DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BCP54; BCP55; BCP56 NPN medium power transistors Product specification Supersedes data of 1997 Apr 08 1999 Apr 08 Philips Semiconductors Product specification NPN medium power transistors BCP54; BCP55; BCP56 FEATURES PINNING • High current (max. 1 A) PIN • Low voltage (max. 80 V). DESCRIPTION 1 base 2, 4 APPLICATIONS collector 3 emitter • Switching. DESCRIPTION 4 handbook, halfpage 2, 4 NPN medium power transistor in a SOT223 plastic package. PNP complements: BCP51, BCP52 and BCP53. 1 3 1 2 3 Top view Fig.1 MAM287 Simplified outline (SOT223) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCEO PARAMETER collector-base voltage CONDITIONS MIN. MAX. UNIT open emitter BCP54 − 45 V BCP55 − 60 V BCP56 − 100 V BCP54 − 45 V BCP55 − 60 V BCP56 − 80 V − 5 V collector-emitter voltage open base VEBO emitter-base voltage IC collector current (DC) − 1 A ICM peak collector current − 1.5 A IBM peak base current − 0.2 A open collector Ptot total power dissipation − 1.33 W Tstg storage temperature Tamb ≤ 25 °C; note 1 −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”. 1999 Apr 08 2 Philips Semiconductors Product specification NPN medium power transistors BCP54; BCP55; BCP56 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-a thermal resistance from junction to ambient Rth j-s thermal resistance from junction to soldering point VALUE UNIT 94 K/W 13 K/W note 1 Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER collector cut-off current CONDITIONS MIN. TYP. MAX. IE = 0; VCB = 30 V − − 100 nA IE = 0; VCB = 30 V; Tj = 125 °C − − 10 µA − 100 nA IEBO emitter cut-off current IC = 0; VEB = 5 V − hFE DC current gain IC = 5 mA; VCE = 2 V 25 − − IC = 150 mA; VCE = 2 V 63 − 250 IC = 500 mA; VCE = 2 V 25 − − hFE DC current gain UNIT − IC = 150 mA; VCE = 2 V BCP55-10; 56-10 63 − 160 BCP54-16; 55-16; 56-16 100 − 250 − − 500 VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 50 mA mV VBE base-emitter voltage IC = 0.5 A; VCE = 2 V − − 1 V fT transition frequency IC = 10 mA; VCE = 5 V; f = 100 MHz − 130 − MHz h FE1 ----------h FE2 DC current gain ratio of the complementary pairs IC = 150 mA; VCE = 2 V − − 1.6 1999 Apr 08 3 Philips Semiconductors Product specification NPN medium power transistors BCP54; BCP55; BCP56 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-11-11 97-02-28 SOT223 1999 Apr 08 EUROPEAN PROJECTION 4 Philips Semiconductors Product specification NPN medium power transistors BCP54; BCP55; BCP56 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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