Rohm BD6994FV-E2 Multifunction single-phase full-wave Datasheet

Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD6994FV
Key Specifications

Operating Voltage Range:

Operating Temperature Range:

Output Voltage (Total):
General Description
BD6994FV is a 1chip driver for 12V single-phase
full-wave fan motor. This IC employs the Bi-CMOS
process and incorporates various functions such as low
ON resistance, low power consumption and quiet drive.
Package
SSOP-B16
Features
 SSOP Small Package
 BTL Soft Switching Drive
 Stand-by Function
 Speed Controllable by DC / Pulse Input
 Quick Start
 Duty Control Start-up Function
 Lock Protection and Automatic Restart
(without External Capacitor)
 Rotation Speed Pulse Signal (FG) Output
 Lock Alarm Signal(AL) Output
Application
 Fan motors for general consumer equipment of desktop PC, Projector, etc.
Absolute Maximum Ratings
Parameter
Symbol
Supply Voltage
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Output Voltage
Output Current
Signal(FG/AL) Output Voltage
Signal(FG/AL) Output Current
Reference Voltage(REF) Output Current
Hall Bias(HB) Output Current 1
Hall Bias(HB) Output Current 2
Input Voltage(H+, H–, TH, MIN, SEL, PS)
Junction Temperature
VCC
Pd
Topr
Tstg
VO
IO
VFG/VAL
IFG/IAL
IREF
IHB1
IHB2
VIN
Tjmax
Limit
20
0.87 (Note 1)
-40 to +105
-55 to +150
20
1.2 (Note 2)
20
10
5
12 (Note 3)
5 (Note 4)
7
150
4.5V to 17V
-40°C to +105°C
0.6V(Typ) at 0.4A
W (Typ) x D (Typ) x H (Max)
5.00mm x 6.40mm x 1.35mm
SSOP-B16
Unit
V
W
°C
°C
V
A
V
mA
mA
mA
mA
V
°C
(Note 1) Derate by 7.0mW/°C if operating over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) Do not exceed Pd and Tjmax.
(Note 3) Ta=0°C or Higher.
(Note 4) Less than Ta=0°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Operating Supply Voltage Range
Operating Input Voltage Range 1(H+, H–) (VCC≥9V)
Operating Input Voltage Range 1(H+, H–) (VCC<9V)
Operating Input Voltage Range 2(TH, MIN)
○Product structure：Silicon monolithic integrated circuit
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Symbol
VCC
VIN1
VIN2
Limit
4.5 to 17.0
0.4 to 3
0.4 to VCC/3
0.4 to VREF
Unit
V
V
V
V
○This product has no designed protection against radioactive rays
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Pin Configuration
Pin Description
P/No. P/Name
1
GND
2
OUT2
3
VCC
4
MIN
5
TH
6
OSC
7
FG
8
AL
9
H+
10
HB
11
H–
12
REF
(TOP VIEW)
GND
1
16
GND
OUT2
2
15
OUT1
VCC
3
14
PS
MIN
cc
4
13
SEL
TH
5
12
REF
OSC
6
11
H–
FG
7
10
HB
AL
8
9
H+
Figure 1. Pin Configuration
13
SEL
14
15
16
PS
OUT1
GND
Function
Ground pin
Motor output 2 pin
Power supply pin
Minimum output duty setting pin
Output duty controllable input pin
Oscillating capacitor connecting pin
Speed pulse signal output pin
Lock alarm signal output pin
Hall + input pin
Hall bias pin
Hall - input pin
Reference voltage output pin
Duty control start up function selecting
pin
Power save pin
Motor output 1 pin
Ground pin
Block Diagram
GND
1
OUT2
2
GND
HALL
AMP
HALL
AMP
16
OUT1 15
INTERNAL
REG
VCC
3
MIN
4
TH
5
STANDBY
PWM
COMP
FUNCTION
SELECTOR
PWM
COMP
REF
PS
SEL
14
13
REF 12
CONTROL
OSC
6
FG
7
AL
8
I/O Truth Table
Hall Input
H+
H–
H
L
L
H
LOGIC
OSC
QUICK
START
SIGNAL
OUTPUT
LOCK
PROTECT
HALL
COMP
H– 11
HALL
BIAS
HB 10
TSD
H+ 9
Figure 2. Block Diagram
OUT1
Driver Output
OUT2
FG
L
H
H
L
Hi-Z
L
H; High, L; Low, Hi-Z; High impedance
FG output is open-drain type.
Motor State
Rotating
Locking
Stand-by
FG Output
Hi-Z
AL Output
L
Hi-Z
L
L; Low, Hi-Z; High impedance
AL output is open-drain type.
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Electrical Characteristics (Unless otherwise specified, Ta=25°C, VCC=12V)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Circuit Current
Circuit Current(Stand-by)
Hall Bias Voltage
Hall Input Offset Voltage
Input-Output Gain
ICC
ISTBY
VHB
VOFS
GIO
70
1.05
46.0
6.5
160
1.25
48.5
9.5
250
1.45
±8
51.0
mA
μA
V
mV
dB
Output Voltage
VO
-
0.6
0.9
V
Lock Detection ON Time
Lock Detection OFF Time
Lock Detection OFF/ON Ratio
FG Hysteresis Voltage
FG Output Low Voltage
FG Output Leak Current
AL Output Low Voltage
AL Output Leak Current
OSC Frequency(Reference Data)
OSC Charge Current
OSC Discharge Current
OSC High Voltage
OSC Low Voltage
tON
tOFF
RLCK
VHYS
VFGL
IFGL
VALL
IALL
FOSC
ICOSC
IDOSC
VOSCH
VOSCL
0.3
3.0
8.5
±7
-16
6
3.4
1.3
0.5
5.0
10
±12
0.2
0.2
26
-11
11
3.6
1.5
0.7
7.0
11.5
±17
0.3
10
0.3
10
-6
16
3.8
1.7
s
s
mV
V
μA
V
μA
kHz
μA
μA
V
V
Output ON Duty 1
DOH1
70
80
90
%
Output ON Duty 2
DOH2
40
50
60
%
Output ON Duty 3
DOH3
10
20
30
%
Re-Circulate Ratio(Reference Data)
Reference Voltage
TH Input Bias Current
MIN Input Bias Current
SEL Input Open Voltage
SEL Input Low Level
SEL Input Bias Current
PS Input Open Voltage
PS Input Low Level
PS Input High Level
PS Input Bias Current
Limit ON Duty at Start-up
Limit ON Duty Time at Start-up
Start Assist Duty 1
Start Assist Duty 2
RRC
VREF
ITH
IMIN
VSEL
VSELL
ISEL
VPS
VPSL
VPSH
IPS
DOHL
tOHL
DOHS1
DOHS2
4.8
-0.6
-0.6
2.9
-0.3
-35
4.2
-0.3
2.5
-35
43
0.3
23
43
50
5.1
3.2
-25
4.7
-25
53
0.5
33
53
5.4
3.5
0.8
-15
5.2
0.8
5.5
-15
63
0.7
43
53
%
V
μA
μA
V
V
μA
V
V
V
μA
%
s
%
%
Conditions
PS=0V
IHB=-2mA
IO=±400mA
High and low side total
RLCK=TOFF / TON
IFG=5mA
VFG=17V
IAL=5mA
VAL=17V
COSC=100pF
VTH=1.8V
Output 1kΩ load
VTH=2.4V
Output 1kΩ load
VTH=3.1V
Output 1kΩ load
VTH=1.65V
IREF=-2mA
VTH=0.2V
VMIN=0.2V
VSEL=0V
VPS=0V
VSEL=0V, VTH<VREF-0.5V
VSEL=0V, VTH<VREF-0.5V
VSEL=0V, VTH>VREF-0.1V
SEL=OPEN, VTH>VREF-0.1V
For parameters involving current, positive nations means inflow of current to IC while negative nation means outflow of current from IC.
The reference data is a design guaranteed value and the numerical all shipment inspection off the subject item.
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Typical Performance Curves (Reference Data)
400
10
105°C
25°C
6
-40°C
4
Circuit Current: ISTBY[μA]
Circuit Current: ICC [mA]
8
2
300
105°C
200
25°C
-40°C
100
Operating Voltage Range
Operating Voltage Range
0
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 3. Circuit Current vs Supply Voltage
(In Operation)
Figure 4. Circuit Current vs Supply Voltage
(In Standby)
1.45
1.45
1.35
1.35
105°C
25°C
-40°C
1.25
1.15
Hall Bias Voltage: VHB[V]
Hall Bias Voltage: VHB[V]
0
105°C
1.25
25°C
-40°C
1.15
Operating Voltage Range
1.05
1.05
0
5
10
15
20
0
Supply Voltage: VCC [V]
4
6
8
10
HB Source Current: IHB[mA]
Figure 5. Hall Bias Voltage vs Supply Voltage
(IHB=-2mA)
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Figure 6. Hall Bias Voltage vs HB Source Current
(VCC=12V)
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Typical Performance Curves (Reference Data) - Continued
51
Input-Output Gain: GIo[dB]
Hall Input Offset Voltage: VOFS[V]
10
5
-40°C
25°C
105°C
0
-5
50
49
105°C
25°C
48
-40°C
47
Operating Voltage Range
Operating Voltage Range
-10
46
0
5
10
15
20
0
10
15
20
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 7. Hall Input Offset Voltage vs Supply Voltage
Figure 8. Input-Output Gain vs Supply Voltage
0
Output High Voltage: VOH [V]
0
Output High Voltage: VOH [V]
5
-0.4
105°C 25°C
-0.8
-40°C
-1.2
-0.4
-0.8
17V
12V
4.5V
-1.2
0
0.4
0.8
1.2
0
0.4
0.8
1.2
Output Source Current: IO[A]
Output Source Current: IO[A]
Figure 9. Output High Voltage vs Output Source Current
(VCC=12V)
Figure 10. Output High Voltage vs Output Source Current
(Ta=25°C)
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BD6994FV
Typical Performance Curves (Reference Data) - Continued
1
1
0.8
0.8
105°C
25°C
Output Low Voltage: VOL[V]
Outpur Low Voltage: VOL[V]
4.5V
0.6
-40°C
0.4
0.2
0.6
12V
17V
0.4
0.2
0
0
0
0.4
0.8
0
1.2
0.8
1.2
Output Sink Current: IO[A]
Output Sink Current: IO[A]
Figure 11. Output Low Voltage vs Output Sink Current
(VCC=12V)
Figure 12. Output Low Voltage vs Output Sink Current
(Ta=25°C)
7.0
0.6
-40°C
0.5
25°C
105°C
0.4
Lock Detection OFF Time: t OFF [s]
0.7
Lock Detection ON Time: t ON [s]
0.4
6.0
-40°C
5.0
25°C
105°C
4.0
Operating Voltage Range
Operating Voltage Range
0.3
3.0
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 13. Lock Detection ON Time vs Supply Voltage
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Figure 14. Lock Detection OFF Time vs Supply Voltage
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BD6994FV
Typical Performance Curves (Reference Data) - Continued
60
FG Hystresis voltage: VHYS [V]
Lock Detection OFF/ON Ratio: R LCK[s/s]
12.0
11.0
-40°C
25°C
105°C
10.0
9.0
40
105°C
20
25°C
-40°C
0
-40°C
25°C
-20
105°C
-40
Operating Voltage Range
Operating Voltage Range
-60
8.0
0
5
10
15
0
20
5
10
15
20
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 15. Lock Detection OFF/ON Ratio vs Supply Voltage
Figure 16. FG Hysteresis Voltage vs Supply Voltage
0.8
FG Output Low Voltage: VFGL[V]
FG Output Low Voltage: VFGL[V]
0.8
0.6
105°C
0.4
25°C
-40°C
0.2
0.6
0.4
4.5V
17V
12V
0.2
0
0
0
2
4
6
8
0
10
4
6
8
10
FG Sink Current: IFG[mA]
FG Sink Current: IFG[mA]
Figure 17. FG Output Low Voltage vs FG Sink Current
(VCC=12V)
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Figure 18. FG Output Voltage vs FG Sink Current
(Ta=25°C)
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BD6994FV
Typical Performance Curves (Reference Data) - Continued
0.8
AL Output Low Voltage: VALL[V]
FG Output Leak Current: IFGL[μA]
8
6
4
2
0
Operating Voltage Range
105°C
25°C
-40°C
-2
0.6
105°C
0.4
25°C
-40°C
0.2
0
0
5
10
15
20
0
FG Voltage: VFG[V]
4
6
8
10
AL Sink Current: IAL[mA]
Figure 19. FG Output Leak Current vs FG Voltage
Figure 20. AL Output Low Voltage vs AL Sink Current
(VCC=12V)
0.8
0.8
AL Output Leak Current: IALL[μA]
AL Output Low Voltage: VALL[V]
2
0.6
0.4
4.5V
17V
12V
0.2
0.6
0.4
0.2
0
Operating Voltage Range
0
105°C
25°C
-40°C
-0.2
0
2
4
6
8
10
0
AL Sink Current: IAL[mA]
5
10
15
20
AL Voltage: VAL[V]
Figure 22. AL Output Leak Current vs AL Voltage
Figure 21. AL Output Low Voltage vs AL Sink Current
(Ta=25°C)
回路電流 vs 電源電圧
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BD6994FV
Typical Performance Curves (Reference Data) – Continued
40
OSC Charge/Discharge Current: ICOSC/IDOSC[μA]
OSC Frequency: fOSC [kHz]
50
40
30
105°C
25°C
-40°C
20
10
Operating Voltage Range
0
20
105°C
25°C
-40°C
0
-40°C
25°C
105°C
-20
Operating Voltage Range
-40
0
5
10
15
20
0
5
Supply Voltage: VCC [V]
15
20
Supply Voltage: VCC [V]
Figure 24. OSC Charge/Discharge Current vs Supply Voltage
Figure 23. OSC Frequency vs Supply Voltage
（Reference Data; COSC=100pF）
4.5
100
14V
105°C
25°C
-40°C
3.5
2.5
105°C
25°C
-40°C
1.5
Re-Circulate Ratio: R RC [%]
OSC High/Low Voltage: VOSCH /VOSCL[V]
10
75
OSC Width
12V
50
25
10V
Operating Voltage Range
0.5
0
0
5
10
15
20
0
Supply Voltage: VCC [V]
1
2
3
4
TH Voltage: VTH [V]
Figure 25. OSC High/Low Voltage vs Supply Voltage
Figure 26. Re-Circulate Ratio vs TH Voltage
(Reference Data; Ta=25°C)
pF）
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BD6994FV
Typical Performance Curves (Reference Data) – Continued
6.0
105°C
25°C
-40°C
Reference Voltage: VREF [V]
Re-Circulate Ratio: R RC [%]
100
75
50
25
105°C
25°C
5.0
-40°C
4.0
3.0
Operating Voltage Range
Operating Voltage Range
0
2.0
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 27. Re-Circulate Ratio vs Supply Voltage
（Reference Data; VTH=1.65V)
Figure 28. Reference Voltage vs Supply Voltage
(IREF=-2mA)
6
0.00
5.5
-0.15
105°C
25°C
5
-40°C
4.5
TH Bias Current: I TH[μA]
Reference Voltage: VREF [V]
5
105°C
25°C
-40°C
-0.30
-0.45
Operating Voltage Range
4
-0.60
0
2
4
6
8
10
0
REF Source Current: IREF [mA]
10
15
20
Supply Voltage: VCC [V]
Figure 30. TH Bias Current vs Supply Voltage
Figure 29. Reference Voltage vs REF Source Current
(VCC=12V)
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BD6994FV
Typical Performance Curves (Reference Data) – Continued
4
105°C
25°C
-40°C
-0.15
SEL Input Open Voltage: VSEL[V]
MIN Bias Current: IMIN[μA]
0.00
-0.30
-0.45
3.5
105°C
25°C
-40°C
3
2.5
Operating Voltage Range
Operating Voltage Range
-0.60
2
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 31. MIN Bias Current vs Supply Voltage
Figure 32. SEL Input Open Voltage vs Supply Voltage
2
-5
1.7
105°C
25°C
-40°C
1.4
1.1
SEL Input Bias Current: I SEL[μA]
SEL Input Threshold Voltage: VSELL[V]
5
-10
-15
-40°C
-20
25°C
-25
105°C
Operating Voltage Range
Operating Voltage Range
0.8
-30
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 33. SEL Input Threshold Voltage vs Supply Voltage
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Figure 34. SEL Input Bias Current vs Supply Voltage
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BD6994FV
Typical Performance Curves (Reference Data) – Continued
2
105°C
25°C
-40°C
PS Input High/Low Threshold Voltage: VPSH/VPSL[V]
PS Input Open Voltage: VPS[V]
5
4
3
Operating Voltage Range
105°C
25°C
-40°C
105°C
25°C
-40°C
1.75
1.5
1.25
Operating Voltage Range
2
1
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 35. PS Input Open Voltage vs Supply Voltage
Figure 36. PS Input High/Low Threshold Voltage vs
Supply Voltage
-10
65
Limit ON Duty at Start-up: D OH [%]
PS Input Bias Current: I PS[μA]
5
-40°C
-20
25°C
105°C
-30
-40
60
55
-40°C
25°C
105°C
50
45
Operating Voltage Range
Operating Voltage Range
-50
40
0
5
10
15
20
0
Supply Voltage: VCC [V]
Figure 37. PS Input Bias Current vs Supply Voltage
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10
15
20
Supply Voltage: VCC [V]
Figure 38. Limit ON Duty Time at Start-up vs Supply Voltage
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Typical Performance Curves (Reference Data) – Continued
45
0.6
Start Assist Duty 1: D OHS1[%]
Limit ON Duty Time at Startup : t OH [s]
0.7
-40°C
0.5
25°C
105°C
0.4
0.3
40
35
105°C
25°C
-40°C
30
25
Operating Voltage Range
Operating Voltage Range
0.2
20
0
5
10
15
0
20
Supply Voltage: VCC [V]
5
10
15
20
Supply Voltage: VCC [V]
Figure 39. Limit ON Duty Time at Start-up vs Supply Voltage
Figure 40. Start Assist Duty 1 vs Supply Voltage
Start Assist Duty 2: D OHS2[%]
65
60
55
-40°C
25°C
105°C
50
45
Operating Voltage Range
40
0
5
10
15
20
Supply Voltage: VCC [V]
Figure 41. Start Assist Duty 2 vs Supply Voltage
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BD6994FV
Application Circuit Example (Constant Values are for Reference)
1. PWM Input Application 1(Use of stand-by function)
This is an example application circuit for converting the external PWM duty into DC voltage, and controlling the
rotational speed.
Bypass capacitor, must be
connected near to VCC
Terminal as much as
possible
Maximum output voltage and
current are 20V and 1.2A.
M
－
1
Reverse polarity protection
2
＋
3
Circuit that converts PWM duty
into DC voltage.
Take into consideration the
operating input voltage range of
TH terminal.
.
OUT2
HALL
AMP
HALL
AMP
OUT1
16
15
From PWM
Terminal
Internal
REG
1μF to
HALL
BIAS
GND
GND
4
Vcc
STANDBY
PWM
COMP
MIN
FUNCTION
SELECTOR
PWM
COMP
5
TH
REF
Input PWM signal into PS
terminal. Stand-by function
can be used. Use only
PUSH-PULL input signal.
14
PS
SEL
Limit ON duty at start up
setting
SEL=OPEN: Disable
SEL=10kΩ: Enable
13
REF
to 10kΩ
Stabilization of REF voltage
12
Hall bias is set according to
the amplitude of hall element
output and hall input voltage
range.
CONTROL
PWM
LOGIC
6
To PS(14Pin)
0Ω to
OSC
OSC
0.1μF to
HALL
COMP
H–
11
100pF
SIG
7
FG
QUICK
START
AL
SIGNAL
OUTPUT
0Ω to
HB 10
HALL
BIAS
H
Protection of FG open-drain
0Ω to
SIG
8
LOCK
PROTECT
H+
TSD
9
Input bypass capacitor to
reduce noise in the input.
Output PWM frequency setting
Figure 42. Application of Converting PWM Duty to DC Voltage
Substrate Design Note
a) IC power, motor outputs, and motor ground lines are made as wide as possible.
b) The bypass capacitor and/or Zener diode are connected near to VCC terminal.
c) H+ and H– lines are arranged side by side and connected from the hall element to the IC as short as possible,
because it is easy for the noise to influence the hall lines.
10 HB
AL 8
SIG
c)
H
9 H+
10 HB
AL 8
9 H+
FG 7
SIG
c)
H
FG 7
11 H–
11 H–
a)
Long lines
12 REF
a)
Short lines
＋
VCC 3
12 REF
Far From IC
b)
14 PS
4 MIN
b)
4 MIN
OUT1 15
6 OSC
OUT2 2
M
OUT2 2
5 TH
GND
PWM
Near to IC
14 PS
OUT1 15
6 OSC
＋
VCC 3
M
a)
a)
SEL 13
5 TH
GND
PWM
1
16
a)
SEL 13
1
16
a)
a)
a)
－
Figure 43. Bad Layout Image of the Substrate
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BD6994FV
Application Circuit Example (Constant Values are for Reference)
2. DC Voltage Input Application 1
This is an example application circuit for fixed rotation speed control by DC voltage. In this application, minimum
rotational speed cannot be set. Moreover, output duty changes depending on the TH voltage. Function of limit ON duty
at start up can be set using the SEL terminal.
M
－
1
2
GND
GND
OUT2
HALL
AMP
HALL
AMP
3 VCC
MIN terminal is pulled up to
REF terminal.
The minimum output duty
setting is invalid.
15
Internal
REG
1μF to
＋
OUT1
16
4
STANDBY
PWM
COMP
MIN
to 10kΩ
PS
FUNCTION
SELECTOR
SEL
PWM
COMP
5
TH
REF
REF
14
13
Limit ON duty at start up
SEL=OPEN: Disable
SEL=10kΩ: Enable
to 10kΩ
12
CONTROL
Set TH voltage less than
OSC high (typ. 3.6V)
LOGIC
6
0Ω to
OSC
OSC
0.1μF to
HALL
COMP
H–
11
100pF
SIG
7
0Ω to
SIG
8
FG
QUICK
START
AL
SIGNAL
OUTPUT
HB 10
HALL
BIAS
LOCK
PROTECT
H+
TSD
0Ω to
H
9
Figure 45. Application of DC Voltage Input 1
3. DC Voltage Input Application 2
This is an example application circuit for fixed rotation speed control by DC voltage. In this application, output duty
changes depending on the MIN voltage. Function of Start Duty Assist can be set using the SEL terminal.
M
－
1
2
GND
GND
OUT2
HALL
AMP
HALL
AMP
3 VCC
MIN terminal is pulled up to
REF terminal.
The minimum output duty
setting is invalid.
4
MIN
STANDBY
PWM
COMP
FUNCTION
SELECTOR
PWM
COMP
5
TH
REF
to 10kΩ
TH terminal is pulled up to
REF terminal.
The Limit ON Duty is invalid.
LOGIC
0Ω to
SEL
REF
14
13
Start Duty Assist
SEL=OPEN: 53%
SEL=10kΩ: 33%
to 10kΩ
12
OSC
OSC
HALL
COMP
0.1μF to
H–
11
100pF
7
0Ω to
SIG
PS
CONTROL
6
SIG
15
Internal
REG
1μF to
＋
OUT1
16
8
FG
QUICK
START
AL
SIGNAL
OUTPUT
HALL
BIAS
LOCK
PROTECT
TSD
HB 10
H+
0Ω to
H
9
Figure 46. Application of DC Voltage Input 2
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BD6994FV
Application Circuit Example (Constant Values are for Reference)
4. DC Voltage Input Application 3 (Thermistor Control Application)
This is an example application circuit for controlling the rotational speed by ambient temperature. In this application, if
the thermistor is OPEN, the IC operates at the set minimum rotational speed. Output duty changes depending on the
TH voltage. Function of limit ON duty at start up can be set using the SEL terminal.
M
－
1
Set MIN voltage less than
OSC high (typ. 3.6V)
2
GND
GND
OUT2
HALL
AMP
HALL
AMP
3 VCC
The input voltage is
changeable in the ambient
temperature set by the
thermistor constant.
15
Internal
REG
1μF to
＋
OUT1
16
4
STANDBY
PWM
COMP
MIN
PS
FUNCTION
SELECTOR
SEL
PWM
COMP
5
TH
REF
REF
14
13
12
CONTROL
Linearization correction
resistance if necessary.
LOGIC
6
OSC
OSC
0.1μF to
HALL
COMP
H–
11
100pF
SIG
Limit ON duty at start up
SEL=OPEN: Disable
SEL=10kΩ: Enable
to 10kΩ
7
FG
QUICK
START
AL
SIGNAL
OUTPUT
0Ω to
0Ω to
SIG
8
HB 10
HALL
BIAS
LOCK
PROTECT
H+
TSD
0Ω to
H
9
Figure 47. Application of Thermistor Control
5. Pulse Input Application (Use of stand-by function)
This is an example application circuit for inverting the external PWM input, and controlling the rotational speed. In this
application, if the external PWM input is OPEN, the IC operates at the set maximum rotational speed. Minimum
rotational speed cannot be set. The output duty changes depending on MIN. Function of Start Duty Assist can be set
using the SEL terminal.
M
GND
GND
1
－
PWM inversion circuit,
Take into consideration the
operating input voltage range
of MIN terminal.
2
OUT2
HALL
AMP
HALL
AMP
3 VCC
Circuit that input direct PWM
(Ref.) PWM input frequency
is 2kHz to 50kHz.
4
MIN
STANDBY
PWM
COMP
FUNCTION
SELECTOR
PWM
COMP
PWM
TH terminal is pulled up by
REF terminal.
The Limit ON Duty is invalid.
5
TH
REF
to 10kΩ
15
From PWM
Terminal
PS
SEL
REF
14
13
12
6
OSC
OSC
HALL
COMP
0.1μF to
H–
11
100pF
SIG
7
FG
QUICK
START
AL
SIGNAL
OUTPUT
0Ω to
0Ω to
SIG
Start Duty Assist
SEL=OPEN: 53%
SEL=10kΩ: 33%
to 10kΩ
CONTROL
LOGIC
To STBY(14Pin)
16
Internal
REG
1μF to
＋
OUT1
Input PWM signal into PS
terminal, can use stand-by
function. Only in the case of
PUSH-PULL input signal.
8
HALL
BIAS
LOCK
PROTECT
TSD
HB 10
H+
0Ω to
H
9
Figure 48. Application of Pulse Input
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Functional Descriptions
1. Variable Speed Operation
The rotating speed changes by PWM duty on the motor outputs (OUT1, OUT2 terminals). PWM operation can be
enabled by
DC Voltage Input in TH Terminal, and MIN Terminal
Pulse Input in MIN Terminal
(1) PWM Operation by DC Input
As shown in Figure 51, to change motor output ON duty, DC voltage input from TH terminal is compared with
triangle wave produced by internal OSC circuit. MIN terminal is for setting the minimum rotating speed. ON duty
is determined by either TH terminal voltage or MIN terminal, whichever is lower.
OSC
OSC
REF
PWM
TH
LPF
PWM
COMP
REF
MIN
PWM
COMP
Figure 49. DC Input Application 1
OSC
REF
H–
High
H+
REF
TH
MIN
OSC
Low
5.0V
3.6V
1.5V
0.0V
GND
OSC
High
OUT1
Low
TH
PWM
COMP
REF
Motor output ON
High
OUT2
Low
MIN
PWM
COMP
Full
Motor
Torque
Min.
Zero
Figure 50. DC Input Application 2
Figure 51. DC Input Operation Timing Chart
Dividing resistance of the internal regulator generates OSC high level (typ. 3.6V) and OSC low level (typ. 1.5V)
voltage, and the ratio of those voltages is designed to be hard to fluctuate. When the input voltage at TH
terminal is constant, effect by fluctuation of OSC H/L voltage is large. However, by setting that an application of
REF voltage generates input voltage via TH, application can be made hard to be affected by voltage fluctuation
of triangle wave. For an application that requires strict precision, determine a value with sufficient margin after
taking full consideration of external constants.
(2) PWM Operation by Pulse Input
Pulse signal can be input to MIN terminal for PWM operation as shown in Figure 53. The ON duty of the output
changes by the cycle of the input pulse signal. The TH terminal is pulled-up in the REF terminal.
H–
High
H+
Low
High
PWM
Low
REF TH
MIN
OSC
REF
5.0V
3.6V
OSC
OSC
1.5V
0.0V
GND
High
TH
PWM
COMP
REF
REF
Low
Motor output ON
High
MIN
PWM
COMP
PWM
Figure 52. Pulse Input Application
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OUT1
OUT2
Low
Full
Motor
Torque
Zero
Figure 53. Pulse Input Operation Timing Chart
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BD6994FV
Functional Descriptions
1. Variable Speed Operation – Continued
(3) Setting of TH and MIN Terminals
The voltage of the TH terminal or MIN terminal becomes irregular when it is open. Please apply voltages to both
terminals when you turn on IC power supply (VCC).
Setting less than OSC High level
(Torque ONsetting)
OK
REF
Pull up setting
(Torque OFFsetting)
OK
TH
MIN
REF
Pull down setting
(Prohibit input)
NG
TH
MIN
REF
Open setting
(Prohibit input)
NG
TH
MIN
REF
TH
MIN
Figure 54. Setting of the Variable Speed Function
(4) Output Oscillatory Frequency Setting
Frequency (Fosc) in which the motor outputs are operated PWM by DC voltage input is set according to
capacity value (Cosc) of the capacitor connected with OSC terminal.
fOSC = |IDOSC x ICOSC|/ (COSC x (|IDOSC| + |ICOSC|) x (VOSCH - VOSCL)) [Hz] (Equation 1)
fOSC: OSC Frequency [Hz]
COSC: OSC Capacitance [F]
IDOSC: OSC Discharge current [A] (Typ 11μA)
ICOSC: OSC Charge current [A] (Typ -11μA)
VOSCH: OSC High voltage [V] (Typ 3.6V)
VOSCL: OSC Low voltage [V] (Typ 1.5V)
(ex.) The frequency when motor output PWM operates becomes about 26.2 kHz when assuming that Cosc is
100pF.
fOSC=|11 x 10-6 x -11 x 10-6| / (100 x 10-12 x (|11 x 10-6| + |-11 x 10-6|) x (3.6-1.5)) = 26.2 x 103 [Hz] (Equation2)
2. Limit ON Duty at Start-up and Function Selector
(1) Limit ON Duty at Start-up
In the application circuit of speed control by DC voltage input, Limit ON Duty at start up function can reduce the
rush current of the motor. It is driven by a constant output duty (DOHL; Typ 53%) within a given period of time
(tOHL; Typ 0.5s). When SEL is LOW (pull-down to GND using R<10kΩ) and TH voltage is less than 3.6V (Typ),
Limit ON Duty at start up function operates under the following conditions:
(a) Power ON
(b) Quick Start
(c) Lock release, Lock detection ON time(TON)
(d) Standby release
DOH
Motor Output
ON Duty[%]
53
0
2.49
OFF
tOHL (Typ 0.5s)
DOHL (Typ 53%)
1.5
ON
Power
Supply
100
3.6
THVoltage
[V]
VTH
Motor
Output ON
Duty
Duty limit
0%
Power ON
Figure 55. Characteristic of Limit ON Duty at Start-up
Input torque
DOHL (Typ 53%)
:Limit ON Duty at start-up
Figure 56. Timing Chart of Power ON
(2) Function Selector of Limit ON Duty
Function of Limit ON duty at start up can be set (Disable or Enable) using the SEL terminal.
Please refer to the timing chart (Figure 56, 61, 62) for each function.
(a) SEL = OPEN (pull up to internal REG); Limit ON Duty at Start-up Disable
(b) SEL = Low (pull down to GND using R<10kΩ); Limit ON Duty at Start-up Enable
Internal
REG
OPEN
SEL
Disable
DUTY LIMIT
START-UP
Internal
REG
CONTROL
LOGIC
Pull down
To GND
FUNCTION
SELECTOR
to 10kΩ
SEL=OPEN
Limit ON Duty at Start-up: Disable
SEL
Enable
DUTY LIMIT
START-UP
CONTROL
LOGIC
FUNCTION
SELECTOR
SEL=pull down to GND
Limit ON Duty at start-up: Enable
Figure 57. Select Function in the DC Voltage Input Application
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Functional Descriptions
3. Start Duty Assist and Duty Selector
(1) Start Duty Assist
In the application circuit of speed control by pulse input, Start Duty Assist can secure a constant starting torque
even at low duty. The IC is driven by a constant output duty (DOHS1; Typ 33% or DOHS2; Typ 53%) within a given
period of time (Typ 0.25s). When TH voltage more than REF-0.1V and MIN voltage is less than 3.6V (Typ), Start
Duty Assist function operates under the following conditions:
(a) Power ON
(b) Quick Start
(c) Lock release, Lock detection ON time (Ton)
(d) Standby release
When the motor rotates, this function is released even if in this time.
Motor output
ON Duty[%]
DOH
53
33
0
50
OFF
Typ 0.25s
DOHS (Typ 53% or 33%)
0
ON
Power
Supply
100
100
MIN ON
Duty[%]
DMIN
Input torque
Motor DOHS (Typ 53% or 33%)
Output ON
Duty
Power ON
Figure 58. Characteristic of Start Duty Assist
Duty assist.
0%
:Start Duty Assist
Figure 59. Timing Chart of Power ON
(2) Duty Selector of Start Duty Assist
Function of Start Duty Assist can be set to either 53% or 33% using the SEL terminal. Please refer to the timing
chart (Figure 59, 62, 63) for each function.
(a) SEL = OPEN (pull up to internal REG); Duty 53%
(b) SEL = Low (pull down to GND using R<10kΩ); Duty 33%
Internal
REG
OPEN
SEL
Duty 53%
START DUTY
ASSIST
Internal
REG
CONTROL
LOGIC
Pull down
to GND
FUNCTION
SELECTOR
to 10kΩ
SEL=OPEN: Start Duty Assist 53%
SEL
Duty 33%
START DUTY
ASSIST
CONTROL
LOGIC
FUNCTION
SELECTOR
SEL=pull down to GND: Start Duty Assist 33%
Figure 60. Duty Select in the Pulse Input Application
(3) Relation with Limit ON Duty Function
As shown in Table1, the function changes depending on the setting of SEL terminal and the two speed control
applications.
Table 1. Speed Control Application and SEL Terminal Setting
SEL Terminal
Speed Control Application
OPEN
10kΩ pull down to GND
DC Voltage Input
(TH<REF-0.5V)
Pulse Input
(TH>REF-0.1V)
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Start Duty Assist :
53%
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Limit ON Duty :
Enable
Start Duty Assist :
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BD6994FV
Functional Descriptions
4. Quick Start
When torque off logic is input by the control signal over a fixed time (1.0ms), the lock protection function is disabled.
The motor can restart quickly once the control signal is applied.
Lock alarm signal (AL) at the time of the Quick Start maintains the logic of the AL signal just before the Quick Start
standby. But when AL signal begins Quick Start standby in Hi-Z and a hall input signal is replaced during Quick Start
standby later, AL signal is changed to L from H.
The lock protection function doesn’t work with an input frequency slower than 1 kHz assuming high level duty = 100%
of the MIN input signal. Input signal frequency must be faster than 2 kHz.
Motor idling
H–
High
H+
Low
TH
3.6V
Lock
Protection
Signal
Enable
Disable
Typ 1.0ms
Quick start standby mode
Motor Output
ON Duty
Input
torque
(SEL=OPEN
or TH>2.49V)
0%
tOHL (Typ 0.5s)
Motor Output
ON Duty
Input
torque
Duty limit
DOHL (Typ 53%)
(SEL<0.8V
and TH<2.49V)
0%
Torque OFF
Motor stop
Torque ON
:Limit ON Duty enable
Figure 61. Quick Start Timing Chart (DC Input Application)
Motor Idling
H–
High
H+
Low
High
MIN
Low
Lock
Protection
Signal
Enable
Disable
Typ 1.0ms
Typ 0.25s
Quick start standby mode
DOHS2 (Typ 53%)
Motor Output
ON Duty
Input
torque
Duty assist.
(SEL=OPEN)
0%
Typ 0.25s
Motor Output
ON Duty
Input
torque
DOHS1 (Typ 33%)
Duty assist.
0%
(SEL<0.8V)
Torque OFF
Motor stop
Torque ON
:Start Duty Assist
Figure 62. Quick Start Timing Chart (Pulse Input Application)
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BD6994FV
Functional Descriptions
5. Lock Protection and Automatic Restart
Motor rotation is detected by hall signal and the IC internal counter set lock detection ON time (TON) and OFF time
(TOFF). Timing chart is shown in Figure 63.
Motor Idling
H–
High
H+
Low
tON (Typ 0.5s)
tOFF (Typ 5.0s)
tOFF
tON
tOFF
tON
High
OUT1
Low
High
OUT2
Low
High
FG
Low
High
AL
Low
Input
torque
Motor Output
ON Duty
(SEL=OPEN
or TH>2.49V)
0%
tOHL (Typ 0.5s)
Motor Output
ON Duty
(SEL<0.8V
and TH<2.49V)
Typ 0.25s
Motor Output
ON Duty
(TH=REF
and MIN<3.6V)
Motor lock Lock detection
Lock release
: High impedance
Input
torque
Duty limit
0%
Input
torque
Duty assist.
0%
:Limit ON Duty
:Start Duty Assist 53% or 33%
Figure 63. Lock Protection (Incorporated Counter System) Timing Chart でゅーて
6. Hall Input Setting
(1) Hall Input Setting
Hall input voltage range is shown in operating conditions (P.1). Adjust the value of hall element bias resistor R 1
in Figure 65 so that the input voltage of a hall amplifier is input in "hall input voltage range" including signal
amplitude.
IH
Hall input upper limit
H–
3V (Vcc>9V)
Vcc/3V (Vcc<9V)
HALL
BIAS
HB
C1
Hall bias current;
IH[A] = Vhb[V] / (RH+R1)[Ω]
Hall
H–
H+
Operating hall input
voltage range
HALL
AMP
H–
RH
H+
H+
Hall input lower limit
HALL
COMP
0.4V
Figure 64. Hall Input Voltage Range
C2
R1
Figure 65. Hall Input Application
(2) Reducing the Noise of Hall Signal
VCC noise or the like depending on the wiring pattern of board may affect Hall element. In this case, place a
capacitor like C1 in Figure 65. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, place a capacitor like C2.
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BD6994FV
Functional Descriptions
7. BTL Soft Switching Function (Silent Drive Setting)
(1) Motor Output Slope by the Hall Input Amplitude
Input signal to hall amplifier (H+, H–) is amplified to produce an output signal (OUT1, OUT2).
When the hall element amplitude is small, the slope of the output waveform is gentle. When it is large, the slope
of the output waveform is steep.
Gain of 48.5dB (270 times) is provided between input and output, therefore, an appropriate hall element input
signal must be applied to the IC such that output waveform swings. An input of more than 150mVpp (Hall
amplitude difference conversion) is recommended.
Hall amplitude; Large
Hall amplitude; Middle
Hall amplitude; Small
Large
H–
Mid.
Small
Small
Mid.
H+
Large
High
OUT1
Low
High
OUT2
Low
Motor
Current
0A
Figure 66. Hall Input Amplitude and the Motor Output Waveform
(2) Drive System at DC Voltage Input
At the speed controlled by the DC voltage input to TH terminal, BD6994FV automatically adjusts the
regeneration section during phase change of output depending on TH voltage. As a result, the motor becomes
closer to H bridge drive at high speed rotation, and contributes to lower power consumption
Rotate at high speed (0.2V < TH < 1.5V)
Rotate at middle speed (1.5V < TH < 2.0V)
Rotate at low speed (2.0V < TH < 3.6V)
H–
H+
High
OUT1
Low
High
OUT2
Low
Motor
Current
0A
Figure 67. TH Voltage and Motor Output Waveform (PWM by the TH voltage is Omitted for a Functional Description)
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Functional Descriptions
8. Stand-by
When L logic of PS pin is input by the control signal over a fixed time (1.0ms), the IC will be in stand-by mode.
In stand-by mode, AL signal becomes L logic and FG signal becomes Hi-Z logic.
When H logic of PS pin is input by the control signal, the IC is in normal drive mode.
When AL pin is not used in stand-by mode, the motor current becomes 160uA (VCC=12V,Typ).
Motor idling
空転
H–
High
H+
Low
High
PS
Low
REF/HB
Typ 1.0ms
OFF
Stand-by
High
OUT1
Low
High
OUT2
Low
High
FG
Low
Torque OFF
Motor Stop
Torque ON
Figure 68.Stand-by Timing Chart
When PS pin is used like in the application circuit example, use PUSH-PULL PWM signal input.
PWM signal input of the open Drain / Collector cannot be used. Because internal resistance (200kΩ: pull up to internal
REG) is high, using open Drain / Corrector is not enough for speed of H input.
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BD6994FV
Safety Measure
1. Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 69. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
After reverse connection
In normal energization
Reverse power connection
VCC
destruction prevention
VCC
I/O
Circuit
VCC
I/O
Circuit
Block
Circuit
Block
GND
GND
Internal circuit impedance is high
 Amperage small
I/O
Block
GND
Large current flows
 Thermal destruction
No destruction
Figure 69. Flow of Current When Power is Connected Reversely
2. Measure against VCC Voltage Rise by Back Electromotive Force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
Phase
Switching
ON
ON
ON
Figure 70. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C).
(A) Capacitor
(B) Zenner diode
ON
(C) Capacitor & Zenner diode
ON
ON
ON
ON
ON
Figure 71. Measure against Vcc and Motor Driving Outputs Voltage
Rise at Regenerative Braking
3. Problem of GND line PWM Switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
4. Protection of Rotation Speed Pulse (FG) and/or Lock Alarm (AL) Open-Drain Output
FG and/or AL output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the
absolute maximum rating, when FG and/or AL terminal is directly connected to power supply, could damage the IC.
Motor Unit
VCC
Controller
Motor
Driver
Driver
M
AL
FG
Protection
Resistor
Pull-up
Resistor
SIG
Connector
GND
PWM Input
Prohibit
Figure 72. GND Line PWM Switching Prohibited
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Figure 73. Protection of FG/AL Terminal
TSZ02201-0H1H0B101220-1-2
13.Jul.2015 Rev.002
BD6994FV
M
Power Consumption
1. Current Pathway
－
The current pathways that relates to driver IC are
the following, and shown in Figure 74.
(1) Circuit Current (ICC)
＋
(2) Motor Driving Current (IM)
(3) Reference Bias Current to the LPF and Resistors (IREF)
(4) Hall Bias Current to the Hall Element (IHB)
(5) FG(AL) Output Sink Current (ISO)
1
2
GND
GND
OUT2
HALL
AMP
HALL
AMP
IM
3
VCC
STANDBY
ICC
4
PWM
COMP
MIN
PW(a): Power consumption [W]
VCC: VCC voltage [V]
ICC: Circuit current [A]
(Expect hall bias current (IHB))
FUNCTION
SELECTOR
PWM
COMP
5
TH
REF
PS
SEL
REF
14
13
12
IREF
CONTROL
LOGIC
6
SIG
15
Internal
REG
PWM
2. Calculation of Power Consumption
(1) Circuit Current (Icc)
PW(a) = VCC x ICC [W] (Equation3)
OUT1
16
ISO
7
SIG
8
OSC
HALL
COMP
OSC
H–
11
IHB
FG
QUICK
START
AL
SIGNAL
OUTPUT
HALL
BIAS
LOCK
PROTECT
TSD
HB 10
H+
H
9
Figure 74. Current Pathway of IC
(2) Motor Driving Current (IM)
PW(b) = ((VOH+VOL) x IM) x T2/T1 + (ICHANGE / 2 x VCC / 4) x T3/ T1 [W] (Equation4)
PW(b): Power consumption [W]
VOH: Output high voltage [V]
VOL: Output low voltage [V]
IM: Motor driving average current [A]
ICHANGE: Motor driving current of BTL initiation [A]
(3) Reference Bias Current to the LPF and Resistors (IREF)
PW(c) = (VCC - VREF) x IREF [W] (Equation5)
PW(c): Power consumption [W]
VREF: REF voltage [V]
IREF: REF bias current [A]
H–
H+
OUT1
OUT2
I Change
Im
T2
(4) Hall Bias Current to the Hall Element (IHB)
PW(d) = (VCC - VHB) x IHB [W] (Equation6)
T3
T1
Figure 75. Motor Driving Current for calculation
PW(d): Power consumption [W]
VHB: Hall bias voltage [V]
IHB: Hall bias current [A]
(5) FG(AL) Output Sink Current (Iso)
PW(e) = VSO x ISO [W] (Equation7)
PW(e): Power consumption [W]
VSO: FG(AL) output low voltage [V]
ISO: FG(AL) output sink current [A]
Total power consumption of driver IC becomes the following by the above (1) to (5).
PW(ttl) = PW(a) + PW(b) + PW(c) + PW(d) + PW(e) [W] (Equation8)
(ex.)
PW(a) = 12 x 6.5 x 10-3 [W] (Equation9)
PW(b) = ((0.37 + 0.23) x 0.4) x 9/10 + (0.4/2 x 12/4) x 1/10 [W] (Equation10)
PW(c) = (12 - 5.1) x 2.0 x10-3 [W] (Equation11)
PW(d) = (12 - 1.25) x 3.5 x 10-3 [W] (Equation12)
PW(e) = 0.2 x 5.0 x 10-3 [W] (Equation13)
PW(ttl) = 0.406 [W] (Equation14)
Refer to next page when you calculate the chip surface temperature (Tj) and the package surface temperature (Tc) by
using the power consumption value.
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BD6994FV
Power Dissipation
1. Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip into the package, that is junction temperature of the absolute maximum
rating, depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this maximum
joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature.
Therefore, when a power dissipation exceeds the absolute maximum rating, the operating temperature range is not a
guarantee. The maximum junction temperature is in general equal to the maximum value in the storage temperature
range.
2. Thermal Resistance
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter
which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of
the substrate mounting, thermal resistances from the chip junction to the ambience and to the package surface are
shown respectively with θja[°C/W] and θjc[°C/W]. Thermal resistance is classified into the package part and the
substrate part, and thermal resistance in the package part depends on the composition materials such as the mold
resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat
dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be
decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model and calculations are shown in Figure 76, and Equation 15 and 16, respectively.
θja = (Tj - Ta) / P [°C/W] (Equation 15)
θjc = (Tj - Tc) / P [°C/W] (Equation 16)
Ambient temperature: Ta[°C]
Package surface Temperature: Tc[°C]
θja[°C/W]
where:
θja is the thermal resistance from the chip junction
to the ambience
θjc is the thermal resistance from the chip junction
to the package surface
Tj is the junction temperature
Ta is the ambient temperature
Tc is the package surface temperature
P is the power consumption
Chip surface temperature: Tj[°C]
θjc[°C/W]
Mouting Substrate
Figure 76. Thermal Resistance Model of Surface Mount
Even if it uses the same package, thermal resistance θja and θjc are changed depending on the chip size, power
consumption, and the measurement environments of the ambient temperature, the mounting condition, and the wind
velocity, etc. Thermal resistance under a certain regulated condition is shown in Table 2 as a reference data when the
FR4 glass epoxy substrate (70mm x 70mm x 1.6mm and 3% or less in the area of the copper foil) is mounted.
Table 2. Thermal Resistance (Reference Data)
Rohm Standard (Note 1)
θja
θjc
Unit
°C/W
°C/W
Mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board
3. Thermal De-rating Curve
Thermal de-rating curve indicates power that can be
consumed by IC with reference to ambient
temperature. Power that can be consumed by IC
begins to attenuate at certain ambient temperature
(25°C), and becomes 0W at the maximum joint
temperature (150°C). The inclination is reduced by
the reciprocal of thermal resistance θja. The thermal
de-rating curve under a certain regulated condition
is shown in Figure 77.
1.0
Power Dissipation: Pd[W]
(Note 1)
One-layer
142.9
36
0.8
-1/θja=-7.0mW/°C
0.6
0.4
Operating temp range
0.2
0.0
-50
-25
0
25
50
75
100
125
150
Ambient Temperature: Ta[°C]
Figure 77. Power Dissipation vs Ambient Temperature
(Mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy
substrate)
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BD6994FV
I/O Equivalence Circuit (Resistance Values are Typical)
1. Power supply terminal,
and Ground terminal
2. Hall input terminals,
3. Motor output pins
Output duty controllable input
pin, and Minimum output duty
setting pin
4. Reference voltage
output and Hall bias pin
Vcc
Vcc
Vcc
H+
H–
TH
MIN
GND
REF
HB
OUT1
OUT2
1kΩ
5. Duty control start up function
setting pin
Internal REG
6. Oscillating capacitor
connecting pin
Internal REG
7. Speed pulse signal output pin
and Lock alarm signal output pin
Internal REG
Vcc
10kΩ
Internal REG
200kΩ
150kΩ
SEL
8. Power Save pin
1kΩ
5Ω
1kΩ
FG
AL
PS
10kΩ
OSC
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BD6994FV
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage the ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the power dissipation stated in this
datasheet is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this
absolute maximum rating, increase the board size and copper area to raise heat dissipation capability.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, width of power and ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. To prevent damage from
static discharge, ground the IC during assembly and use similar precautions during transport and storage. The IC’s
power supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process.
10. Mounting Errors and Inter-pin Short
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD6994FV
Operational Notes
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. Especially, if it is not expressed on the datasheet, unused input pins should be
connected to the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 78. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown (TSD) Circuit
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction
temperature falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD6994FV
Physical Dimension, Tape and Reel Information
Package Name
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BD6994FV
Ordering Information
B
D
6
9
9
Part Number
4
F
V
Package
･FV; SSOP-B16
GE 2
-
Packaging and forming specification
･G;Halogen free
･E2;Embossed tape and reel
Marking Diagram
SSOP-B16
(TOP VIEW)
D 6 9 9 4
Part Number
LOT Number
1PIN Mark
Revision History
Date
Revision
18.May.2015
13.Jul.2015
001
002
Comments
New Release
Change of Ordering Information
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD6994FV - Web Page
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