ASB ALN0892 Internally matched lna module Datasheet

plerowTM ALN0892
Internally Matched LNA Module
Features
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
· S21 = 34.5 dB @ 824 MHz
= 33.5 dB @ 894 MHz
· S21 = 34.0 dB @ 890 MHz
= 33.0 dB @ 960 MHz
· NF of 0.65 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Specifications (in Production)
2-stage Single Type
Typ. @ T = 25C, Vs = 5 V, Freq. = 859, 925 MHz, Zo.sys = 50 ohm
Specifications
Parameter
Unit
CDMA
Min
Frequency Range
Typ
GSM
Max
Min
MHz
824
dB
33
Gain Flatness
dB
 0.5
 0.6
 0.5
 0.6
Noise Figure
dB
0.65
0.70
0.60
0.65
Output IP3
dBm
S11 / S22 (2)
dB
Output P1dB
dBm
Switching Time (3)
38
mA
Supply Voltage
V
Impedance
Package Type & Size
34
32.5
39
38
960
20
Website: www.asb.co.kr
E-mail: [email protected]
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
39
-18 / -12
21
20
170
More Information
33.5
-18 / -12
sec
Supply Current
890
Max
Gain
(1)
894
Typ
21
-
190
170
190
5

50
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
plerow
Pin Number
Function
ALN0892
3
RF In
ASB Inc.
(Top View)
(Bottom View)
8
RF Out
10
Vs
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Solder Stencil Area
(Side View)
Ø 0.4 plated thru holes to ground plane
(Recommended Footprint)
1/5
www.asb.co.kr
August 2017
plerowTM ALN0892
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
824~960 MHz
+5 V
S-parameters & K Factor
Noise Figure
OIP3
2/5
P1dB
www.asb.co.kr
August 2017
plerowTM ALN0892
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
859  35 MHz
+5 V
S-parameters & K Factor
Noise Figure
OIP3
3/5
P1dB
www.asb.co.kr
August 2017
plerowTM ALN0892
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
925  35 MHz
+5 V
4/5
S-parameters & K Factor
Noise Figure
OIP3
P1dB
www.asb.co.kr
August 2017
plerowTM ALN0892
Internally Matched LNA Module
Application Circuit
VS
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
C2
ALN
IN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for
the best electrical performance.
2)
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
20~40 sec
260C
Ramp-up
(3˚C/sec)
200C
Ramp-down
(6C/sec)
OUT
IN
150C
Size 25x25mm
(for ALN Series – 13x13mm)
60~180 sec
Copyright 2009-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no responsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced
in any form or by any means without the prior written consent of ASB.
5/5
www.asb.co.kr
August 2017
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