Everlight EAST3226RGBA1 Compatible with automatic placement equipment. Datasheet

SMD  B
EAST3226RGBA1
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS compliant version
․Compliance with EU REACH
․Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
.
Description
․The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density,
reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
1 Copyright ©: 2010,
Revision
1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016. Issue No:Release
12:11:14.0
www.everlightamericas.com
DSE-0014886Date:2016-02-26
Rev:1
LifecyclePhase:
LifecyclePhase:Developing()
Expired Period: Forever
DATASHEET
SMD  B
EAST3226RGBA1
Device Selection Guide
Code
Chip
Emitted Color
Materials
R6
AlGaInP
Brilliant
G6
AlGaInP
Brilliant Yellow Green
BH
InGaN
Blue
Resin Color
Red
Water Clear
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Reverse Voltage
Forward Current
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Electrostatic
Discharge(HBM)
Rating
Unit
VR
5
V
IF
25
mA
IFP
Pd
ESD
Code
R6
60
G6
60
BH
100
R6
60
G6
60
BH
95
R6
2000
G6
2000
BH
150
mA
mW
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
2 Copyright :© 2010,
Revision
1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
12:11:14.0
www.everlightamericas.com
DSE-0014886Date:2016-02-26
Rev:1
LifecyclePhase:
LifecyclePhase:Developing()
Expired Period: Forever
DATASHEET
SMD  B
EAST3226RGBA1
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Luminous Intensity
Viewing Angle
Peak Wavelength
Min.
Typ.
Max.
R6
72
100
180
G6
28.5
50
90
BH
28.5
50
90
-----
120
-----
R6
-----
632
-----
G6
-----
575
-----
BH
-----
468
-----
R6
619
-----
629
2θ1/2
λp
Unit
Condition
mcd
Deg
nm
IF=20mA
Dominant
λd
Wavelength
Spectrum
Iv
Code
Radiation
Bandwidth
Forward Voltage
Reverse Current
△λ
VF
IR
G6
568
-----
575
BH
465
-----
480
R6
-----
20
-----
G6
-----
20
-----
BH
-----
25
-----
R6
-----
2.0
2.4
G6
-----
2.0
2.4
BH
-----
3.5
3.9
R6
-----
-----
10
G6
-----
-----
10
BH
-----
-----
50
nm
nm
V
μA
VR=5V
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1V
3 Copyright :© 2010,
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1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
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LifecyclePhase:
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DATASHEET
SMD  B
EAST3226RGBA1
Typical Electro-Optical Characteristics Curves
R6
4 Copyright :© 2010,
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1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
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SMD  B
EAST3226RGBA1
Typical Electro-Optical Characteristics Curves
G6
5 Copyright :© 2010,
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SMD  B
EAST3226RGBA1
Typical Electro-Optical Characteristics Curves
BH
Forward Current vs.
Forward Voltage
Spectrum Distribution
Wavelength λ (nm)
Forward Voltage VF (V)
Relative Luminous Intensity vs.
Forward Current
Ta=25°C
1000
100
10
1
-60 -40 -20
0
20 40 60 80 100
Relative Luminous Intensity (%)
Relative Luminous Intensity vs.
Ambient Temperature
Relative Luminous Intensity (%)
Ta=25°C
Forward Current IF (mA)
Relative Luminous Intensity (%)
Ta=25°C
Forward Current I F (mA)
Ambient Temperature Ta (°C)
Radiation Diagram
Forward Current Derating Curve
Forward Current IF (mA)
0°
Ta=25°C
10° 20°
30°
40°
1.0
0.9
50°
0.8
60°
0.7
0.5 0.3
0.1
0.2 0.4 0.6
70°
80°
90°
Ambient Temperature Ta (°C)
6 Copyright :© 2010,
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DATASHEET
SMD  B
EAST3226RGBA1
Package Dimension
Anode mark
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
7 Copyright :© 2010,
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DATASHEET
SMD  B
EAST3226RGBA1
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
8 Copyright :© 2010,
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1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
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DATASHEET
SMD  B
EAST3226RGBA1
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
9 Copyright :© 2010,
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1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
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DATASHEET
SMD  B
EAST3226RGBA1
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
26 0°C M ax.
10 sec. M ax.
A bo ve2 55 °C
30 sec.M ax.
3 °C /sec.M ax.
6°C /sec.M ax .
P re-heating
A bo ve 2 17 °C
60 ~ 15 0sec.
1 50~ 20 0°C
6 0~ 12 0sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful
because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
1 Copyright :© 2010,
Revision
1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
12:11:14.0
www.everlightamericas.com
DSE-0014886Date:2016-02-26
Rev:1
0
LifecyclePhase:
LifecyclePhase:Developing()
Expired Period: Forever
DATASHEET
SMD  B
EAST3226RGBA1
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlightamericas before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
1 Copyright :© 2010,
Revision
1 Everlight Americas Inc.All Rights Reserved. Release Date:24.Feb.2016.Issue No: Release
12:11:14.0
www.everlightamericas.com
DSE-0014886Date:2016-02-26
Rev:1
1
LifecyclePhase:
LifecyclePhase:Developing()
Expired Period: Forever
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