FERROXCUBE DATA SHEET SMD beads EMI-suppression products Supersedes data of September 2004 2008 Sep 01 Ferroxcube EMI-suppression products SMD BEADS FOR EMI SUPPRESSION SMD beads Mechanical data General data ITEM 5.3 ± 0.35 1.2 min 1.1 min SPECIFICATION Strip material copper (Cu), tin (Sn) plated Solderability “IEC 60068-2-58”, Part 2, Test Ta, method 1 Taping method “IEC 60286-3” , “EIA 481-1” and “EIA 481-2” GRADE |Ztyp (Ω) at f (MHz) 1.27 ± 0.07 1.8 max MBE731 0.2 ± 0.015 Grades, parameters and type numbers |(1) 3.05 ± 0.15 Dimensions in mm. Fig.1 BDS 3/1.8/5.3. TYPE NUMBER BDS 3/1.8/5.3; mass ≈0.1 g (2) 3S1 4S2 28 10 33 25 25 100 25 25 38 100 45 300 4.6 ± 0.3 1.2 min 1.1 min BDS 3/1.8/5.3-3S1 BDS 3/1.8/5.3-4S2 4S2 25 3 45 10 35 25 30 25 50 100 55 BDS 3/3/8.9; mass ≈0.3 g 3S1 4S2 MGC296 0.2 ± 0.015 Dimensions in mm. BDS3/3/4.6-3S1 Fig.2 BDS 3/3/4.6. BDS3/3/4.6-4S2 3.05 ± 0.15 8.9 ± 0.35 5 min 1.2 min 300 1.27 ± 0.07 3 max (3) 55 3 80 10 55 25 65 25 100 100 110 300 BDS 3/3/8.9-3S1 65 25 100 100 110 300 MGC297 0.2 ± 0.015 Dimensions in mm. BDS 3/3/8.9-4S2 Fig.3 BDS 3/3/8.9. BDS 4.6/3/8.9; mass ≈0.5 g (3) 4S2 1.27 ± 0.07 3 max BDS 3/3/4.6; mass ≈0.15 g (2) 3S1 3.05 ± 0.15 4.6 ± 0.3 8.9 ± 0.35 BDS 4.6/3/8.9-4S2 5 min 1.2 min 1.27 ± 0.07 3 max Note 0.2 ± 0.015 1. Typical values, Zmin is −20%. 2. DC resistance <0.6 mΩ. Dimensions in mm. 3. DC resistance <1.0 mΩ 2008 Sep 01 Fig.4 BDS 4.6/3/8.9. 1436 MGC298 Ferroxcube EMI-suppression products SMD beads RECOMMENDED DIMENSIONS OF SOLDER LANDS Table 1 Reflow soldering DIMENSIONS (mm) SIZE A B C D BDS 3/1.8/5.3 2.8 7.2 2.2 3.3 BDS 3/3/4.6 2.8 6.4 1.8 3.3 BDS 3/3/8.9 7.0 10.8 1.9 3.3 BDS 4.6/3/8.9 7.0 10.8 1.9 3.3 ; ; B C C A D MEA734 For dimensions see Table 1. Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm (≈0.7 mg solder paste per mm2). Fig.5 Reflow and vapour phase soldering. Table 2 Wave soldering DIMENSIONS (mm) SIZE A B C D E BDS 3/1.8/5.3 2.0 7.2 2.6 3.0 0.8 BDS 3/3/4.6 2.0 6.4 2.2 3.0 0.8 BDS 3/3/8.9 6.0 12.2 3.1 3.0 2.5 BDS 4.6/3/8.9 6.0 12.2 3.1 3.0 ;;; B C 2.5 A C E D MEA735 For dimensions see Table 2. Fig.6 Wave soldering. 2008 Sep 01 1437 Ferroxcube EMI-suppression products SMD beads Soldering profiles Temp in oC Soldering 20 - 40 sec Preheat 480 sec max 255 - 260 oC o 217 oC 6 C/s max o 3 C/s max o max 200 C 60 - 150 sec min 150 oC 60 - 180 sec Time in sec 25 oC MFP129 Fig.7 Reflow soldering. 300 10 s T MLA861 (°C) 250 235 °C to 260 °C 200 second wave 5 K/s first wave 2 K/s 200 K/s 150 100 °C to 130 °C forced cooling 100 2 K/s 50 0 0 50 100 150 Typical values (solid line). Process limits (dotted lines). Fig.8 Double wave soldering. 2008 Sep 01 1438 200 t (s) 250 Ferroxcube EMI-suppression products SMD beads BLISTER TAPE AND REEL DIMENSIONS K0 handbook, full pagewidth P0 D0 T P2 E F cover tape W B0 MEA613 - 1 A0 D1 P1 direction of unreeling For dimensions see Table 3. Fig.9 Blister tape. Table 3 Physical dimensions of blister tape; see Fig.9 DIMENSIONS (mm) SIZE BDS3/1.8/5.3 BDS3/3/4.6 BDS3/3/8.9 BDS4.6/3/8.9 A0 3.25 ±0.1 3.45 ±0.1 3.45 ±0.1 5.1 ±0.1 B0 5.85 ±0.1 5.1 ±0.1 9.4 ±0.1 9.4 ±0.1 K0 2.0 ±0.1 3.1 ±0.1 3.1 ±0.1 3.1 ±0.1 T 0.3 ±0.05 0.25 ±10% 0.35 ±0.05 0.3 ±0.05 W 12.0 ±0.3 12.0 ±0.3 16.0 ±0.3 16.0 ±0.3 E 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 F 5.5 ±0.05 5.5 ±0.05 7.5 ±0.1 7.5 ±0.1 D0 1.5 +0.1 1.5 +0.1 1.5 +0.1 1.5 +0.1 D1 ≥1.5 ≥1.5 ≥1.5 ≥1.5 P0 4.0 ±0.1 4.0 ±0.1 4.0 ±0.1 4.0 ±0.1 P1 8.0 ±0.1 8.0 ±0.1 8.0 ±0.1 8.0 ±0.1 P2 2.0 ±0.1 2.0 ±0.05 2.0 ±0.1 2.0 ±0.1 2008 Sep 01 1439 Ferroxcube EMI-suppression products SMD beads W2 handbook, full pagewidth 20.5 12.75 0.15 N 0 A MSA284 W1 Dimensions in mm. For dimensions see Table 4. Fig.10 Reel. Table 4 Reel dimensions; see Fig.10 DIMENSIONS (mm) SIZE A N W1 W2 12 330 100 ±5 12.4 ≤16.4 16 330 100 ±5 16.4 ≤20.4 2008 Sep 01 1440 Ferroxcube EMI-suppression products SMD beads DATA SHEET STATUS DEFINITIONS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS Preliminary specification Development This data sheet contains preliminary data. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. DISCLAIMER Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube for any damages resulting from such application. PRODUCT STATUS DEFINITIONS STATUS INDICATION DEFINITION Prototype These are products that have been made as development samples for the purposes of technical evaluation only. The data for these types is provisional and is subject to change. Design-in These products are recommended for new designs. Preferred These products are recommended for use in current designs and are available via our sales channels. Support These products are not recommended for new designs and may not be available through all of our sales channels. Customers are advised to check for availability. 2008 Sep 01 1441