M TC1410/TC1410N 0.5A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Will Withstand 500 mA Reverse Current • Input Will Withstand Negative Inputs Up to 5V • ESD Protected: 4 kV • High Peak Output Current: 0.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 500 pF in 25 nsec • Short Delay Time: 30 nsec Typ. • Consistent Delay Times With Changes in Supply Voltage • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 16Ω • Available in Space-Saving 8-pin MSOP Package • Pinout Same as TC1411/TC1412/TC1413 The TC1410/TC1410N are 0.5A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. Switch Mode Power Supplies Line Drivers Pulse Transformer Drive Relay Driver 8-Pin MSOP/PDIP/SOIC VDD 1 IN 2 NC 3 GND 4 2 8 VDD 7 OUT 6 OUT 5 GND 6,7 Inverting VDD 1 TC1410N • • • • Package Type TC1410 Applications As MOSFET drivers, the TC1410/TC1410N can easily charge a 500 pF gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the ‘ON’ and ‘OFF’ states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. IN 2 NC 3 GND 4 2 8 VDD 7 OUT 6 OUT 5 GND 6,7 Non-Inverting NC = No Connection NOTE: Duplicate pins must be connected together for proper operation. 2003 Microchip Technology Inc. DS21389C-page 1 TC1410/TC1410N Functional Block Diagram TC1410 VDD Inverting Output 300 mV Output Non-Inverting Output Input Effective Input C = 10 pF 4.7V TC1410N GND DS21389C-page 2 2003 Microchip Technology Inc. TC1410/TC1410N 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Symbol Absolute Maximum Ratings † Description VDD Supply input, 4.5V to 16V INPUT Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA ≤ 70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Control input NC Storage Temperature Range.............. -65°C to +150°C No connection GND Ground GND Ground OUTPUT CMOS push-pull output, common to pin 7 OUTPUT CMOS push-pull output, common to pin 6 Maximum Junction Temperature ...................... +150°C Supply input, 4.5V to 16V VDD † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym Min Typ Max Units Logic ‘1’, High Input Voltage VIH 2.0 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current IIN -1 — 1 µA -10 — 10 Conditions Input 0V ≤ VIN ≤ VDD, TA = +25°C -40°C ≤ TA ≤ +85°C Output High Output Voltage VOH VDD – 0.025 — — V DC Test Low Output Voltage VOL — — 0.025 V DC Test Output Resistance RO — 16 22 Ω — 20 28 — 20 28 IPK — 0.5 — A VDD = 16V IREV — 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec, VDD = 16V tR — 25 35 nsec — 27 40 0°C ≤ TA ≤ +70°C — 29 40 — 25 35 -40°C ≤ TA ≤ +85°C, Figure 4-1 TA = +25°C — 27 40 Peak Output Current Latch-Up Protection Withstand Reverse Current VDD = 16V, IO = 10 mA, TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C Switching Time (Note 1) Rise Time Fall Time tF Delay Time Note 1: tD1 nsec TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 — 29 40 — 30 40 — 33 45 0°C ≤ TA ≤ +70°C — 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1 nsec TA = +25°C Switching times ensured by design. 2003 Microchip Technology Inc. DS21389C-page 3 TC1410/TC1410N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Delay Time Sym Min Typ Max Units Conditions tD2 — 30 40 nsec — 33 45 0°C ≤ TA ≤ +70°C — 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1 — 0.5 1.0 — 0.1 0.15 TA = +25°C Power Supply Power Supply Current Note 1: IS mA VIN = 3V, VDD = 16V VIN = 0V Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V. Parameters Sym Min Typ Max Units Specified Temperature Range (C) TA 0 — +70 ºC ºC Conditions Temperature Ranges Specified Temperature Range (E) TA -40 — +85 Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Thermal Resistance, 8L-MSOP θJA — 206 — ºC/W Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W Package Thermal Resistances DS21389C-page 4 2003 Microchip Technology Inc. TC1410/TC1410N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 500 500 TA = +25°C 400 VIN = 3V ISUPPLY (µA) ISUPPLY (µA) 400 300 200 100 0 VSUPPLY = 16V VIN = 3V 6 8 10 12 14 200 100 VIN = 0V 4 300 0 16 VIN = 0V -40 -20 0 VDD (V) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. 1.6 FIGURE 2-4: vs. Temperature. 1.6 TA = +25°C 1.4 1.3 VIL 1.2 60 80 Quiescent Supply Current VSUPPLY = 16V 4 VIH 1.4 1.3 VIL 1.2 6 8 10 12 14 1.1 16 -40 -20 VDD (V) FIGURE 2-2: Voltage. 0 20 40 60 80 TEMPERATURE (°C) Input Threshold vs. Supply FIGURE 2-5: Temperature. 50 Input Threshold vs. 50 TA = +85°C 40 RDS-ON (Ohms) 40 RDS-ON (Ohms) 40 1.5 VIH VTHRESHOLD (V) VTHRESHOLD (V) 1.5 1.1 20 TEMPERATURE (°C) TA = +25°C 30 20 TA = -40°C 10 30 20 TA = +85°C TA = +25°C 10 TA = -40°C 0 0 4 6 8 10 12 VDD (V) FIGURE 2-3: High-State Output Resistance vs. Supply Voltage. 2003 Microchip Technology Inc. 14 16 4 6 8 10 12 14 16 VDD (V) FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. DS21389C-page 5 TC1410/TC1410N Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 100 100 CLOAD = 500 pF 80 60 tFALL (nsec) tRISE (nsec) 80 TA = +85°C TA = +25°C 40 20 0 4 6 8 100 10 VDD (V) 60 TA = +85°C 40 TA = +25°C 20 TA = -40°C FIGURE 2-7: Voltage. TA = -40°C 12 14 0 16 Rise Time vs. Supply 4 6 8 FIGURE 2-10: Voltage. 100 CLOAD = 500 pF TA = +85°C tD2 (nsec) 60 TA = +25°C 40 14 16 CLOAD = 500 pF 60 TA = +85°C TA = +25°C 40 TA = -40°C 20 4 6 8 FIGURE 2-8: Supply Voltage. 10 VDD (V) 12 14 Propagation Delay vs. 4 TA = +25°C VDD = 16V Propagation Delays (nsec) 60 40 20 500 1000 1500 2000 2500 3000 8 3500 DS21389C-page 6 Rise and Fall Times vs. 12 14 16 Propagation Delay vs. tD2 41 tD1 37 33 29 25 0 500 1000 CLOAD (pF) FIGURE 2-9: Capacitive Load. 10 VDD (V) TA = +25°C VDD = 16V tRISE tFALL 0 6 FIGURE 2-11: Supply Voltage. 80 0 0 16 45 100 tRISE, tFALL (nsec) 12 Fall Time vs. Supply TA = -40°C 20 0 10 VDD (V) 80 80 tD1 (nsec) CLOAD = 500 pF 1500 2000 2500 3000 3500 CLOAD (pF) FIGURE 2-12: Capacitive Load. Propagation Delays vs. 2003 Microchip Technology Inc. TC1410/TC1410N 3.0 PIN DESCRIPTIONS 3.3 The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. 3.1 PIN FUNCTION TABLE Symbol CMOS Push-Pull Output (OUTPUT) The MOSFET driver output is a low-impedance, CMOS, push-pull style output, capable of driving a capacitive load with 0.5 A peak currents. Description Supply input, 4.5V to 16V 3.4 Control input The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 1 VDD 2 INPUT 3 NC 4 GND Ground 5 GND Ground 6 OUTPUT CMOS push-pull output, common to pin 7 7 OUTPUT CMOS push-pull output, common to pin 6 8 VDD No connection Ground Supply input, 4.5V to 16V Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input also has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 2003 Microchip Technology Inc. DS21389C-page 7 TC1410/TC1410N 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 16V 0V 1.0 µF 0.1 µF 1, 8 Input 10% tD1 VDD tD2 tF tR 90% 90% Output 2 6, 7 Output 10% 10% 0V Inverting Driver TC1410 CL = 500 pF TC1410 TC1410N +5V 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 0V VDD 10% tD1 90% Output 0V 90% tR 10% tD2 tF 10% Non-Inverting Driver TC1410N FIGURE 4-1: DS21389C-page 8 Switching Time Test Circuit. 2003 Microchip Technology Inc. TC1410/TC1410N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW 8-Lead MSOP YWWNNN Note: * Example: TC1410 COA0346 Example: 1410NE 346057 XXXXXXX XX...X YY WW NNN TC1410 CPA057 0346 057 NNN Legend: Example: Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. 2003 Microchip Technology Inc. DS21389C-page 9 TC1410/TC1410N 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB α β MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21389C-page 10 2003 Microchip Technology Inc. TC1410/TC1410N 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2003 Microchip Technology Inc. DS21389C-page 11 TC1410/TC1410N 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins .026 BSC Pitch A .043 Overall Height A2 .030 .033 .037 Molded Package Thickness A1 .006 .000 Standoff E .193 TYP. Overall Width E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF φ Foot Angle 0° 8° c Lead Thickness .003 .006 .009 B .009 .012 .016 Lead Width α 5° 15° Mold Draft Angle Top β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21389C-page 12 2003 Microchip Technology Inc. TC1410/TC1410N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Examples: a) b) Device: TC1410: 0.5A Single MOSFET Driver, Inverting TC1410N: 0.5A Single MOSFET Driver, Non-Inverting Temperature Range: C E Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead c) = = 0°C to +70°C -40°C to +85°C TC1410COA: 0.5A Single MOSFET driver, SOIC package, 0°C to +70°C. TC1410CPA: 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1410EUA713: Tape and Reel, 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C. a) TC1410NCPA: b) TC1410NEPA: c) TC1410NEUA: * MSOP package is only available in E-Temp. 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. 0.5A Single MOSFET driver, PDIP package, -40°C to +85°C. 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21389C-page 13 TC1410/TC1410N NOTES: DS21389C-page 14 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2003 Microchip Technology Inc. DS21389C-page 15 M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta Unit 915 Bei Hai Wan Tai Bldg. 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A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 07/28/03 2003 Microchip Technology Inc.