1SS419 TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type 1SS419 High-Speed Switching Applications Small package • Low forward voltage: VF (3) = 0.56 V (typ.) • Low reverse current: IR = 5 μA (max) CATHODE MARK • Unit: mm Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit VRM 45 V Reverse voltage VR 40 V Maximum (peak) forward current IFM 200 mA Maximum (peak) reverse voltage Average forward current IO 100 mA IFSM 1 A Power dissipation P* 100 mW Junction temperature Tj 125 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −40~100 °C Surge current (10 ms) sESC JEDEC ― JEITA ― TOSHIBA 1-1K1A Weight: 0.0011 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). * Mounted on a glass-epoxy circuit board of 20 × 20 mm, pad dimensions of 4 × 4 mm. Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit VF (1) IF = 1 mA ― 0.28 ― VF (2) IF = 10 mA ― 0.36 ― VF (3) IF = 50 mA ― 0.56 0.62 Reverse current IR VR = 40 V ― ― 5 μA Total capacitance CT VR = 0, f = 1 MHz ― 15 ― pF Forward voltage Equivalent Circuit (Top View) V Marking X 1 2007-11-01 1SS419 IR – VR IF - VF 100u 100 100 Ta=100°C 10 REVERSE CURRENT IR (A) FORWARD CURRENT IF (mA) 10u 10 Ta = 100°C 25 -25 1 75 50 1u1 25 100n 0 0 10n0 1n0 -25 0 100p 0.1 10p0 0 0.2 0.4 0.6 FORWORD VOLTAGE VF (V) 0.8 0 10 20 REVERSE VOLTAGE 40 P - Ta CT - VR 140 100 P (mW) Ta = 25°C f = 1MHz 10 POWER DISSIPATION TOTAL CAPACITANCE CT (pF) 30 VR (V) 1 0.1 Mounted on a glass glassepoxy circuit board of 20 x 20 mm, pad dimensions of 4 x 4 mm. 120 100 80 60 40 20 0 0 10 20 30 40 0 REVERSE VOLTAGE VR (V) 25 50 75 100 125 150 AMBIENT TEMPERATURE Ta (°C) 2 2007-11-01 1SS419 RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 3 2007-11-01