1 of 3 Creation Date : June 01, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3225CH1H473J200AA TDK item description C3225CH1H473JT**** Applications Commercial Grade Feature General General (Up to 50V) Series C3225 [EIA 1210] Status Production Size Length(L) 3.20mm ±0.40mm Width(W) 2.50mm ±0.30mm Thickness(T) 2.00mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) Recommended Land Pattern (PA) 2.00mm to 2.40mm Recommended Land Pattern (PB) 1.00mm to 1.20mm Recommended Land Pattern (PC) 1.90mm to 2.50mm Electrical Characteristics Capacitance 47nF ±5% Rated Voltage 50VDC Temperature Characteristic CH(0±60ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 1000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : June 01, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3225CH1H473J200AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C3225CH1H473J200AA ESR C3225CH1H473J200AA Capacitance C3225CH1H473J200AA C3225CH1H473J200AA Temperature Characteristic C3225CH1H473J200AA(No Bias) DC Bias Characteristic C3225CH1H473J200AA(DC Bias = 25V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C3225CH1H473J200AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : June 01, 2017 (GMT)