Diodes BAS21T Surface mount fast switching diode Datasheet

BAS21T
SURFACE MOUNT FAST SWITCHING DIODE
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Features
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Mechanical Data
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Ultra-Small Surface Mount Package
Fast Switching Speed
For General Purpose Switching Applications
High Conductance
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Notes 4 and 5)
Case: SOT-523
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
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SOT-523
TOP VIEW
Maximum Ratings
TOP VIEW
Internal Schematic
@TA = 25°C unless otherwise specified
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IO
Value
250
Unit
V
200
V
V
mA
mA
IFRM
141
400
200
2.5
0.5
625
Symbol
PD
RθJA
TJ, TSTG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
@ t = 1.0μs
@ t = 1.0s
IFSM
Repetitive Peak Forward Surge Current
A
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics
@TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Symbol
V(BR)R
Min
250
Forward Voltage
VF
⎯
Reverse Current @ Rated DC Blocking Voltage (Note 2)
IR
Total Capacitance
Reverse Recovery Time
Notes:
Max
⎯
1.0
1.25
Unit
V
⎯
100
15
nA
μA
CT
⎯
5.0
pF
trr
⎯
50
ns
V
Test Condition
IR = 100μA
IF = 100mA
IF = 200mA
TJ = 25°C
TJ = 100°C
VR = 0, f = 1.0MHz
IF = IR = 30mA,
Irr = 0.1 x IR, RL = 100Ω
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS21T
Document number: DS30264 Rev. 10 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated
IF, INSTANTANEOUS FORWARD CURRENT (A)
BAS21T
PD, POWER DISSIPATION (mW)
200
150
100
50
0
0
100
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
1
0.1
0.01
0.001
200
0
0.8
1.0
0.2
0.4
1.2
1.4
0. 6
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
0
10
30
40
20
VR, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
4.0
100
TA = 150ºC
3.5
10
CT, TOTAL CAPACITANCE (pF)
TA = 125ºC
TA = 75ºC
1
0.1
TA = 25ºC
0.01
TA = 0ºC
0.001
T A = -40ºC
2.5
2.0
1.5
1.0
0.5
0.0
0.0001
0
150
200
250
50
100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
Ordering Information
(Notes 5 & 6)
Part Number
BAS21T-7-F
Notes:
3.0
Case
SOT-523
Packaging
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
T3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
T3YM
Date Code Key
Year
Code
Month
Code
2001
M
2002
N
2003
P
2004
R
2005
S
2006
T
2007
U
2008
V
2009
W
2010
X
2011
Y
2012
Z
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
BAS21T
Document number: DS30264 Rev. 10 - 2
2 of 3
www.diodes.com
March 2009
© Diodes Incorporated
BAS21T
Package Outline Dimensions
A
SOT-523
Dim
Min
Max
Typ
A
0.15
0.30
0.22
B
0.75
0.85
0.80
C
1.45
1.75
1.60
D
0.50
⎯
⎯
G
0.90
1.10
1.00
H
1.50
1.70
1.60
J
0.00
0.10
0.05
K
0.60
0.80
0.75
L
0.10
0.30
0.22
M
0.10
0.20
0.12
N
0.45
0.65
0.50
0°
8°
α
⎯
All Dimensions in mm
B C
G
H
K
M
N
J
L
D
Suggested Pad Layout
Y
Z
C
X
Dimensions Value (in mm)
Z
1.8
X
0.4
Y
0.51
C
1.3
E
0.7
E
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
BAS21T
Document number: DS30264 Rev. 10 - 2
3 of 3
www.diodes.com
March 2009
© Diodes Incorporated
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