APTM120A80FT1G VDSS = 1200V RDSon = 800mΩ typ @ Tj = 25°C ID = 14A @ Tc = 25°C Phase leg MOSFET Power Module 5 6 Application 11 • • • • Q1 7 8 Features 3 4 Q2 NTC • 9 10 1 2 Welding converters Switched Mode Power Supplies Uninterruptible Power Supplies Motor control 12 • • • Power MOS 8™ Fast FREDFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Fast intrinsic reverse diode - Avalanche energy rated - Very rugged Very low stray inductance - Symmetrical design Internal thermistor for temperature monitoring High level of integration Benefits • • • • Pins 1/2 ; 3/4 ; 5/6 must be shorted together • • Outstanding performance at high frequency operation Direct mounting to heatsink (isolated package) Low junction to case thermal resistance Solderable terminals both for power and signal for easy PCB mounting Low profile RoHS Compliant Absolute maximum ratings IDM VGS RDSon PD IAR Tc = 25°C Tc = 80°C Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Tc = 25°C Max ratings 1200 14 10 90 ±30 960 357 12 Unit V December, 2007 ID Parameter Drain - Source Breakdown Voltage A V mΩ W A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1–5 APTM120A80FT1G – Rev 0 Symbol VDSS APTM120A80FT1G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic IDSS RDS(on) VGS(th) IGSS Zero Gate Voltage Drain Current Drain – Source on Resistance Gate Threshold Voltage Gate – Source Leakage Current Test Conditions Tj = 25°C VDS = 1200V VGS = 0V Tj = 125°C VGS = 10V, ID = 12A VGS = VDS, ID = 2.5mA VGS = ±30 V Min 3 Typ 800 4 Max 250 1000 960 5 ±100 Unit Max Unit µA mΩ V nA Dynamic Characteristics Symbol Ciss Coss Crss Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VGS = 0V VDS = 25V f = 1MHz Qg Total gate Charge Qgs Gate – Source Charge Qgd Gate – Drain Charge VGS = 10V VBus = 600V ID = 12A Td(on) Turn-on Delay Time Tr Td(off) Tf Rise Time Turn-off Delay Time Fall Time Min Typ 6696 615 80 pF 260 nC 42 120 45 Resistive switching @ 25°C VGS = 15V VBus = 800V ID = 12A RG = 2.2Ω 27 ns 145 42 Source - Drain diode ratings and characteristics Symbol Characteristic IS Continuous Source current (Body diode) VSD Diode Forward Voltage dv/dt Peak Diode Recovery X trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Min Typ Tc = 25°C Tc = 80°C VGS = 0V, IS = - 12A IS = - 12A VR = 100V diS/dt = 100A/µs Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C 1.3 3.5 Max 14 10 1.1 25 270 640 Unit A V V/ns ns µC www.microsemi.com 2–5 APTM120A80FT1G – Rev 0 December, 2007 X dv/dt numbers reflect the limitations of the circuit rather than the device itself. IS ≤ - 12A di/dt ≤ 1000A/µs VDD ≤ 800V Tj ≤ 125°C APTM120A80FT1G Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance Min RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 -40 -40 -40 2.5 Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink M4 Typ Max 0.35 150 125 100 4.7 80 Unit °C/W V °C N.m g Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic Resistance @ 25°C R25 B 25/85 T25 = 298.15 K RT = Min Typ 50 3952 Max Unit kΩ K R25 T: Thermistor temperature ⎡ ⎛ 1 1 ⎞⎤ RT: Thermistor value at T − ⎟⎟⎥ exp ⎢ B25 / 85 ⎜⎜ ⎝ T25 T ⎠⎦ ⎣ See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com www.microsemi.com 3–5 APTM120A80FT1G – Rev 0 December, 2007 SP1 Package outline (dimensions in mm) APTM120A80FT1G Typical Performance Curve Low Voltage Output Characteristics Low Voltage Output Characteristics 20 VGS=10V 25 TJ=125°C TJ=25°C ID, Drain Current (A) 20 15 10 TJ=125°C 5 0 15 VGS=6, 7, 8 &9V 5V 10 5 4.5V 0 0 5 10 15 20 0 Normalized RDS(on) vs. Temperature 15 20 25 30 Transfert Characteristics 20 3 VGS=10V ID=12A 2.5 2 1.5 1 0.5 VDS > ID(on)xRDS(on)MAX 250µs pulse test @ < 0.5 duty cycle 15 TJ=125°C 10 TJ=25°C 5 0 0 50 75 100 125 0 150 1 3 4 5 6 VGS, Gate to Source Voltage (V) Capacitance vs Drain to Source Voltage Gate Charge vs Gate to Source 12 10000 ID=12A TJ=25°C VDS=240V Ciss VDS=600V 8 VDS=960V 6 4 2 C, Capacitance (pF) 10 2 1000 Coss 100 Crss 10 0 0 40 80 120 160 200 240 280 Gate Charge (nC) 0 50 100 150 200 VDS, Drain to Source Voltage (V) www.microsemi.com 4–5 December, 2007 25 TJ, Junction Temperature (°C) VGS, Gate to Source Voltage 10 VDS, Drain to Source Voltage (V) ID, Drain Current (A) RDSon, Drain to Source ON resistance VDS, Drain to Source Voltage (V) 5 APTM120A80FT1G – Rev 0 ID, Drain Current (A) 30 APTM120A80FT1G ISD, Reverse Drain Current (A) Drain Current vs Source to Drain Voltage 50 40 TJ=125°C 30 20 10 TJ=25°C 0 0 0.2 0.4 0.6 0.8 1 1.2 VSD, Source to Drain Voltage (V) Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 0.4 0.9 0.3 0.7 0.2 0.5 0.3 0.1 0.1 Single Pulse 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5–5 APTM120A80FT1G – Rev 0 December, 2007 rectangular Pulse Duration (Seconds)