DPS-081104 CHIP BEADS ARRAY Array Series v Features v Dimensions (unit : mm) • Good reliability (Monolithic structure) • Magnetically shielded B • Fast mounting speed T W • RoHS compliant L v Applications • CD-ROM, DVD, MD Lines • Digital TVs and VTRs v General Code 1 2 3 4 5 6 7 E D CBA 3216 G A 121 1 2 3 4 5 N4 6 E 7 Series Code CBA : Chip Ferrite Beads Array Dimension Code The first two digits : length (mm) The last two digits : width (mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120 (Ω) Number of circuit N4 : 4 array Packaging Code E : Reel embossed tape packaging Size 3216 L 3.2±0.20 W 1.6±0.20 T 0.9±0.20 B 0.3±0.20 E 0.4±0.15 D 0.8±0.10 v Temperature Range • Operating Temp. -55 ~ +125℃ • Storage Temp. -10 ~ +40 ℃ v Typical Material Characteristics High μ Low μ (Low RXCP) (High RXCP) V M J,K A This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY v 3216 SIZE Impedance (Ω) ±25% DC Resistance (Ω) max. Rated Current (mA) max. CBA3216GA300N4 30 0.10 200 CBA3216GA600N4 60 0.25 200 CBA3216GA121N4 120 0.30 300 CBA3216GA221N4 220 0.35 150 CBA3216GA301N4 300 0.40 100 CBA3216GA471N4 470 0.45 100 CBA3216GA601N4 601 0.50 100 CBA3216GA102N4 100 0.70 50 CBA3216GK600N4 60 0.25 400 CBA3216GK121N4 120 0.30 350 CBA3216GK221N4 220 0.35 250 CBA3216GK301N4 300 0.40 250 CBA3216GK471N4 470 0.50 200 CBA3216GK601N4 600 0.60 200 CBA3216GK102N4 1000 0.75 150 CBA3216GM300N4 30 0.10 200 CBA3216GM600N4 60 0.12 200 CBA3216GM121N4 120 0.20 100 CBA3216GM301N4 300 0.45 100 CBA3216GM471N4 470 0.45 100 CBA3216GM601N4 600 0.50 100 Test Frequency (MHz) 100 CHIP BEAD ARRAY Series Samwha P/N ※ Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY v 3216 SIZE 45 Impedance [W ] Impedance [W ] CBA 3216 GA 600 N4 100 Z 30 R 15 Z 75 R 50 X 25 CBA 3216 GA 121 N4 200 Impedance [W ] CBA 3216 GA 300 N4 60 Z 150 R 100 X 50 X 1 10 100 0 1000 1 Frequency [MHz] 100 Impedance [W ] 150 0 X 1 10 100 300 200 0 1000 X 1 10 100 600 400 200 0 1000 R X 1 10 Frequency [MHz] CBA 3216 GA 102 N4 100 1000 Frequency [MHz] CBA 3216 GK 121 N4 240 1000 Z R 100 100 CBA 3216 GA 601 N4 800 Z Frequency [MHz] 1200 10 CBA 3216 GK 221 N4 400 600 X 300 0 1 10 100 180 Z 120 R 60 0 1000 X 1 Frequency [MHz] Impedance [W ] Impedance [W ] 100 R 200 1 10 100 200 R 100 X 1 10 600 100 1000 Frequency [MHz] CBA 3216 GK 601 N4 1000 Z Z R 400 200 750 R 500 X 250 X X 0 Z 0 1000 CBA 3216 GK 471 N4 800 Z 400 10 300 Frequency [MHz] CBA 3216 GK 301 N4 600 Impedance [W ] R Impedance [W ] 900 Impedance [W ] Impedance [W ] Z CHIP BEAD ARRAY Series Impedance [W ] R 75 1 Frequency [MHz] CBA 3216 GA 301 N4 400 Z 225 0 1000 Frequency [MHz] CBA 3216 GA 221 N4 300 10 Impedance [W ] 0 1000 Frequency [MHz] 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY Reliability & Test Condition Item Requirements Test Conditions Operating temperature range - 55 ℃ ~ + 125 ℃ - Storage temperature range 40 ℃ max., 70% RH max. at packing condition More than 90% of the terminal electrode shall be covered with new solder Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. More than 50% of the terminal electrode shall be covered with new solder ST ≥ Reflow soldering ST 1 CT 3 CT Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. No mechanical damage 2. Impedance shall not change more than ±30 % CHIP BEAD, Reliability & Test Condition Solderability Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity resistance This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY Reliability & Test Condition Item Requirements Test Conditions Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Thermal shock 1. -55 ± 3℃ for 30 minutes 2.125 ± 3 ℃ for 30 minutes 3. repeat 100 cycle Vibration Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage Flexure strength ITEM 4 ARRAY A (mm) 0.8 B (mm) 0.8 C (mm) 3.0 W (kgf) 0.4 Land pattern R0.5 W B C A 50 D CHIP BEAD, Reliability & Test Condition Low temperature resistance 20 W Bending strength R340 The terminal electrode shall be neither break off nor the chip damage 2 mm Resistance meter This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Standard Quantity Size Q’TY(PCS) 1005 10,000 1608 4,000 2012 4,000 3216 3,000 4516 2,000 4532 1,000 Remarks 0.85 T size (Unit:mm) A B C Φ178±2 Φ50 min. Φ13±0.5 D E W 4±0.8 2±0.2 9±1.5 CHIP BEAD, Packaging v Reel Dimension v Leader & Blank Portion (Unit:mm) Blank Chips Blank 350±50 mm 60 Pitch 350±50 mm 60 Pitch Leader 150 min This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Taping Dimensions (Paper tape) T A B S P (Unit:mm) A ±0.1 B ±0.1 P ±0.1 S ±0.1 T (Max.) 1005 1.15 0.65 2.0 1.0 0.8 1608 1.80 1.00 4.0 2.0 1.1 2012 2.30 1.55 4.0 2.0 1.1 v Taping Dimensions (Emboss tape) CHIP BEAD, Packaging Type (Unit:mm) Type A ±0.1 B ±0.1 C ±0.1 D ±0.1 2012 2.25 1.45 1.50 0.23 3216 3.50 1.85 1.25 0.23 4516 4.90 1.90 1.35 0.30 4532 4.85 3.60 1.40 0.30 This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Soldering Profile v Reflow Soldering Pre - heating Soldering Cooling 245±5℃ 230 180 150 10 sec. max. 30~60 sec. 60 sec. min. v Flow Soldering Pre - heating Soldering Cooling 250±5℃ 250 180 150 60 sec. min. 10 sec. max. CHIP BEAD, Soldering Profile 60~120 sec. 60 sec. min. v Manual Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. Tc 2 sec. max. This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD