TI1 DS90CR583 Lvds 24-bit color flat panel display (fpd) link- 65 mhz Datasheet

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DS90CR583, DS90CR584
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SNLS110B – JULY 1997 – REVISED APRIL 2013
DS90CR583/DS90CR584 LVDS 24-Bit Color Flat Panel Display (FPD) Link— 65 MHz
Check for Samples: DS90CR583, DS90CR584
FEATURES
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20 to 65 MHz Shift clk Support
Up to 227 Mbytes/s Bandwidth
Cable Size is Reduced to Save Cost
290 mV Swing LVDS Devices for Low EMI
Low Power CMOS Design (< 550 mW typ)
Power-Down Mode Saves Power (< 0.25 mW)
PLL Requires No External Components
Low Profile 56-lead TSSOP Package
Rising Edge Data Strobe
Compatible with TIA/EIA-644 LVDS Standard
Single Pixel Per Clock XGA (1024 x 768)
Supports VGA, SVGA, XGA and Higher
1.8 Gbps Throughput
DESCRIPTION
The DS90CR583 transmitter converts 28 bits of
CMOS/TTL data into four LVDS (Low Voltage
Differential Signaling) data streams. A phase-locked
transmit clock is transmitted in parallel with the data
streams over a fifth LVDS link. Every cycle of the
transmit clock 28 bits of input data are sampled and
transmitted. The DS90CR584 receiver converts the
LVDS data streams back into 28 bits of CMOS/TTL
data. At a transmit clock frequency of 65 MHz, 24 bits
of RGB data and 4 bits of LCD timing and control
data (FPLINE, FPFRAME, DRDY, CONTROL) are
transmitted at a rate of 455 Mbps per LVDS data
channel. Using a 65 MHz clock, the data throughput
is 227 Mbytes per second. These devices are offered
with rising edge data strobes for convenient interface
with a variety of graphics and LCD panel controllers.
This chipset is an ideal means to solve EMI and
cable size problems associated with wide, high speed
TTL interfaces.
BLOCK DIAGRAM
Figure 1. DS90CR583
See Package Number DGG
Figure 2. DS90CR584
See Package Number DGG
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2013, Texas Instruments Incorporated
OBSOLETE
DS90CR583, DS90CR584
SNLS110B – JULY 1997 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−0.3V to +6V
Supply Voltage (VCC)
CMOS/TTL Input Voltage
−0.3V to (VCC + 0.3V)
CMOS/TTL Output Voltage
−0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage
−0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage
−0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration
Continuous
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
Lead Temperature (Soldering, 4 sec)
Maximum Power Dissipation @ 25°C
+260°C
DGG (TSSOP) Package:
DS90CR583
Package Derating:
1.63W
DS90CR584
1.61W
DS90CR583
12.5 mW/°C above +25°C
DS90CR584
12.4 mW/°C above +25°C
This device does not meet 2000V ESD rating (3) .
(1)
(2)
(3)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the device should be operated at these limits. “Electrical Characteristics” specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
ESD Rating: HBM (1.5 kΩ, 100 pF)
PLL V CC ≥ 1000V All other pins ≥ 2000V EIAJ (0Ω, 200 pF) ≥ 150V
Recommended Operating Conditions
Min
Nom
Max
Units
Supply Voltage (VCC)
4.75
5.0
5.25
V
Operating Free Air Temperature (TA)
−10
+25
+70
°C
2.4
V
100
mVP-P
Receiver Input Range
0
Supply Noise Voltage (VCC)
ELECTRICAL CHARACTERISTICS
over opeOver recommended operating supply and temperature ranges unless otherwise specifiedrating free-air temperature
range (unless otherwise noted)
Symb
Parameter
Conditions
Min
Typ
Max
Units
CMOS/TTL DC SPECIFICATIONS
VIH
2
High Level Input Voltage
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2.0
VCC
V
Copyright © 1997–2013, Texas Instruments Incorporated
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SNLS110B – JULY 1997 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS (continued)
over opeOver recommended operating supply and temperature ranges unless otherwise specifiedrating free-air temperature
range (unless otherwise noted)
Symb
Parameter
Conditions
VIL
Low Level Input Voltage
VOH
High Level Output Voltage
IOH = −0.4 mA
VOL
Low Level Output Voltage
IOL = 2 mA
VCL
Input Clamp Voltage
IIN
IOS
Min
Typ
GND
3.8
Max
Units
0.8
V
4.9
V
0.1
0.3
ICL = −18 mA
−0.79
−1.5
V
V
Input Current
VIN = VCC, GND, 2.5V or 0.4V
±5.1
±10
μA
Output Short Circuit Current
VOUT = 0V
−120
mA
450
mV
LVDS DRIVER DC SPECIFICATIONS
VOD
Differential Output Voltage
R L = 100Ω
250
290
ΔV OD
Change in VOD between
Complementary Output States
35
mV
ΔV CM
Change in VCM between
Complementary Output States
35
mV
−2.9
−5
mA
±1
±10
μA
+100
mV
VOL
Low Level Output Voltage
IOS
Output Short Circuit Current
VOUT = 0V, RL = 100Ω
0.9
IOZ
Output TRI-STATE Current
Power Down = 0V, VOUT = 0V or VCC
1.01
V
LVDS RECEIVER DC SPECIFICATIONS
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
IIN
Input Current
V CM = +1.2V
−100
VIN = +2.4V
mV
VCC = 5.5V
VIN = 0V
±10
μA
±10
μA
TRANSMITTER SUPPLY CURENT
ICCTW
ICCTG
ICCTZ
ICCRW
ICCRG
ICCRZ
Transmitter Supply Current,
Worst Case
RL = 100Ω, CL = 5 pF,
Worst Case Pattern
(Figure 3, Figure 5)
Transmitter Supply Current,
16 Grayscale
RL = 100Ω, CL = 5 pF,
16 Grayscale Pattern
(Figure 4, Figure 5)
Transmitter Supply Current,
Power Down
Power Down = Low
Receiver Supply Current,
Worst Case
CL = 8 pF,
Worst Case Pattern
(Figure 3, Figure 6)
Receiver Supply Current,
16 Grayscale
CL = 8 pF,
16 Grayscale Pattern
(Figure 4, Figure 6)
Receiver Supply Current,
Power Down
f = 32.5 MHz
49
63
mA
f = 37.5 MHz
51
64
mA
f = 65 MHz
70
84
mA
f = 32.5 MHz
40
55
mA
f = 37.5 MHz
41
55
mA
f = 65 MHz
55
67
mA
1
10
µA
f = 32.5 MHz
64
77
mA
f = 37.5 MHz
70
85
mA
f = 65 MHz
110
140
mA
f = 32.5 MHz
35
55
mA
f = 37.5 MHz
37
55
mA
f = 65 MHz
55
67
mA
1
10
μA
Typ
Max
Units
Power Down = Low
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
LLHT
LVDS Low-to-High Transition Time (Figure 5)
0.75
1.5
ns
LHLT
LVDS High-to-Low Transition Time (Figure 5)
0.75
1.5
ns
TCIT
TxCLK IN Transition Time (Figure 7)
8
ns
350
ps
8.5
ns
(1)
TCCS
TxOUT Channel-to-Channel Skew
TCCD
TxCLK IN to TxCLK OUT Delay @ 25°C, VCC = 5.0V (Figure 11)
(1)
(Figure 8)
3.5
This limit based on bench characterization.
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Transmitter Switching Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
TCIP
TxCLK IN Period (Figure 9)
15
T
50
ns
TCIH
TxCLK IN High Time (Figure 9)
0.35T
0.5T
0.65T
ns
TCIL
TxCLK IN Low Time (Figure 9)
0.35T
0.5T
0.65T
ns
TSTC
TxIN Setup to TxCLK IN (Figure 9 )
5
3.5
THTC
TxIN Hold to TxCLK IN (Figure 9)
2.5
1.5
TPDD
Transmitter Powerdown Delay (Figure 20)
100
ns
TPLLS
Transmitter Phase Lock Loop Set (Figure 13)
10
ms
TPPos0
Transmitter Output Pulse Position 0 (Figure 15)
−0.30
0
0.30
ns
TPPos1
Transmitter Output Pulse Position 1
1.70
1/7 Tclk
2.50
ns
TPPos2
Transmitter Output Pulse Position 2
3.60
2/7 Tclk
4.50
ns
TPPos3
Transmitter Output Pulse Position 3
5.90
3/7 Tclk
6.75
ns
TPPos4
Transmitter Output Pulse Position 4
8.30
4/7 Tclk
9.00
ns
TPPos5
Transmitter Output Pulse Position 5
10.40
5/7 Tclk
11.10
ns
TPPos6
Transmitter Output Pulse Position 6
12.70
6/7 Tclk
13.40
ns
f = 65 MHz
ns
ns
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Typ
Max
Units
CLHT
Symbol
CMOS/TTL Low-to-High Transition Time (Figure 6)
2.5
4.0
ns
CHLT
CMOS/TTL High-to-Low Transition Time (Figure 6)
2.0
3.5
ns
RCOP
RxCLK OUT Period
15
T
50
ns
RCOH
RxCLK OUT High Time
f = 65 MHz
3.8
5
ns
RCOL
RxCLK OUT Low Time
f = 65 MHz
7.8
9
ns
RSRC
RxOUT Setup to RxCLK OUT
f = 65 MHz
2.5
4.2
ns
RHRC
RxOUT Hold to RxCLK OUT
f = 65 MHz
4.0
5.2
RCCD
RxCLK IN to RxCLK OUT Delay @ 25°C, VCC = 5.0V (Figure 12)
RPLLS
Receiver Phase Lock Loop Set (Figure 14)
RSKM
RxIN Skew Margin (1) (Figure 16)
RPDD
Receiver Powerdown (Figure 19)
(1)
4
Parameter
Min
6.4
VCC = 5V, TA =25°C
ns
10.7
ns
10
ms
1
μs
600
ps
Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account transmitter
output skew (TCCS) and the setup and hold time (internal data sampling window), allowing for LVDS cable skew dependent on
type/length and source clock (TxCLK IN) jitter RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle)
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SNLS110B – JULY 1997 – REVISED APRIL 2013
AC Timing Diagrams
Figure 3. “Worst Case” Test Pattern
(1)
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
(2)
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
(3)
Figure 3 and Figure 4 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
(4)
Recommended pin to signal mapping. Customer may choose to define differently.
Figure 4. “16 Grayscale” Test Pattern
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Figure 5. DS90CR583 (Transmitter) LVDS Output Load and Transition Times
Figure 6. DS90CR584 (Receiver) CMOS/TTL Output Load and Transition Times
Figure 7. DS90CR583 (Transmitter) Input Clock Transition Time
Note: Measurements at Vdiff = 0V
Note: TCSS measured between earliest and latest LVDS edges.
Note: TxCLK Differential High→Low Edge
Figure 8. DS90CR583 (Transmitter) Channel-to-Channel Skew and Pulse Width
6
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Figure 9. DS90CR583 (Transmitter) Setup/Hold and High/Low Times
Figure 10. DS90CR584 (Receiver) Clock In to Clock Out Delay
Figure 11. DS90CR583 (Transmitter) Clock In to Clock Out Delay
Figure 12. DS90CR584 (Receiver) Clock In to Clock Out Delay
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Figure 13. DS90CR583 (Transmitter) Phase Lock Loop Set Time
Figure 14. DS90CR584 (Receiver) Phase Lock Loop Set Time
8
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Figure 15. Transmitter LVDS Output Pulse Position Measurement
SW—Setup and Hold Time (Internal Data Sampling Window)
TCCS—Transmitter Output Skew
RSKM ≥ Cable Skew (type, length) + Source Clock Jitter (cycle to cycle)
Cable Skew—typically 10 ps–40 ps per foot
Figure 16. Receiver LVDS Input Skew Margin
Figure 17. Seven Bits of LVDS in One Clock Cycle
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Figure 18. Parallel TTL Data Inputs Mapped to LVDS Outputs (DS90CR583)
Figure 19. Receiver Powerdown Delay
Figure 20. Transmitter Powerdown Delay
DS90CR583 Pin Descriptions—FPD Link Transmitter
Pin Name
I/O
No.
TxIN
I
28
TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME, DRDY and
CNTL (also referred to as HSYNC, VSYNC, Data Enable, CNTL)
TxOUT+
O
4
Positive LVDS differential data output
TxOUT−
O
4
Negative LVDS differential data output
FPSHIFT IN
I
1
TTL level clock input. The falling edge acts as data strobe
TxCLK OUT+
O
1
Positive LVDS differential clock output
TxCLK OUT−
O
1
Negative LVDS differential clock output
PWR DOWN
I
1
TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down
VCC
I
4
Power supply pins for TTL inputs
GND
I
5
Ground pins for TTL inputs
10
Description
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DS90CR583 Pin Descriptions—FPD Link Transmitter (continued)
I/O
No.
PLL VCC
Pin Name
I
1
Power supply pin for PLL
Description
PLL GND
I
2
Ground pins for PLL
LVDS VCC
I
1
Power supply pin for LVDS outputs
LVDS GND
I
3
Ground pins for LVDS outputs
I/O
No.
I
4
Positive LVDS differential data inputs
DS90CR584 Pin Descriptions—FPD Link Receiver
Pin Name
RxIN+
Description
RxIN−
I
4
Negative LVDS differential data inputs
RxOUT
O
28
TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME,
DRDY and CNTL (also referred to as HSYNC, VSYNC, Data Enable, CNTL)
RxCLK IN+
I
1
Positive LVDS differential clock input
RxCLK IN−
I
1
Negative LVDS differential clock input
FPSHIFT OUT
O
1
TTL level clock output. The falling edge acts as data strobe
PWR DOWN
I
1
TTL level input. Assertion (low input) maintains the receiver outputs in the previous state
VCC
I
4
Power supply pins for TTL outputs
GND
I
5
Ground pins for TTL outputs
PLL VCC
I
1
Power supply for PLL
PLL GND
I
2
Ground pin for PLL
LVDS VCC
I
1
Power supply pin for LVDS inputs
LVDS GND
I
3
Ground pins for LVDS inputs
Connection Diagram
Figure 21. 56 Pin TSSOP
See Package Number DGG
Figure 22. 56 Pin TSSOP
See Package Number DGG
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REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
•
12
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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