DFLR1200 - DFLR1600 SURFACE MOUNT SILICON RECTIFIER DIODES VOLTAGE RANGE: 200 - 600V CURRENT: 1.0 A Features ! Glass passivated device ! Ideal for surface mouted applications ! Low reverse leakage ! Metallurgically bonded construction B Mechanical Data C ! Case: SOD-123FL plastic body over passivated junction ! Terminals : Plated axial leads, ! solderable per MIL-STD-750, Method 2026 ! ! ! E SOD-123FL Dim Min Max Typ A 3.58 3.72 3.65 3 B 2.72 2.78 2.75 C 1.77 1.83 1.80 D 1 1.02 1.08 1.05 E 0.097 1.03 1.00 H 0.13 0.17 0.15 L 0.53 0.57 0.55 All Dimensions in mm D H Polarity : Color band denotes cathode end Mounting Position : Any Weight:0.0007 ounce, 0.02 grams L E A Maximum Ratings and Electrical Characteristics Single phase, half wave, 60Hz, resistive or inductive load. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage TA = 25°C unless otherwise specified For capacitive load, derate current by 20%. Symbol DFLR1200 DFLR1400 DFLR1600 Unit VRRM VRWM VR 200 400 600 V VR(RMS) 140 280 420 V IO 1.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load IFSM 25 A Forward Voltage VFM 1.1 V IRM 3.0 100 mA CT 10 pF Average Rectified Output Current (see figure 4) @ IF = 1.0A Peak Reverse Leakage Current at Rated DC Blocking Voltage @ TA = 25°C @ TA = 125°C Typical Total Capacitance (f = 1MHz, VR = 4.0VDC) Thermal Characteristics Characteristic Thermal Resistance, Junction to Ambient Air (Note 1) Thermal Resistance, Junction to Soldering Point (Note 3) Operating and Storage Temperature Range Notes: Symbol Typ Max Unit RqJA 134 ¾ °C/W RqJS ¾ 6 °C/W Tj, TSTG ¾ -65 to +150 °C 1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. TA = 25°C 2. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. 3. Theoretical R qJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction. 1 of 2 www.sunmate.tw IF, INSTANTANEOUS FORWARD CURRENT (mA) 10,000 10 TA = 150°C 1 1,000 TA = 125°C TA = 150°C 0.1 TA = 85°C 100 TA = 75°C 0.01 TA = 25°C TA = 25°C 10 0.001 TA = -55°C TA = -65°C 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.0001 1.8 25 0 50 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics 1.2 12 f = 1MHz Note 1 IF, DC FORWARD CURRENT (A) 10 CT, TOTAL CAPACITANCE (pF) 100 75 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 2 Typical Reverse Characteristics 8 6 4 2 1.0 0.8 0.6 0.4 0.2 0.0 0 0 10 20 30 40 VR, REVERSE VOLTAGE (V) Fig. 3 Typical Total Capacitance 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 4 DC Forward Current Derating 2 of 2 www.sunmate.tw