no data shift will occur within the FIFO. The FIFO is reset during any device Reset. It is not affected when the device enters or wakes up from a Power-Saving mode. 16.4.3 RECEIVE INTERRUPT The receive interrupt flag (U1RXIF or U2RXIF) can be read from the corresponding interrupt flag register. The interrupt flag is set by an edge generated by the receiver. The condition for setting the receive interrupt flag depends on the settings specified by the URXISEL<1:0> (UxSTA<7:6>) control bits. Setting the UTXBRK bit (UxSTA<11>) will cause the UxTX line to be driven to logic ‘0’. The UTXBRK bit overrides all transmission activity. Therefore, the user should generally wait for the transmitter to be Idle before setting UTXBRK. a) To send a break character, the UTXBRK bit must be set by software and must remain set for a minimum of 13 baud clock cycles. The UTXBRK bit is then cleared by software to generate Stop bits. The user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid Stop bit(s) before reloading the UxTXB, or starting other transmitter activity. Transmission of a break character does not generate a transmit interrupt. b) 16.4 Switching between the Interrupt modes during operation is possible, though generally not advisable during normal operation. 16.4.1 Receiving Data RECEIVING IN 8-BIT OR 9-BIT DATA MODE The following steps must be performed while receiving 8-bit or 9-bit data: 1. 2. 3. 4. 5. Set up the UART (see Section 16.3.1 “Transmitting in 8-bit data mode”). Enable the UART (see Section 16.3.1 “Transmitting in 8-bit data mode”). A receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the URXISEL bits (UxSTA<7:6>). Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. Read the received data from UxRXREG. The act of reading UxRXREG will move the next word to the top of the receive FIFO, and the PERR and FERR values will be updated. DS70116G-page 102 c) If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred from the Receive Shift register (UxRSR) to the receive buffer. There may be one or more characters in the receive buffer. If URXISEL<1:0> = 10, an interrupt is generated when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 3 characters. If URXISEL<1:0> = 11, an interrupt is set when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 4 characters (i.e., becomes full). 16.5 16.5.1 Reception Error Handling RECEIVE BUFFER OVERRUN ERROR (OERR BIT) The OERR bit (UxSTA<1>) is set if all of the following conditions occur: a) b) c) The receive buffer is full. The Receive Shift register is full, but unable to transfer the character to the receive buffer. The Stop bit of the character in the UxRSR is detected, indicating that the UxRSR needs to transfer the character to the buffer. Once OERR is set, no further data is shifted in UxRSR (until the OERR bit is cleared in software or a Reset occurs). The data held in UxRSR and UxRXREG remains valid. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 16.5.2 FRAMING ERROR (FERR) The FERR bit (UxSTA<2>) is set if a ‘0’ is detected instead of a Stop bit. If two Stop bits are selected, both Stop bits must be ‘1’, otherwise FERR will be set. The read-only FERR bit is buffered along with the received data. It is cleared on any Reset. 16.5.3 PARITY ERROR (PERR) The PERR bit (UxSTA<3>) is set if the parity of the received word is incorrect. This error bit is applicable only if a Parity mode (odd or even) is selected. The read-only PERR bit is buffered along with the received data bytes. It is cleared on any Reset. 16.5.4 IDLE STATUS When the receiver is active (i.e., between the initial detection of the Start bit and the completion of the Stop bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the completion of the Stop bit and detection of the next Start bit, the RIDLE bit is ‘1’, indicating that the UART is Idle. 16.5.5 RECEIVE BREAK The receiver will count and expect a certain number of bit times based on the values programmed in the PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. 16.6 Address Detect Mode Setting the ADDEN bit (UxSTA<5>) enables this special mode in which a 9th bit (URX8) value of ‘1’ identifies the received word as an address, rather than data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any impact on interrupt generation in this mode since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. 16.7 Loopback Mode Setting the LPBACK bit enables this special mode in which the UxTX pin is internally connected to the UxRX pin. When configured for the Loopback mode, the UxRX pin is disconnected from the internal UART receive logic. However, the UxTX pin still functions as in a normal operation. To select this mode: a) b) c) Configure UART for desired mode of operation. Set LPBACK = 1 to enable Loopback mode. Enable transmission as defined in Section 16.3 “Transmitting Data”. 16.8 Baud Rate Generator If the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by PDSEL and STSEL. The URXDA bit is set, FERR is set, zeros are loaded into the receive FIFO, interrupts are generated if appropriate and the RIDLE bit is set. The UART has a 16-bit Baud Rate Generator to allow maximum flexibility in baud rate generation. The Baud Rate Generator register (UxBRG) is readable and writable. The baud rate is computed as follows: When the module receives a long break signal and the receiver has detected the Start bit, the data bits and the invalid Stop bit (which sets the FERR), the receiver must wait for a valid Stop bit before looking for the next Start bit. It cannot assume that the break condition on the line is the next Start bit. FCY = Instruction Clock Rate (1/TCY) Break is regarded as a character containing all ‘0’s with the FERR bit set. The break character is loaded into the buffer. No further reception can occur until a Stop bit is received. Note that RIDLE goes high when the Stop bit has not yet been received. BRG = 16-bit value held in UxBRG register (0 through 65535) The Baud Rate is given by Equation 16-1. EQUATION 16-1: BAUD RATE Baud Rate = FCY / (16*(BRG+1)) Therefore, the maximum baud rate possible is FCY /16 (if BRG = 0), and the minimum baud rate possible is FCY / (16* 65536). With a full 16-bit Baud Rate Generator at 30 MIPS operation, the minimum baud rate achievable is 28.5 bps. © 2007 Microchip Technology Inc. DS70116G-page 103 dsPIC30F5011/5013 16.9 Auto Baud Support To allow the system to determine baud rates of received characters, the input can be optionally linked to a capture input (IC1 for UART1, IC2 for UART2). To enable this mode, the user must program the input capture module to detect the falling and rising edges of the Start bit. 16.10.2 UART OPERATION DURING CPU IDLE MODE For the UART, the USIDL bit selects if the module will stop operation when the device enters Idle mode or whether the module will continue on Idle. If USIDL = 0, the module will continue operation during Idle mode. If USIDL = 1, the module will stop on Idle. 16.10 UART Operation During CPU Sleep and Idle Modes 16.10.1 UART OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted. The UxTX pin is driven to logic ‘1’. Similarly, if entry into Sleep mode occurs while a reception is in progress, then the reception is aborted. The UxSTA, UxMODE, transmit and receive registers and buffers, and the UxBRG register are not affected by Sleep mode. If the WAKE bit (UxMODE<7>) is set before the device enters Sleep mode, then a falling edge on the UxRX pin will generate a receive interrupt. The Receive Interrupt Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will wake-up the device from Sleep. The UARTEN bit must be set in order to generate a wake-up interrupt. DS70116G-page 104 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 16-1: UART1 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 — — U1MODE 020C UARTEN — USIDL — U1STA 020E UTXISEL — — — U1TXREG 0210 — — — — — U1RXREG 0212 — — — — — U1BRG 0214 Legend: u = uninitialized bit TABLE 16-2: SFR Name Addr. Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 WAKE LPBACK ABAUD Bit 3 — PERR Bit 0 Reset State — — TRMT — — UTX8 Transmit Register 0000 000u uuuu uuuu — — URX8 Receive Register 0000 0000 0000 0000 URXISEL1 URXISEL0 ADDEN — Bit 1 UTXBF UTXBRK UTXEN RIDLE Bit 2 PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000 FERR OERR URXDA 0000 0001 0001 0000 Baud Rate Generator Prescaler 0000 0000 0000 0000 UART2 REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 — — Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 WAKE LPBACK ABAUD Bit 3 Bit 2 Bit 1 Bit 0 Reset State U2MODE 0216 UARTEN — USIDL — U2STA 0218 UTXISEL — — — U2TXREG 021A — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000 U2BRG 021E Legend: u = uninitialized bit UTXBRK UTXEN — — UTXBF TRMT URXISEL1 URXISEL0 ADDEN Baud Rate Generator Prescaler — — RIDLE PERR PDSEL1 PDSEL0 FERR OERR STSEL 0000 0000 0000 0000 URXDA 0000 0001 0001 0000 0000 0000 0000 0000 Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 105 dsPIC30F5011/5013 NOTES: DS70116G-page 106 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 17.0 CAN MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). 17.1 Overview The Controller Area Network (CAN) module is a serial interface, useful for communicating with other CAN modules or microcontroller devices. This interface/ protocol was designed to allow communications within noisy environments. The CAN module is a communication controller implementing the CAN 2.0 A/B protocol, as defined in the BOSCH specification. The module will support CAN 1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B Active versions of the protocol. The module implementation is a full CAN system. The CAN specification is not covered within this data sheet. The reader may refer to the BOSCH CAN specification for further details. The module features are as follows: • Implementation of the CAN protocol CAN 1.2, CAN 2.0A and CAN 2.0B • Standard and extended data frames • 0-8 bytes data length • Programmable bit rate up to 1 Mbps • Support for remote frames • Double-buffered receiver with two prioritized received message storage buffers (each buffer may contain up to 8 bytes of data) • 6 full (standard/extended identifier) acceptance filters, 2 associated with the high priority receive buffer and 4 associated with the low priority receive buffer • 2 full acceptance filter masks, one each associated with the high and low priority receive buffers • Three transmit buffers with application specified prioritization and abort capability (each buffer may contain up to 8 bytes of data) • Programmable wake-up functionality with integrated low-pass filter • Programmable Loopback mode supports self-test operation • Signaling via interrupt capabilities for all CAN receiver and transmitter error states • Programmable clock source • Programmable link to Input Capture module (IC2, for both CAN1 and CAN2) for time-stamping and network synchronization • Low-power Sleep and Idle mode © 2007 Microchip Technology Inc. The CAN bus module consists of a protocol engine and message buffering/control. The CAN protocol engine handles all functions for receiving and transmitting messages on the CAN bus. Messages are transmitted by first loading the appropriate data registers. Status and errors can be checked by reading the appropriate registers. Any message detected on the CAN bus is checked for errors and then matched against filters to see if it should be received and stored in one of the receive registers. 17.2 Frame Types The CAN module transmits various types of frames which include data messages or remote transmission requests initiated by the user, as other frames that are automatically generated for control purposes. The following frame types are supported: • Standard Data Frame: A standard data frame is generated by a node when the node wishes to transmit data. It includes an 11-bit standard identifier (SID), but not an 18-bit extended identifier (EID). • Extended Data Frame: An extended data frame is similar to a standard data frame but includes an extended identifier as well. • Remote Frame: It is possible for a destination node to request the data from the source. For this purpose, the destination node sends a remote frame with an identifier that matches the identifier of the required data frame. The appropriate data source node will then send a data frame as a response to this remote request. • Error Frame: An error frame is generated by any node that detects a bus error. An error frame consists of 2 fields: an error flag field and an error delimiter field. • Overload Frame: An overload frame can be generated by a node as a result of 2 conditions. First, the node detects a dominant bit during interframe space which is an illegal condition. Second, due to internal conditions, the node is not yet able to start reception of the next message. A node may generate a maximum of 2 sequential overload frames to delay the start of the next message. • Interframe Space: Interframe space separates a proceeding frame (of whatever type) from a following data or remote frame. DS70116G-page 107 dsPIC30F5011/5013 FIGURE 17-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM Acceptance Mask RXM1 BUFFERS Acceptance Filter RXF2 MESSAGE MSGREQ TXABT TXLARB TXERR MTXBUFF TXB2 MESSAGE MSGREQ TXABT TXLARB TXERR MTXBUFF MESSAGE TXB1 MSGREQ TXABT TXLARB TXERR MTXBUFF TXB0 A c c e p t R X B 0 Message Queue Control Transmit Byte Sequencer Acceptance Mask RXM0 Acceptance Filter RXF3 Acceptance Filter RXF0 Acceptance Filter RXF4 Acceptance Filter RXF1 Acceptance Filter RXF5 Identifier M A B Data Field Data Field PROTOCOL ENGINE Note 1: RERRCNT TERRCNT Err Pas Bus Off Transmit Error Counter CRC Generator R X B 1 Identifier Receive Error Counter Transmit Shift A c c e p t Receive Shift Protocol Finite State Machine CRC Check Transmit Logic Bit Timing Logic CiTX(1) CiRX(1) Bit Timing Generator i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2). DS70116G-page 108 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 17.3 Modes of Operation The CAN module can operate in one of several operation modes selected by the user. These modes include: • • • • • • Initialization Mode Disable Mode Normal Operation Mode Listen Only Mode Loopback Mode Error Recognition Mode Modes are requested by setting the REQOP<2:0> bits (CiCTRL<10:8>). Entry into a mode is Acknowledged by monitoring the OPMODE<2:0> bits (CiCTRL<7:5>). The module will not change the mode and the OPMODE bits until a change in mode is acceptable, generally during bus Idle time which is defined as at least 11 consecutive recessive bits. 17.3.1 INITIALIZATION MODE In the Initialization mode, the module will not transmit or receive. The error counters are cleared and the interrupt flags remain unchanged. The programmer will have access to configuration registers that are access restricted in other modes. The module will protect the user from accidentally violating the CAN protocol through programming errors. All registers which control the configuration of the module can not be modified while the module is on-line. The CAN module will not be allowed to enter the Configuration mode while a transmission is taking place. The Configuration mode serves as a lock to protect the following registers. • • • • • All Module Control Registers Baud Rate and Interrupt Configuration Registers Bus Timing Registers Identifier Acceptance Filter Registers Identifier Acceptance Mask Registers 17.3.2 DISABLE MODE In Disable mode, the module will not transmit or receive. The module has the ability to set the WAKIF bit due to bus activity, however, any pending interrupts will remain and the error counters will retain their value. If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the module will enter the Module Disable mode. If the module is active, the module will wait for 11 recessive bits on the CAN bus, detect that condition as an Idle bus, then accept the module disable command. When the OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indicates whether the module successfully went into Module Disable mode. The I/O pins will revert to normal I/O function when the module is in the Module Disable mode. © 2007 Microchip Technology Inc. The module can be programmed to apply a low-pass filter function to the CiRX input line while the module or the CPU is in Sleep mode. The WAKFIL bit (CiCFG2<14>) enables or disables the filter. Note: 17.3.3 Typically, if the CAN module is allowed to transmit in a particular mode of operation and a transmission is requested immediately after the CAN module has been placed in that mode of operation, the module waits for 11 consecutive recessive bits on the bus before starting transmission. If the user switches to Disable mode within this 11-bit period, then this transmission is aborted and the corresponding TXABT bit is set and TXREQ bit is cleared. NORMAL OPERATION MODE Normal operating mode is selected when REQOP<2:0> = 000. In this mode, the module is activated and the I/O pins assume the CAN bus functions. The module transmits and receives CAN bus messages via the CxTX and CxRX pins. 17.3.4 LISTEN ONLY MODE If the Listen Only mode is activated, the module on the CAN bus is passive. The transmitter buffers revert to the port I/O function. The receive pins remain inputs. For the receiver, no error flags or Acknowledge signals are sent. The error counters are deactivated in this state. The Listen Only mode can be used for detecting the baud rate on the CAN bus. To use this, it is necessary that there are at least two further nodes that communicate with each other. 17.3.5 LISTEN ALL MESSAGES MODE The module can be set to ignore all errors and receive any message. The Listen All Messages mode is activated by setting the REQOP<2:0> bits to ‘111’. In this mode, the data which is in the message assembly buffer until the time an error occurred, is copied in the receive buffer and can be read via the CPU interface. 17.3.6 LOOPBACK MODE If the Loopback mode is activated, the module connects the internal transmit signal to the internal receive signal at the module boundary. The transmit and receive pins revert to their port I/O function. DS70116G-page 109 dsPIC30F5011/5013 17.4 17.4.1 Message Reception RECEIVE BUFFERS The CAN bus module has 3 receive buffers. However, one of the receive buffers is always committed to monitoring the bus for incoming messages. This buffer is called the Message Assembly Buffer (MAB). There are 2 receive buffers visible, RXB0 and RXB1, that can essentially instantaneously receive a complete message from the protocol engine. All messages are assembled by the MAB and are transferred to the RXBn buffers only if the acceptance filter criterion are met. When a message is received, the RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This bit can only be set by the module when a message is received. The bit is cleared by the CPU when it has completed processing the message in the buffer. If the RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt will be generated when a message is received. RXF0 and RXF1 filters with RXM0 mask are associated with RXB0. The filters RXF2, RXF3, RXF4, and RXF5 and the mask RXM1 are associated with RXB1. 17.4.2 MESSAGE ACCEPTANCE FILTERS 17.4.4 RECEIVE OVERRUN An overrun condition occurs when the MAB has assembled a valid received message, the message is accepted through the acceptance filters and when the receive buffer associated with the filter has not been designated as clear of the previous message. The overrun error flag, RXnOVR (CiINTF<15> or CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be set and the message in the MAB will be discarded. If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended for RXB0 will not be diverted into RXB1 if RXB0 contains an unread message and the RX0OVR bit will be set. If the DBEN bit is set, the overrun for RXB0 is handled differently. If a valid message is received for RXB0 and RXFUL = 1 indicates that RXB0 is full and RXFUL = 0 indicates that RXB1 is empty, the message for RXB0 will be loaded into RXB1. An overrun error will not be generated for RXB0. If a valid message is received for RXB0 and RXFUL = 1, indicating that both RXB0 and RXB1 are full, the message will be lost and an overrun will be indicated for RXB1. The message acceptance filters and masks are used to determine if a message in the message assembly buffer should be loaded into either of the receive buffers. Once a valid message has been received into the MAB, the identifier fields of the message are compared to the filter values. If there is a match, that message will be loaded into the appropriate receive buffer. 17.4.5 The acceptance filter looks at incoming messages for the RXIDE bit (CiRXnSID<0>) to determine how to compare the identifiers. If the RXIDE bit is clear, the message is a standard frame and only filters with the EXIDE bit (CiRXFnSID<0>) clear are compared. If the RXIDE bit is set, the message is an extended frame, and only filters with the EXIDE bit set are compared. Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can override the EXIDE bit. These receive errors do not generate an interrupt. However, the receive error counter is incremented by one in case one of these errors occur. The RXWAR bit (CiINTF<9>) indicates that the receive error counter has reached the CPU warning limit of 96 and an interrupt is generated. 17.4.3 MESSAGE ACCEPTANCE FILTER MASKS The mask bits essentially determine which bits to apply the filter to. If any mask bit is set to a zero, then that bit will automatically be accepted regardless of the filter bit. There are 2 programmable acceptance filter masks associated with the receive buffers, one for each buffer. RECEIVE ERRORS The CAN module will detect the following receive errors: • Cyclic Redundancy Check (CRC) Error • Bit Stuffing Error • Invalid Message Receive Error 17.4.6 RECEIVE INTERRUPTS Receive interrupts can be divided into 3 major groups, each including various conditions that generate interrupts: • Receive Interrupt: A message has been successfully received and loaded into one of the receive buffers. This interrupt is activated immediately after receiving the End-of-Frame (EOF) field. Reading the RXnIF flag will indicate which receive buffer caused the interrupt. • Wake-up Interrupt: The CAN module has woken up from Disable mode or the device has woken up from Sleep mode. DS70116G-page 110 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 • Receive Error Interrupts: A receive error interrupt will be indicated by the ERRIF bit. This bit shows that an error condition occurred. The source of the error can be determined by checking the bits in the CAN Interrupt Status register, CiINTF. - Invalid Message Received: If any type of error occurred during reception of the last message, an error will be indicated by the IVRIF bit. - Receiver Overrun: The RXnOVR bit indicates that an overrun condition occurred. - Receiver Warning: The RXWAR bit indicates that the receive error counter (RERRCNT<7:0>) has reached the warning limit of 96. - Receiver Error Passive: The RXEP bit indicates that the receive error counter has exceeded the error passive limit of 127 and the module has gone into error passive state. 17.5 17.5.1 Message Transmission TRANSMIT BUFFERS The CAN module has three transmit buffers. Each of the three buffers occupies 14 bytes of data. Eight of the bytes are the maximum 8 bytes of the transmitted message. Five bytes hold the standard and extended identifiers and other message arbitration information. 17.5.2 TRANSMIT MESSAGE PRIORITY Transmit priority is a prioritization within each node of the pending transmittable messages. There are 4 levels of transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>, where n = 0, 1 or 2 represents a particular transmit buffer) for a particular message buffer is set to ‘11’, that buffer has the highest priority. If TXPRI<1:0> for a particular message buffer is set to ‘10’ or ‘01’, that buffer has an intermediate priority. If TXPRI<1:0> for a particular message buffer is ‘00’, that buffer has the lowest priority. 17.5.3 Setting TXREQ bit simply flags a message buffer as enqueued for transmission. When the module detects an available bus, it begins transmitting the message which has been determined to have the highest priority. If the transmission completes successfully on the first attempt, the TXREQ bit is cleared automatically, and an interrupt is generated if TXIE was set. If the message transmission fails, one of the error condition flags will be set, and the TXREQ bit will remain set indicating that the message is still pending for transmission. If the message encountered an error condition during the transmission attempt, the TXERR bit will be set, and the error condition may cause an interrupt. If the message loses arbitration during the transmission attempt, the TXLARB bit is set. No interrupt is generated to signal the loss of arbitration. 17.5.4 ABORTING MESSAGE TRANSMISSION The system can also abort a message by clearing the TXREQ bit associated with each message buffer. Setting the ABAT bit (CiCTRL<12>) will request an abort of all pending messages. If the message has not yet started transmission, or if the message started but is interrupted by loss of arbitration or an error, the abort will be processed. The abort is indicated when the module sets the TXABT bit and the TXnIF flag is not automatically set. 17.5.5 TRANSMISSION ERRORS The CAN module will detect the following transmission errors: • Acknowledge Error • Form Error • Bit Error These transmission errors will not necessarily generate an interrupt but are indicated by the transmission error counter. However, each of these errors will cause the transmission error counter to be incremented by one. Once the value of the error counter exceeds the value of 96, the ERRIF (CiINTF<5>) and the TXWAR bit (CiINTF<10>) are set. Once the value of the error counter exceeds the value of 96, an interrupt is generated and the TXWAR bit in the Error Flag register is set. TRANSMISSION SEQUENCE To initiate transmission of the message, the TXREQ bit (CiTXnCON<3>) must be set. The CAN bus module resolves any timing conflicts between setting of the TXREQ bit and the Start-of-Frame (SOF), ensuring that if the priority was changed, it is resolved correctly before the SOF occurs. When TXREQ is set, the TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR (CiTXnCON<4>) flag bits are automatically cleared. © 2007 Microchip Technology Inc. DS70116G-page 111 dsPIC30F5011/5013 17.5.6 TRANSMIT INTERRUPTS 17.6 Baud Rate Setting Transmit interrupts can be divided into 2 major groups, each including various conditions that generate interrupts: All nodes on any particular CAN bus must have the same nominal bit rate. In order to set the baud rate, the following parameters have to be initialized: • Transmit Interrupt: At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message for transmission. Reading the TXnIF flags will indicate which transmit buffer is available and caused the interrupt. • • • • • • • Transmit Error Interrupts: A transmission error interrupt will be indicated by the ERRIF flag. This flag shows that an error condition occurred. The source of the error can be determined by checking the error flags in the CAN Interrupt Status register, CiINTF. The flags in this register are related to receive and transmit errors. - Transmitter Warning Interrupt: The TXWAR bit indicates that the transmit error counter has reached the CPU warning limit of 96. - Transmitter Error Passive: The TXEP bit (CiINTF<12>) indicates that the transmit error counter has exceeded the error passive limit of 127 and the module has gone to error passive state. - Bus Off: The TXBO bit (CiINTF<13>) indicates that the transmit error counter has exceeded 255 and the module has gone to the bus off state. FIGURE 17-2: Synchronization Jump Width Baud Rate Prescaler Phase Segments Length determination of Phase Segment 2 Sample Point Propagation Segment bits 17.6.1 BIT TIMING All controllers on the CAN bus must have the same baud rate and bit length. However, different controllers are not required to have the same master oscillator clock. At different clock frequencies of the individual controllers, the baud rate has to be adjusted by adjusting the number of time quanta in each segment. The nominal bit time can be thought of as being divided into separate non-overlapping time segments. These segments are shown in Figure 17-2. • • • • Synchronization Segment (Sync Seg) Propagation Time Segment (Prop Seg) Phase Segment 1 (Phase1 Seg) Phase Segment 2 (Phase2 Seg) The time segments and also the nominal bit time are made up of integer units of time called time quanta or TQ. By definition, the nominal bit time has a minimum of 8 TQ and a maximum of 25 TQ. Also, by definition, the minimum nominal bit time is 1 μsec corresponding to a maximum bit rate of 1 MHz. CAN BIT TIMING Input Signal Sync Prop Segment Phase Segment 1 Phase Segment 2 Sync Sample Point TQ DS70116G-page 112 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 17.6.2 PRESCALER SETTING There is a programmable prescaler with integral values ranging from 1 to 64, in addition to a fixed divide-by-2 for clock generation. The time quantum (TQ) is a fixed unit of time derived from the oscillator period, and is given by Equation 17-1, where FCAN is FCY (if the CANCKS bit is set) or 4FCY (if CANCKS is clear). Note: FCAN must not exceed 30 MHz. If CANCKS = 0, then FCY must not exceed 7.5 MHz. EQUATION 17-1: TIME QUANTUM FOR CLOCK GENERATION TQ = 2 (BRP<5:0> + 1) / FCAN 17.6.3 PROPAGATION SEGMENT This part of the bit time is used to compensate physical delay times within the network. These delay times consist of the signal propagation time on the bus line and the internal delay time of the nodes. The Prop Seg can be programmed from 1 TQ to 8 TQ by setting the PRSEG<2:0> bits (CiCFG2<2:0>). 17.6.4 PHASE SEGMENTS The phase segments are used to optimally locate the sampling of the received bit within the transmitted bit time. The sampling point is between Phase1 Seg and Phase2 Seg. These segments are lengthened or shortened by resynchronization. The end of the Phase1 Seg determines the sampling point within a bit period. The segment is programmable from 1 TQ to 8 TQ. Phase2 Seg provides delay to the next transmitted data transition. The segment is programmable from 1 TQ to 8 TQ, or it may be defined to be equal to the greater of Phase1 Seg or the information processing time (2 TQ). The Phase1 Seg is initialized by setting bits SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is initialized by setting SEG2PH<2:0> (CiCFG2<10:8>). The following requirement must be fulfilled while setting the lengths of the phase segments: Prop Seg + Phase1 Seg > = Phase2 Seg 17.6.5 SAMPLE POINT The sample point is the point of time at which the bus level is read and interpreted as the value of that respective bit. The location is at the end of Phase1 Seg. If the bit timing is slow and contains many TQ, it is possible to specify multiple sampling of the bus line at the sample point. The level determined by the CAN bus then corresponds to the result from the majority decision of three values. The majority samples are taken at the sample point and twice before with a distance of TQ/2. The CAN module allows the user to choose between sampling three times at the same point or once at the same point, by setting or clearing the SAM bit (CiCFG2<6>). Typically, the sampling of the bit should take place at about 60-70% through the bit time, depending on the system parameters. 17.6.6 SYNCHRONIZATION To compensate for phase shifts between the oscillator frequencies of the different bus stations, each CAN controller must be able to synchronize to the relevant signal edge of the incoming signal. When an edge in the transmitted data is detected, the logic will compare the location of the edge to the expected time (Synchronous Segment). The circuit will then adjust the values of Phase1 Seg and Phase2 Seg. There are 2 mechanisms used to synchronize. 17.6.6.1 Hard Synchronization Hard synchronization is only done whenever there is a ‘recessive’ to ‘dominant’ edge during bus Idle indicating the start of a message. After hard synchronization, the bit time counters are restarted with the Sync Seg. Hard synchronization forces the edge which has caused the hard synchronization to lie within the synchronization segment of the restarted bit time. If a hard synchronization is done, there will not be a resynchronization within that bit time. 17.6.6.2 Resynchronization As a result of resynchronization, Phase1 Seg may be lengthened or Phase2 Seg may be shortened. The amount of lengthening or shortening of the phase buffer segment has an upper bound known as the synchronization jump width, and is specified by the SJW<1:0> bits (CiCFG1<7:6>). The value of the synchronization jump width will be added to Phase1 Seg or subtracted from Phase2 Seg. The resynchronization jump width is programmable between 1 TQ and 4 TQ. The following requirement must be fulfilled while setting the SJW<1:0> bits: Phase2 Seg > Synchronization Jump Width © 2007 Microchip Technology Inc. DS70116G-page 113 CAN1 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 C1RXF0SID 0300 — — — Bit 12 Bit 11 Bit 10 C1RXF0EIDH 0302 — — — C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier <5:0> C1RXF1SID — 0308 — — — — — — C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier <5:0> Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 0310 — — — — — — C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier <5:0> C1RXF3SID — — — — — — — — Bit 0 — — — — — — — — — 0318 — — — C1RXF3EIDH 031A — — — C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — 0000 uuuu uuuu uuuu — — — — — — EXIDE 000u uuuu uuuu uu0u — — — C1RXF4SID 0320 — — — C1RXF4EIDH 0322 — — — C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier <5:0> C1RXF5SID — — — — — — 0000 uuuu uuuu uuuu — Receive Acceptance Filter 4 Standard Identifier <10:0> — — — — 0328 — — — C1RXF5EIDH 032A — — — C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier <5:0> C1RXM0SID — — — — — — 0000 uuuu uuuu uuuu — Receive Acceptance Filter 5 Standard Identifier <10:0> — — — — 0330 — — — C1RXM0EIDH 0332 — — — C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier <5:0> C1RXM1SID — — — — — — 0000 uuuu uuuu uuuu — Receive Acceptance Mask 0 Standard Identifier <10:0> — — — uuuu uu00 0000 0000 — MIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — MIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 Receive Acceptance Mask 0 Extended Identifier <17:6> 0338 — — — C1RXM1EIDH 033A — — — C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — 0000 uuuu uuuu uuuu — Receive Acceptance Mask 1 Standard Identifier <10:0> — Receive Acceptance Mask 1 Extended Identifier <17:6> Transmit Buffer 2 Standard Identifier <10:6> — © 2007 Microchip Technology Inc. — — — — — — — — TXRTR TXRB1 — — — — — 0000 uuuu uuuu uuuu — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu Transmit Buffer 2 Extended Identifier <13:6> C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier <5:0> 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 C1TX2CON 034E — C1TX1SID 0350 Transmit Buffer 1 Standard Identifier <10:6> C1TX1EID 0352 C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier <5:0> C1TX1B1 0356 Transmit Buffer 1 Byte 1 Legend: — — Transmit Buffer 1 Extended Identifier <17:14> u = uninitialized bit — — — — — — — — — — — TXRTR TXRB1 — DLC<3:0> uuuu 0000 uuuu uuuu C1TX2B1 — TXRB0 uuuu uu00 0000 0000 EXIDE 000u uuuu uuuu uu0u Receive Acceptance Filter 5 Extended Identifier <17:6> — uuuu uu00 0000 0000 EXIDE 000u uuuu uuuu uu0u Receive Acceptance Filter 4 Extended Identifier <17:6> — uuuu uu00 0000 0000 EXIDE 000u uuuu uuuu uu0u Receive Acceptance Filter 3 Extended Identifier <17:6> — uuuu uu00 0000 0000 0000 uuuu uuuu uuuu — Receive Acceptance Filter 3 Standard Identifier <10:0> — uuuu uu00 0000 0000 EXIDE 000u uuuu uuuu uu0u Receive Acceptance Filter 2 Extended Identifier <17:6> — Reset State EXIDE 000u uuuu uuuu uu0u 0000 uuuu uuuu uuuu — Receive Acceptance Filter 2 Standard Identifier <10:0> — Transmit Buffer 2 Extended Identifier <17:14> Bit 1 Receive Acceptance Filter 1 Extended Identifier <17:6> 0312 0342 Bit 7 Receive Acceptance Filter 1 Standard Identifier <10:0> C1RXF2SID 0340 — — C1RXF2EIDH C1TX2EID Bit 8 Receive Acceptance Filter 0 Extended Identifier <17:6> C1RXF1EIDH 030A C1TX2SID Bit 9 Receive Acceptance Filter 0 Standard Identifier <10:0> TXABT TXLARB TXERR — TXREQ — — uuuu uuuu uuuu uuuu — Transmit Buffer 1 Standard Identifier <5:0> TXPRI<1:0> SRR DLC<3:0> Transmit Buffer 1 Byte 0 — 0000 0000 0000 0000 TXIDE uuuu u000 uuuu uuuu Transmit Buffer 1 Extended Identifier <13:6> TXRB0 uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu — — uuuu uuuu uuuu u000 uuuu uuuu uuuu uuuu dsPIC30F5011/5013 DS70116G-page 114 TABLE 17-1: © 2007 Microchip Technology Inc. TABLE 17-1: SFR Name Addr. CAN1 REGISTER MAP (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 C1TX1CON 035E — C1TX0SID 0360 Transmit Buffer 0 Standard Identifier <10:6> C1TX0EID 0362 — — — Transmit Buffer 0 Extended Identifier <17:14> — — — — — — — — — — — TXRTR TXRB1 — TXABT TXLARB TXERR uuuu uuuu uuuu uuuu TXREQ — TXPRI<1:0> Transmit Buffer 0 Standard Identifier <5:0> SRR Transmit Buffer 0 Extended Identifier <13:6> C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier <5:0> 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 C1TX0CON 036E — — — C1RX1SID 0370 — — — — — — — — — — — DLC<3:0> uuuu 0000 uuuu uuuu C1TX0B1 — TXRB0 0000 0000 0000 0000 TXIDE uuuu u000 uuuu uuuu — TXABT TXLARB TXERR — uuuu uuuu uuuu u000 uuuu uuuu uuuu uuuu TXREQ — TXPRI<1:0> Receive Buffer 1 Standard Identifier <10:0> — — SRR 0000 0000 0000 0000 RXIDE 000u uuuu uuuu uuuu Receive Buffer 1 Extended Identifier <17:6> C1RX1EID 0372 C1RX1DLC 0374 Receive Buffer 1 Extended Identifier <5:0> C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 C1RX1CON 037E — — — C1RX0SID 0380 — — — — — — — — — — — — RXFUL — — 0000 uuuu uuuu uuuu RXRB0 — — DLC<3:0> uuuu uuuu uuuu uuuu RXRTRRO FILHIT<2:0> Receive Buffer 0 Standard Identifier <10:0> — uuuu uuuu 000u uuuu SRR 0000 0000 0000 0000 RXIDE 000u uuuu uuuu uuuu Receive Buffer 0 Extended Identifier <17:6> C1RX0EID 0382 C1RX0DLC 0384 Receive Buffer 0 Extended Identifier <5:0> C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu C1RX0CON 038E — — — — — RXRTR RXRB1 — — — — RXFUL — — 0000 uuuu uuuu uuuu RXRB0 — — uuuu uuuu 000u uuuu RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000 DS70116G-page 115 C1CTRL 0390 CANCAP — CSIDLE ABAT CANCKS 0392 — — — — — C1CFG2 0394 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000 C1INTE 0398 — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000 C1EC 039A — — — — OPMODE<2:0> DLC<3:0> C1CFG1 Legend: REQOP<2:0> — — — — ICODE<2:0> SJW<1:0> — BRP<5:0> SEG1PH<2:0> Transmit Error Count Register u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. 0000 0000 0000 0000 PRSEG<2:0> Receive Error Count Register 0000 0100 1000 0000 0u00 0uuu uuuu uuuu 0000 0000 0000 0000 dsPIC30F5011/5013 — RXRTR RXRB1 SFR Name CAN2 REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 C2RXF0SID 03C0 — — — C2RXF0EIDH 03C2 — — — C2RXF0EIDL 03C4 C2RXF1SID 03C8 — — — C2RXF1EIDH 03CA — — — C2RXF1EIDL 03CC C2RXF2SID 03D0 — — — C2RXF2EIDH 03D2 — — — C2RXF2EIDL 03D4 Bit 12 Bit 11 Bit 10 03D8 03DA — — — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 — — — — — — Bit 1 Bit 0 Reset State — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — EXIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — MIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 — MIDE 000u uuuu uuuu uu0u — — uuuu uu00 0000 0000 SRR TXIDE uuuu u000 uuuu uuuu 0000 uuuu uuuu uuuu — — Receive Acceptance Filter 1 Standard Identifier <10:0> — Receive Acceptance Filter 1 Extended Identifier <17:6> — — — — — — 0000 uuuu uuuu uuuu — — Receive Acceptance Filter 2 Standard Identifier <10:0> — Receive Acceptance Filter 2 Extended Identifier <17:6> Receive Acceptance Filter 2 Extended Identifier <5:0> — Bit 7 Receive Acceptance Filter 0 Extended Identifier <17:6> Receive Acceptance Filter 1 Extended Identifier <5:0> — Bit 8 Receive Acceptance Filter 0 Standard Identifier <10:0> — Receive Acceptance Filter 0 Extended Identifier <5:0> — Bit 9 — — — — — — 0000 uuuu uuuu uuuu — — Receive Acceptance Filter 3 Standard Identifier <10:0> © 2007 Microchip Technology Inc. C2RXF3SID C2RXF3EIDH C2RXF3EIDL 03DC C2RXF4SID 03E0 — — — C2RXF4EIDH 03E2 — — — C2RXF4EIDL 03E4 C2RXF5SID 03E8 — — — C2RXF5EIDH 03EA — — — C2RXF5EIDL 03EC C2RXM0SID 03F0 — — — C2RXM0EIDH 03F2 — — — C2RXM0EIDL 03F4 C2RXM1SID 03F8 — — — C2RXM1EIDH 03FA — — — C2RXM1EIDL 03FC Receive Acceptance Mask 1 Extended Identifier <5:0> C2TX2SID 0400 Transmit Buffer 2 Standard Identifier <10:6> C2TX2EID 0402 C2TX2DLC 0404 C2TX2B1 0406 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu C2TX2B2 0408 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu C2TX2B3 040A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu C2TX2B4 040C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 C2TX2CON 040E C2TX1SID 0410 C2TX1EID 0412 C2TX1DLC Legend: — Receive Acceptance Filter 3 Extended Identifier <17:6> Receive Acceptance Filter 3 Extended Identifier <5:0> — — — 0000 uuuu uuuu uuuu — — — — — — — 0000 uuuu uuuu uuuu — — Receive Acceptance Filter 5 Extended Identifier <17:6> — — — — — — 0000 uuuu uuuu uuuu — — Receive Acceptance Mask 0 Standard Identifier <10:0> — Receive Acceptance Mask 0 Extended Identifier <17:6> — — — — — — 0000 uuuu uuuu uuuu — — Receive Acceptance Mask 1 Standard Identifier <10:0> — Receive Acceptance Mask 1 Extended Identifier <17:6> — — — — — — — — — TXRTR TXRB1 Transmit Buffer 2 Extended Identifier <5:0> — — Transmit Buffer 1 Standard Identifier <10:6> Transmit Buffer 1 Extended Identifier <17:14> 0414 — — Transmit Buffer 2 Extended Identifier <17:14> u = uninitialized bit — Receive Acceptance Filter 5 Standard Identifier <10:0> Receive Acceptance Mask 0 Extended Identifier <5:0> — — Receive Acceptance Filter 4 Extended Identifier <17:6> Receive Acceptance Filter 5 Extended Identifier <5:0> — — Receive Acceptance Filter 4 Standard Identifier <10:0> Receive Acceptance Filter 4 Extended Identifier <5:0> — — — Transmit Buffer 1 Extended Identifier <5:0> — — — — — — — — — TXRTR TXRB1 — — — — 0000 uuuu uuuu uuuu — — Transmit Buffer 2 Standard Identifier <5:0> Transmit Buffer 2 Extended Identifier <13:6> TXRB0 — DLC<3:0> TXABT TXLARB TXERR — TXREQ uuuu 0000 uuuu uuuu — — uuuu uuuu uuuu uuuu — Transmit Buffer 1 Standard Identifier <5:0> TXPRI<1:0> SRR TXIDE Transmit Buffer 1 Extended Identifier <13:6> TXRB0 DLC<3:0> uuuu uuuu uuuu u000 — 0000 0000 0000 0000 uuuu u000 uuuu uuuu uuuu 0000 uuuu uuuu — — uuuu uuuu uuuu u000 dsPIC30F5011/5013 DS70116G-page 116 TABLE 17-2: © 2007 Microchip Technology Inc. TABLE 17-2: SFR Name C2TX1B1 Addr. CAN2 REGISTER MAP (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0416 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu C2TX1B2 0418 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu C2TX1B3 041A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu C2TX1B4 041C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 C2TX1CON 041E C2TX0SID 0420 C2TX0EID 0422 C2TX0DLC 0424 C2TX0B1 0426 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu C2TX0B2 0428 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu C2TX0B3 042A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu C2TX0B4 042C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 C2TX0CON 042E — — — — — — — — Transmit Buffer 0 Standard Identifier <10:6> Transmit Buffer 0 Extended Identifier <17:14> — — — — — — — — — — TXRTR TXRB1 Transmit Buffer 0 Extended Identifier <5:0> — — — — — — TXABT TXLARB TXERR uuuu uuuu uuuu uuuu TXREQ — TXPRI<1:0> Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE Transmit Buffer 0 Extended Identifier <13:6> TXRB0 — DLC<3:0> TXABT TXLARB TXERR 0000 0000 0000 0000 uuuu u000 uuuu uuuu uuuu 0000 uuuu uuuu — — — uuuu uuuu uuuu u000 uuuu uuuu uuuu uuuu TXREQ — TXPRI<1:0> Receive Buffer 1 Standard Identifier <10:0> C2RX1SID 0430 — — — C2RX1EID 0432 — — — C2RX1DLC 0434 C2RX1B1 0436 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu C2RX1B2 0438 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu C2RX1B3 043A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu C2RX1B4 043C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 C2RX1CON 043E — — — C2RX0SID 0440 — — — C2RX0EID 0442 — — — C2RX0DLC 0444 C2RX0B1 0446 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu C2RX0B2 0448 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu C2RX0B3 044A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu C2RX0B4 044C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 C2RX0CON 044E — — — — — C2CTRL 0450 CANCAP — CSIDLE ABAT CANCKS — RXRTR — — — — — RXFUL — — 0000 uuuu uuuu uuuu RXRB0 — — DLC<3:0> uuuu uuuu 000u uuuu uuuu uuuu uuuu uuuu RXRTRRO FILHIT<2:0> SRR 0000 0000 0000 0000 RXIDE Receive Buffer 0 Extended Identifier <17:6> Receive Buffer 0 Extended Identifier <5:0> RXRTR — RXRB1 — — — DS70116G-page 117 0452 — — — — — — WAKFIL — — — — — C2INTF 0456 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR C2INTE 0458 — — — — — — — — RXFUL REQOP<2:0> 0454 045A — Receive Buffer 0 Standard Identifier <10:0> C2CFG1 C2EC RXRB1 — — OPMODE<2:0> — SEG2PH<2:0> — 000u uuuu uuuu uuuu 0000 uuuu uuuu uuuu RXRB0 — 000u uuuu uuuu uuuu DLC<3:0> uuuu uuuu uuuu uuuu RXRTRRO DBEN — uuuu uuuu 000u uuuu JTOFF FILHIT0 0000 0000 0000 0000 — 0000 0100 1000 0000 ICODE<2:0> SJW<1:0> BRP<5:0> SEG1PH<2:0> 0000 0000 0000 0000 SEG2PHTS SAM EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000 — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000 Transmit Error Count Register u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. Receive Error Count Register PRSEG<2:0> 0u00 0uuu uuuu uuuu 0000 0000 0000 0000 dsPIC30F5011/5013 — C2CFG2 Legend: RXIDE Receive Buffer 1 Extended Identifier <17:6> Receive Buffer 1 Extended Identifier <5:0> — SRR 0000 0000 0000 0000 dsPIC30F5011/5013 NOTES: DS70116G-page 118 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 18.0 DATA CONVERTER INTERFACE (DCI) MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). 18.1 Module Introduction The dsPIC30F Data Converter Interface (DCI) module allows simple interfacing of devices, such as audio coder/decoders (codecs), A/D converters and D/A converters. The following interfaces are supported: • Framed Synchronous Serial Transfer (Single or Multi-Channel) • Inter-IC Sound (I2S) Interface • AC-Link Compliant mode The DCI module provides the following general features: • Programmable word size up to 16 bits • Support for up to 16 time slots, for a maximum frame size of 256 bits • Data buffering for up to 4 samples without CPU overhead 18.2 Module I/O Pins 18.2.3 CSDI PIN The serial data input (CSDI) pin is configured as an input only pin when the module is enabled. 18.2.3.1 COFS PIN The codec frame synchronization (COFS) pin is used to synchronize data transfers that occur on the CSDO and CSDI pins. The COFS pin may be configured as an input or an output. The data direction for the COFS pin is determined by the COFSD control bit in the DCICON1 register. The DCI module accesses the shadow registers while the CPU is in the process of accessing the memory mapped buffer registers. 18.2.4 BUFFER DATA ALIGNMENT Data values are always stored left justified in the buffers since most codec data is represented as a signed 2’s complement fractional number. If the received word length is less than 16 bits, the unused LSbs in the receive buffer registers are set to ‘0’ by the module. If the transmitted word length is less than 16 bits, the unused LSbs in the transmit buffer register are ignored by the module. The word length setup is described in subsequent sections of this document. 18.2.5 TRANSMIT/RECEIVE SHIFT REGISTER There are four I/O pins associated with the module. When enabled, the module controls the data direction of each of the four pins. The DCI module has a 16-bit shift register for shifting serial data in and out of the module. Data is shifted in/ out of the shift register MSb first, since audio PCM data is transmitted in signed 2’s complement format. 18.2.1 18.2.6 CSCK PIN The CSCK pin provides the serial clock for the DCI module. The CSCK pin may be configured as an input or output using the CSCKD control bit in the DCICON2 SFR. When configured as an output, the serial clock is provided by the dsPIC30F. When configured as an input, the serial clock must be provided by an external device. 18.2.2 CSDO PIN The serial data output (CSDO) pin is configured as an output only pin when the module is enabled. The CSDO pin drives the serial bus whenever data is to be transmitted. The CSDO pin is tri-stated or driven to ‘0’ during CSCK periods when data is not transmitted, depending on the state of the CSDOM control bit. This allows other devices to place data on the serial bus during transmission periods not used by the DCI module. © 2007 Microchip Technology Inc. DCI BUFFER CONTROL The DCI module contains a buffer control unit for transferring data between the shadow buffer memory and the serial shift register. The buffer control unit is a simple 2-bit address counter that points to word locations in the shadow buffer memory. For the receive memory space (high address portion of DCI buffer memory), the address counter is concatenated with a ‘0’ in the MSb location to form a 3-bit address. For the transmit memory space (high portion of DCI buffer memory), the address counter is concatenated with a ‘1’ in the MSb location. Note: The DCI buffer control unit always accesses the same relative location in the transmit and receive buffers, so only one address counter is provided. DS70116G-page 119 dsPIC30F5011/5013 FIGURE 18-1: DCI MODULE BLOCK DIAGRAM BCG Control bits SCKD FOSC/4 Sample Rate CSCK Generator FSD Word Size Selection bits Frame Length Selection bits 16-bit Data Bus DCI Mode Selection bits Frame Synchronization Generator COFS Receive Buffer Registers w/Shadow DCI Buffer Control Unit 15 Transmit Buffer Registers w/Shadow 0 DCI Shift Register CSDI CSDO DS70116G-page 120 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 18.3 18.3.1 DCI Module Operation MODULE ENABLE The DCI module is enabled or disabled by setting/ clearing the DCIEN control bit in the DCICON1 SFR. Clearing the DCIEN control bit has the effect of resetting the module. In particular, all counters associated with CSCK generation, frame sync and the DCI buffer control unit are Reset. 18.3.4 FRAME SYNC MODE CONTROL BITS The type of frame sync signal is selected using the Frame Synchronization mode control bits (COFSM<1:0>) in the DCICON1 SFR. The following operating modes can be selected: The DCI clocks are shutdown when the DCIEN bit is cleared. • • • • When enabled, the DCI controls the data direction for the four I/O pins associated with the module. The Port, LAT and TRIS register values for these I/O pins are overridden by the DCI module when the DCIEN bit is set. The operation of the COFSM control bits depends on whether the DCI module generates the frame sync signal as a master device, or receives the frame sync signal as a slave device. It is also possible to override the CSCK pin separately when the bit clock generator is enabled. This permits the bit clock generator to operate without enabling the rest of the DCI module. The master device in a DSP/codec pair is the device that generates the frame sync signal. The frame sync signal initiates data transfers on the CSDI and CSDO pins and usually has the same frequency as the data sample rate (COFS). 18.3.2 The DCI module is a frame sync master if the COFSD control bit is cleared and is a frame sync slave if the COFSD control bit is set. WORD SIZE SELECTION BITS The WS<3:0> word size selection bits in the DCICON2 SFR determine the number of bits in each DCI data word. Essentially, the WS<3:0> bits determine the counting period for a 4-bit counter clocked from the CSCK signal. Any data length, up to 16-bits, may be selected. The value loaded into the WS<3:0> bits is one less the desired word length. For example, a 16-bit data word size is selected when WS<3:0> = 1111. Note: 18.3.3 These WS<3:0> control bits are used only in the Multi-Channel and I2S modes. These bits have no effect in AC-Link mode since the data slot sizes are fixed by the protocol. FRAME SYNC GENERATOR The frame sync generator (COFSG) is a 4-bit counter that sets the frame length in data words. The frame sync generator is incremented each time the word size counter is reset (refer to Section 18.3.2 “Word Size Selection Bits”). The period for the frame synchronization generator is set by writing the COFSG<3:0> control bits in the DCICON2 SFR. The COFSG period in clock cycles is determined by the following formula: EQUATION 18-1: COFSG PERIOD Frame Length = Word Length • (FSG Value + 1) Frame lengths, up to 16 data words, may be selected. The frame length in CSCK periods can vary up to a maximum of 256 depending on the word size that is selected. Note: Multi-Channel mode I2S mode AC-Link mode (16-bit) AC-Link mode (20-bit) 18.3.5 MASTER FRAME SYNC OPERATION When the DCI module is operating as a frame sync master device (COFSD = 0), the COFSM mode bits determine the type of frame sync pulse that is generated by the frame sync generator logic. A new COFS signal is generated when the frame sync generator resets to ‘0’. In the Multi-Channel mode, the frame sync pulse is driven high for the CSCK period to initiate a data transfer. The number of CSCK cycles between successive frame sync pulses will depend on the word size and frame sync generator control bits. A timing diagram for the frame sync signal in Multi-Channel mode is shown in Figure 18-2. In the AC-Link mode of operation, the frame sync signal has a fixed period and duty cycle. The AC-Link frame sync signal is high for 16 CSCK cycles and is low for 240 CSCK cycles. A timing diagram with the timing details at the start of an AC-Link frame is shown in Figure 18-3. In the I2S mode, a frame sync signal having a 50% duty cycle is generated. The period of the I2S frame sync signal in CSCK cycles is determined by the word size and frame sync generator control bits. A new I2S data transfer boundary is marked by a high-to-low or a low-to-high transition edge on the COFS pin. The COFSG control bits will have no effect in AC-Link mode since the frame length is set to 256 CSCK periods by the protocol. © 2007 Microchip Technology Inc. DS70116G-page 121 dsPIC30F5011/5013 18.3.6 SLAVE FRAME SYNC OPERATION When the DCI module is operating as a frame sync slave (COFSD = 1), data transfers are controlled by the codec device attached to the DCI module. The COFSM control bits control how the DCI module responds to incoming COFS signals. In the Multi-Channel mode, a new data frame transfer will begin one CSCK cycle after the COFS pin is sampled high (see Figure 18-2). The pulse on the COFS pin resets the frame sync generator logic. FIGURE 18-2: In the I2S mode, a new data word will be transferred one CSCK cycle after a low-to-high or a high-to-low transition is sampled on the COFS pin. A rising or falling edge on the COFS pin resets the frame sync generator logic. In the AC-Link mode, the tag slot and subsequent data slots for the next frame will be transferred one CSCK cycle after the COFS pin is sampled high. The COFSG and WS bits must be configured to provide the proper frame length when the module is operating in the Slave mode. Once a valid frame sync pulse has been sampled by the module on the COFS pin, an entire data frame transfer will take place. The module will not respond to further frame sync pulses until the data frame transfer has completed. FRAME SYNC TIMING, MULTI-CHANNEL MODE CSCK COFS CSDI/CSDO FIGURE 18-3: MSB LSB FRAME SYNC TIMING, AC-LINK START-OF-FRAME BIT_CLK CSDO or CSDI S12 S12 S12 Tag Tag Tag bit 2 bit 1 LSb MSb bit 14 bit 13 SYNC FIGURE 18-4: I2S INTERFACE FRAME SYNC TIMING CSCK CSDI or CSDO MSB LSB MSB LSB WS Note: A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length – this will be system dependent. DS70116G-page 122 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 18.3.7 BIT CLOCK GENERATOR EQUATION 18-2: The DCI module has a dedicated 12-bit time base that produces the bit clock. The bit clock rate (period) is set by writing a non-zero 12-bit value to the BCG<11:0> control bits in the DCICON3 SFR. When the BCG<11:0> bits are set to zero, the bit clock will be disabled. If the BCG<11:0> bits are set to a nonzero value, the bit clock generator is enabled. These bits should be set to ‘0’ and the CSCKD bit set to ‘1’ if the serial clock for the DCI is received from an external device. The formula for the bit clock frequency is given in Equation 18-2. TABLE 18-1: FBCK = BIT CLOCK FREQUENCY FCY 2 • (BCG + 1) The required bit clock frequency will be determined by the system sampling rate and frame size. Typical bit clock frequencies range from 16x to 512x the converter sample rate depending on the data converter and the communication protocol that is used. To achieve bit clock frequencies associated with common audio sampling rates, the user will need to select a crystal frequency that has an ‘even’ binary value. Examples of such crystal frequencies are listed in Table 18-1. DEVICE FREQUENCIES FOR COMMON CODEC CSCK FREQUENCIES FS (KHZ) FCSCK/FS FCSCK (MHZ)(1) FOSC (MHZ) PLL FCYC (MIPS) BCG(2) 8 256 2.048 8.192 4 8.192 1 12 256 3.072 6.144 8 12.288 1 32 32 1,024 8.192 8 16.384 7 44.1 32 1.4112 5.6448 8 11.2896 3 48 64 3.072 6.144 16 24.576 3 Note 1: 2: When the CSCK signal is applied externally (CSCKD = 1), the external clock high and low times must meet the device timing requirements. When the CSCK signal is applied externally (CSCKD = 1), the BCG<11:0> bits have no effect on the operation of the DCI module. © 2007 Microchip Technology Inc. DS70116G-page 123 dsPIC30F5011/5013 18.3.8 SAMPLE CLOCK EDGE CONTROL BIT The sample clock edge (CSCKE) control bit determines the sampling edge for the CSCK signal. If the CSCK bit is cleared (default), data will be sampled on the falling edge of the CSCK signal. The AC-Link protocols and most Multi-Channel formats require that data be sampled on the falling edge of the CSCK signal. If the CSCK bit is set, data will be sampled on the rising edge of CSCK. The I2S protocol requires that data be sampled on the rising edge of the CSCK signal. 18.3.9 DATA JUSTIFICATION CONTROL BIT In most applications, the data transfer begins one CSCK cycle after the COFS signal is sampled active. This is the default configuration of the DCI module. An alternate data alignment can be selected by setting the DJST control bit in the DCICON1 SFR. When DJST = 1, data transfers will begin during the same CSCK cycle when the COFS signal is sampled active. 18.3.10 TRANSMIT SLOT ENABLE BITS The TSCON SFR has control bits that are used to enable up to 16 time slots for transmission. These control bits are the TSE<15:0> bits. The size of each time slot is determined by the WS<3:0> word size selection bits and can vary up to 16 bits. If a transmit time slot is enabled via one of the TSE bits (TSEx = 1), the contents of the current transmit shadow buffer location will be loaded into the CSDO Shift register and the DCI buffer control unit is incremented to point to the next location. During an unused transmit time slot, the CSDO pin will drive ‘0’s or will be tri-stated during all disabled time slots depending on the state of the CSDOM bit in the DCICON1 SFR. The data frame size in bits is determined by the chosen data word size and the number of data word elements in the frame. If the chosen frame size has less than 16 elements, the additional slot enable bits will have no effect. Each transmit data word is written to the 16-bit transmit buffer as left justified data. If the selected word size is less than 16 bits, then the LSbs of the transmit buffer memory will have no effect on the transmitted data. The user should write ‘0’s to the unused LSbs of each transmit buffer location. DS70116G-page 124 18.3.11 RECEIVE SLOT ENABLE BITS The RSCON SFR contains control bits that are used to enable up to 16 time slots for reception. These control bits are the RSE<15:0> bits. The size of each receive time slot is determined by the WS<3:0> word size selection bits and can vary from 1 to 16 bits. If a receive time slot is enabled via one of the RSE bits (RSEx = 1), the shift register contents will be written to the current DCI receive shadow buffer location and the buffer control unit will be incremented to point to the next buffer location. Data is not packed in the receive memory buffer locations if the selected word size is less than 16 bits. Each received slot data word is stored in a separate 16-bit buffer location. Data is always stored in a left justified format in the receive memory buffer. 18.3.12 SLOT ENABLE BITS OPERATION WITH FRAME SYNC The TSE and RSE control bits operate in concert with the DCI frame sync generator. In the Master mode, a COFS signal is generated whenever the frame sync generator is reset. In the Slave mode, the frame sync generator is reset whenever a COFS pulse is received. The TSE and RSE control bits allow up to 16 consecutive time slots to be enabled for transmit or receive. After the last enabled time slot has been transmitted/ received, the DCI will stop buffering data until the next occurring COFS pulse. 18.3.13 SYNCHRONOUS DATA TRANSFERS The DCI buffer control unit will be incremented by one word location whenever a given time slot has been enabled for transmission or reception. In most cases, data input and output transfers will be synchronized, which means that a data sample is received for a given channel at the same time a data sample is transmitted. Therefore, the transmit and receive buffers will be filled with equal amounts of data when a DCI interrupt is generated. In some cases, the amount of data transmitted and received during a data frame may not be equal. As an example, assume a two-word data frame is used. Furthermore, assume that data is only received during slot #0 but is transmitted during slot #0 and slot #1. In this case, the buffer control unit counter would be incremented twice during a data frame but only one receive register location would be filled with data. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 18.3.14 BUFFER LENGTH CONTROL The amount of data that is buffered between interrupts is determined by the buffer length (BLEN<1:0>) control bits in the DCICON1 SFR. The size of the transmit and receive buffers may be varied from 1 to 4 data words using the BLEN control bits. The BLEN control bits are compared to the current value of the DCI buffer control unit address counter. When the 2 LSbs of the DCI address counter match the BLEN<1:0> value, the buffer control unit will be reset to ‘0’. In addition, the contents of the receive shadow registers are transferred to the receive buffer registers and the contents of the transmit buffer registers are transferred to the transmit shadow registers. 18.3.15 BUFFER ALIGNMENT WITH DATA FRAMES 18.3.16 There are two transmit status bits in the DCISTAT SFR. The TMPTY bit is set when the contents of the transmit buffer registers are transferred to the transmit shadow registers. The TMPTY bit may be polled in software to determine when the transmit buffer registers may be written. The TMPTY bit is cleared automatically by the hardware when a write to one of the four transmit buffers occurs. The TUNF bit is read-only and indicates that a transmit underflow has occurred for at least one of the transmit buffer registers that is in use. The TUNF bit is set at the time the transmit buffer registers are transferred to the transmit shadow registers. The TUNF Status bit is cleared automatically when the buffer register that underflowed is written by the CPU. There is no direct coupling between the position of the AGU address pointer and the data frame boundaries. This means that there will be an implied assignment of each transmit and receive buffer that is a function of the BLEN control bits and the number of enabled data slots via the TSE and RSE control bits. Note: As an example, assume that a 4-word data frame is chosen and that we want to transmit on all four time slots in the frame. This configuration would be established by setting the TSE0, TSE1, TSE2 and TSE3 control bits in the TSCON SFR. With this module setup, the TXBUF0 register would be naturally assigned to slot #0, the TXBUF1 register would be naturally assigned to slot #1, and so on. 18.3.17 Note: When more than four time slots are active within a data frame, the user code must keep track of which time slots are to be read/written at each interrupt. In some cases, the alignment between transmit/ receive buffers and their respective slot assignments could be lost. Examples of such cases include an emulation breakpoint or a hardware trap. In these situations, the user should poll the SLOT status bits to determine what data should be loaded into the buffer registers to resynchronize the software with the DCI module. © 2007 Microchip Technology Inc. TRANSMIT STATUS BITS The transmit status bits only indicate status for buffer locations that are used by the module. If the buffer length is set to less than four words, for example, the unused buffer locations will not affect the transmit status bits. RECEIVE STATUS BITS There are two receive status bits in the DCISTAT SFR. The RFUL Status bit is read-only and indicates that new data is available in the receive buffers. The RFUL bit is cleared automatically when all receive buffers in use have been read by the CPU. The ROV Status bit is read-only and indicates that a receive overflow has occurred for at least one of the receive buffer locations. A receive overflow occurs when the buffer location is not read by the CPU before new data is transferred from the shadow registers. The ROV Status bit is cleared automatically when the buffer register that caused the overflow is read by the CPU. When a receive overflow occurs for a specific buffer location, the old contents of the buffer are overwritten. Note: The receive status bits only indicate status for buffer locations that are used by the module. If the buffer length is set to less than four words, for example, the unused buffer locations will not affect the transmit status bits. DS70116G-page 125 dsPIC30F5011/5013 18.3.18 SLOT STATUS BITS The SLOT<3:0> status bits in the DCISTAT SFR indicate the current active time slot. These bits will correspond to the value of the frame sync generator counter. The user may poll these status bits in software when a DCI interrupt occurs to determine what time slot data was last received and which time slot data should be loaded into the TXBUF registers. 18.3.19 CSDO MODE BIT The CSDOM control bit controls the behavior of the CSDO pin during unused transmit slots. A given transmit time slot is unused if it’s corresponding TSEx bit in the TSCON SFR is cleared. If the CSDOM bit is cleared (default), the CSDO pin will be low during unused time slot periods. This mode will be used when there are only two devices attached to the serial bus. If the CSDOM bit is set, the CSDO pin will be tri-stated during unused time slot periods. This mode allows multiple devices to share the same CSDO line in a multichannel application. Each device on the CSDO line is configured so that it will only transmit data during specific time slots. No two devices will transmit data during the same time slot. 18.3.20 DIGITAL LOOPBACK MODE Digital Loopback mode is enabled by setting the DLOOP control bit in the DCICON1 SFR. When the DLOOP bit is set, the module internally connects the CSDO signal to CSDI. The actual data input on the CSDI I/O pin will be ignored in Digital Loopback mode. 18.3.21 UNDERFLOW MODE CONTROL BIT When an underflow occurs, one of two actions may occur depending on the state of the Underflow mode (UNFM) control bit in the DCICON1 SFR. If the UNFM bit is cleared (default), the module will transmit ‘0’s on the CSDO pin during the active time slot for the buffer location. In this Operating mode, the codec device attached to the DCI module will simply be fed digital ‘silence’. If the UNFM control bit is set, the module will transmit the last data written to the buffer location. This Operating mode permits the user to send continuous data to the codec device without consuming CPU overhead. DS70116G-page 126 18.4 DCI Module Interrupts The frequency of DCI module interrupts is dependent on the BLEN<1:0> control bits in the DCICON2 SFR. An interrupt to the CPU is generated each time the set buffer length has been reached and a shadow register transfer takes place. A shadow register transfer is defined as the time when the previously written TXBUF values are transferred to the transmit shadow registers and new received values in the receive shadow registers are transferred into the RXBUF registers. 18.5 18.5.1 DCI Module Operation During CPU Sleep and Idle Modes DCI MODULE OPERATION DURING CPU SLEEP MODE The DCI module has the ability to operate while in Sleep mode and wake the CPU when the CSCK signal is supplied by an external device (CSCKD = 1). The DCI module will generate an asynchronous interrupt when a DCI buffer transfer has completed and the CPU is in Sleep mode. 18.5.2 DCI MODULE OPERATION DURING CPU IDLE MODE If the DCISIDL control bit is cleared (default), the module will continue to operate normally even in Idle mode. If the DCISIDL bit is set, the module will halt when Idle mode is asserted. 18.6 AC-Link Mode Operation The AC-Link protocol is a 256-bit frame with one 16-bit data slot, followed by twelve 20-bit data slots. The DCI module has two Operating modes for the AC-Link protocol. These Operating modes are selected by the COFSM<1:0> control bits in the DCICON1 SFR. The first AC-Link mode is called ‘16-bit AC-Link mode’ and is selected by setting COFSM<1:0> = 10. The second AC-Link mode is called ‘20-bit AC-Link mode’ and is selected by setting COFSM<1:0> = 11. 18.6.1 16-BIT AC-LINK MODE In the 16-bit AC-Link mode, data word lengths are restricted to 16 bits. Note that this restriction only affects the 20-bit data time slots of the AC-Link protocol. For received time slots, the incoming data is simply truncated to 16 bits. For outgoing time slots, the 4 LSbs of the data word are set to ‘0’ by the module. This truncation of the time slots limits the A/D and DAC data to 16 bits but permits proper data alignment in the TXBUF and RXBUF registers. Each RXBUF and TXBUF register will contain one data time slot value. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 18.6.2 20-BIT AC-LINK MODE The 20-bit AC-Link mode allows all bits in the data time slots to be transmitted and received but does not maintain data alignment in the TXBUF and RXBUF registers. The 20-bit AC-Link mode functions similar to the MultiChannel mode of the DCI module, except for the duty cycle of the frame synchronization signal. The AC-Link frame synchronization signal should remain high for 16 CSCK cycles and should be low for the following 240 cycles. The 20-bit mode treats each 256-bit AC-Link frame as sixteen, 16-bit time slots. In the 20-bit AC-Link mode, the module operates as if COFSG<3:0> = 1111 and WS<3:0> = 1111. The data alignment for 20-bit data slots is ignored. For example, an entire AC-Link data frame can be transmitted and received in a packed fashion by setting all bits in the TSCON and RSCON SFRs. Since the total available buffer length is 64 bits, it would take 4 consecutive interrupts to transfer the AC-Link frame. The application software must keep track of the current AC-Link frame segment. 18.7 I2S Mode Operation The DCI module is configured for I2S mode by writing a value of ‘01’ to the COFSM<1:0> control bits in the DCICON1 SFR. When operating in the I2S mode, the DCI module will generate frame synchronization signals with a 50% duty cycle. Each edge of the frame synchronization signal marks the boundary of a new data word transfer. The user must also select the frame length and data word size using the COFSG and WS control bits in the DCICON2 SFR. 18.7.1 I2S FRAME AND DATA WORD LENGTH SELECTION The WS and COFSG control bits are set to produce the period for one half of an I2S data frame. That is, the frame length is the total number of CSCK cycles required for a left or a right data word transfer. The BLEN bits must be set for the desired buffer length. Setting BLEN<1:0> = 01 will produce a CPU interrupt, once per I2S frame. 18.7.2 I2S DATA JUSTIFICATION As per the I2S specification, a data word transfer will, by default, begin one CSCK cycle after a transition of the WS signal. A ‘MSb left justified’ option can be selected using the DJST control bit in the DCICON1 SFR. If DJST = 1, the I2S data transfers will be MSb left justified. The MSb of the data word will be presented on the CSDO pin during the same CSCK cycle as the rising or falling edge of the COFS signal. The CSDO pin is tri-stated after the data word has been sent. © 2007 Microchip Technology Inc. DS70116G-page 127 DCI REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 DCICON1 0240 DCIEN — DCISIDL — DLOOP CSCKD DCICON2 0242 — — — — BLEN1 BLEN0 DCICON3 0244 — — — — DCISTAT 0246 — — — — Bit 9 Bit 8 Bit 7 CSCKE COFSD UNFM — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 CSDOM DJST — — — COFSM1 COFSG<3:0> — Bit 0 WS<3:0> 0000 0000 0000 0000 BCG<11:0> SLOT3 SLOT2 SLOT1 SLOT0 — — — Reset State COFSM0 0000 0000 0000 0000 0000 0000 0000 0000 — ROV RFUL TUNF TMPTY 0000 0000 0000 0000 TSCON 0248 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000 RSCON 024C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000 RXBUF0 0250 Receive Buffer #0 Data Register 0000 0000 0000 0000 RXBUF1 0252 Receive Buffer #1 Data Register 0000 0000 0000 0000 RXBUF2 0254 Receive Buffer #2 Data Register 0000 0000 0000 0000 RXBUF3 0256 Receive Buffer #3 Data Register 0000 0000 0000 0000 TXBUF0 0258 Transmit Buffer #0 Data Register 0000 0000 0000 0000 TXBUF1 025A Transmit Buffer #1 Data Register 0000 0000 0000 0000 TXBUF2 025C Transmit Buffer #2 Data Register 0000 0000 0000 0000 TXBUF3 025E Transmit Buffer #3 Data Register 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 128 TABLE 18-2: © 2007 Microchip Technology Inc. dsPIC30F5011/5013 19.0 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC module has six 16-bit registers: • • • • • • Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The ADCON1, ADCON2 and ADCON3 registers control the operation of the ADC module. The ADCHS register selects the input channels to be converted. The ADPCFG register configures the port pins as analog inputs or as digital I/O. The ADCSSL register selects inputs for scanning. The 12-bit Analog-to-Digital converter allows conversion of an analog input signal to a 12-bit digital number. This module is based on a Successive Approximation Register (SAR) architecture and provides a maximum sampling rate of 200 ksps. The ADC module has up to 16 analog inputs which are multiplexed into a sample and hold amplifier. The output of the sample and hold is the input into the converter which generates the result. The analog reference voltage is software selectable to either the device supply voltage (AVDD/AVSS) or the voltage level on the (VREF+/VREF-) pin. The ADC has a unique feature of being able to operate while the device is in Sleep mode with RC oscillator selection. FIGURE 19-1: ADC Control Register 1 (ADCON1) ADC Control Register 2 (ADCON2) ADC Control Register 3 (ADCON3) ADC Input Select Register (ADCHS) ADC Port Configuration Register (ADPCFG) ADC Input Scan Selection Register (ADCSSL) Note: The SSRC<2:0>, ASAM, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, must not be written to while ADON = 1. This would lead to indeterminate results. The block diagram of the 12-bit ADC module is shown in Figure 19-1. 12-BIT ADC FUNCTIONAL BLOCK DIAGRAM AVDD AVSS VREF+ VREF- AN1 0001 AN2 0010 AN3 0011 AN4 0100 AN5 0101 AN6 0110 AN7 0111 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 1000 DAC 12-bit SAR Conversion Logic 16-word, 12-bit Dual Port RAM Sample/Sequence Control Sample 1001 1010 Input Switches 1011 Input MUX Control 1100 1101 1110 1111 VREFAN1 © 2007 Microchip Technology Inc. Comparator Bus Interface 0000 Data Format AN0 S/H CH0 DS70116G-page 129 dsPIC30F5011/5013 19.1 ADC Result Buffer 19.3 Selecting the Conversion Sequence The ADC module contains a 16-word, dual port, readonly buffer called ADCBUF0...ADCBUFF, to buffer the ADC results. The RAM is 12 bits wide, but the data obtained is represented in one of four different 16-bit data formats. The contents of the sixteen ADC Result Buffer registers, ADCBUF0 through ADCBUFF, cannot be written by user software. Several groups of control bits select the sequence in which the ADC connects inputs to the sample/hold channel, converts a channel, writes the buffer memory and generates interrupts. 19.2 The SMPI bits select the number of acquisition/ conversion sequences that would be performed before an interrupt occurs. This can vary from 1 sample per interrupt to 16 samples per interrupt. Conversion Operation After the ADC module has been configured, the sample acquisition is started by setting the SAMP bit. Various sources, such as a programmable bit, timer time-outs and external events, will terminate acquisition and start a conversion. When the A/D conversion is complete, the result is loaded into ADCBUF0...ADCBUFF, and the DONE bit and the A/D interrupt flag ADIF are set after the number of samples specified by the SMPI bit. The ADC module can be configured for different interrupt rates as described in Section 19.3 “Selecting the Conversion Sequence”. The following steps should be followed for doing an A/D conversion: 1. 2. 3. 4. 5. 6. 7. Configure the ADC module: • Configure analog pins, voltage reference and digital I/O • Select ADC input channels • Select ADC conversion clock • Select ADC conversion trigger • Turn on ADC module Configure ADC interrupt (if required): • Clear ADIF bit • Select ADC interrupt priority Start sampling. Wait the required acquisition time. Trigger acquisition end, start conversion: Wait for ADC conversion to complete, by either: • Waiting for the ADC interrupt, or • Waiting for the DONE bit to get set. Read ADC result buffer, clear ADIF if required. DS70116G-page 130 The sequence is controlled by the sampling clocks. The BUFM bit will split the 16-word results buffer into two 8-word groups. Writing to the 8-word buffers will be alternated on each interrupt event. Use of the BUFM bit will depend on how much time is available for the moving of the buffers after the interrupt. If the processor can quickly unload a full buffer within the time it takes to acquire and convert one channel, the BUFM bit can be ‘0’ and up to 16 conversions (corresponding to the 16 input channels) may be done per interrupt. The processor will have one acquisition and conversion time to move the sixteen conversions. If the processor cannot unload the buffer within the acquisition and conversion time, the BUFM bit should be ‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt occurs. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will have the entire time between interrupts to move the eight conversions. The ALTS bit can be used to alternate the inputs selected during the sampling sequence. The input multiplexer has two sets of sample inputs: MUX A and MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are selected for sampling. If the ALTS bit is ‘1’ and SMPI<3:0> = 0000 on the first sample/convert sequence, the MUX A inputs are selected and on the next acquire/convert sequence, the MUX B inputs are selected. The CSCNA bit (ADCON2<10>) will allow the multiplexer input to be alternately scanned across a selected number of analog inputs for the MUX A group. The inputs are selected by the ADCSSL register. If a particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. If the number of inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs are unused. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 19.4 Programming the Start of Conversion Trigger The conversion trigger will terminate acquisition and start the requested conversions. The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 4 alternate sources of conversion trigger. When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit will cause the conversion trigger. When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under ADC clock control. The SAMC bits select the number of ADC clocks between the start of acquisition and the start of conversion. This provides the fastest conversion rates on multiple channels. SAMC must always be at least 1 clock cycle. Other trigger sources can come from timer modules or external interrupts. 19.5 For correct ADC conversions, the ADC conversion clock (TAD) must be selected to ensure a minimum TAD time of 334 nsec (for VDD = 5V). Refer to the Electrical Specifications section for minimum TAD under other operating conditions. Example 19-1 shows a sample calculation for the ADCS<5:0> bits, assuming a device operating speed of 30 MIPS. EXAMPLE 19-1: If the clearing of the ADON bit coincides with an autostart, the clearing has a higher priority and a new conversion will not start. Selecting the ADC Conversion Clock The ADC conversion requires 14 TAD. The source of the ADC conversion clock is software selected, using a six-bit counter. There are 64 possible options for TAD. EQUATION 19-1: ADC CONVERSION CLOCK ADC CONVERSION CLOCK AND SAMPLING RATE CALCULATION Minimum TAD = 334 nsec TCY = 33.33 nsec (30 MIPS) TAD –1 TCY 334 nsec =2• 33.33 nsec = 19 ADCS<5:0> = 2 Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion and stop the sampling sequencing until the next sampling trigger. The ADCBUF will not be updated with the partially completed A/D conversion sample. That is, the ADCBUF will continue to contain the value of the last completed conversion (or the last value written to the ADCBUF register). 19.6 The internal RC oscillator is selected by setting the ADRC bit. –1 Therefore, Set ADCS<5:0> = 19 TCY (ADCS<5:0> + 1) 2 33.33 nsec = (19 + 1) 2 Actual TAD = = 334 nsec If SSRC<2:0> = ‘111’ and SAMC<4:0> = ‘00001’ Since, Sampling Time = Acquisition Time + Conversion Time = 1 TAD + 14 TAD = 15 x 334 nsec Therefore, Sampling Rate = 1 (15 x 334 nsec) = ~200 kHz TAD = TCY * (0.5*(ADCS<5:0> + 1)) © 2007 Microchip Technology Inc. DS70116G-page 131 dsPIC30F5011/5013 19.7 ADC Speeds The dsPIC30F 12-bit ADC specifications permit a maximum of 200 ksps sampling rate. The table below summarizes the conversion speeds for the dsPIC30F 12-bit ADC and the required operating conditions. TABLE 19-1: 12-BIT ADC EXTENDED CONVERSION RATES dsPIC30F 12-bit ADC Conversion Rates Speed Up to 200 ksps(1) TAD Sampling Minimum Time Min 334 ns 1 TAD Rs Max VDD Temperature 2.5 kΩ 4.5V to 5.5V -40°C to +85°C Channels Configuration VREF- VREF+ CHX ANx S/H Up to 100 ksps 668 ns 1 TAD 2.5 kΩ 3.0V to 5.5V ADC -40°C to +125°C VREF- VREF+ or or AVSS AVDD CHX ANx S/H ADC ANx or VREF- Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 19-2 for recommended circuit. DS70116G-page 132 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 The following figure depicts the recommended circuit for the conversion rates above 100 ksps. The dsPIC30F5013 is shown as an example. FIGURE 19-2: ADC VOLTAGE REFERENCE SCHEMATIC 63 62 61 65 64 VSS 69 68 67 66 1 60 2 59 3 4 58 5 6 56 7 54 8 9 53 57 C2 0.1 μF dsPIC30F5013 C6 0.01 μF VDD 49 R1 10 AVDD C5 1 μF AVDD C4 0.1 μF AVDD C3 0.01 μF 40 39 38 37 36 35 34 33 41 VDD 42 20 VSS 43 19 30 18 29 44 28 45 17 AVSS 27 16 AVDD 46 VREF- 47 15 VREF+ 14 22 VDD 21 C7 0.1 μF VDD 50 13 C1 0.01 μF C8 1 μF VDD VSS VDD R2 10 VDD 52 VSS VDD See Note 1: 55 10 VDD VDD 80 79 78 77 76 75 74 73 72 VDD VDD VDD Note 1: Ensure adequate bypass capacitors are provided on each VDD pin. The configuration procedures below give the required setup values for the conversion speeds above 100 ksps. • Configure the ADC clock period to be: 1 (14 + 1) x 200,000 19.7.1 200 KSPS CONFIGURATION GUIDELINE The following configuration items are required to achieve a 200 ksps conversion rate. • Comply with conditions provided in Table 19-2. • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 19-2. • Set SSRC<2.0> = 111 in the ADCON1 register to enable the auto convert option. • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register. • Write the SMPI<3.0> control bits in the ADCON2 register for the desired number of conversions between interrupts. © 2007 Microchip Technology Inc. = 334 ns by writing to the ADCS<5:0> control bits in the ADCON3 register. • Configure the sampling time to be 1 TAD by writing: SAMC<4:0> = 00001. The following figure shows the timing diagram of the ADC running at 200 ksps. The TAD selection in conjunction with the guidelines described above allows a conversion speed of 200 ksps. See Example 19-1 for code example. DS70116G-page 133 dsPIC30F5011/5013 FIGURE 19-3: CONVERTING 1 CHANNEL AT 200 KSPS, AUTO-SAMPLE START, 1 TAD SAMPLING TIME TSAMP = 1 TAD TSAMP = 1 TAD ADCLK TCONV = 14 TAD TCONV = 14 TAD SAMP DONE ADCBUF0 ADCBUF1 Instruction Execution BSET ADCON1, ASAM 19.8 ADC Acquisition Requirements The analog input model of the 12-bit ADC is shown in Figure 19-4. The total sampling time for the ADC is a function of the internal amplifier settling time and the holding capacitor charge time. For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the voltage level on the analog input pin. The source impedance (RS), the interconnect impedance (RIC), and the internal sampling switch (RSS) imped- FIGURE 19-4: ance combine to directly affect the time required to charge the capacitor CHOLD. The combined impedance of the analog sources must therefore be small enough to fully charge the holding capacitor within the chosen sample time. To minimize the effects of pin leakage currents on the accuracy of the ADC, the maximum recommended source impedance, RS, is 2.5 kΩ. After the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. The internal holding capacitor will be in a discharged state prior to each sample operation. 12-BIT ADC ANALOG INPUT MODEL VDD Rs VA ANx RIC ≤ 250Ω VT = 0.6V Sampling Switch RSS ≤ 3 kΩ RSS CPIN VT = 0.6V I leakage ± 500 nA CHOLD = DAC capacitance = 18 pF VSS Legend: CPIN = input capacitance VT = threshold voltage I leakage = leakage current at the pin due to various junctions RIC = interconnect resistance RSS = sampling switch resistance CHOLD = sample/hold capacitance (from DAC) Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ. DS70116G-page 134 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 19.9 Module Power-down Modes The module has two internal Power modes. When the ADON bit is ‘1’, the module is in Active mode, and is fully powered and functional. When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for maximum current savings. In order to return to the Active mode from Off mode, the user must wait for the ADC circuitry to stabilize. 19.10 ADC Operation During CPU Sleep and Idle Modes 19.10.1 ADC OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with a partially completed conversion on exit from Sleep mode. 19.10.2 A/D OPERATION DURING CPU IDLE MODE The ADSIDL bit selects if the module stops on Idle or continues on Idle. If ADSIDL = 0, the module continues operation on assertion of Idle mode. If ADSIDL = 1, the module stops on Idle. 19.11 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the ADC module to be turned off, and any conversion and sampling sequence to be aborted. The values that are in the ADCBUF registers are not modified. The ADC Result register contains unknown data after a Power-on Reset. 19.12 Output Formats The ADC result is 12 bits wide. The data buffer RAM is also 12 bits wide. The 12-bit data can be read in one of four different formats. The FORM<1:0> bits select the format. Each of the output formats translates to a 16-bit result on the data bus. Register contents are not affected by the device entering or leaving Sleep mode. The ADC module can operate during Sleep mode if the ADC clock source is set to RC (ADRC = 1). When the RC clock source is selected, the ADC module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed, which eliminates all digital switching noise from the conversion. When the conversion is complete, the DONE bit is cleared and the result is loaded into the ADCBUF register. If the ADC interrupt is enabled, the device wakes up from Sleep. If the ADC interrupt is not enabled, the ADC module is turned off, although the ADON bit remains set. © 2007 Microchip Technology Inc. DS70116G-page 135 dsPIC30F5011/5013 FIGURE 19-5: ADC OUTPUT DATA FORMATS RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Signed Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Signed Integer Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 19.13 Configuring Analog Port Pins 19.14 Connection Considerations The ADPCFG and TRIS registers are used to control the operation of the ADC port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The analog inputs have diodes to VDD and VSS as ESD protection. This requires that the analog input be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased, which may damage the device if the input current specification is exceeded. The ADC operation is independent of the state of the CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits. An external RC filter is sometimes added for antialiasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. When reading the Port register, all pins configured as analog input channels will read as cleared. Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. DS70116G-page 136 © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 19-2: A/D CONVERTER REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 ADCBUF0 0280 — — — — ADC Data Buffer 0 0000 uuuu uuuu uuuu ADCBUF1 0282 — — — — ADC Data Buffer 1 0000 uuuu uuuu uuuu ADCBUF2 0284 — — — — ADC Data Buffer 2 0000 uuuu uuuu uuuu ADCBUF3 0286 — — — — ADC Data Buffer 3 0000 uuuu uuuu uuuu ADCBUF4 0288 — — — — ADC Data Buffer 4 0000 uuuu uuuu uuuu ADCBUF5 028A — — — — ADC Data Buffer 5 0000 uuuu uuuu uuuu ADCBUF6 028C — — — — ADC Data Buffer 6 0000 uuuu uuuu uuuu ADCBUF7 028E — — — — ADC Data Buffer 7 0000 uuuu uuuu uuuu ADCBUF8 0290 — — — — ADC Data Buffer 8 0000 uuuu uuuu uuuu ADCBUF9 0292 — — — — ADC Data Buffer 9 0000 uuuu uuuu uuuu ADCBUFA 0294 — — — — ADC Data Buffer 10 0000 uuuu uuuu uuuu ADCBUFB 0296 — — — — ADC Data Buffer 11 0000 uuuu uuuu uuuu ADCBUFC 0298 — — — — ADC Data Buffer 12 0000 uuuu uuuu uuuu ADCBUFD 029A — — — — ADC Data Buffer 13 0000 uuuu uuuu uuuu ADCBUFE 029C — — — — ADC Data Buffer 14 0000 uuuu uuuu uuuu ADCBUFF 029E — — — — ADC Data Buffer 15 ADCON1 02A0 ADON — ADSIDL — — — — Bit 10 — Bit 9 Bit 8 Bit 7 FORM<1:0> Bit 6 Bit 5 SSRC<2:0> Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 uuuu uuuu uuuu — — ASAM SAMP DONE 0000 0000 0000 0000 BUFM ALTS 0000 0000 0000 0000 ADCON2 02A2 ADCON3 02A4 — — — ADCHS 02A6 — — — ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000 ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL11 CSSL6 CSSL4 CSSL3 CSSL0 0000 0000 0000 0000 CSCNA — — SAMC<4:0> CH0NB CSSL12 CH0SB<3:0> CSSL10 CSSL9 CSSL8 BUFS — ADRC — — — CSSL7 SMPI<3:0> ADCS<5:0> — CSSL5 u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. CH0NA 0000 0000 0000 0000 CH0SA<3:0> CSSL2 CSSL1 0000 0000 0000 0000 DS70116G-page 137 dsPIC30F5011/5013 Legend: VCFG<2:0> Bit 11 dsPIC30F5011/5013 NOTES: DS70116G-page 138 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 20.0 SYSTEM INTEGRATION Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). Several system integration features maximize system reliability, minimize cost through elimination of external components, provide Power-Saving Operating modes and offer code protection: • Oscillator Selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Programmable Brown-out Reset (BOR) • Watchdog Timer (WDT) • Low-Voltage Detect • Power-Saving Modes (Sleep and Idle) • Code Protection • Unit ID Locations • In-Circuit Serial Programming (ICSP) 20.1 Oscillator System Overview The dsPIC30F oscillator system has the following features: • Various external and internal oscillator options as clock sources • An on-chip PLL to boost internal operating frequency • A clock switching mechanism between various clock sources • Programmable clock postscaler for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures • Clock Control register (OSCCON) • Configuration bits for main oscillator selection Configuration bits determine the clock source upon Power-on Reset (POR) and Brown-out Reset (BOR). Thereafter, the clock source can be changed between permissible clock sources. The OSCCON register controls the clock switching and reflects system clock related status bits. Table 20-1 provides a summary of the dsPIC30F Oscillator operating modes. A simplified diagram of the oscillator system is shown in Figure 20-1. dsPIC30F devices have a Watchdog Timer that is permanently enabled via the Configuration bits or can be software controlled. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a delay on power-up only to keep the part in Reset while the power supply stabilizes. With these two timers on chip, most applications need no external Reset circuitry. Sleep mode is designed to offer a very low-current Power-down mode. The user application can wake-up from Sleep through external Reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit a wide variety of applications. In Idle mode, the clock sources are still active but the CPU is shut-off. The RC oscillator option saves system cost while the LP crystal option saves power. © 2007 Microchip Technology Inc. DS70116G-page 139 dsPIC30F5011/5013 TABLE 20-1: OSCILLATOR OPERATING MODES Oscillator Mode Description XTL 200 kHz-4 MHz crystal on OSC1:OSC2. XT 4 MHz-10 MHz crystal on OSC1:OSC2. XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled. XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled. XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1). LP 32 kHz crystal on SOSCO:SOSCI(2). HS 10 MHz-25 MHz crystal. EC External clock input (0-40 MHz). ECIO External clock input (0-40 MHz), OSC2 pin is I/O. EC w/ PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled(1). EC w/ PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled(1). EC w/ PLL 16x External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1). ERC External RC oscillator, OSC2 pin is FOSC/4 output(3). ERCIO External RC oscillator, OSC2 pin is I/O(3). FRC 7.37 MHz internal RC oscillator. FRC w/ PLL 4x 7.37 MHz Internal RC oscillator, 4x PLL enabled. FRC w/ PLL 8x 7.37 MHz Internal RC oscillator, 8x PLL enabled. FRC w/ PLL 16x 7.37 MHz Internal RC oscillator, 16x PLL enabled. LPRC 512 kHz internal RC oscillator. Note 1: 2: 3: dsPIC30F maximum operating frequency of 120 MHz must be met. LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1. Requires external R and C. Frequency operation up to 4 MHz. DS70116G-page 140 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM Oscillator Configuration bits PWRSAV Instruction Wake-up Request FPLL OSC1 OSC2 Primary Oscillator PLL x4, x8, x16 PLL Lock COSC<1:0> Primary Osc TUN<3:0> 4 NOSC<1:0> Primary Oscillator Stability Detector OSWEN Internal Fast RC Oscillator (FRC) POR Done Oscillator Start-up Timer Clock Secondary Osc Switching and Control Block SOSCO SOSCI 32 kHz LP Oscillator Secondary Oscillator Stability Detector Internal LowPower RC Oscillator (LPRC) FCKSM<1:0> 2 Programmable Clock Divider System Clock 2 POST<1:0> LPRC Fail-Safe Clock Monitor (FSCM) CF Oscillator Trap to Timer1 © 2007 Microchip Technology Inc. DS70116G-page 141 dsPIC30F5011/5013 20.2 20.2.1 Oscillator Configurations INITIAL CLOCK SOURCE SELECTION While coming out of Power-on Reset or Brown-out Reset, the device selects its clock source based on: a) b) FOS<1:0> Configuration bits, which select one of four oscillator groups, and FPR<3:0> Configuration bits, which select one of 13 oscillator choices within the primary group. Table 20-2 shows the Configuration bit values for clock selection. TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2 Function EC Primary 1 1 1 0 1 1 CLKO ECIO Primary 1 1 1 1 0 0 I/O EC w/ PLL 4x Primary 1 1 1 1 0 1 I/O EC w/ PLL 8x Primary 1 1 1 1 1 0 I/O EC w/ PLL 16x Primary 1 1 1 1 1 1 I/O ERC Primary 1 1 1 0 0 1 CLKO ERCIO Primary 1 1 1 0 0 0 I/O XT Primary 1 1 0 1 0 0 OSC2 XT w/ PLL 4x Primary 1 1 0 1 0 1 OSC2 XT w/ PLL 8x Primary 1 1 0 1 1 0 OSC2 XT w/ PLL 16x Primary 1 1 0 1 1 1 OSC2 XTL Primary 1 1 0 0 0 0 OSC2 FRC w/ PLL 4x Internal FRC 1 1 0 0 0 1 I/O FRC w/ PLL 8x Internal FRC 1 1 1 0 1 0 I/O FRC w/ PLL 16x Internal FRC 1 1 0 0 1 1 I/O HS Primary 1 1 0 0 1 0 OSC2 LP Secondary 0 0 — — — — (Notes 1, 2) FRC Internal FRC 0 1 x x x x (Notes 1, 2) LPRC Internal LPRC 1 0 — — — — (Notes 1, 2) Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. 20.2.2 OSCILLATOR START-UP TIMER (OST) To ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an Oscillator Start-up Timer is included. It is a simple 10-bit counter that counts 1024 TOSC cycles before releasing the oscillator clock to the rest of the system. The time-out period is designated as TOST. The TOST time is involved every time the oscillator has to restart (i.e., on POR, BOR and wake-up from Sleep). The Oscillator Start-up Timer is applied to the LP oscillator, XT, XTL, and HS modes (upon wake-up from Sleep, POR and BOR) for the primary oscillator. DS70116G-page 142 20.2.3 LP OSCILLATOR CONTROL Enabling the LP oscillator is controlled with two elements: 1. 2. The current oscillator group bits COSC<1:0>. The LPOSCEN bit (OSCON register). The LP oscillator is on (even during Sleep mode) if LPOSCEN = 1. The LP oscillator is the device clock if: • COSC<1:0> = 00 (LP selected as main oscillator) and • LPOSCEN = 1 Keeping the LP oscillator on at all times allows for a fast switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator still requires a start-up time. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 20.2.4 PHASE LOCKED LOOP (PLL) The PLL multiplies the clock which is generated by the primary oscillator or Fast RC oscillator. The PLL is selectable to have gains of x4, x8, and x16. Input and output frequency ranges are summarized in Table 20-3. TABLE 20-3: PLL FREQUENCY RANGE FIN PLL Multiplier FOUT 4 MHz-10 MHz x4 16 MHz-40 MHz 4 MHz-10 MHz x8 32 MHz-80 MHz 4 MHz-7.5 MHz x16 64 MHz-120 MHz The PLL features a lock output which is asserted when the PLL enters a phase locked state. Should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. The state of this signal is reflected in the read-only LOCK bit in the OSCCON register. 20.2.5 FAST RC OSCILLATOR (FRC) The FRC oscillator is a fast (7.37 MHz ±2% nominal) internal RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the use of an external crystal, ceramic resonator, or RC network. The FRC oscillator can be used with the PLL to obtain higher clock frequencies. The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the OSCCON register (OSCCON<13:12>) are set to ‘01’. The four bit field specified by TUN<3:0> (OSCCON <15:14> and OSCCON<11:10>) allows the user to tune the internal fast RC oscillator (nominal 7.37 MHz). The user can tune the FRC oscillator within a range of +10.5% (840 kHz) and -12% (960 kHz) in steps of 1.50% around the factory-calibrated setting (see Table 20-4). If OSCCON<13:12> are set to ‘11’ and FPR<3:0> are set to ‘0001’, ‘1010’ or ‘0011’, then a PLL multiplier of 4, 8 or 16 (respectively) is applied. Note: When a 16x PLL is used, the FRC frequency must not be tuned to a frequency greater than 7.5 MHz. TABLE 20-4: TUN<3:0> Bits 0111 0110 0101 0100 0011 0010 0001 0000 1111 1110 1101 1100 1011 1010 1001 1000 20.2.6 FRC TUNING FRC Frequency + 10.5% + 9.0% + 7.5% + 6.0% + 4.5% + 3.0% + 1.5% Center Frequency (oscillator is running at calibrated frequency) - 1.5% - 3.0% - 4.5% - 6.0% - 7.5% - 9.0% - 10.5% - 12.0% LOW-POWER RC OSCILLATOR (LPRC) The LPRC oscillator is a component of the Watchdog Timer (WDT) and oscillates at a nominal frequency of 512 kHz. The LPRC oscillator is the clock source for the Power-up Timer (PWRT) circuit, WDT and clock monitor circuits. It can also be used to provide a low frequency clock source option for applications where power consumption is critical and timing accuracy is not required The LPRC oscillator is always enabled at a Power-on Reset because it is the clock source for the PWRT. After the PWRT expires, the LPRC oscillator remains on if one of the following conditions is true: • The Fail-Safe Clock Monitor is enabled • The WDT is enabled • The LPRC oscillator is selected as the system clock via the COSC<1:0> control bits in the OSCCON register If one of the above conditions is not true, the LPRC shuts off after the PWRT expires. Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. © 2007 Microchip Technology Inc. DS70116G-page 143 dsPIC30F5011/5013 20.2.7 FAIL-SAFE CLOCK MONITOR The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by appropriately programming the FCKSM Configuration bits (clock switch and monitor selection bits) in the FOSC Device Configuration register. If the FSCM function is enabled, the LPRC internal oscillator will run at all times (except during Sleep mode) and is not subject to control by the SWDTEN bit. In the event of an oscillator failure, the FSCM generates a clock failure trap event and switches the system clock over to the FRC oscillator. The user then has the option to either attempt to restart the oscillator or execute a controlled shutdown. The user may decide to treat the trap as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. In this event, the CF (Clock Fail) Status bit (OSCCON<3>) is also set whenever a clock failure is recognized. In the event of a clock failure, the WDT is unaffected and continues to run on the LPRC clock. If the oscillator has a very slow start-up time coming out of POR, BOR or Sleep, it is possible that the PWRT timer will expire before the oscillator has started. In such cases, the FSCM is activated and the FSCM initiates a clock failure trap, and the COSC<1:0> bits are loaded with FRC oscillator selection. This effectively shuts off the original oscillator that was trying to start. The OSCCON register holds the control and status bits related to clock switching. • COSC<1:0>: Read-only status bits always reflect the current oscillator group in effect. • NOSC<1:0>: Control bits which are written to indicate the new oscillator group of choice. - On POR and BOR, COSC<1:0> and NOSC<1:0> are both loaded with the Configuration bit values FOS<1:0>. • LOCK: The LOCK Status bit indicates a PLL lock. • CF: Read-only Status bit indicating if a clock fail detect has occurred. • OSWEN: Control bit changes from a ‘0’ to a ‘1’ when a clock transition sequence is initiated. Clearing the OSWEN control bit will abort a clock transition in progress (used for hang-up situations). If Configuration bits FCKSM<1:0> = 1x, the clock switching and fail-safe clock monitoring functions are disabled. This is the default Configuration bit setting. If clock switching is disabled, the FOS<1:0> and FPR<3:0> bits directly control the oscillator selection and the COSC<1:0> bits do not control the clock selection. However, these bits will reflect the clock source selection. Note: The user may detect this situation and restart the oscillator in the clock fail trap ISR. Upon a clock failure detection, the FSCM module initiates a clock switch to the FRC oscillator as follows: 1. 2. 3. The COSC bits (OSCCON<13:12>) are loaded with the FRC oscillator selection value. CF bit is set (OSCCON<3>). OSWEN control bit (OSCCON<0>) is cleared. For the purpose of clock switching, the clock sources are sectioned into four groups: 1. 2. 3. 4. Primary Secondary Internal FRC Internal LPRC The user can switch between these functional groups but cannot switch between options within a group. If the primary group is selected, then the choice within the group is always determined by the FPR<3:0> Configuration bits. 20.2.8 The application should not attempt to switch to a clock frequency lower than 100 KHz when the fail-safe clock monitor is enabled. If such clock switching is performed, the device may generate an oscillator fail trap and switch to the Fast RC oscillator. PROTECTION AGAINST ACCIDENTAL WRITES TO OSCCON A write to the OSCCON register is intentionally made difficult because it controls clock switching and clock scaling. To write to the OSCCON low byte, the following code sequence must be executed without any other instructions in between: Byte Write “0x46” to OSCCON low Byte Write “0x57” to OSCCON low Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. To write to the OSCCON high byte, the following instructions must be executed without any other instructions in between: Byte Write “0x78” to OSCCON high Byte Write “0x9A” to OSCCON high Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. DS70116G-page 144 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 20.3 Reset The PIC18F1220/1320 differentiates between various kinds of Reset: a) b) c) d) e) f) g) h) Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep Watchdog Timer (WDT) Reset (during normal operation) Programmable Brown-out Reset (BOR) RESET Instruction Reset caused by trap lockup (TRAPR) Reset caused by illegal opcode or by using an uninitialized W register as an address pointer (IOPUWR) FIGURE 20-2: Different registers are affected in different ways by various Reset conditions. Most registers are not affected by a WDT wake-up since this is viewed as the resumption of normal operation. Status bits from the RCON register are set or cleared differently in different Reset situations, as indicated in Table 20-5. These bits are used in software to determine the nature of the Reset. A block diagram of the On-Chip Reset Circuit is shown in Figure 20-2. A MCLR noise filter is provided in the MCLR Reset path. The filter detects and ignores small pulses. Internally generated Resets do not drive MCLR pin low. RESET SYSTEM BLOCK DIAGRAM RESET Instruction Digital Glitch Filter MCLR Sleep or Idle WDT Module POR VDD Rise Detect S VDD Brown-out Reset BOR BOREN R Q SYSRST Trap Conflict Illegal Opcode/ Uninitialized W Register 20.3.1 POR: POWER-ON RESET A power-on event will generate an internal POR pulse when a VDD rise is detected. The Reset pulse will occur at the POR circuit threshold voltage (VPOR) which is nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate requirements. The POR pulse will reset a POR timer and place the device in the Reset state. The POR also selects the device clock source identified by the oscillator configuration fuses. The POR circuit inserts a small delay, TPOR, which is nominally 10 μs and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter is based on device Configuration bits and can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total delay is at device power-up, TPOR + TPWRT. When these delays have expired, SYSRST will be negated on the next leading edge of the Q1 clock and the PC will jump to the Reset vector. The timing for the SYSRST signal is shown in Figure 20-3 through Figure 20-5. © 2007 Microchip Technology Inc. DS70116G-page 145 dsPIC30F5011/5013 FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset DS70116G-page 146 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 20.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled) The oscillator start-up circuitry is not linked to the POR circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after the POR timer and the PWRT have expired: • The oscillator circuit has not begun to oscillate. • The Oscillator Start-up Timer has not expired (if a crystal oscillator is used). • The PLL has not achieved a LOCK (if PLL is used). If the FSCM is enabled and one of the above conditions is true, then a clock failure trap will occur. The device will automatically switch to the FRC oscillator and the user can switch to the desired crystal oscillator in the trap ISR. 20.3.1.2 FPR<3:0>). Furthermore, if an Oscillator mode is selected, the BOR will activate the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, then the clock will be held until the LOCK bit (OSCCON<5>) is ‘1’. Concurrently, the POR time-out (TPOR) and the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 μs is applied. The total delay in this case is (TPOR + TFSCM). The BOR Status bit (RCON<1>) will be set to indicate that a BOR has occurred. The BOR circuit, if enabled, will continue to operate while in Sleep or Idle modes and will reset the device should VDD fall below the BOR threshold voltage. FIGURE 20-6: Operating without FSCM and PWRT VDD If the FSCM is disabled and the Power-up Timer (PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is FRC, LPRC, EXTRC or EC, it will be active immediately. If the FSCM is disabled and the system clock has not started, the device will be in a frozen state at the Reset vector until the system clock starts. From the user’s perspective, the device will appear to be in Reset until a system clock is available. 20.3.2 BOR: PROGRAMMABLE BROWN-OUT RESET The BOR (Brown-out Reset) module is based on an internal voltage reference circuit. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (i.e., missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). The BOR module allows selection of one of the following voltage trip points (see Table 23-11): EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) D R R1 C Note 1: 2: 3: Note: MCLR dsPIC30F External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. R should be suitably chosen to make sure that the voltage drop across R does not violate the device’s electrical specifications. R1 should be suitably chosen to limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD), or Electrical Overstress (EOS). Dedicated supervisory devices, such as the MCP1XX and MCP8XX, may also be used as an external Power-on Reset circuit. • 2.6V-2.71V • 4.1V-4.4V • 4.58V-4.73V Note: The BOR voltage trip points indicated here are nominal values provided for design guidance only. Refer to the Electrical Specifications in the specific device data sheet for BOR voltage limit specifications. A BOR will generate a Reset pulse which will reset the device. The BOR will select the clock source based on the device Configuration bit values (FOS<1:0> and © 2007 Microchip Technology Inc. DS70116G-page 147 dsPIC30F5011/5013 Table 20-5 shows the Reset conditions for the RCON register. Since the control bits within the RCON register are R/W, the information in the table implies that all the bits are negated prior to the action specified in the condition column. TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 0 0 0 0 0 0 0 0 1 MCLR Reset during normal operation 0x000000 0 0 1 0 0 0 0 0 0 Software Reset during normal operation 0x000000 0 0 0 1 0 0 0 0 0 MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0 MCLR Reset during Idle 0x000000 0 0 1 0 0 1 0 0 0 WDT Time-out Reset 0x000000 0 0 0 0 1 0 0 0 0 PC + 2 WDT Wake-up 0 0 0 0 1 0 1 0 0 Interrupt Wake-up from Sleep PC + 2 (1) 0 0 0 0 0 0 1 0 0 Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0 Trap Reset 0x000000 1 0 0 0 0 0 0 0 0 Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0 Legend: Note 1: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. DS70116G-page 148 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 Table 20-6 shows a second example of the bit conditions for the RCON register. In this case, it is not assumed the user has set/cleared specific bits prior to action specified in the condition column. TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2 Condition Power-on Reset Program Counter 0x000000 TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 u u u u u u u 0 1 MCLR Reset during normal operation 0x000000 u u 1 0 0 0 0 u u Software Reset during normal operation 0x000000 u u 0 1 0 0 0 u u MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u MCLR Reset during Idle 0x000000 u u 1 u 0 1 0 u u WDT Time-out Reset 0x000000 u u 0 0 1 0 0 u u PC + 2 WDT Wake-up u u u u 1 u 1 u u Interrupt Wake-up from Sleep PC + 2 (1) u u u u u u 1 u u Clock Failure Trap 0x000004 u u u u u u u u u Trap Reset 0x000000 1 u u u u u u u u Illegal Operation Reset 0x000000 u 1 u u u u u u u Legend: Note 1: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. © 2007 Microchip Technology Inc. DS70116G-page 149 dsPIC30F5011/5013 20.4 20.4.1 Watchdog Timer (WDT) WATCHDOG TIMER OPERATION The primary function of the Watchdog Timer (WDT) is to reset the processor in the event of a software malfunction. The WDT is a free-running timer which runs off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal oscillator) fails. 20.4.2 ENABLING AND DISABLING THE WDT The Watchdog Timer can be “Enabled” or “Disabled” only through a Configuration bit (FWDTEN) in the Configuration register, FWDT. Setting FWDTEN = 1 enables the Watchdog Timer. The enabling is done when programming the device. By default, after chip erase, FWDTEN bit = 1. Any device programmer capable of programming dsPIC30F devices allows programming of this and other Configuration bits. If enabled, the WDT will increment until it overflows or “times out”. A WDT time-out will force a device Reset (except during Sleep). To prevent a WDT time-out, the user must clear the Watchdog Timer using a CLRWDT instruction. If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared to indicate a wake-up resulting from a WDT time-out. Setting FWDTEN = 0 allows user software to enable/ disable the Watchdog Timer via the SWDTEN (RCON<5>) control bit. 20.6 There are two power-saving states that can be entered through the execution of a special instruction, PWRSAV; these are Sleep and Idle. The format of the PWRSAV instruction is as follows: PWRSAV <parameter>, where ‘parameter’ defines Idle or Sleep mode. 20.6.1 Low-Voltage Detect The Low-Voltage Detect (LVD) module is used to detect when the VDD of the device drops below a threshold value, VLVD, which is determined by the LVDL<3:0> bits (RCON<11:8>) and is thus user programmable. The internal voltage reference circuitry requires a nominal amount of time to stabilize, and the BGST bit (RCON<13>) indicates when the voltage reference has stabilized. In some devices, the LVD threshold voltage may be applied externally on the LVDIN pin. The LVD module is enabled by setting the LVDEN bit (RCON<12>). DS70116G-page 150 SLEEP MODE In Sleep mode, the clock to the CPU and peripherals is shutdown. If an on-chip oscillator is being used, it is shutdown. The Fail-Safe Clock Monitor is not functional during Sleep since there is no clock to monitor. However, LPRC clock remains active if WDT is operational during Sleep. The brown-out protection circuit and the Low-Voltage Detect circuit, if enabled, will remain functional during Sleep. The processor wakes up from Sleep if at least one of the following conditions has occurred: • any interrupt that is individually enabled and meets the required priority level • any Reset (POR, BOR and MCLR) • WDT time-out On waking up from Sleep mode, the processor will restart the same clock that was active prior to entry into Sleep mode. When clock switching is enabled, bits COSC<1:0> will determine the oscillator source that will be used on wake-up. If clock switch is disabled, then there is only one system clock. Note: 20.5 Power-Saving Modes If a POR or BOR occurred, the selection of the oscillator is based on the FOS<1:0> and FPR<3:0> Configuration bits. If the clock source is an oscillator, the clock to the device will be held off until OST times out (indicating a stable oscillator). If PLL is used, the system clock is held off until LOCK = 1 (indicating that the PLL is stable). In either case, TPOR, TLOCK and TPWRT delays are applied. If EC, FRC, LPRC or EXTRC oscillators are used, then a delay of TPOR (~ 10 μs) is applied. This is the smallest delay possible on wake-up from Sleep. Moreover, if LP oscillator was active during Sleep and LP is the oscillator used on wake-up, then the start-up delay will be equal to TPOR. PWRT delay and OST timer delay are not applied. In order to have the smallest possible start-up delay when waking up from Sleep, one of these faster wake-up options should be selected before entering Sleep. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 Any interrupt that is individually enabled (using the corresponding IE bit), and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Sleep Status bit in the RCON register is set upon wake-up. Note: In spite of various delays applied (TPOR, TLOCK and TPWRT), the crystal oscillator (and PLL) may not be active at the end of the time-out (e.g., for low frequency crystals). In such cases, if FSCM is enabled, then the device will detect this as a clock failure and process the clock failure trap, the FRC oscillator will be enabled and the user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the device will simply suspend execution of code until the clock is stable and will remain in Sleep until the oscillator clock has started. All Resets will wake-up the processor from Sleep mode. Any Reset, other than POR, will set the Sleep Status bit. In a POR, the Sleep bit is cleared. If the Watchdog Timer is enabled, then the processor will wake-up from Sleep mode upon WDT time-out. The SLEEP and WDTO Status bits are both set. If Watchdog Timer is enabled, then the processor will wake-up from Idle mode upon WDT time-out. The Idle and WDTO status bits are both set. Unlike wake-up from Sleep, there are no time delays involved in wake-up from Idle. 20.7 The Configuration bits in each device Configuration register specify some of the Device modes and are programmed by a device programmer, or by using the In-Circuit Serial Programming (ICSP) feature of the device. Each device Configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are six device Configuration registers available to the user: 1. 2. 3. 4. 5. 20.6.2 IDLE MODE In Idle mode, the clock to the CPU is shutdown while peripherals keep running. Unlike Sleep mode, the clock source remains active. Several peripherals have a control bit in each module that allows them to operate during Idle. LPRC Fail-Safe Clock remains active if clock failure detect is enabled. The processor wakes up from Idle if at least one of the following conditions has occurred: • any interrupt that is individually enabled (IE bit is ‘1’) and meets the required priority level • any Reset (POR, BOR, MCLR) • WDT time-out Upon wake-up from Idle mode, the clock is re-applied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction. Any interrupt that is individually enabled (using IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Idle Status bit in the RCON register is set upon wake-up. Any Reset other than POR will set the Idle Status bit. On a POR, the Idle bit is cleared. © 2007 Microchip Technology Inc. Device Configuration Registers 6. FOSC (0xF80000): Oscillator Configuration Register FWDT (0xF80002): Watchdog Timer Configuration Register FBORPOR (0xF80004): BOR and POR Configuration Register FBS (0xF80006): Boot Code Segment Configuration Register FSS (0xF80008): Secure Code Segment Configuration Register FGS (0xF8000A): General Code Segment Configuration Register The placement of the Configuration bits is automatically handled when you select the device in your device programmer. The desired state of the Configuration bits may be specified in the source code (dependent on the language tool used), or through the programming interface. After the device has been programmed, the application software may read the Configuration bit values through the table read instructions. For additional information, please refer to the “dsPIC30F Flash Programming Specification” (DS70102), the “dsPIC30F Family Reference Manual” (DS70046) and the “CodeGuard™ Security” chapter (DS70180). Note: 1. If the code protection configuration fuse bits (FBS<BSS<2:0>, FSS<SSS<2:0>, FGS<GCP> and FGS<GWRP>) have been programmed, an erase of the entire code-protected device is only possible at voltages VDD ≥ 4.5V. 2. This device supports an Advanced implementation of CodeGuard™ Security. Please refer to the “CodeGuard Security” chapter (DS70180) for information on how CodeGuard Security may be used in your application. DS70116G-page 151 dsPIC30F5011/5013 20.8 Peripheral Module Disable (PMD) Registers The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled via the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral will also be disabled so writes to those registers will have no effect and read values will be invalid. A peripheral module will only be enabled if both the associated bit in the PMD register is cleared and the peripheral is supported by the specific dsPIC DSC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of 1 instruction cycle (assuming the module control registers are already configured to enable module operation). 20.9 When MPLAB® ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. When the device has this feature enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. One of four pairs of Debug I/O pins may be selected by the user using configuration options in MPLAB IDE. These pin pairs are named EMUD/EMUC, EMUD1/ EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3. In each case, the selected EMUD pin is the Emulation/ Debug Data line, and the EMUC pin is the Emulation/ Debug Clock line. These pins will interface to the MPLAB ICD 2 module available from Microchip. The selected pair of Debug I/O pins is used by MPLAB ICD 2 to send commands and receive responses, as well as to send and receive data. To use the In-Circuit Debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD, and the selected EMUDx/EMUCx pin pair. This gives rise to two possibilities: 1. 2. DS70116G-page 152 In-Circuit Debugger If EMUD/EMUC is selected as the Debug I/O pin pair, then only a 5-pin interface is required, as the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in all dsPIC30F devices. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/ EMUC3 is selected as the Debug I/O pin pair, then a 7-pin interface is required, as the EMUDx/EMUCx pin functions (x = 1, 2 or 3) are not multiplexed with the PGD and PGC pin functions. © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 20-7: SFR Name Addr. SYSTEM INTEGRATION REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 TRAPR IOPUWR BGST LVDEN Bit 11 Bit 10 TUN1 TUN0 Bit 9 Bit 8 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 EXTR SWR SWDTEN WDTO SLEEP IDLE LOCK — CF — RCON 0740 OSCCON 0742 TUN3 TUN2 PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — DCIMD I2CMD 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD PMD2 Note 1: 2: File Name NOSC<1:0> POST<1:0> U2MD U1MD SPI2MD SPI1MD C2MD OC4MD OC3MD Bit 1 Bit 0 Reset State BOR POR (Note 1) LPOSCEN OSWEN (Note 2) C1MD ADCMD 0000 0000 0000 0000 OC2MD OC1MD 0000 0000 0000 0000 OC6MD OC5MD Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 — — — — Reset state depends on type of Reset. Reset state depends on Configuration bits. TABLE 20-8: FOSC COSC<1:0> LVDL<3:0> Bit 7 DEVICE CONFIGURATION REGISTER MAP Addr. Bits 23-16 F80000 — Bit 15 Bit 14 FCKSM<1:0> Bit 13 Bit 12 Bit 11 Bit 10 — — — — Bit 9 FOS<1:0> Bit 3 Bit 2 Bit 1 Bit 0 FPR<3:0> FWDT F80002 — FWDTEN — — — — — — — — — FWPSA<1:0> FBORPOR F80004 — MCLREN — — — — — — — BOREN — BORV<1:0> FBS F80006 — — — RBS1 RBS0 — — — EBS — — — — BSS<2:0> FSS F80008 — — — RBS1 RBS0 — — ESS1 ESS0 — — — — SSS<2:0> FGS F8000A — — — — — — — — — — — — — FWPSB<3:0> — — — — FPWRT<1:0> BWRP SWRP GSS1 GSS0 Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F5011/5013 DS70116G-page 153 dsPIC30F5011/5013 NOTES: DS70116G-page 154 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 21.0 INSTRUCTION SET SUMMARY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). The dsPIC30F instruction set adds many enhancements to the previous PIC® MCU instruction sets, while maintaining an easy migration from PIC MCU instruction sets. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: • • • • • Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 21-1 shows the general symbols used in describing the instructions. The dsPIC30F instruction set summary in Table 21-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand which is typically a register ‘Wb’ without any address modifier • The second source operand which is typically a register ‘Ws’ with or without an address modifier • The destination of the result which is typically a register ‘Wd’ with or without an address modifier However, word or byte-oriented file register instructions have two operands: • The file register specified by the value ‘f’ • The destination, which could either be the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ © 2007 Microchip Technology Inc. Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value or indirectly by the contents of register ‘Wb’) The literal instructions that involve data movement may use some of the following operands: • A literal value to be loaded into a W register or file register (specified by the value of ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand which is a register ‘Wb’ without any address modifier • The second source operand which is a literal value • The destination of the result (only if not the same as the first source operand) which is typically a register ‘Wd’ with or without an address modifier The MAC class of DSP instructions may use some of the following operands: • The accumulator (A or B) to be used (required operand) • The W registers to be used as the two operands • The X and Y address space prefetch operations • The X and Y address space prefetch destinations • The accumulator write back destination The other DSP instructions do not involve any multiplication, and may include: • The accumulator to be used (required) • The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier • The amount of shift specified by a W register ‘Wn’ or a literal value The control instructions may use some of the following operands: • A program memory address • The mode of the table read and table write instructions DS70116G-page 155 dsPIC30F5011/5013 All instructions are a single word, except for certain double word instructions, which were made double word instructions so that all the required information is available in these 48 bits. In the second word, the 8 Most Significant bits are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes, and RETURN/RETFIE instructions, TABLE 21-1: which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or twoword instruction. Moreover, double word moves require two cycles. The double word instructions execute in two instruction cycles. Note: For more details on the instruction set, refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157). SYMBOLS USED IN OPCODE DESCRIPTIONS Field #text Description Means literal defined by “text” (text) Means “content of text” [text] Means “the location addressed by text” { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register ∈ {W13, [W13]+=2} bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15} C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address ∈ {0x0000...0x1FFF} lit1 1-bit unsigned literal ∈ {0,1} lit4 4-bit unsigned literal ∈ {0...15} lit5 5-bit unsigned literal ∈ {0...31} lit8 8-bit unsigned literal ∈ {0...255} lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal ∈ {0...16384} lit16 16-bit unsigned literal ∈ {0...65535} lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0 None Field does not require an entry, may be blank OA, OB, SA, SB DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate PC Program Counter Slit10 10-bit signed literal ∈ {-512...511} Slit16 16-bit signed literal ∈ {-32768...32767} Slit6 6-bit signed literal ∈ {-16...16} DS70116G-page 156 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wb Base W register ∈ {W0..W15} Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register ∈ { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈ {W4*W4,W5*W5,W6*W6,W7*W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈ {W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7} Wn One of 16 working registers ∈ {W0..W15} Wnd One of 16 destination working registers ∈ {W0..W15} Wns One of 16 source working registers ∈ {W0..W15} WREG W0 (working register used in file register instructions) Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register ∈ { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space prefetch address register for DSP instructions ∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2, [W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2, [W9+W12],none} Wxd X data space prefetch destination register for DSP instructions ∈ {W4..W7} Wy Y data space prefetch address register for DSP instructions ∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2, [W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2, [W11+W12], none} Wyd Y data space prefetch destination register for DSP instructions ∈ {W4..W7} © 2007 Microchip Technology Inc. DS70116G-page 157 dsPIC30F5011/5013 TABLE 21-2: Base Instr # 1 2 3 4 5 6 INSTRUCTION SET OVERVIEW Assembly Mnemonic ADD ADDC AND ASR BCLR BRA 7 BSET 8 BSW Assembly Syntax Description # of # of Words Cycles Status Flags Affected ADD Acc Add Accumulators 1 1 ADD f f = f + WREG 1 1 OA,OB,SA,SB C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None DS70116G-page 158 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 21-2: Base Instr # 9 10 11 12 13 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic BTG BTSC BTSS BTST BTSTS 14 CALL 15 CLR Assembly Syntax Description # of # of Words Cycles Status Flags Affected BTG f,#bit4 Bit Toggle f 1 1 BTG Ws,#bit4 Bit Toggle Ws 1 1 None None BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB 16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep 17 COM COM f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb - Ws - C) 1 1 C,DC,N,OV,Z 18 19 20 CP CP0 CPB 21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠ 1 1 (2 or 3) None 25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 26 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z DEC2 f f = f -2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 27 28 DEC2 DISI © 2007 Microchip Technology Inc. DS70116G-page 159 dsPIC30F5011/5013 TABLE 21-2: Base Instr # 29 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic DIV Assembly Syntax Description # of # of Words Cycles Status Flags Affected DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV None 30 DIVF DIVF 31 DO DO #lit14,Expr Do code to PC+Expr, lit14+1 times 2 2 DO Wn,Expr Do code to PC+Expr, (Wn)+1 times 2 2 None 32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB None 34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 38 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None 39 INC INC f f=f+1 1 1 C,DC,N,OV,Z 40 41 42 INC2 IOR LAC INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 43 LNK LNK #lit14 Link frame pointer 1 1 None 44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB None 45 46 47 MAC MOV MOVSAC MOV f,Wn Move f to Wn 1 1 MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N,Z MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None Prefetch and store accumulator 1 1 None MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB DS70116G-page 160 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 21-2: Base Instr # 48 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic MPY Assembly Syntax Description # of # of Words Cycles Status Flags Affected MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB Wm*Wn,Acc,Wx,Wxd,Wy,Wyd 49 MPY.N MPY.N -(Multiply Wm by Wn) to Accumulator 1 1 None 50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 51 MUL 52 53 54 NEG NOP POP MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z NOP No Operation 1 1 None NOPR No Operation 1 1 None POP f Pop f from Top-of-Stack (TOS) 1 1 None POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd+1) 1 2 None Pop Shadow Registers 1 1 All Push f to Top-of-Stack (TOS) 1 1 None None POP.S 55 PUSH PUSH f PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 PUSH.D Wns Push W(ns):W(ns+1) to Top-of-Stack (TOS) 1 2 None Push Shadow Registers 1 1 None PUSH.S 56 PWRSAV PWRSAV Go into Sleep or Idle mode 1 1 WDTO,Sleep 57 RCALL RCALL Expr #lit1 Relative Call 1 2 None RCALL Wn Computed Call 1 2 None Repeat Next Instruction lit14+1 times 1 1 None 58 REPEAT REPEAT #lit14 REPEAT Wn 59 RESET RESET Repeat Next Instruction (Wn)+1 times 1 1 None Software device Reset 1 1 None 60 RETFIE RETFIE 61 RETLW RETLW 62 RETURN RETURN 63 RLC RLC f RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z 64 65 66 RLNC RRC RRNC #lit10,Wn Return from interrupt 1 3 (2) None Return with literal in Wn 1 3 (2) None Return from Subroutine 1 3 (2) None f = Rotate Left through Carry f 1 1 C,N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z RRNC f f = Rotate Right (No Carry) f 1 1 N,Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z © 2007 Microchip Technology Inc. DS70116G-page 161 dsPIC30F5011/5013 TABLE 21-2: Base Instr # 67 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic SAC Assembly Syntax Description # of # of Words Cycles Status Flags Affected SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None 68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z 69 SETM SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB 70 71 72 73 74 75 SFTAC SL SUB SUBB SUBR SUBBR SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f - WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 SUBR f f = WREG - f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 80 TBLWTL TBLWTL Ws,Wd 81 ULNK ULNK 82 XOR 76 77 83 SWAP ZE Write Ws to Prog<15:0> 1 2 None Unlink frame pointer 1 1 None N,Z XOR f f = f .XOR. WREG 1 1 XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N DS70116G-page 162 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 22.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 22.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2007 Microchip Technology Inc. DS70116G-page 163 dsPIC30F5011/5013 22.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 22.5 MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 22.6 22.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 family of microcontrollers and the dsPIC30, dsPIC33 and PIC24 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 22.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS70116G-page 164 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 22.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 22.8 MPLAB ICE 4000 High-Performance In-Circuit Emulator The MPLAB ICE 4000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for high-end PIC MCUs and dsPIC DSCs. Software control of the MPLAB ICE 4000 In-Circuit Emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. 22.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 22.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. The MPLAB ICE 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, and up to 2 Mb of emulation memory. The MPLAB ICE 4000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. © 2007 Microchip Technology Inc. DS70116G-page 165 dsPIC30F5011/5013 22.11 PICSTART Plus Development Programmer 22.13 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. 22.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. DS70116G-page 166 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. © 2007 Microchip Technology Inc. dsPIC30F5011/5013 23.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. For detailed information about the dsPIC30F architecture and core, refer to “dsPIC30F Family Reference Manual” (DS70046). Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD and MCLR) (1) ............................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V Voltage on MCLR with respect to VSS ....................................................................................................... 0V to +13.25V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin (2) ..........................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports (2) ..............................................................................................................200 mA Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather than pulling this pin directly to VSS. Maximum allowable current is a function of device maximum power dissipation. See Table 23-2 for PDMAX. Note 1: 2: †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: 23.1 All peripheral electrical characteristics are specified. For exact peripherals available on specific devices, please refer the Family Cross Reference Table. DC Characteristics TABLE 23-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temp Range dsPIC30F501X-30I dsPIC30F501X-20I dsPIC30F501X-20E 30 20 — 4.75-5.5V -40°C to 85°C 4.75-5.5V -40°C to 125°C — — 20 3.0-3.6V -40°C to 85°C 15 10 — 3.0-3.6V -40°C to 125°C — — 10 2.5-3.0V -40°C to 85°C 7.5 7.5 — © 2007 Microchip Technology Inc. DS70116G-page 167 dsPIC30F5011/5013 TABLE 23-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Operating Junction Temperature Range TJ -40 — +125 °C Operating Ambient Temperature Range TA -40 — +85 °C Operating Junction Temperature Range TJ -40 — +150 °C Operating Ambient Temperature Range TA -40 — +85 °C Operating Junction Temperature Range TJ -40 — +150 °C Operating Ambient Temperature Range TA -40 — +125 °C dsPIC30F501x-30I dsPIC30F501x-20I dsPIC30F501x-20E Power Dissipation: Internal chip power dissipation: P INT = V D D × ( ID D –∑ I O H) PD PINT + PI/O W PDMAX (TJ - TA) / θJA W I/O Pin power dissipation: P I/O = ∑ ( { V D D – V O H } × IOH ) + ∑ ( V O L × I O L ) Maximum Allowed Power Dissipation TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol θJA θJA Package Thermal Resistance, 64-pin TQFP (10x10x1mm) Package Thermal Resistance, 80-pin TQFP (12x12x1mm) Note 1: Max Unit Notes 39 — °C/W 1 39 — °C/W 1 Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations. TABLE 23-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. Typ Symbol Characteristic Min Typ(1) Max Units 2.5 — 5.5 V Industrial temperature 3.0 — 5.5 V Extended temperature Conditions Operating Voltage(2) DC10 VDD Supply Voltage DC11 VDD Supply Voltage Voltage(3) DC12 VDR RAM Data Retention — 1.5 — V DC16 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V DC17 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — Note 1: 2: 3: V/ms 0-5V in 0.1 sec 0-3V in 60 ms Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. This is the limit to which VDD can be lowered without losing RAM data. DS70116G-page 168 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC30a 7.3 11 mA 25°C DC30b 7.5 11.2 mA 85°C DC30c 7.6 11.4 mA 125°C DC30e 12.9 19.2 mA 25°C DC30f 12.8 19.1 mA 85°C DC30g 12.8 19.1 mA 125°C DC31a 1.9 2.8 mA 25°C DC31b 2.0 3 mA 85°C DC31c 2.0 3 mA 125°C DC31e 4.1 6.1 mA 25°C DC31f 4.0 6 mA 85°C DC31g 3.8 5.7 mA 125°C DC23a 13.5 20 mA 25°C DC23b 14 21 mA 85°C DC23c 15 22.5 mA 125°C DC23e 23 34.5 mA 25°C DC23f 23.5 35 mA 85°C DC23g 24 36 mA 125°C DC24a 32 48 mA 25°C DC24b 32.5 49 mA 85°C DC24c 33 49.5 mA 125°C DC24e 53.5 80 mA 25°C DC24f 54 81 mA 85°C DC24g 54 81 mA 125°C DC27a 60 90 mA 25°C DC27b 61 91.5 mA 85°C DC27d 101 152 mA 25°C DC27e 100 150 mA 85°C DC27f 100 150 mA 125°C DC29a 145 217 mA 25°C DC29b 144 216 mA 85°C Note 1: 2: 3.3V FRC (-2 MIPS) 5V 3.3V LPRC (-512 lHz) 5V 3.3V 4 MIPS 5V 3.3V 10 MIPS 5V 3.3V 20 MIPS 5V 5V 30 MIPS Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. © 2007 Microchip Technology Inc. DS70116G-page 169 dsPIC30F5011/5013 TABLE 23-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1,2) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC50a 4.8 7.2 mA 25°C DC50b 4.9 7.3 mA 85°C DC50c 5.0 7.5 mA 125°C DC50e 8.9 13.3 mA 25°C DC50f 8.8 13.2 mA 85°C DC50g 8.8 13.2 mA 125°C DC51a 1.6 2.4 mA 25°C DC51b 1.62 2.43 mA 85°C DC51c 1.62 2.43 mA 125°C DC51e 3.65 5.47 mA 25°C DC51f 3.4 5.1 mA 85°C DC51g 3.3 4.95 mA 125°C DC43a 8.5 12.75 mA 25°C DC43b 8.7 13 mA 85°C DC43c 9.6 14.4 mA 125°C DC43e 15.2 22.8 mA 25°C DC43f 15.2 22.8 mA 85°C DC43g 15.2 22.8 mA 125°C DC44a 19.9 29.8 mA 25°C DC44b 20.2 30.3 mA 85°C DC44c 20.5 30.7 mA 125°C DC44e 33.4 50 mA 25°C DC44f 33.7 50.5 mA 85°C DC44g 34 51 mA 125°C DC47a 37.4 56 mA 25°C DC47b 38 57 mA 85°C DC47d 62.3 93.4 mA 25°C DC47e 62.9 94.3 mA 85°C DC47f 63.5 95.2 mA 125°C DC49a 90.8 136 mA 25°C DC49b 91 137 mA 85°C Note 1: 2: 3.3V FRC (~2MIPS) 5V 3.3V LPRC (~512 kHz) 5V 3.3V 4 MIPS EC mode, 4X PLL 5V 3.3V 10 MIPS EC mode, 4X PLL 5V 3.3V 20 MIPS EC mode, 8X PLL 5V 5V 30 MIPS EC mode,16X PLL Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with core off, clock on and all modules turned off. DS70116G-page 170 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units 25 μA Conditions Power Down Current (IPD)(2) DC60a 5 25°C DC60b 8 40 μA 85°C DC60c 14 70 μA 125°C DC60e 8 40 μA 25°C DC60f 12 55 μA 85°C DC60g 20 100 μA 125°C DC61a 7.8 12 μA 25°C DC61b 7.9 12 μA 85°C DC61c 8.4 13 μA 125°C DC61e 15.4 23.1 μA 25°C DC61f 14.7 22 μA 85°C DC61g 14.1 21.1 μA 125°C DC62a 3.8 6 μA 25°C DC62b — — μA 85°C DC62c — — μA 125°C DC62e 5.5 10 μA 25°C DC62f — — μA 85°C DC62g — — μA 125°C DC63a 31.5 47.2 μA 25°C DC63b 34.4 51.5 μA 85°C DC63c 36.5 55 μA 125°C DC63e 36.5 54.7 μA 25°C DC63f 39.1 58.7 μA 85°C DC63g 40.5 61 μA 125°C DC66a 19.6 29.4 μA 25°C DC66b 21.5 32.3 μA 85°C DC66c 23 34.5 μA 125°C DC66e 24 36 μA 25°C DC66f 25.5 38.3 μA 85°C 26.2 39 μA 125°C DC66g Note 1: 2: 3: 3.3V Base Power Down Current(3) 5V 3.3V Watchdog Timer Current: ΔIWDT(3) 5V 3.3V Timer 1 w/32 kHz Crystal: ΔITI32(3) 5V 3.3V BOR On: ΔIBOR(3) 5V 3.3V Low-Voltage Detect: ΔILVD(3) 5V Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. © 2007 Microchip Technology Inc. DS70116G-page 171 dsPIC30F5011/5013 TABLE 23-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. VIL Characteristic Min Typ(1) Max Units Conditions Input Low Voltage(2) DI10 I/O pins: with Schmitt Trigger buffer VSS — 0.2 VDD V DI15 MCLR VSS — 0.2 VDD V DI16 OSC1 (in XT, HS and LP modes) VSS — 0.2 VDD V DI17 OSC1 (in RC mode)(3) VSS — 0.3 VDD V DI18 SDA, SCL VSS — 0.3 VDD V SM bus disabled DI19 SDA, SCL VSS — 0.2 VDD V SM bus enabled I/O pins: with Schmitt Trigger buffer 0.8 VDD — VDD V DI25 MCLR 0.8 VDD — VDD V DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD — VDD V VIH DI20 Input High Voltage (2) mode)(3) DI27 OSC1 (in RC 0.9 VDD — VDD V DI28 SDA, SCL 0.7 VDD — VDD V SM bus disabled SDA, SCL VDD — VDD V SM bus enabled 50 250 400 μA VDD = 5V, VPIN = VSS DI29 0.8 Current(2) ICNPU CNXX Pull-up IIL Input Leakage Current(2)(4)(5) DI30 DI50 I/O ports — 0.01 ±1 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI51 Analog input pins — 0.50 — μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI55 MCLR — 0.05 ±5 μA VSS ≤ VPIN ≤ VDD DI56 OSC1 — 0.05 ±5 μA VSS ≤ VPIN ≤ VDD, XT, HS and LP Osc mode Note 1: 2: 3: 4: 5: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that the dsPIC30F device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. DS70116G-page 172 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. VOL Characteristic Min Typ(1) Max Units — 0.6 V IOL = 8.5 mA, VDD = 5V Conditions Output Low Voltage(2) DO10 I/O ports — — — TBD V IOL = 2.0 mA, VDD = 3V DO16 OSC2/CLKOUT — — 0.6 V IOL = 1.6 mA, VDD = 5V (RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V VOH DO20 Output High Voltage(2) I/O ports DO26 OSC2/CLKOUT (RC or EC Osc mode) VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V 15 pF In XTL, XT, HS and LP modes when external clock is used to drive OSC1. Capacitive Loading Specs on Output Pins(2) DO50 COSC2 OSC2/SOSC2 pin — — DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode DO58 CB SCL, SDA — — 400 pF In I2C mode Note 1: 2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. FIGURE 23-1: LOW-VOLTAGE DETECT CHARACTERISTICS VDD LV10 LVDIF (LVDIF set by hardware) © 2007 Microchip Technology Inc. DS70116G-page 173 dsPIC30F5011/5013 TABLE 23-10: ELECTRICAL CHARACTERISTICS: LVDL Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. LV10 Characteristic(1) Min Typ Max Units LVDL Voltage on VDD transition LVDL = 0000(2) high to low — — — V LVDL = 0001(2) — — — V LVDL = 0010(2) — — — V (2) — — — V LVDL = 0100 2.50 — 2.65 V LVDL = 0101 2.70 — 2.86 V LVDL = 0110 2.80 — 2.97 V LVDL = 0111 3.00 — 3.18 V LVDL = 1000 3.30 — 3.50 V LVDL = 1001 3.50 — 3.71 V LVDL = 1010 3.60 — 3.82 V LVDL = 1011 3.80 — 4.03 V LVDL = 1100 4.00 — 4.24 V LVDL = 1101 4.20 — 4.45 V LVDL = 1110 4.50 — 4.77 V LVDL = 1111 — — — V Symbol VPLVD LVDL = 0011 LV15 Note 1: 2: VLVDIN External LVD input pin threshold voltage Conditions These parameters are characterized but not tested in manufacturing. These values not in usable operating range. FIGURE 23-2: BROWN-OUT RESET CHARACTERISTICS VDD BO10 (Device in Brown-out Reset) BO15 (Device not in Brown-out Reset) RESET (due to BOR) Power-Up Time-out DS70116G-page 174 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-11: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. BO10 Symbol VBOR Min Typ(1) Max Units BORV = 11(3) — — — V BORV = 10 2.60 — 2.71 V BORV = 01 4.10 — 4.40 V BORV = 00 4.58 — 4.73 V — 5 — mV Characteristic BOR Voltage(2) on VDD transition high to low Conditions Not in operating range BO15 VBHYS Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. 11 values not in usable operating range. 2: 3: TABLE 23-12: DC CHARACTERISTICS: PROGRAM AND EEPROM Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units Conditions Data EEPROM Memory(2) -40°C ≤ TA ≤ +85°C D120 ED Byte Endurance 100K 1M — E/W D121 VDRW VDD for Read/Write VMIN — 5.5 V D122 TDEW Erase/Write Cycle Time — 2 — ms D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are violated D124 IDEW IDD During Programming — 10 30 mA Row Erase -40°C ≤ TA ≤ +85°C Using EECON to read/write VMIN = Minimum operating voltage Program FLASH Memory(2) D130 EP Cell Endurance 10K 100K — E/W D131 VPR VDD for Read VMIN — 5.5 V D132 VEB VDD for Bulk Erase 4.5 — 5.5 V D133 VPEW VDD for Erase/Write 3.0 — 5.5 V D134 TPEW Erase/Write Cycle Time — 2 — ms D135 TRETD Characteristic Retention 40 100 — Year D136 TEB ICSP Block Erase Time — 4 — ms D137 IPEW IDD During Programming — 10 30 mA Row Erase D138 IEB IDD During Programming — 10 30 mA Bulk Erase Note 1: 2: VMIN = Minimum operating voltage Provided no other specifications are violated Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are characterized but not tested in manufacturing. © 2007 Microchip Technology Inc. DS70116G-page 175 dsPIC30F5011/5013 23.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC30F AC characteristics and timing parameters. TABLE 23-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Operating voltage VDD range as described in DC Spec Section 23.0. AC CHARACTERISTICS FIGURE 23-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 Ω CL = 50 pF for all pins except OSC2 VSS FIGURE 23-4: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 OS20 OS30 OS25 OS30 OS31 OS31 CLKOUT OS40 DS70116G-page 176 OS41 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-14: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. OS10 FOSC Characteristic Min Typ(1) Max Units External CLKIN Frequency(2) (External clocks allowed only in EC mode) DC 4 4 4 — — — — 40 10 10 7.5 MHz MHz MHz MHz EC EC with 4x PLL EC with 8x PLL EC with 16x PLL Oscillator Frequency(2) DC 0.4 4 4 4 4 10 — — — — — — — — 32.768 4 4 10 10 10 7.5 25 — MHz MHz MHz MHz MHz MHz MHz kHz RC XTL XT XT with 4x PLL XT with 8x PLL XT with 16x PLL HS LP Conditions OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10 for FOSC value OS25 TCY Instruction Cycle Time(2)(3) 33 — DC ns See Table 23-17 (2) OS30 TosL, TosH External Clock in (OSC1) High or Low Time .45 x TOSC — — ns EC OS31 TosR, TosF External Clock(2) in (OSC1) Rise or Fall Time — — 20 ns EC OS40 TckR CLKOUT Rise Time(2)(4) — — — ns See parameter D031 — — — ns See parameter D032 OS41 TckF Note 1: 2: 3: 4: CLKOUT Fall Time (2)(4) Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “Min” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “Max” cycle time limit is “DC” (no clock) for all devices. Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin. CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY). © 2007 Microchip Technology Inc. DS70116G-page 177 dsPIC30F5011/5013 TABLE 23-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. OS50 Characteristic(1) Symbol PLL Input Frequency Range(2) FPLLI (2) OS51 FSYS On-Chip PLL Output OS52 TLOC PLL Start-up Time (Lock Time) Note 1: 2: Min Typ(2) Max 4 — 10 MHz EC, XT, FRC modes with PLL 16 — 120 MHz EC, XT, FRC modes with PLL — 20 50 Units Conditions μs These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 23-16: PLL JITTER AC CHARACTERISTICS Param No. Characteristic Min Typ(1) Max Units x4 PLL — 0.251 0.413 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V — 0.251 0.413 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V — 0.256 0.47 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.256 0.47 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V — 0.355 0.584 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V ≤ +125°C VDD = 3.0 to 3.6V OS61 x8 PLL x16 PLL Note 1: Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Conditions — 0.355 0.584 % -40°C ≤ — 0.362 0.664 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.362 0.664 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V — 0.67 0.92 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V TA — 0.632 0.956 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.632 0.956 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V These parameters are characterized but not tested in manufacturing. DS70116G-page 178 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-17: INTERNAL CLOCK TIMING EXAMPLES Clock Oscillator Mode FOSC (MHz)(1) TCY (μsec)(2) MIPS(3) w/o PLL MIPS(3) w PLL x4 MIPS(3) w PLL x8 MIPS(3) w PLL x16 EC 0.200 20.0 0.05 — — — XT Note 1: 2: 3: 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 — 25 0.16 6.25 — — — 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 — Assumption: Oscillator Postscaler is divide by 1. Instruction Execution Cycle Time: TCY = 1 / MIPS. Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction cycle]. TABLE 23-18: AC CHARACTERISTICS: INTERNAL FRC JITTER ACCURACY AND DRIFT(1) AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Internal FRC Jitter @ FRC Freq. = 7.37 MHz(2) OS62 FRC FRC with 4x PLL FRC with 8x PLL FRC with 16x PLL — +0.04 +0.16 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V — +0.07 +0.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V — +0.31 +0.62 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V — +0.34 +0.77 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V — +0.44 +0.87 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V — +0.48 +1.08 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V — +0.71 +1.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V % -40°C ≤ TA ≤ +125°C VDD = 3.0-5.5V Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(2) OS63 FRC — — +1.50 Internal FRC Drift @ FRC Freq. = 7.37 MHz(2) OS64 Note 1: 2: -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V -0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V -0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift percentages. Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN bits (OSCCON<3:0>)can be used to compensate for temperature drift. © 2007 Microchip Technology Inc. DS70116G-page 179 dsPIC30F5011/5013 TABLE 23-19: INTERNAL LPRC ACCURACY Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic Min Typ Max Units Conditions -20 — +40 % — LPRC @ Freq. = 512 kHz(1) OS65 Note 1: Change of LPRC frequency as VDD changes. FIGURE 23-5: CLKOUT AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 23-3 for load conditions. TABLE 23-20: CLKOUT AND I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions DO31 TIOR Port output rise time — 7 20 ns — DO32 TIOF Port output fall time — 7 20 ns — DI35 TINP INTx pin high or low time (output) 20 — — ns — DI40 TRBP CNx high or low time (input) 2 TCY — — ns — Note 1: 2: 3: 4: These parameters are asynchronous events not related to any internal clock edges. Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC. These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. DS70116G-page 180 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-6: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR SY11 PWRT Time-out OSC Time-out SY30 Internal RESET Watchdog Timer RESET SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 23-3 for load conditions. © 2007 Microchip Technology Inc. DS70116G-page 181 dsPIC30F5011/5013 TABLE 23-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C SY11 TPWRT Power-up Timer Period 3 12 50 4 16 64 6 22 90 ms -40°C to +85°C User programmable SY12 TPOR Power-on Reset Delay 3 10 30 μs -40°C to +85°C SY13 TIOZ I/O High-impedance from MCLR Low or Watchdog Timer Reset — 0.8 1.0 μs SY20 TWDT1 Watchdog Timer Time-out Period (No Prescaler) 1.6 2.2 3.0 ms VDD = 5V, -40°C to +85°C 1.7 2.2 3.1 ms VDD = 3V, -40°C to +85°C 100 — — μs VDD ≤ VBOR (D034) TWDT2 SY25 TBOR Brown-out Reset Pulse Width(3) SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay — 500 900 μs -40°C to +85°C Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Refer to Figure 23-2 and Table 23-11 for BOR. DS70116G-page 182 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-7: BAND GAP START-UP TIME CHARACTERISTICS VBGAP 0V Enable Band Gap (see Note) Band Gap Stable SY40 Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set. TABLE 23-22: BAND GAP START-UP TIME REQUIREMENTS AC CHARACTERISTICS Param No. SY40 Note 1: 2: Symbol TBGAP Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Typ(2) Max Units Conditions Band Gap Start-up Time — 40 65 µs Defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. RCON<13> Status bit These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. © 2007 Microchip Technology Inc. DS70116G-page 183 dsPIC30F5011/5013 FIGURE 23-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx11 Tx10 Tx15 Tx20 OS60 TMRX Note: Refer to Figure 23-3 for load conditions. TABLE 23-23: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TA10 TA11 TA15 Symbol TTXH TTXL TTXP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TA15 Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns TCY + 10 — — ns Synchronous, with prescaler Greater of: 20 ns or (TCY + 40)/N — — — Asynchronous 20 — — ns DC — 50 kHz 1.5 TCY — TxCK Input Period Synchronous, no prescaler OS60 Ft1 TA20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Note: SOSC1/T1CK oscillator input frequency range (oscillator enabled by setting bit TCS (T1CON, bit 1)) 0.5 TCY Must also meet parameter TA15 N = prescale value (1, 8, 64, 256) Timer1 is a Type A. DS70116G-page 184 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-24: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TB10 TB11 TB15 Symbol TtxH TtxL TtxP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TB15 Synchronous, with prescaler 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns TCY + 10 — — ns 1.5 TCY — TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler TB20 TCKEXTMRL Note: Delay from External TxCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 0.5 TCY Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) Timer2 and Timer4 are Type B. TABLE 23-25: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ Max Units Conditions TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, no prescaler TCY + 10 — — ns N = prescale value (1, 8, 64, 256) 1.5 TCY — Synchronous, with prescaler TC20 TCKEXTMRL Note: Delay from External TxCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 0.5 TCY Timer3 and Timer5 are Type C. © 2007 Microchip Technology Inc. DS70116G-page 185 dsPIC30F5011/5013 FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICX IC10 IC11 IC15 Note: Refer to Figure 23-3 for load conditions. TABLE 23-26: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period Characteristic(1) No Prescaler With Prescaler No Prescaler With Prescaler Note 1: Min Max Units 0.5 TCY + 20 — ns 10 — ns 0.5 TCY + 20 — ns 10 — ns (2 TCY + 40)/N — ns Conditions N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. DS70116G-page 186 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 23-3 for load conditions. TABLE 23-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ(2) Max Units Conditions OC10 TccF OCx Output Fall Time — — — ns See Parameter D032 OC11 TccR OCx Output Rise Time — — — ns See Parameter D031 Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS70116G-page 187 dsPIC30F5011/5013 FIGURE 23-11: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx TABLE 23-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions OC15 TFD Fault Input to PWM I/O Change — — 50 ns — OC20 TFLT Fault Input Pulse Width 50 — — ns — Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70116G-page 188 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-12: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS CSCK (SCKE = 0) CS11 CS10 CS21 CS20 CS20 CS21 CSCK (SCKE = 1) COFS CS55 CS56 CS35 CS51 CSDO HIGH-Z 70 CS50 LSb MSb CS30 CSDI MSb IN HIGH-Z CS31 LSb IN CS40 CS41 Note: Refer to Figure 23-3 for load conditions. © 2007 Microchip Technology Inc. DS70116G-page 189 dsPIC30F5011/5013 TABLE 23-29: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. CS10 Symbol TcSCKL Characteristic(1) Min Typ(2) Max Units Conditions TCY / 2 + 20 — — ns — 30 — — ns — TCY / 2 + 20 — — ns — CSCK Output High Time(3) (CSCK pin is an output) 30 — — ns — CSCK Input Low Time (CSCK pin is an input) CSCK Output Low Time(3) (CSCK pin is an output) CS11 TcSCKH CSCK Input High Time (CSCK pin is an input) CS20 TcSCKF CSCK Output Fall Time(4) (CSCK pin is an output) — 10 25 ns — CS21 TcSCKR CSCK Output Rise Time(4) (CSCK pin is an output) — 10 25 ns — CS30 TcSDOF CSDO Data Output Fall Time(4) — 10 25 ns — CS31 TcSDOR CSDO Data Output Rise Time(4) — 10 25 ns — CS35 TDV Clock edge to CSDO data valid — — 10 ns — CS36 TDIV Clock edge to CSDO tri-stated 10 — 20 ns — CS40 TCSDI Setup time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 — — ns — CS41 THCSDI Hold time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 — — ns — CS50 TcoFSF COFS Fall Time (COFS pin is output) — 10 25 ns Note 1 CS51 TcoFSR COFS Rise Time (COFS pin is output) — 10 25 ns Note 1 CS55 TscoFS Setup time of COFS data input to CSCK edge (COFS pin is input) 20 — — ns — CS56 THCOFS Hold time of COFS data input to CSCK edge (COFS pin is input) 20 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all DCI pins. DS70116G-page 190 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-13: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS BIT_CLK (CSCK) CS61 CS60 CS62 CS21 CS20 CS71 CS70 CS72 SYNC (COFS) CS75 CS76 CS80 SDO (CSDO) MSb LSb LSb CS76 CS75 MSb IN SDI (CSDI) CS65 CS66 TABLE 23-30: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions ns — CS60 TBCLKL BIT_CLK Low Time 36 40.7 45 CS61 TBCLKH BIT_CLK High Time 36 40.7 45 ns CS62 TBCLK BIT_CLK Period — 81.4 — ns CS65 TSACL Input Setup Time to Falling Edge of BIT_CLK — — 10 ns — CS66 THACL Input Hold Time from Falling Edge of BIT_CLK — — 10 ns — CS70 TSYNCLO SYNC Data Output Low Time — 19.5 — μs Note 1 CS71 TSYNCHI SYNC Data Output High Time — 1.3 — μs Note 1 CS72 TSYNC SYNC Data Output Period — 20.8 — μs Note 1 — Bit clock is input CS75 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS77 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 3V CS78 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 3V CS80 TOVDACL Output valid delay from rising edge of BIT_CLK — — 15 ns — Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. These values assume BIT_CLK frequency is 12.288 MHz. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS70116G-page 191 dsPIC30F5011/5013 FIGURE 23-14: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 MSb SDOx BIT14 - - - - - -1 SP31 SDIx LSb SP30 MSb IN LSb IN BIT14 - - - -1 SP40 SP41 Note: Refer to Figure 23-3 for load conditions. TABLE 23-31: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns — SP11 TscH SCKX Output High Time(3) TCY/2 — — ns — — — — ns See parameter D032 Time(4 SP20 TscF SCKX Output Fall SP21 TscR SCKX Output Rise Time(4) — — — ns See parameter D031 SP30 TdoF SDOX Data Output Fall Time(4) — — — ns See parameter D032 SP31 TdoR SDOX Data Output Rise Time(4) — — — ns See parameter D031 SP35 TscH2doV, TscL2doV SDOX Data Output Valid after SCKX Edge — — 30 ns — SP40 TdiV2scH, TdiV2scL Setup Time of SDIX Data Input to SCKX Edge 20 — — ns — SP41 TscH2diL, TscL2diL Hold Time of SDIX Data Input to SCKX Edge 20 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70116G-page 192 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-15: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS SP36 SCKX (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKX (CKP = 1) SP35 BIT14 - - - - - -1 MSb SDOX SP40 SDIX LSb SP30,SP31 MSb IN BIT14 - - - -1 LSb IN SP41 Note: Refer to Figure 23-3 for load conditions. TABLE 23-32: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. SP10 Symbol TscL Characteristic(1) SCKX output low time(3) time(3) Min Typ(2) Max Units Conditions TCY / 2 — — ns — SP11 TscH SCKX output high TCY / 2 — — ns — SP20 TscF SCKX output fall time(4) — — — ns See Parameter DO32 SP21 TscR SCKX output rise time(4) — — — ns See Parameter DO31 SP30 TdoF SDOX data output fall time(4) — — — ns See Parameter DO32 SP31 TdoR SDOX data output rise time(4) — — — ns See Parameter DO31 SP35 TscH2doV SDOX data output valid after SCKX edge , TscL2doV — — 30 ns — SP36 TdoV2sc, SDOX data output setup to TdoV2scL first SCKX edge 30 — — ns — SP40 TdiV2scH, Setup time of SDIX data input TdiV2scL to SCKX edge 20 — — ns — SP41 TscH2diL, TscL2diL 20 — — ns — Note 1: 2: 3: 4: Hold time of SDIX data input to SCKX edge These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. © 2007 Microchip Technology Inc. DS70116G-page 193 dsPIC30F5011/5013 FIGURE 23-16: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX BIT14 - - - - - -1 LSb SP51 SP30,SP31 SDIX MSb IN BIT14 - - - -1 LSb IN SP41 SP40 Note: Refer to Figure 23-3 for load conditions. TABLE 23-33: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP70 TscL SCKX Input Low Time 30 — — ns — SP71 TscH SCKX Input High Time 30 — — ns — — 10 25 ns — — 10 25 ns — — — — ns See Parameter DO32 — — — ns See Parameter DO31 Time(3) SP72 TscF SCKX Input Fall SP73 TscR SCKX Input Rise Time(3) Time(3) SP30 TdoF SDOX Data Output Fall SP31 TdoR SDOX Data Output Rise Time(3) SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge — — 30 ns — SP40 TdiV2scH, TdiV2scL Setup Time of SDIX Data Input to SCKX Edge 20 — — ns — SP41 TscH2diL, TscL2diL Hold Time of SDIX Data Input to SCKX Edge 20 — — ns — SP50 TssL2scH, TssL2scL SSX↓ to SCKX↑ or SCKX↓ Input 120 — — ns — SP51 TssH2doZ SSX↑ to SDOX Output High-Impedance(3) 10 — 50 ns — SP52 TscH2ssH SSX after SCK Edge TscL2ssH 1.5 TCY +40 — — ns — Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Assumes 50 pF load on all SPI pins. DS70116G-page 194 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-17: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 SP52 MSb SDOX BIT14 - - - - - -1 LSb SP30,SP31 SDIX MSb IN BIT14 - - - -1 SP51 LSb IN SP41 SP40 Note: Refer to Figure 23-3 for load conditions. © 2007 Microchip Technology Inc. DS70116G-page 195 dsPIC30F5011/5013 TABLE 23-34: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions TscL SCKX Input Low Time 30 — — ns — SP71 TscH SCKX Input High Time 30 — — ns — SP72 TscF SCKX Input Fall Time(3) — 10 25 ns — SP70 (3) SP73 TscR SCKX Input Rise Time — 10 25 ns — SP30 TdoF SDOX Data Output Fall Time(3) — — — ns See parameter D032 SP31 TdoR SDOX Data Output Rise Time(3) — — — ns See parameter D031 SP35 TscH2doV SDOX Data Output Valid after , SCKX Edge TscL2doV — — 30 ns — SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 — — ns — SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 — — ns — SP50 TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input TssL2scL 120 — — ns — SP51 TssH2doZ SS↑ to SDOX Output High-Impedance(4) 10 — 50 ns — SP52 TscH2ssH SSX↑ after SCKX Edge TscL2ssH 1.5 TCY + 40 — — ns — SP60 TssL2doV SDOX Data Output Valid after SSX Edge — — 50 ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70116G-page 196 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-18: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCL IM31 IM34 IM30 IM33 SDA Stop Condition Start Condition Note: Refer to Figure 23-3 for load conditions. FIGURE 23-19: I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCL IM11 IM26 IM10 IM25 IM33 SDA In IM40 IM40 IM45 SDA Out Note: Refer to Figure 23-3 for load conditions. © 2007 Microchip Technology Inc. DS70116G-page 197 dsPIC30F5011/5013 TABLE 23-35: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. IM10 Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — µs — 400 kHz mode TCY / 2 (BRG + 1) — µs — (2) TCY / 2 (BRG + 1) — µs — Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — µs — 400 kHz mode TCY / 2 (BRG + 1) — µs — 1 MHz mode(2) TCY / 2 (BRG + 1) — µs — Characteristic 1 MHz mode THI:SCL IM11 TF:SCL IM20 TR:SCL IM21 SDA and SCL Fall Time SDA and SCL Rise Time TSU:DAT Data Input Setup Time IM25 THD:DAT Data Input Hold Time IM26 TSU:STA IM30 Start Condition Setup Time THD:STA Start Condition Hold Time IM31 TSU:STO Stop Condition Setup Time IM33 THD:STO Stop Condition IM34 Hold Time TAA:SCL IM40 Output Valid From Clock 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) — 100 ns 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) — 300 ns 100 kHz mode 250 — ns 400 kHz mode 100 — ns 1 MHz mode(2) TBD — ns 100 kHz mode 0 — ns 400 kHz mode 0 0.9 µs 1 MHz mode(2) TBD — ns 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — ns 400 kHz mode TCY / 2 (BRG + 1) — ns 1 MHz mode(2) TCY / 2 (BRG + 1) — ns IM50 CB Note 1: 2: CB is specified to be from 10 to 400 pF — — Only relevant for repeated Start condition After this period the first clock pulse is generated — — 100 kHz mode — 3500 ns — 400 kHz mode — 1000 ns — mode(2) — — ns — 100 kHz mode 4.7 — µs Time the bus must be free before a new transmission can start 1 MHz TBF:SDA Bus Free Time IM45 CB is specified to be from 10 to 400 pF 400 kHz mode 1.3 — µs 1 MHz mode(2) TBD — µs — 400 pF Bus Capacitive Loading BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)” in the “dsPIC30F Family Reference Manual” (DS70046). Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). DS70116G-page 198 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-20: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCL IS34 IS31 IS30 IS33 SDA Stop Condition Start Condition FIGURE 23-21: I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCL IS30 IS26 IS31 IS25 IS33 SDA In IS40 IS40 IS45 SDA Out © 2007 Microchip Technology Inc. DS70116G-page 199 dsPIC30F5011/5013 TABLE 23-36: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. IS10 IS11 IS20 IS21 IS25 IS26 IS30 IS31 IS33 IS34 IS40 IS45 Symbol TLO:SCL THI:SCL TF:SCL TR:SCL TSU:DAT THD:DAT TSU:STA THD:STA TSU:STO THD:STO TAA:SCL TBF:SDA Characteristic Clock Low Time Clock High Time SDA and SCL Fall Time SDA and SCL Rise Time Data Input Setup Time Data Input Hold Time Start Condition Setup Time Start Condition Hold Time Stop Condition Setup Time Stop Condition Hold Time Output Valid From Clock Bus Free Time Min Max Units 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 1 MHz mode(1) 100 kHz mode 0.5 4.0 — — μs μs 400 kHz mode 0.6 — μs 1 MHz mode(1) 100 kHz mode 0.5 — — 300 μs ns 400 kHz mode 1 MHz mode(1) 20 + 0.1 CB — 300 100 ns ns 100 kHz mode 400 kHz mode — 20 + 0.1 CB 1000 300 ns ns 1 MHz mode(1) 100 kHz mode — 250 300 — ns ns 400 kHz mode 1 MHz mode(1) 100 100 — — ns ns 100 kHz mode 400 kHz mode 0 0 — 0.9 ns μs 1 MHz mode(1) 100 kHz mode 0 4.7 0.3 — μs μs 400 kHz mode 1 MHz mode(1) 0.6 0.25 — — μs μs 100 kHz mode 400 kHz mode 4.0 0.6 — — μs μs 1 MHz mode(1) 100 kHz mode 0.25 4.7 — — μs μs 400 kHz mode 1 MHz mode(1) 0.6 0.6 — — μs μs 100 kHz mode 400 kHz mode 4000 600 — — ns ns 1 MHz mode(1) 100 kHz mode 250 0 3500 ns ns 400 kHz mode 1 MHz mode(1) 0 0 1000 350 ns ns 100 kHz mode 400 kHz mode 4.7 1.3 — — μs μs 1 MHz mode(1) IS50 Note 1: 0.5 — μs Bus Capacitive — 400 pF Loading Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only). CB DS70116G-page 200 Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz. — Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz — CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF — — Only relevant for repeated Start condition After this period the first clock pulse is generated — — — Time the bus must be free before a new transmission can start — © 2007 Microchip Technology Inc. dsPIC30F5011/5013 FIGURE 23-22: CXTX Pin (output) CAN MODULE I/O TIMING CHARACTERISTICS New Value Old Value CA10 CA11 CXRX Pin (input) CA20 TABLE 23-37: CAN MODULE I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions CA10 TioF Port Output Fall Time — — — ns See parameter D032 CA11 TioR Port Output Rise Time — — — ns See parameter D031 CA20 Tcwf Pulse Width to Trigger CAN Wakeup Filter 500 ns — Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS70116G-page 201 dsPIC30F5011/5013 TABLE 23-38: 12-BIT A/D MODULE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD - 0.3 or 2.7 — Lesser of VDD + 0.3 or 5.5 V — AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V — Reference Inputs AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V — AD06 VREFL Reference Voltage Low AVSS — AVDD - 2.7 V — AD07 VREF Absolute Reference Voltage AVSS - 0.3 — AVDD + 0.3 V — AD08 IREF Current Drain — 150 .001 200 1 μA μA A/D operating A/D off AD10 VINH-VINL Full-Scale Input Span VREFL VREFH V See Note AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V AD12 — Leakage Current — ±0.001 ±0.610 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V Source Impedance = 2.5 kΩ AD13 — Leakage Current — ±0.001 ±0.610 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Source Impedance = 2.5 kΩ AD17 RIN Recommended Impedance of Analog Voltage Source — — 2.5K Ω AD20 Nr Resolution AD21 INL Integral Nonlinearity — — <±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD21A INL Integral Nonlinearity — — <±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22 DNL Differential Nonlinearity — — <±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD22A DNL Differential Nonlinearity — — <±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD23 GERR Gain Error +1.25 +1.5 +3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD23A GERR Gain Error +1.25 +1.5 +3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD24 EOFF Offset Error -2 -1.5 -1.25 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD24A EOFF Offset Error -2 -1.5 -1.25 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Analog Input — — DC Accuracy Note 1: 12 data bits bits The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. DS70116G-page 202 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-38: 12-BIT A/D MODULE SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. AD25 Symbol — Characteristic Monotonicity(1) Min. Typ Max. Units — — — — Conditions Guaranteed Dynamic Performance AD30 THD Total Harmonic Distortion — -71 — dB — AD31 SINAD Signal to Noise and Distortion — 68 — dB — AD32 SFDR Spurious Free Dynamic Range — 83 — dB — AD33 FNYQ Input Signal Bandwidth — — 100 kHz — AD34 ENOB Effective Number of Bits 10.95 11.1 — bits — Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. © 2007 Microchip Technology Inc. DS70116G-page 203 dsPIC30F5011/5013 FIGURE 23-23: 12-BIT A/D CONVERSION TIMING CHARACTERISTICS (ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP ch0_dischrg ch0_samp eoc AD61 AD60 TSAMP AD55 DONE ADIF ADRES(0) 1 2 3 4 5 6 7 8 9 1 – Software sets ADCON. SAMP to start sampling. 2 – Sampling starts after discharge period. TSAMP is described in the dsPIC30F Family Reference Manual, Section 18. 3 – Software clears ADCON. SAMP to start conversion. 4 – Sampling ends, conversion sequence starts. 5 – Convert bit 11. 6 – Convert bit 10. 7 – Convert bit 1. 8 – Convert bit 0. 9 – One TAD for end of conversion. DS70116G-page 204 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 TABLE 23-39: 12-BIT A/D CONVERSION TIMING REQUIREMENTS Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions 334 — ns VDD = 3-5.5V (Note 1) 1.5 1.8 μs — ns — Clock Parameters AD50 TAD A/D Clock Period AD51 TRC A/D Internal RC Oscillator Period AD55 TCONV Conversion Time AD56 FCNV Throughput Rate — — 200 ksps AD57 TSAMP Sampling Time — 1 TAD — ns AD60 TPCS Conversion Start from Sample Trigger AD61 TPSS AD62 AD63 1.2 Conversion Rate — 14 TAD VDD = VREF = 5V VDD = 3-5.5V source resistance RS = 0-2.5 kΩ Timing Parameters Note 1: — 1 TAD — ns — Sample Start from Setting Sample (SAMP) Bit 0.5 TAD — 1.5 TAD ns — TCSS Conversion Completion to Sample Start (ASAM = 1) — 0.5 TAD — ns — TDPU Time to Stabilize Analog Stage from A/D Off to A/D On — 20 — μs — Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. © 2007 Microchip Technology Inc. DS70116G-page 205 dsPIC30F5011/5013 NOTES: DS70116G-page 206 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 24.0 PACKAGING INFORMATION 24.1 Package Marking Information 64-Lead TQFP Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN dsPIC 30F5011 -30I/PT e3 07160S1 80-Lead TQFP Example XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: dsPIC 30F5013 -30I/PT e3 07160S3 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. DS70116G-page 207 dsPIC30F5011/5013 64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 N b NOTE 1 123 NOTE 2 α A c φ A2 β A1 L L1 Units Dimension Limits Number of Leads MILLIMETERS MIN N NOM MAX 64 Lead Pitch e Overall Height A – 0.50 BSC – Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.20 1.00 REF Foot Angle φ Overall Width E 12.00 BSC Overall Length D 12.00 BSC Molded Package Width E1 10.00 BSC Molded Package Length D1 10.00 BSC 0° 3.5° 7° Lead Thickness c 0.09 – 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-085B DS70116G-page 208 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 N b NOTE 1 12 3 NOTE 2 c β φ L α A A2 A1 L1 Units Dimension Limits Number of Leads MILLIMETERS MIN N NOM MAX 80 Lead Pitch e Overall Height A – 0.50 BSC – Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.20 1.00 REF Foot Angle φ Overall Width E 14.00 BSC Overall Length D 14.00 BSC Molded Package Width E1 12.00 BSC Molded Package Length D1 12.00 BSC 0° 3.5° 7° Lead Thickness c 0.09 – 0.20 Lead Width b 0.17 0.22 0.27 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-092B © 2007 Microchip Technology Inc. DS70116G-page 209 dsPIC30F5011/5013 NOTES: DS70116G-page 210 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 APPENDIX A: REVISION HISTORY Revision F (May 2006) Previous versions of this data sheet contained Advance or Preliminary Information. They were distributed with incomplete characterization data. Revision F of this document reflects the following updates: • Supported I2C Slave Addresses (see Table 15-1) • ADC Conversion Clock selection to allow 200 kHz sampling rate (see Section 19.0 “12-bit Analogto-Digital Converter (ADC) Module” • Operating Current (Idd) Specifications (see Table 23-5) • BOR voltage limits (see Table 23-11) • I/O pin Input Specifications (see Table 23-8) • Watchdog Timer time-out limits (see Table 23-21) Revision G (January 2007) This revision includes updates to the packaging diagrams. © 2007 Microchip Technology Inc. DS70116G-page 211 dsPIC30F5011/5013 NOTES: DS70116G-page 212 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 INDEX A A/D .................................................................................... 129 Aborting a Conversion .............................................. 131 ADCHS Register ....................................................... 129 ADCON1 Register..................................................... 129 ADCON2 Register..................................................... 129 ADCON3 Register..................................................... 129 ADCSSL Register ..................................................... 129 ADPCFG Register..................................................... 129 Configuring Analog Port Pins.............................. 60, 136 Connection Considerations....................................... 136 Conversion Operation ............................................... 130 Effects of a Reset...................................................... 135 Operation During CPU Idle Mode ............................. 135 Operation During CPU Sleep Mode.......................... 135 Output Formats ......................................................... 135 Power-down Modes .................................................. 135 Programming the Sample Trigger............................. 131 Register Map............................................................. 137 Result Buffer ............................................................. 130 Sampling Requirements............................................ 134 Selecting the Conversion Sequence......................... 130 AC Characteristics ............................................................ 176 Internal LPRC Accuracy............................................ 180 Load Conditions ........................................................ 176 AC Temperature and Voltage Specifications .................... 176 AC-Link Mode Operation .................................................. 126 16-bit Mode ............................................................... 126 20-bit Mode ............................................................... 127 ADC Selecting the Conversion Clock ................................ 131 ADC Conversion Speeds .................................................. 132 Address Generator Units .................................................... 35 Alternate Vector Table ........................................................ 45 Analog-to-Digital Converter. See A/D. Assembler MPASM Assembler................................................... 164 Automatic Clock Stretch...................................................... 94 During 10-bit Addressing (STREN = 1)....................... 94 During 7-bit Addressing (STREN = 1)......................... 94 Receive Mode ............................................................. 94 Transmit Mode ............................................................ 94 B Bandgap Start-up Time Requirements............................................................ 183 Timing Characteristics .............................................. 183 Barrel Shifter ....................................................................... 21 Bit-Reversed Addressing .................................................... 38 Example ...................................................................... 38 Implementation ........................................................... 38 Modifier Values Table ................................................. 39 Sequence Table (16-Entry)......................................... 39 Block Diagrams 12-bit A/D Functional ................................................ 129 16-bit Timer1 Module .................................................. 65 16-bit Timer2............................................................... 71 16-bit Timer3............................................................... 71 16-bit Timer4............................................................... 76 16-bit Timer5............................................................... 76 32-bit Timer2/3............................................................ 70 32-bit Timer4/5............................................................ 75 CAN Buffers and Protocol Engine............................. 108 © 2007 Microchip Technology Inc. DCI Module............................................................... 120 Dedicated Port Structure ............................................ 59 DSP Engine ................................................................ 18 dsPIC30F5011.............................................................. 8 dsPIC30F5013.............................................................. 9 External Power-on Reset Circuit .............................. 147 I2C .............................................................................. 92 Input Capture Mode.................................................... 79 Oscillator System...................................................... 141 Output Compare Mode ............................................... 83 Reset System ........................................................... 145 Shared Port Structure................................................. 60 SPI.............................................................................. 88 SPI Master/Slave Connection..................................... 88 UART Receiver......................................................... 100 UART Transmitter....................................................... 99 BOR Characteristics ......................................................... 175 BOR. See Brown-out Reset. Brown-out Reset Characteristics.......................................................... 174 Timing Requirements ............................................... 182 C C Compilers MPLAB C18.............................................................. 164 MPLAB C30.............................................................. 164 CAN Module ..................................................................... 107 Baud Rate Setting .................................................... 112 CAN1 Register Map.................................................. 114 CAN2 Register Map.................................................. 116 Frame Types ............................................................ 107 I/O Timing Characteristics ........................................ 201 I/O Timing Requirements.......................................... 201 Message Reception.................................................. 110 Message Transmission............................................. 111 Modes of Operation .................................................. 109 Overview................................................................... 107 CLKOUT and I/O Timing Characteristics.......................................................... 180 Requirements ........................................................... 180 Code Examples Data EEPROM Block Erase ....................................... 54 Data EEPROM Block Write ........................................ 56 Data EEPROM Read.................................................. 53 Data EEPROM Word Erase ....................................... 54 Data EEPROM Word Write ........................................ 55 Erasing a Row of Program Memory ........................... 49 Initiating a Programming Sequence ........................... 50 Loading Write Latches ................................................ 50 Code Protection ................................................................ 139 Control Registers ................................................................ 48 NVMADR .................................................................... 48 NVMADRU ................................................................. 48 NVMCON.................................................................... 48 NVMKEY .................................................................... 48 Core Architecture Overview..................................................................... 13 CPU Architecture Overview ................................................ 13 Customer Change Notification Service............................. 219 Customer Notification Service .......................................... 219 Customer Support............................................................. 219 DS70116G-page 213 dsPIC30F5011/5013 D Data Accumulators and Adder/Subtractor........................... 19 Data Space Write Saturation ...................................... 21 Overflow and Saturation ............................................. 19 Round Logic ................................................................ 20 Write Back................................................................... 20 Data Address Space ........................................................... 27 Alignment .................................................................... 30 Alignment (Figure) ...................................................... 30 Effect of Invalid Memory Accesses (Table)................. 30 MCU and DSP (MAC Class) Instructions Example .............................................................. 29 Memory Map ......................................................... 27, 28 Near Data Space ........................................................ 31 Software Stack ............................................................ 31 Spaces ........................................................................ 30 Width ........................................................................... 30 Data Converter Interface (DCI) Module ............................ 119 Data EEPROM Memory ...................................................... 53 Erasing ........................................................................ 54 Erasing, Block ............................................................. 54 Erasing, Word ............................................................. 54 Protection Against Spurious Write .............................. 57 Reading....................................................................... 53 Write Verify ................................................................. 57 Writing ......................................................................... 55 Writing, Block .............................................................. 56 Writing, Word .............................................................. 55 DC Characteristics ............................................................ 167 BOR .......................................................................... 175 Brown-out Reset ....................................................... 174 I/O Pin Output Specifications .................................... 173 Idle Current (IIDLE) .................................................... 170 Low-Voltage Detect................................................... 173 LVDL ......................................................................... 174 Operating Current (IDD)............................................. 169 Power-Down Current (IPD) ........................................ 171 Program and EEPROM............................................. 175 Temperature and Voltage Specifications .................. 168 DCI Module Bit Clock Generator................................................... 123 Buffer Alignment with Data Frames .......................... 125 Buffer Control ............................................................ 119 Buffer Data Alignment ............................................... 119 Buffer Length Control ................................................ 125 COFS Pin .................................................................. 119 CSCK Pin .................................................................. 119 CSDI Pin ................................................................... 119 CSDO Mode Bit ........................................................ 126 CSDO Pin ................................................................. 119 Data Justification Control Bit ..................................... 124 Device Frequencies for Common Codec CSCK Frequencies (Table) ....................................................... 123 Digital Loopback Mode ............................................. 126 Enable ....................................................................... 121 Frame Sync Generator ............................................. 121 Frame Sync Mode Control Bits ................................. 121 I/O Pins ..................................................................... 119 Interrupts ................................................................... 126 Introduction ............................................................... 119 Master Frame Sync Operation .................................. 121 Operation .................................................................. 121 Operation During CPU Idle Mode ............................. 126 Operation During CPU Sleep Mode .......................... 126 Receive Slot Enable Bits........................................... 124 DS70116G-page 214 Receive Status Bits................................................... 125 Register Map ............................................................ 128 Sample Clock Edge Control Bit ................................ 124 Slave Frame Sync Operation.................................... 122 Slot Enable Bits Operation with Frame Sync............ 124 Slot Status Bits ......................................................... 126 Synchronous Data Transfers .................................... 124 Timing Characteristics AC-Link Mode................................................... 191 Multichannel, I2S Modes................................... 189 Timing Requirements AC-Link Mode................................................... 191 Multichannel, I2S Modes................................... 190 Transmit Slot Enable Bits ......................................... 124 Transmit Status Bits.................................................. 125 Transmit/Receive Shift Register ............................... 119 Underflow Mode Control Bit...................................... 126 Word Size Selection Bits .......................................... 121 Development Support ....................................................... 163 Device Configuration Register Map ............................................................ 153 Device Configuration Registers FBORPOR ................................................................ 151 FBS........................................................................... 151 FGS .......................................................................... 151 FOSC........................................................................ 151 FSS........................................................................... 151 FWDT ....................................................................... 151 Device Overview................................................................... 7 Disabling the UART .......................................................... 101 Divide Support .................................................................... 16 Instructions (Table) ..................................................... 16 DSP Engine ........................................................................ 17 Multiplier ..................................................................... 19 Dual Output Compare Match Mode .................................... 84 Continuous Pulse Mode.............................................. 84 Single Pulse Mode...................................................... 84 E Electrical Characteristics .................................................. 167 AC............................................................................. 176 DC ............................................................................ 167 Enabling and Setting Up UART Setting Up Data, Parity and Stop Bit Selections ....... 101 Enabling the UART ........................................................... 101 Equations ADC Conversion Clock ............................................. 131 Baud Rate................................................................. 103 Bit Clock Frequency.................................................. 123 COFSG Period.......................................................... 121 Serial Clock Rate ........................................................ 96 Time Quantum for Clock Generation ........................ 113 Errata .................................................................................... 6 Exception Sequence Trap Sources .............................................................. 43 External Clock Timing Characteristics Type A, B and C Timer ............................................. 184 External Clock Timing Requirements ............................... 177 Type A Timer ............................................................ 184 Type B Timer ............................................................ 185 Type C Timer ............................................................ 185 External Interrupt Requests ................................................ 45 F Fast Context Saving ........................................................... 45 Flash Program Memory ...................................................... 47 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 I I/O Ports .............................................................................. 59 Parallel (PIO) .............................................................. 59 I2C 10-bit Slave Mode Operation ........................................ 93 Reception.................................................................... 94 Transmission............................................................... 94 I2C 7-bit Slave Mode Operation .......................................... 93 Reception.................................................................... 93 Transmission............................................................... 93 I2C Master Mode Operation ................................................ 95 Baud Rate Generator.................................................. 96 Clock Arbitration.......................................................... 96 Multi-Master Communication, Bus Collision and Bus Arbitration .................................................... 96 Reception.................................................................... 95 Transmission............................................................... 95 I2C Master Mode Support ................................................... 95 I2C Module .......................................................................... 91 Addresses ................................................................... 93 Bus Data Timing Characteristics Master Mode ..................................................... 197 Slave Mode ....................................................... 199 Bus Data Timing Requirements Master Mode ..................................................... 198 Slave Mode ....................................................... 200 Bus Start/Stop Bits Timing Characteristics Master Mode ..................................................... 197 Slave Mode ....................................................... 199 General Call Address Support .................................... 95 Interrupts..................................................................... 95 IPMI Support ............................................................... 95 Operating Function Description .................................. 91 Operation During CPU Sleep and Idle Modes ............ 96 Pin Configuration ........................................................ 91 Programmer’s Model................................................... 91 Register Map............................................................... 97 Registers..................................................................... 91 Slope Control .............................................................. 95 Software Controlled Clock Stretching (STREN = 1).... 94 Various Modes ............................................................ 91 I2S Mode Operation .......................................................... 127 Data Justification....................................................... 127 Frame and Data Word Length Selection................... 127 Idle Current (IIDLE) ............................................................ 170 In-Circuit Serial Programming (ICSP) ......................... 47, 139 Input Capture (CAPX) Timing Characteristics .................. 186 Input Capture Module ......................................................... 79 Interrupts..................................................................... 80 Register Map............................................................... 81 Input Capture Operation During Sleep and Idle Modes ...... 80 CPU Idle Mode............................................................ 80 CPU Sleep Mode ........................................................ 80 Input Capture Timing Requirements ................................. 186 Input Change Notification Module ....................................... 63 dsPIC30F5011 Register Map (Bits 15-8) .................... 63 dsPIC30F5011 Register Map (Bits 7-0) ...................... 63 dsPIC30F5013 Register Map (Bits 15-8) .................... 63 dsPIC30F5013 Register Map (Bits 7-0) ...................... 63 Instruction Addressing Modes............................................. 35 File Register Instructions ............................................ 35 Fundamental Modes Supported.................................. 35 MAC Instructions......................................................... 36 MCU Instructions ........................................................ 35 Move and Accumulator Instructions............................ 36 Other Instructions........................................................ 36 © 2007 Microchip Technology Inc. Instruction Set Overview................................................................... 158 Summary .................................................................. 155 Internal Clock Timing Examples ....................................... 178 Internet Address ............................................................... 219 Interrupt Controller Register Map .............................................................. 46 Interrupt Priority .................................................................. 42 Traps .......................................................................... 43 Interrupt Sequence ............................................................. 45 Interrupt Stack Frame................................................. 45 Interrupts ............................................................................ 41 L Load Conditions................................................................ 176 Low Voltage Detect (LVD) ................................................ 150 Low-Voltage Detect Characteristics.................................. 173 LVDL Characteristics ........................................................ 174 M Memory Organization ......................................................... 23 Core Register Map ..................................................... 32 Microchip Internet Web Site.............................................. 219 Modes of Operation Disable...................................................................... 109 Initialization............................................................... 109 Listen All Messages.................................................. 109 Listen Only................................................................ 109 Loopback .................................................................. 109 Normal Operation ..................................................... 109 Modulo Addressing ............................................................. 36 Applicability................................................................. 38 Incrementing Buffer Operation Example .................... 37 Start and End Address ............................................... 37 W Address Register Selection.................................... 37 MPLAB ASM30 Assembler, Linker, Librarian ................... 164 MPLAB ICD 2 In-Circuit Debugger ................................... 165 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator.................................................... 165 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator.................................................... 165 MPLAB Integrated Development Environment Software.. 163 MPLAB PM3 Device Programmer .................................... 165 MPLINK Object Linker/MPLIB Object Librarian ................ 164 N NVM Register Map .............................................................. 51 O OC/PWM Module Timing Characteristics ......................... 188 Operating Current (IDD) .................................................... 169 Oscillator Configurations .......................................................... 142 Fail-Safe Clock Monitor .................................... 144 Fast RC (FRC).................................................. 143 Initial Clock Source Selection ........................... 142 Low Power RC (LPRC)..................................... 143 LP Oscillator Control......................................... 142 Phase Locked Loop (PLL) ................................ 143 Start-up Timer (OST)........................................ 142 Operating Modes (Table).......................................... 140 System Overview...................................................... 139 Oscillator Selection ........................................................... 139 DS70116G-page 215 dsPIC30F5011/5013 Oscillator Start-up Timer Timing Characteristics .............................................. 181 Timing Requirements ................................................ 182 Output Compare Interrupts ................................................. 85 Output Compare Module..................................................... 83 Register Map............................................................... 86 Timing Characteristics .............................................. 187 Timing Requirements ................................................ 187 Output Compare Operation During CPU Idle Mode............ 85 Output Compare Sleep Mode Operation............................. 85 P Packaging Information ...................................................... 207 Marking ..................................................................... 207 Peripheral Module Disable (PMD) Registers .................... 152 PICSTART Plus Development Programmer ..................... 166 Pinout Descriptions ............................................................. 10 PLL Clock Timing Specifications....................................... 178 POR. See Power-on Reset. Port Write/Read Example.................................................... 60 PORTA Register Map for dsPIC30F5013 ................................ 61 PORTB Register Map for dsPIC30F5011/5013 ....................... 61 PORTC Register Map for dsPIC30F5011 ................................ 61 Register Map for dsPIC30F5013 ................................ 61 PORTD Register Map for dsPIC30F5011 ................................ 62 Register Map for dsPIC30F5013 ................................ 62 PORTF Register Map for dsPIC30F5011 ................................ 62 Register Map for dsPIC30F5013 ................................ 62 PORTG Register Map for dsPIC30F5011/5013 ....................... 62 Power Saving Modes ........................................................ 150 Idle ............................................................................ 151 Sleep ......................................................................... 150 Sleep and Idle ........................................................... 139 Power-Down Current (IPD) ................................................ 171 Power-up Timer Timing Characteristics .............................................. 181 Timing Requirements ................................................ 182 Program Address Space ..................................................... 23 Construction ................................................................ 24 Data Access from Program Memory Using Program Space Visibility ..................................... 26 Data Access From Program Memory Using Table Instructions................................................ 25 Data Access from, Address Generation...................... 24 Data Space Window into Operation ............................ 27 Data Table Access (LS Word) .................................... 25 Data Table Access (MS Byte) ..................................... 26 Memory Map ............................................................... 23 Table Instructions TBLRDH.............................................................. 25 TBLRDL .............................................................. 25 TBLWTH ............................................................. 25 TBLWTL.............................................................. 25 Program and EEPROM Characteristics ............................ 175 Program Counter................................................................. 14 Programmable................................................................... 139 Programmer’s Model........................................................... 14 Diagram ...................................................................... 15 DS70116G-page 216 Programming Operations.................................................... 49 Algorithm for Program Flash....................................... 49 Erasing a Row of Program Memory............................ 49 Initiating the Programming Sequence......................... 50 Loading Write Latches ................................................ 50 Protection Against Accidental Writes to OSCCON ........... 144 R Reader Response............................................................. 220 Reset ........................................................................ 139, 145 BOR, Programmable ................................................ 147 Brown-out Reset (BOR)............................................ 139 Oscillator Start-up Timer (OST) ................................ 139 POR Operating without FSCM and PWRT................ 147 With Long Crystal Start-up Time ...................... 147 POR (Power-on Reset)............................................. 145 Power-on Reset (POR)............................................. 139 Power-up Timer (PWRT) .......................................... 139 Reset Sequence ................................................................. 43 Reset Sources ............................................................ 43 Reset Sources Brown-out Reset (BOR).............................................. 43 Illegal Instruction Trap ................................................ 43 Trap Lockout............................................................... 43 Uninitialized W Register Trap ..................................... 43 Watchdog Time-out .................................................... 43 Reset Timing Characteristics............................................ 181 Reset Timing Requirements ............................................. 182 Run-Time Self-Programming (RTSP) ................................. 47 S Simple Capture Event Mode............................................... 79 Buffer Operation ......................................................... 80 Hall Sensor Mode ....................................................... 80 Prescaler .................................................................... 79 Timer2 and Timer3 Selection Mode............................ 80 Simple OC/PWM Mode Timing Requirements ................. 188 Simple Output Compare Match Mode ................................ 84 Simple PWM Mode ............................................................. 84 Input Pin Fault Protection ........................................... 84 Period ......................................................................... 85 Software Simulator (MPLAB SIM) .................................... 164 Software Stack Pointer, Frame Pointer .............................. 14 CALL Stack Frame ..................................................... 31 SPI Module ......................................................................... 87 Framed SPI Support ................................................... 87 Operating Function Description .................................. 87 Operation During CPU Idle Mode ............................... 89 Operation During CPU Sleep Mode............................ 89 SDOx Disable ............................................................. 87 Slave Select Synchronization ..................................... 89 SPI1 Register Map...................................................... 90 SPI2 Register Map...................................................... 90 Timing Characteristics Master Mode (CKE = 0).................................... 192 Master Mode (CKE = 1).................................... 193 Slave Mode (CKE = 1).............................. 194, 195 Timing Requirements Master Mode (CKE = 0).................................... 192 Master Mode (CKE = 1).................................... 193 Slave Mode (CKE = 0)...................................... 194 Slave Mode (CKE = 1)...................................... 196 Word and Byte Communication .................................. 87 Status Bits, Their Significance and the Initialization Condition for RCON Register, Case 1 ...................... 148 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 Status Bits, Their Significance and the Initialization Condition for RCON Register, Case 2 ...................... 149 Status Register ................................................................... 14 Symbols Used in Opcode Descriptions............................. 156 System Integration ............................................................ 139 Register Map............................................................. 153 T Table Instruction Operation Summary ................................ 47 Temperature and Voltage Specifications AC ............................................................................. 176 Timer1 Module .................................................................... 65 16-bit Asynchronous Counter Mode ........................... 65 16-bit Synchronous Counter Mode ............................. 65 16-bit Timer Mode....................................................... 65 Gate Operation ........................................................... 66 Interrupt....................................................................... 66 Operation During Sleep Mode .................................... 66 Prescaler..................................................................... 66 Real-Time Clock ......................................................... 66 Interrupts............................................................. 67 Oscillator Operation ............................................ 67 Register Map............................................................... 68 Timer2 and Timer3 Selection Mode .................................... 84 Timer2/3 Module ................................................................. 69 16-bit Timer Mode....................................................... 69 32-bit Synchronous Counter Mode ............................. 69 32-bit Timer Mode....................................................... 69 ADC Event Trigger...................................................... 72 Gate Operation ........................................................... 72 Interrupt....................................................................... 72 Operation During Sleep Mode .................................... 72 Register Map............................................................... 73 Timer Prescaler........................................................... 72 Timer4/5 Module ................................................................. 75 Register Map............................................................... 77 Timing Characteristics A/D Conversion Low-speed (ASAM = 0, SSRC = 000) .............. 204 Bandgap Start-up Time............................................. 183 CAN Module I/O........................................................ 201 CLKOUT and I/O....................................................... 180 DCI Module AC-Link Mode ................................................... 191 Multichannel, I2S Modes ................................... 189 External Clock........................................................... 176 I2C Bus Data Master Mode ..................................................... 197 Slave Mode ....................................................... 199 I2C Bus Start/Stop Bits Master Mode ..................................................... 197 Slave Mode ....................................................... 199 Input Capture (CAPX) ............................................... 186 OC/PWM Module ...................................................... 188 Oscillator Start-up Timer ........................................... 181 Output Compare Module........................................... 187 Power-up Timer ........................................................ 181 Reset......................................................................... 181 SPI Module Master Mode (CKE = 0) .................................... 192 Master Mode (CKE = 1) .................................... 193 Slave Mode (CKE = 0) ...................................... 194 Slave Mode (CKE = 1) ...................................... 195 Type A, B and C Timer External Clock ..................... 184 Watchdog Timer........................................................ 181 © 2007 Microchip Technology Inc. Timing Diagrams CAN Bit..................................................................... 112 Frame Sync, AC-Link Start of Frame ....................... 122 Frame Sync, Multi-Channel Mode ............................ 122 I2S Interface Frame Sync ......................................... 122 PWM Output ............................................................... 85 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 1 ........................................ 146 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 2 ........................................ 146 Time-out Sequence on Power-up (MCLR Tied to VDD).............................................................. 146 Timing Diagrams and Specifications DC Characteristics - Internal RC Accuracy .............. 178 Timing Diagrams.See Timing Characteristics Timing Requirements A/D Conversion Low-speed ........................................................ 205 Bandgap Start-up Time ............................................ 183 Brown-out Reset....................................................... 182 CAN Module I/O ....................................................... 201 CLKOUT and I/O ...................................................... 180 DCI Module AC-Link Mode................................................... 191 Multichannel, I2S Modes................................... 190 External Clock .......................................................... 177 I2C Bus Data (Master Mode) .................................... 198 I2C Bus Data (Slave Mode) ...................................... 200 Input Capture............................................................ 186 Oscillator Start-up Timer........................................... 182 Output Compare Module .......................................... 187 Power-up Timer ........................................................ 182 Reset ........................................................................ 182 Simple OC/PWM Mode ............................................ 188 SPI Module Master Mode (CKE = 0).................................... 192 Master Mode (CKE = 1).................................... 193 Slave Mode (CKE = 0)...................................... 194 Slave Mode (CKE = 1)...................................... 196 Type A Timer External Clock .................................... 184 Type B Timer External Clock .................................... 185 Type C Timer External Clock.................................... 185 Watchdog Timer ....................................................... 182 Timing Specifications PLL Clock ................................................................. 178 PLL Jitter .................................................................. 178 Trap Vectors ....................................................................... 44 DS70116G-page 217 dsPIC30F5011/5013 U UART Module Address Detect Mode ............................................... 103 Auto Baud Support.................................................... 104 Baud Rate Generator ................................................ 103 Enabling and Setting Up ........................................... 101 Framing Error (FERR)............................................... 103 Idle Status ................................................................. 103 Loopback Mode ........................................................ 103 Operation During CPU Sleep and Idle Modes .......... 104 Overview ..................................................................... 99 Parity Error (PERR) .................................................. 103 Receive Break........................................................... 103 Receive Buffer (UxRXB) ........................................... 102 Receive Buffer Overrun Error (OERR Bit) ................ 102 Receive Interrupt....................................................... 102 Receiving Data.......................................................... 102 Receiving in 8-bit or 9-bit Data Mode........................ 102 Reception Error Handling.......................................... 102 Transmit Break.......................................................... 102 Transmit Buffer (UxTXB)........................................... 101 Transmit Interrupt...................................................... 102 Transmitting Data...................................................... 101 Transmitting in 8-bit Data Mode ................................ 101 Transmitting in 9-bit Data Mode ................................ 101 UART1 Register Map ................................................ 105 UART2 Register Map ................................................ 105 UART Operation Idle Mode .................................................................. 104 Sleep Mode ............................................................... 104 Unit ID Locations............................................................... 139 Universal Asynchronous Receiver Transmitter (UART) Module ............................................................................... 99 W Wake-up from Sleep ......................................................... 139 Wake-up from Sleep and Idle.............................................. 45 Watchdog Timer Timing Characteristics .............................................. 181 Timing Requirements ................................................ 182 Watchdog Timer (WDT) ............................................ 139, 150 Enabling and Disabling ............................................. 150 Operation .................................................................. 150 WWW Address.................................................................. 219 WWW, On-Line Support........................................................ 6 DS70116G-page 218 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. DS70116G-page 219 dsPIC30F5011/5013 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y Device: dsPIC30F5011/5013 N Literature Number: DS70116G Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70116G-page 220 © 2007 Microchip Technology Inc. dsPIC30F5011/5013 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. d s P I C 3 0 F 5 0 1 3 AT - 3 0 I / P T- E S Custom ID (3 digits) or Engineering Sample (ES) Trademark Architecture PT PT S W Flash Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up = = = = Package TQFP 10x10 TQFP 12x12 Die (Waffle Pack) Die (Wafers) Temperature I = Industrial -40°C to +85°C E = Extended High Temp -40°C to +125°C Device ID Speed 20 = 20 MIPS 30 = 30 MIPS T = Tape and Reel A,B,C… = Revision Level Example: dsPIC30F5013AT-30I/PT = 30 MIPS, Industrial temp., TQFP package, Rev. A © 2007 Microchip Technology Inc. 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