TI1 DLPA2005ERSLT Power management and led/lamp driver ic Datasheet

Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
DLPA2005 Power Management and LED/Lamp Driver IC
1
1 Features
•
•
•
•
•
•
•
•
•
Charger
DC_IN
BAT
– Light Sensor (for White Point Correction)
– Internal Reference Voltage
– External (Thermistor) Temperature Sensor
Monitoring and Protection Circuits
– Hot Die Warning and Thermal
– Low-Battery Warning
– Programmable Battery Undervoltage Lockout
(UVLO)
– Load Switch UVLO
– Overcurrent and Undervoltage Protection
DLPA2005 QFN Package
– 48-Pin 0.4-mm Pitch
– Die Size: 6.0 mm × 6.0 mm ± 0.15 mm
•
•
2 Applications
DLP® Pico™ Projector
DLP® Mobile Sensing
3 Description
DLPA2005 is a dedicated PMIC/RGB LED/Lamp
driver for the DLP2010, DLP2010NIR and DLP3010
Digital Micromirror Devices (DMD) when used with a
DLPC3430, DLPC3433, DLPC3435, DLCP3438, or
DLPC150 digital controller. For reliable operation of
these chipsets it is mandatory to use a DLPA2000 or
DLPA2005.
Device Information(1)
PART NUMBER
...
2.3V-5.5V
DC Supplies
DLPA2005
VSPI
1.1V
1.1V
Reg
SYSPWR
L3
1.8V
HDMI
HDMI
Receiver
PROJ_ON
Front-End
Chip
FLASH,
SDRAM
- OSD
- AutoLock
- Scaler
- uController
Keypad
Keystone
Sensor
VLED
SPI_0
I2C_1
HOST_IRQ
FLASH
4
SPI_1
4
PARKZ
RESETZ
INTZ
RED
GREEN
BLUE
BIAS, RST, OFS
3
Illumination
Optics
WPC
CMP_PWM
LABB
CMP_OUT
eDRAM
Thermistor
I2C
1.8V
(optional)
1.1V
Sub-LVDS DATA
CTRL
VIO
VCC_INTF
VCC_FLSH
TVP5151
Video
Decoder
Current
Sense
L2
LED_SEL(2)
DLPC3430/
DLPC3435
L1
DLPA2005
GPIO_8 (Normal Park)
Cal data
(optional)
EEPROM
28
SD Card
Reader,
etc.
1.8V
PROJ_ON
Parallel I/F
CVBS
6.00 mm × 6.00 mm
± 0.150 mm
Projector Module Electronics
VDD
Triple
ADC
BODY SIZE (NOM)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1.8V
VGA
VQFN (48)
1.8V
Other
Supplies
On/Off
PACKAGE
±
•
High Efficiency RGB LED/Lamp Driver With BuckBoost DC-to-DC Converter, DMD Supplies, DPP
Core Supply, 1.8-V Load Switch, and
Measurement System in a Small Chip-Scale
Package
Three Low-Impedance (30 mΩ Typical at 27°C)
MOSFET Switches for Channel Selection
Independent, 10-Bit Current Control per Channel
2.4-A Max LED Current for DLPA2005 Embedded
Applications
DMD Regulators
– Requires Only a Single Inductor
– VOFS: 10 V
– VBIAS: 18 V
– VRST: –14 V
– Passive Discharge to GND When Disabled
DPP 1.1-V Core Supply
– Synchronous Step-Down Converter With
Integrated Switching FETs
– Supports up to 600-mA Output Current
VLED Buck Boost Converter
– Power Save Mode at Light Load Current
Low-Impedance Load Switch
– VIN Range from 1.8 to 3.6 V
– Supports up to 200 mA of Current
– Passive Discharge to GND When Disabled
DMD Reset Signal Generation and Power Supply
Sequencing
33-MHz Serial Peripheral Interface (SPI)
Multiplexer for Measuring Analog Signals
– Battery Voltage
– LED Voltage, LED Current
+
•
VCORE
18
DLP2010
WVGA
(WVGA
DDR
DMD
DMD)
Spare R/W
GPIO
BT.656
Included in DLP® Chip Set
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
1
1
1
2
3
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 5
Electrical Characteristics........................................... 6
Data Transmission Timing Requirements............... 10
Typical Characteristics ............................................ 11
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 25
7.5 Register Maps ......................................................... 27
8
Application and Implementation ........................ 38
8.1 Application Information............................................ 38
8.2 Typical Projector Application .................................. 38
8.3 Typical Mobile Sensing Application ....................... 40
9 Power Supply Recommendations...................... 43
10 Layout................................................................... 44
10.1 Layout Guidelines ................................................. 44
10.2 Layout Example .................................................... 44
10.3 Thermal Considerations ........................................ 45
11 Device and Documentation Support ................. 46
11.1
11.2
11.3
11.4
Device Support......................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
46
46
46
46
12 Mechanical, Packaging, and Orderable
Information ........................................................... 46
4 Revision History
Changes from Revision A (September 2014) to Revision B
Page
•
Updated title .......................................................................................................................................................................... 1
•
Updated Features, Applications, and Description ................................................................................................................. 1
•
Added mobile sensing application ......................................................................................................................................... 1
•
Updated Detailed Description .............................................................................................................................................. 12
•
Added new Typical Mobile Sensing application in Application Information ......................................................................... 38
Changes from Original (August 2014) to Revision A
•
2
Page
Changed device status from Product preview to Production Data and released full version of the document. ................... 1
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
5 Pin Configuration and Functions
Package M arking DLPA2005
(TO P VIEW )
24 SWC
23 PGNDC
22 LS_IN
21 LS_OUT
20 GND
19 V2V5
18 VINA
17 VOFS
16 No Connect
15 VBIAS
14 CNTR_VRST
13 SWP
DLPA2005 VQ FN Package
(BO TTO M VIEW )
29
VC O R E
SPI_C LK
7
30
SEN S2
IN TZ
6
31
LED _SEL0
AG N D 1
5
32
VSPI
R ESETZ
4
33
SEN S1
SPI_D IN
3
34
LED _SEL1
VIN L
2
35
V6V
VIN L
1
36
R LIM _K
TI
YM
LLLL
S
PAD2005
A4
TI YM S$$
LLLL G 4
$$
= TI LETTERS
= YEAR / M O NTH DATE CO DE
= ASSY LO T CO DE
= ASSEM BLY SITE CO DE
PER Q SS 005-120
= W AFER FAB CO DE
(1 or 2 CHARACTERS)
=pin 1 M arking
SW6 37
8
SW5 38
C M P_O U T
SPI_C SZ
SW4 39
28
RLIM 40
9
VLED 41
PR O J_O N
SPI_D O U T
VLED 42
27
L2 43
10
L2 44
PW M _IN
VIN R
PGNDL 45
VIN C
26
PGNDL 46
25
11
L1 47
12
SW N
L1 48
PG N D R
Pin Functions
PIN
NAME
VINL
NUMBER
1
2
I/O
DESCRIPTION
I
Power supply input for VLED BUCK-BOOST power stage. Connect to system power.
SPI_DIN
3
I
SPI data input
RESETZ
4
O
Reset output to the DLP system (active low). Pin is held low to reset DLP system.
AGND1
5
GND
INTZ
6
O
Interrupt output signal (open drain). Connect to pullup resistor or short to ground.
SPI_CLK
7
I
Clock input for SPI interface
SPI_CSZ
8
I
SPI chip select (active low)
SPI_DOUT
9
O
SPI data output
VINR
10
I
Power supply input for DMD switch mode power supply (SMPS). Connect to system power.
SWN
11
I
Connection for the DMD SMPS-inductor (high-side switch).
PGNDR
12
GND
Power ground for DMD SMPS. Connect to ground plane.
SWP
13
O
Connection for the DMD SMPS-inductor (low-side switch).
CNTR_VRST
14
O
Connection to VRST for fast discharge function
VBIAS
15
O
VBIAS output rail. Connect to ceramic capacitor.
No Connect
16
I
Previously reference pin for the VRST regulator. On A4 design this reference is internal to
DLPA2005 chip.
VOFS
17
O
VOFS output rail. Connect to ceramic capacitor.
VINA
18
POWER
Power supply input for sensitive analog circuitry
V2V5
19
O
Internal supply filter pin for digital logic; typical 2.5 V
GND
20
GND
Ground connection to be connected to ground plane.
LS_OUT
21
O
Load switch
LS_IN
22
I
Load switch
PGNDC
23
GND
SWC
24
I/0
VINC
25
I
Power supply input for VCORE BUCK power stage. Connect to system power.
PWM_IN
26
I
Reference voltage input for analog comparator.
PROJ_ON
27
I
Input signal to enable or disable the IC and DLP projector.
Analog ground. Connect to ground plane.
Power ground for VCORE BUCK
Connection for 1.1-V BUCK inductor
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
3
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Pin Functions (continued)
PIN
NAME
NUMBER
I/O
DESCRIPTION
CMP_OUT
28
O
Analog-comparator output.
VCORE
29
I
VCORE BUCK converter feedback pin.
SENS2
30
I
Input signal from temperature sensor.
LED_SEL0
31
I
Digital input to the RGB Strobe Decoder
VSPI
32
I
Power supply input for SPI interface. Connect to system I/O voltage.
SENS1
33
I
Input signal from light sensor.
LED_SEL1
34
I
Digital input to the RGB Strobe Decoder
V6V
35
O
Internal supply filter pin for gate driver circuitry. Typical 6.25 V
RLIM_K
36
I
Kelvin sense connection to top side of LED current sense resistor.
For best accuracy, route this trace directly to the top of the current sense resistor and
separate it from the normal trace from the current sense resistor to the RLIM pins.
SW6
37
O
Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
SW5
38
O
Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
SW4
39
O
Low-side MOSFET switch for LED cathode. Connect to RGB LED assembly.
RLIM
40
O
Connection to LED ‘current sense’ resistor.
Bottom side of sense resistor is connected to GND.
VLED
41 / 42
O
VLED BUCK-BOOST converter output pin.
L2
43 / 44
I
Connection for VLED BUCK-BOOST inductor.
PGNDL
45 / 46
GND
L1
47 / 48
O
4
Power ground for VLED BUCK-BOOST. Connect to ground plane.
Connection for VLED BUCK-BOOST inductor.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature (unless otherwise noted) (1)
MIN
MAX
UNIT
Input voltage at VINL, VINA, VINR, VINC
–0.3
7
V
Ground pins to system ground
–0.3
0.3
V
Voltage at SWN
–18
7
V
Voltage at SWP, VBIAS
–0.3
20
V
Voltage at VOFS
–0.3
12
V
Voltage at V6V, VLED, L1, L2, SWC, SW4, SW5, SW6, INTZ, PROJ_ON
–0.3
7
V
Voltage at all pins, unless noted otherwise
–0.3
3.6
V
Source current RESETZ, CMP_OUT
Source current SPI_DOUT
Sink current RESETZ, CMP_OUT
Sink current SPI_DOUT, INTZ
Peak output current
1
mA
5.5
mA
1
mA
5.5
mA
Internally limited
Internally limited by thermal
shutdown
Continuous total power dissipation
TJ
Operating junction temperature
–30
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted).
MIN
NOM
MAX
Full functional and parametric performance
2.7
3.6
6
Extended operating range, limited parametric performance
2.3
3.6
6
Voltage at VSPI
1.65
1.8
3.6
V
Operational ambient temperature
–10
85
°C
Operational junction temperature
–10
120
°C
Input voltage at VINL, VINA,
VINR, VINC,
UNIT
V
6.4 Thermal Information
THERMAL METRIC (1)
DLPA2005
UNIT
RSL (48 PINS)
RθJA
(1)
(2)
Junction-to-ambient thermal resistance (2)
27.9
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Estimated when mounted on high K JEDEC board per JESD 51-7 with thickness of 1.6 mm, 4 layers, size of 76.2 mm × 114.3 mm, and
2-oz. copper for top and bottom plane. Actual thermal impedance will depend on PCB used in the application.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
5
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) (see
PARAMETER
(1) (2) (3)
)
TEST CONDITIONS
MIN
TYP
MAX
2.7
3.6
6
2.3
3.6
6
UNIT
SUPPLIES
INPUT VOLTAGE
Input voltage range
VIN
Extended input voltage range (1)
VINA, VINR, VINL, VINC
Low-battery warning threshold
VINA falling
3
Hysteresis
VINA rising
100
Undervoltage lockout threshold
VINA falling (through 5-bit trim function)
Hysteresis
VINA rising
Startup voltage
VBIAS, VOFS, VRST; loaded with 2 mA
IQ
ACTIVE mode
Motor current excluded
ISTD
STANDBY mode
IIDLE
IDLE mode
VLOW_BAT
Vhys(UVLO)
VSTARTUP
2.3
V
V
mV
4.5
100
V
mV
2.5
V
INPUT CURRENT
15
mA
900
µA
10
µA
INTERNAL SUPPLIES
VV6V
Internal supply, analog
6.25
V
CLDO_V6V
Filter capacitor for V6V LDO
100
nF
VV2V5
Internal supply, logic
2.5
V
CLDO_V2V5
Filter capacitor for V2V5 LDO
2.2
µF
DMD REGULATOR
RDS(ON)
VFW
MOSFET ON-resistance
Forward voltage drop
Switch E (from VINR to SWN)
1000
Switch F (from SWP to PGNDR)
320
Switch G (2) (from SWP to VBIAS[2])
VINR = 5 V, VSWP = 2 V, IF = 100 mA
1.3
Switch H (from SWP to VOFS)
VINR = 5 V, VSWP = 2 V, IF = 100 mA
1.3
tDIS
Rail discharge time
VIN = 2.9 V; COUT = 110 nF
tPG
Power-good timeout
Not tested in production
ILIMIT
Switch current limit
L
Inductor value
mΩ
V
40
µs
6
ms
312
mA
10
µH
10
V
VOFS REGULATOR
Output voltage
DC output voltage accuracy
IOUT = 2 mA
DC load regulation
VIN = 3.6 V, IOUT = 0 to 2 mA
DC line regulation
VINA, VINL, VINR, VINC 2.7 to 6 V, IOUT = 2
mA
VRIPPLE
Output ripple
VIN = 3.6 V, IOUT = 2 mA, COUT = 440 nF (4)
IOUT
Output current
VOFS
–2%
Power-good threshold
(fraction of nominal output voltage)
RDIS
Output discharge resistor
Active when rail is disabled
Output capacitor
Recommended value (output capacitors for
VOFS / VBIAS must be equal)
110
tDISCHARGE < 40 µs at 2.9 V
100
6
35
mV/V
375
PG
(1)
(2)
(3)
(4)
V/A
0
VOFS rising
COUT
2%
–19
mVpp
3
86%
VOFS falling
66%
mA
100
Ω
220
nF
110
nF
Fully functional but limited parametric performance
Including rectifying diode
Typicals are at 25 C.
To reduce ripple the COUT can be increased. VRIPPLE is inversely proportional to COUT.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted) (see (1)(2)(3))
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VBIAS REGULATOR
Output voltage
18
DC output voltage accuracy
IOUT = 2 mA
DC Load regulation
VIN = 3.6 V, IOUT = 0 to 2 mA
DC Line regulation
VINA, VINL, VINR, VINC 2.7 to 6 V, IOUT = 2
mA
VRIPPLE
Output ripple
VIN = 3.6 V, IOUT = 2 mA, COUT = 440 nF
(see (4))
IOUT
Output current
VBIAS
–2%
PG
Power-good threshold
(fraction of nominal output voltage)
RDIS
Output discharge resistor
Active when rail is disabled
Output capacitor
Recommended value (output capacitors for
VOFS / VBIAS must be equal)
110
tDISCHARGE < 40 µs at 2.9 V
100
COUT
–14
V/A
18
mV/V
375
mVpp
0
VBIAS rising
V
2%
4
86%
VBIAS falling
66%
mA
Ω
100
220
nF
110
VRST REGULATOR
Output voltage
VRST
–14
DC output voltage accuracy
IOUT = 2 mA
DC load regulation
VIN = 3.6 V, IOUT = 0 to 2 mA
–3%
V
3%
13
V/A
DC line regulation
VINA, VINL, VINR, VINC 2.7 to 6 V, IOUT = 2
mA
–21
mV/V
VRIPPLE
Output ripple
VIN = 3.6 V, IOUT = 2 mA, COUT = 440 nF
(see (4))
375
mVpp
VREF_VRST
Reference voltage
500
mV
IOUT
Output current
PG
Power-good threshold (fraction of
nominal output voltage)
VRST rising
VRST falling
90%
RDIS
Output discharge resistor
Active when rail is disabled
±150
COUT
Output capacitor
0
110
tDISCHARGE < 70 µs at VBAT ≥ 2.7 V
4
mA
90%
Ω
220
100
110
nF
LED DRIVER
VLED BUCK-BOOST
VLED
Output voltage range
1.2
Default output voltage
SW4, SW5, SW6 in OPEN position
VOVP
Output overvoltage protection
Clamps buck-boost output
VLED_OVP
Fault detection threshold
Triggers VLED_OVP interrupt
ISW
Switch current limit
RDS(ON)
MOSFET ON-resistance
fSW
Switching frequency
COUT
Output capacitance
5.4
3.5
5.5
7
5.4
3.5
4.0
Switch A (from VINL to L1)
50
Switch B (from L1 to PGNDL)
50
Switch C (from L2 to PGNDL)
50
Switch D (from L2 to VLED)
50
V
V
V
4.5
A
mΩ
2.25
MHz
2 × 22
µF
RGB STROBE CONTROLLER SWITCHES
RDS(ON)
Drain-source ON-resistance
SW4, SW5, SW6
ILEAK
OFF-state leakage current
VDS = 5 V
30
75
mΩ
1
µA
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
7
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted) (see (1)(2)(3))
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
4.55
V
LED CURRENT CONTROL
Vƒ
LED forward voltage
VIN ≥4.50 V, VLED ≤4.8 V; (closed loop
operation)
Covers USB power and 5 V AC adapter
Current at max. code 0x3CBh for
SWx_IDAC[9:0]
RLIM =39mΩ, 0.1%, TA ≤45°C (see register
settings)
LED Currents
ILED
DC current accuracy, SW4, 5, 6
Transient LED current limit range
trise
Current rise time
2200
2400
mA
VIN ≥ 2.7 V, VLED ≤4.8 V, (closed loop
operation)
Covers single cell Li-ion battery with high
current loading
Current at max. code 0x20Eh for
SWx_IDAC[9:0]
RLIM = 39 mΩ, 0.1%, TA=25 C (see register
settings)
1300
RLIM = 39 mΩ
±100
ILIM[3
:0] =
0000
ILIM[3
:0] =
1111
2600
mA
333
at RLIM = 39 mΩ
mA
3846
ILED from 5% to 95%, ILED = 300 mA,
Transient current limit disabled
Not tested in production
50
µs
6
V
1.1-V REGULATOR
VCORE (BUCK)
VIN
Input voltage
2.3
Nominal fixed output voltage
VOUT
DC output voltage accuracy
d
1.1
0 mA ≤ IOUT ≤ 600 mA at VIN > 2.5 V
VOUT = 1.1 V
–1.5%
1.5%
Maximum duty cycle
RDS(ON)
Low-side MOSFET on-resistance
High-side MOSFET on-resistance
IOUT
Output current
ILIMIT
Switch current limit
V
100%
VIN = 3.6 V, TJ = 27ºC
VIN > 2.3 V
Time to ramp from 10% to 90% of VOUT, VIN
= 3.6 V
185
380
mΩ
240
480
mΩ
300
600
mA
1
A
250
µs
tSS
Soft-start time
COUT
Output capacitance
10
µF
L
Nominal Inductance
2.2
µH
LOAD SWITCH
VIN
Input voltage range
LS_IN
RDS(ON)
P-channel MOSFET on-resistance
VIN = 1.8 V, over full temperature range
Output capacitor
Ceramic
4.7
ESR of output capacitor
Ceramic
5
COUT
1.8
3.6
V
340
385
mΩ
10
12
µF
20
500
mΩ
MEASUREMENT SYSTEM (AFE)
G
8
Amplifier gain (PGA)
AFE_GAIN[1:0] = 01
1.0
AFE_GAIN[1:0] = 10
9.5
AFE_GAIN[1:0] = 11
18
Submit Documentation Feedback
V/V
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted) (see (1)(2)(3))
PARAMETER
VOFS
tsettle
ƒsample
TEST CONDITIONS
PGA, AFE_CAL_DIS = 1
Not tested in production
Input referred offset voltage
Comparator
Not tested in production
Settling time
Sampling rate
MIN
TYP
MAX
–1
1
–1.5
1.5
UNIT
mV
To 1% of final value (not tested in
production)
15
To 0.1% of final value (not tested in
production)
52
Not tested in production
19
µs
kHz
LOGIC LEVELS AND TIMING CHARACTERISTICS
VOL
VOH
Output low-level
IO = 0.5-mA sink current
(RESETZ, CMP_OUT)
0
0.3
IO = 5-mA sink current
(SPI_DOUT, INTZ)
0
0.3 ×
VSPI
1.3
2.5
0.7 ×
VSPI
VSPI
IO = 0.5-mA source current
(RESETZ, CMP_OUT)
Output high-level
IO = 5-mA source current
(SPI_DOUT)
PROJ_ON, LED_SEL0, LED_SEL1
VIL
Input low-level
VIH
Input high-level
IBIAS
Input bias current
tDEGLITCH
Deglitch time
SPI_CSZ, SPI_CLK, SPI_DIN
PROJ_ON, LED_SEL0, LED_SEL1
SPI_CSZ, SPI_CLK, SPI_DIN
V
V
0
0.4
0
0.3 ×
VSPI
V
1.2
0.7 ×
VSPI
VSPI
VIO = 3.3 V, any input pin
0.5
PROJ_ON, (not tested in production)
LED_SEL0, LED_SEL1 pins (not tested in
production)
V
µA
1
ms
300
ns
INTERNAL OSCILLATOR
ƒOSC
Oscillator frequency
9
Frequency accuracy
TA = –30 to 85°C
–10%
MHz
10%
THERMAL SHUTDOWN
TWARN
TSHTDWN
Thermal warning (HOT threshold)
120
Hysteresis
10
Thermal shutdown (TSD threshold)
Hysteresis
150
15
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
°C
°C
9
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
6.6 Data Transmission Timing Requirements
VBAT = 3.6 ± 5%, TA = 25 ºC, CL = 10 pF (unless otherwise noted)
MIN
ƒCLK
Serial clock frequency
tCLKL
Pulse width low, SPI_CLK, 50% level
10
tCLKH
Pulse width high, SPI_CLK, 50% level
10
tt
Transition time, 20% to 80% level, all signals
0.2
tCSCR
SPI_CSZ falling to SPI_CLK rising, 50% level
tCFCS
SPI_CLK falling to SPI_CSZ rising, 50% level
tCDS
SPI_DIN data setup time, 50% level
tCDH
SPI_DIN data hold time, 50% level
tiS
SPI_DOUT data setup time (1)), 50% level
tiH
SPI_DOUT data hold time (1), 50% level
tCFDO
SPI_CLK falling to SPI_DOUT data valid, 50% level
tCSZ
SPI_CSZ rising to SPI_DOUT HiZ
(1)
TYP
0
MAX
UNIT
36
MHz
ns
ns
4
ns
8
ns
1
ns
7
ns
6
ns
10
ns
0
ns
13
ns
6
ns
The DLPC3430/DLPC3435 processors send and receive data on the falling edge of the clock.
SPI_CSZ
(SS)
tCSCR
tCLKL
tCLKH
tCFCS
SPI_CLK
(SCLK)
tCDS
tCDH
SPI_DIN
(MOSI)
tCFDO
SPI_DOUT
(MISO)
tiS
HiZ
tiH
tCSZ
HiZ
Figure 1. SPI Timing Diagram
10
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
6.7 Typical Characteristics
The maximum output current of the buck-boost is a function of input voltage (VIN), and output voltage (VLED).
The relationship between VIN, VLED, and MAX ILED is shown in Figure 2. Please note that VLED is the output
of the buck-boost regulator, which includes the voltage drop across the sense resistor RLIM (39 mOhms typical),
internal strobe control switch (75 mΩ max), and the forward voltage of the LED. For example, to drive 2.4 A of
current through a LED with Vƒ = 4.8 V using the DLPA2005, the minimum input voltage needs to be 4.5 V.
2.3 V < VLED < 4.8 V
Figure 2. Maximum LED Output Current as a Function of
Input Voltage (VIN) and Buck-Boost Output Voltage (VLED)
NOTE
Measured on a typical unit. VLED is the output of the buck-boost regulator and includes
the voltage drop across the sense resistor, internal strobe control switch, and the forward
voltage of the LED.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
11
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
7 Detailed Description
7.1 Overview
The DLPA2005 is a power management and LED driver IC optimized for DLP video and data display systems.
DLPA2005 is part of the chipset comprising of either DLP2010 (.2WVGA) DMD and DLPC3430/DLPC3435
controller, the DLP2010NIR (.2WVGA-NIR) DMD and DLPC150 controller, or the DLP3010 (.3 720p) DMD and
DLPC3433/DLPC3438 controller. The DLPA2005 contains a complete LED driver including high efficiency power
convertors. The DLPA2005 can supply up to 2.4 A per LED. Integrated high-current switches are included for
sequentially selecting R, G, and B LEDs. The DLPA2005 also contains three regulated DC supplies for the DMD
reset circuitry: VBIAS, VRST and VOFS, as well as a regulated DC supply of 1.1 V and a load switch for the 1.8
V to support the controllers. The DLPA2005 has a SPI used for setting the configuration. Using SPI, currents can
be set independently for each LED with 10-bit resolution. Other features included are the generation of the
system reset, power sequencing, input signals for sequentially selecting the active LED, IC self-protections, and
an analog MUX for routing analog information to an external ADC.
7.2 Functional Block Diagram
VINA
From system power
REFERENCE
SYSTEM
V2V5
LDO_V2V5
VREF
2.2µ
VLED
1µ
UVLO
VREF
VLED_OVP
V6V
LDO_V6V
100n
LOW_BAT
VINL
VREF
From system power
GND
A
SET_LOW_BAT_USB
B
AFE_GAIN [1:0]
AFE
PWM_IN
From host
CMP_OUT
To host
MUX
SENS1
SENS2
From light sensor
From temperature sensor
VLED
BUCK-BOOST
AFE_SEL[3:0]
C
VINA/3
VLED/3
SW4
SW5
SW6
RLIM_K
VREF
D
L1
1µ
PGNDL
2.2µ
L2
VLED
22µ
22µ
SW4
SW5
SW6
RGB
STROBE
DECODER
RLIM
VINR
From system power
10µ
SWN
VRST
RLIM_K
RLIM
E
SWP
220n
VINC
10µ
220n
VBIAS
VOFS
PGNDR
VBIAS
VOFS
From system power
H
CNTR_VRST
G
F
SWC
DMD
RESET
REGULATORS
VCORE
BUCK
2.2uH
Vout DCDC1 (0.9-1.2V @ 450mA)
10µF
GND
VCORE
220n
LS_IN
from any 1.8V-3.3V supply
LS_OUT
Load Switch
to system load
10PF
V2V5
PROJ_ON
LED_SEL0
LED_SEL1
From host
From host
From host
RESETZ
To system
0.1u
From host
From host
From host
From host
To host
12
VSPI
SPI_CSZ
SPI_CLK
SPI_DIN
SPI_DOUT
DIGITAL
CORE
INTZ
5k
VIO (depends on DPP requirements)
To DPP (optional)
SPI
GND
A.
Pin names refer to DLPA2005 pinout
B.
Pins connected to ‘system power’ can be locally decoupled with the capacity as indicated in the block diagram. At
least adequate decoupling capacity (50 μF or more) should be connected at the location the supply is entering the
board.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
7.3 Feature Description
7.3.1 DMD Regulators
DLPA2005 contains three switch-mode power supplies that power the DMD. These rails are VOFS, VBIAS, and
VRST. After pulling the PROJ_ON pin high, the DMD is first initialized followed by a power-up of the VOFS line
after a small delay of less than 10 ms followed by VBIAS and VRST with an additional delay of 145 ms. The LED
driver and STROBE DECODER circuit can only be enabled after all three rails are enabled. There are two
power-down sequences, the normal power-down timing initiated after pulling the PROJ_ON pin low, and a fast
power-down mode where if any one of the rails encounters a fault such as an output short, all three rails are
discharged simultaneously. The detailed power-up and power-down diagrams are shown in Figure 3 and
Figure 4.
5 ms (min)
System Power
(VINx)
10 ms
25 ms
PROJ_ON
DMD_EN
in register 0x01h
V2V5
Stop Regulating
VBIAS
VBIAS
Pad DMD_EN
by DPP through
SPI write
VOFS
VRST
10 ms
DMD
”10 ms
initialization
by DPP
•10 ms
Stop Regulating
VRST
145 ms
VCORE
LS_OUT (1.8 V)
VLED
INTZ
Startup DPP
RESETZ
STATE OFF
STANDBY
ACTIVE1
ACTIVE2
OFF
Figure 3. Power Sequence Normal Shutdown Mode
NOTE
All values are typical (unless otherwise noted).
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
13
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Feature Description (continued)
Fault Condition
5 ms (min)
System Power
(VINx)
PROJ_ON
DMD_EN
in register 0x01h
V2V5
Stop Regulating
VBIAS
VBIAS Delay
VBIAS
Pad DMD_EN
by DPP through
SPI write
VOFS
VOFS
Delay
VRST
10 ms
DMD
”10 ms
initialization
by DPP
•10 ms
VRST Delay
145 ms
Stop Regulating
VRST
VCORE
LS_OUT (1.8V)
VLED
INTZ
Startup DPP
RESETZ
RESETZ Delay
STATE OFF
(1)
STANDBY
ACTIVE1
ACTIVE2
STANDBY
If the FAULT condition happens and its associated interrupt is masked in the Interrupt Mask Register (0Dh), the INTZ
does not go low, but all other timing shown in the diagram is unaffected.
Figure 4. Power Sequence Fault Shutdown Mode
NOTE
All values are typical (unless otherwise noted).
7.3.2 RGB Strobe Decoder
DLPA2005 contains RGB color-sequential circuitry that is composed of three NMOS switches, the LED driver,
the strobe decoder, and the LED current control. The NMOS switches are connected to the terminals of the
external LED package and turn the currents through the LEDs on and off. Package connections are shown in
Figure 5 and Figure 9 and corresponding switch map in Table 1.
The LED_SEL[1:0] signals typically receive a rotating code switching from RED to GREEN to BLUE and then
back to RED. When the LED_SEL[1:0] input signals select a specific color, the NMOSFETs are controlled based
on the color selected, and a 10-bit current control DAC for this color is selected that provides a control current to
the RGB LEDs feedback control network.
14
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Feature Description (continued)
VLED
SW4
R
G
B
SW5
SW6
SW4
SW5
SW6
RLIM
RLIM_K
RLIM
RBOT_K
Figure 5. Switch Connection for a Common-Anode LED Assembly
Table 1. Switch Positions for Common Anode RGB LEDs (MAP = 0)
Common Anode
LED_SEL[1:0]
SW6
SW5
SW4
0x00h
Open
Open
Open
IDAC Input
N/A
0x01h
Open
Open
Closed
SW4_IDAC[9:0]
0x02h
Open
Closed
Open
SW5_IDAC[9:0]
0x03h
Closed
Open
Open
SW6_IDAC[9:0]
The switching of the three NMOS switches is controlled such that switches are returned to the open position first
before the closed connections are made (break before make). The dead time between opening and closing
switches is controlled through the BBM register. Switches that already are in the closed position (and are to
remain in the closed state according to the SWCNTRL register) are not opened during the BBM delay time.
I-LED
BBM dead time
SW6
SW4
SW5
SW6
SW4
TIME
Figure 6. BBM Timing (See Register 0Bh in Table 20)
7.3.3 LED Current Control
DLPA2005 provides time-sequential circuitry to drive three LEDs with independent current control. A system
based on a common anode LED configuration is shown in Figure 9 and consists of a buck-boost converter,
which provides the voltage to drive the LEDs, three switches connected to the cathodes of the LEDs, an RLIM
resistor used to sense the LED current, and a current DAC to control the LED current. The voltage measured at
the pin V(RLIM_K) is used by the regulator loop.
The STROBE DECODER controls the switch positions as described in the previous section (RGB Strobe
Decoder ). With all switches in the open position, the buck-boost output assumes an output voltage of 3.5 V.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
15
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
For a common-anode RGB LED configuration, the buck-boost output voltage (VLED) assumes a value such that
the voltage drop across the sense resistor equals
SPACE
(SW4_IDAC[9:0]Ivalue + ILED) × RLIM
(1)
SPACE
when SW4 is closed. The exact value of VLED depends on the current setting and the voltage drop across the
LED but is limited to 5.4 V. When the STROBE decoder switches from SW4 to SW5, the buck-boost assumes a
new output voltage such that the sense voltage equals:
SPACE
(SW5_IDAC[9:0]Ivalue + ILED) × RLIM
(2)
SPACE
and finally when SW6 is selected.
SPACE
(SW6_IDAC[9:0]Ivalue + ILED) × RLIM
(3)
SPACE
7.3.4 Maximum Led Currents and Efficiency Considerations
The DLPA2005 comprises a buck-boost power converter to supply the appropriate VLED to the LEDs. The
maximum obtainable LED current for a given LED forward voltage are limited by three items:
• The inherent maximum LED current of the PAD2005, i.e. for DAC setting 03FFh.
• The maximum input current of about 4 A.
• The converter efficiency.
• Junction and ambient temperature
In the Figure 2 graph the LED current versus DAC setting is given for several supply voltages (VIN). The load
was configured for each supply case such that at the maximum attainable current VOUT max=4.8 V.
For the higher supply voltages VIN>4.5 V the DAC current increases linearly up to the max setting of 3FFh. At
that setting the ILED is about 2.5 A. For VIN=2.3 V and VIN=2.7 V the LED current is typically limited to 0.9 A
and 1.3 A, respectively. Main reason of this limitation is the maximum input current in combination with the
limited converter efficiency. This can be understood by looking at the equation describing the power conversion:
SPACE
VOUT ˜ I OUT
Keff ˜VIN ˜ I IN
This equation states that the output power of the converter is equal to the input power times the converter
efficiency. As indicated above, the input current IIN of the power converter is maximized to about 4A. The neff is
the efficiency of the power converter, as described further down this section. For the lower input voltage the
power converter runs as a boost converter.
(VOUT=4.8 V). Assuming 100% efficiency, VIN=2.3 V, VOUT=4.8 V and IINmax=4 A, the maximum attainable
ILED is:
I LED
Keff ˜VIN ˜ I IN
VOUT
1˜ 2.3V ˜ 4 A
1.9 A
4.8V
For the power converter approaching the maximum input current, the efficiency can roll down significantly. As a
result the maximum LED current for VIN=2.3 V and VOUT=4.8 V is about 0.9 A.
The efficiency of the power converter depends on the input supply voltage and the output loading, i.e. output
voltage and output current. In the below graph efficiency curves as a function of the LED current are given for
several input supply voltages. Again for each of these supply cases the load was controlled such that at
maximum output current the output voltage was about 4.8 V.
16
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Figure 7. Measured Typical Power converter efficiency as a function of ILED for several supply voltages
(VOUTmax=4.8V for each supply)
Note that in the measurement the output of the buck-boost regulator includes the voltage drop across the sense
resistor RLIM, the voltage drop across the internal strobe control switch, and the forward voltage of the LED.
For higher input voltages the power converter runs at an efficiency of 85% or better. For the lower supply
voltages because of the boost action, the efficiency quickly rolls down. Refer to section Thermal Considerations
for information related to these efficiencies.
7.3.5 Calculating Inductor Peak Current
To properly configure the DLPA2005 device, a 2.2-μH inductor must be connected between pin L1 and pin L2.
The peak current for the inductor in steady state operation can be calculated.
Equation 4 shows how to calculate the peak current I1 in step down mode operation, and Equation 5 shows how
to calculate the peak current I2 in boost mode operation. VIN1 is the maximum input voltage, VIN2 is the minimum
input voltage, ƒ is the switching frequency (2.25 MHz), and L the inductor value (2.2 μH).
V
V VOUT
I
I1 OUT OUT IN1
0.8
2 u VIN1 u f u L
(4)
I2
VOUT u IOUT VIN2 VOUT VIN2
0.8 u VIN2
2 u VOUT u f u L
(5)
The critical current value for selecting the right inductor is the higher value of I1 and I2. Also consider that load
transients and error conditions may cause higher inductor currents. This needs to be accounted for when
selecting an appropriate inductor. Internally the switching current is limited to a maximum of 4 A.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
17
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
7.3.6 LED Current Accuracy
The LED drive current is controlled by a current DAC (Digital to Analog Converter) and can be set independently
for switch SW4, SW5 and SW6. For the DLPA2005, the DAC is trimmed at a current of 2528 mA at code:
0x3FFh, and the step size is 2.47 mA. First order gain-error of the DAC can be neglected, but an offset current
error must be taken into account. This offset error differs depending on the used RLIM, and is ±100 mA for the
DLPA2005 using a current sense resistor of 39 mΩ.
The max current of the DLPA2005 (SWx_IDAC[9:0] = 0x3FFh) is regulated to 2528 mA. At the lowest setting
(SWx_IDAC[9:0] = 0x029h) the current is regulated to 101 mA (DLPA2005). For this current setting (0x028h), the
absolute current error results into a large relative error, however this is not a typical operating point.
For best accuracy of the LED current, take the below two considerations into account:
• The LED current setting does not only depend on the accuracy of the RLIM resistor but also strongly depends
on the added resistance of pcb traces in the ground route of RLIM and the soldering quality. Due to the low
value of the current sense resistor RLIM, any extra introduced resistance of e.g. several milliohms will result
in a noticeable different LED current.
• Voltage sensing across RLIM is internally referred to the analog ground, i.e. pin 5 AGND1 and pin 20 GND.
To prevent any voltage drop between the ground connection of RLIM and the AGND of the PAD2005, make a
star connection of the RLIM ground near pin 5. Take care to make it a low ohmic route that can handle the
high LED current. Subsequently, make the ground connection for pin 5 to the system ground low ohmic as
well.
Taking the above measures relative to RLIM, the ILED current should align with the calculated value according
to:
• Decimal_Code# = (set_current - min_current)/ step_current.
• If needed translate the Decimal_Code# to HEX code before entering in the control software.
7.3.7 Transient Current Limiting
Typically the forward voltages of the green and blue diodes are close to each other (about 3 to 4 V). However,
the forward voltage of the red diode is significantly lower (1.8 to 2.5 V). This can lead to a current spike in the red
diode when the strobe controller switches from green or blue to red because VLED is initially at a higher voltage
than required to drive the RED diode. DLPA2005 provides transient current limiting for each switch to limit the
current in the LEDs during the transition. The transient current limit value is controlled through the ILIM[3:0] bits
in the IREG register. The same register also contains three bits to select which switch employs the transient
current limiting feature. In a typical application, the transient current limit will only apply to the RED diode, and
the ILIM[3:0] value will typically be set approximately 10% higher than the DC regulation current. The effect that
the transient current limit has on the LED current is shown in Figure 8.
18
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
1500
1200
Current overshoot due to
initially too high buck-boost
output voltage
900
600
300
RED LED CURRENT (mA)
RED LED CURRENT (mA)
1500
1200
900
Transient current
limit active
600
300
0
0
TIME
TIME
Red LED current without transient current limit. The
current overshoots because the buck-boost voltage
starts at the (higher) level of the green or blue LED.
LED current with transient current limit.
Figure 8. RED LED Current With and Without Transient Current Limit
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
19
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
FB
VLED
BUCK-BOOST
VLED
SW4LIM_EN
SW4
I-LED
0
ILIM [3:0]
VDAC
E/ A
1
SW5LIM_EN
SW5
I-LED
0
E/ A
1
SW6LIM_EN
SW6
I-LED
0
LED_SEL [1:0]
MAP
STROBE
DECODER
RLIM
E/ A
1
SW4_IDAQ [9:0]
SW5_IDAQ [9:0]
RLIM_K
IDAC
200
SW6_IDAQ [9:0]
I-DAC
RLIM
Figure 9. LED Driver Block Diagram
7.3.8 1.1-V Regulator (Buck Converter)
The buck converter creates a voltage of 1.1 V, and due to its switching nature, an output ripple with a frequency
of approximately 2.25 MHz occurs on its output. This ripple is strongly dependent on the decoupling capacitor at
the output in combination with the inductor. The magnitude of the ripple can be calculated with Equation 6.
V
1 CORE
§
·
VINC
1
'VCORE VCORE u
u¨
ESR ¸
Luf
© 8 u COUT u f
¹
(6)
The best way to minimize this ripple is to select a capacitor with a very-low ESR.
20
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
7.3.9 Measurement System
The measurement system is composed of a 10:1 analog multiplexer (MUX), a programmable-gain amplifier, and
a comparator. It works together with the DPP processor to provide:
• White-point correction (WPC) by independently adjusting the RGB LED currents after measuring the
brightness of each color with an external light sensor
• A measurement of the:
– Battery voltage
– LED forward voltage
– Exact LED current
– Temperature as derived by measuring the voltage across an external thermistor
Figure 10 shows a block diagram of the measurement system.
AFE_GAIN [1:0]
From host
AFE_SEL[3:0]
AFE
PWM_IN
VINA/3
VLED/3
SW4
SW5
CMP_OUT
MUX
To host
From light sensor
SENS1
SENS2
From temperature sensor
Figure 10. Block Diagram of the Measurement System
Table 2. Recommended Configuration of the AFE for Different Input Selections
AFE_SEL[3:0]
SELECTED INPUT
RECOMMENDED GAIN SETTING
AFE-GAIN[1:0]
RECOMMENDED SETTING OF
AFE_CAL_DIS BIT
0x00h
SENS2
0x01h (1x)
Setting has no effect on measurement
0x01h
VLED
0x01h (1x)
Setting has no effect on measurement
0x02h
VINA
0x01h (1x)
Setting has no effect on measurement
0x03h
SENS1
0x01h (1x)
Setting has no effect on measurement
0x04h
RLIM_K
0x03h (18x)
Set to 1 if sense voltage is >100 mV.
Otherwise set to 0 (default)
0x05h
SW4
0x02h (9.5x)
Set to 1 if sense voltage is >200 mV.
Otherwise set to 0 (default)
0x06h
SW5
0x02h (9.5x)
Set to 1 if sense voltage is >200 mV.
Otherwise set to 0 (default)
0x07h
SW6
0x02h (9.5x)
Set to 1 if sense voltage is >200 mV.
Otherwise set to 0 (default)
0x08h
No connect
N/A
0x09h
VREF
0x01h (1x)
N/A
Setting has no effect on measurement
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
21
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
7.3.10 Protection Circuits
DLPA2005 has several protection circuits to protect the IC and system from damage due to excessive power
consumption, die temperature, or over-voltages. These circuits are described in the following sections.
7.3.10.1 Thermal Warning (HOT) and Thermal Shutdown (TSD)
DLPA2005 continuously monitors the junction temperature and issues a HOT interrupt if temperature exceeds
the HOT threshold. If the temperature continues to increase above the thermal shutdown threshold, all rails are
disabled and the TSD bit in the INT register is set. After the temperature drops below its threshold, the system
recovers and waits for the DPP to resend the DMD_EN bit.
Thermal Shutdown
Threshold
Thermal warning
Threshold
Hysteresis
Hysteresis
Temperature
HOT
(Internal Signal)
TSD
(Internal Signal)
Available Time for Controlled
Shutdown of System
Figure 11. Definition of the Thermal Shutdown and Hot-Die Temperature Warning
7.3.10.2 Low Battery Warning (BAT_LOW) and Undervoltage Lockout (UVLO)
If the battery voltage drops below the BAT_LOW threshold (typically 3 V) the BAT_LOW interrupt is issued, but
normal operation continues. After the battery drops below the undervoltage threshold which has a default
hardcoded value of 2.3 V (this UVLO voltage can be changed through register 09 h from 2.3 to 4.5 V), the UVLO
interrupt is issued, all rails are powered down in sequence, the DMD_EN bit is reset, and the part enters
STANDBY mode. The power rails cannot be re-enabled before the input voltage recovers to >2.4 V. To re-enable
the rails, the PROJ_ON pin must be toggled. The undervoltage threshold is programmable from 2.3 to 4.5 V in
31 steps.
The UVLO shutdown process will protect the DMD by allowing time for the mirrors to park, then doing a fast
discharge of VOFS, VRST, and VBIAS. This protection occurs even in the case of sudden battery removal from
the projector, as long as the bulk capacitance on the battery voltage (VINx) keeps this voltage above 2.3 V for as
long as needed for VOFS, VRST, and VBIAS to discharge to the required safe levels as shown in the DMD data
sheet. VOFS, VRST, and VBIAS discharge times depend on the load capacitance on each regulator. When for
instance every supply is decoupled using a capacitor of 0.5 µF, VINx should stay above 2.3 V for at least 100 µs
after the battery is suddenly removed. During this time, the mirrors can be placed in a safe position and VOFS,
VRST, and VBIAS can be discharged.
NOTE
Capacitive loads should be such that LS_OUT stays above 1.65 V until VOFS, VRST, and
VBIAS have discharged to their required safe levels.
22
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
VINA
Hysteresis
BAT_LOW Threshold
Hysteresis
UVLO Threshold
ACTIVE
BAT LOW
(Internal Signal)
UVLO
(Internal Signal)
INACTIVE
ACTIVE
200-µs
deglitch
INACTIVE
Programmable Deglitch Time1
(1)
This time is programmable from 0 to 100 µs
Figure 12. UVLO is Asserted When the Input Supply Drops Below the UVLO Threshold
7.3.10.3 DMD Regulator Fault (DMD_FLT)
The DMD regulator is continuously monitored to check if the output rails are in regulation and if the inductor
current increases as expected during a switching cycle. If either one of the output rails drops out of regulation (for
example, due to a shorted output) or the inductor current does not increase as expected during a switching cycle
(due to a disconnected inductor), the DMD_FLT interrupt bit is set in the INT register, the DMD_EN bit is reset,
and the DMD regulator is shut down. Resetting the DMD_EN bit also causes the LED driver to power down. To
restart the system, the PROJ_ON pin must be toggled. In case the interrupt is masked, it is sufficient to set the
DMD_EN bit to restart the system.
7.3.10.4 V6V Power-Good (V6V_PGF) Fault
The LED driver regulation loop requires the V6V rail for proper operation. The rail is continuously monitored and
should the output drop below the power-good threshold, the V6V_PGF bit is set. The VLED buck-boost is then
disabled and attempts to restart automatically.
7.3.10.5 VLED Overvoltage (VLED_OVP) Fault
If the buck-boost output voltage rises above 5.4 V, the VLED_OVP interrupt is set but the buck-boost regulator is
not turned off. A typical condition to cause this fault is an open LED.
7.3.10.6 VLED Power Save Mode
In normal PWM operation, the efficiency of the VLED buck-boost converter dramatically reduces for LED currents
below 100 mA. In this case, the power save mode allows high converting efficiency at low output currents by
skipping pulses in the switcher’s gate driver control.
7.3.10.7 V1V8 PG Failure
If for any reason the voltage on the LS_OUT drops below approximately 1.3 V, then VOFS, VBIAS, and VRST
immediately go into fast shut down. Holding off power down to do mirror parking is not included since 1.3 V is too
low to wait for this. Reactivating can only be done by toggling the PROJ_ON off and on again.
7.3.10.8 Interrupt Pin (INTZ)
Use the interrupt pin to signal events and fault conditions to the host processor. Whenever a fault or event occurs
in the IC, the corresponding interrupt bit is set in the INT register, and the open-drain output is pulled low. The
INTZ pin is released (returns to HiZ state) and fault bits are cleared when the INT register is read by the host.
However, if a failure persists, the corresponding INT bit remains set and the INTZ pin is pulled low again after a
maximum of 32 µs.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
23
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Interrupt events include fault conditions such as power-good faults, over-voltage, over-temperature shutdown,
and UVLO. For all interrupt conditions see the interrupt register on Table 22.
The MASK register is used to mask events from generating interrupts, that is, from pulling the INTZ pin low. The
MASK settings affect the INTZ pin only and have no impact on protection and monitor circuits themselves. When
an interrupt is masked, the event causing the interrupt still sets the corresponding bit in the INT register.
However, it does not pull the INTZ pin low.
7.3.10.9 SPI
DLPA2005 provides a 4-wire SPI port that supports high-speed serial data transfers up to 33.3 MHz. Support
includes register and data buffer write and read operations. The SPI_CSZ input serves as the active low chip
select for the SPI port. The SPI_CSZ input must be forced low in order to write or read registers and data
buffers. When SPI_CSZ is forced high, the data at the SPI_DIN input is ignored, and the SPI_DOUT output is
forced to a high-impedance state. The SPI_DIN input serves as the serial data input for the port; the SPI_DOUT
output serves as the serial data output. The SPI_CLK input serves as the serial data clock for both the input and
output data. Data is latched at the SPI_DIN input on the rising edge of SPI_CLK, while data is clocked out of the
SPI_DOUT output on the falling edge of SPI_CLK. Figure 13 illustrates the SPI port protocol. Byte 0 is referred to
as the command byte, where the most significant bit is the write/not read bit. For the W/nR bit, a 1 indicates a
write operation, while a 0 indicates a read operation. The remaining seven bits of the command byte are the
register address targeted by the write or read operation. The SPI port supports write and read operations for
multiple sequential register addresses through the implementation of an auto-increment mode. As shown in
Figure 13, the auto-increment mode is invoked by simply holding the SPI_CSZ input low for multiple data bytes.
The register address is automatically incremented after each data byte transferred, starting with the address
specified by the command byte. After reaching address 0x7Fh the address pointer jumps back to 0x00h.
Set SPI_CSZ = 1 here to write/read one register location
Hold SPI_CSZ = 0 to enable auto-increment mode
SPI_CSZ
Header
SPI_DIN
Byte0
Register Data (write)
Byte1
Byte2
Byte3
ByteN
Register Data (read)
SPI_DOUT
Data for A[6:0]
Data for A[6:0] + 1
Data for A[6:0] + (N – 2)
SPI_CLK
Byte 0
SPI_DIN
W/nR
Byte 1
A6 A5 A4 A3 A2 A1 A0 N7 N6 N5 N4 N3 N2 N1 N0
W/nR
Set high for write, low for read
Register Address
SPI_CLK
Figure 13. SPI Protocol
7.3.11 Password Protected Registers
Register addresses 0x11h through 0x27h can be read-accessed the same way as any other register, but are
protected against accidental write operations through the PASSWORD register (address 0x10h). To write to a
protected register, follow these steps:
1. Write data 0xBAh to register address 0x10h.
2. Write data 0xBEh to register address 0x10h.
Both writes must be consecutive, that is, there must be no other read or write operation in between sending the
two bytes. After the password has been successfully written, registers 0x11h through 0x27h are unlocked and
can be write accessed using the regular SPI protocol. They remain unlocked until any byte other than 0xBAh is
written to the PASSWORD register or the part is power cycled.
To check if the registers are unlocked, read back the PASSWORD register. If the data returned is 0x00h, the
registers are locked. If the PASSWORD register returns 0x01h, the registers are unlocked.
24
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
7.4 Device Functional Modes
MODES OF OPERATION
OFF
This is the lowest-power mode of operation. All power functions are turned off, registers are reset to
their default values and the IC does not respond to SPI commands. RESETZ pin is pulled low. The
IC will enter OFF mode whenever the PROJ_ON pin is low.
STANDBY
The DMD regulators and LED power (VLED) are turned off, but the IC does respond to the SPI
interface. The device enters STANDBY mode whenever PROJ_ON is set high or DMD_EN7 bit is
set to 0 using the SPI interface after PROJ_ON is already high. The device also enters STANDBY
mode when a fault condition is detected8. (see the section about Protection Circuits on pages 28 &
30)
ACTIVE1
The DMD supplies are enabled but LED power (VLED) is disabled. PROJ_ON pin must be high,
DMD_EN bit must be set to 1, and VLED_EN9 bit is set to 0.
ACTIVE2
DMD supplies and LED power are enabled. PROJ_ON pin must be high and DMD_EN and
VLED_EN bits must both be set to 1.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
25
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Device Functional Modes (continued)
POWERDOWN
Valid power source connected
PROJ_ON = low
OFF
PROJ_ON = low
VRST = OFF
VBIAS = OFF
VOFS = OFF
VLED = OFF
SPI interface disabled
PWR_EN = low
RESETZ = low
All registers set to default values
PROJ_ON = high
DMD_EN = 0
|| FAULT = 1
STANDBY
VRST = OFF
VBIAS = OFF
VOFS = OFF
VLED = OFF
SPI interface enabled
PWR_EN = high
RESETZ = high (but is low if entered
state due to UVLO detection)
DMD_EN = 1
& FAULT = 0
VRST = ON
VBIAS = ON
VOFS = ON
VLED = OFF
SPI interface enabled
PWR_EN = high
RESETZ = high
ACTIVE 1
VLED_EN = 1
VLED_EN = 0
VRST = ON
VBIAS = ON
VOFS = ON
VLED = ON
SPI interface enabled
PWR_EN = high
RESETZ = high
ACTIVE 2
A.
|| = OR , & = AND
B.
FAULT = Undervoltage on any supply (except LS_OUT), thermal shutdown, or UVLO detection
C.
UVLO detection, per the diagram, causes the DLPA2005 to go into the standby state. This is not the lowest power
state. If lower power is desired, PROJ_ON should be set low.
D.
DMD_EN register bit can be reset or set by SPI writes. DMD_EN defaults to 0 when PROJ_ON goes from low to high
and then the DPP ASIC software automatically sets it to 1. Also, FAULT = 1 causes the DMD_EN register bit to be
reset.
E.
PWR_EN is a signal internal to the DLPA2005. This signal turns on the VCORE regulator and the load switch that
drives pin LS_OUT
Figure 14. State Diagram
26
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 3. Device State as a Function of Control-Pin
Status
PROJ_ON PIN
STATE
LOW
OFF
HIGH
STANDBY
ACTIVE1
ACTIVE2
(Device state depends on
DMD_EN and VLED_EN bits
and whether there are any
fault conditions.)
Table 4. Modes of Operation
MODE
DESCRIPTION
OFF
This is the lowest-power mode of operation. All power functions are turned off, registers are reset to their default values, and
the IC does not respond to SPI commands. RESETZ pin is pulled low. The IC will enter OFF mode whenever the PROJ_ON
pin is low.
STANDBY
The DMD regulators and LED power (VLED) are turned off, but the IC does respond to the SPI. The device enters STANDBY
mode whenever PROJ_ON is set high or DMD_EN (1) bit is set to 0 using the SPI interface after PROJ_ON is already high.
The device also enters STANDBY mode when a fault condition is detected (2). (See Protection Circuits .)
ACTIVE1
The DMD supplies are enabled but LED power (VLED) is disabled. PROJ_ON pin must be high, DMD_EN bit must be set to
1, and VLED_EN (3) bit is set to 0.
ACTIVE2
DMD supplies and LED power are enabled. PROJ_ON pin must be high and DMD_EN and VLED_EN bits must both be set
to 1.
(1)
(2)
(3)
Settings can be done through Reg01h [9] and Reg2E [119]
Power-good faults, over-voltage, overtemperature shutdown, and undervoltage lockout
Settings can be done through Reg47h [60], bit is named VLED_EN_SET
7.5 Register Maps
Table 5. Register Description
REGISTE
R
ADDRESS
(Hex)
NAME
TABLE
DESCRIPTION
DEFAULT
USER CONFIGURATION DEFINITIONS
R
0x00
CHIP ID
Table 6
Chip Revision Register; DLPA2005
C4
R/W
0x01
CHIPENABLE
Table 7
Enable Register
0F
R/W
0x02
IREG
Table 8
Transient-current limit settings
30
R/W
0x03
SW4MSB
Table 9
Regulation current MSB, SW4
0
R/W
0x04
SW4LSB
Table 10, Table 11
Regulation current LSB, SW4
0
R/W
0x05
SW5MSB
Table 12
Regulation current MSB, SW5
0
R/W
0x06
SW5LSB
Table 13, Table 14
Regulation current LSB, SW5
0
R/W
0x07
SW6MSB
Table 15
Regulation current MSB, SW6
0
R/W
0x08
SW6LSB
Table 16, Table 17
Regulation current LSB, SW6
0
R/W
0x09
SWCNTRL
Table 18
Switch ON/OFF control (direct mode)
0
R/W
0x0A
AFE
Table 19
AFE (MUX) control
0
R/W
0x0B
BBM
Table 20, Table 21
Break Before Make timing
0
R
0x0C
INT
Table 22, Table 23
Interrupt register
R/W
0x0D
INT MASK
Table 24, Table 25
Interrupt Mask register
0
R/W
0x0E
TIMING
Table 26, Table 27
Timing register VOFS, VBIAS, VRST, and RESETZ
7
DFh
USER PROTECTED DEFINITION
R/W
0x10
PASSWORD
Table 28
Password register
0
R/W
0x11
SYSTEM
Table 29
System Configuration register
0
User EEPROM, Byte0
0
USER EEPROM SCRATCH PAD DEFINITION
R/W
0x20
BYTE0
Table 31
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
27
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Register Maps (continued)
Table 5. Register Description (continued)
REGISTE
R
ADDRESS
(Hex)
R/W
0x21
BYTE1
Table 32
User EEPROM, Byte1
0
R/W
0x22
BYTE2
Table 33
User EEPROM, Byte2
0
R/W
0x23
BYTE3
Table 34
User EEPROM, Byte3
0
R/W
0x24
BYTE4
Table 35
User EEPROM, Byte4
0
R/W
0x25
BYTE5
Table 36
User EEPROM, Byte5
0
R/W
0x26
BYTE6
Table 37
User EEPROM, Byte6
0
R/W
0x27
BYTE7
Table 38
User EEPROM, Byte7
0
NAME
TABLE
DEFAULT
DESCRIPTION
Table 6. Chip Revision Register
REGISTER = 00h
DATA BIT
D7
D6
D5
FIELD NAME
D4
D3
D2
D1
D0
HEX
CHIP ID [7:0]
READ/WRITE
R
R
R
R
R
R
R
R
RESET VALUE
DLPA2005
1
1
0
0
0
1
0
0
FIELD NAME
BIT
CHIP ID
[7:0]
C4
BIT DEFINITION
7:4
CHIPID<3:0>
3:0
REVID<3:0>
Table 7. Enable Register
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
15:12
11
CHIPENABLE
[15:8]
10
9
8
28
REGISTER = 01h
D4
D3
D2
D1
D0
CHIPENABLE [15:8]
R/W
R/W
R/W
R/W
R/W
0
1
1
1
1
BIT DEFINITION
USER_GPO<3:0>
VLED_POWER_SAVE_MODE_DIS
Power save mode is used to improve efficiency at light load.
FAST_SHUTDOWN_EN
Applicable only during a fault condition.
Shutdown timing is defined by register 0Eh. (see Figure 5)
DMD_EN
VLED_EN
Submit Documentation Feedback
HEX
0F
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 8. Transient-Current Limit Settings
DATA BIT
Field Name
Read/Write
Reset Value
FIELD NAME
Not used
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
1
REGISTER = 02h
D4
D3
D2
IREG [23:16]
R/W
R/W
R/W
1
0
0
BIT DEFINITION
TBD
IREG_ILIM<3:0>
Rlim = 39 mΩ
0000
333 mA
0001
385 mA
0010
442 mA
0011
494 mA
0100
564 mA
0101
705 mA
0110
846 mA
0111
1128 mA
1000
1410 mA
1001
1692 mA
1010
1974 mA
1011
2256 mA
1100
2538 mA
1101
2974 mA
1110
3410 mA
1111
3846 mA
SW6LIM_EN
Transient current-limit enable for SW6
0 – Transient current-limit is disabled
1 – Transient current-limit is enabled
SW5LIM_EN
Transient current-limit enable for SW5
0 – Transient current-limit is disabled
1 – Transient current-limit is enabled
SW4LIM_EN
Transient current-limit enable for SW4
0 – Transient current-limit is disabled
1 – Transient current-limit is enabled
23
IREG [3:0]
22:19
[23:16]
SW6LIM_EN
18
SW5LIM_EN
17
SW4LIM_EN
16
D1
D0
HEX
R/W
0
R/W
0
30
D1
D0
HEX
R/W
0
R/W
0
00
Table 9. Regulation Current MSB, SW4 (1)
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
Bit
R/W
0
R/W
0
SW4MSB
[31:24]
(1)
31:26
25:24
REGISTER = 03h
D4
D3
D2
SW4MSB [31:24]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
TBD
SW4_IDAC<9:8>
The DLPA2005 can use up to code 0x3ffh for SW4_IDAC[9:0].
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
29
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Table 10. Regulation Current LSB, SW4
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
SW4LSB
D7
D6
D5
R/W
0
Bit
[39:32]
R/W
0
R/W
0
39:32
REGISTER = 04h
D4
D3
D2
SW4LSB [39:32]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
SW4_IDAC<7:0>
D1
D0
HEX
R/W
0
R/W
0
00
Table 11. Regulation Current LSB, SW4 Bit Definitions
DLPA2005
(1) (2)
SW4_IDAC[9:0]
LED
CURRENT
SW4_IDAC[9:0]
LED
CURRENT
SW4_IDAC[9:0]
LED
CURRENT
0x000h
0 mA
0x100h
633 mA
0x200h
1265 mA
0x300h
1898 mA
0x029h
101 mA
0x101h
635 mA
0x201h
1268 mA
0x301h
1900 mA
0x02Ah
104 mA
0x102h
638 mA
0x202h
1270 mA
0x302h
1903 mA
...
...
...
...
...
...
...
...
0x0FEh
628 mA
0x1FEh
1260 mA
0x2FEh
1893 mA
0x3FEh
2526 mA
0x0FFh
630 mA
0x1FFh
1263 mA
0x2FFh
1895 mA
0x3FFh
2528 mA
(1)
(2)
SW4_IDAC[9:0]
LED CURRENT
Values shown are for a typical DLPA2005 unit at T = 25°C. Typical step size is 2.47 mA for RLIM = 39 mΩ
The DLPA2005 can use up to code 0x3FFh for SW4_IDAC[9:0].
Table 12. Regulation Current MSB, SW5 (1)
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
Bit
R/W
0
R/W
0
SW5MSB
[47:40]
(1)
47:42
41:40
REGISTER = 05h
D4
D3
D2
SW5MSB [47:40]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
TBD
SW5_IDAC<9:8>
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
The DLPA2005 can use up to code 0x3FFh for SW5_IDAC[9:0].
Table 13. Regulation Current LSB, SW5
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
SW5LSB
30
D7
D6
D5
R/W
0
BIT
[55:48]
R/W
0
R/W
0
55:48
REGISTER = 06h
D4
D3
D2
SW5LSB [55:48]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
SW5_IDAC<7:0>
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 14. Regulation Current LSB, SW5 Bit Definitions
DLPA2005
(1) (2)
SW5_IDAC[9:0]
LED
CURRENT
SW5_IDAC[9:0]
LED
CURRENT
SW5_IDAC[9:0]
LED
CURRENT
SW5_IDAC[9:0]
LED CURRENT
0x000h
0 mA
0x100h
633 mA
0x200h
1265 mA
0x300h
1898 mA
0x029Ch
101 mA
0x101h
635 mA
0x201h
1268 mA
0x301h
1900 mA
0x02Ah
104 mA
0x102h
638 mA
0x202h
1270 mA
0x302h
1903 mA
...
...
...
...
...
...
...
...
0x0FEh
628 mA
0x1FEh
1260 mA
0x2FEh
1893 mA
0x3FEh
2526 mA
0x0FFh
630 mA
0x1FFh
1263 mA
0x2FFh
1895 mA
0x3FFh
2528 mA
(1)
(2)
Values shown are for a typical DLPA2005 unit at T = 25°C. Typical step size is 2.47 mA for RLIM = 39 mΩ
The DLPA2005 can use up to code 0x3FFh for SW5_IDAC[9:0].
Table 15. Regulation Current MSB, SW6 (1)
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
SW6MSB
[63:56]
(1)
63:58
57:56
REGISTER = 07h
D4
D3
D2
SW6MSB [63:56]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
TBD
SW6_IDAC<9:8>
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
The DLPA2005 can use up to code 0x3FFh for SW6_IDAC[9:0].
Table 16. Regulation Current LSB, SW6
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
SW6LSB
D7
D6
D5
R/W
0
BIT
[71:64]
R/W
0
R/W
0
71:64
REGISTER = 08h
D4
D3
D2
SW6LSB [71:64]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
SW6_IDAC<7:0>
Table 17. Regulation Current LSB, SW6 Bit Definitions
DLPA2005
(1) (2)
SW6_IDAC[9:0]
LED
CURRENT
SW6_IDAC[9:0]
LED
CURRENT
SW6_IDAC[9:0]
LED
CURRENT
SW6_IDAC[9:0]
LED CURRENT
0x000h
0 mA
0x100h
633 mA
0x200h
1265 mA
0x300h
1898 mA
0x029h
101 mA
0x101h
635 mA
0x201h
1268 mA
0x301h
1900 mA
0x02Ah
104 mA
0x102h
638 mA
0x202h
1270 mA
0x302h
1903 mA
...
...
...
...
...
...
...
...
0x0FEh
628 mA
0x1 FEh
1260 mA
0x2FEh
1893 mA
0x3FEh
2526 mA
0x0FFh
630 mA
0x1 FFh
1263 mA
0x2FFh
1895 mA
0x3FFh
2528 mA
(1)
(2)
Values shown are for a typical DLPA2005 unit at T = 25°C. Typical step size is 2.47 mA for RLIM = 39 mΩ
The DLPA2005 can use up to code 0x3FFh for SW6_IDAC[9:0].
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
31
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Table 18. Switch On/Off Control (Direct Mode)
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
SWCNTRL
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
79
78
77
76:72
[79:72]
REGISTER = 09h
D4
D3
D2
D1
D0
SWCNTRL [79:72]
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
BIT DEFINITION
SW6 (controls switch 6 if direct mode (see reg 11h) is enabled)
SW5 (controls switch 5 if direct mode (see reg 11h) is enabled)
SW4 (controls switch 4 if direct mode (see reg 11h) is enabled)
UVLO_TRIM<4:0>
00000
2.3 V (minimum value – default value)
00001
2.37 V
.....
Step approximately 70 mV
11110
4.43 V
11111
4.5 V (maximum value)
HEX
00
Table 19. AFE (MUX) Control
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
AFE
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
87
86
85:84
83:80
[87:80]
REGISTER = 0Ah
D4
D3
D2
AFE [87:80]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
AFE_EN
AFE_CAL_DIS
AFE_GAIN<1:0>
AFE_SEL<3:0>
D1
D0
HEX
R/W
0
R/W
0
00
D2
D1
D0
HEX
R/W
0
R/W
0
R/W
0
00
Table 20. Break Before Make (BBM) Timing
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
D7
D6
D5
R/W
0
R/W
0
R/W
0
REGISTER = 0Bh
D4
D3
BBM [95:88]
R/W
R/W
0
0
Table 21. Break Before Make (BBM) Timing Bit Definitions (1)
FIELD NAME
BIT
BIT DEFINITION
BBM_DELAY<7:0>
BBM
(1)
[95:88]
95:88
0x00 – 0 ns
0x40 – 7326 ns
0x80 – 14430 ns
0xC0 – 21534 ns
0x01 – 333 ns
0x41 – 7437 ns
0x81 – 14541 ns
0xC1 – 21645 ns
0x02 – 444 ns
0x42 – 7548 ns
0x82 – 14652 ns
0xC2 – 21756 ns
...
...
...
...
0x3E – 7104 ns
0x7E – 14208 ns
0xBE – 21312 ns
0xFE – 28416 ns
0x3F – 7215 ns
0x7F – 14319 ns
0xBF – 21423 ns
0xFF – 28527 ns
It takes 333 to 444 ns to turn off the switches from the time a change occurs on LED_SEL[1:0].
Table 22. Interrupt Register
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
32
D7
D6
D5
R
0
R
0
R
0
REGISTER = 0Ch
D4
D3
INT [103:96]
R
R
0
0
Submit Documentation Feedback
D2
D1
D0
HEX
R
0
R
0
R
0
00
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 23. Interrupt Register Bit Definitions
FIELD NAME
INT
BIT
BIT DEFINITION
103
VLED_OVP
VLED buck_boost overvoltage fault interrupt (normal operation resumes)
0 – No fault
1 – Buck_boost output is above OVP threshold
102
IREG_PG_FAULT
V6V power-good fault interrupt (normal operation resumes)
0 – No fault
1 – V6V is not in regulation
101
PROJ_ON_INT
Proj_On interrupt (part enters OFF mode)
0 – Pin is pulled high, normal mode
1 – Pin is pulled low, alerts the DPP that the DMD regulator is about to shut down.
100
DMD_FAULT
DMD regulator fault (part enters STANDBY mode and DMD_EN bit is cleared)
0 – No fault
1 – The inductor current is not increasing at the correct rate, likely to be caused by an
open inductor.
Or, one of the regulator outputs has dropped below the power-good threshold, likely to
be caused by a short
99
UVLO
UVLO interrupt (sensed at VINA pin), DMD bit is cleared.
0 – Battery voltage is above the UVLO threshold
1 – Battery voltage has dropped below the UVLO threshold
98
BAT_LOW_WARN
Low battery warning interrupt (sensed at VINA pin, normal operation resumes)
0 – Battery voltage is above the low-battery threshold
1 – Battery voltage has dropped below the low-battery threshold
97
TS_WARN
Thermal warning interrupt (normal operation resumes)
0 – Die temperature is in normal operating range
1 – Die temperature is above the HOT threshold
Or, part has not cooled down enough to recover from HOT.
96
TS_WARN
Thermal Warning Interrupt (normal operation resumes)
0 – Die temperature is in normal operating range
1 – Die temperature is above the HOT threshold
Or, part has not cooled down enough to recover from HOT.
[103:96]
Table 24. Interrupt Mask Register
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
D7
D6
D5
R/W
1
R/W
1
R/W
0
REGISTER = 0Dh
D4
D3
INT MASK [111:104]
R/W
R/W
1
1
D2
D1
D0
HEX
R/W
1
R/W
1
R/W
1
DF
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
33
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Table 25. Interrupt Mask Register Bit Definitions
FIELD NAME
INT MASK
BIT
BIT DEFINITION
111
VLED BUCK_BOOST
Overvoltage fault interrupt mask
0 – Interrupt is not masked
1 – Interrupt is masked
110
IREG_PG_FAULT_MASK
0 – Interrupt is not masked
1 – Interrupt is masked
109
PROJ_ON interrupt mask
0 – Interrupt is not masked
1 – Interrupt is masked
108
DMD_REGULATOR fault mask
0 – Interrupt is not masked
1 – Interrupt is masked
107
UVLO_MASK
0 – Interrupt is not masked
1 – Interrupt is masked
106
Low Battery Warning Mask (sensed at VINA pin)
0 – Interrupt is not masked
1 – Interrupt is masked
105
Thermal Shutdown Interrupt Mask
0 – Interrupt is not masked
1 – Interrupt is masked
104
Thermal Warning Interrupt Mask
0 – Interrupt is not masked
1 – Interrupt is masked
[111:104]
Table 26. Timing Register VOFS, VBIAS, VRST, and RESETZ
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
34
D7
D6
D5
R/W
0
R/W
0
R/W
0
REGISTER = 0Eh
D4
D3
TIMING [119:112]
R/W
R/W
0
0
Submit Documentation Feedback
D2
D1
D0
HEX
R/W
1
R/W
1
R/W
1
07
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 27. Timing Register VOFS, VBIAS, VRST, and RESETZ Bit Definitions
FIELD NAME
TIMING
BIT
BIT DEFINITION
119:116
VOFS/RESETZ_DELAY<3:0> (for values see min and max delay)
115:112
VBIAS/VRST_DELAY<3:0> (for values see min and max delay)
[119:112]
Min Delay (μs)
Max Delay (μs)
0000
4.0
4.4
0001
8.0
8.9
0010
16.0
17.8
0011
32.0
35.5
0100
64.0
71.1
0101
128.0
142.2
0110
256.0
284.4
0111
512.0
569.0
1000
6.2
7.1
1001
12.4
14.2
1010
24.9
28.4
1011
49.8
56.9
1100
99.5
113.8
1101
199.1
227.6
1110
398.3
455.2
1111
1024.2
1138.0
Table 28. Password Register
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
PASSWORD
[135:128]
135:128
REGISTER = 10h
D4
D3
D2
D1
PASSWORD [135:128]
R/W
R/W
R/W
R/W
0
0
0
0
BIT DEFINITION
USER PASSWORD (0xBAh + 0xBEh) Disable (0x00h)
Once set, register 11h can be written.
D0
HEX
R/W
0
00
Table 29. System Configuration Register
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
D7
D6
D5
R/W
0
R/W
0
R/W
0
REGISTER = 11h
D4
D3
SYSTEM [143:136]
R/W
R/W
0
0
D2
D1
D0
HEX
R/W
0
R/W
0
R/W
0
00
Table 30. System Configuration Register Bit Definitions
FIELD NAME
BIT
BIT DEFINITION
143:139
SYSTEM
TBD
138
EEPROM_PROGRAM
Program scratch pad values to EEPROM
137
DIRECT_MODE
Allows direct control of switches through SW CONTROL REGISTER
136
TBD
[143:136]
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
35
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Table 31. User EEPROM, BYTE0
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE0
D7
D6
D5
R/W
0
BIT
[7:0]
R/W
0
R/W
0
7:0
REGISTER = 20h
D4
D3
D2
BYTE0 [7:0]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 0
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
Table 32. User EEPROM, BYTE1
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE1
D7
D6
D5
R/W
0
BIT
[15:8]
R/W
0
R/W
0
15:8
REGISTER = 21h
D4
D3
D2
BYTE1 [15:8]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 1
Table 33. User EEPROM, BYTE2
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE2
D7
D6
D5
R/W
0
BIT
[23:16]
R/W
0
R/W
0
23:16
REGISTER = 22h
D4
D3
D2
BYTE2 [23:16]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 2
Table 34. User EEPROM, BYTE3
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE3
D7
D6
D5
R/W
0
BIT
[31:24]
R/W
0
R/W
0
31:24
REGISTER = 23h
D4
D3
D2
BYTE3 [31:24]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 3
Table 35. User EEPROM, BYTE4
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE4
36
D7
D6
D5
R/W
0
BIT
[39:32]
R/W
0
R/W
0
39:32
REGISTER = 24h
D4
D3
D2
BYTE4 [39:32]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 4
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Table 36. User EEPROM, BYTE5
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE5
D7
D6
D5
R/W
0
BIT
[47:40]
R/W
0
R/W
0
47:40
REGISTER = 25h
D4
D3
D2
BYTE5 [47:40]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 5
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R/W
0
R/W
0
00
D1
D0
HEX
R
0
R
0
00
Table 37. User EEPROM, BYTE6
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
D7
D6
D5
R/W
0
BIT
R/W
0
R/W
0
BYTE6
[55:48]
55:48
REGISTER = 26h
D4
D3
D2
BYTE6 [55:48]
R/W
R/W
R/W
0
0
0
BIT DEFINITION
USER BYTE 6
Table 38. User EEPROM, BYTE7
DATA BIT
FIELD NAME
READ/WRITE
RESET VALUE
FIELD NAME
BYTE7
D7
D6
D5
R
0
BIT
[63:56]
R
0
R
0
63:56
REGISTER = 27h
D4
D3
D2
BYTE7 [63:56]
R
R
R
0
0
0
BIT DEFINITION
USER BYTE 7
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
37
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
A DLPC343x controller can be used with a DLP2010 (.2 WVGA) DMD or DLP3010 (.3 720p) DMD to provide a
compact, reliable, high-efficiency display solution for many different video display applications. The DMDs are
spatial light modulators which reflect incoming light from an illumination source to one of two directions with the
primary direction being into collection optics within a projection lens. The projection lens sends the light to the
destination needed for the application. Each application is derived primarily from the optical architecture of the
system and the format of the pixel data being input into the DLPC343x.
In display applications using the DLP2010 DMD or DLP3010 DMD, the DLPA2005 provides all needed analog
functions including the analog power supplies and the RGB LED driver to provide a robust and efficient display
solution. Display applications of interest include pico-projectors embedded in display devices like smart phones,
tablets, cameras, and camcorders. Other applications include wearable (near-eye) displays, battery-powered
mobile accessory, interactive display, low latency gaming displays, and digital signage.
Alternately, a DLPC150 controller can be used with a DLP2010 or DLP2010NIR DMD. Applications of interest
when using the DLPC150 controller include machine vision systems, spectrometers, skin analysis, medical
systems, material identification, chemical sensing, infrared projection, and compressive sensing. In a
spectroscopy application the DLPC150 controller and DLP2010NIR DMD are often combined with a single
element detector to replace expensive InGaAs array-based detector designs. In this application the DMD acts as
a wavelength selector reflecting specific wavelengths of light into the single point detector.
8.2 Typical Projector Application
A common application when using DLPA2005 with DLP2010 DMD and DLPC3430/DLPC3435 controller is for
creating an accessory projector for a smart phone, tablet or any other portable smart device. The
DLPC3430/DLPC3435 in an accessory projector typically receives images from a smart device over either HDMI
as shown below (WI-FI can also be used to transmit data). DLPA2005 provides power supply sequencing and
controls the RGB LED currents as required by the application.
38
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Charger
+
DC_IN
BAT
±
Typical Projector Application (continued)
...
2.3V-5.5V
DC Supplies
Projector Module Electronics
1.8V
Other
Supplies
1.8V
VSPI
1.1V
1.1V
Reg
SYSPWR
L3
1.8V
MSP430
PROJ_ON
1.8V
PROJ_ON
VLED
Cal data
(optional)
SPI_0
EEPROM
I2C_1
HDMI
FLASH
4
SPI_1
4
PARKZ
RESETZ
INTZ
RED
GREEN
BLUE
BIAS, RST, OFS
3
LED_SEL(2)
28
DLPC3430/
DLPC3435
Parallel I/F
Current
Sense
L2
I2C
HDMI
Receiver
L1
DLPA2005
GPIO_8 (Normal Park)
Illumination
Optics
WPC
CMP_PWM
LABB
CMP_OUT
eDRAM
Thermistor
1.8V
VCC_INTF
VCC_FLSH
1.1V
Sub-LVDS DATA
CTRL
VIO
18
VCORE
DLP2010
WVGA
(WVGA
DDR
DMD
DMD)
Spare R/W
GPIO
Figure 15. Typical Setup Using DLPA2005
8.2.1 Design Requirements
A pico-projector is created by using a DLP chip set comprised of DLP2010 (.2 WVGA) DMD, DLPC3430 or
DLPC3435 controller and DLPA2005 PMIC/LED driver. The DLPC3430 or DLPC3435 does the digital image
processing, the DLPA2005 provides the needed analog functions for the projector, and DMD is the display
device for producing the projected image. In addition to the three DLP chips in the chip set, other chips may be
needed. At a minimum a flash part is needed to store the software and firmware to control the DLPC3430 or
DLPC3435. The illumination light that is applied to the DMD is typically from red, green, and blue LEDs. These
are often contained in three separate packages, but sometimes more than one color of LED die may be in the
same package to reduce the overall size of the pico-projector. For connecting the DLPC3430 or DLPC3435 to
the front end for receiving images parallel interface is used. While using parallel interface, I2C should be
connected to the front end for sending commands to the DLPC3430 or DLPC3435. The only power supplies
needed external to the projector are the battery (SYSPWR) and a regulated 1.8 V supply. The entire picoprojector can be turned on and off by using a single signal called PROJ_ON. When PROJ_ON is high, the
projector turns on and begins displaying images. When PROJ_ON is set low, the projector turns off and draws
just microamps of current on SYSPWR. When PROJ_ON is set low, the 1.8 V supply can continue to be left at
1.8 V and used by other non-projector sections of the product. If PROJ_ON is low, the DLPA2005 will not draw
current on the 1.8 V supply.
8.2.2 Detailed Design Procedure
For connecting together the DLP2010, DLPC3430 or DLPC3435 and DLPA2005, see the reference design
schematic. When a circuit board layout is created from this schematic a very small circuit board is possible. An
example small board layout is included in the reference design data base. Layout guidelines should be followed
to achieve a reliable projector. The optical engine that has the LED packages and the DMD mounted to it is
typically supplied by an optical OEM who specializes in designing optics for DLP projectors.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
39
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Typical Projector Application (continued)
8.2.3 Application Curves
As the LED currents that are driven time-sequentially through the red, green, and blue LEDs are increased, the
brightness of the projector increases. This increase is somewhat non-linear, and the curve for typical white
screen lumens changes with LED currents. It’s assumed that the same current amplitude is applied to the red,
green, and blue LEDs.
1
0.9
0.8
Luminance
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
500
1000
1500
Current (mA)
2000
2500
3000
D001
Figure 16. Luminance vs Current
8.3 Typical Mobile Sensing Application
A typical embedded system application using the DLPC150 controller and the DLPC2010NIR is shown in
Figure 17. In this configuration, the DLPC150 controller supports a 24-bit parallel RGB input, typical of LCD
interfaces, from an external source or processor. The DLPC150 controller processes the digital input image and
converts the data into the format needed by the DLP2010NIR. The DLP2010NIR steers light by setting specific
micromirrors to the "on" position, directing light to the detector, while unwanted micromirrors are set to "off"
position, directing light away from the detector. The microprocessor sends binary images to the DLP2010NIR to
steer specific wavelengths of light into the detector. The microprocessor uses an analog-to-digital converter to
sample the signal received by the detector into a digital value. By sequentially selecting different wavelengths of
light and capturing the values at the detector, the microprocessor can then plot a spectral response to the light.
40
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Power
Management
On/Off
BAT
–
Charger
DC_IN
+
Typical Mobile Sensing Application (continued)
2.3 to 5.5 V
1.8 V
Other
Supplies
VIN
SYSPWR
VDD
1.1 V
1.1-V
Reg
1.8 V
1.8S V
LS_IN
PROJ_ON
PROJ_ON
USB
DLPA2000
or
DLPA2005
PROJ_ON
Detector
ADC
FLASH
FLASH,
SDRAM
4
SPI_0
SPI_1
4
PARKZ
RESETZ
INTZ
Microprocessor
HOST_IRQ
Thermistor
I2C
1.8S V
Bluetooth
Illumination
Optics
CMP_OUT
Parallel RGB I/F (28)
SD
Card
Current
Sense
CMP_PWM
DLPC150
TRIG_OUT (2)
RED
BIAS, RST, OFS
3
LED_SEL(2)
TRIG_IN
Keypad
VLED
Sub-LVDS DATA
LPSDR CTRL
VIO
DLP2010NIR
WVGA
(WVGA
DDR
DMD
DMD)
VCC_INTF
VCC_FLSH
1.1 V
Projection
Optics
VCORE
ADC + Amplifier
NIR
Detector
DLP® Chip Set
Figure 17. Typical Application Diagram
8.3.1 Design Requirements
All applications using the DLP 0.2-inch WVGA chipset require the:
• DLPC150 controller, and
• DLPA2005 PMIC, and
• DLP2010 or DLP2010NIR DMD
components for operation. The system also requires an external parallel flash memory device loaded with the
DLPC150 configuration and support firmware. DLPC150 does the digital image processing and formats the
data for the DMD. DLPA2005 PMIC provides the needed analog functions for the DLPC150 and DLP2010 or
DLP2010NIR. The chipset has several system interfaces and requires some support circuitry. The following
interfaces and support circuitry are required:
• DLPC150 system interfaces:
– Control interface
– Trigger interface
– Input data interface
– Illumination interface
• DLPC150 support circuitry and interfaces:
– Reference clock
– PLL
– Program memory flash interface
• DMD interfaces:
– DLPC150 to DMD digital data
– DLPC150 to DMD control interface
– DLPC150 to DMD micromirror reset control interface
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
41
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
Typical Mobile Sensing Application (continued)
8.3.2 Detailed Design Procedure
8.3.2.1 Dlpc150 System Interfaces
The 0.2-inch WVGA chipset supports a16-bit or 24-bit parallel RGB interface for image data transfers from
another device. There are two primary output interfaces: illumination driver control interface and sync outputs.
8.3.2.1.1 Control Interface
The 0.2-inch WVGA chipset supports I2C commands through the control interface. The control interface allows
another master processor to send commands to the DLPC150 controller to query system status or perform
realtime operations such as LED driver current settings.
8.3.3 Application Curve
In a reflective spectroscopy application, a broadband light source illuminates a sample and the reflected light
spectrum is dispersed onto the DLP2010NIR. A microprocessor in conjunction with the DLPC150 controls
individual DLP2010NIR micromirrors to reflect specific wavelengths of light to a single point detector. The
microprocessor uses an analog-to-digital converter to sample the signal received by the detector into a digital
value. By sequentially selecting different wavelengths of light and capturing the values at the detector, the
microprocessor can then plot a spectral response to the light. This systems allows the measurement of the
collected light and derive the wavelengths absorbed by the sample. This process leads to the absorption
spectrum shown in Figure 18.
Figure 18. Sample Dlpc150 Based Spectrometer Output
42
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
9 Power Supply Recommendations
The DLPA2005 is designed to operate from a 2.3 to 6 V input voltage supply or battery. To avoid insufficient
supply current due to line drop, ringing due to trace inductance at the VIN terminal, or supply peak current
limitations, additional bulk capacitance may be required. In the case ringing that is caused by the interaction with
the ceramic input capacitors, an electrolytic or tantalum type capacitor may be needed for damping.
The amount of bulk capacitance required should be evaluated such that the input voltage can remain in spec
long enough for a proper fast shutdown to occur for the vofs, vrst, and vbias supplies. The shutdown begins
when the input voltage drops below the programmable UVLO threshold such as when the external power supply
or battery supply is suddenly removed from the system.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
43
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
10 Layout
10.1 Layout Guidelines
As for all chips with switching power supplies, the layout is an important step in the design, especially in the case
of high peak currents and high switching frequencies. If the layout is not carefully done, the regulators could
show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current paths
and for the power ground tracks. Input capacitors, output capacitors, and inductors should be placed as close as
possible to the IC.
Figure 19 shows an example layout that has critical parts placed as close as possible to the pins they are
connected to. Here are recommendations for the following components:
R1
is RLIM and is connected via a wide trace (low resistance) to the system ground. The analog ground
at pin 5 should be star connected to the point where RLIM is connected to the system ground. Aim on
a wide and low-ohmic trace as well, although this one is less critical (tens of mA).
L1
is the big inductor for the VLED that is connected via two wide traces to the pins
C4
are the decoupling capacitors for the VLED and they are as close as possible placed to the part and
directly connected to ground.
L3/C20
are components used for the VCORE BUCK. L3 is placed close to the pin and connected with a wide
trace to the part. C20 is placed directly beside the inductor and connected to the PGND pin
L2
This inductor is part of the DMD reset regulators and is also placed as close as possible to the
DLPA2005 using wide PCB traces.
10.2 Layout Example
Figure 19. Example Layout of DLPA2005
44
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
10.3 Thermal Considerations
An important consequence of the efficiency numbers shown in Figure 7 is that it enables to perform DLPA2005
thermal calculations. Since the efficiency is not 100%, power is dissipated in the DLPA2005 chip. Due to that
dissipation die temperature will rise. For reliability reasons it is good to aim for as low as possible die
temperatures. Using a heat sink and airflow are efficient means to keep die temperature reasonably low. In cases
that airflow and / or a heat sink are / is not feasible, the system designer should specifically pay attention to the
thermal design. The die temperature for regular operation should remain below 120°C.
In the following an example is given of such a thermal calculation. The calculation starts with summarizing all
blocks in the DLPA2005 that dissipate. Clearly, the buck-boost converter supplying the LED power is the main
source of dissipation. For illustrating purposes here we assume this buck-boost converter to be the only block
that dissipates significantly. For the example assume: VOUT=4.8 V (for all three LEDs), IOUT=2.4 A and VIN=5
V. From Figure 7 it can be derived that the related efficiency equals about neff=88%.
The power dissipated by the DLPA2005 is then given by:
SPACE
PDISS
PIN POUT
§ 100% ·
1¸
POUT ¨
¨ K
¸
eff
©
¹
§ 100% ·
1¸ 1.6W
4.8V ˜ 2.4 A ˜ ¨
© 88%
¹
SPACE
The rise of die temperature due to this power dissipation can be calculated using the thermal resistance from
junction to ambient, M JA=27.9°C/W. This calculation yields:
SPACE
TJUNCTION
TAMBIENT PDISS ˜T JA
25°C 1.6W ˜ 27.9°C / W
69.6°C
SPACE
It is also possible to calculate the maximum allowable ambient temperature to prevent surpassing the maximum
die temperature. Assume again the dissipation of PDISS=1.6W. The maximum ambient temperature that is
allowed is then given by:
SPACE
TAMBIENT max
TJUNCTION max PDISS ˜T JA 120°C 1.6W ˜ 27.9°C / W
75.4°C
SPACE
It is again stressed here that for proper calculations the total power dissipation of the PAD2005 should be taken
into account. On top of that, if components that are close to the PAD2005 also dissipate a significant amount of
power, the (local) ambient temperature can be higher than the ambient temperature of the system.
If calculations show that the die temperature will surpass the maximum specified value, two basic options exist:
• Adding a heat sink with or without airflow. This will reduce 0JA yielding lower die temperature.
• Lowering the dissipation in the PAD2005 implying lowering the maximum allowable LED current.
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
45
DLPA2005
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
www.ti.com
11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
Package Marking DLPA2005
(TOP VIEW )
TI
YM
LLLL
S
PAD2005
A4
TI YMS$$
LLLL G4
$$
= TI LETTERS
= YEAR / MONTH DATE CODE
= ASSY LOT CODE
= ASSEMBLY SITE CODE
PER QSS 005-120
= W AFER FAB CODE
(1 or 2 CHARACTERS)
=pin 1 Marking
Figure 20. Package Marking DLPA2005 (Top View)
11.2 Trademarks
Pico is a trademark of Texas Instruments.
DLP is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Cover Tape The cover tape does not cover the index hole and does not shift to outside from carrier tape.
ESD Countermeasure Plastic material used in both carrier tape and cover tape are static dissipative.
46
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
DLPA2005
www.ti.com
DLPS047B – SEPTEMBER 2014 – REVISED OCTOBER 2015
Insertion of Device The device is located such as symbolization in upper side and lead pins in lower side.
Packing Method The reel is packed into Moisture Barrier bag and fastened by heat-sealing after fixed the end of
leader tape by tape. The QFN device packing includes desiccant, humidity indicator.
Reel Box
Each Moisture Barrier bag is packed into reel box.
Tape Structure The carrier tape is made of plastic and the structure is shown in above schematic. The device is
put on embossed area of carrier tape, and covered by cover tape made of plastic.
Reel Box Material Corrugated Fiberboard
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: DLPA2005
47
PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DLPA2005ERSLR
ACTIVE
VQFN
RSL
48
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
PAD2005
A4
DLPA2005ERSLT
ACTIVE
VQFN
RSL
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
PAD2005
A4
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DLPA2005ERSLR
VQFN
RSL
48
3000
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
DLPA2005ERSLT
VQFN
RSL
48
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DLPA2005ERSLR
VQFN
RSL
48
3000
367.0
367.0
38.0
DLPA2005ERSLT
VQFN
RSL
48
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated