AP02N40H/J
RoHS-compliant Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ 100% Avalanche Test
D
▼ Fast Switching Characteristic
▼ Simple Drive Requirement
G
BVDSS
400V
RDS(ON)
5Ω
ID
1.6A
S
Description
G
D
AP02N40 uses rugged design with the best combination of fast
switching and cost-effectiveness.
The TO-252 package is widely preferred for all commercial-industrial
surface mount applications and suited for AC/DC converters. The
through-hole version (AP02N40J) is available for low-profile
applications.
S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
400
V
VGS
Gate-Source Voltage
+30
V
ID@TC=25℃
Continuous Drain Current, V GS @ 10V
1.6
A
ID@TC=100℃
Continuous Drain Current, V GS @ 10V
1
A
3
A
33
W
5
mJ
1
A
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
2
EAS
Single Pulse Avalanche Energy
IAR
Avalanche Current
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Parameter
Maximum Thermal Resistance, Junction-case
Rthj-a
Maximum Thermal Resistance, Junction-ambient (PCB mount)
Rthj-a
Maximum Thermal Resistance, Junction-ambient
Data & specifications subject to change without notice
4
Value
Unit
3.8
℃/W
62.5
℃/W
110
℃/W
1
200902042
AP02N40H/J
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
3
Min.
Typ.
Max. Units
VGS=0V, ID=1mA
400
-
-
V
VGS=10V, ID=0.7A
-
-
5
Ω
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=1A
-
1.5
-
S
IDSS
Drain-Source Leakage Current
VDS=400V, VGS=0V
-
-
25
uA
Drain-Source Leakage Current (T j=125 C) VDS=320V, VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS=+30V, VDS=0V
-
-
+100
nA
ID=1A
-
6.4
10
nC
o
IGSS
3
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=320V
-
1.2
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
3.2
-
nC
3
td(on)
Turn-on Delay Time
VDD=200V
-
8
-
ns
tr
Rise Time
ID=1A
-
9
-
ns
td(off)
Turn-off Delay Time
RG=50Ω,VGS=10V
-
21
-
ns
tf
Fall Time
RD=200Ω
-
12
-
ns
Ciss
Input Capacitance
VGS=0V
-
180
300
pF
Coss
Output Capacitance
VDS=25V
-
22
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
5.6
-
pF
Min.
Typ.
IS=1.6A, VGS=0V
-
-
1.5
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
3
3
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=1A, VGS=0V,
-
150
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
680
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
o
2.Starting Tj=25 C , VDD=50V , L=10mH , RG=25Ω
3.Pulse test
2
4.Surface mounted on 1 in copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP02N40H/J
3
2
10V
8.0V
7.0V
ID , Drain Current (A)
T C =150 o C
2
6.0V
1
10V
8 .0V
7 .0V
6.0 V
1.6
ID , Drain Current (A)
o
T C =25 C
1.2
0.8
V G =5 .0V
0.4
V G =5.0V
0
0
0
4
8
12
16
20
24
28
0
32
V DS , Drain-to-Source Voltage (V)
5
10
15
20
25
30
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
3
1.2
I D =1A
V G =10V
Normalized RDS(ON)
Normalized BVDSS (V)
1.1
1
2
1
0.9
0
0.8
-50
0
50
100
-50
150
0
50
100
150
T j , Junction Temperature ( o C )
o
T j , Junction Temperature ( C)
Fig 3. Normalized BVDSS v.s. Junction
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
1.2
10
IS (A)
T j = 150 o C
Normalized VGS(th) (V)
1.1
T j = 25 o C
1
1
0.9
0.8
0.7
0.6
0.1
0
0.2
0.4
0.6
0.8
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP02N40H/J
f=1.0MHz
12
10000
8
I D =1A
V DS =320V
C (pF)
VGS , Gate to Source Voltage (V)
10
6
C iss
100
C oss
4
C rss
2
0
1
0
2
4
6
8
1
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
10
100us
ID (A)
1
1ms
10ms
100ms
DC
0.1
T C =25 o C
Single Pulse
Normalized Thermal Response (Rthjc)
1
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
0.02
t
0.01
T
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.01
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4