SAMWHA CBA3216GM300N4 Beads array Datasheet

DPS-081104
CHIP BEADS ARRAY
Array Series
v Features
v Dimensions
(unit : mm)
• Good reliability (Monolithic structure)
• Magnetically shielded
B
• Fast mounting speed
T
W
• RoHS compliant
L
v Applications
• CD-ROM, DVD, MD Lines
• Digital TVs and VTRs
v General Code
1
2
3
4
5
6
7
E
D
CBA
3216
G
A
121
1
2
3
4
5
N4
6
E
7
Series Code
CBA : Chip Ferrite Beads Array
Dimension Code
The first two digits : length (mm)
The last two digits : width (mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
Material Code
A: General Frequency
K,J: Medium Frequency
M: High Frequency
V: Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 121 = 120 (Ω)
Number of circuit
N4 : 4 array
Packaging Code
E : Reel embossed tape packaging
Size
3216
L
3.2±0.20
W
1.6±0.20
T
0.9±0.20
B
0.3±0.20
E
0.4±0.15
D
0.8±0.10
v Temperature Range
• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃
v Typical Material Characteristics
High μ
Low μ
(Low RXCP)
(High RXCP)
V
M
J,K
A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v 3216 SIZE
Impedance
(Ω) ±25%
DC Resistance
(Ω) max.
Rated Current
(mA) max.
CBA3216GA300N4
30
0.10
200
CBA3216GA600N4
60
0.25
200
CBA3216GA121N4
120
0.30
300
CBA3216GA221N4
220
0.35
150
CBA3216GA301N4
300
0.40
100
CBA3216GA471N4
470
0.45
100
CBA3216GA601N4
601
0.50
100
CBA3216GA102N4
100
0.70
50
CBA3216GK600N4
60
0.25
400
CBA3216GK121N4
120
0.30
350
CBA3216GK221N4
220
0.35
250
CBA3216GK301N4
300
0.40
250
CBA3216GK471N4
470
0.50
200
CBA3216GK601N4
600
0.60
200
CBA3216GK102N4
1000
0.75
150
CBA3216GM300N4
30
0.10
200
CBA3216GM600N4
60
0.12
200
CBA3216GM121N4
120
0.20
100
CBA3216GM301N4
300
0.45
100
CBA3216GM471N4
470
0.45
100
CBA3216GM601N4
600
0.50
100
Test Frequency
(MHz)
100
CHIP BEAD ARRAY Series
Samwha P/N
※ Measuring Equipment
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v 3216 SIZE
45
Impedance [W ]
Impedance [W ]
CBA 3216 GA 600 N4
100
Z
30
R
15
Z
75
R
50
X
25
CBA 3216 GA 121 N4
200
Impedance [W ]
CBA 3216 GA 300 N4
60
Z
150
R
100
X
50
X
1
10
100
0
1000
1
Frequency [MHz]
100
Impedance [W ]
150
0
X
1
10
100
300
200
0
1000
X
1
10
100
600
400
200
0
1000
R
X
1
10
Frequency [MHz]
CBA 3216 GA 102 N4
100
1000
Frequency [MHz]
CBA 3216 GK 121 N4
240
1000
Z
R
100
100
CBA 3216 GA 601 N4
800
Z
Frequency [MHz]
1200
10
CBA 3216 GK 221 N4
400
600
X
300
0
1
10
100
180
Z
120
R
60
0
1000
X
1
Frequency [MHz]
Impedance [W ]
Impedance [W ]
100
R
200
1
10
100
200
R
100
X
1
10
600
100
1000
Frequency [MHz]
CBA 3216 GK 601 N4
1000
Z
Z
R
400
200
750
R
500
X
250
X
X
0
Z
0
1000
CBA 3216 GK 471 N4
800
Z
400
10
300
Frequency [MHz]
CBA 3216 GK 301 N4
600
Impedance [W ]
R
Impedance [W ]
900
Impedance [W ]
Impedance [W ]
Z
CHIP BEAD ARRAY Series
Impedance [W ]
R
75
1
Frequency [MHz]
CBA 3216 GA 301 N4
400
Z
225
0
1000
Frequency [MHz]
CBA 3216 GA 221 N4
300
10
Impedance [W ]
0
1000
Frequency [MHz]
0
1
10
100
1000
0
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Requirements
Test Conditions
Operating
temperature range
- 55 ℃ ~ + 125 ℃
-
Storage
temperature range
40 ℃ max., 70% RH max.
at packing condition
More than 90% of the terminal electrode shall be
covered with new solder
Resistance to
soldering heat
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 270 ± 10 ℃
Soldering time : 10 ± 0.5 sec.
More than 50% of the terminal electrode
shall be covered with new solder
ST ≥
Reflow soldering
ST
1
CT
3
CT
Preheat temperature : 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
High temperature
resistance
Temperature : 125 ± 3 ℃
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
Temperature : 125 ± 3 ℃
Applied current : rated current
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. No mechanical damage
2. Impedance shall not change more than ±30 %
CHIP BEAD, Reliability & Test Condition
Solderability
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 ± 1 sec.
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity
resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Applied current : rated current
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity load
resistance
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Temperature : -55 ± 3 ℃
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Thermal shock
1. -55 ± 3℃ for 30 minutes
2.125 ± 3 ℃ for 30 minutes
3. repeat 100 cycle
Vibration
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop
Drop 10 times on a concrete floor
from a height of 100 cm
No mechanical damage
Flexure strength
ITEM
4 ARRAY
A (mm)
0.8
B (mm)
0.8
C (mm)
3.0
W (kgf)
0.4
Land pattern
R0.5
W
B C
A
50
D
CHIP BEAD, Reliability & Test Condition
Low temperature
resistance
20
W
Bending strength
R340
The terminal electrode shall be neither break off
nor the chip damage
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size
Q’TY(PCS)
1005
10,000
1608
4,000
2012
4,000
3216
3,000
4516
2,000
4532
1,000
Remarks
0.85 T size
(Unit:mm)
A
B
C
Φ178±2
Φ50 min.
Φ13±0.5
D
E
W
4±0.8
2±0.2
9±1.5
CHIP BEAD, Packaging
v Reel Dimension
v Leader & Blank Portion
(Unit:mm)
Blank
Chips
Blank
350±50 mm
60 Pitch
350±50 mm
60 Pitch
Leader
150 min
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
B
S
P
(Unit:mm)
A
±0.1
B
±0.1
P
±0.1
S
±0.1
T
(Max.)
1005
1.15
0.65
2.0
1.0
0.8
1608
1.80
1.00
4.0
2.0
1.1
2012
2.30
1.55
4.0
2.0
1.1
v Taping Dimensions (Emboss tape)
CHIP BEAD, Packaging
Type
(Unit:mm)
Type
A
±0.1
B
±0.1
C
±0.1
D
±0.1
2012
2.25
1.45
1.50
0.23
3216
3.50
1.85
1.25
0.23
4516
4.90
1.90
1.35
0.30
4532
4.85
3.60
1.40
0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating
Soldering
Cooling
245±5℃
230
180
150
10 sec. max.
30~60 sec.
60 sec. min.
v Flow Soldering
Pre - heating
Soldering
Cooling
250±5℃
250
180
150
60 sec. min.
10 sec. max.
CHIP BEAD, Soldering Profile
60~120 sec.
60 sec. min.
v Manual Soldering
300
Soldering Iron : 30W max.
Diameter of soldering iron : 1.2 mm max.
Tc
2 sec. max.
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
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