Rohm BD8229EFV-E2 4ch system motor driver ic Datasheet

System Motor driver IC Series for CD / DVD Players
4ch
System Motor Driver IC
BD8229EFV
No.10011EAT01
●Description
BD8229EFV is BTL driver of 5 input 4 output developed for driving Spindle motor, Sled/Loading motor and the actuator coil.
The hysteresis comparator for reset is built in, and the number of parts can reduce.
●Features
1) 4CH BTL Driver
2) HTSSOP-B24 power package is adopted, the set is miniaturized.
3) Has a wide dynamic range(PreVcc=PowVcc=8V,RL=8Ω, 6.0V(typ.))
4) Built-in thermal-shut down circuit
5) Separating Vcc into Pre and Power (Power divides into CH1/2 and CH3/4), can make better Power efficiency
6) Switches CH2 input by Control input terminal (CNT).
7) Incorporates mute function by CNT terminal and mute terminal
8) Built in hysteresis comparator for reset
●Applications
Car Audio
●Absolute Maximum Ratings
Parameter
Power supply voltage
Symbol
Limits
Unit
PreVcc,PowVcc1, PowVcc2
Input terminal voltage 1
Input terminal voltage 2
15
V
Vin1
*3
PreVCC
V
Vin2
*4
PowVCC2
V
*1
Power dissipation
1.1
Pd
W
4.0*2
Operating temperature range
Topr
-40~+85
℃
Storage temperature
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
*1
*2
*3
*4
70mm×70mm×1.6mm,occupied copper foil is less than 3%,glass epoxy standard board) mounting.
Reduce power by 11.6mW for each degree above 25℃.
Exclusive standard board mounting. Reduce power by 32.0mW for each degree above 25℃.
Vin1 Application terminal:IN1, CNT, IN2-1, IN2-2, BIAS, IN3, IN4, MUTE
Vin2 Application terminal:RSTDET
●Recommended Operating Conditions
Parameter
PRE part Power supply
Symbol
Limits
Unit
*5
PreVcc
4.5~14
V
*3
DC motor system power supply
PowVcc1
4.5~PreVCC
V
Actuator system power supply
PowVcc2
4.5~PreVCC*3
V
*5
Set the power supply voltage taking allowable dissipation into considering.
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1/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Electrical Characteristics (Unless otherwise noted,Ta=25℃, PreVcc=PowVcc=8V, BIAS=1.65V, RL=8Ω)
Limits
Parameter
Symbol
Unit
Condition
MIN
TYP
MAX
Quiescent dissipation current
IQ
-
30
45
mA
At no-load
< Driver >
Output offset voltage (CH1,2)
Voof 12
-100
0
100
mV
Output offset voltage (CH3,4)
Voof 34
-50
0
50
mV
Maximum output amplitude (CH1,2)
VOM 12
5.4
6.0
-
V
Maximum output amplitude (CH3,4)
VOM 34
4.7
5.3
-
V
Closed circuit voltage gain (CH1,2)
Gv 12
24.0
25.7
27.4
dB
Closed circuit voltage gain (CH3,4)
Gv 34
15.5
17.5
19.5
dB
MUTE terminal low level input voltage
VML
-
-
0.5
V
MUTE terminal high level input voltage
VMH
2.0
-
-
V
CNT terminal low level input voltage
VCNTL
-
-
0.5
V
CNT terminal high level input voltage
VCNTH
2.0
-
-
V
LDIN terminal voltage(SLED input)
VLDIN
-
0.1
0.3
V
CNT=’L’
Internal bias voltage
VBIN
1.53
1.65
1.77
V
CNT=’H’
< Reset >
Reset release voltage
VDET
1.19
1.25
1.31
V
Hysteresis voltage
VHYS
5
25
55
mV
Detection terminal outflow current
ICMP
-
50
150
nA
RSTOUT output Low voltage
VRSTOUT
-
0.1
0.3
V
3.3VPull-up(10kΩ)
●Thermal Derating Curve
④4.0W
③2.8W
②1.7W
①1.1W
Rating for 70mm×70mm(size), 1.6mm(thickness), copper foil occupation ratio less than 3%,
and use of glass-epoxy substrate.
Fig.1 Power dissipation
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2/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Package Outlines
D8229EFV
Lot.No
HTSSOP-B24(Unit:mm)
Fig.2 Package Outlines
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3/11
2010.02 - Rev.A
CNT
47kΩ
47kΩ
100kΩ
14
GND
100kΩ
47kΩ
13
PreVcc
RSTDET
15
PreVcc
MUTE
BIAS
100kΩ
16
PreGND
17
MUTE
18
IN4
19
IN3
BIAS
20
20kΩ
1.65V
20kΩ
20kΩ
21
IN2-2
22
IN2-1
23
CNT
24
IN1
●Block Diagram
RSTOUT
Technical Note
BD8229EFV
47kΩ
Pre GND
1.25V
T.S.D
LEVEL
SHIFT
LEVEL
SHIFT
LEVEL
SHIFT
PowVcc1 PowGND1
PowGND2
10
11
PowGND2
9
VO4(+)
8
VO4(-)
7
VO3(+)
6
CH4
VO3(-)
5
CH3
VO2(+)
4
VO2(-)
3
VO1(+)
2
CH2
VO1(-)
1
PowGND1
PowVcc1
CH1
PowVcc2
12
PowVcc2
LEVEL
SHIFT
T.S.D:Thermal Shut-Down
Fig.3:Block Diagram
○Pin Descriptions
No.
Symbol
Description
No.
Symbol
Description
CH1,2 power supply terminal
13
PreVcc
Pre,RESET power supply terminal
power GND1
14
RSTOUT
Reset output
Driver CH1 negative output
15
RSTDET
Reset detection comparator input
Driver CH1 positive output
16
PreGND
Pre, Reset Block GND
Driver CH2 negative output
17
MUTE
MUTE terminal
Driver CH2 positive output
18
IN4
CH4 input
VO3(-)
Driver CH3 negative output
19
IN3
CH3 input
VO3(+)
Driver CH3 positive output
20
BIAS
BIAS input terminal
1
PowVcc1
2
PowGND1
3
VO1(-)
4
VO1(+)
5
VO2(-)
6
VO2(+)
7
8
9
VO4(-)
Driver CH4 negative output
21
IN2-2
CH2-2 input
10
VO4(+)
Driver CH4 positive output
22
IN2-1
CH2-1 input
11
PowGND2
power GND2
23
CNT
Control input terminal
12
PowVcc2
CH3,4 power supply terminal
24
IN1
IN1 input
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© 2010 ROHM Co., Ltd. All rights reserved.
4/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Functional Description
1.The driver can put the mute by switching the terminal MUTE and the terminal CNT to High level and Low level.
The table below shows the logic.
INPUT
OUTPUT
MUTE
CNT
CH1,3,4
CH2
H
H
ACTIVE
LD ON
H
L
ACTIVE
SL ON
L
L
H
L
MUTE
MUTE
LD ON
MUTE
SL : SLED LD : Loading
2.The mute works when the bias terminal (20PIN) becomes 0.7V(typ.) or less. Please set it to 1.3V or more in the state of
use normally.(However, the mute doesn't work as for CH2 at CNT='H'. )
3.When the power-supply voltage becomes 3.8V(typ.) or less, the output terminal becomes the state of the mute.
When the power-supply voltage rises up to 4.0V again, the driver part circuit stands up
4.The threshold voltage of PowVcc2 reset can be calculated by the following expressions.
RVCC
Vin
10kΩ
PowVcc2
R1
RSTOUT
RSTDET
+
VDET V
R2
1.25V /1.225V
Vin =
R1+ R2
× VDET
R2
・The threshold voltage of PowVcc2 reset can be changed by external resistance R1 and R2.
R1 and R2 recommend the resistance of 100kΩ or less respectively.
・Please make below the voltage of PowVcc2(PIN12) the voltage of the RSTOUT output terminal that is the pull-up (RVCC).
・The characteristic chart of RSTDET and RSTOUT is shown as follows.
RSTOUT(V)
RVCC
Hysterisis 25 mV(typ.)
1.25V( typ.)
RSTDET (V)
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5/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Example of Recommended Circuit
RSTDET RESET出力
BIAS
SP IN
24
SL/LD
SL IN
LD IN
23
22
21
19
18
47kΩ
100kΩ
17
47kΩ
16
15
100kΩ
47kΩ
14
Pre GND
13
PreVcc
MUTE
BIAS
100kΩ
PreVcc
MUTE
ACT IN
Pre GND
CNT
20
20 kΩ
1.65V
20 kΩ
20kΩ
ACT IN
47 kΩ
1.25V
PowVcc2
T.S.D
LEVEL
SHIFT
LEVEL
SHIFT
LEVEL
SHIFT
LEVEL
SHIFT
PowGND2 PowVcc2
PowVcc1 PowGND1
CH1
1
2
3
CH2
4
M
5
CH3
6
7
CH4
8
9
10
11
12
M
PowVcc
PowVcc
Fig.4:Application circuit
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6/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●The Picture of Application Board Wire Connection(Reference for BD8229EFV)
Fig.5. application board wire connection
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7/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●The Picture of Application Board Pattern(Reference for BD8229EFV)
BD8229EFV
Top Silkscreen Overlay
Top Layer
Bottom Silkscreen Overlay
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Bottom Layer
8/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Terminal Equivalent Circuit
20k
47k
47k
50k
50k
×2
20k
47k
10k
10k
positive output
20k
negative output
20k
10k
100k
20k
100k
100k
100k
100k
100k
20k
20k
positive output
10k
negative output
10k
25
5k
※Resistance in the above-mentioned terminal equivalent circuit chart is 25℃, and a value at typical.
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9/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Notes for use
1.Absolute maximum ratings
We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the
absolute maximum ratings. However, this IC might be destroyed when the absolute maximum ratings, such as impressed voltages or the
operating temperature range, is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified.
Please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute
maximum rating is assumed.
2.Reverse polarity connection
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction
protection device as a diode in the supply line and motor coil line.
3.Power supply line
Due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1μF) close
to the IC power input terminals (Vcc and GND) iare recommended. Please note the electrolytic capacitor value decreases at lower
temperatures and examine to dispense physical measures for safety. And, for ICs with more than one power supply, it is possible that rush
current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power
coupling capacitance, power wiring, width of GND wiring, and routing of wiring.
4.GND line
Please keep the GND line the lowest potential always, and check the GND voltage when transient voltages are connected to the IC.
5.Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough
temperature margins. This product has exposed the frame to the back side of the package, but please note that it is assumed to use heat
radiation efficiency by the heat radiation for this part. Please take the heat radiation pattern on not only the surface of the substrate but
also the back of the substrate widely.
6.Short circuit mode between terminals and wrong mounting
Do not mount the IC in the wrong direction and displacement, and be careful about the reverse-connection of the power connector.
Moreover, this IC might be destroyed when the dust short the terminals between them or GND.
7.Radiation
Strong electromagnetic radiation can cause operation failures.
8.ASO (Area of Safety Operation)
Do not exceed the maximum ASO and the absolute maximum ratings of the output driver.
9.TSD (Thermal Shut-Down)
The TSD is activated when the junction temperature (Tj) exceeds Tjmax, and the output terminal is switched to OPEN. The guarantee and
protection of set are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates
the TSD circuit.
10.Capacitor between output driver and GND
If a large capacitor is connected between the output driver and GND, this IC might be destroyed when Vcc becomes 0V or GND, because
the electric charge accumulated in the capacitor flows to the output driver. Please set said capacitor to smaller than 0.1μF.
11.Inspection by the set circuit board
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and
all process. Moreover, when attaching or detaching from jig in the inspection process, please turn off the power before mounting the IC,
and turn on after mounting the IC, and vice versa. In addition, please take into consideration the countermeasures for electrostatic
damage, such as giving the earth in assembly process, transportation or preservation.
12.Input terminal
+
This IC is a monolithic IC, and has P isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in
this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure
below. When the GND voltage potential is greater than the voltage potential at Terminals A on the resistor, at Terminal B on the transistor,
the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of
surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The
parasitic element operating causes the interference of circuit operation, then the wrong operation and destruction. Therefore, please be
careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND (P substrate). Please do not
apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal
lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is
impressing.
Resistor
Transistor(NPN)
Terminal-A
Terminal-B
C
Terminal-B
B
E
Terminal-A
B
P+
P+
P
C
E
Parasitic
element
P+
P
P+
P-Substrate
P-Substrate
Surrounding
elements
Parasitic
element
GND
Parasitic
element
GND
Parasitic
element
GND
GND
Simplified structure of IC
13Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and
large current not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit
board. As for GND of external parts, it is similar to the above-mentioned.
14Please make below the voltage of PowVcc2(PIN12) the voltage of the RSTOUT output terminal that is the pull-up (RVCC).
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10/11
2010.02 - Rev.A
Technical Note
BD8229EFV
●Ordering part number
B
D
8
Part No.
2
2
9
E
Part No.
F
V
Package
EFV: HTSSOP-B24
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B24
<Tape and Reel information>
7.8 ± 0.2
(MAX 8.15 include BURR)
13
0.3Min.
1
Embossed carrier tape
Quantity
2000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
12
0.15 ± 0.1
0.1
1.15 ± 0.1
Tape
Direction
of feed
5.6 ± 0.2
7.6 ± 0.3
24
0.1
0.65
0.22 ± 0.1
1pin
(Unit : mm)
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Reel
11/11
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.02 - Rev.A
Notice
Notes
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consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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R1010A
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