TriQuint AG503-89G Lead-free / rohs-compliant / green sot-89package Datasheet

AG503-89
InGaP HBT Gain Block
Product Features
•
•
•
•
•
•
DC – 4000 MHz
+15.5 dBm P1dB at 900 MHz
+29 dBm OIP3 at 900 MHz
21.5 dB Gain at 900 MHz
Single Voltage Supply
Lead-free / RoHS-compliant /
Green SOT-89package
• Internally matched to 50 Ω
Product Description
Functional Diagram
The AG503-89 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG503-89 typically provides
21.5 dB of gain, +29 dBm OIP3, and +15.5 dBm P1dB.
The device combines dependable performance with
consistent quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85 °C and is
housed in a lead-free/green/RoHS-compliant SOT-89
industry-standard SMT package.
GND
Applications
The AG503-89 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
•
•
•
•
•
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG503-89 will work for other various applications
within the DC to 4 GHz frequency range such as CATV
and WiMAX.
Mobile Infrastructure
CATV / FTTX
W-LAN / ISM
RFID
WiMAX / WiBro
Specifications (1)
Parameter
4
1
2
3
RF IN
GND
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Typical Performance (1)
Units
Min
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
DC
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Device Voltage
Device Current
18.1
Typ
900
21.3
15
17
+15.6
+29
+37
3.1
1900
19.1
+14.4
+27.4
5.0
45
Max
Parameter
Units
4000
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
Typical
500
22.0
-18
-24
+15.6
+29.4
3.0
900
21.3
-15
-17
+15.6
+29.0
3.1
1900
19.1
-15
-10.6
+14.4
+27.4
3.3
2140
18.7
-17
-10.4
+14.2
+27.2
3.3
20.1
1. Test conditions: 25 ºC, Supply Voltage = +6 V, Rbias = 22.1 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Thermal Resistance, Rth
Rating
-55 to +150 °C
+5.8 V
+10 dBm
+177 °C
232 °C / W
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No.
AG503-89G
AG503-89PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
700 – 2400 MHz Fully Assembled Eval. Board
Standard T/R size = 3000 pieces on a 13” reel.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 1 of 5
January 2008
AG503-89
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 22.1 Ω, Icc = 45 mA
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
22.3
-26
-18
+15.9
+29.4
3.0
500
22.0
-18
-24
+15.6
+29.4
3.0
900
21.3
-15
-17
+15.6
+29.0
3.1
1900
19.1
-15
-10.6
+14.4
+27.4
3.3
2140
18.7
-17
-10.4
+14.2
+27.2
3.3
2400
18.2
-22
-10.7
+14.0
+26.8
3.4
3500
16.6
-27
-16
+11.3
5800
12.8
-16
-8.2
1. Test conditions: T = 25 ºC, Supply Voltage = +6 V, Device Voltage = 6.0 V, Rbias = 22.1 Ω, Icc = 45 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
Return Loss
18
16
14
-40 C
+25 C
1
-10
-20
-30
S11
+85 C
2
Frequency (GHz)
3
0
4
1
2
3
4
5
40
25
20
2
2.5
35
-40 C
3
0
+25 C
200
1
+85 C
-40 C
10
+25 C
600
800
1
1.5
2
2.5
Frequency (GHz)
3
3.5
4
+85 C
0.5
1
20
18
16
16
16
12
14
8
Output Power
4
0
-12
-8
-4
0
Input Power (dBm)
1.5
2
2.5
3
Output Power / Gain vs. Input Power
10
0.5
+25 C
Frequency (GHz)
Gain
12
+85 C
0
0
0
1000
frequency = 900 MHz
5
-40 C
400
4
8
Gain (dB)
Gain (dB)
18
5.4
2
Output Power / Gain vs. Input Power
P1dB vs. Frequency
15
5.0
3
Frequency (MHz)
20
4.6
0
Frequency (GHz)
20
4.2
4
Output Power (dBm)
1.5
3.8
Noise Figure vs. Frequency
25
1
3.4
5
+85 C
15
0.5
20
Device Voltage (V)
30
0
40
0
3.0
6
NF (dB)
30
OIP2 (dBm)
45
+25 C
Optimal operating point
Output IP2 vs. Frequency
35
-40 C
60
Frequency (GHz)
Output IP3 vs. Frequency
OIP3 (dBm)
S22
-40
12
0
80
Device Current (mA)
S11, S22 (dB)
Gain (dB)
20
P1dB (dBm)
I-V Curve
0
frequency = 2000 MHz
20
16
Gain
14
12
12
8
10
4
Output Power
8
Output Power (dBm)
22
0
-12
-8
-4
0
Input Power (dBm)
4
8
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 2 of 5
January 2008
AG503-89
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +8 V, Rbias = 44 Ω, Icc = 45 mA
Gain vs. Frequency
Output IP3 vs. Frequency
OIP3 (dBm)
Gain (dB)
20
18
16
Output IP2 vs. Frequency
35
45
30
40
OIP2 (dBm)
22
25
20
14
-40 C
+25 C
1
2
Frequency (GHz)
+25 C
85 C
3
0
4
+85 C
-40 C
25
0.5
1
1.5
2
2.5
3
0
200
Frequency (GHz)
400
600
800
1000
Frequency (MHz)
P1dB vs. Frequency
Noise Figure vs. Frequency
5
20
4
15
NF (dB)
P1dB (dBm)
+25 C
15
12
0
30
-40 C
+85 C
35
10
5
-40 C
+25 C
3
2
1
+85 C
-40 C
0
+25 C
+85 C
0
0
0.5
1
1.5
2
2.5
Frequency (GHz)
3
3.5
4
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 3 of 5
January 2008
AG503-89
InGaP HBT Gain Block
Application Circuit
Vcc
Icc = 45 mA
R1
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
AG503-89
C2
Blocking
Capacitor
C1
Blocking
Capacitor
Recommended Component Values
Reference
Designator
50
500
L1
820 nH
220 nH
C1, C2, C4
.018 µF
1000 pF
Frequency (MHz)
900
1900
2200
68 nH
27 nH
22 nH
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R1
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018 μF chip capacitor
Do Not Place
22.1 Ω 1% tolerance
Size
0603
0603
0603
Recommended Bias Resistor Values
S upply
R1 value
S ize
Voltage
6V
22.2 ohms
0603
7V
44.4 ohms
0805
8V
67 ohms
1206
9V
89 ohms
1210
10 V
111 ohms
1210
12 V
156 ohms
2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
0805
Typical Device Data
S-Parameters (Vdevice = +5.0 V, ICC = 45 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
3250
3500
3750
4000
4250
4500
4750
5000
5250
5500
5750
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-26.19
-23.35
-17.91
-15.52
-14.09
-12.90
-12.87
-13.81
-15.74
-18.98
-23.23
-32.94
-28.58
-25.07
-27.36
-37.65
-25.73
-18.68
-15.09
-13.28
-12.57
-12.84
-13.69
-15.63
-17.91
-179.61
160.54
150.08
141.97
134.98
131.90
129.91
128.31
126.11
107.41
104.12
143.49
-115.87
-108.27
-114.74
-166.05
89.46
73.79
67.26
62.51
57.49
52.85
47.99
44.02
36.55
21.55
21.45
21.24
20.88
20.37
19.84
19.26
18.68
18.13
17.67
17.32
16.89
16.52
16.16
15.80
15.41
14.94
14.43
13.80
13.22
12.77
12.35
12.10
11.98
11.87
177.16
166.20
152.40
139.13
126.75
114.96
104.78
94.73
85.30
76.68
70.25
60.61
51.58
42.71
33.60
24.19
14.88
6.00
-2.56
-11.15
-18.52
-25.59
-32.66
-39.82
-47.46
-24.24
-24.75
-24.74
-24.57
-24.92
-24.28
-24.39
-24.24
-23.81
-23.91
-23.81
-22.99
-22.79
-22.54
-22.21
-21.58
-21.74
-21.16
-21.17
-21.12
-21.10
-20.88
-20.37
-20.16
-19.50
0.28
1.32
-1.75
-4.88
-9.48
-9.59
-7.54
-9.74
-11.07
-12.44
-16.75
-18.94
-19.91
-23.20
-26.19
-31.30
-35.64
-41.49
-46.41
-49.57
-53.33
-58.61
-62.10
-65.61
-70.88
-18.02
-19.32
-24.54
-20.39
-15.97
-13.31
-11.54
-10.79
-10.51
-10.52
-10.71
-11.55
-12.66
-14.43
-16.07
-15.90
-13.59
-10.76
-8.74
-7.63
-6.98
-6.96
-7.30
-8.21
-9.28
-7.09
-22.62
-82.96
-137.56
-161.71
-172.90
-177.90
-179.42
-178.17
-164.14
-165.63
-165.21
-169.42
-177.62
160.53
126.84
99.68
83.55
74.76
70.27
68.95
66.81
67.16
66.03
63.60
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 4 of 5
January 2008
AG503-89
InGaP HBT Gain Block
AG503-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG503-89G will be marked with an
“A503G” designator with an alphanumeric lot
code marked below the part designator. The
obsolete tin-lead package is marked with an
“AG503” designator followed by an
alphanumeric lot code.
A503G
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 5 of 5
January 2008
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