AP70SL500AP
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
VDS @ Tj,max.
750V
▼ Fast Switching Characteristic
RDS(ON)
0.5Ω
▼ Simple Drive Requirement
3
ID
8.8A
▼ 100% Rg & UIS Test
D
G
▼ RoHS Compliant & Halogen-Free
S
Description
AP70SL500A series are from Advanced Power innovated design and
silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer
with an extreme efficient device for use in a wide range of power
applications.
The TO-220 package is widely preferred for all commercial-industrial
through hole applications. The low thermal resistance and low
package cost contribute to the worldwide popular package.
G
D
TO-220(P)
S
.
Absolute Maximum Ratings@Tj=25oC(unless otherwise specified)
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
Rating
Units
700
V
+20
V
3
8.8
A
3
5.6
A
Drain Current, VGS @ 10V
Drain Current, VGS @ 10V
1
IDM
Pulsed Drain Current
20
A
dv/dt
MOSFET dv/dt Ruggedness (VDS = 0 …400V )
50
V/ns
PD@TC=25℃
Total Power Dissipation
78.1
W
PD@TA=25℃
Total Power Dissipation
2
W
48
mJ
15
V/ns
4
Single Pulse Avalanche Energy
EAS
5
dv/dt
Peak Diode Recovery dv/dt
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
1.6
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
62
℃/W
Data & specifications subject to change without notice
1
201505191
AP70SL500AP
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
Min.
Typ.
700
-
-
V
VGS=10V, ID=2A
-
-
0.5
Ω
VGS=0V, ID=250uA
2
Max. Units
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
5
V
gfs
Forward Transconductance
VDS=10V, ID=2A
-
6
-
S
IDSS
Drain-Source Leakage Current
VDS=480V, VGS=0V
-
-
100
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
Qg
Total Gate Charge
ID=2A
-
30
48
nC
Qgs
Gate-Source Charge
VDS=480V
-
7
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
12
-
nC
td(on)
Turn-on Delay Time
VDD=300V
-
12
-
ns
tr
Rise Time
ID=2A
-
5
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω
-
45
-
ns
tf
Fall Time
VGS=10V
-
15
-
ns
Ciss
Input Capacitance
VGS=0V
-
Coss
Output Capacitance
VDS=100V
-
40
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
2.5
-
pF
Rg
Gate Resistance
f=1.0MHz
-
3.6
7.2
Ω
Min.
Typ.
.
1150 1840
pF
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
IS=2A, VGS=0V
-
0.8
-
V
trr
Reverse Recovery Time
IS=8A, VGS=0V
-
350
-
ns
Qrr
Reverse Recovery Charge
dI/dt=50A/µs
-
2.9
-
µC
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
3.Limited by max. junction temperature. Maximum duty cycle D=0.75
4.Starting Tj=25oC , VDD=50V , L=150mH , RG=25Ω
5.ISD ≦ ID, VDD ≦ BVDSS, starting TJ = 25oC
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP70SL500AP
20
10
o
T C =25 C
8
ID , Drain Current (A)
16
ID , Drain Current (A)
o
T C =150 C
10V
9.0V
8.0V
7.0V
12
8
0.37Ω
6
10V
9.0V
8.0V
7.0V
V G =6.0V
4
V G =6.0V
4
2
0
0
0
4
8
12
16
20
24
0
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
16
24
32
Fig 2. Typical Output Characteristics
520
3
I D =2A
V G =10V
I D =2A
o
T C =25 C
2.6
480
460
.
Normalized RDS(ON)
500
RDS(ON) (mΩ)
8
V DS , Drain-to-Source Voltage (V)
2.2
1.8
1.4
440
1
420
0.6
0.2
400
4
5
6
7
8
9
-100
10
-50
0
50
100
150
o
V GS Gate-to-Source Voltage (V)
T j , Junction Temperature ( C )
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2
8
I D =250uA
1.5
IS (A)
Normalized VGS(th)
6
4
T j = 150 o C
T j = 25 o C
1
0.5
2
0
0
0
0.2
0.4
0.6
0.8
1
V SD (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-100
-50
0
50
100
150
o
T j , Junction Temperature ( C )
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP70SL500AP
f=1.0MHz
12
10000
I D =2A
V DS =480V
1000
C iss
0.37Ω
8
100
C (pF)
VGS , Gate to Source Voltage (V)
10
6
C oss
10
C rss
4
1
2
0
0.1
0
10
20
30
40
0
200
Q G , Total Gate Charge (nC)
400
600
800
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
Operation in this area
limited by RDS(ON)
ID (A)
10
10us
100us
1
1ms
10ms
100ms
1s
DC1000
T C =25 o C
Single Pulse
0.1
1
10
100
.
Normalized Thermal Response (Rthjc)
100
Duty factor=0.5
0.2
0.1
0.05
0.1
0.02
PDM
0.01
t
Single Pulse
T
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
0.01
0.00001
0.0001
0.001
V DS , Drain-to-Source Voltage (V)
0.01
0.1
1
10
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
100
PD , Power Dissipation (W)
VG
80
QG
10V
60
QGS
QGD
40
20
Charge
Q
0
0
50
100
150
o
T C , Case Temperature ( C )
Fig 11. Total Power Dissipation
Fig 12. Gate Charge Waveform
4
AP70SL500AP
MARKING INFORMATION
Part Number
70SL500A
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
.
5