Infineon BGA758L7 5-6 ghz lna for wlan Datasheet

BGA758L7
5-6 GHz LNA for WLAN
Data Sheet
Revision 1.0, 2010-02-22
Preliminary
RF & Protection Devices
Edition 2010-02-22
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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BGA758L7
BGA758L7 5-6 GHz LNA for WLAN
Revision History: 2010-02-22, Revision 1.0
Previous Revision: 2009-04-03, Revision 0.1
Page
Subjects (major changes since last revision)
all
Preliminary data sheet
all
New document layout
7, 8, 10
Electrical Characteristics adjusted
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USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc.
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WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2009-10-19
Preliminary Data Sheet
3
Revision 1.0, 2010-02-22
BGA758L7
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
2.1
2.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Digital Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Preliminary Data Sheet
4
Revision 1.0, 2010-02-22
BGA758L7
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Cross-section of Application Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package Outline TSLP-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Footprint TSLP-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Preliminary Data Sheet
5
Revision 1.0, 2010-02-22
BGA758L7
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical Characteristics: TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V,
f = 5.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Digital Control Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Preliminary Data Sheet
6
Revision 1.0, 2010-02-22
5-6 GHz LNA for WLAN
BGA758L7
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Gain, |S21|2= 12.5 dB at 5.5 GHz
High Linearity, Input P-1dB = -3.5 dBm at 5.5 GHz
Low noise figure, NF = 1.3 dB at 5.5 GHz
Internal output matching on chip
AC coupled RF output port
Temperature compensated internal biasing circuit
Digital On/Off switch on chip
Low external part count
1 kV HBM ESD protection for IN-pin
2 kV HBM ESD protection for all other pins
B7HFM silicon germanium technology
Tiny TSLP-7-8 leadless package
Pb-free (RoHS compliant) package
6
5
4
7
1
2
3
TSLP-7-8
Application
•
Low noise amplifier for WLAN application
PON
BIAS
VCC
Biasing & Logic
Circuitry
OUT
IN
GND
Figure 1
BGA 758 L7_Blockdiagram .vsd
Block Diagram
Product Name
Marking
Package
BGA758L7
BA
TSLP-7-8
Preliminary Data Sheet
7
Revision 1.0, 2010-02-22
BGA758L7
Features
Description
The BGA758L7 is a 5 - 6 GHz Silicon Germanium low noise amplifier MMIC in tiny TSLP-7-8 package. The LNA
delivers a gain of 12.5 dB while giving an excellent noise figure of 1.3 dB in the application configuration described
in Chapter 3. The supply current of 7.0 mA is chosen to maintain a high input compression point of -3.5 dBm.
The temperature compensated internal biasing circuit provides stable current conditions over temperature range.
Output matching is done by on chip matching circuits in combination with the bonding wire inductances. The
application circuit requires only three external elements.
With only one additional external element an ultra low noise figure of 1.1 dB can be achieved. For detailed
information please refer to Infineon BGA758L7 Application Note.
Pin Definition and Function
Table 1
Pin Definition and Function
Pin No.
Name
Function
1
PON
Power on control
2
IN
RF input
3
BIAS
DC bias
4
n.c.
not connected
5
VCC
DC Supply
6
OUT
RF output
7
GND
RF ground and DC ground for bias and logic circuity
Preliminary Data Sheet
8
Revision 1.0, 2010-02-22
BGA758L7
Maximum Ratings
1
Maximum Ratings
Table 2
Maximum Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Voltage at pin VCC
VCC
-0.3
–
4
V
1)
Voltage at pin IN
VIN
-0.3
–
0.9
V
–
Voltage at pin BIAS
VBIAS
-0.3
–
0.9
V
–
Voltage at pin OUT
VOUT
-0.3
–
VCC + 0.3
V
–
Voltage at pin PON
VPON
-0.3
–
VCC + 0.3
V
–
Voltage at pin GND
VGND
-0.3
–
0.3
V
–
Current into pin VCC
ICC
–
–
12
mA
–
RF input power
PIN
–
–
0
dBm
–
Total power dissipation,
TJ
–
–
48
mW
–
Junction temperature
Ptot
–
–
150
°C
–
Ambient temperature range
TA
-30
–
85
°C
–
Storage temperature range
TSTG
-65
–
150
°C
–
ESD capability all pins
VESD-HBM –
–
1000
V
according to
JESD22A-114
ESD capability all pins,
excluding pin IN
VESD-HBM –
–
2000
V
according to
JESD22A-114,
w/o pin IN
ESD capability all pins
VESD-MM
–
100
V
according to
JESD22A-115
TS < 120°C2)
–
1) All voltages refer to GND-Node unless otherwise noted
2) TS is measured on the ground lead at the soldering point
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Thermal Resistance
Table 3
Thermal Resistance
Parameter
Symbol
Value
Unit
Junction - soldering point
RthJS
615
1) For calculation of RthJA please refer to Application Note Thermal Resistance
K/W
1)
Preliminary Data Sheet
9
Revision 1.0, 2010-02-22
BGA758L7
Electrical Characteristics
2
Electrical Characteristics
2.1
Electrical Parameter
Table 4
Electrical Characteristics1): TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V, f = 5.5 GHz
Parameter
Symbol
Pass band frequency range
FBW
2
Values
Unit
Min.
Typ.
Max.
5.0
–
6.0
GHz
–
12.5
–
dB
Note / Test Condition
Gain
|S21|
Gain flatness
ΔG
–
0.3
–
dB
Reverse isolation
|S12|
–
21
–
dB
NF
–
1.3
–
dB
Input return loss
RLin
–
18
–
dB
50 Ω
Output return loss
RLout
–
20
–
dB
50 Ω
Input power at 1dB compression point P-1dB
–
-3.5
–
dBm
|S21|
–
-3
–
dB
DC - 1.7 GHz
–
1
–
dB
1.7 - 2.0 GHz
–
6
–
dB
2.3 - 2.7 GHz
–
12
–
dB
3.3 - 3.9 GHz
–
4
–
dB
9.0 - 10 GHz
–
3
–
dB
10 - 18 GHz
–
-4
–
dBm
0.8 - 1.0 GHz
–
-12
–
dBm
1.7 - 2.0 GHz
–
-9
–
dBm
2.3 - 4.0 GHz
–
-8
–
dBm
4.4 - 4.5 GHz
–
0
–
dBm
9.0 - 10 GHz
Measured from ON
signal turns on (90%)
to the point were LNA
output power stabilizes
to within 0.5 dB of final
value
Noise figure
2)
Maximum gain out of band
Minimum input 1dB compression
out of band
P-1dB
Turn-on time
ton
–
0.2
–
μs
Supply current at VCC
ICC
5.0
7.0
9.0
mA
Shutdown current
Ioff
–
6
μA
Stability factor
k
–
>1
–
In any 50 MHz
instantaneous
bandwidth
VPON = 0 V
Unconditional stable
for all frequencies
1) Measured on application board according to application schematic on page 12, including PCB losses (unless noted
otherwise)
2) PCB losses subtracted
Preliminary Data Sheet
10
Revision 1.0, 2010-02-22
BGA758L7
Electrical Characteristics
2.2
Digital Signals
Table 5
Digital Control Parameter
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Power on control voltage range
VPON
-0.3
–
VCC
V
–
Control voltage for power on
VPON,on
2
–
VCC
V
–
Control voltage for power off
VPON,off
-0.3
–
1.1
V
–
Capacitance at power on pin
Cin
–
1
–
pF
–
Input current at power on pin
IPON
–
10
–
μA
VPON = 3.3 V
Preliminary Data Sheet
11
Revision 1.0, 2010-02-22
BGA758L7
Application Information
3
Application Information
Application Board Configuration
N1
BGA758L7
PON
PON,1
OUT,6
RFout
RFin
IN,2
VCC,5
VCC
C1
L1
BIAS,3
GND,4
C2
GND,7
BGA758 L7_Application _Schematic.vsd
Figure 2
Application Schematic
Table 6
Bill of Materials
Name
Value
Package
Manufacturer
Function
C1
2.7 pF
0402
Various
DC blocking
C2
1 nF
0402
Various
Supply voltage filtering
L1
3.9 nH
0402
Murata LQW type
Bias feed and input matching
TSLP-7-8
Infineon
5-6 GHz LNA
N1
A list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes.
Preliminary Data Sheet
12
Revision 1.0, 2010-02-22
BGA758L7
Application Information
%*$/B$SSOLFDWLRQB%RDUGYVG
Figure 3
Drawing of Application Board
Micro- Via 150 µm
Via 500 µm
TOP- Layer CU 35 µm
Rogers 4003 200 µm Core
GND 1 CU 35 µm
FR4 800 µm
GND 2 CU 35 µm
BGA 758L7 _Cross_section.vsd
Figure 4
Cross-section of Application Board
Preliminary Data Sheet
13
Revision 1.0, 2010-02-22
BGA758L7
Package Information
Package Information
Bottom view
1.26 ±0.05
0.31 +0.01
-0.02
0.03 A
4
5
B
3
2
1
0.48
(0.05) 2)
TSLP-7-8-PO V01
Package Outline TSLP-7-8 (side and bottom view)
0.4
Pin 1
marking
8
1.7
4
Figure 6
0.03 B
6 x 0.2 ±0.035 1)
1) Dimension applies to plated terminals
2) Dimension of 0.02 MIN. is guaranteed
Figure 5
0.03 B
0.05 A
6
7
Pin 1 marking
0.05 B
0.2 MIN.
(0.05) 2)
1.1
A
0.5 ±0.0351)
0.05 MAX.
1.16 ±0.035 1)
0.96
6 x 0.2 ±0.035 1)
Top view
1.4 ±0.05
4
1.6
TSLP-7-8-TP V01
Marking Layout (top view)
Preliminary Data Sheet
14
Revision 1.0, 2010-02-22
BGA758L7
Package Information
SMD
1.21
0.51
0.25
0.25
0.25
0.23
0.45
0.25
0.23
0.25
Copper
0.2
0.25
0.2
1.35
0.2
0.45
0.25
0.2
1.35
0.25
0.25
1.21
0.51
0.25
0.23
Solder mask
Vias
0.23
Stencil apertures
TSLP-7-8-FP V01
Figure 7
Footprint TSLP-7-8
Preliminary Data Sheet
15
Revision 1.0, 2010-02-22
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Published by Infineon Technologies AG