AOSMD AO6414L N-channel enhancement mode field effect transistor Datasheet

AO6414
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO6414 uses advanced trench technology to
provide excellent RDS(ON) and low gate charge. It
offers operation over a wide gate drive range from
2.5V to 12V. This device is suitable for use as a load
switch. Standard product AO6414 is Pb-free (meets
ROHS & Sony 259 specifications). AO6414L is a
Green Product ordering option. AO6414 and
AO6414L are electrically identical.
VDS (V) = 55V
ID = 2.4A (VGS = 4.5V)
RDS(ON) < 160mΩ (VGS = 4.5V)
RDS(ON) < 200mΩ (VGS = 2.5V)
D
TSOP-6
Top View
D
D
G
1 6
2 5
3 4
D
D
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
TA=25°C
Current A
TA=70°C
ID
Pulsed Drain Current
B
IDM
TA=25°C
Power Dissipation
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
TJ, TSTG
Symbol
Alpha & Omega Semiconductor, Ltd.
Units
V
V
2.3
1.9
A
9
1.56
1.1
-55 to 150
PD
t ≤ 10s
Steady-State
Steady-State
Maximum
55
±12
RθJA
RθJL
Typ
58
94
37
W
°C
Max
80
120
50
Units
°C/W
°C/W
°C/W
AO6414
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=10mA, VGS=0V
VDS=44V, VGS=0V
55
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID(ON)
Gate-Source leakage current
Gate Threshold Voltage
On state drain current
RDS(ON)
Static Drain-Source On-Resistance
gFS
VSD
IS
VGS=2.5V, ID=1.5A
Forward Transconductance
VDS=5V, ID=2.4A
Diode Forward Voltage
IS=1A
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Reverse Transfer Capacitance
Crss
Rg
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
Turn-On Rise Time
tr
tD(off)
Turn-Off DelayTime
Turn-Off Fall Time
tf
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge
Typ
Max
0.002
1
5
±100
2
V
TJ=55°C
VDS=0V, VGS=±12V
VDS=VGS ID=250μA
VGS=4.5V, VDS=5V
VGS=4.5V, ID=2.4A
0.6
10
TJ=125°C
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=4.5V, VDS=25V, ID=2.4A
VGS=10V, VDS=25V, RL=10.4Ω,
RGEN=3Ω
IF=2.4A, dI/dt=100A/μs
IF=2.4A, dI/dt=100A/μs
Units
1.3
μA
nA
V
A
125
175
157
11
0.78
160
210
200
mΩ
1
1.9
S
V
A
214
31
12.6
1.3
300
2.6
0.6
0.8
2.3
2.4
16.5
2
20
17
3.3
nC
nC
nC
ns
ns
ns
ns
30
ns
nC
3
mΩ
pF
pF
pF
Ω
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 μs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA
curve provides a single pulse rating.
Rev0: Nov. 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO6414
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
8
10V
4.5V
8
3.5V
VDS=5V
2.5V
6
ID(A)
ID (A)
6
4
4
125°C
2
VGS=2V
2
25°C
0
0
0
1
2
3
4
VDS (Volts)
Fig 1: On-Region Characteristics
1
5
200
Normalized On-Resistance
VGS=2.5V
160
140
VGS=4.5V
120
100
0
1.75
2
2.25
VGS(Volts)
Figure 2: Transfer Characteristics
1
2
3
4
1.8
2.5
VGS=4.5V, 2.4A
1.6
1.4
VGS=2.5V,1.5A
1.2
1
0.8
5
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
350
ID=2.4A
300
1.0E+00
250
125°C
1.0E-01
125°C
IS (A)
RDS(ON) (mΩ)
1.5
2
180
RDS(ON) (mΩ)
1.25
200
1.0E-02
25°C
25°C
150
1.0E-03
100
1.0E-04
50
0
2
4
6
8
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source
Voltage
Alpha & Omega Semiconductor, Ltd.
10
1.0E-05
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO6414
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
400
5
Capacitance (pF)
4
VGS (Volts)
350
VDS=25V
ID=2.4A
3
2
300
Ciss
250
200
150
Coss
100
Crss
1
50
0
0
0
1
2
0
3
Qg (nC)
Figure 7: Gate-Charge Characteristics
5
10
15
20
25
VDS (Volts)
Figure 8: Capacitance Characteristics
30
100.00
20
10μs
RDS(ON)
limited
1.00
0.10
1s
0.1s
DC
10s
1ms
10
5
TJ(Max)=150°C
TA=25°C
0
0.001
0.01
0.1
TJ(Max)=150°C
TA=25°C
15
100μs
10ms
Power (W)
ID (Amps)
10.00
1
10
100
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=80°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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