Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 1/7 CYStech Electronics Corp. High –speed double diode BAS299N3 Features • Small plastic SMD package • High switching speed: max. 4ns • Continuous reverse voltage: max. 100V • Repetitive peak reverse voltage: max. 110V • Repetitive peak forward current: max. 900mA. • Pb-free package Equivalent Circuit Outline SOT-23 Common connection BAS299N3 2 1 3 1：Anode 2：Cathode 3：Common connection Cathode Anode Ordering Information Device BAS299N3-0-T1-G Package SOT-23 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs/ tape & reel in 7” reel Product rank, zero for no rank products Product name BAS299N3 CYStek Product Specification Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Absolute Maximum Ratings @TA=25℃ Parameters Repetitive peak reverse voltage Continuous reverse voltage Continuous forward current(single diode loaded) Continuous forward current(double diode loaded) Repetitive peak forward current Non-repetitive peak forward current @square wave, Tj=125℃ prior to surge t=1μs t=1ms t=1s Total power dissipation(Note 1) Junction Temperature Storage Temperature Symbol VRRM VR IF Min - IFRM IFSM Ptot Tj Tstg -65 Max 110 100 430 250 900 Unit V V 8 2 1 250 150 +150 A A A mW °C °C mA mA Note 1: Device mounted on an FR-4 PCB. Electrical Characteristics @ Tj=25℃ unless otherwise specified Parameters Symbol Forward voltage VF Reverse current IR Diode capacitance Cd Reverse recovery time trr Forward recovery voltage Vfr Conditions Min Typ. - - - - - IF=1mA IF=10mA IF=50mA IF=150mA IF=300mA VR=25V VR=100V VR=25V,Tj=150℃ VR=100V,Tj=150℃ VR=0V, f=1MHz when switched from IF=10mA to IR=10mA,RL=100Ω, measured at IR=1mA when switched from IF=10mA tr=20ns Max 715 855 1 1.2 1.25 30 1 30 50 Unit mV mV V V V nA μA μA μA - 3 pF - - 4 ns - - 1.75 V Thermal Characteristics Symbol Parameter Rth,j-tp Rth, j-a thermal resistance from junction to tie-point thermal resistance from junction to ambient Conditions Value Note 1 360 500 Unit ℃/W ℃/W Note 1: Device mounted on an FR-4 PCB. BAS299N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 3/7 Typical Characteristics Power Derating Curve Forward Current vs Forward Voltage 0.3 Instantaneous Forward Current---IF(mA) 10000 Power Dissipation(W) 0.25 0.2 0.15 0.1 0.05 Pulse width=300μs, 1% Duty cycle 1000 125℃ 100 25°C 75°C 10 0℃ -40°C 1 0 0 25 50 75 100 125 150 0 175 Ambient Temperature---TA(℃) 0.2 0.4 0.6 0.8 1 1.2 1.4 Forward Voltage---VF(V) 1.6 1.8 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 5 100000 10000 Junction Capacitance---C J(pF) Reverse Leakage Current---I R (nA) Tj=125°C Tj=75℃ 1000 Tj=25℃ 100 10 Tj=0° Tj=-40°C 1 4 3 2 1 Tj=25℃, f=1.0MHz 0 0.1 0 20 40 60 Reverse Voltage---VR (V) BAS299N3 80 100 0.1 1 10 100 Reverse Voltage---VR (V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 4/7 Recommended Soldering Footprint BAS299N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 5/7 Reel Dimension Carrier Tape Dimension BAS299N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note :1. All temperatures refer to topside of the package, measured on the package body surface. 2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care should be taken to match the coefficients of thermal expansion between components and PCB. If they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools. BAS299N3 CYStek Product Specification Spec. No. : C328N3 Issued Date : 2017.04.05 Revised Date : Page No. : 7/7 CYStech Electronics Corp. SOT-23 Dimension Marking: Product Code 2A7 Date Code: Year+Month Year: 7→2017, 8→2018 Month: 1→1, 2→2,‧‧‧ 9→9, A→10, B→11, C→12 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Anode 2.Cathode 3.Common connection *:Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0669 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0000 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.70 0.89 1.30 0.30 0.50 1.70 2.30 0.00 0.10 DIM J K L S V L1 Inches Min. Max. 0.0032 0.0079 0.0118 0.0266 0.0335 0.0453 0.0830 0.1161 0.0098 0.0256 0.0118 0.0197 Millimeters Min. Max. 0.08 0.20 0.30 0.67 0.85 1.15 2.10 2.95 0.25 0.65 0.30 0.50 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYSrek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAS299N3 CYStek Product Specification