1 of 3 Creation Date : May 19, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X6S1H475K125AC TDK item description C2012X6S1H475KT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 4.7μF ±10% Rated Voltage 50VDC Temperature Characteristic X6S(±22%) Dissipation Factor (Max.) 7.5% Insulation Resistance (Min.) 106MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 19, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X6S1H475K125AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012X6S1H475K125AC ESR C2012X6S1H475K125AC Capacitance C2012X6S1H475K125AC C2012X6S1H475K125AC Temperature Characteristic C2012X6S1H475K125AC(No Bias) DC Bias Characteristic C2012X6S1H475K125AC(DC Bias = 25V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012X6S1H475K125AC(100kHz) C2012X6S1H475K125AC(500kHz) C2012X6S1H475K125AC(1MHz) Multilayer Ceramic Chip Capacitors C2012X6S1H475K125AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 19, 2017 (GMT)