Datasheet Operational Amplifiers Series Input/Output Full Swing High Slew Rate Low Voltage CMOS Operational Amplifiers BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Key Specifications Low Operating Supply Voltage (single supply): +2.4V to +5.5V High Slew Rate: 3.0V/µs Wide Temperature Range: BU7291G/BU7294xx -40C to +85C BU7291SG/BU7294Sxx -40C to +105C Low Input Offset Current: 1pA (Typ) Low Input Bias Current: 1pA (Typ) ●General Description BU7291G/BU7294xx and BU7291SG/BU7294Sxx are low supply voltage CMOS operational single/quad Amplifiers. This series is a Input/Output full swing, high slew rate, low supply current and high speed operation. Input bias current is very low at 1pA (Typ) . Especially,BU7291SG and BU7294Sxx, it has wide temperature range from -40C to +105C. ●Features High slew rate Input/Output full swing Large DC voltage gain Low input bias current ●Package SSOP5 SOP14 SSOP-B14 W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm ●Application Battery equipment Consumer electronics ●Simplified schematic VDD Vbias +IN Class AB control OUT -IN Vbias VSS Figure 1. Simplified schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Pin Configuration BU7291G, BU7291SG : SSOP5 +IN 1 VSS 2 -IN Pin No. Pin Name 1 +IN 2 VSS 3 -IN 4 OUT 5 VDD 14 OUT4 Pin No. Pin Name 13 -IN4 1 OUT1 -IN1 +IN1 VDD 5 + 4 OUT 3 BU7294F, BU7294SF : SOP14 BU7294FV, BU7294SFV : SSOP-B14 OUT1 1 -IN1 2 CH1 CH4 - + + - +IN1 3 12 +IN4 2 VDD 4 11 VSS 3 +IN2 5 -IN2 6 10 +IN3 - + + - CH3 CH2 9 -IN3 OUT2 7 8 OUT3 4 VDD 5 +IN2 6 -IN2 7 OUT2 8 OUT3 9 -IN3 10 +IN3 11 VSS 12 +IN4 13 -IN4 14 OUT4 SSOP5 Package SOP14 SSOP-B14 BU7291G BU7291SG BU7294F BU7294SF BU7294FV BU7294SFV ●Ordering Information B U 7 2 9 Part Number BU7291G BU7291SG BU7294xx BU7294Sxx www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 x x x x - xx Packaging and forming specification E2: Embossed tape and reel (SOP14/ SSOP-B14) TR: Embossed tape and reel (SSOP5) Package G:SSOP5 F:SOP14 FV:SSOP-B14 2/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Line-up Topr Package Operable Part Number -40C to +85C SSOP5 Reel of 3000 BU7291G-TR -40C to +105C SSOP5 Reel of 3000 BU7291SG-TR -40C to +85C SOP14 Reel of 2500 BU7294F-E2 -40C to +105C SOP14 Reel of 2500 BU7294SF-E2 -40C to +85C SSOP-B14 Reel of 2500 BU7294FV-E2 -40C to +105C SSOP-B14 Reel of 2500 BU7294SFV-E2 ●Absolute Maximum Ratings(Ta=25C) Ratings Parameter Symbol Supply Voltage Power dissipation BU7291 BU7294 VDD-VSS Pd BU7291S BU7294S +7 Unit V *1*4 SSOP5 0.54 SOP14 0.45*2*4 SSOP-B14 0.70*3*4 W Differential Input Voltage*5 Input Common-mode Voltage Range Input Current *6 Vid VDD - VSS V Vicm (VSS - 0.3) to VDD + 0.3 V Ii ±10 mA Operating Supply Voltage Vopr +2.4 to +5.5 V Operating Temperature Topr Storage Temperature Maximum Junction Temperature Tstg - 55 to +125 C Tjmax +125 C - 40 to +85 - 40 to +105 C Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 To use at temperature above Ta＝25C reduce 5.4mW. *2 To use at temperature above Ta＝25C reduce 4.5mW. *3 To use at temperature above Ta＝25C reduce 7.0mW. *4 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *5 The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. *6 An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Electrical Characteristics ○BU7291, BU7291S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C) Limits Temperature Parameter Symbol Range Min. Typ. Max. Unit Condition Input Offset Voltage *7 Vio 25C - 1 9 mV - Input Offset Current*7 Iio 25C - 1 - pA - Input Bias Current *7 Ib 25C - 1 - pA - 25C - 470 800 Full range - - 1100 μA RL=∞ Av=0dB, +IN=1.5V - V RL=10kΩ - VSS+0.1 V RL=10kΩ 70 105 - dB RL=10kΩ 25C 0 - 3 V VSS to VDD CMRR 25C 40 60 - dB - Power Supply Rejection Ratio PSRR 25C 45 80 - dB - Output Source Current *9 Isource 25C 5 8 - mA VDD-0.4V Isink 25C 9 16 - mA VSS+0.4V SR 25C - 3.0 - V/μs CL=25pF GBW 25C - 2.8 - MHz CL=25pF, f=100kHz Unity Gain Frequency fT 25C - 2.8 - MHz CL=25pF Phase Margin θ 25C - 50 - deg CL=25pF THD+N 25C - 0.03 - % Supply Current*8 IDD Maximum Output Voltage(High) VOH 25C VDD-0.1 - Maximum Output Voltage(Low) VOL 25C - Av 25C Vicm Common-mode Rejection Ratio Large Signal Voltage Gain Input Common-mode Voltage Range Output Sink Current *9 Slew Rate Gain Band Width Total Harmonic Distortion +Noise *7 *8 *9 OUT=0.8VP-P, f=1kHz Absolute value Full range BU7291: Ta=-40C to +85C BU7291S: Ta=-40C to +105C Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ○BU7294, BU7294S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C) Limits Temperature Parameter Symbol Range Min. Typ. Max. Unit Condition Input Offset Voltage *10 Vio 25C - 1 9 mV - Input Offset Current*10 Iio 25C - 1 - pA - Input Bias Current *10 Ib 25C - 1 - pA - 25C - 2000 3200 Full range - - 4400 VOH 25C VDD-0.1 - VOL 25C - Av 25C Vicm Common-mode Rejection Ratio μA RL=∞, All Op-Amps Av=0dB, +IN=1.5V - V RL=10kΩ - VSS+0.1 V RL=10kΩ 70 105 - dB RL=10kΩ 25C 0 - 3 V VSS to VDD CMRR 25C 40 60 - dB - Power Supply Rejection Ratio PSRR 25C 45 80 - dB - Output Source Current *12 Isource 25C 5 8 - mA VDD-0.4V Isink 25C 9 16 - mA VSS+0.4V SR 25C - 3.0 - V/μs CL=25pF GBW 25C - 2.8 - MHz CL=25pF, f=100kHz Unity Gain Frequency fT 25C - 2.8 - MHz CL=25pF Phase Margin θ 25C - 50 - deg CL=25pF THD+N 25C - 0.03 - % OUT=0.8VP-P, f=1kHz CS 25C - 100 - dB f=1kHz, OUT=0.5Vrms Supply Current*11 IDD Maximum Output Voltage(High) Maximum Output Voltage(Low) Large Signal Voltage Gain Input Common-mode Voltage Range Output Sink Current *12 Slew Rate Gain Band Width Total Harmonic Distortion +Noise Channel Separation *10 *11 *12 Absolute value Full range BU7294: Ta=-40C to +85C BU7294S: Ta=-40C to +105C Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential Input Voltage (Vid) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. 1.3 Input Common-mode Voltage Range (Vicm) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25C (normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics 2.1 Input Offset Voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. 2.2 Input Offset Current (Iio) Indicates the difference of input bias current between the non-inverting and inverting terminals. 2.3 Input Bias Current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. 2.4 Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. 2.5 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. 2.6 Large Signal Voltage Gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) 2.7 Input Common-mode Voltage Range (Vicm) Indicates the input voltage range where IC normally operates. 2.8 Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.9 Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) 2.10 Output Source Current/ Output Sink Current (Isource / Isink) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. 2.11 Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. 2.12 Gain Band Width (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. 2.13 Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. 2.14 Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. 2.16 Total Harmonic Distortion+Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.12 Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves ○BU7291, BU7291S 800 0.8 POWER DISSIPATION [W] . POWER DISSIPATION [W] . 800 0.8 0.6 600 BU7291G 400 0.4 200 0.2 0 0 85 25 50 75 AMBIENT TEMPERATURE [°C] 0.6 600 BU7291SG 400 0.4 0.2 200 0 100 0 125 Figure 3. Derating curve 1200 1200 1000 1000 SUPPLY CURRENT [μA] SUPPLY CURRENT [μA] Figure 2. Derating curve 105 25 50 75 100 AMBIENT TEMPERATURE [°C] 800 105C 85C 600 400 -40C 25C 200 800 5.5V 600 3.0V 400 2.4V 200 0 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 5. Supply Current – Ambient Temperature Figure 4. Supply Current – Supply Voltage (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7291, BU7291S 6 6 5 OUTPUT VOLTAGE HIGH [V] OUTPUT VOLTAGE HIGH [V] 105C 5 85C 4 25C 3 -40C 2 1 5.5V 4 3.0V 3 2.4V 2 1 0 0 1 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 6. Maximum Output Voltage High – Supply Voltage (RL=10kΩ) 125 Figure 7. Maximum Output Voltage High – Ambient Temperature (RL=10kΩ) 10 OUTPUT VOLTAGE LOW [mV] 10 OUTPUT VOLTAGE LOW [mV] -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 8 6 85C -40C 105C 25C 4 2 0 8 6 5.5V 4 2 2.4V 3.0V 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 8. Maximum Output Voltage Low Supply Voltage (RL=10kΩ) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 9. Maximum Output Voltage Low – Ambient Temperature (RL=10kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7291, BU7291S 20 OUTPUT SOURCE CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 50 40 -40C 25C 30 20 85C 105C 10 5.5V 15 3.0V 10 2.4V 5 0 0 0 0.5 1 1.5 2 2.5 -50 3 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] OUTPUT VOLTAGE [V] Figure 10. Output Source Current – Output Voltage (VDD=3V) Figure 11. Output Source Current – Ambient Temperature (OUT=VDD-0.4V) 80 80 OUTPUT SINK CURRENT [mA] -40C OUTPUT SINK CURRENT [mA] -25 60 25C 40 85C 105C 20 60 5.5V 40 3.0V 20 2.4V 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 OUTPUT VOLTAGE [V] -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 12. Output Sink Current – Output Voltage (VDD=3V) Figure 13. Output Sink Current – Ambient Temperature (OUT=VSS+0.4V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7291, BU7291S 5 5 4 4 25C INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] -40C 3 2 1 85C 105C 0 -1 -2 -3 -4 2 5.5V 1 0 3.0V -1 2.4V -2 -3 -4 -5 -5 2 3 4 5 6 SUPPLY VOLTAGE [V] -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 14. Input Offset Voltage – Supply Voltage (Vicm=VDD, OUT=1.5V) Figure 15. Input Offset Voltage – Ambient Temperature (Vicm=VDD, OUT=1.5V) 15 125 160 LARGE SIGNAL VOLTAGE GAIN [dB] . INPUT OFFSET VOLTAGE [mV] 3 10 -40C 85C 5 0 105C 25C -5 -10 -15 140 105C 85C 120 25C 100 -40C 80 60 -1 0 1 2 3 4 COMMON MODE INPUT VOLTAGE [V] 2 Figure 16. Input Offset Voltage – Common Mode Input Voltage (VDD=3V) 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 17. Large Signal Voltage Gain – Supply Voltage (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7291, BU7291S COMMON MODE REJECTION REJECTION RATIO RATIO [dB] [dB] LARGE SIGNAL VOLTAGE GAIN [dB] . 160 140 5.5V 120 2.4V 100 3.0V 80 60 120 100 105C 60 -40C 25C 40 20 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 19. Common Mode Rejection Ratio – Supply Voltage Figure 18. Large Signal Voltage Gain – Ambient Temperature 140 120 POWER SUPPLY REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB] . 85C 80 120 100 100 5.5V 80 60 2.4V 3.0V 40 20 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 80 60 40 20 0 -50 Figure 20. Common Mode Rejection Ratio – Ambient Temperature -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 21. Power Supply Rejection Ratio – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7291, BU7291S 5 5 4 4 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] 5.5V 5.5V 3 2.4V 2 3.0V 2.4V 2 1 1 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 3.0V 3 -50 Figure 22. Slew Rate L-H – Ambient Temperature -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 23. Slew Rate H-L – Ambient Temperature 200 100 Phase 80 60 100 Gain 40 PHASE [deg] GAIN[dB] 150 50 20 0 0 101 1.E+01 102 1.E+02 103 104 105 FREQUENCY [Hz] 1.E+03 1.E+04 1.E+05 106 1.E+06 107 1.E+07 Figure 24. Voltage Gain・Phase－Frequency (*)The data above is measurement value of typical sample, it is not guaranteed. BU7291G: -40C to +85C BU7291SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7294, BU7294S 800 0.8 800 0.8 600 0.6 POWER DISSIPATION [W] POWER DISSIPATION [W] BU7294F BU7294FV 400 0.4 200 0.2 600 0.6 BU7294SF BU7294SFV 400 0.4 200 0.2 0 0 0 85 25 50 75 100 AMBIENT TEMPERATURE [°C] 105 25 50 75 100 125 AMBIENT TEMPERATURE [°C] 0 125 Figure 26. Derating curve 5000 5000 4000 4000 SUPPLY CURRENT [uA] SUPPLY CURRENT [uA] Figure 25. Derating curve 105C 3000 85C 2000 25C 1000 -40C 0 3000 5.5V 2000 3.0V 2.4V 1000 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 27. Supply Current – Supply Voltage -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 28. Supply Current – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294G: -40C to +85C BU7294SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7294, BU7294S 6 6 OUTPUT VOLTAGE HIGH [V] OUTPUT VOLTAGE HIGH [V] 105C 5 25C 4 85C 3 -40C 2 1 0 5 5.5V 4 3.0V 3 2 2.4V 1 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 9 9 OUTPUT VOLTAGE LOW [mV] OUTPUT VOLTAGE LOW [mV] 10 8 7 105C 85C 5 4 3 25C -40C 25 50 75 100 125 Figure 30. Maximum Output Voltage High – Ambient Temperature (RL=10kΩ) 10 2 0 AMBIENT TEMPERATURE [°C] Figure 29. Maximum Output Voltage High – Supply Voltage (RL=10kΩ) 6 -25 1 8 7 6 5.5V 5 4 3 3.0V 2 2.4V 1 0 0 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 31. Maximum Output Voltage Low – Supply Voltage (RL=10kΩ) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 32. Maximum Output Voltage Low – Ambient Temperature (RL=10kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294G: -40C to +85C BU7294SG: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7294, BU7294S 50 OUTPUT SOURCE CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 50 40 -40C 25C 30 20 85C 105C 10 0 40 30 20 5.5V 3.0V 10 2.4V 0 0 0.5 1 1.5 2 2.5 3 -50 OUTPUT VOLTAGE [V] 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 33. Output Source Current – Output Voltage (VDD=3V) Figure 34. Output Source Current –Ambient Temperature (OUT=VDD-0.4V) 80 OUTPUT SINK CURRENT [mA] 80 OUTPUT SINK CURRENT [mA] -25 -40C 60 25C 40 85C 105C 20 60 40 5.5V 3.0V 20 2.4V 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 OUTPUT VOLTAGE [V] -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 36. Output Sink Current – Ambient Temperature (OUT=VSS+0.4V) Figure 35. Output Sink Current – Output Voltage (VDD=3V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx 5 5 4 4 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] ●Typical Performance Curves - Continued ○BU7294, BU7294S 3 2 1 0 85C -1 105C -2 -40C 25C -3 2 1 0 -1 -2 5.5V -3 -4 -5 -5 3 4 5 SUPPLY VOLTAGE [V] Figure 37. Input Offset Voltage – Supply Voltage 3.0V 2.4V -4 2 -50 6 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 38. Input Offset Voltage – Ambient Temperature 160 LARGESIGNAL SIGNALVOLTAGE VOLTAGEGAIN GAIN[dB] [dB] LARGE 15 INPUT OFFSET VOLTAGE [mV] 3 10 -40C 25C 85C 105C 5 0 -5 -10 140 105C 120 100 -40C 25C 85C 80 60 -15 -1 0 1 2 3 COMMON MODE INPUT VOLTAGE [V] 2 4 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 40. Large Signal Voltage Gain – Supply Voltage Figure 39. Input Offset Voltage – Common Mode Input Voltage (VDD=3V) (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7294, BU7294S 140 120 100 2.4V 80 5.5V 3.0V 60 40 20 0 -50 120 COMMON COMMONMODE MODEREJECTION REJECTION RATIO RATIO[dB] [dB] LARGESIGNAL SIGNALVOLTAGE VOLTAGEGAIN GAIN[dB] [dB] LARGE 160 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 100 105C 80 60 -40C 40 25C 20 0 125 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 42. Common Mode Rejection Ratio – Supply Voltage Figure 41. Large Signal Voltage Gain – Ambient Temperature 140 120 POWER SUPPLY REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB] 85C 120 100 5.5V 100 80 60 2.4V 3.0V 40 20 0 80 60 40 20 0 -50 -25 0 25 50 75 100 125 -50 AMBIENT TEMPERATURE [°C] Figure 43. Common Mode Rejection Ratio – Ambient Temperature -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 44. Power Supply Rejection Ratio – Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Typical Performance Curves - Continued ○BU7294, BU7294S 5 5 4 SLEW RATE H-L [V/μs] SLEW RATE L-H [V/μs] 5.5V 5.5V 3 2.4V 2 3.0V 1 4 3.0V 3 2.4V 2 1 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] 125 Figure 46. Slew Rate H-L – Ambient Temperature Figure 45. Slew Rate L-H – Ambient Temperature 200 100 Phase 150 60 100 40 Gain PHASE [deg] GAIN[dB] 80 50 20 0 1 10 0 2 10 0 3 10 1 4 10 10 105 100 0 6 7 10 10 1000 10000 FREQUENCY [Hz] Figure 47. Voltage Gain・Phase－Frequency (*)The data above is measurement value of typical sample, it is not guaranteed. BU7294: -40C to +85C BU7294S: -40C to +105C www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Application Information NULL method condition for Test circuit1 Parameter Input Offset Voltage VDD, VSS, EK, Vicm Unit:V VF S1 S2 S3 VDD VSS EK VF1 ON ON OFF 3 0 -1.5 ON ON ON 3 0 VF2 VF3 1 1.5 2 -2.5 VF4 0 ON ON OFF 3 0 -1.5 VF5 3 3 VF6 Power Supply Rejection Ratio 3 -0.5 Large Signal Voltage Gain Common-mode Rejection Ratio (Input Common-mode Voltage Range) Vicm Calculation ON ON 2.4 OFF VF7 0 -1.2 0 4 5.5 － Calculation－ |VF1| 1. Input Offset Voltage (Vio) Vio = 2. Large Signal Voltage Gain(Av) Av = 20Log [V] 1+RF/RS 2 × (1+RF/RS) [dB] |VF2-VF3| 3. Common-mode Rejection Ratio (CMRR) CMRR= 20Log 1.8 × (1+RF/RS) [dB] |VF4 - VF5| 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log 3.8 × (1+ RF/RS) [dB] |VF6 - VF7| 0.1µF RF=50kΩ SW1 EK RS=50Ω 0.01µF 500kΩ VDD Ri=10kΩ 15V Vo 500kΩ 0.015µF 0.015µF DUT NULL SW3 RS=50Ω 1000pF Ri=10kΩ RL Vicm 50kΩ VF SW2 VSS VRL -15V Figure 48. Test circuit 1 (one channel only) www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx Switch Condition for Test circuit2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON Input voltage SW3 VH R2 100kΩ SW4 ● ● VDD=3V VL t － SW1 Input wave SW2 Output voltage ＋ SW5 SW6 SW8 SW7 SW9 SW10 SW11 SW12 90% SR=ΔV/Δt VH R1 1kΩ VSS ΔV RL VIN- VIN+ CL 10% VL VL Vo Δt t Output wave Figure 50. Slew rate input output wave Figure 49. Test circuit 2 R2=100kΩ R2=100kΩ VDD VDD R1=1kΩ R1=1kΩ OTHER CH VIN R1//R2 OUT1 =0.5Vrms OUT2 R1//R2 VSS VSS CS=20Log 100×OUT1 OUT2 Figure 51. Test circuit 3 (Channel Separation) www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Application example ○Voltage follower Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT=IN VDD OUT IN VSS Figure 52. Voltage follower ○Inverting amplifier For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. Figure 53. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 VDD OUT For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. OUT=(1 + R2/R1)・IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. IN VSS Figure 54. Non-inverting amplifier circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at Ta=25C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θjaC/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 55. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power dissipation (Pd). θja = (Tjmax－Ta) / Pd C/W ・・・・・ (Ⅰ) The Derating curve in Figure 55. (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 56. (c) to (d) shows an example of the derating curve for BU7291, BU7291S, BU7294, BU7294S. Power dissipation of LSI [W] Pd(max) θja=(Tjmax-Ta)/Pd C/W Power dissipation of IC P2 Ambient temperature Ta[ C ] θja2 <θja1 P1 θja2 Tj(max) θja1 0 Chip surface temperature Tj[ C ] 25 50 75 100 125 Ambient temperature Ta[C] (b) Derating curve (a) Thermal resistance Figure 55. Thermal resistance and Derating Curve 1000 1.0 800 0.8 POWER DISSIPATION [W] . POWER DISSIPATION [W] . 1000 1.0 BU7294FV (*13) 600 0.6 BU7294F (*15) 400 0.4 BU7291G (*14) 200 0.2 0 800 0.8 BU7294SFV (*13) 600 0.6 BU7294SF (*15) 400 0.4 BU7291SG (*14) 200 0.2 0 0 25 50 75 85 100 0 AMBIENT TEMPERATURE [℃ ] 25 50 75 105 100 125 AMBIENT TEMPERATURE [℃ ] (*13) (*14) (*15) Unit 7.0 5.4 4.5 mW/C When using the unit above Ta=25C, subtract the value above per degree C. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted Figure 56. Derating Curve www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 BU7291G, BU7291SG, BU7294xx, BU7294Sxx Datasheet ●Operational Notes 1) Absolute maximum ratings Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely charged to the terminal. However, it does not guarantee the circuit operation. 2) Applied voltage to the input terminal For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage VDD + 0.3V. Then, regardless of power supply voltage,VSS - 0.3V can be applied to input terminals without deterioration or destruction of its characteristics. 3) Power supply (single / dual) The op-amp operates when the voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 4) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Short-circuit between pins and erroneous mounting Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 8) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 9) Output capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1μF between output pin and VSS pin. 10) Oscillation by output capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 11) Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Physical Dimensions Tape and Reel Information Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 24/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 25/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx Package Name SSOP-B14 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 26/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet BU7291G, BU7291SG, BU7294xx, BU7294Sxx ●Marking Diagram SSOP5(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK SSOP-B14(TOP VIEW) Product Name Part Number Marking LOT Number BU7291 BU7291S BU7294 Package Type G SSOP5 F SOP14 FV SSOP-B14 F BU7294S SOP14 FV SSOP-B14 Marking D1 FB BU7294F 7294 BU7294SF 7294S 1PIN MARK ●Land pattern data all dimensions in mm Land length Land width ≧ℓ 2 b2 PKG Land pitch e Land space MIE SSOP5 0.95 2.4 1.0 0.6 SOP14 1.27 4.60 1.10 0.76 SSOP-B14 0.65 4.60 1.20 0.35 SSOP5 e SOP14, SSOP-B14 e ℓ2 MIE e MIE b2 b2 ℓ 2 ●Revision History Date 22.May.2013 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Revision 001 Changes New Release 27/27 TSZ02201-0RAR1G200390-1-2 22.May.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001