Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses ACCU-GUARD® TECHNOLOGY The new F0603G Accu-Guard® II low current fuses is based on thin-film technology which allows precise control of the component electrical and physical characteristics that is not possible with standard fuse technologies. The Accu-Guard II Low Current series encompasses the lowest current ratings in a 0603 package and features LGA terminations. FEATURES APPLICATIONS ELECTRICAL SPECIFICATIONS • • • • • • • • • • • • • • • • • Operating temperature: -55ºC to +125ºC Current carrying capacity: -55ºC to -11ºC 107% of rating -10ºC to +60ºC 100% of rating +61ºC to +100°C 85% of rating +101ºC to +125°C 80% of rating Rated voltage: 32V Post-fusing resistance: >1MΩ Accurate current rating Fast acting Standard 0603 chip size Color coded Taped and reeled RoHS compliant UL Approval: E141069 Cellular Telephones Two-Way Radios Computers Battery Chargers Rechargeable Battery Packs Hard Disk Drives PDA’s LCD Screens Digital and Video Cameras Instrumentation TERMINATION Nickel/Solder coating compatible with automatic soldering technolgies: relow wave sodering, vapor phase and manual. ELECTRICAL PARAMETERS Current Rating A 0.050 0.062 0.075 0.100 0.125 0.150 0.200 Part Number F0603G0R05FNTR F0603G0R06FNTR F0603G0R07FNTR F0603G0R10FNTR F0603G0R12FNTR F0603G0R15FNTR F0603G0R20FNTR Resistance @0.1 x IRATED Ω (max.) 3.4 2.5 2.0 2.4 1.6 1.2 0.8 RECOMMEND PAD LAYOUT Voltage Drop @IRATED mV (max.) 250 280 280 300 250 220 210 millimeters (inches) Fusing Current (within 5 sec) A 0.125 0.155 0.1875 0.250 0.312 0.375 0.500 Pre-Arc I2t @10xIRATED A2-sec (typ) 2 x 10-6 2 x 10-6 4 x 10-6 7 x 10-6 1 x 10-5 2 x 10-5 4 x 10-5 Color Code Blue Yellow Brown Red White Green Pink RECOMMEND PAD LAYOUT millimeters (inches) S A B H T L W T A B S, H 1.6±0.1 (0.063±0.004) 0.81±0.1 (0.063±0.004) 0.61±0.1 (0.063±0.004) 0.23±0.05 (0.063±0.002) 0.66±0.05 (0.063±0.002) 0.10±0.05 (0.063±0.002) 1.1 (0.043) L W 0.85 (0.033) 2.4 (0.095) Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses ENVIRONMENTAL CHARACTERISTICS Test Solderability Leach Resistance Storage Shear Temperature Cycling Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in “as received” packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate (e.g. FR – 4). 1000 cycles -55ºC to +125ºC. Tested as shown in diagram 3 mm� Deflection 45mm 2 45mm Requirement Total area of imperfections in solder coating up to 5% of the land suface area Dissolution of termination ≤ 15% of the land surface area Good solderability Destruction at 5N force minimum No Visible damage ΔR/R<10% No visible damage ΔR/R<10% Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses FUSE TIME – CURRENT CHARACTERISTICS 10 200 mA Pre-Arc Time, sec 1 150 mA 10-1 125 mA 10-2 100 mA 10-3 75 mA 62 mA 10-4 50 mA 10-5 10-6 0.1 1 Current, Amp 10 Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses FUSE PRE-ARC JOULE INTEGRALS VS CURRENT 10 200 mA 150 mA 125 mA 100 mA 75 mA 1 62 mA 10-1 Pre-Arc I2t, A2sec 10-2 50 mA 10-3 10-4 10-5 10-6 0 0.5 1 1.5 2 2.5 3 Current, Amp FUSE PRE-ARC JOULE INTEGRALS VS PRE-ARC TIME 10 200 mA 150 mA 125 mA 100 mA 75 mA 1 Pre-Arc I2t, A2sec 10-1 10-2 10-3 62 mA 10-4 10-5 50 mA 10-6 10-6 10-5 10-4 10-3 10-2 Pre-Arc Time, sec 4 10-1 1 10