A Datasheet BT830 Bluetooth v4.0 Dual-Mode UART HCI Module Version 1.6 BT830 - SA BT830 - ST BT830 Datasheet REVISION HISTORY Revision 1.0 1.1 Date 23 July 2014 10 Nov 2014 Changes Initial Version Updated pin definitions Approved By Jonathan Kaye Jonathan Kaye 1.2 1.3 10 Aug 2015 30 Sept 2015 Added Tape/Reel information Added additional antenna information Jonathan Kaye Andrew Chen 1.4 1.5 15 Dec 2015 17 Aug 2016 Replaced tray image with new one Changed Hardware Integration Guide to Datasheet. Maggie Teng Sue White 1.6 31 Aug 2016 Updated Declaration of Conformity Tom Smith Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 2 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet CONTENTS 1 Scope ..................................................................................................................................................................5 2 Operational Description .....................................................................................................................................5 3 Block Diagram and Descriptions.........................................................................................................................6 4 Specifications......................................................................................................................................................7 5 Pin Definitions ....................................................................................................................................................8 6 DC Electrical Characteristic ............................................................................................................................. 10 7 RF Characteristics ............................................................................................................................................ 12 8 Interface .......................................................................................................................................................... 12 8.1 PIO .............................................................................................................................................................. 12 8.2 WLAN Coexistence Interface ...................................................................................................................... 12 8.3 UART Interface ........................................................................................................................................... 13 8.4 PCM Interface ............................................................................................................................................. 13 8.5 GCI Interface ............................................................................................................................................... 15 8.6 Slots and Sample Formats .......................................................................................................................... 16 8.7 PCM Timing Information ............................................................................................................................. 16 8.8 PCM Slave Timing ....................................................................................................................................... 19 8.9 PCM Slave Mode Timing Parameters ......................................................................................................... 19 8.10 PCM_CLK and PCM_SYNC Generation ....................................................................................................... 20 8.11 PCM Configuration ..................................................................................................................................... 20 8.12 Digital Audio Interface (I²S) ........................................................................................................................ 21 9 Power Supply and Regulation ......................................................................................................................... 23 9.1 Voltage Regulator Enable and Reset .......................................................................................................... 23 9.2 Power Sequencing ...................................................................................................................................... 24 10 Antenna Performance ..................................................................................................................................... 24 10.1 Multilayer Chip Antenna ............................................................................................................................ 24 10.2 NanoBlade .................................................................................................................................................. 26 11 Mechanical Dimensions and Land Pattern ...................................................................................................... 27 11.1 BT830-SA Mechanical Drawing .................................................................................................................. 27 11.2 BT830-ST Mechanical Drawing ................................................................................................................... 28 12 Implementation Note ...................................................................................................................................... 29 12.1 PCB Layout on Host PCB ............................................................................................................................. 29 12.1.1 Antenna Keep-out and Proximity to Metal or Plastic ....................................................................... 29 Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 3 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 12.1.2 13 DC Power Supply Options for Using BT830 Module ......................................................................... 30 Application Note for Surface Mount Modules ................................................................................................ 30 13.1 Introduction ................................................................................................................................................ 30 13.2 Shipping ...................................................................................................................................................... 30 13.2.1 Tray Package ..................................................................................................................................... 30 13.2.2 Tape and Reel Package Information ................................................................................................. 31 13.3 Reflow Parameters ..................................................................................................................................... 32 14 FCC and IC Regulatory ..................................................................................................................................... 34 14.1 Documentation Requirements ................................................................................................................... 34 15 European Union Regulatory ............................................................................................................................ 37 15.1 EU Declarations of Conformity - BT830-SA and BT830-ST ......................................................................... 37 16 Ordering Information ...................................................................................................................................... 38 16.1 General Comments..................................................................................................................................... 38 17 Bluetooth SIG Approvals ................................................................................................................................. 39 17.1 Application Note: Subsystem Combinations .............................................................................................. 39 17.1.1 Laird Customer Declaration ID Procedure ........................................................................................ 39 Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 4 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet SCOPE This document describes key hardware aspects of the Laird BT830 Bluetooth HCI modules. This document is intended to assist device manufacturers and related parties, with the integration of this module into their host devices. Data in this document are drawn from a number of sources including data sheets for the CSR8811. Because the BT830 is currently in development stage, this document is preliminary and the information in this document is subject to change. Visit www.lairdtech.com to obtain the most recent version of this document. OPERATIONAL DESCRIPTION The BT830 series of UART HCI devices are designed to meet the needs of OEMs adding robust Bluetooth connectivity and using embedded Bluetooth stacks within their products. Leveraging the market-leading CSR8811 chipset, the BT830 series provides exceptionally low power consumption with outstanding range. Supporting the latest Bluetooth v4.0 specification with EDR (Enhanced Data Rate), the Laird BT830 series enables OEMs to accelerate their development time for leveraging either Classic Bluetooth or Bluetooth Low Energy (BLE) into their operating system-based devices. With a footprint as small as 8.5 x 13 mm, yet output power at 7 dBm, these modules are ideal for applications where designers need high performance in minimal size. For maximum flexibility in systems integration, the modules are designed to support a UART interface plus GPIO and additionally I2S and PCM audio interfaces. BT830-SA module BT830 –ST module These modules present an HCI interface and have native support for Windows and Linux Bluetooth software stacks. All BT830 series devices are fully qualified as Bluetooth Hardware Controller Subsystem products. This allows designers to integrate their existing pre-approved Bluetooth host and profile subsystem stacks to gain a Bluetooth END product approval for their products. The BT830 series is engineered to provide excellent RF performance with integrated antenna and additional band pass filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free development cycle. A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT830 series modules and further reduces risk and time in development cycles. BT830-SA BT830-ST 2.1 BTv4.0 Dual Mode UART HCI Module (Integrated Antenna) BTv4.0 Dual Mode UART HCI Module (SMT Pad for External Antenna) Features and Benefits 2.2 Bluetooth v4.0 - dual mode (Classic Bluetooth and BLE) Compact footprint 3-wire Wi-Fi coexistence scheme High antenna radiation gain and efficiency Good interference rejection for multi-com system (GSM/WCDMA) Class 1 output – 7 dBm UART, GPIO, I2S, and PCM Industrial temperature range Bluetooth hardware controller subsystem FCC, IC, and CE approvals Host Wake up Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 5 © Copyright 2016 Laird. All Rights Reserved Application Areas Medical devices ePOS terminals Barcode scanners Industrial cable replacement M2M connectivity Automotive Diagnostic Equipment Personal Digital Assistants (PDA) Bluetooth HID device (keyboard, mouse, and joystick) Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet BLOCK DIAGRAM AND DESCRIPTIONS Figure 2: BT830 module block diagram CS8811A08 (Main chip) The BT830 is based on the CSR8811A08 dual mode chip. The chip is a single-chip radio with on-chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps. Dedicated signal and baseband processing is included for full Bluetooth operation. The chip provides PCM/I2S and UART interfaces. Up to four general purpose I/Os are available for general use such as Wi-Fi coexistence or general indicators. Note: The purpose of the SPI interface is to access the module’s inner settings such as selecting different WLAN CO-EXIST scheme. The SPI interface can also be used to place the module in RF test mode. You cannot use the module over the SPI interface for normal operation as the main host interface. Antenna Options BT830-SA – The antenna is a ceramic monopole chip antenna. BT830-ST – Provides a SMT pad for connecting an external antenna. Band Pass Filter The band pass filter filters the out-of-band emissions from the transmitter to meet the specific regulations for type approvals of various countries. Crystal The embedded 26 MHz crystal is used for generating the clock for the entire module. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 6 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet SPECIFICATIONS Table 1: BT830 specifications Categories Wireless Specification Host Interface Feature Bluetooth® Frequency Implementation V4.0 Dual Mode 2.402 - 2.480 GHz Maximum Transmit Power Class 1 +7 dBm from antenna Receive Sensitivity Range Data Rates UART GPIO -89 dBm Circa 100 meters Up to 3 Mbps (over the air) RX, TX, CTS, RTS Six configurable lines (1.8V/3.3V configurable by VDD_PADS) Host Controller Interface over UART 3 wire CSR schemes supported (Unity-3 and Unity-3e) 3.3V +/-10% Note: See Implementation Note for details on different DC power selections on the BT830. Idle Mode ~4.3 mA (Master; ACL link; No traffic) File Transfer ~7.1 mA (Master; ACL link; Transmit) Multilayer ceramic antenna with up to 40% efficiency. SMT pad for external antenna 8.5 x 13 x 1.6 mm (BT830 - module) -30°C to +85°C -40°C to +85°C Lead-free and RoHS compliant 1-Year Warranty Hardware Controller Subsystem Approved All BT830 series (BT830-SA; BT830-ST) Operational Modes Coexistence HCI 802.11 (Wi-Fi) Supply Voltage Supply Power Consumption Current Antenna Option Internal (BT830-SA) External (BT830-ST) Dimensions Operating Storage Lead Free Warranty Bluetooth® FCC / IC / CE Physical Environmental Miscellaneous Approvals Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 7 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet PIN DEFINITIONS Table 2: BT830 pin definitions # Pin Name I/O 1 VDD_PADS DC voltage input Supply Domain (1.75V-3.6V) 2 GND GND - Positive DC supply for configuring digital I/O level. Ground 3 PIO2 VDD_PADS Programmable input/output line NC 4 UART_RTS VDD_PADS UART request to send, active low NC 5 UART_TX VDD_PADS UART data output, active high NC 6 UART_CTS VDD_PADS UART clear to send, active low NC 7 UART_RX VDD_PADS UART data input, active high NC 8 VREG_EN_RST# Bidirectional, tristate, with weak internal pulldown Bidirectional, tristate, with weak internal pull-up Bidirectional, tristate, with weak internal pull-up Bidirectional, tristate, with weak internal pull-up Bidirectional, tristate, with weak internal pull-up Input with strong internal pulldown VDD_PADS N/A 9 VREG_IN_HV Analogue regulator input 3.3V Take high to enable internal regulators. Also acts as active low reset. Maximum voltage is VDD_PADS. Module main DC power supply; Input to internal high-voltage regulator 10 VREG_OUT_HV 1.8V GND GND GND GND Output from internal high-voltage regulator and input to low-voltage internal regulators. Ground Ground Ground Ground N/C 11 12 13 14 Analogue regulator input/output GND GND GND GND 15 16 17 GND GND RF GND GND - Ground Ground BT830-ST – RF signal out (50 ohm) BT830-SA – No connection GND GND Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth - Description 8 © Copyright 2016 Laird. All Rights Reserved If Unused… N/A GND N/A GND GND GND GND Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet # Pin Name I/O Supply Domain VDD_PADS 18 19 GND PCM_SYNC/ SPI_CS#/ PIO23 GND Bidirectional, tristate, with weak internal pulldown 20 PCM_CLK/ SPI_CLK/ PIO24 Bidirectional, tristate, with weak internal pulldown VDD_PADS 21 PCM_IN/ SPI_MOSI/ PIO21 Input, tri-state, with weak internal pulldown VDD_PADS 22 PCM_OUT/ SPI_MISO/ PIO22 Output, tri-state, with weak internal pulldown VDD_PADS 23 24 GND PIO0/ 32K_CLK_IN VDD_PADS 25 PIO1/ BT_ACTIVE 26 PIO9/ BT_PRIORITY GND Bidirectional, tristate, with weak internal pulldown Bidirectional, tristate, with weak internal pulldown Bidirectional, tristate, with weak internal pulldown 27 PIO4/ WLAN_ACTIVE 28 SPI_PCM#_SEL 29 30 Description Ground PCM synchronous data sync SPI chip select, active low programmable input/output line *See Note 1. PCM synchronous data clock SPI clock Programmable input/output line *See Note 1. If Unused… GND NC NC PCM synchronous data input SPI data input Programmable input/output line *See Note 1. PCM synchronous data output SPI data output Programmable input/output line *See Note 1. Ground Programmable input/output line and 32kHz sleep clock input NC VDD_PADS Programmable input/output line; Wi-Fi and BT 3-wire coexistance NC VDD_PADS Programmable input/output line; Wi-Fi and BT 3-wire coexistance NC Bidirectional, tristate, with weak internal pulldown Input with weak internal pulldown VDD_PADS Programmable input/output line; Wi-Fi and BT 3-wire coexistance NC VDD_PADS NC PIO3/ Host Wake up Bidirectional, tristate, with weak internal pulldown VDD_PADS Control line to select SPI or PCM interface, high = SPI, low = PCM *See Note 1. Programmable input/output line; Host wake up from BT, active High. GND GND - Ground GND Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 9 © Copyright 2016 Laird. All Rights Reserved NC GND NC NC Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Note 1: The purpose of the SPI interface is to access the module’s inner settings such as selecting different WLAN CO-EXIST scheme. The SPI interface can also be used to put the module in RF test mode. You cannot use the module over the SPI interface for normal operation as the main host interface. DC ELECTRICAL CHARACTERISTIC Table 3: Absolute maximum ratings Rating Min Max Unit Storage temperature VREG_IN_HV VREG_OUT_HV -40 2.3 1.7 +85 4.8 2.0 ⁰C V V VDD_PADS Other terminal voltages -0.4 -0.4 3.6 VDD_PADS + 0.4 V V V Min -30 3.0 1.75 1.75 VDD_PADS Max +85 3.6 1.95 3.6 VDD_PADS Unit ⁰C V V V V Table 4: Recommended operating conditions Rating Operating temperature VREG_IN_HV VREG_OUT_HV VDD_PADS VREG_EN_RST# Table 5: High-voltage Linear Regulator Normal Operation Input voltage (VREG_IN_HV) Output voltage (VREG_OUT_HV) Temperature coefficient Output noise (frequency range 100Hz to100kHz) Settling time (settling time within 10% of final value) Output current Min 3.0 1.75 -200 - Typ 3.3 1.85 - Max 3.6 1.95 200 0.4 Unit V V ppm/⁰C mV rms - - 5 µs - - 100 mA Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 10 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Table 6: Digital I/O Characteristics Normal Operation Min Typ VIL input logic level low Input Voltage -0.4 - Max Unit 0.4 V VIH input logic level high 0.7 x VDD_PADS Output Voltage VDD_PADS + 0.4 V VOL output logic level low, IOL = 4.0 mA VOH output logic level high, IOL = 4.0 mA - - 0.4 V 0.75 x VDD_PADS - - V -10 150 -0.33 5.0 5.0 µA µA µA µA pF Input and Tristate Currents -150 -40 10 40 -5 -1.0 0.33 1.0 1.0 - Strong pull-up Strong pull-down Weak pull-up Weak pull-down CI input capacitance Table 7: Current Consumption Normal Operation Idle Inquiry File Transfer (ACL) Transmit (Master) Receive (Slave) Avg. 5 891 7.1 11.5 292 448 LE Connected (Master) LE Scan (Master) Unit mA µA mA mA µA µA Current consumption values are taken with: VREG_IN_HV pin = 3.15V RF TX power set to 0dBm XTAL used with PSKEY_LP_XTAL_LVL = 8 LEDs disconnected Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 11 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet RF CHARACTERISTICS Table 8: RF Characteristics RF Characteristics, VREG_IN_HV/VDD_PADS Min = 3.3V @ room temperature unless otherwise specified Maximum RF Transmit Power RF power variation over temperature range RF power variation over supply voltage range RF power variation over BT band RF power control range -21 20 dB band width for modulated carrier ACP F = F0 ± 2MHz Typ. Max 7 1.5 BT. Spec. 8 20 1000 -20 0.2 3 8 F = F0 ± 3MHz -40 F = F0 > 3MHz -40 Unit dBm dB dB dB dBm kHz Drift rate ΔF1avg 5 165 ≤20 140<175 kHz kHz ΔF1max 168 140<175 kHz ΔF2avg / ΔF1avg 0.9 >=0.8 Table 9: BDR and EDR receiver sensitivity RF Characteristics, VREG_IN_HV/VDD_PADS = 3.3V @ room temp. Sensitivity for 0.1% BER Packet Type Min Typ Max BT. Spec. Unit -70 dBm dBm DH1 DH3 -87 -87 DH5 2-DH5 -87 -91 dBm dBm Sensitivity variation over BT band 3-DH5 All -85 3 dBm dB Sensitivity variation over temperature range All TBD dB INTERFACE 8.1 PIO PIO lines are configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset and have additional individual bus-keeper configuration. 8.2 WLAN Coexistence Interface Dedicated hardware is provided to implement a variety of WLAN coexistence schemes. The following are supported: Channel skipping AFH Priority signaling Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 12 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Channel signaling Host passing of channel instructions The BT830 supports the following WLAN coexistence schemes: Unity-3 Unity-3e More information is available in the BT830 Configuration File application note, available on the documentation tab of the BT830 Product Page at Lairdtech.com. 8.3 UART Interface This is a standard UART interface for communicating with other serial devices. The CSR8811 UART interface provides a simple mechanism for communicating with other serial devices using the RS-232 protocol. Figure 1: Signals that implement the UART function The above figure shows the four signals that implement the UART function. When BT830 is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, implement RS232 hardware flow control where both are active low indicators. The default configuration of UART is 115200 bauds; None parity check; 1 stop bit; 8 bits per byte. Note: 8.4 With a standard PC, an accelerated serial port adapter card is required to communicate with the UART at its maximum data rate. PCM Interface The audio PCM interface on the BT830 supports the following: Continuous transmission and reception of PCM encoded audio data over Bluetooth. Processor overhead reduction through hardware support for continual transmission and reception of PCM data. A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not pass through the HCI protocol layer. Hardware on the BT830 for sending data to and from a SCO connection. Up to three SCO connections on the PCM interface at any one time. PCM interface master, generating PCM_SYNC and PCM_CLK. PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK. Various clock formats including: – Long Frame Sync – Short Frame Sync GCI timing environments. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 13 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 13-bit or 16-bit linear, 8-bit µ-law, or A-law companded sample formats. Receives and transmits on any selection of three of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32. 8.4.1 PCM Interface Master/Slave When configured as the master of the PCM interface, the BT830 generates PCM_CLK and PCM_SYNC. Figure 2: PCM Interface Master Figure 3: PCM Interface Slave 8.4.2 Long Frame Sync Figure 4: Long Frame Sync (shown with 8-bit Companded Sample) Long Frame Sync indicates a clocking format that controls the transfer of PCM data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When the BT830 is configured as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is eight bits long. When the BT830 is configured as PCM Slave, PCM_SYNC is from one cycle PCM_CLK to half the PCM_SYNC rate. BT830 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 14 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 8.4.3 Short Frame Sync In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always one clock cycle long. Figure 5: Short Frame Sync (Shown with 16-bit Sample) As with Long Frame Sync, BT830 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge. 8.4.4 Multi-Slot Operation More than one SCO connection over the PCM interface is supported using multiple slots. Up to three SCO connections are carried over any of the first four slots. Figure 6: Multi-slot operation with 2 Slots and 8-bit companded samples 8.5 GCI Interface BT830 is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The two 64 kbps B channels are accessed when this mode is configured. Figure 7: Multi-slot operation The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8 kHz. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 15 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 8.6 Slots and Sample Formats BT830 receives and transmits on any selection of the first four slots following each sync pulse. Slot durations are either 8 or 16 clock cycles: 8 clock cycles for 8-bit sample formats 16 clock cycles for 8-bit, 13-bit, or 16-bit sample formats BT830 supports: 13-bit linear, 16-bit linear, and 8-bit µ-law or A-law sample formats A sample rate of 8 ksps Little or big endian bit order For 16-bit slots, the three or eight unused bits in each slot are filled with sign extension, padded with zeros or a programmable 3-bit audio attenuation compatible with some codecs. Figure 8: 16-bit slot Length and sample formats 8.7 PCM Timing Information Table 10: PCM Timing information Symbol fmclk Parameter PCM_CLK frequency 4MHz DDS generation. Frequency selection is programmable. 48MHz DDS generation. Frequency selection is programmable. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 16 © Copyright 2016 Laird. All Rights Reserved Min - Typ 128 Max - Unit kHz - kHz 256 512 2.9 - Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Symbol tmclkh (a) Parameter PCM_SYNC frequency for SCO connection PCM_CLK high 4MHz DDS generation Min 980 Typ 8 - Max - Unit kHz ns tmclkl a) - PCM_CLK low PCM_CLK jitter 730 - - 21 ns ns pk-pk Delay time from 4MHz DDS generation PCM_CLK high to 48MHz DDS generation PCM_SYNC high Delay time from PCM_CLK high to valid PCM_OUT - - 20 40.83 ns ns - - 20 ns Delay time from PCM_CLK low to PCM_SYNC low (long frame sync only) - - 20 40.83 ns ns tdmclksynch tdmclkpout tdmclklsyncl 4MHz DDS generation 48MHz DDS generation 4MHz DDS generation 48MHz DDS generation (a) Assumes normal system clock operation. Figures vary during low-power modes, when system clock speeds are reduced. Table 11: PCM Master Mode Timing Parameters Symbol tdmclkhsyncl tdmclklpoutz tdmclkhpoutz tsupinclkl thpinclkl Parameter Delay time from 4MHz DDS generation PCM_CLK high to 48MHz DDS generation PCM_SYNC low Delay time from PCM_CLK low to PCM_OUT high impedance Delay time from PCM_CLK high to PCM_OUT high impedance Set-up time for PCM_IN valid to PCM_CLK low Hold time for PCM_CLK low to PCM_IN invalid Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 17 © Copyright 2016 Laird. All Rights Reserved Min - Typ - Max 20 40.83 Unit ns ns - - 20 ns - - 20 ns 20 0 - - ns ns Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Figure 9: PCM Master Timing Long Frame Sync Figure 10: PCM Master Timing Short Frame Sync Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 18 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 8.8 PCM Slave Timing Symbol fsclk fsclk tsclkl Parameter PCM clock frequency (Slave mode: input) Min 64 Typ - Max 2048 Unit kHz PCM clock frequency (GCI mode) PCM_CLK low time 128 200 - 4096 - kHz ns tsclkh PCM_CLK high time 200 - - ns 8.9 PCM Slave Mode Timing Parameters Symbol thsclksynch tsusclksynch tdpout tdsclkhpout tdpoutz tsupinsclkl thpinsclkl Parameter Hold time from PCM_CLK low to PCM_SYNC high Set-up time for PCM_SYNC high to PCM_CLK low Min 2 20 Typ - Max - Unit ns ns Delay time from PCM_SYNC or PCM_CLK, whichever is later, to valid PCM_OUT data (long frame sync only) Delay time from CLK high to PCM_OUT valid data Delay time from PCM_SYNC or PCM_CLK low, whichever is later, to PCM_OUT data line high impedance Set-up time for PCM_IN valid to CLK low Hold time for PCM_CLK low to PCM_IN invalid - - 15 ns - - 15 20 ns ns 20 2 - - ns ns Figure 11: PCM Slave Timing Long Frame Sync Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 19 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Figure 12: PCM Slave Timing Short Frame Sync 8.10 PCM_CLK and PCM_SYNC Generation BT830 has two methods of generating PCM_CLK and PCM_SYNC in master mode: Generating these signals by DDS from BT830internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256 or 512 kHz and PCM_SYNC to 8 kHz. Generating these signals by DDS from an internal 48MHz clock enables a greater range of frequencies to be generated with low jitter but consumes more power. To select this second method, set bit to 48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length of PCM_SYNC is either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in PSKEY_PCM_CONFIG32. Equation 8.1 describes PCM_CLK frequency when generated from the internal 48MHz clock: Equation 8.1: PCM_CLK Frequency Generated Using the Internal 48MHz Clock Set the frequency of PCM_SYNC relative to PCM_CLK using Equation 8.2: Equation 8.2: PCM_SYNC Frequency Relative to PCM_CLK CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set SKEY_PCM_LOW_JITTER_CONFIG to 0x08080177. 8.11 PCM Configuration Configure the PCM by using PSKEY_PCM_CONFIG32 and PSKEY_PCM_LOW_JITTER_CONFIG (see your PSKey file). The default for PSKEY_PCM_CONFIG32 is 0x00800000. For example: First slot following sync is active, 13-bit linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no tri-state of PCM_OUT). Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 20 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 8.12 Digital Audio Interface (I²S) The digital audio interface supports the industry standard formats for I²S, left-justified or right-justified. The interface shares the same pins as the PCM interface which means each audio bus is mutually exclusive in its usage. Table 12 lists these alternative functions. Figure 11 shows the timing diagram. Table 12: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface. PCM Interface PCM_OUT I²S Interface SD_OUT PCM_IN PCM_SYNC SD_IN WS PCM_CLK SCK Figure 13: PCM Configuration The internal representation of audio samples within BT830is 16-bit and data on SD_OUT is limited to 16-bit per channel. Table 13: Digital Audio Interface Slave Timing Symbol - Parameter SCK Frequency Min - Typ - Max 6.2 Unit MHz tch tcl WS Frequency SCK high time SCK low time 80 80 - 96 - kHz ns ns Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 21 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Table 14: I²S Slave Mode Timing Symbol tssu tsh topd tisu tih Parameter WS valid to SCK high set-up time Min 20 Typ - Max - Unit ns SCK high to WS invalid hold time SCK low to SD_OUT valid delay time 2.5 - - 20 ns ns SD_IN valid to SCK high set-up time SCK high to SD_IN invalid hold time 20 2.5 - - ns ns Figure 14: Digital Audio Interface Slave Timing Table 15: Digital Audio Interface Master Timing Symbol - Parameter SCK Frequency WS Frequency Min - Typ - Max 6.2 96 Unit MHz kHz Table 16: I²S Master Mode Timing Parameters, WS and SCK as Outputs Symbol tspd topd tisu tih Parameter SCK low to WS valid delay time SCK low to SD_OUT valid delay time SD_IN valid to SCK high set-up time SCK high to SD_IN invalid hold time Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth Min - Typ - Max 39.27 18.44 Unit ns ns 18.44 - - ns 0 - - ns 22 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Figure 15: Digital Audio Interface Master Timing POWER SUPPLY AND REGULATION BT830 can be powered by either of the two sources listed below: Method #1 – Apply 3.3 V on pin-9, High-voltage linear regulator input (VREG_IN_HV), to generate the main 1.8 V out put on pin-10 (VREG_OUT_HV). A minimum 1.5μF capacitor must be connected to the Pin-10 (VREG_OUT_HV). Low ESR capacitors such as multilayer ceramic types should be used. In this case, the VDD_PADS can be either 3.3V or 1.8V. Method #2 – Apply 1.8V on pin-10 High-voltage linear regulator output (VREG_OUT_HV), to generate the internal voltage for the system. Be sure to left Pin-9 un-connected in this method. In this case, the VDD_PADS can only be set at 1.8V. Note: The I/O signal voltage level (VDD_PADS) should be equal or less than the power supply mentioned voltage above. 9.1 Voltage Regulator Enable and Reset A single pin, VREG_EN_RST#, controls both the high-voltage linear regulator enables and the digital reset function. The VREG_EN_RST# pin remains active controlling the reset function if the HV linear regulator is not used; the pin must be driven high to take the device out of reset. The regulator is enabled by taking the VREG_EN_RST# pin above 1.0V. The regulator can also be controlled by the software. The VREG_EN_RST# is also connected internally to the reset function, and is powered from the VDD_PADS supply, so voltages above VDD_PADS must not be applied to this pin. The VREG_EN_RST# pin is pulled down internally. The VREG_EN_RST# pin is an active low reset. Assert the reset signal for a period greater than five milliseconds to ensure a full reset. Note: The regulator enables are released as soon as VREG_EN_RST# is low, so the regulators shut down. Therefore do not take VREG_EN_RST# low for less than five millilseconds, as a full reset is not guaranteed. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 23 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Other reset sources are: - Power-on reset - Via a software-configured watchdog timer A warm reset function is also available under software control. After a warm reset the RAM data remains available. 9.2 Power Sequencing CSR recommends that all power supplies are powered at the same time. The order of powering the supplies relative to the I/O supply, VDD_PADS to VREG_IN_HV or VREG_OUT_HV, is not important. ANTENNA PERFORMANCE 10.1 Multilayer Chip Antenna Figure 16 illustrates this antenna’s performance. Unit in dBi @2.44GHz AT3216-B2R7HAA XY-plane XZ-plane YZ-plane Peak Avg. Peak Avg. Peak Avg. -2.2 -5.9 -0.7 -5.0 -1.3 -3.7 Efficiency 40% Figure 16: BT830 gain table for the multilayer chip antenna Figure 17: Network Analyzer output Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 24 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet XY-plane Unit : dBi Peak gain Avg. gain -2.2 -5.9 Peak gain Avg. gain XZ-plane -0.7 -5.0 YZ-plane Peak gain -1.3 Avg. gain -3.7 XY-plane X Y XZ-plane Z X YZ-plane Z Y Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 25 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 10.2 NanoBlade The following describes the performance of the NanoBlue antenna (EBL2449A1-15UFL): Parameter Frequency Range Performance 2.4-2.5 GHz Gain 2.0 dBi Polarization Linear Impedance 50 ohms VSWR <2.0:1 Dimensions (L x W x H) 1.88 in x .5 in x .032 in Weight 2 grams XY-plane XZ-plane YZ-plane Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 26 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet MECHANICAL DIMENSIONS AND LAND PATTERN 11.1 BT830-SA Mechanical Drawing Note: Dimensions are in millimetres (mm). Tolerances: .xx ±0.03 mm for PCB PAD; +/0.15mm for module size. .x ±1.3 mm Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 27 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 11.2 BT830-ST Mechanical Drawing Note: Dimensions are in millimetres (mm). Tolerances: .xx ±0.03 mm for PCB PAD; +/0.15mm for module size. .x ±1.3 mm Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 28 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet IMPLEMENTATION NOTE 12.1 PCB Layout on Host PCB Checklist (for PCB): Must locate the BT830 module close to the edge of PCB. Use solid GND plane on inner layer (for best EMC and RF performance). Place GND vias as close to module GND pads as possible Route traces to avoid noise being picked up on VCC supply. Antenna Keep-out area: – Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. – Keep all mounting hardware and metal clear of the area to allow proper antenna radiation. – For best antenna performance, place the BT830 module on the edge of the host PCB, preferably in the corner with the antenna facing the corner. – A different host PCB thickness dielectric will have small effect on antenna. Figure 18: Recommend Antenna keep-out area (in White) used on the BT830-SA 12.1.1 Antenna Keep-out and Proximity to Metal or Plastic Checklist (for metal /plastic enclosure): Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right. Metal close to the BT830-SA chip monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of degradation is entirely system dependent which means some testing by customers is required (in their host application). Any metal closer than 20 mm starts to significantly degrade performance (S11, gain, radiation efficiency). It is best that the customer tests the range with mock-up (or actual prototype) of the product to assess effects of enclosure height (and material whether metal or plastic). Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 29 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 12.1.2 DC Power Supply Options for Using BT830 Module Using DC power 3.3 V Power the on Pin-9 (VREG_IN_HV) with 3.3 V and pull-high on Pin-8 (VREG_EN_RST#) to turn on the internal regulator. The BT830 module generates 1.8 V output on Pin-10 (VREG_OUT_HV) which can supply to the other DC pin of the board. Using DC power 1.8 V Leave the Pin-9 (VREG_IN_HV) no connection, power the Pin-10 (VREG_OUT_HV) with 1.8 V and pull-high on Pin-8 (VREG_EN_RST#) to turn on the internal regulator. APPLICATION NOTE FOR SURFACE MOUNT MODULES 13.1 Introduction Laird surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and is updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and they conform to current automated manufacturing processes. 13.2 Shipping 13.2.1 Tray Package Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Error! Reference s ource not found.. Figure 19: Shipping tray layout Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 30 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet 13.2.2 Tape and Reel Package Information Note: Ordering information for Tape and Reel packaging is an addition of T/R to the end of the full module part number. For example, BT830 becomes BT830-Sx-xx-T/R. Figure 20: Reel specifications Figure 21: Tape specifications Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 31 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet There are 2500 BT830 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (12,500 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Figure 22. 13.2.2.1 Packaging Process Figure 22: BT800 packaging process 13.3 Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, see Table 17 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in in Table 17, the modules must be removed from the shipping tray. Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30°C/60%RH. Table 17: Recommended baking times and temperatures MSL 125°C Baking Temp. Saturated @ 30°C/85% 3 9 hours 90°C/≤ 5%RH Baking Temp. Floor Life Limit + 72 hours @ 30°C/60% 7 hours Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth Saturated @ 30°C/85% 33 hours 40°C/ ≤ 5%RH Baking Temp. Floor Life Limit + 72 hours @ 30°C/60% 23 hours 32 © Copyright 2016 Laird. All Rights Reserved Saturated @ 30°C/85% 13 days Floor Life Limit + 72 hours @ 30°C/60% 9 days Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds. Figure 13-23: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 18. Table 18: Recommended Maximum and minimum temperatures Specification Value Unit Temperature Inc./Dec. Rate (max) Temperature Decrease rate (goal) 1~3 2-4 °C / Sec °C / Sec Soak Temp Increase rate (goal) Flux Soak Period (Min) .5 - 1 70 °C / Sec Sec Flux Soak Period (Max) Flux Soak Temp (Min) 120 150 Sec °C Flux Soak Temp (max) Time Above Liquidous (max) 190 70 °C Sec Time Above Liquidous (min) Time In Target Reflow Range (goal) 50 30 Sec Sec Time At Absolute Peak (max) Liquidous Temperature (SAC305) 5 218 Sec °C Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature 240 250 260 °C °C °C Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 33 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet FCC AND IC REGULATORY Model BT830 US/FCC SQGBT830 CANADA/IC 3147A-BT830 BT830 DVK-BT830 SQGBT830 SQGBT830 3147A-BT830 3147A-BT830 The BT830 family has been designed to operate with the antenna listed below having a maximum gain of 0.5 dBi. The required antenna impedance is 50 ohms. Item 1 2 Part Number AT3216-B2R7HAA S181FL-L-RMM-2450S Mfg. ACX Nearson Type Ceramic Dipole Gain (dBi) 0.5 2.0 Connector N/A UFL 3 4 EBL2449A1-15UFL MAF94190 Laird Laird PCB Dipole Dipole 2.0 2.0 UFL UFL 5 WRR2400-IP04-B (MAF94019) Laird Dipole 1.5 UFL 14.1 Documentation Requirements In order to ensure regulatory compliance, when integrating the BT830 into a host device, it is necessary to meet the documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC, Industry Canada, and European Union) outline the information that may be included in the user’s guide and external labels for the host devices into which the BT830 is integrated. FCC Note: You must place “Contains FCC ID: SQG-BT830” on the host product in such a location that it can be seen by an operator at the time of purchase. User’s Guide Requirements The BT830 complies with FCC Part 15 Rules for a Modular Approval. To leverage Laird’s grant, the conditions below must be met for the host device into which the BT830 is integrated: The transmitter module is not co-located with any other transmitter or antenna that is capable of simultaneous operation. As long as the conditions above are met, further transmitter testing is typically not required. However, the OEM integrator is still responsible for testing its end-product for any additional compliance requirements required with this module installed, such as (but not limited to) digital device emissions and PC peripheral requirements. IMPORTANT: In the event that the conditions above cannot be met (for example certain device configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. When using Laird’s FCC grant for the BT830, the integrator must include specific information in the user’s guide for the device into which the BT830 is integrated. The integrator must not Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 34 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet provide information to the end user regarding how to install or remove this RF module in the user’s manual of the device into which the BT830 is integrated. The following FCC statements must be added in their entirety and without modification into a prominent place in the user’s guide for the device into which the BT830 is integrated: IMPORTANT NOTE: To comply with FCC requirements, the BT830 must not be co-located or operating in conjunction with any other antenna or transmitter. 14.1.1.1 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: 1. Reorient or relocate the receiving antenna. 2. Increase the separation between the equipment and receiver. 3. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 4. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. Industry Canada Note: You must place “Contains IC ID: 3147A-BT830” on the host product in such a location that it can be seen by an operator at the time of purchase. RF Radiation Hazard Warning Using higher gain antennas and types of antennas not certified for use with this product is not allowed. The device shall not be co-located with another transmitter. Cet avertissement de sécurité est conforme aux limites d'exposition définies par la norme CNR-102 at relative aux fréquences radio. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 35 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet This radio transmitter (Contains IC ID: 3147A-BT830) has been approved by Industry Canada to operate with the antenna types listed in table above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le présent émetteur radio (Contains IC ID: 3147A-BT830) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 36 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet EUROPEAN UNION REGULATORY The BT830 has been tested for compliance with relevant standards for the EU market. BT830 modules were tested with a 0.5 dBi chip antenna. The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request. 15.1 EU Declarations of Conformity - BT830-SA and BT830-ST Manufacturer: Products: EU Directives: Conformity Assessment: Laird BT830 1999/5/EC – R&TTE 1999/519/EC 2006/95/EC – Low Voltage directive (LVD) 2004/108/EC – Electromagnetic compatibility (EMC) 2014/30/EU – EMC Annex IV Reference standards used for presumption of conformity: Article Number 3.1a 3.1b 3.2 Requirement 2006/95/EC Low voltage equipment safety 2006/95/EC RF Exposure 2004/108/EC Protection requirements with respect to electromagnetic compatibility 1999/5/EC Means of the efficient use of the radio frequency spectrum Reference standard(s) EN 60950-1:2006 +A11:2009 +A1:2010 +A12:2011 +A2:2013 EN 62311:2008 EN 62479:2010 EN 301 489-1 v1.9.2 (2011-09) EN 301 489-17 v2.2.1 (2012-09) EN 300 328 v1.9.1 (2015-02) Declaration: We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose. Place of Issue: Date of Issue: Name of Authorized Person: Laird W66N220 Commerce Court, Cedarburg, WI 53012 USA tel: +1-262-375-4400 fax: +1-262-364-2649 August 2016 Thomas T Smith, Director of EMC Compliance Signature of Authorized Person: Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 37 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet ORDERING INFORMATION Part Number BT830-SA Description BTv4.0 Dual Mode UART HCI Module with integrated Antenna BT830-ST DVK-BT830 BTv4.0 Dual Mode UART HCI Module – Trace Pin Development Kit for BT830 Module 16.1 General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 38 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet BLUETOOTH SIG APPROVALS 17.1 Application Note: Subsystem Combinations This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to create a complete Bluetooth End Product solution. Subsystem listings referenced as an example: Design Name Owner BT830 Laird Embedded CE 6.0 (Host Subsystem) Microsoft Corporation Declaration ID D023115 Link to listing on the SIG website B012893 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=12893 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=23115 17.1.1 Laird Customer Declaration ID Procedure This procedure assumes that the member is simply combining two subsystems to create a new design, without any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the Bluetooth SIG website. Figure 24 shows the basic subsystem combination of a controller and host subsystem. The Controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a Profile Subsystem. The controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a Profile Subsystem. D023115 Figure 24: Basic subsystem combination of a controller and host subsystem The Qualification Process requires each company to registered as a member of the Bluetooth SIG – http://www.bluetooth.org The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 39 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BT830 Datasheet For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document: https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm. In step 1, select the option, Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 40 © Copyright 2016 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610