Superworld C3-3N9S-10 Ceramic chip inductor Datasheet

CERAMIC CHIP INDUCTORS
C3 SERIES
1. PART NO. EXPRESSION :
C3-1N0S-10
(a) Series code
(a)
(b) Inductance code : 1N0 = 1.0nH
(b) (c)
(d)
(d) 10 : RoHS Compliant
(c) Tolerance code : S = ±0.3nH, J = ±5%
2. CONFIGURATION & DIMENSIONS :
A
D
C
B
Unit:m/m
A
B
2.0±0.2
1.25±0.2
C
0.85±0.2
D
1.25±0.2
0.2 ~ 0.8
3. GENERAL SPECIFICATION :
a) Operating temp. : -40°C to +85°C
b) Storage temp. : -10°C to +40°C
c) Humdity range : 70% RH Max.
d) Resistance to solder heat : 265°C.6secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C3 SERIES
4. ELECTRICAL CHARACTERISTICS :
Part Number
Dim. C
±0.2
Inductance
( nH )
Q
Min.
Test
Frequency
( MHz )
SRF
( GHz )
Min.
DCR
(ȍ)
Max.
Rated Current
( mA )
Max.
C3-1N0S-10
0.85
1.0
10
100
10
0.10
300
C3-1N2S-10
0.85
1.2
10
100
10
0.10
300
C3-1N5S-10
0.85
1.5
10
100
4.0
0.10
300
C3-1N8S-10
0603
1.8
10
100
4.0
0.10
300
C3-2N2S-10
0603
2.2
10
100
4.0
0.10
300
C3-2N7S-10
0.85
2.7
12
100
4.0
0.10
300
C3-3N3S-10
0.85
3.3
12
100
4.0
0.13
300
C3-3N9S-10
0.85
3.9
12
100
4.0
0.15
300
C3-4N7S-10
0.85
4.7
12
100
3.5
0.20
300
C3-5N6S-10
0.85
5.6
15
100
3.2
0.23
300
C3-6N8J-10
0.85
6.8
15
100
2.8
0.25
300
C3-8N2J-10
0.85
8.2
15
100
2.4
0.28
300
C3-10NJ-10
0.85
10
15
100
2.1
0.30
300
C3-12NJ-10
0.85
12
15
100
1.9
0.35
300
C3-15NJ-10
0.85
15
15
100
1.6
0.40
300
C3-18NJ-10
0.85
18
15
100
1.5
0.45
300
C3-22NJ-10
0.85
22
18
100
1.4
0.50
300
C3-27NJ-10
0.85
27
18
100
1.3
0.55
300
C3-33NJ-10
0.85
33
18
100
1.2
0.60
300
C3-39NJ-10
0.85
39
18
100
1.0
0.65
300
C3-47NJ-10
0.85
47
18
100
0.9
0.70
300
C3-56NJ-10
0.85
56
18
100
0.8
0.75
300
C3-68NJ-10
0.85
68
18
100
0.7
0.80
300
C3-82NJ-10
0.85
82
18
100
0.6
0.90
300
C3-R10J-10
0.85
100
18
100
0.6
0.90
300
C3-R12J-10
0.85
120
13
50
0.5
0.95
300
C3-R15J-10
1.25
150
13
50
0.5
1.00
300
C3-R18J-10
1.25
180
13
50
0.4
1.10
300
C3-R22J-10
1.25
220
12
50
0.35
1.20
300
C3-R27J-10
1.25
270
12
50
0.3
1.30
300
C3-R33J-10
1.25
330
12
50
0.25
1.40
300
C3-R39J-10
1.25
390
10
50
0.25
1.40
300
C3-R47J-10
1.25
470
10
50
0.20
1.50
300
C3-R56J-10
1.25
560
10
25
0.18
5.00
50
C3-R68J-10
1.25
680
10
25
0.16
5.50
50
Tolerance code :
S : ±0.3nH
J : ±5%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
C3 SERIES
5. CHARACTERISTICS CURVES :
Inductance vs. Frequency Characteristics
Q vs. Frequency Characteristics
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C3 SERIES
6. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
DC Resistance
TEST CONDITION
HP4338 digital milli-ohm meter
Terminal Strength
Appearance : No significant abnormality
Impedance change : Within ±30%
Solder chip on PCB and applied 10N (1.02Kgf) for 10sec
DCR : Shall be satisfied
Appearance : No significant abnormality
Inductance change : Within ±20%
45
45
40
0.8
DCR : Shall be satisfied
Solder a chip on a test substrate, bend the substrate
by 3mm hold for 10s and then return.
Soldering shall be done in accordance with the
recommended PC board pattern and reflow soldering
bending
Substrate Bending
Strength
100
Resistance to Solder
Heat
Appearance : No significant abnormality
Electrical and mechanical characteristics shall
be satisfied
Consult standard MIL-STD-202
METHOD 210
More than 95% coverage of all metabolised area
Solderability
Consult standard J-STD-002
High Temperature
Resistance
Appearance : No mechanical damage.
Inductance : Within ±20% of initial value.
unit : mm
Preheat : 100 ~ 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 265±3°C
Dip Time : 6±1sec.
Measurement to be made after keeping at room temp
for 24±2hrs
Solder Temperature : 240±5°C
Solder : Sn-Ag3.0-Cu0.5
Dip Time : 3±1sec.
Temperature : 85±2°C
Applied Current : rated current (max. value)
Duration : 1008±12hrs
Measurement : After placing for 24 hours (min.) at room
ambient temperature
Humidity Resistance
Appearance : No mechanical damage.
Inductance : Within ±20% of initial value.
Temperature Cycle
Appearance : No mechanical damage.
Inductance : Within ±20% of initial value.
Humidity : 90~95% RH.
Temperature : 60±2°C
Applied Current : rated current (max. value)
Duration : 1008±12hrs
Measurement : After placing for 24 hours (min.) at room
ambient temperature
Condition for 1 cycle
Step1 : -40±3°C 30±3 min.
Step2 : Room temperature 2 to 5 minutes
Step3 : +85±2°C 30±3 min.
Step4 : Room temperature 2 to 5 minutes
Number of cycles : 100
Measurement : After placing for 24 hours (min.) at room
ambient temperature
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C3 SERIES
6. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
Low Temperature
Storage test
Thermal Shock
TEST CONDITION
Appearance : No mechanical damage.
Temperature : -40±2°C
Inductance : Within ±20% of initial value.
Measurement : After placing for 24 hours (min.) at room
ambient temperature
Appearance : No mechanical damage.
Temperature : -40°C, +85°C kept stabilized for
30 minutes each
Inductance : Within ±20% of initial value.
Cycle : 100 cycles
Duration : 1008±12hrs
Measurement : After placing for 24 hours (min.) at room
ambient temperature
Vibration Test
Appearance : No mechanical damage.
Waveform : Sine wave
Frequency : 10-55-10Hz for 1 min.
Inductance : Within ±20% of initial value.
Amplitude : 1.5mm(peak-peak)
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
C3 SERIES
7. SOLDERING :
7-1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
A
TEMPERATURE °C
main heating
1 to 5
°C/sec
Heat time
50 to 150
sec
Heat temperature
120 to 180
°C
C
Slope of temp. rise
1 to 5
°C/sec
D
Time over 230°C
90 ~ 120
sec
Peak temperature
255 ~ 260
°C
Peak hold time
10 max.
sec
No. of mounting
3
times
E
230°C
B
180°C
pre-heating
120°C
normal
temperature
A
B
C
E
D
TIME(sec.)
Slope of temp. rise
(Melting area of solder)
7-2. Soldering Iron
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 3.0mm tip diameter (max)
e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm
f) Limit soldering time to 3 secs.
7-3. Solder Volume :
t
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance. Solder shall be used not to be exceed as shown in right side.
Upper limit
Recommendable
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
C3 SERIES
8. PACKAGING INFORMATION :
8-1. Paper Carrier Tape Packaging
P0
D0
T
B
W
F
E
P2
P1
A
Unreeling direction
A(mm)
B(mm)
W(mm)
F(mm)
E(mm)
P1(mm)
P2(mm)
P0(mm)
D0(mm)
t(mm)
1.45±0.05 2.25±0.05 8.00±0.10 3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.55±0.05 0.95±0.05
8-2. Leader And Trailer Tape
Components
Trailer
Empty compartments
Leader
End
Start
20 pitch or more
110mm or more
400 ~ 560mm
8-3. Configuration
W1
2±0.5
±0.5
A(mm)
N(mm)
W1(mm)
W2(mm)
QTY (PCS)
178±2.0
50 Min.
10±1.5
20 Max.
4000/Reel
A
N
1 3 .0
±
21
8
0.
R1.0
W2
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
CERAMIC CHIP INDUCTORS
C3 SERIES
8-4. Tearing Off Force
F
165° to 180°
Peeling Strength of Cover Tape
Top cover tape
Cover Tape
10g ~ 100g
Base tape
Peel Speed : 300mm/min
8-5. Packaging
1. Reel and a bag of desiccant shall be packed in Nylon or plastic bag
2. Maximum of 5 bags shall be packed in an inner box
3. Maximum of 6 inner boxes shall be packed in an outer box
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 40°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
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