Product Folder Order Now Technical Documents Support & Community Tools & Software DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 DAC38RFxx Dual- or Single-Channel, Single-Ended or Differential Output, 14-Bit, 9-GSPS, RF-Sampling DAC With JESD204B Interface and On-Chip PLL 1 Features 3 Description • • • The DAC38RFxx is a family of high-performance, dual/single-channel, 14-bit, 9-GSPS, RF-sampling digital-to-analog converters (DACs) that are capable of synthesizing wideband signals from 0 to 4.5 GHz. A high dynamic range allows the DAC38RFxx family to generate signals for a wide range of applications including 3G/4G signals for wireless base-stations and radar. 1 • • • • • • • 14-Bit Resolution Maximum DAC Sample Rate: 9 GSPS Key Specifications: – RF Full-Scale Output Power at 2.1 GHz: – DAC38RF80/90/84: 0 dBm – DAC38RF83/93/85: 3 dBm (with 2:1 balun) – Spectral Performance(on-chip PLL, DIFF): – fDAC = 5898.24 MSPS, fOUT = 2.14 GHz – WCDMA ACLR: 75 dBc – WCDMA alt-ACLR: 77 dBc – fDAC = 8847.36 MSPS, fOUT = 3.7 GHz – 20 MHz LTE ACLR: 63 dBc – fDAC = 9 GSPS, fOUT = 1.8 GHz – IMD3 = 70 dBc (–6 dBFS, 10-MHz tone spacing) – NSD = –157 dBc/Hz Dual-Band Digital Up-converter per DAC – 6, 8, 10, 12, 16, 18, 20 or 24x Interpolation – 4 Independent NCOs With 48-Bit Resolution JESD204B Interface, Subclass 1 – Support for Multichip Synchronization – Maximum Lane Rate: 12.5 Gbps Single-Ended Output With Integrated Balun (DAC38RF80/90/84) Covering 700 MHz to 3800 MHz Internal PLL and VCO With Bypass – fC(VCO) = 5.9 or 8.9 GHz Power Dissipation: 1.4 to 2.2 W/ch Power Supplies: –1.8 V, 1 V, 1.8 V Package: 10 x 10 mm BGA, 0.8 mm Pitch, 144Balls The devices feature a low-power JESD204B Interface with up to 8 lanes with a maximum bit rate of 12.5 Gbps allowing an input data rate of 1.25 GSPS complex per channel. The DAC38RFxx provides two digital up-converters per channel, with multiple options for interpolation rates. A digital quadrature modulator with independent, frequency flexible NCOs are available to support multi-band operation. An optional low-jitter PLL/VCO simplifies the DAC sampling clock generation by allowing use of a lower frequency reference clock. Device Information(1) PART NUMBER OUTPUT TYPE DAC38RF83 DAC38RF93 2 Differential DAC38RF85 DAC38RF84 2 1 DAC38RF80 DAC38RF90 NUMBER OF CHANNELS 2 Single ended 2 1 (1) For all available device options, see the Device Comparison Table. 2x20-MHz LTE at 1.84 GHz and 2.14 GHz, 800 MHz Span 2 Applications • • • • • Wireless Communications Communications Test Equipment Arbitrary Waveform Generators Military Software Defined Radios Radar and Satellite Communications (SATCOM) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. 1 Applications ........................................................... 1 Description ............................................................. 1 Revision History..................................................... 2 Device Comparison Table..................................... 6 Pin Configuration and Functions ......................... 7 Specifications....................................................... 13 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 Absolute Maximum Ratings .................................... ESD Ratings............................................................ Recommended Operating Conditions..................... Thermal Information ................................................ Electrical Characteristics - DC Specifications ......... Electrical Characteristics - Digital Specifications .... Electrical Characteristics - AC Specifications ......... PLL/VCO Electrical Characteristics ........................ Timing Requirements .............................................. Typical Characteristics .......................................... 13 13 13 14 14 17 20 23 24 25 Detailed Description ............................................ 33 8.1 Overview ................................................................. 33 8.2 Functional Block Diagrams ..................................... 33 8.3 Feature Description................................................. 39 8.4 Device Functional Modes........................................ 75 8.5 Register Maps ........................................................ 79 9 Application and Implementation ...................... 141 9.1 Application Information.......................................... 141 9.2 Typical Application: Multi-band Radio Frequency Transmitter ............................................................ 142 10 Power Supply Recommendations ................... 145 10.1 Power Supply Sequencing .................................. 146 11 Layout................................................................. 146 11.1 Layout Guidelines ............................................... 146 11.2 Layout Example .................................................. 149 12 Device and Documentation Support ............... 150 12.1 Related Links ...................................................... 12.2 Receiving Notification of Documentation Updates.................................................................. 12.3 Community Resources........................................ 12.4 Trademarks ......................................................... 12.5 Electrostatic Discharge Caution .......................... 12.6 Glossary .............................................................. 150 150 150 150 150 150 13 Mechanical, Packaging, and Orderable Information ......................................................... 150 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (April 2017) to Revision C Page • Changed the Description ........................................................................................................................................................ 1 • Changed the Device Information table ................................................................................................................................... 1 • Changed From: alarm_out_pol To: alm_out_pol in ALARM pin description in the Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 table ............................................................................................................................................ 8 • Changed the Description of pins A3, A4, A7, A6, A9, A10, A12, E12, F11, F7, G6, H5, H7, J6, J11 in the Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 table................................................................................................... 8 • Changed the description of TXENABLE pin in Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 table .................. 9 • Changed From: alarm_out_pol To: alm_out_pol in ALARM pin description in the Pin Functions - DAC38RF80, DAC38RF90, DAC38RF84 table .......................................................................................................................................... 11 • Changed the Description of pins A3, A4, A7, A6, A9, A10, A12, D8, E8, F11, F7, G6, H5, H7, J6, J11 in the Pin Functions - DAC38RF80, DAC38RF90, DAC38RF84 table................................................................................................. 11 • Added description to TXENABLE pin in the Pin Functions - DAC38RF80, DAC38RF90, DAC38RF84 table..................... 12 • Changed the MAX value of VEE18N rail in Absolute Maximum Ratings From: 0.5 V To: 0.3 V ......................................... 13 • Added "Supply Voltage Range" to the Recommended Operating Conditions table ............................................................ 13 • Changed DNL typical value From: ±0.5 To: ±3 LSB in the Electrical Characteristics - DC Specifications ......................... 14 • Changed INL typical value From: ±1 To: ±4 LSB in the Electrical Characteristics - DC Specifications ............................. 14 • Added "Reference voltage drift" to the Electrical Characteristics - DC Specifications table ................................................ 14 • Changed the Isolation values in the TEST CONDITIONS, MIN,and MAX columns in the Electrical Characteristics AC Specifications table......................................................................................................................................................... 22 • Added Isolation vs Output Frequency plot for DAC38RF80/90/84 in Figure 40 .................................................................. 30 • Added Isolation vs Output Frequency plot for DAC38RF83/93/95 in Figure 39 .................................................................. 31 • Changed the MPY values in Table 4.................................................................................................................................... 41 • Added MPY value for 16.5x to Table 4 ................................................................................................................................ 41 2 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Revision History (continued) • Changed x To: √ in the JESD204B Formats for DAC38RFxx talbe ..................................................................................... 44 • Changed JESD204B frame format for LMFSHd=84111 in Table 12 ................................................................................... 45 • Changed JESD204B frame format for LMFSHd=44210 in Table 14 ................................................................................... 46 • Changed JESD204B frame format for LMFSHd=24410 in Table 16 ................................................................................... 46 • Changed JESD204B frame format for LMFSHd=44210 in Table 17 ................................................................................... 46 • Changed JESD204B frame format for LMFSHd=88210 in Table 18 ................................................................................... 46 • Changed JESD204B frame format for LMFSHd=24410 in Table 19 ................................................................................... 47 • Changed JESD204B frame format for LMFSHd=48410 in Table 20 ................................................................................... 47 • Changed JESD204B frame format for LMFSHd=24310 in Table 21 ................................................................................... 47 • Changed JESD204B frame format for LMFSHd=48310 in Table 22 ................................................................................... 47 • Changed Table 33 ................................................................................................................................................................ 60 • Changed register field programming values for LMFSHd=24410 and 24310 in Table 36 ................................................... 65 • Changed the bit positions of N_M1 register field From: 12-8 To: 4-0 in Table 37 .............................................................. 65 • Changed the bit positions of N_M1' N_M1’ (NPRIME_M1) register field From: 4-0 To: 12-8 in Table 37 ......................... 65 • Deleted ISFIRCD_ENA and ISFIR_AB regsiter fields. Added ISFIR_ENA register field in Inverse Sinc Filter ................... 67 • Changed the description of DAC PLL alarm in Alarm Monitoring ........................................................................................ 70 • Changed from BIST_ENA to Reserved in Table 56 ............................................................................................................ 91 • Changed from BIST_ZERO to Reserved in Table 56 ......................................................................................................... 91 • Changed the description of OUTSUM_SEL field in Table 64 ............................................................................................. 97 • Changed From: "dummy data generation" To: "distortion enhancement" in Table 111 .................................................... 127 • Changed the junction temp and loop filter voltage range for PLL tuning in Figure 167 .................................................... 141 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 3 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Changes from Revision A (February 2017) to Revision B Page • Added VDDE1 rail to Supply Voltage Range in the Absolute Maximum Ratings table........................................................ 13 • Changed subtitle From: LVDS OUTPUT: SYNC1+/-, SYNC2+/- To: LVDS OUTPUT: SYNC0+/-, SYNC1+/- in the Electrical Characteristics - Digital Specifications table ........................................................................................................ 17 • Added "0 dBFS" amplitude of input digital data in test conditions in the Electrical Characteristics - AC Specifications table ...................................................................................................................................................................................... 20 • Changed the NSD values for -9 dBFS in Electrical Characteristics - AC Specifications table ............................................ 22 • Added the PLL/VCO Electrical Characteristics table............................................................................................................ 23 • Changed From: VCO frequency = 5898.24 MHz To: VCO frequency = 5.9 GHz in Figure 43 and Figure 44 .................... 32 • Changed From: measured at 1 GHz To: measured at 1.8 GHz in Figure 41 and Figure 43............................................... 32 • Added JESD204B clock phase register setting to Table 36 ................................................................................................ 65 • Removed descriptions for CLKJESD_DIV register from Table 36 ...................................................................................... 65 • Added JESD204B clock phase register setting to Table 37................................................................................................. 65 • Added information about the DAC output total current for various full scale current settings in DAC Fullscale Output Current ................................................................................................................................................................................. 72 • Changed the text in the second sentence of the DAC Transfer Function for DAC38RF80/90/84 section ......................... 75 • Changed Bit 0 of Table 123 From: Enables the GSM PLL To: Reserved.......................................................................... 134 • Changed Table 125 ........................................................................................................................................................... 136 • Changed description of SERDES_REFCLK_DIV register field in Table 126 .................................................................... 137 • Changed Bit 12:11, 6:5 and 4:2 of Table 129 ................................................................................................................... 139 • Updated the startup sequence in Figure 167 .................................................................................................................... 141 4 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Changes from Original (December 2016) to Revision A Page • Changed Feature: Spectral Performance (on-chip PLL, DIFF) .............................................................................................. 1 • Changed text From: 1.23 GSPS complex per channel To: 1.25 GSPS complex per channel in the Description ................. 1 • Changed the Pin Configuration image .................................................................................................................................. 7 • Changed the Pin Functions table ........................................................................................................................................... 8 • Changed the Description of SYSREF+ From: "LVPECL SYSREF positive input." To: "LVPECL SYSREF positive input, self biased." in the Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 table .................................................... 9 • Changed the Pin Configuration image ................................................................................................................................ 10 • Changed the Pin Functions table ......................................................................................................................................... 11 • Added "Transformer (TCM2-452X-2+) loss not de-embedded 2.1 GHz output frequency" to the Full scale output power Test Conditions in Electrical Characteristics - DC Specifications.............................................................................. 14 • Changed Reference output current From: 100 mA To: 100 nA in the Electrical Characteristics - DC Specifications ......... 14 • Changed the POWER SUPPLY CURRENT AND CONSUMPTION section of the Electrical Characteristics - DC specifications table ............................................................................................................................................................... 14 • Updated the typical values for power consumption for all modes in Electrical Characteristics - DC Specifications table... 17 • Specified the test conditions for Electrical Characteristics - DC Specifications table .......................................................... 17 • Added max current and power consumption for operating Mode 1 and Mode 11 Electrical Characteristics - DC Specifications table............................................................................................................................................................... 17 • Changed VI(DPP) From: MIN = 100 V TYP = 800 V To: TYP = 800 mV MAX = 2000 mVin Electrical Characteristics Digital Specifications table.................................................................................................................................................... 17 • Changed the typical values throughout the Electrical Characteristics - AC Specifications table ......................................... 20 • Changed the NSD Test Conditions in the Electrical Characteristics - AC Specifications table ........................................... 22 • Changed the AC PERFORMANCE – Modulated Signals section Test Conditions in the Electrical Characteristics AC Specifications table......................................................................................................................................................... 22 • Changed From: LMFSHd = 841 To: LMFSHd = 84111 in the Typical Characteristics conditions statement ...................... 25 • Updated graphs in the Typical Characteristics section ........................................................................................................ 25 • Added: Transformer loss is not de-embedded in Figure 37 ................................................................................................ 31 • Added: VCO frequency to Figure 41 through Figure 44 ...................................................................................................... 31 • Changed text From: 1.25 GSPS complex per channel To: 1.23 GSPS complex per channel in the Description ............... 33 • Replaced the Functional Block Diagrams, Figure 45 through Figure 50.............................................................................. 33 • Updated the max input rate in Table 9 ................................................................................................................................ 44 • Updated value of pull up and pull down resistors in Figure 70 under CMOS Digital Inputs ................................................ 72 • Changed From: 2 x (DACFS -11) To: 2 mA x (DACFS - 11) in Equation 10 ...................................................................... 72 • Changed text From: "(PFD) and charge pump (CP) is required." To: "(PFD) is approximately 550 MHz." in the Internal PLL/VCO section ..................................................................................................................................................... 76 • Updated the startup sequence in Figure 167 .................................................................................................................... 141 • Replaced Figure 172 ......................................................................................................................................................... 145 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 5 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 5 Device Comparison Table Device DAC38RF83 DAC38RF93 DAC38RF85 DAC38RF80 DAC38RF90 DAC38RF84 6 No. of Channels Output Interpolation VCO Center Frequency 6-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 12-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 6-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 6-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 12-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 6-24 VCO0 = 5.9 GHz, VCO1 = 8.85 GHz 2 2 Differential 1 2 2 Single ended 1 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 6 Pin Configuration and Functions DAC38RF83, DAC38RF93, DAC38RF85 AAV Package 144-Pin (FCBGA) 144-Pin FCBGA Top View A B C D E F G H J K L M VSSCLK AGND VOUT2+ VOUT2- AGND VDDOUT18 VDDOUT18 AGND VOUT1- VOUT1+ AGND 12 VSSCLK AGND AGND AGND VDDA1 VDDA18 VDDA18 VDDA1 AGND AGND AGND 11 10 DACCLK+ VDDAPLL18 EXTIO VEE18N VEE18N VSSCLK VDDL2_1 VDDL2_1 VSSCLK VEE18N VEE18N SDIO 10 9 DACCLK- VDDAPLL18 RBIAS VSSCLK VDDCLK1 VDDCLK1 VSSCLK RESET\ SCLK SDO 9 8 VSSCLK VSSCLK ATEST VDDPLL1 VDDPLL1 VSSCLK VDDL1_1 VDDL1_1 VSSCLK ALARM SLEEP SDEN\ 8 7 CLKTX+ VDDTX18 SYNC1\+ VDDDIG1 DGND VDDE1 DGND VDDE1 DGND GPI0 GPO0 GPI1 7 6 CLKTX- VDDTX1 SYNC1\- DGND VDDDIG1 DGND VDDE1 DGND VDDE1 TXENABLE GPO1 DGND 6 5 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDIO18 TRST\ TMS DGND RX3+ 5 4 SYSREF- VDDS18 SYNC0\+ VSENSE VDDDIG1 VDDDIG1 VDDDIG1 TDI TDO TCLK DGND RX3- 4 3 SYSREF+ VDDS18 SYNC0\- IFORCE VDDDIG1 AMUX1 AMUX0 VDDT1 VDDT1 TESTMODE DGND RX2- 3 2 DGND DGND DGND DGND DGND DGND DGND VDDR18 VDDR18 DGND DGND RX2+ 2 1 RX7+ RX7- RX6- RX6+ RX5+ RX5- RX4- RX4+ RX0+ RX0- RX1- RX1+ 1 A B C D E F G H J K L M 12 DACCLKSE 11 VSSCLK VDDAVCO18 VDDAVCO18 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 7 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 PIN I/O DESCRIPTION NAME NO. AGND C11, C12, D11, E11, F12, J12, K11, L11, M11, M12 – Analog ground. ALARM K8 O CMOS output for ALARM condition. Default polarity is active low, but can be changed to active high via RESET_CONFIG alm_out_pol control bit. AMUX0 G3 O Analog test pin for SerDes, Lane 0 to Lane 3. Can be left floating. AMUX1 F3 O Analog test pin for SerDes, Lane 4 to Lane 7. Can be left floating. ATEST C8 O Analog test pin for DAC, references and PLL. Can be left floating. CLKTX+ A7 O Divided output clock, internal 100 Ω differential termination, self-biased, positive terminal. CLKTX- A6 O Divided output clock, internal 100 Ω differential termination, self-biased, negative terminal. DACCLK+ A10 I Device clock, internal 100 Ω differential termination, self-biased, positive terminal. DACCLK- A9 I Device clock, internal 100 Ω differential termination, self-biased, negative terminal. DACCLKSE A12 I Single ended device clock optional input. Can be left floating if not used. internal 50 Ω termination. DGND A2, B2, C2, D2, D6, E2, E7, F2, F6, G2, G7, H6, J7, K2, L2, L3, L4, L5, M6 - Digital ground. EXTIO C10 I/O GPI0 K7 - Requires a 0.1 μF decoupling capacitor to AGND. Factory use only. User should GND. GPI1 M7 - Factory use only. User should GND. GPO0 L7 O Used for CMOS SYNC0\ signal. GPO1 L6 O Used for CMOS SYNC1\ signal. IFORCE D3 O Test pin for on chip parametrics. Can be left floating. RBIAS C9 O Full-scale output current bias. Change the full-scale output current through DACFS in register DACFS (8.5.72). Expected to be 3.6 kΩ to GND for 40 mA full scale output. RESET K9 I Active low input for chip RESET, which resets all the programming registers to their default state. Internal pull-up. RX0+ J1 I CML SerDes interface lane 0 input, positive RX0- K1 I CML SerDes interface lane 0 input, negative RX1+ M1 I CML SerDes interface lane 1 input, positive RX1- L1 I CML SerDes interface lane 1 input, negative RX2+ M2 I CML SerDes interface lane 2 input, positive RX2- M3 I CML SerDes interface lane 2 input, negative RX3+ M5 I CML SerDes interface lane 3 input, positive RX3- M4 I CML SerDes interface lane 3 input, negative RX4+ H1 I CML SerDes interface lane 4 input, positive RX4- G1 I CML SerDes interface lane 4 input, negative RX5+ E1 I CML SerDes interface lane 5 input, positive RX5- F1 I CML SerDes interface lane 5 input, negative RX6+ D1 I CML SerDes interface lane 6 input, positive RX6- C1 I CML SerDes interface lane 6 input, negative RX7+ A1 I CML SerDes interface lane 7 input, positive RX7- B1 I CML SerDes interface lane 7 input, negative SCLK L9 I Serial interface clock. Internal pull-down. SDEN M8 I Active low serial data enable, always an input to the DAC38RFxx. Internal pull-up. SDIO M10 I/O Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional input 4-pin mode. Internal pull-down. SDO M9 O Uni-directional serial interface data output in 4-pin mode. The SDO pin is tri-stated in 3-pin interface mode (default). SLEEP L8 I Active high asynchronous hardware power-down input. Internal pull-down. SYNC0+ C4 O Synchronization request to transmitter for JESD204B link 0, LVDS positive output. SYNC0- C3 O Synchronization request to transmitter for JESD204B link 0, LVDS negative output. SYNC1+ C7 O Synchronization request to transmitter for JESD204B link 1, LVDS positive output. SYNC1- C6 O Synchronization request to transmitter for JESD204B link 1, LVDS negative output. 8 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 (continued) PIN I/O DESCRIPTION NAME NO. SYSREF+ A3 I LVPECL SYSREF positive input, internal 100 Ω differential termination, self biased. This positive/negative pair is captured with the rising edge of DACCLKP/N. It is used for multiple DAC synchronization. SYSREF- A4 I LVPECL SYSREF negative input, self biased, internal 100 Ω differential termination. (See the SYSREF+ description) TCLK K4 I JTAG test clock. Internal pull-down TDI H4 I JTAG test data in. Internal pull-up TDO J4 O JTAG test data out. Internal pull-up TESTMODE K3 - This pin is used for factory testing. Recommended to connect to ground for normal operation. TMS K5 I JTAG test mode select. Internal pull-up TRST J5 I JTAG test reset. Internal pull-up. Must be connected to ground if not used TXENABLE K6 I Transmit enable active high input. Internal pull-down. This pin is ORed with spi_txenable bit in JESD_FIFO register to enable analog output data transmission. To enable analog output data transmission, pull the CMOS TXENABLE pin to high. To disable analog output, pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. VDDA1 F11, J11 I Analog 1 V supply voltage. Must be separated from VDDDIG1 supply for best performance. VDDA18 G11, H11 I Analog 1.8 V supply voltage. (1.8 V) VDDPLL1 D8, E8 I Analog 1 V supply for PLL. VDDAPLL18 B9, B10 I PLL analog supply voltage. (1.8 V) VDDAVCO18 D9, E9 I Analog supply voltage for VCO (1.8 V) VDDCLK1 G9, H9 I Internal clock buffer supply voltage (1 V). It is recommended to isolate this supply from VDDDIG1 and VDDA1. VDDL1_1 G8, H8 I DAC core supply voltage. (1 V) VDDL2_1 G10, H10 I DAC core supply voltage. (1 V) VDDDIG1 A5, B5, C5, D5, D7, E3, E4, E5, E6, F4, F5, G4, G5 I Digital supply voltage. (1 V). It is recommended to isolate this supply from VDDCLK1 and VDDA1. F7, H7, G6, J6 I Digital Encoder supply voltage (1 V). Must be separated from VDDDIG1 supply for best performance. VDDE1 VDDIO18 H5 I Supply voltage for all digital I/O and CMOS I/O (1.8 V). G12, H12 I DAC output supply. (1.8 V) VDDR18 H2, J2 I Supply voltage for SerDes. (1.8 V) VDDS18 B3, B4 I Supply voltage for LVDS SYNC0+/- and SYNC1+/- (1.8 V) VDDT1 H3, J3 I Supply voltage for SerDes termination. (1 V) VDDTX1 B6 I Supply voltage for divided clock output. (1 V) VDDTX18 B7 I Supply voltage for divided clock output . (1.8 V) VEE18N D10, E10, K10, L10 I Analog supply voltage. (-1.8 V) VOUT1+ L12 O DAC channel 1 output. VOUT1- K12 O DAC channel 1 complementary output. VOUT2+ D12 O DAC channel 2 output. Leave pin floating in DAC38RF85 VOUT2- E12 O DAC channel 2 complementary output. Leave pin floating in DAC38RF85 VSENSE D4 O Test pin for on chip parametrics. Can be left floating. VSSCLK A8, A11, B8, B11, B12, F8, F9, F10, J8, J9, J10 - Clock ground. VDDOUT18 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 9 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com DAC38RF80, DAC38RF84, DAC38RF90 AAV Package 144-Pin (FCBGA) 144-Pin FCBGA Top View A B C D E F G H J K L M VSSCLK AGND AGND VOUT2 AGND VDDOUT18 VDDOUT18 AGND VOUT1 AGND AGND 12 VSSCLK AGND AGND AGND VDDA1 VDDA18 VDDA18 VDDA1 AGND AGND AGND 11 10 DACCLK+ VDDAPLL18 EXTIO VEE18N VEE18N VSSCLK VDDL2_1 VDDL2_1 VSSCLK VEE18N VEE18N SDIO 10 9 DACCLK- VDDAPLL18 RBIAS VSSCLK VDDCLK1 VDDCLK1 VSSCLK RESET\ SCLK SDO 9 8 VSSCLK VSSCLK ATEST VDDPLL1 VDDPLL1 VSSCLK VDDL1_1 VDDL1_1 VSSCLK ALARM SLEEP SDEN\ 8 7 CLKTX+ VDDTX18 SYNC1\+ VDDDIG1 DGND VDDE1 DGND VDDE1 DGND GPI0 GPO0 GPI1 7 6 CLKTX- VDDTX1 SYNC1\- DGND VDDDIG1 DGND VDDE1 DGND VDDE1 TXENABLE GPO1 DGND 6 5 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDDIG1 VDDIO18 TRST\ TMS DGND RX3+ 5 4 SYSREF- VDDS18 SYNC0\+ VSENSE VDDDIG1 VDDDIG1 VDDDIG1 TDI TDO TCLK DGND RX3- 4 3 SYSREF+ VDDS18 SYNC0\- IFORCE VDDDIG1 AMUX1 AMUX0 VDDT1 VDDT1 TESTMODE DGND RX2- 3 2 DGND DGND DGND DGND DGND DGND DGND VDDR18 VDDR18 DGND DGND RX2+ 2 1 RX7+ RX7- RX6- RX6+ RX5+ RX5- RX4- RX4+ RX0+ RX0- RX1- RX1+ 1 A B C D E F G H J K L M 12 DACCLKSE 11 10 VSSCLK VDDAVCO18 VDDAVCO18 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Pin Functions - DAC38RF80, DAC38RF90, DAC38RF84 PIN I/O DESCRIPTION NAME NO. AGND C11, C12, D11, E11, F12, J12, K11, L11, M11, M12, D12, L12 - Analog ground. ALARM K8 O CMOS output for ALARM condition. Default polarity is active low, but can be changed to active high via RESET_CONFIG alm_out_pol control bit. AMUX0 G3 O Analog test pin for SerDes, Lane 0 to Lane 3. Can be left floating. AMUX1 F3 O Analog test pin for SerDes, Lane 4 to Lane 7. Can be left floating. ATEST C8 O Analog test pin for DAC, references and PLL. Can be left floating. CLKTX+ A7 O Divided output clock, internal 100 Ω differential termination, self-biased, positive terminal. CLKTX- A6 O Divided output clock, internal 100 Ω differential termination, self-biased, negative terminal. DACCLK+ A10 I Device clock, internal 100 Ω differential termination, self-biased, positive terminal. DACCLK- A9 I Device clock, internal 100 Ω differential termination, self-biased, negative terminal. DACCLKSE A12 I Single ended device clock optional input. Can be left floating if not used. internal 50 Ω termination DGND A2, B2, C2, D2, D6, E2, E7, F2, F6, G2, G7, H6, J7, K2, L2, L3, L4, L5, M6 - Digital ground. EXTIO C10 Requires a 0.1 μF decoupling capacitor to AGND. GPI0 L6 Factory use only. User should GND. GPI1 M7 Factory use only. User should GND. GPO0 L7 Used for CMOS SYNC0\ signal. GPIO1 K7 Used for CMOS SYNC1\ signal. IFORCE D3 Test pin for on chip parametrics. Can be left floating. RBIAS C9 I/O RESET K9 I Active low input for chip RESET, which resets all the programming registers to their default state. Internal pull-up. RX0+ J1 I CML SerDes interface lane 0 input, positive RX0- K1 I CML SerDes interface lane 0 input, negative RX1+ M1 I CML SerDes interface lane 1 input, positive RX1- L1 I CML SerDes interface lane 1 input, negative RX2+ M2 I CML SerDes interface lane 2 input, positive RX2- M3 I CML SerDes interface lane 2 input, negative RX3+ M5 I CML SerDes interface lane 3 input, positive RX3- M4 I CML SerDes interface lane 3 input, negative RX4+ H1 I CML SerDes interface lane 4 input, positive RX4- G1 I CML SerDes interface lane 4 input, negative RX5+ E1 I CML SerDes interface lane 5 input, positive RX5- F1 I CML SerDes interface lane 5 input, negative RX6+ D1 I CML SerDes interface lane 6 input, positive RX6- C1 I CML SerDes interface lane 6 input, negative RX7+ A1 I CML SerDes interface lane 7 input, positive RX7- B1 I CML SerDes interface lane 7 input, negative SCLK L9 I Serial interface clock. Internal pull-down. SDEN M8 I Active low serial data enable, always an input to the DAC38RFxx. Internal pull-up. SDIO M10 I/O Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional input 4-pin mode. Internal pull-down. SDO M9 O Uni-directional serial interface data output in 4-pin mode. The SDO pin is tri-stated in 3-pin interface mode (default). Full-scale output current bias. Change the full-scale output current through DACFS in register DACFS (8.5.72). Expected to be 3.6 kΩ to GND for 40 mA full scale output. SLEEP L8 I Active high asynchronous hardware power-down input. Internal pull-down. SYNC0+ C4 O Synchronization request to transmitter for JESD204B link 0, LVDS positive output. SYNC0- C3 O Synchronization request to transmitter for JESD204B link 0, LVDS negative output. SYNC1+ C7 O Synchronization request to transmitter for JESD204B link 1, LVDS positive output. SYNC1- C6 O Synchronization request to transmitter for JESD204B link 1, LVDS negative output. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 11 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Pin Functions - DAC38RF80, DAC38RF90, DAC38RF84 (continued) PIN I/O DESCRIPTION NAME NO. SYSREF+ A3 I LVPECL SYSREF positive input, internal 100 Ω differential termination, self biased. This positive/negative pair is captured with the rising edge of DACCLKP/N. It is used for multiple DAC synchronization. SYSREF- A4 I LVPECL SYSREF negative input, internal 100 Ω differential termination, self biased. (See the SYSREF+ description) TCLK K4 I JTAG test clock. Internal pull-down TDI H4 I JTAG test data in. Internal pull-up TDO J4 O JTAG test data out. Internal pull-up TESTMODE K3 I This pin is used for factory testing. Recommended to connect to ground. TMS K5 I JTAG test mode select. Internal pull-up TRST J5 I JTAG test reset. Must be connected to ground if not used. Internal pull-up TXENABLE K6 I Transmit enable active high input. Internal pull-down. This pin is ORed with spi_txenable bit in JESD_FIFO register to enable analog output data transmission. To enable analog output data transmission, pull the CMOS TXENABLE pin to high. To disable analog output, pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. VDDA1 F11, J11 I Analog 1V supply voltage. Must be separated from VDDDIG1 supply for best performance VDDA18 G11, H11 I Analog 1.8V supply voltage. (1.8 V) VDDPLL1 D8, E8 I Analog 1V supply for PLL. (1 V) VDDAPLL18 B9, B10 I PLL analog supply voltage. (1.8 V) VDDAVCO18 D9, E9 I Analog supply voltage for VCO (1.8 V) VDDCLK1 G9, H9 I Internal clock buffer supply voltage (1 V) It is recommended to isolate this supply from VDDDIG1 and VDDA1. VDDL1_1 G8, H8 I DAC core supply voltage. (1 V) VDDL2_1 G10, H10 I DAC core supply voltage. (1 V) VDDDIG1 A5, B5, C5, D5, D7, E3, E4, E5, E6, F4, F5, G4, G5 I Digital supply voltage. (1 V) It is recommended to isolate this supply from VDDCLK1 and VDDA1. F7, H7, G6, J6 I Digital Encoder supply voltage (1 V). Must be separated from VDDDIG1Must be separated from VDDDIG1 supply for best performance VDDE1 VDDIO18 H5 I Supply voltage for all digital I/O and CMOS I/O. (1.8 V) G12, H12 I DAC supply voltage (1.8 V) VDDR18 H2, J2 I Supply voltage for SerDes. (1.8 V) VDDS18 B3, B4 I Supply voltage for LVDS SYNC0+/- and SYNC1+/- (1.8V) VDDT1 H3, J3 I Supply voltage for SerDes termination. (1 V) VDDTX1 B6 I Supply voltage for divided clock output. (1 V) VDDTX18 B7 I Supply voltage for divided clock output. (1.8 V) VEE18N D10, E10, K10, L10 I Analog supply voltage. (-1.8 V) VOUT1 K12 O DAC channel 1 single ended output. VOUT2 E12 O DAC channel 2 single ended output. Leave pin floating in DAC38RF84 VSENSE D4 I Test pin for on chip parametrics. Can be left floating. VSSCLK A8, A11, B8, B11, B12, F8, F9, F10, J8, J9, J10 - Clock ground. VDDOUT18 12 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply Voltage Range (2) MIN MAX UNIT VDDDAC1, VDDDIG1, VDDL1_1, VDDL2_1, VDDCLK1, VDDT1, VDDCLK1, VDDTX1, VDDE1 –0.3 1.3 V VDDR18, VDDIO18, VDDS18, VDDAPLL18, VDDOUT18, VDDA18, VDDAVCO18, VDDTX18 –0.3 2.45 V VEE18N –2 0.3 V –0.3 0.3 V RX[0..7]+/- –0.5 VDDDIG1 + 0.5 V V SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM, RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST, TESTMODE, GPI0, GPI1, GPO0, GPO1 –0.5 VDDIO + 0.5 V V CLKOUT+/- –0.5 VDDTX18 + 0.5 V V DACCLK+/-, SYSREF+/-, DACCLKSE –0.5 VDDCLK1 + 0.5 V V SYNC0+/-, SYNC1+/- –0.5 VDDS18 + 0.5 V V VOUT1+/-, VOUT2+/- –0.5 VDDAOUT18 + 0.5 V V RBIAS, EXTIO, ATEST –0.5 VDDAOUT18 + 0.5 V V IFORCE, VSENSE –0.5 VDDDIG1 + 0.5 V V AMUX1, AMUX0 –0.5 VDDT1 + 0.5 V V 20 mA Voltage between AGND and DGND Pin Voltage Range (2) Peak input current (any input) Peak total input current (all inputs) –30 mA Junction temperature TJ 150 °C Operating free-air temperature, TA –40 85 °C Storage temperature, Tstg –65 150 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Measured with respect to AGND or DGND. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±1000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TJ TA Maximum rated operating junction temperature (1) 125 Recommended free-air temperature –40 Supply Voltage Range MAX UNIT 105 °C °C 85 °C VDDA18, VDDAPLL18, VDDS18, VDDIO18, VDDR18, VDDAPLL18, VDDOUT18, VDDAVCO18 1.71 1.8 1.89 V VDDDIG1 VDDA1, VDDT1, VDDAPLL1, VDDCLK1, VDDL1_1, VDDL2_1, VDDTX1, VDDE1 0.95 1 1.05 V -1.89 -1.8 -1.71 V VEE18N (1) NOM Recommended operating temperature Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 13 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 7.4 Thermal Information AAV (FCBGA) THERMAL METRIC (1) UNIT 144 PINS RθJA Junction-to-ambient thermal resistance 25 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.0 °C/W RθJB Junction-to-board thermal resistance 7.7 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 7.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Electrical Characteristics - DC Specifications Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC ACCURACY Resolution 14 bits DNL Differential nonlinearity (DAC38RF83/93/85) only ±3 LSB INL Integral nonlinearity (DAC38RF83/93/85) only ±4 LSB ANALOG OUTPUT Gain Error (DAC38RF83/93/85) only ±2 Full scale output signal current 10 P(OUTFS) Full scale output power 2:1 transformer coupled into 50 Ω- load. Transformer (TCM2-452X-2+) loss not de-embedded 2.1 GHz output frequency (DAC38RF83/93/85) only P(OUTFS) Full scale output power 50-Ω load 2.1 GHz output frequency (DAC38RF80/90/84) only Output Compliance Range 30 %FSR 40 mA 3 dBm 0 dBm 1.3 2.3 V Output capacitance Single ended to ground. (DAC38RF83/93/85) only 1.5 pF Output resistance Measured differentially (DAC38RF83/93/85) only 100 Ω REFERENCE OUTPUT: EXTIO VREF Reference output voltage 0.9 V Reference output current 100 nA ±8 ppm/°C Reference voltage drift POWER SUPPLY CURRENT AND CONSUMPTION 1 V Digital supplies: VDDDIG1 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 1: 2 TX, 1IQ/slice, LMFS = 8411, PLL on, 12x Interpolation, fINPUT = 737.28 MSPS, fDAC = 8847.36 MSPS, NCO’s = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N PDIS mA 1510 1758 mA 281 290 mA 159 180 mA 3779 4894 mW 1 V Digital supplies: VDDDIG1 1110 mA 1303 mA 257 mA 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 2: 1 TX, 1IQ/slice, LMFS = 4211, PLL on, 12x Interpolation, fINPUT = 737.28 MSPS, fDAC = 8847.36 MSPS, NCO = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N 14 2290 Power Dissipation 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 PDIS 1478 Power Dissipation Submit Documentation Feedback 159 mA 3162 mW Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Electrical Characteristics - DC Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER TEST CONDITIONS 1V Digital supplies: VDDDIG1 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 3: 2 TX, 2 IQ/slice, LMFS = 8821, PLL on, 24x Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36 MSPS, NCO1 = 1.84 GHz, NCO2 = 2.15 GHz, CLKTX Disabled -1.8 V Supply: VEE18N PDIS 1522 mA 280 mA mA 1 V Digital supplies: VDDDIG1 1701 mA 1314 mA 256 mA MODE 4: 1 TX, 2 IQ/slice, LMFS = 4421, PLL on, 24x Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36 MSPS, NCO1 = 1.84 GHz, NCO2 = 2.15 GHz, CLKTX Disabled 159 mA Power Dissipation 3763 mW 1 V Digital supplies: VDDDIG1 1328 mA 1312 mA 249 mA 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 5: 2 TX, 1 IQ/slice, LMFS = 4421, PLL on, 18x Interpolation, fINPUT = 491.52 MSPS, fDAC = 8847.36 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N 159 mA Power Dissipation 3374 mW 1 V Digital supplies: VDDDIG1 1027 mA 1206 mA 248 mA 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 6: 1 TX, 1 IQ/slice, LMFS = 2221, PLL on, 18x Interpolation, fINPUT = 491.52 MSPS, fDAC = 8847.36 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N 159 mA Power Dissipation 2964 mW 1 V Digital supplies: VDDDIG1 1157 mA 1125 mA 246 mA 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 7: 2 TX, 1 IQ/slice, LMFS = 8411, PLL on, 6x Interpolation, fINPUT = 983.04 MSPS, fDAC = 5898.24 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N Power Dissipation 1 V Digital supplies: VDDDIG1 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 8: 1 TX, 1 IQ/slice, LMFS = 4211, PLL on, 6x Interpolation, fINPUT = 983.04 MSPS, fDAC = 5898.24 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N PDIS mA mW 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 PDIS UNIT 159 -1.8 V Supply: VEE18N PDIS MAX 4565 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 PDIS TYP 2253 Power Dissipation 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 PDIS MIN Power Dissipation 159 mA 3011 mW 848 mA 647 mA 230 mA 159 mA 2195 mW Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 15 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Electrical Characteristics - DC Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER TEST CONDITIONS MIN 1 V Digital supplies: VDDDIG1 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 9: 2 TX, 2 IQ/slice, LMFS = 4831, PLL on, 24x Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N PDIS mA 1324 mA 251 mA 159 mA mW 1 V Digital supplies: VDDDIG1 1635 mA 1212 mA 250 mA MODE 10: 1 TX, 2 IQ/slice, LMFS = 2431, PLL on, 24x Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36 MSPS, NCO1 = 2.14 GHz, CLKTX Disabled -1.8 V Supply: VEE18N Power Dissipation 159 mA 3583 mW 1 V Digital supplies: VDDDIG1 63 568 mA 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 18 105 mA 47 51 mA 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 MODE 11: Power down mode, no clock, DACs in sleep, SerDes in sleep -1.8 V Supply: VEE18N Power Dissipation VDDTX1 VDDTX18 16 UNIT 4192 1.8 V Supplies: VDDA18 VDDOUT18 VDDAVCO18 VDDAPLL18 VDDR18 VDDIO18 VDDS18 VDDTX18 PDIS MAX Power Dissipation 1 V Analog supplies: VDDA1 VDDACLK1 VDDTX1 VDDAPLL1 VDDT1 VDDE1 PDIS TYP 2131 23 28 mA 208 815 mW fDAC = 8847 MSPS, Clock Out Divider Enabled 25 mA fDAC = 5898 MSPS, Clock Out Divider Enabled 19 mA Clock Out Enabled 16 mA Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 7.6 Electrical Characteristics - Digital Specifications Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 1200 mV CML SerDes INPUTS: RX[7:0]+/VDIFF Receiver input amplitude VCOM Input common mode voltage ZDDIFF Internal differential termination fSerDes SerDes bit rate 50 TERM = 111 600 TERM = 001 700 TERM = 100 0 TERM = 101 mV 250 85 115 Ω 0.78125 100 12.5 Gbps 0.1 9 GHz 2000 mV DIFFERENTIAL CLOCK INPUTS: SYSREF+/-, DACCLK+/fDACCLK DACCLK input frequency VCOM Differential input common mode voltage 0.5 VI(DPP) Differential input peak-to-peak voltage 800 ZT Internal termination 100 Ω CL Input capacitance 2 pF Duty cycle (DACCLK only) 40% V 60% LVDS OUTPUT: SYNC0+/-, SYNC1+/VCOM Output common mode voltage 1.2 V ZT Internal termination 100 Ω VOD Differential output voltage swing 500 mV 1300 mV CML OUTPUT: CLKTX+/VOD CML OUTPUT: CLKTX+/- CMOS INTERFACE: SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM, RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST, TESTMODE, SYNCSE1, SYNCSE2 VIH High-level input voltage VIL Low-level input voltage IIH High-level input current –40 IIL Low-level input current –40 CI CMOS input capacitance VOH High-level output voltage VOL Low-level output voltage 0.7 x VDDIO V 0.3 x VDDIO V 40 µA 40 µA 2 ILOAD = –100 µA VDDIO – 0.2 ILOAD = –2 mA 0.8 x VDDIO pF V ILOAD = 100 µA 0.2 ILOAD = 2 mA 0.5 V LATENCY full rate, RATE = “00” RX SerDes Digital Delay half rate, RATE = “01” 34 29 quarter rate, RATE = “10” 26.5 eighth rate, RATE = “11” 26.25 SerDes output to JED204B elastic buffer input latency 21 - 39 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 UI JESD clock cycles 17 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Electrical Characteristics - Digital Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER 18 TEST CONDITIONS MIN TYP LMFSHD = 82121, 6x Interpolation 856 LMFSHD = 82121, 8x Interpolation 1120 LMFSHD = 82121, 12x Interpolation 1602 LMFSHD = 82121, 16x Interpolation 2091 LMFSHD = 42111 or 84111, 6x Interpolation 817 LMFSHD = 42111 or 84111, 8x Interpolation 1057 LMFSHD = 42111 or 84111, 10x Interpolation 1184 LMFSHD = 42111 or 84111, 12x Interpolation 1532 LMFSHD = 42111 or 84111, 16x Interpolation 1997 LMFSHD = 42111 or 84111, 18x Interpolation 2142 LMFSHD = 42111 or 84111, 24x Interpolation 2941 LMFSHD = 22210 or 44210, 8x Interpolation 1020 LMFSHD = 22210 or 44210, 12x Interpolation 1473 Digital Latency: JESD Buffer to DAC Output LMFSHD = 22210 or 44210, 16x Interpolation 1917 LMFSHD = 22210 or 44210, 18x Interpolation 2050 LMFSHD = 22210 or 44210, 20x Interpolation 2275 LMFSHD = 22210 or 44210, 24x Interpolation 2821 LMFSHD = 12410 or 24410, 16x Interpolation 1912 LMFSHD = 12410 or 24410, 24x Interpolation 2786 LMFSHD = 44210 or 88210, 8x Interpolation 916 LMFSHD = 44210 or 88210, 12x Interpolation 1317 LMFSHD = 44210 or 88210, 16x Interpolation 1709 LMFSHD = 44210 or 88210, 24x Interpolation 2509 LMFSHD = 24410 or 48410, 16x Interpolation 1672 LMFSHD = 24410 or 48410, 24x Interpolation 1593 Submit Documentation Feedback MAX UNIT DAC clock cycles Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Electrical Characteristics - Digital Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted. PARAMETER SYSREF TO JESD LMFC RESET TEST CONDITIONS MIN TYP LMFSHD = 82121, 6x Interpolation 5 LMFSHD = 82121, 8x Interpolation 5 LMFSHD = 82121, 12x Interpolation 5 LMFSHD = 82121, 16x Interpolation 5 LMFSHD = 42111 or 84111, 6x Interpolation 16 LMFSHD = 42111 or 84111, 8x Interpolation 16 LMFSHD = 42111 or 84111, 10x Interpolation 15 LMFSHD = 42111 or 84111, 12x Interpolation 15 LMFSHD = 42111 or 84111, 16x Interpolation 13 LMFSHD = 42111 or 84111, 18x Interpolation 15 LMFSHD = 42111 or 84111, 24x Interpolation 15 LMFSHD = 22210 or 44210, 8x Interpolation 8 LMFSHD = 22210 or 44210, 12x Interpolation 7 LMFSHD = 22210 or 44210, 16x Interpolation 6 LMFSHD = 22210 or 44210, 18x Interpolation 7 LMFSHD = 22210 or 44210, 20x Interpolation 5 LMFSHD = 22210 or 44210, 24x Interpolation 4 LMFSHD = 12410 or 24410, 16x Interpolation 9 LMFSHD = 12410 or 24410, 24x Interpolation 7 LMFSHD = 44210 or 88210, 8x Interpolation 29 LMFSHD = 44210 or 88210, 12x Interpolation 27 LMFSHD = 44210 or 88210, 16x Interpolation 26 LMFSHD = 44210 or 88210, 24x Interpolation 25 LMFSHD = 24410 or 48410, 16x Interpolation 8 LMFSHD = 24410 or 48410, 24x Interpolation 6 MAX Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 UNIT JESD clock cycles 19 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 7.7 Electrical Characteristics - AC Specifications Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9 GSPS, 12x Interpolation, 0 dBFS, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted. PARAMETER TEST CONDITIONS DAC38RF83/93/85 MIN TYP MAX DAC38RF80/90/84 MIN TYP MAX UNIT ANALOG OUTPUT fDAC Maximum DAC sample rate 9 9 GSPS AC PERFORMANCE - CW SFDR SFDR SFDR HD2 20 Spurious Free Dynamic Range 0 – fDAC/2 Spurious Free Dynamic Range within 500 MHz fOUT ± 250 MHz Spurious Free Dynamic Range excluding HD2, HD3 and CMP2 0 – fDAC/2 2nd Order Harmonic fCLK = 6 GHz , fOUT = 501 MHz 63 70 fCLK = 6 GHz , fOUT = 951 MHz 62 67 fCLK = 6 GHz , fOUT = 1851 MHz 58 59 fCLK = 6 GHz , fOUT = 2651 MHz 57 57 fCLK = 9 GHz , fOUT = 501 MHz 62 64 fCLK = 9 GHz , fOUT = 951 MHz 61 65 fCLK = 9 GHz , fOUT = 1851 MHz 61 62 fCLK = 9 GHz , fOUT = 2651 MHz 54 50 fCLK = 9 GHz , fOUT = 3651 MHz 51 51 fCLK = 6 GHz , fOUT = 501 MHz 97 94 fCLK = 6 GHz , fOUT = 951 MHz 93 88 fCLK = 6 GHz , fOUT = 1851 MHz 88 87 fCLK = 6 GHz , fOUT = 2651 MHz 77 78 fCLK = 9 GHz , fOUT = 501 MHz 94 92 fCLK = 9 GHz , fOUT = 951 MHz 90 88 fCLK = 9 GHz , fOUT = 1851 MHz 85 85 fCLK = 9 GHz , fOUT = 2651 MHz 82 82 fCLK = 9 GHz , fOUT = 3651 MHz 79 78 fCLK = 6 GHz , fOUT = 501 MHz 72 72 fCLK = 6 GHz , fOUT = 951 MHz 71 75 fCLK = 6 GHz , fOUT = 1851 MHz 74 75 fCLK = 6 GHz , fOUT = 2651 MHz 71 71 fCLK = 9 GHz , fOUT = 501 MHz 69 64 fCLK = 9 GHz , fOUT = 951 MHz 69 66 fCLK = 9 GHz , fOUT = 1851 MHz 72 65 fCLK = 9 GHz , fOUT = 2651 MHz 71 64 fCLK = 9 GHz , fOUT = 3651 MHz 67 62 fCLK = 6 GHz , fOUT = 501 MHz 72 71 fCLK = 6 GHz , fOUT = 951 MHz 65 68 fCLK = 6 GHz , fOUT = 1851 MHz 57 59 fCLK = 6 GHz , fOUT = 2651 MHz 57 57 fCLK = 9 GHz , fOUT = 501 MHz 71 71 fCLK = 9 GHz , fOUT = 951 MHz 65 67 fCLK = 9 GHz , fOUT = 1851 MHz 62 62 fCLK = 9 GHz , fOUT = 2651 MHz 54 49 fCLK = 9 GHz , fOUT = 3651 MHz 51 51 Submit Documentation Feedback dBc dBc dBc dBc Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Electrical Characteristics - AC Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9 GSPS, 12x Interpolation, 0 dBFS, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted. PARAMETER HD3 CMP2 CMP4+ IMD3 3rd Order Harmonic Fs/2 clock mixing product (Fs/2 – fOUT) Fs/N (N = 4, 8, 16) clock mixing product (fOUT ± Fs/N) Third-order two-tone intermodulation distortion TEST CONDITIONS DAC38RF83/93/85 MIN TYP DAC38RF80/90/84 MAX MIN TYP fCLK = 6 GHz , fOUT = 501 MHz 63 75 fCLK = 6 GHz , fOUT = 951 MHz 62 72 fCLK = 6 GHz , fOUT = 1851 MHz 71 72 fCLK = 6 GHz , fOUT = 2651 MHz 69 70 fCLK = 9 GHz , fOUT = 501 MHz 62 74 fCLK = 9 GHz , fOUT = 951 MHz 61 73 fCLK = 9 GHz , fOUT = 1851 MHz 66 72 fCLK = 9 GHz , fOUT = 2651 MHz 65 69 fCLK = 9 GHz , fOUT = 3651 MHz 67 69 fCLK = 6 GHz , fOUT = 501 MHz 85 79 fCLK = 6 GHz , fOUT = 951 MHz 85 80 fCLK = 6 GHz , fOUT = 1851 MHz 82 76 fCLK = 6 GHz , fOUT = 2651 MHz 79 76 fCLK = 9 GHz , fOUT = 501 MHz 78 70 fCLK = 9 GHz , fOUT = 951 MHz 76 67 fCLK = 9 GHz , fOUT = 1851 MHz 73 67 fCLK = 9 GHz , fOUT = 2651 MHz 74 63 fCLK = 9 GHz , fOUT = 3651 MHz 68 59 fCLK = 6 GHz , fOUT = 501 MHz 92 90 fCLK = 6 GHz , fOUT = 951 MHz 87 87 fCLK = 6 GHz , fOUT = 1851 MHz 81 83 fCLK = 6 GHz , fOUT = 2651 MHz 78 76 fCLK = 9 GHz , fOUT = 501 MHz 95 91 fCLK = 9 GHz , fOUT = 951 MHz 89 88 fCLK = 9 GHz , fOUT = 1851 MHz 84 85 fCLK = 9 GHz , fOUT = 2651 MHz 79 81 fCLK = 9 GHz , fOUT = 3651 MHz 74 74 fCLK = 6 GHz , fOUT = 501 ± 5 MHz, –6 dBFS each tone 80 83 fCLK = 6 GHz , fOUT = 951 ± 5 MHz, –6 dBFS each tone 76 79 fCLK = 6 GHz , fOUT = 1851 ± 5 MHz, –6 dBFS each tone 73 76 fCLK = 6 GHz , fOUT = 2651 ± 5 MHz, –6 dBFS each tone 72 75 fCLK = 9 GHz , fOUT = 501 ± 5 MHz, –6 dBFS each tone 80 84 fCLK = 9 GHz , fOUT = 951 ± 5 MHz, –6 dBFS each tone 75 80 fCLK = 9 GHz , fOUT = 1851 ± 5 MHz, –6 dBFS each tone 70 74 fCLK = 9 GHz , fOUT = 2651 ± 5 MHz, –6 dBFS each tone 70 73 fCLK = 9 GHz , fOUT = 3651 ± 5 MHz, –6 dBFS each tone 68 71 MAX Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 UNIT dBc dBc dBc dBc 21 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Electrical Characteristics - AC Specifications (continued) Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9 GSPS, 12x Interpolation, 0 dBFS, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted. PARAMETER NSD Isolation Noise Spectral Density > 50 MHz offset Isolation between DAC A and DAC B analog output TEST CONDITIONS DAC38RF83/93/85 MIN TYP MAX DAC38RF80/90/84 MIN TYP fCLK = 6 GHz , fOUT = 501 MHz –170 –169 fCLK = 6 GHz , fOUT = 951 MHz –163 –163 fCLK = 6 GHz , fOUT = 1851 MHz –157 –155 fCLK = 6 GHz , fOUT = 2651 MHz –155 –154 fCLK = 9 GHz , fOUT = 501 MHz –172 –171 fCLK = 9 GHz , fOUT = 951 MHz –166 –167 fCLK = 9 GHz , fOUT = 1851 MHz –157 –156 fCLK = 9 GHz , fOUT = 2651 MHz –156 –155 fCLK = 9 GHz , fOUT = 3651 MHz –153 –153 fCLK = 6 GHz , fOUT = 501 MHz, –9 dBFS –170 –169 fCLK = 6 GHz , fOUT = 951 MHz, –9 dBFS –164 –163 fCLK = 6 GHz , fOUT = 1851 MHz, –9 dBFS –162 –159 fCLK = 9 GHz , fOUT = 2651 MHz, –9 dBFS –162 –162 fCLK = 9 GHz , fOUT = 3651 MHz, –9 dBFS –159 –159 fOUT = 1856 MHz 82 60 fOUT = 3105 MHz 73 55 fCLK = 5898.24 MHz, fOUT = 950 MHz 76 78 fCLK = 5898.24 MHz, fOUT = 2140 MHz 75 73 fCLK = 8847.36 MHz, fOUT = 950 MHz 76 77 fCLK = 8847.36 MHz, fOUT = 2140 MHz 73 73 fCLK = 5898.24 MHz, fOUT = 950 MHz 82 83 fCLK = 5898.24 MHz, fOUT = 2140 MHz 77 77 fCLK = 8847.36 MHz, fOUT = 950 MHz 82 82 fCLK = 8847.36 MHz, fOUT = 2140 MHz 77 78 fCLK = 5898.24 MHz, fOUT = 800 MHz 73 74 fCLK = 5898.24 MHz, fOUT = 2650 MHz 70 68 fCLK = 8847.36 MHz, fOUT = 800 MHz 73 74 fCLK = 8847.36 MHz, fOUT = 2650 MHz 69 68 fCLK = 8847.36 MHz, fOUT = 3700 MHz 63 66 MAX UNIT dBFS/ Hz dBc AC PERFORMANCE – Modulated Signals ACPR AltACLR LTE20 22 WCDMA 1 carrier adjacent channel power ratio WCDMA 1 carrier alternate channel ACPR 20 MHz LTE adjacent channel power ratio Submit Documentation Feedback dBc dBc dBc Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 7.8 PLL/VCO Electrical Characteristics Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, internal PLL/VCO clock mode, 12x Interpolation, 0 dBFS, fOUT = 1.8 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PLL/VCO fref Reference clock frequency 100 fVCO /4 MHz fPFD Frequency of phase & frequency detector 100 500 MHz fvcoL Low VCO operating frequency 5240 6720 MHz fvcoH High VCO operating frequency 7960 9000 MHz fBW Loop filter bandwidth 500 KHz Low VCO Phase Noise 600 KHz Frequency Offset 1.2 MHz 1.8 MHz -124 fvco = 6 GHz,CP = 5, PFD = 500 MHz, measured at output frequency = 1.8 GHz 6.0 MHz -131 -135 dBc/Hz -146 High VCO Phase Noise 600 KHz Frequency Offset 1.2 MHz 1.8 MHz -123 fvco = 9 GHz, CP = 5, PFD = 500 MHz, measured at output frequency = 1.8 GHz 6.0 MHz -131 -136 dBc/Hz -148 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 23 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 7.9 Timing Requirements MIN NOM MAX UNIT DIGITAL INPUT TIMING SPECIFICATIONS TIMING: SYSREF+/ts(SYSREF) Setup time, SYSREF+/- valid to rising edge of DACCLK+/- SYSREF Capture assist disabled 50 ps th(SYSREF) Hold time, SYSREF+/- valid after rising edge of DACCLK+/- SYSREF Capture assist disabled 50 ps TIMING: SERIAL PORT ts(/SDEN) Setup time, SDEN to rising edge of SCLK 20 ns ts(SDIO) Setup time, SDIO valid to rising edge of SCLK 10 ns th(SDIO) Hold time, SDIO valid after rising edge of SCLK 5 ns t(SCLK) Period of SCLK td(Data) tRESET temperature sensor read 1 µs 100 ns Data output delay after falling edge of SCLK 25 ns Minimum RESET pulse width 25 ns All other registers ANALOG OUTPUT ts(DAC) Output settling time to 0.1% 1 ns tr Output rise time 10% to 90% 50 ns tf Output fall time 90% to 10% 50 ns 250 ps LATENCY RX SerDes AnalogDelay 24 DAC wake-up time IOUT current settling to 1% of IOUTFS from deep sleep 90 µs DAC sleep time IOUT current settling to less than 1% of IOUTFS in deep sleep 90 µs Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 7.10 Typical Characteristics Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 9 GSPS, 12x interpolation, 0 dBFS digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is disabled. 180 180 -12dBFS -9dBFS -6dBFS 0dBFS 174 168 168 162 NSD (dBc/Hz) NSD (dBc/Hz) 162 156 150 144 144 132 132 126 126 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 120 500 4500 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D005 DAC38RF80/90/84 Figure 2. NSD vs Output Frequency Over Input Scale 180 Iout=40mA Iout=30mA Iout=20mA Iout=10mA 174 168 168 162 156 150 144 156 150 144 138 138 132 132 126 126 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Measured 50 MHz from carrier 4000 Iout=40mA Iout=30mA Iout=20mA Iout=10mA 174 NSD (dBc/Hz) 162 120 500 4500 1000 1500 D011 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) Measured 50 MHz from carrier Figure 3. NSD vs Output Frequency Over Output Current IoutFS 4000 4500 D011 DAC38RF80/90/84 Figure 4. NSD vs Output Frequency Over Output Current IoutFS 180 180 174 174 On-chip PLL External clock 168 On-chip PLL External clock 168 162 NSD (dBc/Hz) 162 156 150 144 156 150 144 138 138 132 132 126 126 120 500 1500 Measured 50 MHz from carrier Figure 1. NSD vs Output Frequency Over Input Scale 120 500 1000 D005 180 NSD (dBc/Hz) 150 138 Measured 50 MHz from carrier NSD (dBc/Hz) 156 138 120 500 -12dBFS -9dBFS -6dBFS 0dBFS 174 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Measured 50 MHz from carrier 4000 4500 120 500 D015 DAC38RF83/93/85 Figure 5. NSD vs Output Frequency Over Clocking Option 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Measured 50 MHz from carrier 4000 4500 D015 DAC38RF80/90/84 Figure 6. NSD vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 25 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Typical Characteristics (continued) 80 80 -12dBFS -6dBFS 0dBFS 75 70 70 65 HD2 (dBc) HD2 (dBc) 65 60 55 60 55 50 50 45 45 40 40 35 500 -12dBFS -6dBFS 0dBFS 75 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 35 500 4500 1000 1500 D002 DAC38RF83/93/85 Figure 7. HD2 vs Output Frequency Over Input Scale 70 65 HD2 (dBc) HD2 (dBc) Iout=10mA Iout=20mA Iout=30mA Iout=40mA 75 65 60 55 60 55 50 50 45 45 40 40 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 35 500 4500 1000 1500 D010 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D023 D008 DAC38RF80/90/84 Figure 9. HD2 vs Output Frequency Over Output Current IoutFS Figure 10. HD2 vs Output Frequency Over Output Current IoutFS 80 80 On-chip PLL External clock 75 70 70 65 65 60 55 60 55 50 50 45 45 40 40 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 On-chip PLL External clock 75 HD2 (dBc) HD2 (dBc) D018 Figure 8. HD2 vs Output Frequency Over Input Scale Iout=10mA Iout=20mA Iout=30mA Iout=40mA 70 26 4500 80 75 35 500 4000 DAC38RF80/90/84 80 35 500 2000 2500 3000 3500 Output Frequency (MHz) 4500 35 500 D013 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D027 DAC38RF83/93/85 DAC38RF80/90/84 Figure 11. HD2 vs Output Frequency Over Clocking Option Figure 12. HD2 vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Typical Characteristics (continued) 80 75 70 HD3 (dBc) HD3 (dBc) 65 60 55 50 -12dBFS -6dBFS 0dBFS 45 40 35 500 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 -12dBFS -6dBFS 0dBFS 1000 1500 D004 DAC38RF83/93/85 HD3 (dBc) 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 D013 Iout=10mA Iout=20mA Iout=30mA Iout=40mA 1000 1500 D024 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D014 DAC38RF83/93/85 DAC38RF80/90/84 Figure 15. HD3 vs Output Frequency Over Output Current IoutFS Figure 16. HD3 vs Output Frequency Over Output Current IoutFS 80 80 75 75 70 70 65 65 HD3 (dBc) HD3 (dBc) HD3 (dBc) 1500 4500 Figure 14. HD3 vs Output Frequency Over Input Scale Iout=10mA Iout=20mA Iout=30mA Iout=40mA 1000 4000 DAC38RF80/90/84 Figure 13. HD3 vs Output Frequency Over Input Scale 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 2000 2500 3000 3500 Output Frequency (MHz) 60 55 55 50 50 45 45 On-chip PLL External clock 40 35 500 60 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 On-chip PLL External clock 40 4500 35 500 D014 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D015 DAC38RF83/93/85 DAC38RF80/90/84 Figure 17. HD3 vs Output Frequency Over Clocking Option Figure 18. HD3 vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 27 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 80 80 75 75 70 70 65 65 SFDR (dBc) SFDR (dBc) Typical Characteristics (continued) 60 55 50 40 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 40 4000 35 500 4500 1000 1500 D032 D001 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) Excludes HD2, HD3 and CMP2 4000 4500 D032 D001 DAC38RF80/90/84 Figure 19. SFDR vs Output Frequency Over Input Scale Figure 20. SFDR vs Output Frequency Over Input Scale 80 80 75 75 70 70 65 65 60 55 50 40 35 500 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Excludes HD2, HD3 and CMP2 4000 60 55 45 40 35 500 4500 1000 1500 D022 DAC38RF83/93/85 75 75 70 70 65 65 SFDR (dBc) 80 55 50 4000 4500 D022 DAC38RF80/90/84 Figure 22. SFDR vs Output Frequency Over Output Current IoutFS 80 60 2000 2500 3000 3500 Output Frequency (MHz) Excludes HD2, HD3 and CMP2 Figure 21. SFDR vs Output Frequency Over Output Current IoutFS On-chip PLL External clock 60 55 50 On-chip PLL External clock 45 45 40 35 500 Iout=10mA Iout=20mA Iout=30mA Iout=40mA 50 Iout=10mA Iout=20mA Iout=30mA Iout=40mA 45 SFDR (dBc) 55 45 SFDR (dBc) SFDR (dBc) Excludes HD2, HD3 and CMP2 40 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Excludes HD2, HD3 and CMP2 4000 4500 35 500 D026 DAC38RF83/93/85 Figure 23. SFDR vs Output Frequency Over Clocking Option 28 60 50 -12dBFS -6dBFS 0dBFS 45 35 500 -12dBFS -6dBFS 0dBFS 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) Excludes HD2, HD3 and CMP2 4000 4500 D026 DAC38RF80/90/84 Figure 24. SFDR vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 SFDR (dBc) SFDR (dBc) Typical Characteristics (continued) -12dBFS -6dBFS 0dBFS 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) ±250 MHz Span 4000 4500 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) SFDR (dBc) ± 250 MHz Span 4000 4500 DAC38RF83/93/85 2000 2500 3000 3500 Output Frequency (MHz) SFDR (dBc) ± 250 MHz Span 4000 4500 1000 1500 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 Figure 29. SFDR vs Output Frequency Over Clocking Option 4500 D032 DAC38RF80/90/84 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D008 DAC38RF80/90/84 On-chip PLL External clock 1000 1500 D026 DAC38RF83/93/85 4000 Figure 28. SFDR vs Output Frequency Over Output Current IoutFS SFDR (dBc) 1500 2000 2500 3000 3500 Output Frequency (MHz) Iout=10mA Iout=20mA Iout=30mA Iout=40mA ± 250 MHz Span On-chip PLL External clock 1000 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 D008 Figure 27. SFDR vs Output Frequency Over Output Current IoutFS 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 1500 Figure 26. SFDR vs Output Frequency Over Input Scale SFDR (dBc) 1500 1000 ±250 MHz Span Iout=10mA Iout=20mA Iout=30mA Iout=40mA 1000 -12dBFS -6dBFS 0dBFS D032 Figure 25. SFDR vs Output Frequency Over Input Scale 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 100 95 90 85 80 75 70 65 60 55 50 45 40 35 500 ± 250M Hz Span 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D026 DAC38RF80/90/84 Figure 30. SFDR vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 29 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Typical Characteristics (continued) 80 90 75 85 80 70 75 IMD3 (dBc) IMD3 (dBc) 65 60 55 50 45 40 35 500 -18dBFS -12dBFS -6dBFS 0dBFS 70 65 60 55 -18dBFS -12dBFS -6dBFS 0dBFS 50 45 40 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 35 500 4500 1000 D006 1500 2000 2500 3000 3500 Output Frequency (MHz) Figure 31. IMD3 vs Output Frequency Over Input Scale Figure 32. IMD3 vs Output Frequency Over Input Scale 80 80 75 75 70 70 65 65 60 45 40 500 1000 1500 60 55 Iout=10mA Iout=20mA Iout=30mA Iout=40mA 50 Iout=10mA Iout=20mA Iout=30mA Iout=40mA 50 45 40 2000 2500 3000 3500 Output Frequency (MHz) 4000 35 500 4500 1000 1500 D009 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D007 DAC38RF83/93/85 DAC38RF80/90/84 Figure 33. IMD3 vs Output Frequency Over Output Current IoutFS Figure 34. IMD3 vs Output Frequency Over Output Current IoutFS 80 80 On-chip PLL External clock 75 70 70 65 65 60 55 60 55 50 50 45 45 40 40 35 500 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 On-chip PLL External clock 75 IMD3 (dBc) IMD3 (dBc) D006 85 55 4500 35 500 D016 DAC38RF83/93/85 Figure 35. IMD3 vs Output Frequency Over Clocking Option 30 4500 DAC38RF80/90/84 HD3 (dBc) IMD3 (dBc) DAC38RF83/93/85 4000 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 4500 D030 DAC38RF80/90/84 Figure 36. IMD3 vs Output Frequency Over Clocking Option Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 6 5 4 3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 Output Power (dBm) Output Power (dBm) Typical Characteristics (continued) 0 500 6 5 4 3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 1000 1500 2000 2500 3000 3500 4000 4500 Output Frequency (MHz) D000 Transformer loss not de-embedded 0 DAC38RF80/90/84 Figure 37. Power vs Output Frequency Figure 38. Power vs Output Frequency 90 DAC A to B DAC B to A 86 82 82 78 78 74 70 66 74 70 66 62 62 58 58 54 54 1000 1500 2000 2500 3000 3500 Output Frequency (MHz) 4000 DAC A to B DAC B to A 86 Isolation (dBc) Isolation (dBc) 1000 1500 2000 2500 3000 3500 4000 4500 Output Frequency (MHz) D017 DAC38RF83/93/85 90 50 500 500 50 500 4500 1000 1500 D002 2000 2500 3000 3500 Output Frequency (MHz) DAC38RF83/93/85 4500 D002 DAC38RF80/90/84 Figure 39. Isolation vs Output Frequency Figure 40. Isolation vs Output Frequency -60 -90 CP=2 CP=3 CP=4 CP=5 CP=6 CP=7 CP=8 CP=9 CP=10 CP=11 CP=12 CP=13 CP=14 CP=15 -100 -120 div4 div3 div2 -100 -110 Phase Noise (dBc) -80 Phase Noise (dBc) 4000 -120 -130 -140 -140 -150 -160 1000 10000 VCO frequency = 8.85 GHz 100000 1000000 Freq offset (Hz) 1E+7 5E+7 -160 1000 10000 100000 1000000 Freq offset (Hz) D027 Measured at 1.8 GHz Figure 41. VCO1 Phase Noise vs Offset Frequency Over Charge pump current 1E+7 5E+7 D028 VCO frequency = 8.85 GHz Figure 42. VCO1 Output Clock Phase Noise vs Offset frequency Over Divider Ratio Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 31 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Typical Characteristics (continued) -100 -80 CP=1 CP=2 CP=3 CP=4 CP=5 CP=6 CP=7 CP=8 CP=9 CP=10 CP=11 CP=12 CP=13 CP=14 CP=15 -120 -110 Phase Noise (dBc) Phase Noise (dBc) -100 div4 div3 div2 -120 -130 -140 -140 -150 -160 1000 10000 100000 1000000 Freq offset (Hz) VCO frequency = 5.9 GHz 1E+7 5E+7 10000 D029 Measured at 1.8 GHz Figure 43. VCO0 Phase Noise vs Offset Frequency Over Charge Pump Current 32 -160 1000 100000 1000000 Freq offset (Hz) 1E+7 5E+7 D030 VCO frequency = 5.9 GHz Figure 44. VCO0 Output clock Phase Noise vs Offset Frequency Over Divider Ratio Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8 Detailed Description 8.1 Overview The DAC38RFxx is a family of high-performance, dual/single-channel, 14-bit, 9-GSPS, RF-sampling digital-toanalog converters (DACs) that are capable of synthesizing wideband signals from 0 to 4.5 GHz. A high dynamic range allows the DAC38RFxx family to generate signals for a wide range of applications including 3G/4G signals for wireless base-stations. The devices feature a low-power JESD204B Interface with up to 8 lanes, and provides a maximum bit rate and input data rate of 12.5 Gbps and 1.25 GSPS complex per channel respectively. The DAC38RFxx provides two digital up-converters per channel, with multiple options for interpolation rates. A digital quadrature modulator with independent, frequency flexible NCOs are available to support multi-band operation. An optional low-jitter PLL/VCO simplifies the DAC sampling clock generation by allowing use of a lower frequency reference clock. DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 8.2 Functional Block Diagrams CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Multi-band DUC Channel 2 (multi-DUC2) SYSREF+ SYSREF- I RX[4..7]+ Q JESD Interface SYNC2\+ SYNC2\VDDT1 VDDR18 RX[0..3]+ VOUT2 14-b DAC x sin(x) I RX[4..7]- VDDTX18 DACB Gain NCO 4 VDDOUT18 Q NCO 3 0.9 V Ref NCO 1 EXTIO RBIAS TESTMODE I Q RX[0..3]- I SYNC1\+ Q VEE18N DACA Gain NCO 2 SYNC1\- VOUT1 14-b DAC x sin(x) VDDA18 Multi-band DUC Channel 1 (multi-DUC1) VDDS18 ATEST AMUX0/1 Temp Sensor TRST\ TMS TCLK GPI1 GPI0 GPO1 GPO0 TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDENB SDIO SDO GND VDDIO18 JTAG TDI Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 45. DAC38RF80 Block Diagram Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 33 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 Functional Block Diagrams (continued) CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Multi-band DUC Channel 2 (multi-DUC2) SYSREF+ SYSREF- I RX[4..7]+ Q JESD Interface SYNC2\+ SYNC2\VDDT1 VDDR18 RX[0..3]+ 14-b DAC x sin(x) I RX[4..7]- VDDTX18 DACB Gain NCO 3 100: VOUT2+ VOUT2- Q NCO 4 0.9 V Ref NCO 1 EXTIO RBIAS TESTMODE I Q RX[0..3]- I SYNC1\+ Q 14-b DAC x sin(x) VDDA18 Multi-band DUC Channel 1 (multi-DUC1) VDDS18 VOUT1+ VOUT1VEE18N DACA Gain NCO 2 SYNC1\- 100: ATEST AMUX0/1 Temp Sensor TRST\ TMS TCLK GPI1 GPI0 GPO1 GPO0 TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDENB SDIO SDO VDDIO18 GND JTAG TDI Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 46. DAC38RF83 Block Diagram 34 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 Functional Block Diagrams (continued) CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Single-band DUC Channel VDDTX18 SYSREF+ SYSREFI RX[4..7]+ Q SYNC2\+ SYNC2\VDDT1 VDDR18 VDDOUT18 NCO 2 JESD Interface RX[4..7]- 0.9 V Ref EXTIO RBIAS TESTMODE RX[0..3]+ I RX[0..3]- Q VOUT1 14-b DAC x sin(x) NCO 1 SYNC1\+ VEE18N DACA Gain SYNC1\- VDDA18 VDDS18 ATEST AMUX0/1 Temp Sensor TRST\ TMS TDI GPI1 GPI0 GPO1 GPO0 TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDENB SDO SDIO GND VDDIO18 JTAG TCLK Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 47. DAC38RF84 Block Diagram Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 35 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 Functional Block Diagrams (continued) CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Single-band DUC Channel VDDTX18 SYSREF+ SYSREFI RX[4..7]+ Q SYNC2\+ SYNC2\VDDT1 VDDR18 VDDOUT18 NCO 2 JESD Interface RX[4..7]- 0.9 V Ref RX[0..3]+ I RX[0..3]- Q 14-b DAC x sin(x) 100: EXTIO RBIAS TESTMODE VOUT1+ VOUT1- NCO 1 SYNC1\+ VEE18N DACA Gain SYNC1\- VDDA18 VDDS18 ATEST AMUX0/1 Temp Sensor TRST\ TMS TCLK GPI1 GPI0 GPO1 GPO0 TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDENB SDIO SDO VDDIO18 GND JTAG TDI Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 48. DAC38RF85 Block Diagram 36 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 Functional Block Diagrams (continued) CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Single-band DUC Channel 2 VDDTX18 DACB Gain SYSREF+ SYSREFI RX[4..7]+ VOUT2 14-b DAC x sin(x) Q SYNC2\+ SYNC2\VDDT1 VDDR18 VDDOUT18 NCO 2 JESD Interface RX[4..7]- 0.9 V Ref Single-band DUC Channel 1 I RX[0..3]+ RX[0..3]- Q VOUT1 14-b DAC x sin(x) EXTIO RBIAS TESTMODE NCO 1 SYNC1\+ VEE18N DACA Gain SYNC1\- VDDA18 VDDS18 ATEST AMUX0/1 Temp Sensor TRST\ TMS TDI GPI1 GPI0 GPO1 GPO0 TESTMODE SLEEP ALARM RESETB TXENABLE SCLK SDENB SDIO SDO VDDIO18 GND JTAG TCLK Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 49. DAC38RF90 Block Diagram Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 37 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com DACCLK+ Low Jitter PLL DACCLKDACCLKSE VDDL2_1 VDDL1_1 VDDA1 VDDE1 VDDDIG1 VDDAVCO18 VDDAPLL1 VDDAPLL18 VDDCLK1 Functional Block Diagrams (continued) CLKTX+ Divider /2, /3, /4 Clock Distribution CLKTXVDDTX1 Single-band DUC Channel 2 VDDTX18 DACB Gain SYSREF+ SYSREFI RX[4..7]+ 14-b DAC x sin(x) 100: Q SYNC2\+ SYNC2\VDDT1 VDDR18 0.9 V Ref RX[0..3]+ I RX[0..3]- Q VOUT2VDDOUT18 NCO 2 JESD Interface RX[4..7]- VOUT2+ 14-b DAC x sin(x) 100: EXTIO RBIAS TESTMODE VOUT1+ VOUT1- NCO 1 SYNC1\+ VEE18N DACA Gain SYNC1\- VDDA18 Single-band DUC Channel 1 VDDS18 ATEST AMUX0/1 Temp Sensor TRST\ TMS TCLK GPI1 GPI0 GPO1 GPO0 TESTMODE ALARM SLEEP RESETB TXENABLE SCLK SDENB SDIO SDO VDDIO18 GND JTAG TDI Control Interface VSENSE TDO IFORCE Copyright © 2016, Texas Instruments Incorporated Figure 50. DAC38RF93 Block Diagram 38 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3 Feature Description 8.3.1 SerDes Inputs The DAC38RFxx RX [0..7]+/- differential inputs are each internally terminated to a common point via 50 Ω, as shown in Figure 51. RXP 0.7V 50O TERM =001 50pF TERM =100 TERM =101 Level Shift To Equalizer & Samplers 50O 0.25V RXN Figure 51. Serial Lane Input Termination Common mode termination is via a 50 pF capacitor to GND. The common mode voltage and termination of the differential signal can be controlled in a number of ways to suit a variety of applications via field TERM in register SRDS_CFG2 (8.5.87), as described in Table 1. NOTE AC coupling is recommended for JESD204B compliance. Table 1. Receiver Termination Selection TERM EFFECT 000 Reserved 001 Common point set to 0.7 V. This configuration is for AC coupled systems. The transmitter has no effect on the receiver common mode, which is set to optimize the input sensitivity of the receiver. Note: this mode is not compatible with JESD204B. 01x Reserved 100 Common point set to GND. This configuration is for applications that require a 0 V common mode. 101 Common point set to 0.25 V. This configuration is for applications that require a low common mode. 110 Reserved 111 Common point floating. This configuration is for DC coupled systems in which the common mode voltage is set by the attached transmit link partner to 0 and 0.6 V. Note: this mode is not compatible with JESD204B Input data is sampled by the differential sensing amplifier using clocks derived from the clock recovery algorithm. The polarity of RX+ and RX- can be inverted by setting the bit of the corresponding lane in field INVPAIR in register SRDS_POL (8.5.88) to “1”. This can potentially simplify PCB layout and improve signal integrity by avoiding the need to swap over the differential signal traces. Due to processing effects, the devices in the RX+ and RX- differential sense amplifiers will not be perfectly matched and there will be some offset in switching threshold. The DAC38RFxx contains circuitry to detect and correct for this offset. This feature can be enabled by setting ENOC in register SRDS_CFG1 (8.5.86) to “1”. It is anticipated the most users will enable this feature. During the compensation process, LOOPBACK in register SRDS_CFG1 (8.5.86) must be set to “00”. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 39 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.2 SerDes Rate The DAC38RFxx has eight configurable JESD204B serial lanes. The highest speed of each SerDes lane is 12.5 Gbps. Because the primary operating frequency of the SerDes is determined by its reference clock and PLL multiplication factor, there is a limit on the lowest SerDes rate supported. To support lower speed application, each receiver should be configured to operate at half, quarter or eighth of the full rate via field RATE in register SRDS_CFG2 (8.5.87). Refer to Table 2 for details. Table 2. Lane Rate Selection RATE EFFECT 00 Full rate. Four data samples taken per SerDes PLL output clock cycle. 01 Half rate. Two data samples taken per SerDes PLL output clock cycle. 10 Quarter rate. One data samples taken per SerDes PLL output clock cycle. 11 Eighth rate. One data samples taken every two SerDes PLL output clock cycles. 8.3.3 SerDes PLL The DAC38RFxx has two integrated PLLs, one PLL is to provide the clocking of DAC; the other PLL is to provide the clocking for the high speed SerDes. The reference frequency of the SerDes PLL can be in the range of 100800 MHz nominal, and 300-800 MHz optimal. The reference frequency is derived from DACCLK divided down by the value in field SerDes_REFCLK_DIV in register SRDS_CLK_CFG (8.5.84), as shown in Figure 52. Field SerDes_CLK_SEL in register SRDS_CLK_CFG (8.5.84) determines if the DACCLK input or DAC PLL output is used as the source of the SerDes PLL reference. If the DACCLK input is used, a pre-divider set by field SerDes_REFCLK_PREDIV in register SRDS_CLK_CFG (8.5.84) should be used to reduce the frequency of the DACCLK. SERDES_REFCLK_PREDIV 0 Predivider DACCLK+ divider 0 SERDES PLL REFCLK DACCLKDAC PLL DACCLKSE 1 1 SERDES_REFCLK_DIV SERDES_REFCLK_SEL SEL_EXTCLK_DIFFSE Figure 52. Reference Clock of SerDes PLL During normal operation, the clock generated by PLL is 4-25 times the reference frequency, according to the multiply factor selected via the field MPY] in register SRDS_PLL_CFG (8.5.85). In order to select the appropriate multiply factor and reference clock frequency, it is first necessary to determine the required PLL output clock frequency. The relationship between the PLL output clock frequency and the lane rate is determined by field RATE in register SRDS_CFG2 (8.5.87) is shown in Table 3. Having computed the PLL output frequency, the reference frequency can be obtained by dividing this by the multiply factor specified via MPY. 40 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 3. RATE LINE RATE PLL OUTPUT FREQUENCY 00 x Gbps 0.25x GHz 01 x Gbps 0.5x GHz 10 x Gbps 1x GHz 11 x Gbps 2x GHz Table 4. SerDes PLL Modes Selection MPY EFFECT 0x20 4x 0x28 5x 0x30 6x 0x40 8x 0x42 8.25x 0x50 10x 0x60 12x 0x64 12.5x 0x78 15x 0x80 16x 0x84 16.5x 0xA0 20x 0xB0 22x 0xC8 25x Other codes Reserved The wide range of multiply factors combined with the different rate modes means it is often possible to achieve a given line rate from multiple different reference frequencies. The configuration which utilizes the highest reference frequency achievable is always preferable. The SerDes PLL VCO must be in the nominal range of 1.5625 - 3.125 GHz. It is necessary to adjust the loop filter depending on the operating frequency of the VCO. If the PLL output frequency is below 2.17 GHz, VRANGE in register SRDS_PLL_CFG (8.5.84) should be set high. Performance of the integrated PLL can be optimized according to the jitter characteristics of the reference clock by setting the appropriate loop bandwidth via field LB in register SRDS_PLL_CFG (8.5.84). The loop bandwidth is obtained by dividing the reference frequency by BWSCALE, where the BWSCALE is a function of both LB and PLL output frequency as shown in Table 5. Table 5. SerDes PLL Loop Bandwidth Selection LB EFFECT BWSCALE vs PLL OUTPUT FREQUENCY 3.125 GHz 2.17 GHz 1.5625 GHz 16 00 Medium loop bandwidth 13 14 01 Ultra high loop bandwidth 7 8 8 10 Low loop bandwidth 21 23 30 11 High loop bandwidth 10 11 14 An approximate loop bandwidth of 8 – 30 MHz is suitable and recommended for most systems where the reference clock is via low jitter clock input buffer. For systems where the reference clock is via a low jitter input cell, but of low quality, an approximate loop bandwidth of less than 8 MHz may offer better performance. For systems where the reference clock is cleaned via an ultra-low jitter LC-based cleaner PLL, a high loop bandwidth up to 60 MHz is more appropriate. Note that the use of ultra-high loop bandwidth setting is not recommended for PLL multiply factor of less than 8. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 41 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com A free running clock output is available when field ENDIVCLK in register SRDS_PLL_CFG (8.5.85) is set high. It runs at a fixed divided-by-80 of the PLL output frequency and can be output on the ALARM pin by setting field DTEST to “0001” (lanes 0 – 3) or “0010” (lanes 4 – 7) in register DTEST (8.5.76). 8.3.4 SerDes Equalizer All channels of the DAC38RFxx incorporate an adaptive equalizer, which can compensate for channel insertion loss by attenuating the low frequency components with respect to the high frequency components of the signal, thereby reducing inter-symbol interference. Figure 53 shows the response of the equalizer, which can be expressed in terms of the amount of low frequency gain and the frequency up to which this gain is applied (i.e., the frequency of the ’zero’). Above the zero frequency, the gain increases at 6 dB/octave until it reaches the high frequency gain. dB Gain 6 -6.3 108 Log10MHz 414 Frequency Figure 53. Equalizer Frequency Response The equalizer can be configured via fields EQ and EQHLD in register SRDS_CFG1 (8.5.86). Table 6 and Table 7 summarize the options. When enabled, the receiver equalization logic analyzes data patterns and transition times to determine whether the low frequency gain should be increased or decreased. The decision logic is implemented as a voting algorithm with a relatively long analysis interval. The slow time constant that results reduces the probability of incorrect decisions but allows the equalizer to compensate for the relatively stable response of the channel. The lock time for the adaptive equalizer is data dependent, and so it is not possible to specify a generally applicable absolute limit. However, assuming random data, the maximum lock time will be 6x106 divided by the CDR activity level. For field CDR in register SRDS_CFG1 (8.5.86) = 110, the activity level is 1.5 x 106 UI. When EQ = 0, finer control of gain boost is available using the EQBOOST IEEE1500 tuning chain field, as shown in Table 8. Table 6. Receiver Equalization Configuration EQ EFFECT 00 No equalization. The equalizer provides a flat response at the maximum gain. This setting may be appropriate if jitter at the receiver occurs predominantly as a result of crosstalk rather than frequency dependent loss. 01 Fully adaptive equalization. The zero position is determined by the selected operating rate, and the low frequency gain of the equalizer is determined algorithmically by analyzing the data patterns and transition positions in the received data. This setting should be used for most applications. 10 Precursor equalization analysis. The data patterns and transition positions in the received data are analyzed to determine whether the transmit link partner is applying more or less precursor equalization than necessary. 11 Postcursor equalization analysis. The data patterns and transition positions in the received data are analyzed to determine whether the transmit link partner is applying more or less post-cursor equalization than necessary. [1-0] 42 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 6. Receiver Equalization Configuration (continued) EQ [2] EFFECT 0 Default 1 Boost. Equalizer gain boosted by 6 dB, with a 20% reduction in bandwidth, and an increase of 5mW power consumption. May improve performance over long links. Table 7. Receiver Equalizer Hold EQHOLD EFFECT 0 Equalizer adaption enabled. The equalizer adaption and analysis algorithm is enabled. This should be the default state. 1 Equalizer adaption held. The equalizer is held in its current state. Additionally, the adaption and analysis algorithm is reset. Table 8. Relationship Between Lane Rate and SerDes PLL Output Frequency EQBOOST GAIN BOOST (dB) BANDWIDTH CHANGE (%) POWER INCREASE (mW) 00 0 0 0 01 2 -30 0 01 4 10 5 11 6 -20 5 When EQ is set to 010 or 011, the equalizer is reconfigured to provide analytical data about the amount of pre and post cursor equalization respectively present in the received signal. This can in turn be used to adjust the equalization settings of the transmitting link partner, where a suitable mechanism for communicating this data back to the transmitter exists. Status information is provided by setting field DTEST in register DTEST (8.5.76) to “0111” for EQOVER and “0110” for EQUNDER. The procedure is as follows: 1. Enable the equalizer by setting fields EQHLD low and EQ to “001” (register SRDS_CFG1 8.5.86). Allow sufficient time for the equalizer to adapt; 2. Set EQHLD to 1 to lock the equalizer and reset the adaption algorithm. This also causes both EQOVER and EQUNDER to become low; 3. Wait at least 48 UI, and proportionately longer if the CDR activity is less than 100%, to ensure the 1 on EQHLD is sampled and acted upon; 4. Set EQ to “010” or “011”, and EQHLD to 0. The equalization characteristics of the received signal are analysed (the equalizer response will continue to be locked); 5. Wait at least 150 × 103 UI to allow time for the analysis to occur, proportionately longer if the CDR activity is less than 100%; 6. Examine EQOVER and EQUNDER for results of analysis – If EQOVER is high, it indicates the signal is over equalized; – If EQUNDER is high, it indicates the signal is under equalized; 7. Set EQHLD to 1; 8. Repeat items 3–7 if required; 9. Set EQ to “001”, and EQHLD to 0 to exit analysis mode and return to normal adaptive equalization. NOTE When changing EQ from one non-zero value to another, EQHLD must already be 1. If this is not the case, there is a chance the equalizer could be reset by a transitory input state (i.e., if EQ is momentarily 000). EQHLD can be set to 0 at the same time as EQ is changed. As the equalizer adaption algorithm is designed to equalize the post cursor, EQOVER or EQUNDER will only be set during post cursor analysis if the amount of post cursor equalization required is more or less than the adaptive equalizer can provide. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 43 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.5 JESD204B Descrambler The descrambler is a 16-bit parallel self-synchronous descrambler based on the polynomial 1 + x14 + x15. From the JESD204B specification, the scrambling/descrambling process only occurs on the user data, not on the code group synchronization or the ILA sequence. Each multi-DUC has a separate descrambler that can be enabled independently. The descrambler is enabled by field SCR in the multi-DUC paged register JESD_N_HD_SCR (8.5.49). 8.3.6 JESD204B Frame Assembly The DAC38RFxx may be programmed as a single or dual DAC device, with one JESD RX block designated for each DAC. The two JESD RX blocks can be programmed to operate as two separate links or as a single link. The JESD204B defines the following parameters: • L is the number of lanes • M is the number of I or Q streams per device (2 = 1 IQ pair, 4 = 2 IQ pairs, 8 = 4 IQ pairs) • F is the number of octets per frame clock period • S is the number of samples per frame • HD is the High-Density bit which controls whether a sample may be divided over more lanes • N = NPRIME is the number of bits per sample (12 or 16 - bits) Fields K and L are found in multi-DUC paged register JESD_K_L (8.5.46), M and S in multi-DUC paged register JESD_M_S (8.5.48), and N, NPRIME and HD in multi-DUC paged register JESD_N_HD_SCR (8.5.49). Table 9 lists the available JESD204B formats, interpolation rates and sample rate limits for the DAC38RFxx. The ranges are limited by the SerDes PLL VCO frequency range, the SerDes PLL reference clock range, the maximum SerDes line rate, and the maximum DAC sample frequency. Table 10 through Table 22 lists the frame formats for each mode. In the frame format tables, i CH (N) [x:y] and q CH (N) [x:y] are bits x through y of the I and Q samples at time N of DUC channel CH. If [x..y] is not listed, the full sample is assumed. For example, i0(0)[15:8] are bits 15 – 8 of the I sample at time 0 of DUC #0, and q1(1) is the full Q sample at time 1 of DUC #1. Table 9. JESD204B Formats for DAC38RFxx L-M-F-S-Hd 1 TX 82121 42111 22210 12410 44210 44 L-M-F-S-Hd 2 TX Frame Format NA 1 TX: Table 10 84111 44210 24410 88210 1 TX: Table 11 2 TX: Table 12 1 TX: Table 13 2 TX: Table 14 1 TX: Table 15 2 TX: Table 16 1 TX: Table 17 2 TX: Table 18 Input Resolution IQ Pairs Per DAC Interp Input Rate Max (MSPS) fDAC Max (MSPS) 16 1 6 1250 7500 √ 16 1 8 1125 9000 √ 16 1 12 750 9000 √ √ √ √ 16 1 16 562.5 9000 √ √ √ √ 16 1 6 1250 7500 √ √ 16 1 8 1125 9000 √ √ 16 1 10 900 9000 √ 16 1 12 750 9000 √ √ √ √ 16 1 16 562.5 9000 √ √ √ √ 16 1 18 500 9000 √ √ √ √ 16 1 24 375 9000 √ √ √ √ 16 1 8 625 5000 √ 16 1 12 625 7500 √ √ √ √ 16 1 16 562.5 9000 √ √ √ √ 16 1 18 500 9000 √ √ √ √ 16 1 20 450 9000 √ √ √ √ 16 1 24 375 9000 √ √ √ √ 16 1 16 312.5 5000 √ √ √ √ 16 1 24 312.5 7500 √ √ √ √ 16 2 8 625 5000 √ √ 16 2 12 625 7500 √ √ √ 16 2 16 562.5 9000 √ √ √ 16 2 24 375 9000 √ √ √ Submit Documentation Feedback DAC38RF83, DAC38RF80 DAC38RF93, DAC38RF90 DAC38RF85 (1 TX only) DAC38RF84 (1 TX only) √ √ √ √ Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 9. JESD204B Formats for DAC38RFxx (continued) L-M-F-S-Hd 1 TX L-M-F-S-Hd 2 TX Frame Format Input Resolution IQ Pairs Per DAC Interp Input Rate Max (MSPS) fDAC Max (MSPS) 2 16 312.5 5000 48410 1 TX: Table 19 2 TX: Table 20 16 24410 16 2 24 312.5 12 2 24 375 24310 48310 1 TX: Table 21 2 TX: Table 22 DAC38RF83, DAC38RF80 DAC38RF93, DAC38RF90 DAC38RF85 (1 TX only) DAC38RF84 (1 TX only) √ √ √ 7500 √ √ √ 9000 √ √ √ Table 10. JESD204B Frame Format for LMFSHd = 82121 # un bits 4 8 # en bits 5 10 Nibble 1 2 lane RX0 i0[15:8] lane RX1 i0[7:0] lane RX2 i1[15:8] lane RX3 i1[7:0] lane RX4 q0[15:8] lane RX5 q0[7:0] lane RX6 q1[15:8] lane RX7 q1[7:0] Table 11. JESD204B Frame Format for LMFSHd = 42111 # un bits 4 8 # en bits 5 10 Nibble 1 2 lane RX0 i0[15:8] lane RX1 i0[7:0] lane RX2 q0[15:8] lane RX3 q0[7:0] Table 12. JESD204B Frame Format for LMFSHd = 84111 (1) (2) # un bits 4 8 # en bits 5 10 Nibble 1 2 (1) lane RX0 A-i0[15:8] lane RX1 A-i0[7:0] (2) lane RX2 A-q0[15:8] lane RX3 A-q0[7:0] lane RX4 B-i0[15:8] lane RX5 B-i0[7:0] lane RX6 B-q0[15:8] lane RX7 B-q0[7:0] DAC A, I sample 0, MSB byte DAC A, I sample 0, LSB byte Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 45 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Table 13. JESD204B Frame Format for LMFSHd = 22210 # un bits 4 8 12 16 # en bits 5 10 15 20 Nibble 1 2 3 4 lane RX0 i0 lane RX1 q0 Table 14. JESD204B Frame Format for LMFSHd = 44210 (1) # un bits 4 8 12 16 # en bits 5 10 15 20 Nibble 1 2 3 4 lane RX0 A-i0 (1) lane RX1 A-q0 lane RX2 B-i0 lane RX3 B-q0 DAC A, I sample 0 Table 15. JESD204B Frame Format for LMFSHd = 12410 # un bits 4 8 12 16 20 24 28 32 # en bits 5 10 15 20 25 30 35 40 Nibble 1 2 3 4 5 6 7 8 lane RX0 i0 q0 Table 16. JESD204B Frame Format for LMFSHd = 24410 # un bits 4 8 12 16 20 24 28 32 # en bits 5 10 15 20 25 30 35 40 Nibble 1 2 3 4 5 6 7 8 lane RX0 A-i0 lane RX1 (1) (1) A-q0 B-i0 B-q0 DAC A, I sample 0 Table 17. JESD204B Frame Format for LMFSHd = 44210 (1) (2) # un bits 4 8 12 16 # en bits 5 10 15 20 Nibble 1 2 3 4 (1) lane RX0 A1-i0 lane RX1 A1-q0 (2) lane RX2 A2-i0 lane RX3 A2-q0 DAC A, MultiDUC 1, I sample 0 DAC A, MultiDUC 2, I sample 0 Table 18. JESD204B Frame Format for LMFSHd = 88210 (1) 46 # un bits 4 8 12 16 # en bits 5 10 15 20 Nibble 1 2 3 4 lane RX0 A1-i0 (1) lane RX1 A1-q0 DAC A, MultiDUC 1, I sample 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 18. JESD204B Frame Format for LMFSHd = 88210 (continued) lane RX2 A2-i0 lane RX3 A2-q0 lane RX4 B1-i0 lane RX5 B1-q0 lane RX6 B2-i0 lane RX7 B1-q0 Table 19. JESD204B Frame Format for LMFSHd = 24410 # un bits 4 8 12 16 20 24 28 32 # en bits 5 10 15 20 25 30 35 40 Nibble 1 2 3 4 5 6 7 8 lane RX0 A1-i0 (1) A1-q0 lane RX1 A2-i0 A2-q0 (1) DAC A, MultiDUC 1, I sample 0 Table 20. JESD204B Frame Format for LMFSHd = 48410 # un bits 4 8 12 16 20 24 28 32 # en bits 5 10 15 20 25 30 35 40 Nibble 1 2 3 4 5 6 7 8 lane RX0 A1-i0 (1) A1-q0 lane RX1 A2-i0 A2-q0 lane RX2 B1-i0 B1-q0 lane RX3 B2-i0 B2-q0 (1) DAC A, MultiDUC 1, I sample 0 Table 21. JESD204B Frame Format for LMFSHd = 24310 (1) # un bits 4 8 12 16 20 24 # en bits 5 10 15 20 25 30 Nibble 1 2 3 4 5 6 lane RX0 A1-i0 (1) A1-q0 lane RX1 A2-i0 A2-q0 DAC A, MultiDUC 1, I sample 0 Table 22. JESD204B Frame Format for LMFSHd = 48310 # un bits 4 8 12 16 20 24 # en bits 5 10 15 20 25 30 Nibble 1 2 3 4 5 6 lane RX0 (1) A1-i0 (1) A1-q0 lane RX1 A2-i0 A2-q0 lane RX2 B1-i0 B1-q0 lane RX3 B2-i0 B2-q0 DAC A, MultiDUC 1, I sample 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 47 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.7 SYNC Interface The DAC38RFxx JESD204B interface has two differential SYNC outputs called SYNC0 and SYNC1 to support one or two links. Alternatively, GPO0 and GPO1 can be used to output SYNC as a single-ended CMOS level. Each of the differential or CMOS outputs is enabled by a 2-bit register (fields GPO0_SEL, GPO1_SEL, SYNC0B_SEL, SYNC1B_SEL in register IO_CONFIG 8.5.2), with bit 0 enabling multi-DUC1 SYNC and bit 1 enabling multi-DUC2 SYNC. If both are enabled, the SYNC\ signals are OR’ed. The SYNC signal can be asserted low by the receiver either to make a synchronization request to initialize/reinitialize the link or to report an error to the transmitter. Synchronization requests must have a minimum duration of five frames plus nine octets rounded up to the nearest whole number of frames. To report an error, the SYNC signal is asserted for exactly two frames. The transmitter interprets any negative edge of its SYNC input as an error and any SYNC assertion lasting four frames or longer as a synchronization request. See the following sections in the standard for more details. • 7.6.3 Errors requiring re-initialization • 7.6.4 Error reporting via SYNC interface • 8.4 SYNC signal decoding 8.3.8 Single or Dual Link Configuration The DAC38RFxx JESD204B interface can be configures with one or two links. The advantage of using two links, one for each DAC, is that one link can be re-established without affecting the other link and DAC. The configuration for each mode of operation are: 1. Dual DAC, dual link (a) Program fields OCTETPATH0_SEL to OCTETPATH7_SEL in multi-DUC paged registers JESD_CROSSBAR1 (8.5.57) and JESD_CROSSBAR2 (8.5.58) so that each multi-DUC will pick data off of the appropriate SerDes lane. (b) Appropriate bits in field LANE_ENA in multi-DUC paged register JESD_LN_EN (8.5.45) must be set for each multi-DUC enable the lanes used. (c) Field ONE_DAC_ONLY in register RESET_CONFIG (8.5.1) should be ‘0’ (default). 2. Dual DAC, single link (a) Program OCTETPATH0_SEL to OCTETPATH7_SEL in multi-DUC paged registers JESD_CROSSBAR1 (8.5.57) and JESD_CROSSBAR2 (8.5.58) so that each multi-DUC will pick data off the appropriate SerDes lane. (b) Appropriate bits in field LANE_ENA in multi-DUC paged register JESD_LN_EN (8.5.45) must be set for each multi-DUC enable the lanes used. (c) Set field ONE_LINK_ONLY to ‘1’ to configure TXENABLE output. 3. Single DAC, single link (a) Set Field ONE_DAC_ONLY in register RESET_CONFIG (8.5.1) to ‘1’ to gate clocks to unused multiDUC2 for power savings. (b) ONE_LINK_ONLY bit does not matter in this case. 48 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.9 Multi-Device Synchronization In many applications, such as multi antenna systems where the various transmit channels information is correlated, it is required that the latency across the link is deterministic and multiple DAC devices are completely synchronized such that their outputs are phase aligned. The DAC38RFxx achieves the deterministic latency using SYSREF (JESD204B Subclass 1). SYSREF is generated from the same clock domain as DACCLK. After having resynchronized its local multiframe clock (LMFC) to SYSREF, the DAC will request a link re-initialization via SYNC interface. Processing of the signal on the SYSREF input can be enabled and disabled via the SPI interface. The SYSREF capture circuit and the timing requirements relative to device clock are described in SYSREF Capture Circuit. 8.3.10 SYSREF Capture Circuit The JESD204B standard for Device Subclass 1 introduces a SYSREF signal that can be used as a global timing reference to align the phase of the internal local multiframe clock (LMFC) and frame clock across multiple devices. This allows the system to achieve deterministic latency and align data samples across several data converters. The SYSREF signal accomplishes this goal by identifying a device clock edge for each chip that can be used as an alignment reference. In particular, the LMFC and frame clock align to the device clock edge upon which the SYSREF transition from “0” to “1” is sampled. SYSREF may be periodic, one-shot, or “gapped” periodic and its period must be a multiple of the LMFC period. Figure 54. SYSREF Signal Timing With high-speed device clocks, the phase of the SYSREF signals relative to the device clock must meet the setup/hold time requirements of each individual device clock. Historically, this has been done by controlling the board-level routing delay and/or employing commercial clock distribution capable of generating device clocks and SYSREF signals with programmable delays and with the option of splitting SYSREF into multiple SYSREFS, each with its own fine-tuned delay. Since the DAC38RFxx family supports device clock frequencies up to 9 GHz, a SYSREF capture circuit is includes in the DAC38RFxx that allows a relaxation in meeting the device clock setup and hold. The SYSREF capture circuit provides: • tolerance to manufacturing and environmental variations in SYSREF phase • immunity to sampling errors due to setup/hold/meta-stability • information about phase of SYSREF relative to DAC clock inside the data converter • software compensation for phase misalignment due to PCB design errors The concepts behind the SYSREF capture scheme are illustrated in Figure 55. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 49 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Figure 55. SYSREF Capture Strategy and Phase Tolerance Windows To understand Figure 55, to begin with we’ll ignore the SYSREF phase tolerance windows in the lower portion of the figure and focus on the blue clock waveform at the top of the figure. This waveform represents the device clock input to a particular DAC chip. The green arrows, labeled “R” and “F”, correspond to the rising and falling edges of this clock (ignoring for the moment the additional arrows labeled “ER” and "EF”). Lower frequency devices captured SYSREF only on the rising edge of the device clock, the new scheme samples SYSREF on the falling edge as well, which provides more flexibility when optimizing the setup and hold time of the SYSREF capture path. Moreover, each time a rising SYSREF edge is captured, the chip remembers the clock phase during which the event occurred, and the system designer can later read back the phase information to observe the SYSREF timing relative to the device clock at the internal capture point. If SYSREF transitions close to the rising or falling clock edge sampling points the capture flop setup and hold time may not be met and the observed phase may be unreliable and subject to meta-stability phenomenon. To reduce the sensitivity to setup/hold/meta-stability concerns an “early” version of the device clock is generated within the DAC and additional SYSREF samples are taken at the “early falling” and “early rising” edges of the clock (labeled “EF” and “ER”, respectively, in Figure 55). The resulting set of four samples is used to narrow down the timing of the rising SYSREF edge to one of four possible clock phases. If the rising SYSREF transition takes place between the “EF” and “F” samples, then SYSREF is said to occur in phase θ1. Similarly, if it takes place between the “F” and “ER” samples, then it is said to occur in phase θ2. If SYSREF transitions between the “ER” and “R” samples, then it is said to occur in phase θ3. And, finally, if the SYSREF rising edge event happens between the “R” and “EF” samples, then it is said to occur in phase θ4. As mentioned before, the chip remembers all observed SYSREF phases and the user can later read them back. Since the delay between “early” and “on time” versions of the clock is intentionally chosen to be larger than the setup/hold/meta-stability window, at most one of the four samples can be affected even when the SYSREF transitions right at one of the four sampling points. Thus, the uncertainty in the observed SYSREF timing is limited to adjacent phases, and with twice as many sampling phases the resolution of the timing information is improved by a factor of two. Referring to the lower portion of Figure 55, the user can now see how this information regarding the observed SYSREF phases is used to devise a reliable SYSREF capture methodology with a high degree of tolerance to manufacturing and environmental variations in SYSREF phase. Based on the SYSREF phases observed for a particular DAC chip during system characterization, the system designer can select one of four so-called “phase tolerance window” options (denoted “’00”, “01”, “10”, and “11”) to maximize immunity to manufacturing and environmental variations. For example, consider the default phase tolerance window labeled “window=00” in the figure. If, during characterization, the system designer observes (by reading back the recorded phase observations) that the rising SYSREF edge nominally occurs in either θ1 or θ2 or both (i.e. θ12) then he would 50 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 program that particular DAC chip to use phase tolerance window “00”. This mapping is indicated in the figure with the label “θ1|θ12|θ2: window=00”. Having programmed the device to use window “00”, all future SYSREF events that occur in θ1 or θ2 would trigger the LMFC and frame clock to be aligned using the following rising clock edge as the alignment reference (as indicated by the red arrow pointing to rising clock edge “R” and labeled “Window=00/01 alignment edge”). The full extent of each phase tolerance window is indicated in the figure using “box and whisker” plots. For the “window=00” example, the “box” portion of the plot indicates that the phase tolerance window is centered on θ12 (to be precise on the boundary between θ1 and θ2) and the “whisker” portion indicates that even if the rising edge of SYSREF occurs as early as the preceding θ4 or as late as the following θ3 it still results in LMFC and frame clock alignment to the same rising clock edge indicated by the red arrow labeled “Window=00/01 alignment edge”. When programmed for phase tolerance window “00”, the DAC chip is tolerant to variations in the SYSREF timing ranging from a rising SYSREF edge that occurs just after one rising edge of clock to just before the next rising edge of the clock. The qualifying phrases “just after” and “just before” are used here to indicate that the SYSREF transition must occur far enough away from the rising edges of the clock to avoid setup/hold violations and prevent the device from concluding that the SYSREF transition has crossed out off the phase tolerance window when in fact it has not. The tolerance range for window “00” is from rising clock edge to rising clock edge and is indicated in the figure by the green text labeled “tolerance = R↔R”. Following the above example, if characterization reveals SYSREF timing centered on θ23 then phase tolerance window “01” (with tolerance for SYSREF rising edge events from EF to EF) should be chosen. Notice that this option is tolerant even to rising SYSREF edges that occur after the rising device clock edge (i.e. in θ4) and will treat them just as if they had occurred in one of the earlier three phases, aligning to the same rising device clock edge indicated by the red arrow labeled “Window=00/01 Alignment Edge”. This allows the system designer to tolerate PCB design errors and/or environmental and manufacturing variations – achieving his intended alignment without having to make physical changes to the board to adjust the SYSREF timing. Similarly, if characterization indicates that SYSREF timing is centered on θ34 or θ41 then phase tolerance window “10” or “11” can be selected, resulting in tolerance for “F↔F” or “ER↔ER” SYSREF timing, respectively. Note, however, that in these two cases the alignment reference edge is by default taken to be the subsequent rising edge of the device clock. Since this may not be the desired behavior, the DAC38RFxx allows the user to program in an optional alignment offset of θ1 if the default offset of 0 does not achieve the desired alignment. This feature is illustrated in Figure 56 where the user can see that by setting the alignment offset to -1, phase tolerance windows “10” and “11” can be made to trigger alignment to the earlier rising device clock edge used by windows “00” and “01”. Alternatively, the window “00” and “01” alignment edge can be pushed one cycle later by setting their alignment offset to +1. Figure 56. Optional SYSREF Alignment Offset Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 51 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Several important controls related to SYSREF alignment and capture timing are contained in register SYSR_CAPTURE (8.5.78). For example, as mentioned before, the device is capable of monitoring the observed phases of the rising SYSREF edge events; however, in order to avoid unwanted noise coupling from the SYSREF circuits into the DAC output, the SYSREF monitoring circuits are disabled by default. Field SYSR_STATUS_ENA enables SYSREF status monitoring. Field SYSR_PHASE_WDW contains the the phase tolerance window selected for normal operation, which is optimized during characterization. Field SYSR_ALIGN_DLY contains the control that allows the system designer to optionally offset the SYSREF alignment event by ±1 device clock cycles. Field SYSR_STATUS_ENA enables the SYSREF capture alignment accumulation and will generate alarms when enabled. Writing a “1” to field SYSR_ALIGN_SYNC clears the accumulated SYSREF alignment statistics. The SYSREF alignment block can be bypassed completely by field SYSREF_BYPASS_ALIGN, in which case SYSREF is latched by the rising edge of DACCLK. When field SYSR_STATUS_ENA is high the device records the phase associated with each SYSREF event for use in characterizing the SYSREF capture timing and selecting an appropriate phase tolerance window. The phase data is available in two forms. First, each of the four phases has a corresponding “sticky” alarm flag indicating which phases have been observed since the last time the register was cleared. In addition, the device also accumulates statistics on the relative number of occurrences of each phase spanning multiple SYSREF events using saturating 8-bit counters. These accumulated real-time SYSREF statistics allow us to account for time-varying effects during characterization such as potential timing differences between the 1st and Nth edges in a “gapped” SYSREF pulse train. The counters are fields PHASE1_CNT and PHASE2_CNT in register SYSREF12_CNT (8.5.10), PHASE3_CNT and PHASE4_CNT in register SYSREF34_CNT (8.5.11), and ALIGN_TO_R1_CNT and ALIGN_TO_R3_CNT in register SYSREF_ALIGN_R (8.5.9). The accumulated SYSREF statistics can be cleared by writing ‘1’ to SYSR_ALIGN_SYNC. This sync signal affects only the SYSREF statistics monitors and does not cause a sync of any other portions of the design. Before collecting phase statistics, the user must first enable the SYSREF status monitoring logic by setting the SYSR_STATUS_ENA bit. The user must then generate a repeating SYSREF input before using SYSR_ALIGN_SYNC to clear the statistic counters. This is necessary to flush invalid data out of the status pipeline. The “sticky” alarm flags indicating which of the four phases have been observed since the last SYSR_ALIGN_SYNC write of ‘1’ are fields ALM_SYSRPHASE1 to ALM_SYSRPHASE4 and are contained in the ALM_SYSREF_DET register (8.5.6). 8.3.11 JESD204B Subclass 0 support Some functionality has been implemented to support Subclass 0 operation. Note that programming the SUBCLASSV configuration parameter has no functional impact on the logic. The value programmed for SUBCLASSV is only used in the initial lane alignment (ILA) sequence. The following configuration parameters are used to support Subclass 0 operation: • Field SYSREF_MODE in register JESD_SYSR_MODE (8.5.56) = 0 • Field DISABLE_ERR_RPT in register JESD_ERR_OUT (8.5.53) = 1 • Field MIN_LATENCY_ENA in register JESD_MATCH (8.5.50) = 1 52 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.12 SerDes Test Modes through Serial Programming The DAC38RFxx supports a number of basic pattern generation and verification of SerDes via the serial interface. Three pseudo random bit stream (PRBS) sequences are available, along with an alternating 0/1 pattern and a 20-bit user-defined sequence. The 27 - 1, 231 - 1 or 223 – 1 sequences implemented can often be found programmed into standard test equipment, such as a Bit Error Rate Tester (BERT). Pattern generation and verification selection is via field TESTPATT in register SRDS_CFG1 (8.5.86), as shown in Table 23. Table 23. SerDes Test Pattern Selection TESTPATT EFFECT 000 Test mode disabled. 001 Alternating 0/1 Pattern. An alternating 0/1 pattern with a period of 2 UI. 010 Verify 27 - 1 PRBS. Uses a 7-bit LFSR with feedback polynomial x7 + x6 + 1. 011 Verify 223 - 1 PRBS. Uses an ITU O.150 conformant 23-bit LFSR with feedback polynomial x23 + x18 + 1. 100 Verify 231 - 1 PRBS. Uses an ITU O.150 conformant 31-bit LFSR with feedback polynomial x31 + x28 + 1. 101 User-defined 20-bit pattern. Uses the USR PATT IEEE1500 Tuning instruction field to specify the pattern. The default value is 0x66666. 11x Reserved. Pattern verification compares the output of the serial to parallel converter with an expected pattern. When there is a mismatch, the TESTFAIL bit is driven high, which can be programmed to come out the ALARM terminal by setting field DTEST in register DTEST (8.5.76) to “0011”. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 53 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.13 SerDes Test Modes through IEEE 1500 Programming DAC38RFxx also provide a number of advanced diagnostic capabilities controlled by the IEEE 1500 interface. These are: • Accumulation of pattern verification errors; • The ability to map out the width and height of the receive eye, known as Eye Scan; • Rreal-time monitoring of internal voltages and currents; The SerDes blocks support the following IEEE1500 instructions: Table 24. IEEE1500 Instruction for SerDes Receivers INSTRUCTION OPCODE DESCRIPTION ws_bypass 0x00 Bypass. Selects a 1-bit bypass data register. Use when accessing other macros on the same IEEE1500 scan chain. ws_cfg 0x35 Configuration. Write protection options for other instructions. ws_core 0x30 Core. Fields also accessible via dedicated core-side ports. ws_tuning 0x31 Tuning. Fields for fine tuning macro performance. ws_debug 0x32 Debug. Fields for advanced control, manufacturing test, silicon characterization and debug. ws_unshadowed 0x34 Unshadowed. Fields for silicon characterization. ws_char 0x33 Char. Fields used for eye scan. The data for each SerDes instruction is formed by chaining together sub-components called head, body (receiver or transmitter) and tail. DAC38RFxx uses two SerDes receiver blocks R0 and R1, each of which contains 4 receive lanes (channels), the data for each IEEE1500 instruction is formed by chaining {head, receive lane 0, receive lane 1, receive lane 2, receive lane 3, tail}. A description of bits in head, body and tail for each instruction is given as follows: NOTE All multi-bit signals in each chain are packed with bits reversed e.g. mpy[7:0] in ws_core head subchain is packed as {retime, enpll, mpy[0:7], vrange, lb[0:1]}. All DATA REGISTER READS from SerDes Block R0 should read 1 bit more than the desired number of bits and discard the first bit received on TDO e.g., to read 40-bit data from R0 block, 41 bits should be read off from TDO and the first bit received should be discarded. Similarly, any data written to SerDes Block R0 Data Registers should be prefixed with an extra 0. Table 25. ws_cfg Chain FIELD DESCRIPTION HEAD (STARTING FROM THE MSB OF CHAIN) RETIME No function. CORE_WE Core chain write enable. RECEIVER (FOR EACH LANE 0, 1, 2, 3) CORE_WE Core chain write enable. TUNING_WE Tuning chain write enable. DEBUG_WE Reserved. CHAR_WE Char chain write enable. UNSHADOWED_WE Reserved. TAIL (ENDING WITH THE LSB OF CHAIN) CORE_WE Core chain write enable. TUNING_WE Tuning chain write enable. DEBUG_WE Reserved. RETIME No function. CHAIN LENGTH = 26 BITS 54 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 26. ws_core Chain FIELD DESCRIPTION HEAD (STARTING FROM THE MSB OF CHAIN) RETIME No function. ENPLL PLL enable. MPY[7:0] PLL multiply. VRANGE VCO range. ENDIVCLK Enable DIVCLK output LB[1:0] Loop bandwidth RECEIVER (FOR EACH LANE 0,1,2,3) ENRX Receiver enable. SLEEPRX Receiver sleep mode. BUSWIDTH[2:0] Bus width. RATE[1:0] Operating rate. INVPAIR Invert polarity. TERM[2:0] Termination. ALIGN[1:0] Symbol alignment. LOS[2:0] Loss of signal enable. CDR[2:0] Clock/data recovery. EQ[2:0] Equalizer. EQHLD Equalizer hold. ENOC Offset compensation. LOOPBACK[1:0] Loopback. BSINRXP Boundary scan initialization. BSINRXN Boundary scan initialization. RESERVED Reserved. Testpatt[2:0] Test pattern selection. TESTFAIL Test failure (real time). LOSTDTCT Loss of signal detected (real time). BSRXP Boundary scan data. BSRXN Boundary scan data. OCIP Offset compensation in progress. EQOVER Receiver signal over equalized. EQUNDER Receiver signal under equalized. LOSTDTCT Loss of signal detected (sticky). SYNC Re-alignment done, or aligned comma output (sticky). RETIME No function. TAIL (ENDING WITH THE LSB CHAIN) CLKBYP[1:0] Clock bypass. SLEEPPLL PLL sleep mode. RESERVED Reserved. LOCK PLL lock (real time). BSINITCLK Boundary scan initialization clock. ENBSTX Enable TX boundary scan. ENBSRX Enable RX boundary scan. ENBSPT RX pulse boundary scan. RESERVED Reserved. NEARLOCK PLL near to lock. UNLOCK PLL lock (sticky). Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 55 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Table 26. ws_core Chain (continued) FIELD DESCRIPTION CFG OVR Configuration over-ride. RETIME No function. CHAIN LENGTH = 196 BITS Table 27. ws_tuning Chain FIELD DESCRIPTION HEAD (STARTING FROM THE MSB OF CHAIN) RETIME No function. RECEIVER (FOR EACH LANE 0,1,2,3) PATTERRTHR[2:0] Resync error threshold. PATT TIMER PRBS timer. RXDSEL[3:0] Status select. ENCOR Enable clear-on-read for error counter. EQZERO[4:0] EQZ OVRi Equalizer zero. EQZ OVR Equalizer zero over-ride. EQLEVEL[15:0] EQ OVRi Equalizer gain observe or set. EQ OVR Equalizer over-ride. EQBOOST[1:0] Equalizer gain boost. RXASEL[2:0] Selects amux output. TAIL (ENDING WITH THE LSB CHAIN) ASEL[3:0] Selects amux output. USR PATT[19:0] User-defined test pattern. RETIME No function. CHAIN LENGTH = 174 BITS Table 28. ws_char Chain FIELD DESCRIPTION HEAD (STARTING FROM THE MSB OF CHAIN) RETIME No function. RECEIVER (FOR EACH LANE 0,1,2,3) TESTFAIL Test failure (sticky). ECOUNT[11:0] Error counter. ESWORD[7:0] Eye scan word masking. ES[3:0] Eye scan. ESPO[6:0] Eye scan phase offset. ES BIT SELECT[4:0] Eye scan compare bit select. ESVO[5:0] Eye scan voltage offset. ESVO OVR Eye scan voltage offset override. ESLEN[1:0] Eye scan run length. ESRUN Eye scan run. ESDONE Eye scan done. TAIL (ENDING WITH THE LSB CHAIN) RETIME No function. CHAIN LENGTH = 194 BITS 56 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.14 Error Counter All receive channels include a 12-bit counter for accumulating pattern verification errors. This counter is accessible via the ECOUNT IEEE1500 Char field. It is an essential part of the eye scan capability (see the Eye Scan section). The counter increments once for every cycle that the TESTFAIL bit is detected. The counter does not increment when at its maximum value (i.e., all 1s). When an IEEE1500 capture is performed, the count value is loaded into the ECOUNT scan elements (so that it can be scanned out), and the counter is then reset, provided NCOR is set high. ECOUNT can be used to get a measure of the bit error rate. However, as the error rate increases, it becomes less accurate due to limitations of the pattern verification capabilities. Specifically, the pattern verifier checks multiple bits in parallel (as determined by the Rx bus width), and it is not possible to distinguish between 1 or more errors. 8.3.15 Eye Scan All receive channels provide features which facilitate mapping the received data eye or extracting a symbol response. A number of fields accessible via the IEEE1500 Char scan chain allow the required low level data to be gathered. The process of transforming this data into a map of the eye or a symbol response must then be performed externally, typically in software. The basic principle used is as follows: • Enable dedicated eye scan input samplers, and generate an error when the value sampled differs from the normal data sample; • Apply a voltage offset to the dedicated eye scan input samplers, to effectively reduce their sensitivity; • Apply a phase offset to adjust the point in the eye that the dedicated eye scan data samples are taken; • Reset the error counter to remove any false errors accumulated as a result of the voltage or phase offset adjustments; • Run in this state for a period of time, periodically checking to see if any errors have occurred; • Change voltage and/or phase offset, and repeat. Alternatively, the algorithm can be configured to optimize the voltage offset at a specified phase offset, over a specified time interval. Eye scan can be used in both synchronous and asynchronous systems, while receiving normal data traffic. The IEEE1500 Char fields used to directly control eye scan and symbol response extraction are ES, ESWORD, ES BIT SELECT, ESLEN, ESPO, ESVO, ESVO OVR, ESRUN and ESDONE. Eye scan errors are accumulated in ECOUNT. The required eyescan mode is selected via the ES field, as shown in Table 29. When enabled, only data from the bit position within the 20-bit word specified via ES BIT SELECT is analyzed. In other words, only eye scan errors associated with data output at this bit position will accumulate in ECOUNT. The maximum legal ES BIT SELECT is 10011. Table 29. Eye Scan Mode Selection ES[3:0] EFFECT 0000 Disabled. Eye scan is disabled. 0x01 Compare. Counts mismatches between the normal sample and the eye scan sample if ES[2] = 0, and matches otherwise. 0x10 Compare zeros. As ES = 0x01, but only analyses zeros, and ignores ones. 0x11 Compare ones. As ES = 0x01, but only analyses ones, and ignores zeroes. 0100 Count ones. Increments ECOUNT when the eye scan sample is a 1. 1x00 Average. Adjusts ESVO to the average eye opening over the time interval specified by ESLEN. Analyses zeroes when ES[2] = 0, and ones when ES[2]= 1. 1001 1110 Outer. Adjusts ESVO to the outer eye opening (i.e. lowest voltage zero, highest voltage 1) over the time interval specified by ESLEN. 1001 analyses zeroes, 1110 analyses ones. 1010 1101 Inner. Adjusts ESVO to the inner eye opening (i.e. highest voltage zero, lowest voltage 1) over the time interval specified by ESLEN. 1010 analyses zeroes, 1101 analyses ones. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 57 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Table 29. Eye Scan Mode Selection (continued) ES[3:0] EFFECT 1x11 Timed Compare. As ES = 001x, but analyses over the time interval specified by ESLEN. Analyses zeroes when ES[2] = 0, and ones when ES[2] = 1. When ES[3] = 0, the selected analysis runs continuously. However, when ES[3] = 1, only the number of qualified samples specified by ESLed, as shown in Table 30. In this case, analysis is started by writing a 1 to ESRUN (it is not necessary to set it back to 0). When analysis completes, ESDONE is set to 1. Table 30. Eye Scan Run Length ESLen NUMBER OF SAMPLES ANALYZED 00 127 01 1023 10 8095 11 65535 When ESVO OVR = 1, the ESVO field determines the amount of offset voltage that is applied to the eye scan data samplers associated with rxpi and rxni. The amount of offset is variable between 0 and 300 mV in increments of ~10 mV, as shown Table 31. When ES[3] = 1, ESVO OVR must be 0 to allow the optimized voltage offset to be read back via ESVO. Table 31. Eye Scan Voltage Offset ESVO OFFSET (mV) 100000 -310 … … 111110 -20 111111 -10 000000 0 000001 10 000010 20 … … 011111 300 The phase position of the samplers associated with rxpi and rxni, is controlled to a precision of 1/32UI. When ES is not 00, the phase position can be adjusted forwards or backwards by more than one UI using the ESPO field, as shown in Table 32. In normal use, the range should be limited to ±0.5 UI (+15 to –16 phase steps). Table 32. Eye Scan Phase Offset 58 ESPO OFFSET (1/32 UI) 011111 +63 … … 000001 +1 000000 0 111111 -1 … … 100000 -64 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.16 JESD204B Pattern Test The DAC38RFxx supports the following test patterns for JESD204B: • Link layer test pattern by setting field JESD_TEST_SEQ in register JESD_LN_EN (8.5.45) and monitoring the lane alarms (1 = fail, 0 = pass) – Verify repeating /D.21.5/ high frequency pattern for random jitter (RJ) – Verify repeating /K.28.5/ mixed frequency pattern for deterministic jitter (DJ) – Verify repeating initial lane alignment (ILA) sequence • RPAT, JSPAT or JTSPAT pattern can be verified using errors counter of 8b/10b errors produced over an amount of time to get an estimate of BER. • Transport layer test pattern: implements a short transport layer pattern check based on F = 1, 2, 4 or 8. The short test pattern has a duration of one frame period and is repeated continuously for the duration of the test. Each sample has a unique value that can be identified with the position of the sample in the user data format. The sample values are such that correct sample values will never be decoded at the receiver if there is a mismatch between the mapping formats being used at the transmitter and receiver devices. This can generally be accomplished by ensuring there are no repeating sub patterns within the stream of samples being transmitted. Refer to the JESD204B standard section 5.1.6 for more details. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 59 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com The DAC38RFxx expects the test samples, in a frame, transmitted by an logic device as per Table 33: Table 33. Short Test Patterns JESD Mode i0 q0 i1 q1 82121 7CB8, F431 6DA9, E520 n/a n/a 42111 7CB8 F431 n/a n/a 22210 7CB8 F431 n/a n/a 12410 7CB8 F431 n/a n/a 44210 7CB8 F431 6DA9 E520 24410 7CB8 F431 6DA9 E520 41121 7CB8, F431 n/a n/a n/a 81180 7C00, B800, F400, 3100, 6D00, A900, E500, 2000 n/a n/a n/a 24310 7CB0 F430 6DA0 E520 41380 7CB0, F430, 6DA0, E520, F870, E960, DA50, CB40 n/a n/a n/a The short test pattern has duration of one frame period and is repeated continuously for the duration of the test. Each sample has a unique value that can be identified with the position of the sample in the user data format. The sample values are such that correct sample values will never be decoded at the receiver if there is a mismatch between the mapping formats being used at the transmitter and receiver devices. This can generally be accomplished by ensuring there are no repeating sub patterns within the stream of samples being transmitted. Following are the steps required to execute the short test functionality in DAC38RFxx. 1. Configure other registers, make sure clocks are up and running. 2. Start driving short test patterns 3. Clear short test alarm by writing ‘0’ to field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP (8.5.67). This is a paged register, one for each Multi-DUC. 4. Enable short test by writing a ‘1’ to field SHORTTEST_ENA in register MULTIDUC_CFG2 (8.5.14). 5. Read the short test alarm from field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP (8.5.67). This is a paged register, one for each Multi-DUC If the alarm read from the register is high, the short test has detected an error. 8.3.17 Multiband DUC (multi-DUC) Each DAC output in the DAC38RFxx is supported by a dual band digital upconverter (DUC), which is called a multi-DUC.Figure 57 shows the signal processing features of each of the two multi-DUCs. The two paths are identical and independent. The SPI interface registers for the multi-DUCs are addressed through paging, with page 0 supporting multi-DUC1 and page 1 supporting multi-DUC2. Register PAGE_SET (8.5.8) is used to set the pages. Both pages can be selected at the same time to program both multi-DUCs simultaneously with the same settings. Each multi-DUC has 2 DUC channels, called path AB and path CD. The output of one multi-DUC can be added to the signal of the other multi-DUC to allow a configuration with 4 total DUCs summed together for 1 DAC. After quadrature modulation is a sin(x)/x compensation filter, followed by the multiband summation block. The multiband summation block had the ability to add the signals from the other multi-DUC for a combined 4 DUCs, each with independent frequency control. The final block is an output delay block with 0 – 15 sample range. 60 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 48-bit NCO1 Input Mux cos xN 16 Q xN 16 PAP xN Path CD Q xN 16 x sin(x) PAP Gain CMIX control (±n*Fs/4) I 16 Multiband summation Complex Mixer (FMIX or CMIX) JESD204B Interface Path AB sin Complex Mixer (FMIX or CMIX) I cos Delay x sin(x) PAP Gain From 2nd multi-DUC sin 48-bit NCO2 Figure 57. DAC38RFxx multi-DUC Signal Processing Block Diagram 8.3.17.1 Multi-DUC input Each multi-DUC, accepts data from up to 8 SerDes lanes. A crossbar switch allows any SerDes lane to be mapped to any other SerDes lane. The crossbar switch is controlled by fields OCTETPATHx_SEL (x = [0..7]) in Registers JESD_CROSSBAR1 (8.5.57) and JESD_CROSSBAR2 (8.5.58). As shown in Table 9, the multiband DUC can be configured as either a single DUC with 1 IQ input, or a dual DUC with 2 IQ inputs, which is selected by asserting field DUAL_IQ in register MULTIDUC_CFG1 (8.5.13). 8.3.17.2 Interpolation Filters The digital upconverter first increases the sample rate of the IQ signal from the input sample rate to the final DAC sample rate through a series of interpolation filters. Different sets of filters are used to achieve different rates, as shown in Table 34. The interpolation rate is selected by field INTERP in register MULTIDUC_CFG1 (8.5.13). Table 34. FIR filters Used for Different Interpolation Rates FILTERS USED Interpolation Rate FIR0 (2x) 6 x FIR1 (2x) LPFIR0_5X FIR2 (2x) LPFIR0_3X FIR3 (2x) LPFIR1_3X x 8 x 10 x x 12 x x 16 x x 18 x 20 x x 24 x x x x x x x x x x x x Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 61 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com The FIR filter coefficients are shown in Table 35 The FIR filters are design with a passband BW of 0.4 x fINPUT, a stopband attenuation of 90 dBc and ripple of < 0.001 dB. The composite frequency response for each interpolation factor are shown in Figure 58 to Figure 65. 20 0 0 -20 -20 -40 -40 Magnitude (dB) Magnitude (dB) 20 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 0 0.075 0.15 0.225 0.3 f/Fdac 0.375 0.45 0 0.15 20 20 0 0 -20 -20 -40 -40 -60 -80 -100 0.375 0.45 D002_8x -60 -80 -100 -120 -120 -140 -140 -160 0.225 0.3 f/Fdac Figure 59. Composite Magnitude Response for 8x Interpolation Magnitude (dB) Magnitude (dB) Figure 58. Composite Magnitude Response for 6x Interpolation -160 0 0.075 0.15 0.225 0.3 f/Fdac 0.375 0.45 0 D003 Figure 60. Composite Magnitude Response for 10x Interpolation 62 0.075 D001 0.075 0.15 0.225 0.3 f/Fdac 0.375 0.45 D004 Figure 61. Composite Magnitude Response for 12x Interpolation Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 20 20 0 0 -20 -20 -40 -40 Magnitude (dB) Magnitude (dB) www.ti.com -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 0 0.075 0.15 0.225 0.3 f/Fdac 0.375 0.45 0 Figure 62. Composite Magnitude Response for 16x Interpolation 0.15 0.225 0.3 f/Fdac 0.375 0.45 D006 Figure 63. Composite Magnitude Response for 18x Interpolation 20 20 0 0 -20 -20 -40 -40 Magnitude (dB) Magnitude (dB) 0.075 D005 -60 -80 -100 -60 -80 -100 -120 -120 -140 -140 -160 -160 0 0.075 0.15 0.225 0.3 f/Fdac 0.375 0.45 0 0.075 0.15 0.225 0.3 f/Fdac D007 Figure 64. Composite Magnitude Response for 20x Interpolation 0.375 0.45 D001 Figure 65. Composite Magnitude Response for 24x Interpolation Table 35. FIR Filter Coefficients tap FIR0 FIR1 LPFIR0_5X FIR2 LPFIR0_3X FIR3 LPFIR1_3X 1 6 -12 -6 29 -14 3 25 1 2 0 0 -22 0 -61 0 88 -4 3 -19 84 -51 -214 -125 -25 22 13 4 0 0 -89 0 -95 0 -576 -50 5 47 -336 -117 1209 181 150 -1764 592 6 0 0 -106 2048 681 256 -2263 -50 7 -100 1006 -18 1209 972 150 491 13 8 0 0 171 0 347 0 8139 -4 9 192 -2691 449 -214 -1475 -25 18625 1 10 0 0 745 0 -3519 0 26365 11 -342 10141 930 29 -3528 3 26365 12 0 16384 841 707 18625 13 572 10141 338 9337 8139 14 0 0 -618 19445 491 15 -914 -2691 -1892 26299 -2263 16 0 0 -3147 26299 -1764 17 1409 1006 -3872 19445 -576 INVSINC Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 63 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Table 35. FIR Filter Coefficients (continued) 64 tap FIR0 FIR1 LPFIR0_5X 18 0 0 -3500 19 -2119 -336 20 0 0 21 3152 FIR2 LPFIR0_3X -1564 707 88 2121 -3528 25 84 7336 -3519 0 0 13430 -1475 23 -4729 -12 19426 347 24 0 24231 972 25 7420 26904 681 26 0 26904 181 27 -13334 24231 -95 28 0 19426 -125 29 41527 13430 -61 30 65536 7336 -14 31 41527 2121 32 0 -1564 33 -13334 -3500 34 0 -3872 35 7420 -3147 36 0 -1892 37 -4729 -618 38 0 338 39 3152 841 40 0 930 41 -2119 745 42 0 449 43 1409 171 44 0 -18 45 -914 -106 46 0 -117 47 572 -89 48 0 -51 49 -342 -22 50 0 -6 51 192 0 53 -100 54 0 55 47 56 0 57 -19 58 0 59 6 LPFIR1_3X 22 22 52 FIR3 9337 Submit Documentation Feedback INVSINC Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.17.3 JESD204B Modes, Interpolation and Clock phase Programming Table 36 lists the register field values required for each JESD204B mode, interpolation mode and clock phase. The register field addresses are listed in Table 37. Table 36. Register Programming for JESD and Interpolation Mode Mode L-M-F-SHd 1 TX/2TX 82121/NA 42111/841 11 22210/442 10 12410/244 10 44210/882 10 24410/484 10 24310/483 10 Register Field Programming Inter p CLOCK PHASES (1-0) INTERP (4-0) CLKJESD_DI V (3-0) CLKJESD_OU T_DIV (3-0) 6 11 00011 0110 0011 8 11 00100 0111 0100 12 11 00110 1010 0110 16 11 01000 1011 0111 6 10 00011 0010 0011 8 11 00100 0011 0100 10 11 00101 0101 0101 12 11 00110 0110 0110 16 11 01000 0111 0111 18 11 01001 1001 1000 24 11 01100 1010 1010 8 01 00100 0001 0100 12 10 00110 0010 0110 16 11 01000 0011 0111 18 11 01001 0100 1000 20 11 01010 0101 1001 24 11 01100 0110 1010 16 01 01000 0001 0111 24 10 00110 0110 1010 8 01 00100 0001 0100 12 10 00110 0010 0110 16 11 01000 0011 0111 24 11 01100 0110 1010 16 01 01000 0001 0111 24 10 01100 0010 1010 24 11 01100 0011 1010 L_M1 (4-0) F_M1 (7-0) M_M1 (7-0) S_M1 (4-0) HD N_M1/N’_M 1 (4-0) 00111 0x00 0x01 00001 1 01111 00011 0x00 0x01 00000 1 01111 00001 0x01 0x01 00000 0 01111 00000 0x03 0x01 00000 0 01111 00011 0x01 0x03 00000 0 01111 00001 0x03 0x03 00000 0 01111 00001 0x02 0x03 00000 0 01011 Table 37. Register Field Addresses for JESD204B Modes, Interpolation and Clock Phase Programming Register Field Name Register Register Address Bit(s) Hyperlink INTERP MULTIDUC_CFG1 0x0A 12-8 8.5.13 CLKJESD_DIV 15-12 SerDes_CLK 0x25 L_M1 JESD_K_L 0x4C 4-0 8.5.47 F_M1 JESD_RBD_F 0x4B 7-0 8.5.46 CLKJESD_OUT_DIV M_M1 S_M1 JESD_M_S 0x4D JESD_N_HD_SCR 0x4E JESD_LN_EN 0x4A HD N_M1 15-8 4-0 8.5.28 8.5.48 6 N_M1’ (NPRIME_M1) JESD_PHASE_MODE 11-8 4-0 8.5.49 12-8 1-0 8.5.45 All registers are paged! Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 65 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.17.4 Digital Quadrature Modulator Each DUC in the DAC38RFxx has digital quadrature modulator (DQM) blocks with independent Numerically Controlled Oscillators (NCO) that converts the complex input signal to a real signal with flexible frequency placement between 0 and fDAC/2. The NCOs are enabled by fields NCOAB_ENA and NCOCD_ENA in register MULTIDUC_CFG2 (8.5.14). The NCOs have 48-bit frequency registers (FREQ_NCOAB (8.5.25) and FREQ_NCOCD (8.5.26)) and 16-bit phase registers (PHASE_NCOAB (8.5.23) and PHASE_NCOCD (8.5.24)) that generate the sine and cosine terms for the complex mixing. The NCO block diagram is shown in Figure 66. 48 16 48 48 Accumulator 48 16 16 Frequency Register sin Look Up Table 16 CLK RESET cos 16 FDAC NCO SYNC via syncsel_NCO(3:0) Phase Register Figure 66. NCO Block Diagram Synchronization of the NCOs occurs by resetting the NCO accumulators to zero. The synchronization source is selected by fields SYNCSEL_NCOAB and SYNCSEL_NCOCD in register SYNCSEL1 (8.5.29). The frequency word in the FREQ_NCOAB and FREQ_NCOCD registers are added to the accumulators every clock cycle, fDAC. The frequency and phase offset of the NCOs are: fNCOAB or CD / AB or CD FREQ _ NCOAB or CD u fDAC 2Œ u 248 (1) PHASE _ NCOAB or CD 216 (2) Treating the complex channels as complex vectors of the form I + j Q, the output of the DQM is: Output AB OutputCD ^IINPUTAB u cos ^IINPUTCD u cos 2ŒINCOABW 2ŒINCOCDW /AB /CD 4INPUTAB u VLQ 2ŒINCOABW 4INPUTCD u VLQ 2ŒINCOCDW /AB ` u 2 MIXERAB _ GAIN /CD ` u 2 1 (3) MIXERCD _ GAIN 1 (4) Where t is the time since the last resetting of the NCO accumulator and the fields MIXERAB_GAIN and MIXERCD_GAIN in register MULTIDUC_CFG2 (8.5.13) are either 0 or 1. The maximum output amplitude of the DQM occurs if IIN(t) and QIN(t) are simultaneously full scale amplitude and the sine and cosine arguments are equal to an integer multiple of π/4. With MIXERAB_GAIN or MIXERCD_GAIN = 0, the gain through the DQM is sqrt(2)/2 or -3 dB. This loss in signal power is in most cases undesirable, and it is recommended that the gain function be used to increase the signal by 3 dB to compensate. With MIXERAB_GAIN or MIXERCD_GAIN = 1, the gain through the DQM is sqrt(2) or +3 dB, which can cause clipping of the signal if IIN(t) and QIN(t) are simultaneously near full scale amplitude and should therefore be used with caution. 8.3.17.5 Low Power Coarse Resolution Mixing Modes In addition to the NCO the DAC38RFxx also has a coarse mixer block capable of shifting the input signal spectrum by the fixed mixing frequencies ±N x fDAC/8. Using the coarse mixer instead of the full mixers will result in lower power consumption. Treating the two complex channels as complex vectors of the form I(t) + j Q(t), the outputs of the coarse mixer is equivalent to: 66 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Output AB IINPUTAB u cos 2ŒICMIX _ ABW 4INPUTAB u VLQ 2ŒICMIX _ ABW (5) OutputCD IINPUTCD u cos 2ŒICMIX _ CDW 4INPUTCD u VLQ 2ŒICMIX _ CDW (6) Where fCMIX_AB and fCMIX_CD and the fixed mixing frequency selected by fields CMIX_AB or CMIX_CD in register CMIX (8.5.21). The coarse mixer blocks are disabled by setting CMIX_AB and CMIX_CD to 0x0. The NCO and coarse mixers can be enabled simultaneously, although this is not useful in most cases as the full frequency range can be covered by the NCO. 8.3.17.6 Inverse Sinc Filter The DAC38RFxx have a 9-tap inverse Sinc filter (INVSINC) that runs at the DAC update rate (fDAC) that can be used to flatten the frequency response of the sample-and-hold output. The DAC sample-and-hold output sets the output current and holds it constant for one DAC clock cycle until the next sample, resulting in the well known sin(x)/x or Sinc(x) frequency response (Figure 67, red line). The inverse sinc filter response (Figure 67, blue line) has the opposite frequency response from 0 to 0.4 x fDAC, resulting in the combined response (Figure 67, green line). Between 0 to 0.4 x fDAC, the inverse sinc filter compensates the sample-and-hold roll-off with less than 0.03 dB error. The inverse sinc filter has a gain > 1 at all frequencies. Therefore, the signal input to INVSINC must be reduced from full scale to prevent saturation in the filter. The amount of back-off required depends on the signal frequency, andis set such that at the signal frequencies the combination of the input signal and filter response is less than 1 (0 dB). For example, if the signal input to INVSINC is at 0.25 x fDAC, the response of INVSINC is 0.9 dB, and the signal must be backed off from full scale by 0.9 dB to avoid saturation. The advantage of INVSINC having a positive gain at all frequencies is that the user is then able to optimize the back-off of the signal based on its frequency. The inverse Sinc filters are enabled by field ISFIR_ENA in register MULTIDUC_CFG1 (9.5.9). 4 3 FIR4 Magnitude (dB) 2 1 Corrected 0 –1 –2 sin(x)/x –3 –4 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 f/fDAC G056 Figure 67. Composite Magnitude Spectrum for INVSINC 8.3.17.7 Summation Block for Dual DUC Modes When using the dual DUC modes, the outputs of the two AQM blocks are summed together to form a composite signal for the DAC output, configured by field OUTSUM_SEL in register OUTSUM (8.5.22). The input signals to the DUCs much be scaled such that the signal does not exceed fullscale during summation. This field can also be configures to add the signals from the adjacent multi-DUC to enable a four DUC signal. 8.3.18 PA Protection Block The DAC38RFxx incorporates an optional power amplifier protection (PAP) block to monitor when the input signal is two large, for example when an interface error occurs, and reduces the output signal power of the DAC. The PAP block achieves the functionality of reducing the input signal that crosses the threshold through three main sub-blocks. These are PAP trigger generation block, PAP gain state machine and GAIN block. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 67 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com The PAP block keeps track of the input signal power by maintaining a sliding window accumulation of last N samples. N is selectable to be 32, 64 or 128 based on the setting (Table 38) of fields PAPAB_SEL_DLY in register PAP_CFG_AB (8.5.35) and PAPCD_SEL_DLY in register PAP_CFG_CD (8.5.36). The average amplitude of input signal is computed by dividing accumulated value by the number of samples in the delay-line (N). The result is then compared against the threshold in fields PAPAB_THRESH in register PAP_CFG_AB (8.5.35) and PAPCD_THRESH in register PAP_CFG_CD (8.5.36). If the threshold is violated, gain state machine is triggered which generated gain value to ramp down the DAC output signal amplitude. After the input signal returns to normal value, the state machine ramps up the DAC output signal amplitude. Table 38. PAP Delay Line Selection pap_sel_dly[1:0] # of samples averaged 00 32 01 64 10 128 11 Reserved The generation of the PAP trigger as explained as follows: • The I and Q samples are treated separately – either can trigger attenuation • In dual DUC modes, each IQ pair is treated separately and has a separate gain block • 8 samples at the input are put through an absolute value circuit (all 2’s complement) • Next these values are vector summed to get a 12 bit result • Then 12 bit result is placed into the delay line and summed into the accumulator • The accumulator is also subtracting out the delayed 12 bit word corresponding to N = 32, N = 64 or N = 128 • Finally the accumulator output is divided down by N and rounded to 13 bits. These 13 bits are compared to the threshold in the SPI registers. A pap_trig occurs if the threshold is exceeded. The PAP gain state machine generates the pap gain value to be applied on the output stream to reduce the output signal amplitude. The state machine below is used to control the attenuation of the DAC output and the gaining up of the signal again once the trigger is released. pap_trig=0 pap_gain=1 Normal pap_trig=1 pap_trig=1 Attenuate Gain wait_cnt_load_r=0 pap_trig=0 wait_cnt_load_r=1 Wait pap_trig=1 Copyright © 2017, Texas Instruments Incorporated Figure 68. PAP Gain State Machine 68 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 The normal operating condition for the PAP block is the NORMAL state in Figure 68. However, when the PAP block detects an error condition it sets the pap_trig signal to ‘1’ causing a state transition from NORMAL operation to the ATTENUATE state. In the ATTENUTATE state the data path gain is scaled from 1.0 down to 0.0 by a programmable step amount set by fields PAPAB_GAIN_STEP in register PAP_GAIN_AB (8.5.31) and PAPCD_GAIN_STEP in register PAP_GAIN_CD (8.5.33). This value is always positive with the decimal place located between the MSB and MSB-1. Unity is equal to “1000000000”. Each clock cycle (16 samples) the PAP_GAIN is stepped down by PAPAB_GAIN_STEP and PAPCD_GAIN_STEP until the gain is 0. After PAP_GAIN is 0, the state machine moves on to the WAIT state. Here a programmable counter counts clock cycles to allow the condition for the pap_trig to be fixed. Fields PAPAB_WAIT in register PAP_WAIT_AB (8.5.32) and PAPCD_WAIT in register PAP_WAIT_CD (8.5.34) are used to select the number of clock cycles (samples = 16 x PAPAB_WAIT or 16 x PAPCD_WAIT) to wait before moving to the next state. Once the WAIT counter equals zero and pap_trig=’0’, the state machine moves on to the GAIN state. If the WAIT equals 0 but pap_trig still equals ‘1’ then the state machine stays in the WAIT state until pap_trig =’0’. 8.3.19 Gain Block The GAIN block also has additional output gain control through fields GAINAB in register GAINAB (8.5.39) and GAINCD in register GAINCD (8.5.40). Similar to PAP_GAIN value, the output gain is always positive with unity when GAINAB or GAINCD = ”010000000000”. To reduce the power, the gain block clock has been gated whenever the pap is disabled and GAINAB or GAINCD is set to unity. 8.3.20 Output Summation The OUTSUM block allows addition of samples from each DUC in the multi-DUC. It is also possible to add the output samples from the adjacent multi-DUC. Field OUTSUM_SEL in register OUTSUM (8.5.22) controls the summation for each multi-DUC. The functionality of the block can be represented by the following equation: OUTSUMoutput SAME AB SAMECD ADJ AB ADJCD (7) In order to avoid overflow, rounding operation is performed after the addition to reduce the word size back to 16bits. Exact number of bits rounded depends on the number of channels added. Table 39 shows the description of round after the summation. Table 39. OUTSUM Scaling and Rounding # OF CHANNELS ADDED # OF BITS ROUNDED 0 0, Use bits[15:0] from the result 1 Use bits[16:1] from the result and bit[0] used for rounding 2 Use bits[17:2] from the result and bits[1:0] used for rounding 3 Use bits[18:3] from the result and bit[2:0] used for rounding 4 Use bits[19:4] from the result and bit[3:0] used for rounding 8.3.21 Output Delay The signal following output summation can be programmably delayed by 0-15 DACCLK cycles through field OUTPUT_DELAY in register OUTSUM (8.5.20). The block takes 16 sample words (vec16) from both the A and B paths and shifts the them to 32 sample long delay line. 8.3.22 Polarity Inversion The signal following the output delay can be inverted by a 2’s complement conversion allowing the + and - DAC outputs to be swapped by asserting field DAC_COMPLEMENT in register MULTIDUC_CFG1 (8.5.13). 8.3.23 Temperature Sensor The DAC38RFxx incorporates a temperature sensor block which monitors the die temperature by measuring the voltage across 2 transistors. The voltage is converted to an 8-bit digital word using a successive approximation (SAR) analog to digital conversion process. The result is scaled, limited and formatted as a twos complement value representing the temperature in degrees Celsius. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 69 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com The sampling is controlled by the serial interface signals SDEN and SCLK. If the temperature sensor is enabled by writing a 0 to field TSENSE_SLEEP in register SLEEP_CONFIG (8.5.70), a conversion takes place each time the serial port is written or read. The data is only read and sent out by the digital block when the temperature sensor is read in field TEMPDATA in register TEMP_PLLVOLT (8.5.7). The conversion uses the first eight clocks of the serial clock as the capture and conversion clock, the data is valid on the falling eighth SCLK. The data is then clocked out of the chip on the rising edge of the ninth SCLK. No other clocks to the chip are necessary for the temperature sensor operation. As a result the temperature sensor is enabled even when the device is in sleep mode. In order for the process described above to operate properly, the serial port read from register TEMP_PLLVOLT must be done with an SCLK period of at least 1 μs. If this is not satisfied the temperature sensor accuracy is greatly reduced. 8.3.24 Alarm Monitoring The DAC38RFxx includes a flexible set of alarm monitoring that can be used to alert of a possible malfunction scenario. All the alarm events can be accessed either through the SIP registers and/or through the ALARM output. Once an alarm is set, the corresponding alarm bit must be reset through the serial interface to allow further testing. The set of alarms includes the following conditions: • JESD alarms – Fields ALM_LANEx_ERR in registers JESD_ALM_Lx (x = 0-7, 8.5.59 to 8.5.66): – multiframe alignment_error. Occurs when multiframe alignment fails – frame alignment error. Occurs when multiframe alignment fails – link configuration error. Occurs when there is wrong link configuration – elastic buffer overflow. Occurs when bad RBD value is used – elastic buffer match error. Occurs when the first non-/K/ doesn’t match the programmed data – code synchronization error – 8b/10b not-in-table decode error – 8b/10b disparity error – Field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP (8.5.67): Occurs when the short pattern test fails. • SerDes alarms – Field ALM_SD_LOTDET in register ALM_SD_DET 8.5.5): Occurs when there are loss of signal detect from SerDes lanes. – Fields ALM_FIFOx_FLAGS in registers JESD_ALM_Lx (x = 0-7, 8.5.59 to 8.5.66): – FIFO write error. Occurs if write request and FIFO is full. – FIFO write full: Occurs if FIFO is full. – FIFO read error. Occurs if read request and FIFO is empty. – FIFO read empty: Occurs if FIFO is empty. – Field ALM_SD0_PLL in register ALM_SYSREF_DET (8.5.6): Occurs if the PLL in the SerDes block 0 goes out of lock. – Field ALM_SD1_PLL in register ALM_SYSREF_DET (8.5.6): Occurs if the PLL in the SerDes block 1 goes out of lock. • SYSREF alarm – Field ALM_SYSREF_ERR in register ALM_SYSREF_PAP (8.5.67): Occurs when the SYSREF is received at an unexpected time. If too many of these occur it will cause the JESD to go into synchronization mode again. • DAC PLL alarm – Field PLL_LOCK in register ALM_SYSREF_DET (8.5.6). This register field is asserted when the PLL is unlocked. When used as an alarm output, a high signal indicates that the PLL is unlocked if the ALM_OUT_POL bit in register RESET_CONFIG is set to 1. • PAP alarm – Field ALM_PAP in register ALM_SYSREF_PAP (8.5.67): Occurs when the average power is above the threshold. While any alarm_pap is asserted the attenuation for the appropriate data path is applied. 70 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.25 Differential Clock Inputs Figure 69 shows the preferred configuration for driving the DACCLK+/- and SYSREF+/- with a differential ECL/PECL source. LVPCL Driver 0.01 mF CAC 100 W 0.01 mF 240 W 240 W Copyright © 2016, Texas Instruments Incorporated Figure 69. Preferred Clock Input Configuration With a Differential ECL/PECL Clock Source Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 71 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.3.26 CMOS Digital Inputs Figure 70 shows a schematic of the equivalent CMOS digital inputs of the DAC38RFxx. SDIO, SCLK, TCLK, SLEEP, TESTMODE and TXENABLE have internal pull-down resistors while SDEN, RESET, TMS, TDI and TRST have internal pull-up resistors. See the Specifications table for logic thresholds. The pull-up and pull-down circuitry is approximately equivalent to 10 kΩ. VDDIO18 VDDIO18 10 k SDIO SCLK TCLK SLEEP TXENABLE TESTMODE 400 SDENB RESETB TMS TDI TRSTB internal digital in 400 internal digital in 10 k GND GND Copyright © 2016, Texas Instruments Incorporated Figure 70. CMOS Digital Equivalent Input 8.3.27 DAC Fullscale Output Current The DAC38RFxx uses a bandgap reference and control amplifier for biasing the full-scale output current. The DAC full scale output current is set by a combination of the fixed current through the external resistor RBIAS (connected to pin BIASJ) and current from course trim current sources: IOUTFS IRBIAS Icoarsetrim (8) The bias current IBIAS through resistor RBIAS is defined by the on-chip bandgap reference voltage VBG (nominally 0.9 V) and control amplifier. For normal operation, it is recommended that RBIAS is set to 3.6 kΩ for a fixed current through RBIAS of 250 µA. This current is scaled 128x internally, giving: IRBIAS 128 u VBG RBIAS 128 u 0.9V 3.6 k 32 mA (9) The course trim current sources are configured through SPI register field DACFS in register DACFS (8.5.72),as follows: I coarsetrim = 2mA × DACFS - 11 (10) From the discussion above, the DAC full scale output current can be configured from 40 mA (DACFS[3:0] = 1111) down to 10 mA (DACFS[3:0] = 0000). In addition to the full scale signal current set by SPI register DACFS (8.5.72), an extra DC bias current is required to set the operating point of the output current sources(Table 40). Table 40. DAC output current (1) 72 DACFS ( 8.5.72) Signal current (mA) Total bias current (mA) (1) 0 10 1 1 12 1 2 14 2 3 16 2 4 18 3 5 20 3 6 22 4 7 24 5 8 26 5 9 28 6 The bias current per each complementary output is half the total bias current Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Table 40. DAC output current (continued) DACFS ( 8.5.72) Signal current (mA) Total bias current (mA) (1) 10 30 6 11 32 7 12 34 7 13 36 8 14 38 8 15 40 9 An external decoupling capacitor CEXT of 0.1 μF should be connected externally to terminal EXTIO for compensation. RBIAS of 3.6 kΩ is recommended for setting the full-scale output current. 8.3.28 Current Steering DAC Architecture The DACs in the DAC38RFxx consist of a segmented array of NMOS current sources, capable of sinking a fullscale output current up to 40 mA (see Figure 71). Differential current switches direct the current to either one of the complimentary output nodes VOUT1/2+ or VOUT1/2-. On the DAC38RF80/90/84 with integrated balun, these output nodes are internal to the device. Complimentary output currents enable differential operation, thus canceling out common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even order distortion components, and increasing signal output power by a factor of four. VDDOUT18 Zext+ Zext- VOUT1/2+ IOUT+ VOUT1/2- 100 : IOUT- VDEE18N (-1.8V) Figure 71. Current Steering DAC Architecture Referring to Figure 71, the total output current IOUTFS is fixed, and is switched to either the + or – output by switches S(N): IOUTFS IOUT + IOUT- (11) Since the output stage is a current sinking architecture, we will denote current into the DAC as + current, and the current flows IOUT+ and IOUT- into terminals VOUT1/2+ and VOUT1/2- respectively. IOUT+ and IOUT- can be expressed as: Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 73 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 IOUT+ IOUT- www.ti.com IOUTFS u CODE 16384 (12) IOUTFS u 16383 CODE 16384 (13) where CODE is the decimal representation of the 14-bit DAC core data input word. Note the signal path up to the DAC is 16-bits and the 2 LSBs are truncated for the DAC core data input word. 8.3.29 DAC Transfer Function for DAC38RF83, 93, 85 The DAC38RF83/93/85 has a differential output and is terminated internally with a differential 100-Ω load. The DAC38RF83/93/85 output compliance range is 1.3 to 2.3 V. Note that care should be taken not to exceed the compliance voltages at node VOUT1/2+ and VOUT1/2-, which would lead to increased signal distortion. Referring again toFigure 71, denote the external impedance as seen by VOUT1/2+ as Zext+ and by VOUT1/2as Zext-. Note that Zext+ and Zext- should terminate to VDDOUT18 to supply the output current for the DAC. Also, Zext+ and Zext- are ideally identical to maintain the differential balance of the output. The voltage at nodes VOUT1/2+ and VOUT1/2- generated by the current flow through the impedance is VOUT 1/ 2 IOUT + u 100 Zext + u Zext + Zext + Zext 100 VOUT 1/ 2 IOUT - u 100 Zext u Zext + 100 Zext + Zext - IOUT - uZext u Zext + Zext + Zext - (14) IOUT + uZext + u Zext Zext + Zext - (15) The DAC38RF83/93/85 can be easily configured to drive a doubly terminated 50-Ω cable using a properly selected 2:1 RF transformer (Figure 72). Note that the center tap of the primary input of the transformer has to be connected to the VDDOUT18 supply (nominally 1.8 V) to enable a DC current flow into the DAC. The AC load impedance as seen through 2:1 transformer is 100 Ω, which is split equally into Zext+ = Zext- = 50 Ω. The DC impedance for the transformer is a short to the center tap of the transformer, which drives the common mode of VOUT1/2+ and VOUT1/2- to 1.8V. To calculate the peak to peak output swing VOUT1/2PP at each node, the equations above simplify to: VOUT 1/ 2PP VOUT 1/ 2 VOUT 1/ 2PP IOUTFS u 50 u 200 IOUT+ IOUTFS,IOUT IOUTFS u 0 VOUT 1/ 2 u IOUT- IOUTFS ,IOUT+ 0 (16) IOUTFS u 25 (17) With IOUTFS = 40 mA, the swing becomes 1 VPP at each node. With the common mode at 1.8 V due to the center tap, the voltage at VOUT1/2+ and VOUT1/2- varies between 1.3 and 2.3 V, which is the compliance range of the DAC. The differential output swing is 2x VOUT1/2PP, or 2 VPPDIFF. On the load side of the transformer, this reduces to 1.414 VPP, for a transferred load power of 7 dBm (assuming no loss). VOUT1/2+ 2:1 RLOAD 100 : 50 : VOUT1/2VDDADAC18 (1.8V) Figure 72. Driving a 50-Ω Load Using a 2:1 Impedance Ratio Transformer (DAC38RF83/93/85) The DAC38RF83/93/85 can also be DC coupled. In this case, the termination voltage can be raised above 1.8 V (for example 2.3 V) so that the common mode for the output pin is nominally 1.8 V. 74 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.3.30 DAC Transfer Function for DAC38RF80/90/84 The DAC38RF80/90/84 has a wide bandwidth integrated balun (nominally 700 MHz to 3.8 GHz passband) to convert the DAC core differential signal to a single ended signal. The single ended output is expected to drive a 50-Ω load (see Figure 73). With full-scale current of 40 mA, the theoretical output power delivered to a 50-Ω load is 4 dBm. However the actual power delivered will be less than the theoretical value and Figure 38 shows the output power across frequency. VOUT1/2 RLOAD 50 : Figure 73. Driving a 50-Ω Load (DAC38RF80/90/84) 8.4 Device Functional Modes 8.4.1 Clocking Modes The DAC38RFxx has both a single ended clock input DACCLKSE and a differential clock input DACCLK+/- to clock the device. The clock input is selected by field SEL_EXTCLK_DIFFSE in register CLK_PLL_CFG (8.5.79). The DAC38RFxx can be clocked directly with a high frequency input clock at the DAC sample rate (PLL Bypass Mode), or an optional on-chip low-jitter phase-locked loop (PLL) can be used to generate the high frequency DAC sample clock internally from a lower frequency reference clock input (PLL Mode). 8.4.2 PLL Bypass Mode Programming In PLL bypass mode a high quality clock is sourced to the DACCLK inputs. This clock is used to directly clock the DAC38RFxx DAC cores. This mode gives the device best performance and is recommended for extremely demanding applications. The bypass mode is selected by setting the following: 1. Set field PLL_ENA in register CLK_PLL_CFG (8.5.79) to “0” to bypass the PLL circuitry. 2. Set field PLL_SLEEP in register SLEEP_CONFIG (8.5.70) to “1” to put the PLL and VCO into sleep mode. 8.4.3 Internal PLL/VCO The DAC38RFxx has an internal clock generation circuit consisting of a PLL and two selectable VCOs, as shown in Figure 74. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 75 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Device Functional Modes (continued) High VCO PFD and charge pump yN Output buffer DAC CLK PLL_N(4-0) Feedback Low VCO yM y4 PLL_M(7-0) Figure 74. Internal PLL/VCO Block Diagram The low VCO is tuned to a target center frequency of 5.9 GHz, and the high VCO is tuned to a target center frequency of 8.85 GHz. The VCO is selected through field PLL_VCOSEL in register PLL_CONFIG2 (8.5.81), with ‘0’ selecting the low VCO and a ‘1’ the high VCO. The 7 bit VCO tuning code in field PLL_VCO in register PLL_CONFIG2 (8.5.81) is used to tune the VCO frequency in the range of 5.24 GHz to 6.72 GHz for low VCO and 7.96 GHz to 9.0 GHz for the high VCO. For the low VCO the center VCO frequency is achieved with PLL_VCO = 63decimal and for the high VCO the target VCO center frequency is achieved with PLL_VCO = 63decimal. The supply current, and therefore; the analog signal amplitude in the VCO is controlled using the field PLL_VCO_RDAC in register PLL_CONFIG1 (8.5.80). This control signal should be set 15decimal initially for 18 mA supply current in the VCO and ~1.4 VPP single ended oscillation amplitude. The PLL has no prescaler, so the DAC sample rate is the VCO frequency. In the PLL feedback path a fixed ÷ 4 frequency divider block receives the VCO output clock and divides its frequency by 4. The maximum operating frequency of the phase-frequency detector (PFD) is approximately 550 MHz. The M (feedback) clock divider takes the output clock signal from the fixed ÷4 block and divides it by a programmable ratio set by the 8-bit field in field PLL_M_M1 in register PLL_CONFIG1 (8.5.80). The programmable division ratio range is ÷1 to ÷256, and is the value of the 8 bit unsigned binary code + 1. Although it is possible to program the M divider to ÷1, ÷2 and ÷3, these values should not be used. As stated previously the PFD and CP have a finite maximum operating frequency, which is the VCO frequency divided by the fixed divider ratio multiplied by the minimum allowable M divider ratio. PFD _ CPFmax Fvco / Fixed _ div x Mdiv min (18) The N (reference) divider determines the ratio between the input reference clock frequency and the PFD operating frequency, and is set by the 5-bit field PLL_N_M1 in register CLK_PLL_CFG (8.5.79). The division ratio range is ÷1 to ÷32, and is the value of the 5-bit unsigned binary code + 1. 76 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Device Functional Modes (continued) The charge pump output current amplitude is set using the 4-bit field PLL_CP_ADJ in in register PLL_CONFIG2 (8.5.81). The current amplitude is simply the digital code multiplied by the unit current amplitude of 100 µA. In a nominal condition, with the LF VCO running at 5.898 GHz, and with the M divider set to ÷4, the PFD will run at 368.625 MHz, and the change pump current should set to 6decimal, which gives 600 µA charge pump output current for a good phase margin of 69 degrees. If a higher M ratio (for lower PFD frequencies) are required the charge pump output current must be increased to maintain good loop stability and prevent excessive peaking in the phase noise response. The charge pump output current setting PLL_CP_ADJ should be adjusted in relation to the feedback (M) divider ratio PLL_M_M1 according to the following table to maintain a constant phase margin of 69 degrees. Table 41. M vs Kp for Maintaining Good Stability M CP_ADJ 4 6 6 9 8 12 10 15 Similarly for the HF VCO running at 8.847 GHz, and with the M divider set to ÷4, the PFD will run at 552.9375 MHz as shown above. Here the change pump current should set to 6decimal, which gives 600 µA charge pump output current for a good phase margin of 69 degrees. 8.4.4 CLKOUT The DAC38RFxx has a programmable output clock on CLKTX+/- balls that is a divided version of the internal DAC sample clock, either with or without PLL. Two frequency dividers, either DACCLK/3 or DACCLK/4, are available by programming field CLK_TX_DIV4 in register CLK_OUT (8.5.71). The output swing voltage is programmable from approximately 125 to 1460 mVPP-DIFF through field CLK_TX_SWING in register CLK_OUT (8.5.71). Field CLK_TX_IDLE in register CLK_OUT (8.5.71) enables an idle state, in which the pins are driven to the proper common-mode levels in order to charge the external AC coupling caps but the clock output is disabled. The output clock circuit can be put to sleep by field CLK_TX_SLEEP in register SLEEP_CONFIG (8.5.70). 8.4.5 Serial Peripheral Interface (SPI) The serial port of the DAC38RFxx is a flexible serial interface which communicates with industry standard microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the operating modes of DAC38RFxx. It is compatible with most synchronous transfer formats and can be configured as a 3 or 4 terminal interface by SIF4_ENA in register IO_CONFIG (8.5.2). In both configurations, SCLK is the serial interface input clock and SDEN is serial interface enable. For 3 terminal configuration, SDIO is a bidirectional terminal for both data in and data out. For 4 terminal configuration, SDIO is bidirectional and SDO is data out only. Data is input into the device with the rising edge of SCLK. Data is output from the device on the falling edge of SCLK. The SPI registers are reset by writing a 1 to SPI_RESET in register RESET_CONFIG (8.5.1). Each read/write operation is framed by signal SDEN (Serial Data Enable Bar) asserted low. The first frame byte is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit address to be accessed. Figure 75 indicates the function of each bit in the instruction cycle and is followed by a detailed description of each bit. The data transfer cycle consists of two bytes. Figure 75. Instruction Byte of the Serial Interface Bit Description 7 (MSB) R/W 6 A6 5 A5 4 A4 3 A3 2 A2 1 A1 0 A0 R/W - Identifies the following data transfer cycle as a read or write operation. A high indicates a read operation from DAC38RFxx and a low indicates a write operation to DAC38RFxx A6:A0 - Identifies the address of the register to be accessed during the read or write operation. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 77 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Figure 76 shows the serial interface timing diagram for a DAC38RFxx write operation. SCLK is the serial interface clock input to DAC38RFxx. Serial data enable SDEN is an active low input to DAC38RFxx. SDIO is serial data input. Input data to DAC38RFxx is clocked on the rising edges of SCLK. Instruction Cycle Data Transfer Cycle SDEN\ SCLK SDIO rwb A6 A5 A4 A3 A2 tS(SDEN\) A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 tSCLK SDEN\ SCLK SDIO tS(SDIO) tH(SDIO) Figure 76. Serial Interface Write Timing Diagram Figure 77 shows the serial interface timing diagram for a DAC38RFxx read operation. SCLK is the serial interface clock input to DAC38RFxx. Serial data enable SDEN\ is an active low input to DAC38RFxx. SDIO is serial data input during the instruction cycle. In 3 pin configuration, SDIO is data out from the DAC38RFxx during the data transfer cycle, while SDO is in a high-impedance state. In 4 pin configuration, both SDIO and SDO are data out from the DAC38RFxx during the data transfer cycle. At the end of the data transfer, SDIO and SDO will output low on the final falling edge of SCLK until the rising edge of SDEN when they will 3-state. Instruction Cycle Data Transfer Cycle SDEN\ SCLK SDIO rwb A6 A5 A4 A3 A2 SDO A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 SDEN\ SCLK SDIO SDO Data n Data n-1 td(Data) Figure 77. Serial Interface Read Timing Diagram n the SIF interface there are four types of registers: 8.4.5.1 NORMAL (RW) The NORMAL register type allows data to be written and read from. All 16-bits of the data are registered at the same time. There is no synchronizing with an internal clock thus all register writes are asynchronous with respect to internal clocks. There are three subtypes of NORMAL: 1. AUTOSYNC: A NORMAL register that causes a sync to be generated after the write is finished. These are used when it is desirable to synchronize the block after writing the register or for a single field that spans across multiple registers. For instance, the NCO requires three 16-bit register writes to set the frequency. Upon writing the last of these registers an autosync is generated to deliver the entire field to the NCO block at once, rather than in pieces after each individual register write. For a field that spans multiple registers, all non-AUTOSYNC registers for the field must be written first before the actual AUTOSYNC register. 78 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 2. No RESET Value: These are NORMAL registers, but the reset value cannot be specified. This could be because the register has some read_only bits or some internal logic partially controls the bit values. 3. READ_ONLY (R): Registers that can only be read. 8.4.5.2 WRITE_TO_CLEAR (W0C) These registers are just like NORMAL registers with one exception. They can be written and read, however, when the internal logic asynchronously sets a bit high in one of these registers, that bit stays high until it is written to ‘0’. This way interrupts will be captured and stay constant until cleared by the user. 8.5 Register Maps Table 42. Register Summary Address Reset Acronym Register Name Section General Configuration Registers (PAGE_SET[2:0] = 000) 0x00 0x5803 RESET_CONFIG Chip Reset and Configuration 8.5.1 0x01 0x1800 IO_CONFIG IO Configuration 8.5.2 0x02 0xFFFF ALM_SD_MASK Lane Signal Detect Alarm Mask 8.5.3 0x03 0xFFFF ALM_CLK_MASK Clock Alarms Mask 8.5.4 0x04 0x0000 ALM_SD_DET SERDES Loss of Signal Detection Alarms 8.5.5 0x05 0x0000 ALM_SYSREF_DET SYSREF Alignment Circuit Alarms 8.5.6 0x06 variable TEMP_PLLVOLT Temperature Sensor and PLL Loop Voltage 8.5.7 0x07-0x08 0x0000 Reserved Reserved 0x09 0x0000 PAGE_SET Page Set 0x0A-0x77 0x0000 Reserved Reserved 0x78 0x0000 SYSREF_ALIGN_R SYSERF Align to r1 and r3 Count 8.5.9 0x79 0x0000 SYSREF12_CNT SYSREF Phase Count 1 and 2 8.5.10 8.5.11 0x7A 0x0000 SYSREF34_CNT SYSREF Phase Count 3 and 4 0x7B-0x7E 0x0000 Reserved Reserved 0x7F 0x0008 VENDOR_VER Vendor ID and Chip Version 8.5.8 8.5.12 Multi-DUC Configuration Registers (PAGE_SET[0] = 1 for multi-DUC1, PAGE_SET[1] = 1 for multi-DUC2) 0x0A 0x02B0 MULTIDUC_CFG1 Multi-DUC Configuration (PAP, Interpolation) 0x0B 0x0000 Reserved Reserved 8.5.13 0x0C 0x2402 MULTIDUC_CFG2 Multi-DUC Configuration (Mixers) 8.5.14 0x0D 0x8300 JESD_FIFO JESD FIFO Control 8.5.15 0x0E 0x00FF ALM_MASK1 Alarm Mask 1 8.5.16 0x0F 0x1F83 ALM_MASK2 Alarm Mask 2 8.5.17 0x10 0xFFFF ALM_MASK3 Alarm Mask 3 8.5.18 0x11 0xFFFF ALM_MASK4 Alarm Mask 4 8.5.19 0x12 0x0000 JESD_LN_SKEW JESD Lane Skew 8.5.20 0x13-0x16 0x0000 Reserved Reserved 0x17 0x0000 CMIX CMIX Configuration 0x18 0x0000 Reserved Reserved 8.5.21 0x19 0x0000 OUTSUM Output Summation and Delay 0x1A-0x1B 0x0000 Reserved Reserved 8.5.22 0x1C 0x0000 PHASE_NCOAB Phase offset for AB path NCO 8.5.23 0x1D 0x0000 PHASE_NCOCD Phase offset for CD path NCO 8.5.24 0x1E-0x20 0x0000 FREQ_NCOAB Frequency for AB path NCO 8.5.25 0x21-0x23 0x0000 FREQ_NCOCD Frequency for CD path NCO 8.5.26 0x24 0x0010 SYSREF_CLKDIV SYSREF Use for Clock Divider 8.5.27 0x25 0x7700 SERDES_CLK Serdes Clock Control 8.5.28 0x26 0x0000 Reserved Reserved 0x27 0x1144 SYNCSEL1 Sync Source Selection 8.5.29 0x28 0x0000 SYNCSEL2 Sync Source Selection 8.5.30 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 79 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Register Maps (continued) Table 42. Register Summary (continued) Address Reset Acronym Register Name Section 0x29 0x0000 PAP_GAIN_AB PAP path AB Gain Attenuation Step 8.5.31 0x2A 0x0000 PAP_WAIT_AB PAP path AB Wait Time at Gain = 0 8.5.32 0x2B 0x0000 PAP_GAIN_CD PAP path CD Gain Attenuation Step 8.5.33 0x2C 0x0000 PAP_WAIT_CD PAP path CD Wait Time at Gain = 0 8.5.34 0x2D 0x1FFF PAP_CFG_AB PAP path AB Configuration 8.5.35 0x2E 0x1FFF PAP_CFG_CD PAP path CD Configuration 8.5.36 0x2F 0x0000 SPIDAC_TEST1 Configuration for DAC SPI Constant 8.5.37 0x30 0x0000 SPIDAC_TEST2 DAC SPI Constant 8.5.38 0x31 0x0000 Reserved Reserved 0x32 0x0800 GAINAB Gain for path AB 8.5.39 0x33 0x0800 GAINCD Gain for path CD 8.5.40 0x34-0x40 0x0000 Reserved Reserved 0x41 0x0000 JESD_ERR_CNT JESD Error Counter 0x42-0x45 0x0000 Reserved Reserved 0x46 0x0044 JESD_ID1 JESD ID 1 8.5.42 0x47 0x190A JESD_ID2 JESD ID 2 8.5.43 0x48 0x31C3 JESD_ID3 JESD ID 3 and Subclass 8.5.44 0x49 0x0000 Reserved Reserved 0x4A 0x0003 JESD_LN_EN JESD Lane Enable 8.5.45 0x4B 0x1300 JESD_RBD_F JESD RBD Buffer and Frame Octets 8.5.46 0x4C 0x1303 JESD_K_L JESD K and L Parameters 8.5.47 0x4D 0x0100 JESD_M_S JESD M and S Parameters 8.5.48 0x4E 0x0F4F JESD_N_HD_SCR JESD N, HD and SCR Parameters 8.5.49 0x4F 0x1CC1 JESD_MATCH JESD Character Match and Other 8.5.50 0x50 0x0000 JESD_LINK_CFG JESD Link Configuration Data 8.5.51 0x51 0x00FF JESD_SYNC_REQ JESD Sync Request 8.5.52 0x52 0x00FF JESD_ERR_OUT JESD Error Output 8.5.53 8.5.54 8.5.55 8.5.41 0x53 0x0100 JESD_ILA_CFG1 JESD Configuration Value used for ILA Check 0x54 0x8E60 JESD_ILA_CFG2 JESD Configuration Value used for ILA Check 0x55-0x5B 0x0000 Reserved Reserved 0x5C 0x0001 JESD_SYSR_MODE JESD SYSREF Mode 0x5D-0x5E 0x0000 Reserved Reserved 0x5F 0x0123 JESD_CROSSBAR1 JESD Crossbar Configuration 1 8.5.57 0x60 0x4567 JESD_CROSSBAR2 JESD Crossbar Configuration 2 8.5.58 0x61-0x63 0x0000 Reserved Reserved 0x64 0x0000 JESD_ALM_L0 JESD Alarms for Lane 0 8.5.59 0x65 0x0000 JESD_ ALM_L1 JESD Alarms for Lane 1 8.5.60 0x66 0x0000 JESD_ ALM_L2 JESD Alarms for Lane 2 8.5.61 0x67 0x0000 JESD_ALM_L3 JESD Alarms for Lane 3 8.5.62 0x68 0x0000 JESD_ALM_L4 JESD Alarms for Lane 4 8.5.63 0x69 0x0000 JESD_ALM_L5 JESD Alarms for Lane 5 8.5.64 0x6A 0x0000 JESD_ALM_L6 JESD Alarms for Lane 6 8.5.65 0x6B 0x0000 JESD_ALM_L7 JESD Alarms for Lane 7 8.5.66 0x6C 0x0000 ALM_SYSREF_PAP SYSREF and PAP Alarms 8.5.67 0x6D 0x0000 ALM_CLKDIV1 Clock Divider Alarms 1 8.5.68 0x6E-0x77 0x0000 Reserved Reserved 8.5.56 Miscellaneous Configuration Registers (PAGE_SET[1:0] = 00, PAGE_SET[2] = 1) 0x0A 80 0xFC03 CLK_CONFIG Submit Documentation Feedback Clock Configuration 8.5.69 Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Register Maps (continued) Table 42. Register Summary (continued) Address Reset Acronym Register Name Section 0x0B 0x0022 SLEEP_CONFIG Sleep Configuration 8.5.70 0x0C 0xA002 CLK_OUT Divided Output Clock Configuration 8.5.71 0x0D 0xF000 DACFS DAC Fullscale Current 8.5.72 0x0E-0x0F 0x0000 Reserved Reserved 0x10 0x0000 LCMGEN Internal sysref generator 8.5.73 0x11 0x0000 LCMGEN_DIV Counter for internal sysref generator 8.5.74 0x12 0x0000 LCMGEN_SPISYSREF SPI SYSREF for internal sysref generator 8.5.75 0x13-0x1A 0x0000 Reserved Reserved 0x1B 0x0000 DTEST Digital Test Signals 0x1C-0x22 0x0000 Reserved Reserved 8.5.76 0x23 0x03F3 SLEEP_CNTL Sleep Pin Control 8.5.77 0x24 0x1000 SYSR_CAPTURE SYSREF Capture Circuit Control 8.5.78 0x25-0x30 0x0000 Reserved Reserved 0x31 0x0200 CLK_PLL_CFG Clock Input and PLL Configuration 8.5.79 0x32 0x0308 PLL_CONFIG1 PLL Configuration 1 8.5.80 0x33 0x4018 PLL_CONFIG2 PLL Configuration 2 8.5.81 0x34 0x0000 LVDS_CONFIG LVDS Output Configuration 8.5.82 0x35 0x0018 PLL_FDIV Fuse farm clock divider 8.5.83 0x36-0x3A 0x0000 Reserved Reserved 0x3B 0x0002 SRDS_CLK_CFG Serdes Clock Configuration 8.5.84 0x3C 0x8228 SRDS_PLL_CFG Serdes PLL Configuration 8.5.85 0x3D 0x0088 SRDS_CFG1 Serdes Configuration 1 8.5.86 0x3E 0x0909 SRDS_CFG2 Serdes Configuration 2 8.5.87 0x3F 0x0000 SRDS_POL Serdes Polarity Control 8.5.88 0x40-0x75 0x0000 Reserved Reserved 0x76 0x0000 SYNCBOUT JESD204B SYNCB Output 8.5.89 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 81 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.1 Chip Reset and Configuration Register (address = 0x00) [reset = 0x5803] Figure 78. Chip Reset and Configuration Register (RESET_CONFIG) 15 0 RW 14 0 RW 13 0 RW 12 0 RW 11 0 RW 10 0 RW 9 0 RW 8 x RW 7 0 RW 6 0 RW 5 0 RW 4 0 RW 3 0 RW 2 0 RW 1 0 RW 0 0 RW LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 43. RESET_CONFIG Field Descriptions Bit Field Type Reset Description 15 SPI_RESET RW 0 This will reset all the SPI registers once programmed. 14 ALM_OUT_POL RW 1 Changes the polarity of the alarm output. 0= active low 1= active high 13 ALM_OUT_ENA RW 0 Turn on the alarm pin 12 SYSCLK_ENA RW 1 Turns on the dividers for the SYSCLK to the Fusefarm 11 AUTOLOAD_TRIG RW 1 Causes a Fuse AUTOLOAD to be executed. 10:7 Reserved RW 0000 Reserved 6 ONE_DAC_ONLY RW 0 When set high only the SLICE0 is available. 5 ONE_LINK_ONLY RW 0 This needs to be set high when a single link setup is being programmed to get the correct TXENABLE signal generation 4:2 82 Reserved RW 000 Reserved 1 INIT_SLICE1 RW 1 Puts the multi-DAC2 JESD into initialization state 0 INIT_SLICE0 RW 1 Puts the multi-DAC1 JESD into initialization state Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.2 IO Configuration Register (address = 0x01) [reset = 0x1800] Figure 79. IO Configuration Register (IO_CONFIG) 15 0 R/W 14 0 R/W 13 0 R/W 12 1 R/W 11 1 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 44. IO_CONFIG Field Descriptions Bit Field Type Reset Description 15:14 GPO0_SEL RW 00 Selects the JESD SYNC_N signal coming out the GPO0 pin. Both bits can be asserted which does an oring of the SYNC_N signals from each multi-DUC. bit 0 = 1 then multi-DUC1 SYNC_N used bit 1 = 1 then multi-DUC2 SYNC_N is used 13:12 SYNC0B_SEL RW 01 Selects the JESD SYNC_N signal coming out the SYNC0B pin. Both bits can be asserted which does an oring of the SYNC_N signals from each multi-DUC. bit 0 = 1 then multi-DUC1 SYNC_N used bit 1 = 1 then multi-DUC2 SYNC_N is used 11:10 SYNC1B_SEL RW 10 Selects the JESD SYNC_N signal coming out the SYNC1B pin. Both bits can be asserted which does an oring of the SYNC_N signals from each multi-DUC. bit 0 = 1 then multi-DUC1 SYNC_N used bit 1 = 1 then multi-DUC2 SYNC_N is used 9:8 GPO1_SEL RW 00 Selects the JESD SYNC_N signal coming out the GPO1 pin. Both bits can be asserted which does an oring of the SYNC_N signals from each multi-DUC. bit 0 = 1 then multi-DUC1 SYNC_N used bit 1 = 1 then multi-DUC2 SYNC_N is used 7 SPI4_ENA RW 0 When set to a '1' the chip is in 4 pin SPI interface mode. 6 Reserved RW 0 Reserved ATEST RW 000000 Select the analog test points: 000000: ATEST is off (ATEST Must be off during normal operation) 000001, 010001, 000110: VSSCLK 000010: VDDPLL1 000101: VDDCLK 000111, 001010, 010000: VDDAPLL18 001011: VDDAVCO18 001101: VDDS18 001110: VDDE1 001111, 111010, 111011, 111100: DGND 010011: VDDTX1 101001, 110001: AGND 101111, 111101, 111110, 11111: VDDDIG1 110000: VDDA18 5:0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 83 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.3 Lane Single Detect Alarm Mask Register (address = 0x02) [reset = 0xFFFF] Figure 80. Lane Single Detect Alarm Mask Register (ALM_SD_MASK) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 45. ALM_SD_MASK Field Descriptions Bit Field 15:0 Type ALM_SD_MASK R/W Reset Description 0xFFFF Used to mask alarms bit 15 - bit 8 : Reserved bit7 : lane 7 loss of signal detect bit6 : lane 6 loss of signal detect bit5 : lane 5 loss of signal detect bit4 : lane 4 loss of signal detect bit3 : lane 3 loss of signal detect bit2 : lane 2 loss of signal detect bit1 : lane1 loss of signal detect bit0 : lane 0 loss of signal detect 8.5.4 Clock Alarms Mask Register (address = 0x03) [reset = 0xFFFF Figure 81. Clock Alarms Mask Register (ALM_CLK_MASK) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 46. ALM_CLK_MASK Field Descriptions Bit Field 15:0 84 ALM_CLK_MASK Type R/W Reset Description 0xFFFF Used to mask alarms bit 15 - bit 8 : Reserved bit 7 : alarm_sysrefphase4 bit 6 : alarm_sysrefphase3 bit 5 : alarm_sysrefphase2 bit 4 : alarm_sysrefphase1 bit 3 : alarm_align_to_r3 bit 2 : alarm_align_to_r1 bit 1 : alarm_sd0_pll bit 0 : alarm_sd1_pll Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.5 SERDES Loss of Signal Detection Alarms Register (address = 0x04) [reset = 0x0000] Figure 82. SERDES Loss of Signal Detection Alarms Register (ALM_SD_DET) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 0 W0C 5 0 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 0 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset Table 47. ALM_SD_DET Field Descriptions Bit 15:8 7:0 Field Type Reset Description Reserved W0C 0x00 Reserved 0x00 Loss of signal detect outputs from the SERDES lanes: bit 7 = lane7 loss of signal bit 6 = lane6 loss of signal bit 5 = lane5 loss of signal bit 4 = lane4 loss of signal bit 3 = lane3 loss of signal bit 2 = lane2 loss of signal bit 1 = lane1 loss of signal bit 0 = lane0 loss of signal ALM_SD_LOSDET W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 85 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.6 SYSREF Alignment Circuit Alarms Register (address = 0x05) [reset = 0x0000] Figure 83. SYSREF Alignment Circuit Alarms Register (ALM_SYSREF_DET) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 0 W0C 5 0 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 0 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset Table 48. ALM_SYSREF_DET Field Descriptions Bit Field Type Reset Description Reserved W0C 0000000 Reserved 8 ALM_SYSRPHASE4 W0C 0 If high the sysrefphase4 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. 7 ALM_SYSRPHASE3 W0C 0 If high the sysrefphase3 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. 6 ALM_SYSRPHASE2 W0C 0 If high the sysrefphase2 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. 5 ALM_SYSRPHASE1 W0C 0 If high the sysrefphase1 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. 4 ALM_ALIGN_TO_R3 W0C 0 If high the align_to_r3 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. TI Internal use only. 3 ALM_ALIGN_TO_R1 W0C 0 If high the align_to_r1 state has been observed in the sysrefalign logic at least once since the last sysrefalign sync. TI Internal use only. 2 ALM_SD0_PLL W0C 0 Driven high if the PLL in the Serdes 0 block goes out of lock. A false alarm is generated at startup when the PLL is locking. User will have to reset this bit after start to monitor accurately. 1 ALM_SD1_PLL W0C 0 Driven high if the PLL in the Serdes 1 block goes out of lock. A false alarm is generated at startup when the PLL is locking. User will have to reset this bit after start to monitor accurately. 0 PLL_LOCK W0C 0 Asserted when PLL is unlocked. 15:9 86 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.7 Temperature Sensor and PLL Loop Voltage Register (address = 0x06) [reset = variable] Figure 84. Temperature Sensor and PLL Loop Voltage Register (TEMP_PLLVOLT) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 1 R 1 1 R 0 0 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 49. TEMP_PLLVOLT Field Descriptions Bit Field Type Reset Description 15:8 TEMPDATA R 0x00 8 bits of data from the tempurature sensor 7:5 PLL_LFVOLT R 0b000 PLL Loop filter voltage 4:0 Reserved R 0b000 Reserved 8.5.8 Page Set Register (address = 0x09) [reset = 0x0000] Figure 85. Page Set Register (PAGE_SET) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 50. PAGE_SET Field Descriptions Bit 15:0 Field PAGE_SET Type R/W Reset Description 0x0000 Each bit selects a page that is active. Multiple pages can be selected at the same time. No bits asserted means that MASTER is the only page selected. bit 0 = page0 : multi-DUC1 bit 1 = page1 : multi-DUC2 bit 2 = page2 : DIG_MISC bit 3-15: Reserved Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 87 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.9 SYSREF Align to r1 and r3 Count Register (address = 0x78) [reset = 0x0000] Figure 86. SYSREF Align to r1 and r3 Count Register (SYSREF_ALIGN_R) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 1 R 4 1 R 3 1 R 2 0 R 1 0 R 0 0 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 51. SYSREF_ALIGN_R Field Descriptions Bit Field Type Reset Description 15:8 ALIGN_TO_R1_CNT R 0x00 Part of the SYSREF Align block 7:0 ALIGN_TO_R3_CNT R 0x00 Part of the SYSREF Align block 8.5.10 SYSREF Phase Count 1 and 2 Register (address = 0x79) [reset = 0x0000] Figure 87. SYSREF Phase Count 1 and 2 Register (SYSREF12_CNT) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 1 R 4 1 R 3 1 R 2 0 R 1 0 R 0 1 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 52. SYSREF12_CNT Field Descriptions Bit 88 Field Type Reset Description 15:8 PHASE2_CNT R 0x00 Part of the SYSREF Align block 7:0 PHASE1_CNT R 0x00 Part of the SYSREF Align block Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.11 SYSREF Phase Count 3 and 4 Register (address = 0x7A) [reset = 0x0000] Figure 88. SYSREF Phase Count 3 and 4 Register (SYSREF34_CNT) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 1 R 4 1 R 3 1 R 2 0 R 1 1 R 0 0 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 53. SYSREF34_CNT Field Descriptions Bit Field Type Reset Description 15:8 PHASE4_CNT R 0x00 Part of the SYSREF Align block 7:0 PHASE3_CNT R 0x00 Part of the SYSREF Align block 8.5.12 Vendor ID and Chip Version Register (address = 0x7F) [reset = 0x0008]] Figure 89. Vendor ID and Chip Version Register (VENDOR_VER) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 1 R 4 1 R 3 1 R 2 1 R 1 1 R 0 1 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 54. VENDOR_VER Field Descriptions Bit Field Type Reset Description 15 AUTOLOAD_DONE R 0 Asserted when the Fusefarm Autoload sequence is done 14:10 EFC_ERR R 00000 The error output from the fuse farm. 9:5 Reserved R 00000 Reserved 4:3 VENDORID R 01 TI identification 2:0 VERSION R 001 Bits to determine what version of build for the chip. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 89 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.13 Multi-DUC Configuration (PAP, Interpolation) Register (address = 0x0A) [reset = 0x02B0] Figure 90. Multi-DUC Configuration (PAP, Interolation) Register (MULTIDUC_CFG1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 1 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 55. MULTIDUC_CFG1 Field Descriptions 90 Bit Field Type Reset Description 15 DUAL_IQ R/W 0 When asserted the SLICE uses both IQ paths 14 ISFIR_ENA R/W 0 Turns on the inverse sync filter for the AB and CD paths when programmed to 1. 13 Not used R/W 0 Not used 12:8 INTERP R/W 00010 Determines the interpolation amount. 00000: 1x 00001: 2x 00010: 4x 00011: 6x 00100: 8x 00101: 10x 00110: 12x 01000: 16x 01001: 18x 01010: 20x 01100: 24x 7 ALM_ZEROS_TXEN R/W 1 When asserted any alarm that isn’t masked will mid-level the DAC output by setting the txenable_from_dig to ‘0’ 6 DAC_COMPLEMENT R/W 0 When asserted the DAC output will be 2's complemented. This helps with hookup at the board level. 5 ALM_ZEROS_JESD R/W 1 When asserted any alarm that isn’t masked will zero the data coming out of the JESD block. 4 ALM_OUT_ENA R/W 1 When asserted the output from the selected SLICE will be passed on to the MASTER alarm control if it is also turned on then the alarm will be sent to the pad_alarm pin. 3 PAPA_ENA R/W 0 Turns on the Power Amp Protection logic for path A. 2 PAPB_ENA R/W 0 Turns on the Power Amp Protection logic for path B. 1 PAPC_ENA R/W 0 Turns on the Power Amp Protection logic for path C. 0 PAPD_ENA R/W 0 Turns on the Power Amp Protection logic for path D. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.14 Multi-DUC Configuration (Mixers) Register (address = 0x0C) [reset = 0x2402] Figure 91. Multi-DUC Configuration (Mixers) Register (MULTIDUC_CFG2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 1 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 56. MULTIDUC_CFG2 Field Descriptions Bit Field Type Reset Description DAC_BITWIDTH R/W 0b00 Determines the bit width of the data going to the DAC 00: 14 bits 01: 14 bits 10: 12 bits 11: 11 bits 13 ZERO_INVLD_DATA R/W 1 When asserted; the data from the JESD block is zeroed in the mapper to prevent goofy output from the DAC. For test purposes this bit should be desasserted 12 SHORTTEST_ENA R/W 0 Turns on the JESD SHORT pattern test (5.1.6.2) 11 Reserved R/W 0 Reserved 10 Reserved R/W 1 Reserved 9 MIXERAB_ENA R/W 0 Turns on the mixer for the A and B streams 8 MIXERCD_ENA R/W 0 Turns on the mixer for the C and D streams 7 MIXERAB_GAIN R/W 0 Adds 6dB of gain when asserted 6 MIXERCD_GAIN R/W 0 Adds 6dB of gain when asserted 5 NCOAB_ENA R/W 0 When high the full NCO block is turned on. 4 NCOCD_ENA R/W 0 When high the full NCO block is turned on. Reserved R/W 00 Reserved 1 TWOS R/W 1 When asserted the chip is expecting 2's complement data is arriving through the JESD; otherwise offset binary is expected 0 Reserved R/W 0 Reserved 15:14 3:2 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 91 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.15 JESD FIFO Control Register (address = 0x0D) [reset = 0x1300] Figure 92. JESD FIFO Control Register (JESD_FIFO) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 57. JESD_FIFO Field Descriptions Bit Field Type Reset Description 15 FIFO_ZEROS_DATA R/W 1 When asserted FIFO errors zero the data out of the JESD block. For test purposes this could be turned off to allow test patterns in the FIFO. NOT USED R/W 000 Not Used 12 SRDS_FIFO_ALM_CLR R/W 0 Set to 1 to clear FIFO errors. Must be set to 0 for proper FIFO operation 11 14:13 Not used R/W 0 Not used 10:8 FIFO_OFFSET R/W 0000 Used to set the difference between read and write pointers in the JESD FIFO. 7:1 Reserved R/W 0 Reserved SPI_TXENABLE R/W 0 When asserted the internal value of txenable = '1' 0 8.5.16 Alarm Mask 1 Register (address = 0x0E) [reset = 0x00FF] Figure 93. Alarm Mask 1 Register (ALM_MASK1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 58. ALM_MASK1 Field Descriptions Bit 15:0 92 Field Type Reset Description ALM_MASK1 R/W 0x00FF Each bit is used to mask an alarm. Assertion masks the alarm: bit 15 = mask lane7 lane errors bit 14 = mask lane6 lane errors bit 13 = mask lane5 lane errors bit 12 = mask lane4 lane errors bit 11 = mask lane3 lane errors bit 10 = mask lane2 lane errors bit 9 = mask lane1 lane errors bit 8 = mask lane0 lane errors bit 7 = mask lane7 FIFO flags bit 6 = mask lane6 FIFO flags bit 5 = mask lane5 FIFO flags bit 4 = mask lane4 FIFO flags bit 3 = mask lane3 FIFO flags bit 2 = mask lane2 FIFO flags bit 1 = mask lane1 FIFO flags bit 0 = mask lane0 FIFO flags Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.17 Alarm Mask 2 Register (address = 0x0F) [reset = 0xFFFF] Figure 94. Alarm Mask 2 Register (ALM_MASK2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 59. ALM_MASK2 Field Descriptions Bit 15:0 Field Type Reset Description ALMS_MASK2 R/W 0xFFFF Each bit is used to mask an alarm. Assertion masks the alarm: bit 15 = not used bit 14 = not used bit 13 = not used bit 12 = mask SYSREF errors on link0 bit 11 = mask alarm from JESD shorttest bit 10 = mask alarm from PAPD bit 9 = mask alarm from PAPC bit 8 = mask alarm from PAPB bit 7 = mask alarm from PAPA bit 6 = not used bit 5 = not used bit 4 = not used bit 3 = not used bit 2 = not used bit 1 = mask alarm_clkdiv192_eq_zero bit 0 = mask alarm_clkdiv192_eq_mult1 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.18 Alarm Mask 3 Register (address = 0x10) [reset = 0xFFFF] Figure 95. Alarm Mask 3 Register (ALM_MASK3) 15 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 60. ALM_MASK3 Field Descriptions Bit 15:0 94 Field Type Reset Description ALMS_MASK3 R/W 0xFFFF Each bit is used to mask an alarm. Assertion masks the alarm: bit 15 = mask alarm_clkdiv8_eq_zero bit 14 = mask alarm_clkdiv12_eq_zero bit 13 = mask alarm_clkdiv16_eq_zero bit 12 = mask alarm_clkdiv18_eq_zero bit 11 = mask alarm_clkdiv20_eq_zero bit 10 = mask alarm_clkdiv32_eq_zero bit 9 = mask alarm_clkdiv36_eq_zero bit 8 = mask alarm_clkdiv40_eq_zero bit 7 = mask alarm_clkdiv48_eq_zero bit 6 = mask alarm_clkdiv64_eq_zero bit 5 = mask alarm_clkdiv72_eq_zero bit 4 = mask alarm_clkdiv80_eq_zero bit 3 = mask alarm_clkdiv96_eq_zero bit 2 = maskalarm_ clkdiv128_eq_zero bit 1 = mask alarm_clkdiv144_eq_zero bit 0 = mask alarm_clkdiv160_eq_zero Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.19 Alarm Mask 4 Register (address = 0x11) [reset = 0xFFFF] Figure 96. Alarm Mask 4 Register (ALM_MASK4) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 61. ALM_MASK4 Field Descriptions Bit 15:0 Field Type Reset Description ALMS_MASK4 R/W 0xFFFF Each bit is used to mask an alarm. Assertion masks the alarm: bit 15 = mask alarm_clkdiv8_eq_mult1 bit 14 = mask alarm_clkdiv12_eq_mult1 bit 13 = mask alarm_clkdiv16_eq_mult1 bit 12 = mask alarm_clkdiv18_eq_mult1 bit 11 = mask alarm_clkdiv20_eq_mult1 bit 10 = mask alarm_clkdiv32_eq_mult1 bit 9 = mask alarm_clkdiv36_eq_mult1 bit 8 = mask alarm_clkdiv40_eq_mult1 bit 7 = mask alarm_clkdiv48_eq_mult1 bit 6 = mask alarm_clkdiv64_eq_mult1 bit 5 = mask alarm_clkdiv72_eq_mult1 bit 4 = mask alarm_clkdiv80_eq_mult1 bit 3 = mask alarm_clkdiv96_eq_mult1 bit 2 = maskalarm_ clkdiv128_eq_mult1 bit 1 = mask alarm_clkdiv144_eq_mult1 bit 0 = mask alarm_clkdiv160_eq_mult1 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 95 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.20 JESD Lane Skew Register (address = 0x12) [reset = 0x0000] Figure 97. JESD Lane Skew Register (JESD_LN_SKEW) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 0 R 5 0 R 4 1 R 3 0 R 2 0 R 1 1 R 0 0 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 62. JESD_LN_SKEW Field Descriptions Bit Field Type Reset Description 15:5 NOT USED R 0x0000 Not used 4:0 MEMIN_LANE_SKEW R 0b00000 Measure of the lane skew for each link only. Bits are READ_ONLY 8.5.21 CMIX Configuration Register (address = 0x17) [reset = 0x0000] Figure 98. CMIX Configuration Register (CMIX) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 63. CMIX Field Descriptions Bit Type Reset Description 15:12 CMIX_AB R/W 0x0 These bits turn on the different coarse mixing options. Combining the different options together can result in every possible n x Fs/8 [n=0->7]. Below is the valid programming table: cmix=(mem_fs8; mem_fs4; mem_fs2; mem_fsm4) 0000 : no mixing 0001 : -fs/4 0010 : fs/2 0100 : fs/4 1000 : fs/8 1100 : 3fs/8 1010 : 5fs/8 1110 : 7fs/8 11:4 Reserved R/W 00000000 0 Reserved 0x0 These bits turn on the different coarse mixing options. Combining the different options together can result in every possible n x Fs/8 [n=0->7]. Below is the valid programming table: cmix=(mem_fs8; mem_fs4; mem_fs2; mem_fsm4) 0000 : no mixing 0001 : -fs/4 0010 : fs/2 0100 : fs/4 1000 : fs/8 1100 : 3fs/8 1010 : 5fs/8 1110 : 7fs/8 3:0 96 Field CMIX_CD R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.22 Output Summation and Delay Register (address = 0x19) [reset = 0x0000] Figure 99. Output Summation and Delay Register (OUTSUM) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 64. OUTSUM Field Descriptions Bit Field Type Reset Description 15:12 OUTPUT_DELAY R/W 0x0 Delays the output to the DAC 0 to 15 clock cycles 11:4 Reserved R/W 0x00 Reserved 0x0 Selects the output summing functions. Each bit selects another sample to sum. Multiple bits can be selected. bit 0 = add the path AB sample bit 1 = add the path CD sample bit 2 = add adjacent DAC path AB sample bit 3 = add adjacent DAC path CD sample 3:0 OUTSUM_SEL R/W 8.5.23 NCO Phase Path AB Register (address = 0x1C) [reset = 0x0000] Figure 100. NCO Phase Path AB Register (PHASE_NCOAB) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 65. PHASE_NCOAB Field Descriptions Bit 15:0 Field Type Reset Description PHASE_NCO1 Auto Sync 0x0000 The phase offset for the FULL NCO1 in the AB datapath. 8.5.24 NCO Phase Path CD Register (address = 0x1D) [reset = 0x0000] Figure 101. NCO Phase Path CD Register (PHASE_NCOCD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 0 R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 66. PHASE_NCOCD Field Descriptions Bit 15:0 Field Type Reset Description PHASE_NCO12 Auto Sync 0x0000 The phase offset for the FULL NCO2 in the CD datapath. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 97 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.25 NCO Frequency Path AB Register (address = 0x1E-0x20) [reset = 0x0000 0000 0000] Figure 102. NCO Frequency Path AB Register (FREQ_NCOAB) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 67. FREQ_NCOAB Field Descriptions Bit 47:0 Field Type Reset Description FREQ_NCOAB R/W 0x0000 0000 0000 NCO frequency word for AB data path. 8.5.26 NCO Frequency Path CD Register (address = 0x21-0x23) [reset = 0x0000 0000 0000] Figure 103. NCO Frequency Path CD Register (FREQ_NCOCD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 68. FREQ_NCOCD Field Descriptions Bit Field 47:0 98 FREQ_NCOCD Type Reset Description R/W 0x0000 0000 0000 NCO frequency word for CD data path. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.27 SYSREF Use for Clock Divider Register (address = 0x24) [reset = 0x0010] Figure 104. SYSREF Use for Clock Divder Register (SYSREF_CLKDIV) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 69. SYSREF_CLKDIV Field Descriptions Bit Field Type Reset Description 15 Reserved R/W 0 Reserved 14:12 CDRVSER_SYSREF_DLY R/W 000 Programmable delay the SYSREF by N dacclk cycles to the CDRV_SER clock dividers. By offsetting the clock to the different multi-DUC blocks, clock mixing could potentially be reduced. 11:7 Not used R/W 00000 Not used 6:4 SYSREF_MODE R/W 001 Determines how SYSREF is used to sync the clock dividers in the CDRV_SER block. 000 = Don’t use SYSREF pulse 001 = Use all SYSREF pulses 010 = Use only the next SYSREF pulse 011 = Skip one SYSREF pulse then use only the next one 100 = Skip one SYSREF pulse then use all pulses. 3:2 SYSREF_DLY R/W 00 Delays the SYSREF into the CDRV_SER capture FF through 1 of 4 choices. This allows for extra delay in case the timing of the clock or SYSREF path isn’t as good as we think. 1:0 Reserved R/W 00 Reserved Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 99 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.28 Serdes Clock Control Register (address = 0x25) [reset = 0x7700] Figure 105. Serdes Clock Control Register (SERDES_CLK) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 70. SERDES_CLK Field Descriptions Bit Field 15:12 100 CLKJESD_DIV Type R/W Reset Description 0x7 This controls the selection of the clk_jesd output 0000 = div4 0001 = div8 0010 = div12 0011 = div16 0100 = div18 0101 = div20 0110 = div24 0111 = div32 1001 = div36 1010 = div48 1011 = div64 1100 = div5.333 1101 = div10.666 1110 = div21p333 11:8 CLKJESD_OUT_DIV R/W 0x7 This controls the selection of the clk_jesd_out output 0000 = div8 0001 = div16 0010 = div32 0011 = div48 0100 = div64 0101 = div80 0110 = div96 0111 = div128 1000 = div144 1001 = div160 1010 = div192 7:0 Reserved R/W 0x0 Reserved Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.29 Sync Source Control 1 Register (address = 0x27) [reset = 0x1144] Figure 106. Sync Source Control 1 Register (SYNCSEL1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 71. SYNCSEL1 Field Descriptions Bit 15:12 11:8 7:4 3:0 Field SYNCSEL_MIXERAB SYNCSEL_MIXERCD SYNCSEL_NCOAB SYNCSEL_NCOCD Type R/W R/W R/W R/W Reset Description 0x1 Controls the syncing of the double buffered SPI registers for the mixerAB block. These bits are enables so a ‘1’ in the bit place allows the sync to pass to the block. bit 0 = auto-sync from SPI register write bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync 0x1 Controls the syncing of the double buffered SPI registers for the mixerCD block. These bits are enables so a ‘1’ in the bit place allows the sync to pass to the block. bit 0 = auto-sync from SPI register write bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync 0x4 Controls the syncing of NCOAB accumulators. These bits are enables so a ‘1’ in the bit place allows the sync to pass to the block. bit 0 = ‘0’ bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync 0x4 Controls the syncing of NCOCD accumulators. These bits are enables so a ‘1’ in the bit place allows the sync to pass to the block. bit 0 = ‘0’ bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 101 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.30 Sync Source Control 2 Register (address = 0x28) [reset = 0x0000] Figure 107. Sync Source Control 2 Register (SYNCSEL2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 72. SYNCSEL2 Field Descriptions Bit Field Type Reset Description 15:12 Reserved R/W 0x0 Reserved 11:8 SYNCSEL_PAPAB R/W 0x0 Select the sync for the PAP A and B. bit 0 = ‘0’ bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync 7:4 SYNCSEL_PAPCD R/W 0x0 Select the sync for the PAP C and D. bit 0 = ‘0’ bit 1 = sysref bit 2 = sync_out from JESD bit 3 = mem_spi_sync 3:2 Reserved R/W 0b00 Reserved 1 SPI_SYNC R/W 0 This is used to generate the SPI_SYNC signal 0 Reserved R/W 0 Reserved 8.5.31 PAP path AB Gain Attenuation Step Register (address = 0x29) [reset = 0x0000] Figure 108. PAP path AB Gain Attenuation Step Register (PAP_GAIN_AB) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 73. PAP_GAIN_AB Field Descriptions Bit 15:10 9:0 102 Field Type Reset Description NOT USED RW 000000 Not Used 0x000 Gain attenuation step PAPAB_GAIN_STEP Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.32 PAP path AB Wait Time Register (address = 0x2A) [reset = 0x0000] Figure 109. PAP path AB Wait Time Register (PAP_WAIT_AB) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 74. PAP_WAIT_AB Field Descriptions Bit 15:10 9:0 Field Type Reset Description Reserved 000000 R/W Reserved PAPAB_WAIT 0x000 R/W Number of clock cycles to wait after gain = 0 8.5.33 PAP path CD Gain Attenuation Step Register (address = 0x2B) [reset = 0x0000] Figure 110. PAP path CD Gain Attenuation Step Register (PAP_GAIN_CD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 75. PAP_GAIN_CD Field Descriptions Bit 15:10 9:0 Field Type Reset Description Not Used R/W 000000 Not Used PAPCD_GAIN_STEP R/W 0x000 Gain attenuation step 8.5.34 PAP Path CD Wait Time Register (address = 0x2C) [reset = 0x0000] Figure 111. PAP path CD Wait Time Register (PAP_WAIT_CD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 76. PAP_WAIT_CD Field Descriptions Bit 15:10 9:0 Field Type Reset Description Reserved R/W 000000 Reserved PAPCD_WAIT R/W 0x000 Number of clock cycles to wait after gain = 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 103 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.35 PAP path AB Configuration Register (address = 0x2D) [reset = 0x0FFF] Figure 112. PAP path AB Configuration Register (PAP_CFG_AB) 15 0 R/W 14 0 R/W 13 Reserved R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 77. PAP_CFG_AB Field Descriptions Bit Field 15:14 13 12:0 Type Reset Description PAPAB_SEL_DLY R/W 00 Controls the length of the delayline in the PAP AB logic. 00 : N =32 01 : N = 64 10 : N = 128 11 : Not Valid Reserved R/W 0 Reserved PAPAB_THRESH R/W 0xFFF The threshold for the PAP AB trigger. 8.5.36 PAP path CD Configuration Register (address = 0x2E) [reset = 0x0FFF] Figure 113. PAP path CD Configuration Register (PAP_CFG_CD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 78. PAP_CFG_CD Field Descriptions Bit Field 15:14 13 12:0 104 Type Reset Description PAPCD_SEL_DLY R/W 00 Controls the length of the delay line in the PAP CD logic. 00 : N = 32 01 : N = 64 10 : N = 128 11 : Not Valid Reserved R/W 0 Reserved PAPCD_THRESH R/W 0xFFF The threshold for the PAP CD trigger. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.37 DAC SPI Configuration Register (address = 0x2F) [reset = 0x0000] Figure 114. DAC SPI Constant 1 Register (SPIDAC_TEST1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 79. SPIDAC_TEST1 Field Descriptions Bit 15:1 0 Field Type Reset Description Reserved R/W 0x0000 Reserved SPIDAC_ENA R/W 0 When asserted the DAC output is set to the value in register SPIDAC. This can be used for trim setting and other static tests. 8.5.38 DAC SPI Constant Register (address = 0x30) [reset = 0x0000] Figure 115. DAC SPI Constant Register (SPIDAC_TEST2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 80. SPIDAC_TEST2 Field Descriptions Bit 15:0 Field Type Reset Description SPIDAC R/W 0x0000 This value replaces the data at the output of the JESD so that the DAC value can be controlled Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 105 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.39 Gain for path AB Register (address = 0x32) [reset = 0x0000] Figure 116. Gain for path AB Register (GAINAB) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 81. GAINAB Field Descriptions Bit Field Type Reset Description 15 GAINAB_ENA R/W 0 Turns on the path AB gain block 14:12 Reserved R/W 0x0 Reserved 11:0 GAINAB R/W 0x400 Extra control of gain in the GAINAB block. This allows a fix gain to be added to the signal if needed. 8.5.40 Gain for path CD Register (address = 0x33) [reset = 0x0000] Figure 117. Gain for path CD Register (GAINCD) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 82. GAINCD Field Descriptions Bit Field Type Reset Description 15 GAINCD_ENA R/W 0 Turns on the Path CD gain block 14:12 Reserved R/W 0x0 Reserved 11:0 GAINCD R/W 0x400 Extra control of gain in the GAINCD block. This allows a fix gain to be added to the signal if needed. 106 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.41 JESD Error Counter Register (address = 0x41) [reset = 0x0000] Figure 118. JESD Error Counter Register (JESD_ERR_CNT) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R 0 1 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 83. JESD_ERR_CNT Field Descriptions Bit 15:0 Field Type Reset Description JESD_ERR_CNT R 0x0000 This is the error count for the JESD link. This is a 16bit value that is not cleared until the JESD synchronization is required or errcnt_clr is programmed to '1' 8.5.42 JESD ID 1 Register (address = 0x46) [reset = 0x0044] Figure 119. JESD ID 1 Register (JESD_ID1) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 x R 7 0 R 6 1 R 5 0 R 4 0 R 3 0 R 2 1 R 1 1 R 0 0 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 84. JESD_ID1 Field Descriptions Bit Field Type Reset Description 15:11 LID0 R/W 00000 JESD ID for lane 0 10:6 LID1 R/W 00001 JESD ID for lane 1 5:1 LID2 R/W 00010 JESD ID for lane 2 Reserved R/W 0 Reserved 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 107 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.43 JESD ID 2 Register (address = 0x47) [reset = 0x190A] Figure 120. JESD ID 2 Register (JESD_ID2) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 1 R 5 0 R 4 0 R 3 0 R 2 1 R 1 1 R 0 1 R LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 85. JESD ID 2 Register (JESD_ID2) Bit Field Type Reset Description 15:11 LID3 R/W 00011 JESD ID for lane 3 10:6 LID4 R/W 00100 JESD ID for lane 4 5:1 LID5 R/W 00101 JESD ID for lane 5 Reserved R/W 0 Reserved 0 8.5.44 JESD ID 3 and Subclass Register (address = 0x48) [reset = 0x31C3] Figure 121. JESD ID 3 Register (JESD_ID3) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 86. JESD_ID3 Field Descriptions Bit Field Type Reset Description 15:11 LID6 R/W 00110 JESD ID for lane 6 10:6 LID7 R/W 00111 JESD ID for lane 7 5:4 Reserved R/W 00 Reserved 3:1 0 108 SUBCLASSV R/W 001 Selects the JESD subclass supported. Note: “001” is subclass 1 and “000” is subclass 0 they are the only modes supported; not used for operation but used for configuration. See field MIN_LATENCY_ENA in register JESD_MATCH (9.5.46) for use in subclass0 JESDV R/W 1 Selects the version of JESD support(0=A; 1=B) NOTE: JESD 204B is only supported version. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.45 JESD Lane Enable Register (address = 0x4A) [reset = 0x0003] Figure 122. JESD Lane Enable Register (JESD_LN_EN) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 87. JESD_LN_EN Field Descriptions Bit 15:8 Field LANE_ENA Type Reset Description 0x00 Turn on each lane as needed. Signal is active high. bit 15 : lane7 enable bit 14 : lane6 enable bit 13 : lane5 enable bit 12 : lane4 enable bit 11 : lane3 enable bit 10 : lane2 enable bit 9 : lane1 enable bit 8 : lane0 enable 7:6 JESD_TEST_SEQ 00 Set to select and verify link layer test sequences. The error for these sequences comes out the lane alarms bit0. 1= a fail and 0 = pass. 00 : test sequence disabled 01 : verify repeating D.21.5 high frequency pattern for random jitter 10 : verify repeating K.28.5 mixed frequency pattern for deterministic jitter 11 : verify repeating ILA sequence 5:2 Reserved 0x0 Reserved 11 Used to tell the JESD block how many clock phases are being used for lanes. 00 = 1 phase 01 = 2 phases 10 = 4 phases 11 = 8 phases 1:0 JESD_PHASE_MODE Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 109 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.46 JESD RBD Buffer and Frame Octets Register (address = 0x4B) [reset = 0x1300] Figure 123. JESD RBD Buffer and Frame Octets Register (JESD_RBD_F) 15 14 13 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 0 R/W R/W R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 2 0 R/W 1 1 R/W 0 1 R/W R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 88. JESD_RBD_F Field Descriptions Bit Field Type Reset Description 15:13 Reserved R/W 00 Reserved 12:8 RBD R/W 10011 This controls the amount of elastic buffers being used in the JESD. Larger numbers will mean more latency; but smaller numbers may not hold enough data to capture the input skew. This value must always be ≤ mem_k 7:0 F_M1 R/W 0x00 This is the number of octets in the frame - 1 8.5.47 JESD K and L Parameters Register (address = 0x4C) [reset = 0x1303] Figure 124. JESD K and L Parameters Register (JESD_K_L) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 89. JESD_K_L Field Descriptions Field Type Reset Description 15:13 Bit Reserved R/W 000 Reserved 12:8 K_M1 R/W 10011 The number of frames in a multi-frame - 1. 0 ≤ k - 1 < 32 7:5 Reserved R/W 0 Reserved 4:0 L_M1 R/W 00011 The number of lanes used by the JESD - 1. 0 ≤ L -1 < 8 110 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.48 JESD M and S Parameters Register (address = 0x4D) [reset = 0x0100] Figure 125. JESD M and S Parameters Register (JESD_M_S) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 0 R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 90. JESD_M_S Field Descriptions Bit Field Type Reset Description 15:8 M_M1 R/W 0x01 The number of streams per frame - 1. 0 ≤ M - 1 < 256 7:5 Reserved R/W 000 Reserved 4:0 S_M1 R/W 00000 The number of samples per stream per frame - 1. 8.5.49 JESD N, HD and SCR Parameters Register (address = 0x4E) [reset = 0x0F4F] Figure 126. JESD N, HD and SCR Parameters Register (JESD_N_HD_SCR) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 0 R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 91. JESD_N_HD_SCR Field Descriptions Field Type Reset Description 15:13 Bit Reserved R/W 000 Reserved 12:8 NPRIME_M1 R/W 01111 The number of adjusted bits per sample - 1 7 Reserved R/W 0 Reserved 6 HD R/W 1 High density mode. Samples can cross the lane boundary 5 SCR R/W 0 Turn on the scrambler 4:0 N_M1 R/W 01111 The number of bits per sample - 1 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 111 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.50 JESD Character Match and Other Register (address = 0x4F) [reset = 0x1CC1] Figure 127. JESD Character Match and Other Parameters Register (JESD_MATCH) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 92. JESD_MATCH Field Descriptions Bit Field Type Reset Description MATCH_DATA R/W 0x1C The character to match for buffer release. Normally it is a /R/=/K28.0/-0x1C but with these bits the user can program the value. 7 MATCH_SPECIFIC R/W 1 Match a specific charater to start the JESD buffering when asserted; otherwise the first non-K will start the buffering. 6 MATCH_CTRL R/W 1 When asserted the match character is a CONTROL character instead of a DATA character. 5 NO_LANE_SYNC R/W 0 Assert if the TX side does not support lane initialization. This way the RX won’t flag errors in the configuration portion of the ILA. Not Used R/W 000 Not Used 1 MIN_LATENCY_ENA R/W 0 Enable minimum latency when set. This is needed for subclass 0 support. 0 JESD_COMMAALIGN_ENA R/W 1 When asserted the JESD block SERDES comma align signal will be added with the SERDES ALIGN bit(0) to control when to shut off comma alignment. When this bit is deasserted; then the programmed bit(spi_config62(11)) is the only control. 15:8 4:2 112 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.51 JESD Link Configuration Data Register (address = 0x50) [reset = 0x0000] Figure 128. JESD Link Configuration Data Register (JESD_LINK_CFG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 93. JESD_Link_CFG Field Descriptions Bit Field Type Reset Description 15-12 ADJCNT R/W 0x0 Lane configuration data for link. Reserved by DAC38RF8x except for lane configuration checking. 11 ADJDIR R/W 0 Lane configuration data for link. Reserved by DAC38RF8x except for lane configuration checking. 10-7 BID R/W 0x0 Lane configuration data for link. Reserved by DAC38RF8x except for lane configuration checking. 6-2 CF R/W 00000 Lane configuration data for link. Reserved by DAC38RF8x except for lane configuration checking. 1-0 CS R/W 00 Lane configuration data for link. Reserved by DAC38RF8x except for lane configuration checking. 8.5.52 JESD Sync Request Register (address = 0x51) [reset = 0x00FF] Figure 129. JESD Sync Request Register (JESD_SYNC_REQ) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 94. JESD_SYNC_REQ Field Descriptions Bit 15:8 7:0 Field Type Reset Description DID R/W 0x00 Lane configuration 0xFF These bits select which errors cause a sync request. Sync requests take priority over the error notification; so if sync request isn’t desired; set these bits to a ‘0’. bit 7 = multi-frame alignment error bit 6 = frame alignment error bit 5 = link configuration error bit 4 = elastic buffer overflow (bad RBD value) bit 3 = elastic buffer end char mismatch (match_ctrl match_data) bit 2 = code synchronization error bit 1 = 8b/10b not-in-table code error bit 0 = 8b/10b disparity error SYNC_REQUEST R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 113 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.53 JESD Error Output Register (address = 0x52) [reset = 0x00FF] Figure 130. JESD Error Output Register (JESD_ERR_OUT) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 95. JESD_ERR_OUT Field Descriptions Bit Field Type Reset Description Reserved R/W 000000 Reserved 9 DISABLE_ERR_RPT R/W 0 Assertion means that errors will not be reported on the sync_n output. 8 PHADJ R/W 0 Lane configuration 0xFF These bits select the errors generated are counted in the err_c for the link. The bits also control what signals are sent out the pad_syncb pin for error notification. bit 7 = multi-frame alignment error bit 6 = frame alignment error bit 5 = link configuration error bit 4 = elastic buffer overflow (bad RBD value) bit 3 = elastic buffer end char mismatch (match_ctrl match_data) bit 2 = code synchronization error bit 1 = 8b/10b not-in-table code error bit 0 = 8b/10b disparity error 15:10 7:0 ERR_ENA R/W 8.5.54 JESD ILA Check 1 Register (address = 0x53) [reset = 0x0100] Figure 131. JESD ILA Check 1 Register (JESD_ILA_CFG1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 96. JESD_ILA_CFG1 Field Descriptions 114 Bit Field Type Reset Description 15:8 ILA_M R/W 0x01 JESD M-1 configuration value used only for ILA checking; may be set independently of the actual JESD mode 7:0 ILA_F R/W 0x00 JESD F-1 configuration value used only for ILA checking; may be set independently of the actual JESD mode Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.55 JESD ILA Check 2 Register (address = 0x54) [reset = 0x8E60] Figure 132. JESD ILA Check 2 Register (JESD_ILA_CFG2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 97. JESD_ILA_CFG2 Field Descriptions Bit Field Type Reset Description 15 ILA_HD R/W 1 JESD HD configuration value used only for ILA checking; may be set independently of the actual JESD mode 14:10 ILA_L R/W 00011 JESD L-1 configuration value used only for ILA checking; may be set independently of the actual JESD mode 9:5 ILA_K R/W 10011 JESD K-1 configuration value used only for ILA checking; may be set independently of the actual JESD mode 4:0 ILA_S R/W 00000 JESD S-1 configuration value used only for ILA checking; may be set independently of the actual JESD mode 8.5.56 JESD SYSREF Mode Register (address = 0x5C) [reset = 0x0001] Figure 133. JESD SYSREF Mode Register (JESD_SYSR_MODE) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 98. JESD_SYSR_MODE Field Descriptions Bit 15:4 3 2:0 Field Type Reset Description Reserved R/W 0x000 Reserved ERR_CNT_CLR R/W 0 A transition from 0->1 causes the error_cnt to be cleared 001 Determines how SYSREF is used in the JESD synchronizing block. 000 = Don’t use SYSREF pulse 001 = Use all SYSREF pulses 010 = Use only the next SYSREF pulse 011 = Skip one SYSREF pulse then use only the next one 100 = Skip one SYSREF pulse then use all pulses. 101 = skip two SYSREFs and then use one 110 = skip two SYSREFs and then use all SYSREF_MODE R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 115 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.57 JESD Crossbar Configuration 1 Register (address = 0x5F) [reset = 0x0123] Figure 134. JESD Crossbar Configuration 1 Register (JESD_CROSSBAR1) 15 Reserved R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 Reserved R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 99. JESD_CROSSBAR1 Field Descriptions Bit Field Type Reset Description 15 Reserved R/W 0 Reserved 14:12 11 10:8 7 6:4 3 2:0 116 OCTETPATH0_SEL R/W 000 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved OCTETPATH1_SEL R/W 001 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved OCTETPATH2_SEL R/W 010 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved 011 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 OCTETPATH3_SEL R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.58 JESD Crossbar Configuration 2 Register (address = 0x60) [reset = 0x4567] Figure 135. JESD_CROSSBAR2 Field DBits to Determine What Version of Build for the chip.escriptions 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 100. JESD_CROSSBAR2 Field Descriptions Bit Field Type Reset Description 15 Reserved R/W 0 Reserved 14:12 11 10:8 7 6:4 3 2:0 OCTETPATH4_SEL R/W 100 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved OCTETPATH5_SEL R/W 101 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved OCTETPATH6_SEL R/W 110 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 Reserved R/W 0 Reserved 111 These bits are used by the cross-bar switch to map any lane to any other lane. The 3 bit term tells the mapper block what lane this particular lane is supposed to be treated as. 000 = treat as lane0 001 = treat as lane1 010 = treat as lane2 011 = treat as lane3 100 = treat as lane4 101 = treat as lane5 110 = treat as lane6 111 = treat as lane7 OCTETPATH7_SEL R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 117 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.59 JESD Alarms for Lane 0 Register (address = 0x64) [reset = 0x0000] Figure 136. JESD Alarms for Lane 0 Register (JBits to determine what version of build for the chip.ESD_ALM_L0) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 0 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 101. JESD_ALM_L0 Field Descriptions Bit Type Reset Description 15:8 ALM_LANE0_ERR W0C 0x00 Lane0 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane0 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 118 Field ALM_FIFO0_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.60 JESD Alarms for Lane 1 Register (address = 0x65 01100101) [reset = 0x0000] Figure 137. JESD Alarms for Lane 1 Register (JESD_ALM_L1) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 0 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 102. JESD_ALM_L1 Field Descriptions Bit Field Type Reset Description 15:8 ALM_LANE1_ERR W0C 0x00 Lane1 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane1 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 ALM_FIFO1_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 119 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.61 JESD Alarms for Lane 2 Register (address = 0x66) [reset = 0x0000] Figure 138. JESD Alarms for Lane 2 Register (JESD_ALM_L2) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 1 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 103. JESD_ALM_L2 Field Descriptions Bit Type Reset Description 15:8 ALM_LANE2_ERR W0C 0x00 Lane2 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane2 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 120 Field ALM_FIFO2_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.62 JESD Alarms for Lane 3 Register (address = 0x67) [reset = 0x0000] Figure 139. JESD Alarms for Lane 3 Register (JESD_ALM_L3) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 0 W0C 2 1 W0C 1 1 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 104. JESD_ALM_L3 Field Descriptions Bit Field Type Reset Description 15:8 ALM_LANE3_ERR W0C 0x00 Lane3 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane3 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 ALM_FIFO3_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 121 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.63 JESD Alarms for Lane 4 Register (address = 0x68) [reset = 0x0000] Figure 140. JESD Alarms for Lane 4 Register (JESD_ALM_L4) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 0 W0C 1 0 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 105. JESD_ALM_L4 Field Descriptions Bit Type Reset Description 15:8 ALM_LANE4_ERR W0C 0x00 Lane4 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane4 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 122 Field ALM_FIFO4_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.64 JESD Alarms for Lane 5 Register (address = 0x69) [reset = 0x0000] Figure 141. 8.4.60 JESD Alarms for Lane 5 Register (address = 0x69) [reset = 0x0000] 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 0 W0C 1 0 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 106. JESD_ALM_L5 Field Descriptions Bit Field Type Reset Description 15:8 ALM_LANE5_ERR W0C 0x00 Lane5 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane5 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 ALM_FIFO5_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 123 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.65 JESD Alarms for Lane 6 Register (address = 0x6A [reset = 0x0000] Figure 142. JESD Alarms for Lane 6 Register (JESD_ALM_L6) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 0 W0C 1 1 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 107. JESD_ALM_L6 Field Descriptions Bit Type Reset Description 15:8 ALM_LANE6_ERR W0C 0x00 Lane6 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane6 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 124 Field ALM_FIFO6_FLAGS W0C Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.66 JESD Alarms for Lane 7 Register (address = 0x6B) [reset = 0x0000] Figure 143. JESD Alarms for Lane 7 Register (JESD_ALM_L7) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 0 W0C 1 1 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 108. JESD Alarms for Lane 7 Register (JESD_ALM_L7) Bit Field Type Reset Description 15:8 ALM_LANE7_ERR W0C 0x00 Lane7 errors: bit 15 = multiframe alignment error bit 14 = frame alignment error bit 13 = link configuration error bit 12 = elastic buffer overflow (bad RBD value) bit 11 = elastic buffer match error. The first non-/K/ doesn’t match “match_ctrl” and “match_data” programmed values. bit 10 = code synchronization error bit 9 = 8b/10b not-in-table code error bit 8 = 8b/10b disparity error 7:4 Reserved W0C 0x0 Reserved 0x0 Lane7 FIFO errors: bit 3 = write_error : High if write request and FIFO is full (NOTE: only released when JESD block is initialize with mem_init_state) bit 2 = write_full : FIFO is FULL bit 1 = read_error : High if read request with empty FIFO (NOTE: only released when JESD block is initialize with mem_init_state) bit 0 = read_empty : FIFO is empty 3:0 ALM_FIFO7_FLAGS W0C 8.5.67 SYSREF and PAP Alarms Register (address = 0x6C) [reset = 0x0000] Figure 144. SYSREF and PAP Alarms Register (ALM_SYSREF_PAP) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 1 W0C 1 0 W0C 0 0 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 109. ALM_SYSREF_PAP Field Descriptions Bit Field Type Reset Description Reserved W0C 0 Reserved 12 ALM_SYSREF_ERR W0C Alarm caused when the sysref is placed at an incorrect location 11 ALM_FROM_SHORTTEST W0C This is the alarm from JESD during the SHORT TEST checking. 10:7 ALM_PAP W0C 0x0 The alarms from the PAP blocks indicated which PAP was triggered. bit0 = PAPA bit1 = PAPB bit2 = PAPC bit3 = PAPD 6:2 Reserved W0C 0x0 Reserved 1 ALM_DIV192_ZERO W0C 0 This is asserted if the clkdiv192 in the CDRV_SER shift register is all zeros. 0 Not Used W0C 0 Not Used 15:13 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 125 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.68 Clock Divider Alarms 1 Register (address = 0x6D) [reset = 0x0000] Figure 145. Clock Divider Alarms 1 Register (ALM_CLKDIV1) 15 0 W0C 14 0 W0C 13 0 W0C 12 0 W0C 11 0 W0C 10 0 W0C 9 0 W0C 8 x W0C 7 0 W0C 6 1 W0C 5 1 W0C 4 0 W0C 3 1 W0C 2 1 W0C 1 0 W0C 0 1 W0C LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset Table 110. ALM_CLKDIV1 Field Descriptions 126 Bit Field Type Reset Description 15 ALM_DIV8_ZERO W0C 0 Asserted if the clkdiv8 in the CDRV_SER shift register is all zeros. 14 ALM_DIV12_ZERO W0C 0 Asserted if the clkdiv12 in the CDRV_SER shift register is all zeros. 13 ALM_DIV16_ZERO W0C 0 Asserted if the clkdiv16 in the CDRV_SER shift register is all zeros. 12 ALM_DIV24_ZERO W0C 0 Asserted if the clkdiv24 in the CDRV_SER shift register is all zeros. (Connected to the div18 port) 11 ALM_DIV20_ZERO W0C 0 Asserted if the clkdiv20 in the CDRV_SER shift register is all zeros. 10 ALM_DIV32_ZERO W0C 0 Asserted if the clkdiv32 in the CDRV_SER shift register is all zeros. 9 ALM_DIV36_ZERO W0C 0 Asserted if the clkdiv36 in the CDRV_SER shift register is all zeros. 8 ALM_DIV40_ZERO W0C 0 Asserted if the clkdiv40 in the CDRV_SER shift register is all zeros. 7 ALM_DIV48_ZERO W0C 0 Asserted if the clkdiv48 in the CDRV_SER shift register is all zeros. 6 ALM_DIV64_ZERO W0C 0 Asserted if the clkdiv64 in the CDRV_SER shift register is all zeros. 5 ALM_DIV72_ZERO W0C 0 Asserted if the clkdiv72 in the CDRV_SER shift register is all zeros. 4 ALM_DIV80_ZERO W0C 0 Asserted if the clkdiv80 in the CDRV_SER shift register is all zeros. 3 ALM_DIV96_ZERO W0C 0 Asserted if the clkdiv96 in the CDRV_SER shift register is all zeros. 2 ALM_DIV128_ZERO W0C 0 Asserted if the clkdiv128 in the CDRV_SER shift register is all zeros. 1 ALM_DIV144_ZERO W0C 0 Asserted if the clkdiv144 in the CDRV_SER shift register is all zeros. 0 ALM_DIV160_ZERO W0C 0 Asserted if the clkdiv160 in the CDRV_SER shift register is all zeros. Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.69 Clock Configuration Register (address = 0x0A) [reset = 0xF000] Figure 146. Clock Configuration Register (CLK_CONFIG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 111. CLK_CONFIG Field Descriptions Bit Field Type Reset Description 15 RCLK_SYNC_ENA RW 1 When asserted the sysref is used to sync the clock divider in the centralclkdiv. This should be disabled after initial syncing. 14 FRCLK_DIV_ENA RW 1 When asserted the full rate clock divider that provides the DIV4 phases to the DACs is enabled 13 DACA_FRCLK_ENA RW 1 When asserted the full rate clock to the DACA block is enabled 12 DACB_FRCLK_ENA RW 1 When asserted the full rate clock to the DACB block is enabled 11 DACA_DUMDATA RW 0 Enables distortion enhancement for DACA when set high 10 DACB_DUMDATA RW 0 Enables distortion enhancement for DACB when set high 9:2 Reserved RW 0x000 Reserved 1 QRCLOCK_DACA_ENA RW 1 Turns on the quarter rate clock for DACA when '1' 0 QRCLOCK_DACB_ENA RW 1 Turns on the quarter rate clock for DACB when '1' 8.5.70 Sleep Configuration Register (address = 0x0B) [reset = 0x0022] Figure 147. Clock Configuration Register (SLEEP_CONFIG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 112. SLEEP_CONFIG Field Descriptions Bit 15:9 Field Type Reset Description Reserved RW 0000000 Reserved 8 VBGR_SLEEP RW 0 Turns off the 'bandgap-over-R' bias 7 Reserved RW 0 Reserved 6 TSENSE_SLEEP RW 0 Turns off the temperature sensor 5 PLL_SLEEP RW 1 Puts the PLL into sleep mode (FUSE Controlled) 4 CLKRECV_SLEEP RW 0 When asserted the clock input receiver gets put into sleep mode. This also affects the FIFO_OSTR receiver as well. 3 DACA_SLEEP RW 0 Puts the DACA into sleep mode 2 DACB_SLEEP RW 0 Puts the DACB into sleep mode 1 CLK_TX_SLEEP RW 1 When asserted the PLL TX clock output is in low power mode. 0 Reserved RW 0 Reserved Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 127 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.71 Divided Output Clock Configuration Register (address = 0x0C) [reset = 0x8000] Figure 148. Divided Output Clock Configuration Register (CLK_OUT) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 113. CLK_OUT Field Descriptions Bit Field Type Reset Description 15 CLK_TX_IDLE R/W 1 When high puts the CLK_TX circuitry in idle mode during which the CLKTX+ and CLKTX- output pins are driven to the proper common-mode levels in order to charge the external AC coupling caps. When low allows the divided clock to be driven onto the CLKTX+ and CLKTX- output pins. CLK_TX_DIVSELECT R/W 01 Selects either div2, div3 or div 4 output. 00 = divided by 3 01 = divided by 4 10 = divided by 2 11 = not valid 14:13 12 128 Reserved R/W 0 Reserved 11:8 CLK_TX_SWING R/W 0x0 Sets desired swing on CLKTX+ and CLKTX- outputs in mVppdiff 0x0 125 0x1 232 0x2 337 0x3 440 0x4 540 0x5 639 0x6 736 0x7 831 0x8 924 0x9 1012 0xA 1097 0xB 1178 0xC 1255 0xD 1329 0xE 1398 0xF 1462 7:3 Reserved R/W 00000 Reserved 2 CLK_TX_FLIP R/W 0 Flips the polarity of CLKTX 1 TX_SYNC_ENA R/W 1 Syncs the CLKTX with SYSREF when asserted 0 EXTREF_ENA R/W 0 Allows the chip to use an external refernce(1) or the internal reference(0) Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.72 DAC Fullscale Current Register (address = 0x0D) [reset = 0xF000] Figure 149. DAC Fullscale Current Register (DACFS) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 114. DACFS Field Descriptions Bit Field Type Reset Description 15:12 DACFS R/W 0xF Scales the output current is 16 equal steps from 10-40mA (10mA + 2mA*DACFS) 10:0 Reserved R/W 0x000 Reserved 8.5.73 Internal SYSREF Generator Register (address = 0x10) [reset = 0x0000] Figure 150. Internal SYSREF Register (LCMGEN) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 115. LCMGEN Field Descriptions Bit Field Type Reset Description Reserved R/W 0x00 Reserved 3 LCMGEN_ENA R/W 0 Enables the LCM custom logic 2 LCMGEN_RESET R/W 0 Reset the LCM custom logic 1 LCMGEN_SPI_SYSREF_ENA R/W 0 TBD 0 LCM_SYSREF_OUTSEL R/W 0 Chooses between internal and external SYSREF 15:4 8.5.74 Counter for Internal SYSREF Generator Register (address = 0x11) [reset = 0x0000] Figure 151. Counter for Internal SYSREF Generator Register (LCMGEN_DIV) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 116. LCMGEN_DIV Field Descriptions Bit 15:0 Field Type Reset Description LCMGEN_DIV R/W 0x00 Counter setting for the LCMGEN block Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 129 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.75 SPI SYSREF for Internal SYSREF Generator Register (address = 0x12) [reset = 0x0000] Figure 152. SPI SYSREF for Internal SYSREF Generator Register (LCMGEN_SPISYSREF) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 117. LCMGEN_SPISYSREF Field Descriptions Bit 15:1 0 Field Type Reset Description Reserved R/W 0x00 Reserved LCMGEN_SPI_SYSREF R/W 0 SPI SYSREF for the LCMGEN block 8.5.76 Digital Test Signals Register (address = 0x1B) [reset = 0x0000] Figure 153. Digital Test Signals Register (DTEST) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 0 R/W 4 1 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 118. DTEST Field Descriptions Bit Field Type Reset Description 15 Reserved R/W 0 Reserved DTEST_LANE R/W 000 Selects the lane to check for the signals selected by field DTEST 14:12 130 11:8 DTEST R/W 0x0 Allows digital test signals to come out the ALARM pin. 0000 : Test disabled; normal ALARM pin function 0001 : SERDES lanes 0 – 3 PLL clock/80 0010 : SERDES lanes 4 – 7 PLL clock/80 0011 : TESTFAIL (lane selected by field DTEST_LANE) 0100 : SYNC (lane selected by field DTEST_LANE) 0101 : OCIP (lane selected by field DTEST_LANE) 0110 : EQUNDER (lane selected by field DTEST_LANE) 0111 : EQOVER (lane selected by field DTEST_LANE) 1000 – 1111 : not used 7:0 Reserved R/W 0x00 Reserved Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.77 Sleep Pin Control Register (address = 0x23) [reset = 0xFFFF] These fields control the routing of the SLEEP signal to different blocks. Assertion means that the SLEEP signal will be sent to the block. These bits do not override the SPI bits; just the SLEEP signal from the PAD. Figure 154. Sleep Pin Control Register (SLEEP_CNTL) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 119. SLEEP_CNTL Field Descriptions Bit 15:10 Field Type Reset Description Reserved R/W 11111 Reserved 9 CLKOUT_SLEEP R/W 1 Allows the output clock to sleep 8 BG_SLEEP R/W 1 Allows the band gap to sleep 7 TEMP_SLEEP R/W 1 Allows the temp sensor to sleep 6 PLL_CP_SLEEP R/W 1 Allows the PLL charge pump to sleep 5 PLL_SLEEP R/W 1 Allows the PLL to sleep 4 CLK_RECV_SLEEP R/W 1 Allows the clock receiver to sleep 3:2 Reserved R/W 11 Reserved 1 DACB_SLEEP R/W 1 Allows DACB to sleep 0 DACA_SLEEP R/W 1 Allows DACA to sleep Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 131 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.78 SYSREF Capture Circuit Control Register (address = 0x24) [reset = 0x1000] Figure 155. SYSREF Capture Circuit Control Register (SYSR_CAPTURE) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 1 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 120. SYSR_CAPTURE Field Descriptions Bit Field 15:14 13:12 11 10:2 1 0 132 SYSR_PHASE_WDW SYSR_ALIGN_DLY Type R/W R/W Reset Description 00 sysref phase alignment tolerance window Centers sysref capture window as follows: 00 = Centered on phase φ12 (**DEFAULT**) 01 = Centered on phase φ23 10 = Centered on phase φ34 11 = Centered on phase φ41 01 sysref alignment offset delay Optional alignment offset that allows system designer to work around hardware (e.g. PCB) alignment errors by letting him specify that the sysref pulse should be treated as occurring one device clock earlier or later than its observed position. Legal settings are as follows: 00 = Offset by -1 device clock cycles. Treat sysref as if it were captured 1 cycle earlier. 01 = No offset (**DEFAULT**) 10 = Offset by +1 device clock cycles. Treat sysref as if it were captured 1 cycle later. 11 = Reserved SYSR_STATUS_ENA R/W 0 Enable alignment status monitoring Enable logic that generates sysref alignment status information and accumulates statistics that can be read by the user. 0 = Disable sysref alignment status outputs (**DEFAULT**). Used during normal operation. 1 = Enable sysref alignment status outputs. Used when characterizing sysref capture timing. Reserved R/W 0x000 Reserved SYSR_ALIGN_SYNC R/W 0 Write a ‘1’ to this bit to clear accumulated sysref align statistics 0 Bypass sysref alignment logic. Bypass the 4x oversampled sysref alignment logic and instead capture the sysref signal using the legacy implementation of a flip-flop clocked directly by the rising edge of the device clock. 0 = Capture sysref using full-featured alignment circuit (**DEFAULT**) 1 = Bypass sysref alignment logic NOTE: When mem_sysref_bypass_align is enabled, the other sysref alignment controls have no effect. SYSR_BYPS_ALIGN R/W Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.79 Clock Input and PLL Configuration Register (address = 0x31) [reset = 0x0200] Figure 156. Clock Input and PLL Configuration Register (CLK_PLL_CFG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 121. Clock Input and PLL Configuration Register (CLK_PLL_CFG) Bit Field Type Reset Description Reserved R/W 00 Reserved 13 SEL_EXTCLK_DIFFSE R/W 0 Selects the external differential or single ended clock for DACCLK. 0 = differential 1 = single ended 12 PLL_RESET R/W 0 When set the M divider; N divider and PFD are held reset 11 PLL_NDIVSYNC_ENA R/W 0 When asserted; the SYSREF input is used to sync the N dividers of the PLL. 10 PLL_ENA R/W 0 Enables the PLL output as the DAC clock when set; the clock provided at the DACCLKP/N is used as the PLL reference clock. When cleared; the PLL is bypassed and the clock provided at the DACCLKP/N pins is used as the DAC clock 9 PLL_CP_SLEEP R/W 1 Must be set to '0' for proper PLL operation. 1 = Charge pump is put to sleep and can be driven by external source through the ATEST pins. 8 15:14 Reserved R/W 0 Reserved 7:3 PLL_N_M1 R/W 00000 Reference clock divider; divide by is N+1 2:0 LOCKDET_ADJ R/W 000 Adjusts the lock detector sensitivity. Upper bit isn't used: x00 - highest sensitivity x11 - lowest sensitivity Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 133 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.80 PLL Configuration 1 Register (address = 0x32) [reset = 0x0308] Figure 157. PLL Configuration 1 Register (PLL_CONFIG1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 122. CONFIG1 Field Descriptions Bit Field Type Reset Description 15:8 PLL_M_M1 R/W 0x03 VCO feedback divider; divide by is 4(M+1) 7:4 Reserved R/W 0x0 Reserved 3:0 PLL_VCO_RDAC R/W 0x8 Controls the VCO amplitude 8.5.81 PLL Configuration 2 Register (address = 0x33) [reset = 0x4018] Figure 158. PLL Configuration 2 Register (PLL_CONFIG2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 123. PLL_CONFIG2 Field Descriptions 134 Bit Field Type Reset Description 15 PLL_VCOSEL R/W 0 Selects between two VCOs 0 = 5.9 GHz VCO(2 turn inductor in upper VCO) 1 = 8.9 GHz VCO (1 turn in the lower VCO) 14:8 PLL_VCO R/W 1000000 VCO frequency range 7:6 Reserved R/W 000 Reserved 5:2 PLL_CP_ADJ R/W 0110 Adjusts the charge pump current; 0 to 1.55 mA in 50 µA steps. Setting to 0000 will hold the LPF pin at 0 V 1 Reserved R/W 0 Reserved 0 Reserved R/W 0 Reserved. Always write 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.82 LVDS Output Configuration Register (address = 0x34) [reset = 0x0000] Figure 159. LVDS Output Configuration Register (LVDS_CONFIG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 0 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 124. LVDS_CONFIG Field Descriptions Bit Field Type Reset Description 15 LVDS_LOPWRB R/W 0 LVDS Output current control LSB; allows output current to be scaled from ~2 mA to ~4 mA 14 LVDS_LOPWRA R/W 0 LVDS Output current control MSB; allows output current to be scaled from ~2 mA to ~4 mA 13 LVDS_LPSEL R/W 0 SYNC LVDS output on chip termination control; 100 Ω when cleared; 200 Ω Output current settings for the combination of bits 15:13 110 = 4.00 mA 010 = 3.50 mA 100 = 3.00 mA 000 = 2.50 mA – Default current 111 = 4.00 mA 011 = 3.33 mA 101 = 2.66 mA 001 = 2.00 mA 12 LVDS_EFUSE_SEL R/W 0 Enable LVDS bias bandgap reference voltage to the ATEST multiplexer. LVDS_TRIM R/W 00 Adjusts the LVDS 1.2 V reference. LVDS_TRIM_ENA must be set and LVDS_EFUSE_SEL must be cleared for these bits to have any effect. 10 +70 mV 00 -70 mV 01 default 11 -20 mV. 9 LVDS_TRIM_ENA R/W 0 When set and LVDS_EFUSE_SEL is cleared; the LVDS_TRIM adjustment is enabled. When cleared; the LVDS_TRIM has no effect. 8 LVDS_SYNC0\_PD R/W 0 The SYNC0 LVDS output is in power down. 7 Reserved R/W 0 Reserved 6 LVDS_SYNC0\_CM R/W 0 SYNC0 LVDS output common mode is 1.2 V when cleared; 0.9 V when set. Reserved R/W 0x00 Reserved 11:10 5:0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 135 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.83 Fuse Farm clock divider Register (address = 0x35) [reset = 0x0018] Figure 160. Fuse Farm clock divider Register (PLL_FDIV) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/1W 4 1 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after rese1t Table 125. PLL_FDIV Field Descriptions Bit 136 Field Type Reset Description 15:8 Reserved R/W 0 Reserved 7:0 PLL_FDIV R/W 0x18 Clock divider for the Fuse farm Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.84 Serdes Clock Configuration Register (address = 0x3B) [reset = 0x0002] Figure 161. Serdes Clock Configuration Register (SRDS_CLK_CFG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/1W 4 1 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after rese1t Table 126. SRDS_CLK_CFG Field Descriptions Bit Field Type Reset Description 15 SERDES_CLK_SEL R/W 0 Select either the PLL output of the DACCLK from the pad. 0 = DACCLK pad 1 = PLL output 14:11 SERDES_REFCLK_DIV R/W 0x0 The divide amount for the serdes REFCLK minus 1 10:2 Reserved R/W 0x000 Reserved 10 These bits select the pre-divide on the DACCLK input clock before the DACCLK is used in the dividers used in the SERDES PLL REFCLK and the Fusefarm SYSCLK. 00 = if DACCLK input ≤ 2 GHz; prediv is set to div1 01 = if DACCLK input is ≤ 4 GHz and > 2 GHz, prediv is set to div2 10 = if DACCLK input is ≤ 9 GHz and > 4 GHz, prediv is set to div4 11 = Not valid 1:0 SERDES_REFCLK_PREDIV R/W 8.5.85 Serdes PLL Configuration Register (address = 0x3C) [reset = 0x8228] Figure 162. Serdes PLL Configuration Register (SRDS_PLL_CFG) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 127. SRDS_PLL_CFG Field Descriptions Bit Field Type Reset Description 15 ENDIVCLK R/W 1 Enable divided by 5 output clock 14:3 CLKBYP R/W 00 Serdes clock bypass 12:11 LB R/W 00 Serdes PLL loop bandwidth 10 SLEEPPLL R/W 0 Serdes PLL Sleep 9 VRANGE R/W 1 Serdes PLL loop filter range MPY R/W 00010100 Serdes reference clock multiply factor CORRECT R/W 0 AND'ed with LANE_ENA so it must be set to 1 for correct behavior 8:1 0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 137 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.86 Serdes Configuration 1 Register (address = 0x3D) [reset = 0x0x0088] Figure 163. Serdes Configuration 1 Register (SRDS_CFG1) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 0 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 128. RDS_CFG1 Field Descriptions Bit Field Type Reset Description 15 Reserved R/W 0 Reserved TESTPATT R/W 000 Test pattern 11 BSINRXN R/W 0 Enable boundary scan - pins 10 BSINRXP R/W 0 Enable boundary scan + pins 9:8 14:12 138 Reserved R/W 00 Reserved 7 ENOC R/W 1 Enable Serdes offset compensation 6 EQHLD R/W 0 Equalizer hold 5:3 EQ R/W 001 Serdes equalizer 2:0 CDR R/W 000 Clock data recovery algorithm settings Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 8.5.87 Serdes Configuration 2 Register (address = 0x3E) [reset = 0x0x0909] Figure 164. Serdes Configuration 2 Register (SRDS_CFG2) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 0 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 129. SRDS_CFG2 Field Descriptions Bit Field Type Reset Description 15:13 LOS R/W 000 Enables loss of signal detection. 000 - Enable detection 100 - Disable detection other - reserved 12:11 ALIGN R/W 01 Enables external or internal symbol alignment 00 : Disabled 01 : Comma alignment 10: Align jog TERM R/W 001 Valid programming: 001 – AC coupling with common mode = 0.7 V 100 – 0 V common mode. 101 – 0.25 V common mode 111 – DC coupling with common mode of 0.6 V. (NOTE: This is not compatible with JESD) Reserved R/W 0 Reserved 6:5 RATE R/W 00 Selects full (00), half (01), quarter (10) or eighth (11) rate operation. 4:2 BUSWIDTH R/W 010 Selects the parallel interface width (16 or 20 bits). 0 : 20 bits 1: 16 bits 1 SLEEPRX R/W 0 Powers the receiver down into the sleep (fast power up) state when high. 0 Reserved R/W 1 Reserved 10:8 7 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 139 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 8.5.88 Serdes Polarity Control Register (address = 0x3F) [reset = 0x0000] Figure 165. Serdes Polarity Control Register (SRDS_POL) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 130. SRDS_POL Field Descriptions Bit 15:8 7:0 Field Type Reset Description Reserved R/W 0x00 Reserved 0x00 Allows the PN pairs of the different lanes to be inverted. bit 7 = lane7 bit 6 = lane6 bit 5 = lane5 bit 4 = lane4 bit 3 = lane3 bit 2 = lane2 bit 1 = lane1 bit 0 = lane0 INVPAIR R/W 8.5.89 JESD204B SYNCB OUTPUT Register (address = 0x76) [reset = 0x0000] Figure 166. JESD204B SYNCB OUTPUT Register (SYNCBOUT) 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 x R/W 7 0 R/W 6 0 R/W 5 1 R/1W 4 1 R/W 3 1 R/W 2 0 R/W 1 1 R/W 0 1 R/W LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 131. SYNCBOUT Field Descriptions Bit Field Type Reset Description Reserved R/W 0x00 Reserved 1 SYNCBOUT1 R/W 0 If the CMOS SYNC outputs are turned on, this bit will show the status of the JESD SYNCB1 signal 0 SYNCBOUT0 R/W 0 If the CMOS SYNC outputs are turned on, this bit will show the status of the JESD SYNCB0 signal 15:2 140 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Start-up Sequence PULL TXENABLE LOW x x x x Provide all 1V supply rails, 1.8V rails and -1.8V rail. Pull TRSTB pin of the JTAG port low Provide a clock to the differential or single ended clock input Toggle RESETB pin low then high (recommended pulse duration >10us) Read SPI Page 0, Register 0x7F Bits[15:10] B 10000b Bits[15:10]=10000b Configure the SPI resgisters for the desired mode On chip PLL mode YES Read page 0, address 0x06 Tj = bits[15:8] LFVOLT = bits[7:5] Increment/decrement VCO tune value SPI Page 4, address 0x33, bits[14:8] NO 108 G di < 125C, LFVOLT =5or6 92 G di < 108C, LFVOLT=4or5 26 G di < 92C, LFVOLT =3or4 -40 G di < 26C, LFVOLT =2or3 Start SYSREF Generation Reset encoder block: Page 1/2:address 0x24:bits [6:4] = 000b Page 1/2:address 0x5C:bits [2:0] = 000b Page 4:address 0x0A:bit [15] = 1b Ensure at least 2 SYSREF rising edges occur to reset the encoder Page 4:address 0x0A:bit [15] = 0b Put JESD204B core in reset Page 0:address 0x00:bits [1:0] = 11b Sync CDRV and JESD204B blocks Page 1/2:address 0x24:bits [6:4] = 010b Ensure at least 2 SYSREF rising edges occur to reset the CDRV Page 1/2:address 0x5C:bits [2:0] = 011b Ensure at least 2 SYSREF rising edges occur to reset the JESD Take JESD Core out of reset Page 0:address 0x00:bits [1:0] = 00b Ensure at least 2 SYSREF rising edges occur x x x x x Clear all DAC alarms: Write 0x0000 to alarm registers on Page0: 0x04, 0x05 and Page1/2: 0x64 to 0x6D Stop SYSREF generation to DAC (optional) Pull TXENABLE HIGH Copyright © 2017, Texas Instruments Incorporated Figure 167. DAC38RF8xx Recommended Startup Sequence Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 141 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 9.2 Typical Application: Multi-band Radio Frequency Transmitter The DAC38RF8xx device family can be used in RF transmitters designed to support multiple operating bands. The two transmit antennae system shown in Figure 168 uses DAC38RF8xx to convert digital baseband signals from an FPGA directly to RF signals in LTE downlink band 1 (2110 MHz - 2170 MHz) and band 3 (1805 MHz 1880 MHz). Device clock SYSREF Band1 and Band3 PLL syncb 2:1 PA CH B 4 lanes Band1 and Band3 50 Q 2:1 PA CH A 4 lanes 50 Q DAC38RFxx FPGA syncb 2:1 ADC 8 lanes Copyright © 2016, Texas Instruments Incorporated Figure 168. Two antennae multi-band Radio Frequency Transmitter 9.2.1 Design Requirements Table 132. Dual band LTE downlink transmitter 142 Parameter Value Operating bands Band 1 (2110 MHz - 2170 MHz) and Band 3 (1805 MHz to 1880 MHz) Data rate (baseband) 368.64 MHz Sampling frequency 8847.36 MHz Interpolation 24 JESD204B Interface configuration L-M-F-S-Hd = 8-8-2-1-0 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 9.2.2 Detailed Design Procedure Two complex data streams of 20MHz LTE data generated in a baseband processor (FPGA/ASIC) is formatted based on Table 18and transmitted to DAC38RF8xx. Inside DAC38RF8xx, the complex input data at a rate of 368.64 MSPS is interpolated 24 times to the final output sampling rate of 8847.36 MSPS. This enables the final RF output to be positioned in the first Nyquist zone for minimal attenuation due to sinc(x) roll off. After interpolation, the output complex data stream is digitally mixed to the final RF frequencies. The digital mixing eliminates system imperfections such as local oscillator (LO) feed-through and sideband images that are inherent in analog mixers. Detailed block diagram is shown in (Figure 169) To simplify the system clocking, a low frequency clock (or device clock) is provided as a reference to the on-chip PLL (Internal PLL/VCO) of DAC38RF8xx. The PLL generates a low phase noise, high frequency sampling clock from the low frequency reference. Serdes Interface FPGA DAC38RF8xx RF output Q data -184.32M 0 +184.32M I data Q data -184.32M 0 JESD Interface I data 24x interpolation 1.8425 GHz 0 1.84G 2.14G Fs/2 24x interpolation 2.14 GHz +184.32M Figure 169. Dual band LTE Downlink Transmitter Block Diagram 9.2.2.1 Calculating the JESD204B SerDes Rate SerDes rate = 1.25 x (M/L) x Baseband data rate x Number of bits per sample (16) M is a JESD204B interface parameter that refers to the number of data streams from FPGA to DAC L is a JESD204B interface parameter that refers to the number of SerDes lanes used to transmit data 1.25 is a factor due to the 8B10B encoding of the baseband data Example, if the baseband data rate = 368.64 MSPS and L-M-F-S-Hd = 8-8-2-1-0 SerDes rate = 1.25 x (8/8) x 368.64 x 16 = 7.3728 Gbps (19) 9.2.2.2 Calculating valid JESD204B SYSREF Frequency Valid SYSREF frequencies depend on the following parameters: 1. Sample clock frequency 2. JESD204B internal clock divider value (CLKJESD_DIV). This depends on the DAC JESD204B L-M-F-S mode and interpolation 3. Number of octets in a frame (F) 4. Number of frames in a multi-frame (K) Maximum SYSREF frequency = (Sample clock frequency/N), where N =LCM(CLKJESD_DIV,4 x K x F). N is the Least common multiple of 4 x K x F and CLKJESD_DIV. All valid SYSREF frequencies are integer divisors of the maximum SYSREF frequency. Example: Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 143 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Given sampling clock frequency = 8.84736 GSPS, Interpolation = 24, DAC Mode=L-M-F-S=8-8-2-1 and K=20: CLKJESD_DIV = 24 (CLKJESD_DIV) Maximum SYSREF Frequency = 8847.36 MHz/240 = 36.864 MHz Valid SYSREF Frequencies = 36.864 MHz/n, where n is any positive integer. 9.2.3 Application Curves Figure 170. Dual band ACPR Performance in Downlink Band 3 with On-chip PLL Figure 171. Dual band ACPR Performance in Downlink Band 1 with On-chip PLL 144 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 10 Power Supply Recommendations Internally, DAC38RFxx comprises a digital subsystem, an analog subsystem, and a clock subsystem. Ideally, the power supply scheme should be partitioned according to these three relatively independent blocks to minimize interactions between them. Most importantly, sensitive analog and clock circuit power supply must be separated from digital switching noise to reduce direct coupling and mixing of switching spurs. Table 133 shows the power supply rails for DAC38RFxx grouped under their respective domains. Table 133. Power Supply Domains Supply rail Nominal voltage (V) VDDIG1 +1.0 VDDIO18 +1.8 VDDR18 +1.8 VDDS18 +1.8 VDDT1 +1.0 VDDE1 +1.0 VDDL1_1 +1.0 VEE18N -1.8 VDDA1 +1.0 VDDA18 +1.8 VDDOUT18 +1.8 VDDPLL1 +1.0 VDDAPLL18 +1.8 VDDAVCO18 +1.8 VDDCLK1 +1.0 VDDL2_1 +1.0 VDDTX1 +1.0 VDDTX18 +1.8 Domain Digital Analog Clock An example power supply scheme suitable for most applications of DAC38RFxx is shown in Figure 172. It is recommended to use ferrite beads (FB) to isolate the individual rails from each other. 5Vin TPS62085 (3 A) 1V 1V TPS74401 (2 A) TPS62085 (3 A) 1.8 V LM27761 (250 mA) 1V 1.8 V VDDDIG1 (2.5 A) VDDT1 (375 mA) VDDL1_1 (45 mA) VDDL2_1 (45 mA) VDDCLK1 (425 mA) VDDA1 (25 mA) VDDPLL1 (30 mA) VDDTX1 (14 mA) VDDE1 (650 mA) VDDA18 (45 mA) VDDOUT18 (100 mA) VDDAVCO18 (40 mA) VDDAPLL18 (20 mA) VDDR18 + VDDS18 + VDDIO18 (135 mA) VDDTX18 (14 mA) ±1.8 V VEE18 (152 mA) Copyright © 2017, Texas Instruments Incorporated Figure 172. Power Supply Scheme for DAC38RFxx Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 145 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 10.1 Power Supply Sequencing There are no power supply sequencing requirements for all the 1-V and 1.8-V power supplies. For the -1.8 V VEE18 rail, it is recommended that this supply is the last to be enabled. Enabling VEE18 (while other supply voltages are disabled) can cause a small negative voltage to be present at the other rails (that is, VDDA1 and VDDDIG1). This small negative voltage can interfere with the startup of some DC-DC converters or LDO's connected to the 1 V and 1.8 V input power rails. 11 Layout 11.1 Layout Guidelines • DAC RF output traces – DAC38RF80, DAC38RF90, DAC38RF84: Single-ended 50 Ω co-planar wave guide for output traces is recommended. – DAC38RF83, DAC38RF93, DAC38RF85: Differential 100 Ω co-planar wave guide for output traces is recommended. – Use short RF traces. Place DAC close to edge of PCB to shorten the length of output and clock traces. This helps to minimize PCB loss and coupling – Stitch the ground plane with ground vias uniformly along the output trace. An example is shown in Figure 173 – Avoid width/spacing differences when entering a landing pad (eg. a balun) by tapering or by redefining width/space rules for the traces Figure 173. Single-ended, 50-Ω Coplanar Wave Guide RF Output Trace Example • 146 Power supply planes – Ensure sufficient lateral spacing between two power planes (about 3x the thickness of the plane is recommended) – Insert ground plane between adjacent power planes where possible Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 Layout Guidelines (continued) Figure 174. Example Power Plane Routing • Bypass Capacitors – Use bypass capacitors with in-pad vias and place between the pin and the power plane. Avoid sharing ground vias or pads of bypass caps used for different power rails – Minimize stubs on bypass capacitors to avoid parasitic inductance Figure 175. Bypass Capacitors Placed on the Power Supply Pin with In-pad Vias • High speed SerDes traces – Route all SerDes traces straight and minimized sharp curves or serpentines. Route for best signal integrity – Some skew between SerDes traces can be tolerated. It is recommended to limit skew between traces to 320ps or less – Place ground planes between the SerDes traces for improved isolation Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 147 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com Layout Guidelines (continued) Figure 176. Layout Example of High Speed SerDes Traces 148 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 www.ti.com SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 11.2 Layout Example xx xx xx xx xx xx xxxxx x xx xx xx xxxx xx xx A B C D 12 11 10 9 x x x x x x x x 8 7 x x x x 6 5 4 3 x x x x x 2 1 xx xx xx xx xx xx xx xx xx xxxx xx xxxx xxxx xxxxx xx xxxxx xxxx xx xx xx xxxx xxxx E F G H J K L M Rbias x x x x x x x x x x x x x x x Bottom Trace Top Trace Capacitor Resistor x Via x x x x x x x x x x x x x x x x Figure 177. Layout Example of DAC38RFxx Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 149 DAC38RF80, DAC38RF83, DAC38RF84 DAC38RF85, DAC38RF90, DAC38RF93 SLASEA3C – DECEMBER 2016 – REVISED JULY 2017 www.ti.com 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 134. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY DAC38RF80 Click here Click here Click here Click here Click here DAC38RF83 Click here Click here Click here Click here Click here DAC38RF84 Click here Click here Click here Click here Click here DAC38RF85 Click here Click here Click here Click here Click here DAC38RF90 Click here Click here Click here Click here Click here DAC38RF93 Click here Click here Click here Click here Click here 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 150 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated DAC38RF83 DAC38RF93 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC38RF80IAAV ACTIVE FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF80I DAC38RF80IAAVR ACTIVE FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF80I DAC38RF83IAAV ACTIVE FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF83I DAC38RF83IAAVR ACTIVE FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF83I DAC38RF84IAAV ACTIVE FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF84I DAC38RF84IAAVR ACTIVE FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF84I DAC38RF85IAAV PREVIEW FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF85I DAC38RF85IAAVR PREVIEW FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF85I DAC38RF90IAAV ACTIVE FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF90I DAC38RF90IAAVR ACTIVE FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF90I DAC38RF93IAAV ACTIVE FCBGA AAV 144 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF93I DAC38RF93IAAVR ACTIVE FCBGA AAV 144 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DAC38RF93I PDAC38RF85AAV ACTIVE FCBGA AAV 144 168 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2017 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 25-May-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DAC38RF80IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 DAC38RF83IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 DAC38RF84IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 DAC38RF85IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 DAC38RF90IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 DAC38RF93IAAVR FCBGA AAV 144 1000 330.0 24.4 10.3 10.3 2.5 4.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-May-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC38RF80IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 DAC38RF83IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 DAC38RF84IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 DAC38RF85IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 DAC38RF90IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 DAC38RF93IAAVR FCBGA AAV 144 1000 336.6 336.6 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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