Renesas EL6204CWZ-T7 Laser driver oscillator Datasheet

DATASHEET
EL6204
FN7219
Rev 3.00
October 28, 2015
Laser Driver Oscillator
The EL6204 is a push-pull oscillator used to reduce laser noise.
It uses the standard interface to existing ROM controllers. The
frequency and amplitude are each set with a separate resistor
connected to ground. The tiny package and harmonic
reduction allow the part to be placed close to a laser with low
RF emissions. An auto turn-off feature allows it to easily be
used on combo CD-RW plus DVD-ROM pickups.
Features
If the APC current is reduced such that the average laser
voltage drops to less than 1.1V, the output and oscillator are
disabled, reducing power consumption to a minimum.
• Auto turn-off threshold
The current drawn by the oscillator consists of a small utility
current, plus the peak output amplitude in the positive cycle. In
the negative cycle the oscillator subtracts peak output
amplitude from the laser APC current.
The EL6204 part is available in the space-saving 6 Ld SOT-23
package and is specified for operation from 0°C to +70°C.
• Low power dissipation
• User-selectable frequency from 60MHz to 600MHz
controlled with a single resistor
• User-specified amplitude from 10mAP-P to 100mAP-P
controlled with a single resistor
• Soft edges for reduced EMI
• Small 6 Ld SOT-23 package
Applications
• DVD players
• DVD-ROM drives
• CD-RW drives
• MO drives
• General purpose laser noise reduction
• Local oscillators
IOUT
1
VDD
2
GND1
3
DRIVER
OSCILLATOR
REFERENCE AND
BIAS
AUTO SHUT-OFF
6
RFREQ
5
GND2
4
RAMP
FIGURE 1. BLOCK DIAGRAM
FN7219 Rev 3.00
October 28, 2015
Page 1 of 12
EL6204
TYPICAL
ROM LASER
DRIVER
GAIN
SETTING
RESISTOR
EMI
REDUCTION
FILTERS
IAPC
BEAD
0.1µF
BEAD
FREQUENCY
SETTING
RESISTOR
PNP
RFREQ
LASER
DIODE
+5V
CONTROLLER
4.7µF
0.1µF
1 IOUT
RFREQ 6
2 VDD
GND2 5
3 GND1
RAMP 4
RAMP
0.1µF
GND
RF
BLOCKING
RESISTOR
MAIN BOARD
PHOTO DIODE
FLEX
~10mW
AMPLITUDE
SETTING
RESISTOR
ON PICKUP
LASER OUTPUT
POWER
LASER OUTPUT POWER
THRESHOLD CURRENT
IAPC
0mW
0mA
~60mA
LASER CURRENT
OSCILLATOR CURRENT
FIGURE 2. TYPICAL APPLICATION CIRCUIT
FN7219 Rev 3.00
October 28, 2015
Page 2 of 12
EL6204
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
Pin Descriptions
PACKAGE
(RoHS Compliant
PKG.
DWG. #
EL6204CWZ-T7
BNAA
(Note 4)
6 Ld SOT-23
P6.064A
EL6204CWZ-T7A
BNAA
(Note 4)
6 Ld SOT-23
P6.064A
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials,
and 100% matte tin plate plus anneal (e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
PIN
NUMBER
PIN
NAME
1
IOUT
Current output to laser diode
2
VDD
Positive power for laser driver (4.5V to 5.5V)
3
GND1
Chip ground pin (0V for output)
4
RAMP
Set pin for output current amplitude
5
GND2
Chip ground pin (0V for RFREQ, RAMP)
6
RFREQ
Set pin for oscillator frequency
PIN DESCRIPTION
3. For Moisture Sensitivity Level (MSL), please see product information
page for EL6204. For more information on MSL, please see tech
brief TB363.
4. The part marking is located on the bottom of the part.
Pin Configuration
EL6204
(6 LD SOT-23)
TOP VIEW
FN7219 Rev 3.00
October 28, 2015
1 IOUT
RFREQ 6
2 VDD
GND2 5
3 GND1
RAMP 4
Page 3 of 12
EL6204
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Voltages Applied to:
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
RFREQ, RAMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.0V
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
6 Ld SOT-23 Package (Notes 5, 6) . . . . . . .
230
105
Operating Ambient Temperature Range . . . . . . . . . . . . . . . . 0°C to +70°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mAP-P
Power Dissipation (max) . . . . . . . . . . . . . . . . . . . . . .See Curves on page 10
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
VOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2V to 3V
RFREQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3kΩ(min)
RAMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25kΩ (min)
FOSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 to 600MHz
IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 to 100mAP-P
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. For JC, the “case temp” location is taken at the package top center.
Electrical Specifications
VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 5.21kΩ (FOSC = 350MHz), RAMP = 2.54kΩ (IOUT = 50mAP-P
measured at 60MHz), VOUT = 2.2V.
PARAMETER
DESCRIPTION
TEST CONDITIONS
MIN
(Note 7)
TYP
MAX
(Note 7)
5.5
V
550
750
µA
22
mA
UNIT
SUPPLY AND REFERENCE VOLTAGE CHARACTERISTICS
PSOR
Power Supply Operating Range
ISO
Supply Current Disabled
VOUT < VCUTOFF
ISTYP
Supply Current Typical Conditions
RFREQ = 5.21kΩRAMP = 2.54kΩ
18.5
ISLO
Supply Current Low Conditions
RFREQ = 30.5kΩ, RAMP = 12.7kΩ
4.75
mA
RFREQ = 3.05kΩRAMP = 1.27kΩ
32
mA
1.27
V
ISHI
Supply Current High Conditions
VFREQ
Voltage at RFREQ Pin
VRAMP
Voltage on RAMP Pin
VCUTOFF
Monitoring Voltage of IOUT Pin
4.5
1.27
1.1
V
1.4
V
400
MHz
OSCILLATOR CHARACTERISTICS
FOSC
Frequency Tolerance
FHIGH
Frequency Range High
RFREQ = 3.05kΩ
600
MHz
FLOW
Frequency Range Low
RFREQ = 30.5kΩ
60
MHz
TCOSC
Frequency Temperature Sensitivity
0°C to +70°C ambient
50
ppm/°C
PSRROSC
Frequency Change F/F
VDD from 4.5V to 5.5V
1
%
Driver Characteristics
Unit to unit frequency variation
300
350
VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 30.5kΩ (FOSC = 60MHz), RAMP = 2540Ω (IOUT = 50mAP-P measured
at 60MHz), VOUT = 2.2V.
PARAMETER
DESCRIPTION
TEST CONDITIONS
MIN
(Note 7)
TYP
MAX
(Note 7)
UNIT
AMPHIGH
Amplitude Range High
RAMP = 1.27kΩ
100
mAP-P
AMPLOW
Amplitude Range Low
RAMP = 12.7kΩ
10
mAP-P
IOSNOM
Offset Current at 2.2V
RFREQ = 5210ΩVOUT = 2.2V
-4
mA
IOSHIGH
Offset Current at 2.8V
RFREQ = 5210ΩVOUT = 2.8V
-4.8
mA
IOSLOW
Offset Current at 1.8V
RFREQ = 5210ΩVOUT = 1.8V
-3.5
mA
IOUTP-P
Output Current Tolerance
Defined as one standard deviation
2
%
Duty Cycle
Output Push Time/Cycle Time
RFREQ = 5210Ω
43
%
PSRRAMP
Amplitude Change of Output I/I
VDD from 4.5V to 5.5V
-54
dB
FN7219 Rev 3.00
October 28, 2015
Page 4 of 12
EL6204
Driver Characteristics
VDD = +5V, TA = +25°C, RL = 10Ω, RFREQ = 30.5kΩ (FOSC = 60MHz), RAMP = 2540Ω (IOUT = 50mAP-P measured
at 60MHz), VOUT = 2.2V. (Continued)
PARAMETER
DESCRIPTION
MIN
(Note 7)
TEST CONDITIONS
TYP
MAX
(Note 7)
UNIT
tON
Auto Turn-on Time
Output voltage step from 0V to 2.2V
15
µs
tOFF
Auto Turn-off Time
Output voltage step from 2.2V to 0V
0.5
µs
IOUTN
Output Current Noise Density
RFREQ = 5210Ωmeasured at 10MHz
2.5
nA/Hz
NOTE:
7. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
IOUT Control
VOUT
IOUT
Less than VCUTOFF
OFF
More than VCUTOFF
Normal Operation
Typical Performance Curves
VDD = 5V, TA = 25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified.
500
7
300
200
100
MEASURED FROM
-40°C TO +85°C
6
NUMBER OF PARTS
NUMBER OF PARTS
400
8
TYPICAL
PRODUCTION
DISTORTION
5
4
3
2
1
0
FREQUENCY (MHz)
90
78
66
54
42
FREQUENCY TC (ppm/°C)
FIGURE 3. FREQUENCY DISTRIBUTION
FIGURE 4. FREQUENCY DRIFT WITH TEMPERATURE
700
700
FREQUENCY = 1824*1kΩ/RFREQ (MHz)
FREQUENCY = 1824*1kΩ/RFREQ (MHz)
600
FREQUENCY (MHz)
600
FREQUENCY (MHz)
30
18
6
390
382
374
366
358
350
342
334
326
318
310
0
500
400
300
200
500
400
300
200
100
100
0
0
0
5
10
15
20
25
RFREQ (kΩ)
FIGURE 5. FREQUENCY vs RFREQ
FN7219 Rev 3.00
October 28, 2015
30
35
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
1kΩ / RFREQ
FIGURE 6. FREQUENCY vs 1/RFREQ
Page 5 of 12
EL6204
Typical Performance Curves
VDD = 5V, TA = 25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified. (Continued)
180
180
(OVERSHOOT INCLUDED)
140
120
AMPLITUDE P-P = 127*1kΩ/RAMP (mA)
MEASURED AT 60MHz
100
80
(OVERSHOOT NOT INCLUDED)
60
40
120
100
80
60
0
0
4
6
8
10
12
AMPLITUDE P-P =
127*1kΩ/RAMP (mA)
MEASURED AT 60MHz
40
20
2
(OVERSHOOT INCLUDED)
140
20
0
IOUT(P-P) MEASURED AT 60/350/600MHz
160
IOUT(P-P) MEASURED AT 60/350/600MHz
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
160
14
(OVERSHOOT NOT INCLUDED)
0
0.1
0.2
0.3
RAMP (kΩ)
FIGURE 7. OUTPUT CURRENT vs RAMP
0.6
0.7
0.8
0.9
35
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
0.5
FIGURE 8. OUTPUT CURRENT vs 1/RAMP
25
20
15
0
30
25
20
15
10
0
0
5
10
15
20
25
30
35
0
5
10
RFREQ (kΩ)
20
25
30
35
FIGURE 10. SUPPLY CURRENT vs RAMP
100
355
95
IOUT( P-P) (mA)
360
350
345
340
4.4
15
RAMP (kΩ)
FIGURE 9. SUPPLY CURRENT vs RFREQ
FREQUENCY (MHz)
0.4
1kΩ / RAMP
90
85
4.6
4.8
5.0
5.2
5.4
SUPPLY VOLTAGE (V)
FIGURE 11. FREQUENCY vs SUPPLY VOLTAGE
FN7219 Rev 3.00
October 28, 2015
5.6
80
4.4
4.6
4.8
5.0
5.2
5.4
5.6
SUPPLY VOLTAGE (V)
FIGURE 12. PEAK-TO-PEAK OUTPUT CURRENT vs SUPPLY VOLTAGE
Page 6 of 12
EL6204
Typical Performance Curves
VDD = 5V, TA = 25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified. (Continued)
400
380
20
FREQUENCY (MHz)
SUPPLY CURRENT (mA)
21
19
18
360
340
320
17
4.4
4.6
4.8
5.0
5.2
5.4
300
-50
5.6
0
SUPPLY VOLTAGE (V)
50
100
150
AMBIENT TEMPERATURE (°C)
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 14. FREQUENCY vs TEMPERATURE
30
95
SUPPLY CURRENT (mA)
IOUT( P-P) (mA)
90
85
80
75
70
25
20
15
65
60
-50
0
50
100
150
10
-50
0
FIGURE 15. PEAK-TO-PEAK OUTPUT CURRENT vs TEMPERATURE
40mA
4.0ns
RFREQ = 30.3kΩ
RAMP = 2.54kΩ
FIGURE 17. OUTPUT CURRENT AT 60MHz
FN7219 Rev 3.00
October 28, 2015
50
100
150
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 16. SUPPLY CURRENT vs TEMPERATURE
40mA
1.0ns
RFREQ = 2.51kΩ
RAMP = 2.54kΩ
FIGURE 18. OUTPUT CURRENT AT 350MHz
Page 7 of 12
EL6204
Typical Performance Curves
VDD = 5V, TA = 25°C, RL = 10Ω, RFREQ = 5.21kΩ, RAMP = 2.54kΩ, VOUT = 2.2V unless
otherwise specified. (Continued)
40mA
0.4ns
RFREQ = 3.03kΩ
RAMP = 2.54kΩ
RELATIVE AMPLITUDE (dB)
10
-10
-30
-50
-70
-90
340
344
348
352
356
360
FREQUENCY (MHz)
FIGURE 19. OUTPUT CURRENT AT 600MHz
Applications Information
Product Description
The EL6204 is a solid state, low-power, high-speed laser
modulation oscillator with external resistor-adjustable operating
frequency and output amplitude. It is designed to interface easily
with laser diodes to break up optical feedback resonant modes
and thereby reduce laser noise. The output of the EL6204 is
composed of a push-pull current source, switched alternately at
the oscillator frequency. The output and oscillator are
automatically disabled for power saving when the average laser
voltage drops to less than 1.1V. The EL6204 has the operating
frequency from 60MHz to 600MHz and the output current from
10mAP-P to 100mAP-P. The supply current is only 18.5mA for the
output current of 50mAP-P at the operating frequency of
350MHz.
Theory of Operation
A typical semiconductor laser will emit a small amount of
incoherent light at low values of forward laser current. However,
after the threshold current is reached, the laser will emit
coherent light. Further increases in the forward current will cause
rapid increases in laser output power. A typical threshold current
is 35mA and a typical slope efficiency is 0.7mW/mA.
When the laser is lasing, it will often change its mode of
operation slightly, due to changes in current, temperature or
optical feedback into the laser. In a DVD-ROM, the optical
feedback from the moving disk forms a significant noise factor
due to feedback-induced mode hopping. In addition to the mode
hopping noise, a diode laser will roughly have a constant noise
level regardless of the power level when a threshold current is
exceeded.
The oscillator is designed to produce a low noise oscillating
current that is added to the external DC current. The effective AC
current is to cause the laser power to change at the oscillator
frequency. This change causes the laser to go through rapid
mode hopping. The low frequency component of laser power
noise due to mode hopping is translated up to sidebands around
FN7219 Rev 3.00
October 28, 2015
FIGURE 20. OUTPUT SPECTRUM-WIDEBAND
the oscillator frequency by this action. Since the oscillator
frequency can be filtered out of the low frequency read and serve
channels, the net result is that the laser noise seems to be
reduced. The second source of laser noise reduction is caused by
the increase in the laser power above the average laser power
during the pushing-current time. The signal-to-noise ratio (SNR)
of the output power is better at higher laser powers because of
the almost constant noise power when a threshold current is
exceeded. In addition, when the laser is off during the pulling
current time, the noise is also very low.
RAMP and RFREQ Value Setting
The laser should always have a forward current during operation.
This will prevent the laser voltage from collapsing and ensure
that the high frequency components reach the junction without
having to charge the junction capacitance.
Generally it is desirable to make the oscillator currents as large
as possible to obtain the greatest reduction in laser noise. But it
is not a trivial matter to determine this critical value. The
amplitude depends on the wave shape of the oscillator current
reaching the laser junction.
If the output current is sinusoidal and the components in the
output circuit are fixed and linear, then the shape of the current
will be sinusoidal. Thus the amount of current reaching the laser
junction is a function of the circuit parasitics. These parasitics
can result in a resonant increase in output depending on the
frequency due to the junction capacitance and layout. Also, the
amount of junction current causing laser emission is variable
with frequency due to the junction capacitance. It can be
concluded that the sizes of the RAMP and RFREQ resistors must
be determined experimentally. A good starting point is to take a
value of RAMP for a peak-to-peak current amplitude less than the
minimum laser threshold current and a value of RFREQ for an
output current close to a sinusoidal wave form (refer to the
“Typical Performance Curves” beginning on page 5).
Page 8 of 12
EL6204
RAMP and RFREQ Pin Interfacing
Figure 21 on page 9 shows an equivalent circuit of pins
associated with the RAMP and RFREQ resistors. VREF is roughly
1.27V for both RAMP and RFREQ. The RAMP and RFREQ resistors
should be connected to the non-load side of the power ground to
avoid noise pickup. These resistors should also return to the
EL6204's ground very directly to prevent noise pickup. They also
should have minimal capacitance to ground. Trimmer resistors
can be used to adjust initial operating points.
Also important is the circuit board layout. At the EL6204's
operating frequencies, even the ground plane is not
low-impedance. High frequency current will create voltage drops
in the ground plane. Figure 23 shows the output current loops.
RFREQ
RAMP
+
VREF
SUPPLY
BYPASS
SOURCING CURRENT
LOOP
SINKING CURRENT LOOP
GND
LASER
DIODE
-
PIN
FIGURE 23. OUTPUT CURRENT LOOPS
FIGURE 21. RAMP AND RFREQ PIN INTERFACE
External voltage sources can be coupled to the RAMP and RFREQ
pins to effect frequency or amplitude modulation or adjustment.
It is recommended that a coupling resistor of 1k be installed in
series with the control voltage and mounted directly next to the
pin. This will keep the inevitable high-frequency noise of the
EL6204's local environment from propagating to the modulation
source, and it will keep parasitic capacitance at the pin
minimized.
Supply Bypassing and Grounding
The resistance of bypass-capacitors and the inductance of
bonding wires prevent perfect bypass action and 150mVP-P
noise on the power lines is common. There needs to be a lossy
bead inductance and secondary bypass on the supply side to
control signals from propagating down the wires. Figure 22
shows the typical connection.
For the pushing current loop, the current flows through the
bypass capacitor, into the EL6204 supply pin, out the IOUT pin to
the laser, and from the laser back to the decoupling capacitor.
This loop should be small.
For the pulling current loop, the current flows into the IOUT pin,
out of the ground pin, to the laser cathode and from the laser
diode back to the IOUT pin. This loop should also be small.
Power Dissipation
With the high output drive capability, the EL6204 is possible to
exceed the +125°C “absolute-maximum junction temperature”
under certain conditions. Therefore, it is important to calculate
the maximum junction temperature for the application to
determine if the conditions need to be modified for the oscillator
to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to Equation 1:
T JMAX - T AMAX
P DMAX = -------------------------------------------- JA
(EQ. 1)
L SERIES: 70Ω REACTANCE AT 300MHz
VS
EL6204
+5V
0.1µF
Chip
0.1µF
Chip
GND
Where
PDMAX = Maximum power dissipation in the package
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
FIGURE 22. RECOMMENDED SUPPLY BYPASSING
JA = Thermal resistance of the package
The supply current of the EL6204 depends on the peak-to-peak
output current and the operating frequency, which are
determined by resistors RAMP and RFREQ. The supply current can
be predicted approximately by Equation 2:
31.25mA  1k 30mA  1k
I SUP = ------------------------------------------- + ---------------------------------- + 0.6mA
R FREQ
R AMP
(EQ. 2)
The power dissipation can be calculated from Equation 3:
P D = V SUP  I SUP
FN7219 Rev 3.00
October 28, 2015
(EQ. 3)
Page 9 of 12
EL6204
Here, VSUP is the supply voltage. Figures 24 and 25 provide a
convenient way to see if the device will overheat. The maximum
safe power dissipation can be found graphically, based on the
package type and the ambient temperature. By using Equation 3,
it is a simple matter to see if PD exceeds the device's power
derating curve. To ensure proper operation, it is important to
observe the recommended derating curve shown in Figures 24
and 25. A flex circuit may have a higher JA and lower power
dissipation would then be required.
POWER DISSIPATION (W)
PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
JEDEC JESD51-3 Low Effective Thermal Conductivity Test Board
0.6
0.5
488mW
0.4

JA
6Pi
=
0.3
n
+2
SO
56
T23
°C
/W
0.2
0.1
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 24. PACKAGE POWER DISSIPATION vs
AMBIENT TEMPERATURE
POWER DISSIPATION (W)
PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
JEDEC JESD51-7 High Effective Thermal Conductivity Test Board
0.6
0.5 543mW

6-
JA
=
0.4
0.3
Pi
n
+2
3
SO
0°
C/
T2
3
W
0.2
0.1
0
0
25
50
75 85
100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 25. PACKAGE POWER DISSIPATION vs
AMBIENT TEMPERATURE
FN7219 Rev 3.00
October 28, 2015
Page 10 of 12
EL6204
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
October 28, 2015
FN7219.3
CHANGE
Added Rev History beginning with Revision 3.
Updated entire datasheet applying Intersil’s new standards.
Removed obsolete parts EL6204CW-T7 AND EL6204CW-T7A
ordering information on page 3 - updated PKG DWG from MDP0038 to P6.064A, added MSL note and part
marking note.
Added Tja and Tjc in “Thermal Information” on page 4 and corresponding notes.
Added Note 7 on page 5 to MIN and MAX in Electrical Spec Tables and corresponding note.
Changed POD MDP0038 to P6.064A
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FN7219 Rev 3.00
October 28, 2015
Page 11 of 12
EL6204
Package Outline Drawing
P6.064A
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0-3°
0.95
D
0.08-0.20
A
5
6
4
PIN 1
INDEX AREA
2.80
3
1.60
3
0.15 C D
2x
1
(0.60)
3
2
0.20 C
2x
0.40 ±0.05
B
5
SEE DETAIL X
3
0.20 M C A-B
D
TOP VIEW
2.90
5
END VIEW
10° TYP
(2 PLCS)
0.15 C A-B
2x
H
1.14 ±0.15
C
SIDE VIEW
0.10 C
0.05-0.15
1.45 MAX
SEATING PLANE
DETAIL "X"
(0.25) GAUGE
PLANE
0.45±0.1
4
(0.60)
(1.20)
NOTES:
(2.40)
(0.95)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
This dimension is measured at Datum “H”.
6.
Package conforms to JEDEC MO-178AA.
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
FN7219 Rev 3.00
October 28, 2015
Page 12 of 12