Rohm BA00CC0WT 2a/1a variable output ldo regulator Datasheet

Datasheet
2A/1A Variable Output
LDO Regulators
BA00DD0xx series BA00CC0xx series
●General Description
The BA00DD0xx and BD00CC0xx series are low-saturation regulators available for outputs up to 2A/1A. The output voltage
can be arbitrarily configured using the external resistance. These series of LDO regulators are offered in a broad packaging
lineup.
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
„ ±1% high-precision output voltage (BA00DD0xx)
„ Low saturation with PNP output
„ Built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuits
„ Built-in thermal shutdown circuit for protecting the IC
from thermal damage due to overloading
„ Built-in over- voltage protection circuit that prevents
the destruction of the IC due to power supply surges
●Packages
HRP5
TO252-5
TO220CP-V5
TO220FP-5
TO220FP-5(V5)
●Key Specifications
„ Input Power Supply Voltage:
25V(Max.)
„ Output voltage type:
Variable
„ Output current: BA00DD0xx series
2A(Max.)
BA00CC0xx series
1A(Max.)
„ Shutdown current:
0μA(Typ.)
„ Operating temperature range:
-40℃ to +125℃
W (Typ.) x D (Typ.) x H (Max.)
9.395mm x 10.54 mm x 2.005mm
6.50 mm x 9.50 mm x 2.50 mm
10.00 mm x 20.12 mm x 4.60 mm
10.00 mm x 30.50 mm x 4.60 mm
10.00 mm x 31.50 mm x 8.15 mm
TO252-5
HRP5
TO220CP-V5
●Applications
Usable in DSP power supplies for DVDs and CDs,
FPDs, televisions, personal computers or any other
consumer device
TO220FP-5
TO220FP-5(V5)
●Ordering Information
B
Part
Number
A
0
0
Output voltage
00:Variable
x
x
Output Current
CC0 : 1A
DD0 : 2A
●Lineup
Maximum output current (Max.)
1A
2A
0
W
x
Shutdown
switch
W : Includes
switch
x
x
Package
HFP：HRP5
FP ：TO252-5
CP ：TO220CP-V5
T ：TO220FP-5
：TO220FP-5(V5)
Package
TO220FP-5
Tube of 500
TO220CP-V5
Reel of 500
TO252-5
Reel of 2000
TO220FP-5(V5) Tube of 500
TO220CP-V5
Reel of 500
HRP5
Reel of 2000
○Product structure：Silicon monolithic integrated circuit
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-
xx
Packaging and forming specification
TR: Embossed tape and reel
(HRP5)
E2: Embossed tape and reel
(TO252-5,TO220CP-V5)
None : Container Tube
(TO220FP-5,TO220FP-5(V5))
V5 :Forming(V5 only)
Orderable Part Number
BA00CC0WT
BA00CC0WCP-V5E2
BA00CC0WFP-E2
BA00CC0WT-V5
BA00DD0WCP-V5E2
BA00DD0WHFP-TR
○This product is not designed protection against radioactive rays.
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Datasheet
BA00DD0xx series BA00CC0xx series
●Block Diagrams / Pin Configurations / Pin Descriptions
[BA00CC0WFP]
[BA00DD0WHFP]
N.C.(TO252-5)
GND(HRP5)
3
3
Vref
Driver
Vcc
VOUT
4
2
0.33μF
+
22μF
OVP
1
TSD
OCP
Fin
CTL
C(ADJ)
5
GND
R2
R1
TOP VIEW
PINNo.
1
2
3
4
5
FIN
FIN
1 2 3 4 5
1 2 3 4 5
TO252-5
HRP5
Symbol
CTL
VCC
N.C./GND
OUT
C
GND
Function
Output voltage ON / OFF control
Power supply voltage input
Unconnected terminal/GND*
Voltage output
Output voltage regulation terminal
GND
*TO252-5 is N.C., and HRP5 is GND
[BA00CC0WT] [BA00CC0CP-V5] [BA00DD0WCP-V5] [BA00DD0WCP-V5]
Vref
Driver
VOUT
Vcc
4
2
0.33μF
+
22μF
OVP
1
CTL
TSD
OCP
3
GND
C(ADJ)
R1
5
R2
TOP VIEW
1 2 3 45
TO220FP-5
1 2 3 45
TO220FP-5(V5)
PINNo. Symbol
Function
1
CTL Output voltage ON/OFF control
2
VCC Power supply voltage input
3
GND GND
4
OUT Voltage output
5
ADJ Output voltage regulation terminal
12 3 4 5
TO220CP-V5
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Datasheet
BA00DD0xx series BA00CC0xx series
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Input Power Supply Voltage*1
Symbol
Vcc
Power Dissipation*2
Pd
Operating Temperature Range
Ambient Storage Temperature
Junction Temperature
Output Control Terminal Voltage
Voltage Applied to the Tip*3
*1
*2
*3
Limits
-0.3 to +35
2300(HRP5)
1300(TO252-5)
2000(TO220FP-5)
2000(TO220FP-5(V5))
2000(TO220CP-V5)
Unit
V
-40 to +125
-55 to +150
+150
-0.3 to +Vcc
+50
℃
℃
℃
V
V
Topr
Tstg
Tjmax
VCTL
Vcc peak
mW
Must not exceed Pd
HRP5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 18.4 mW/℃.
TO252-5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 10.4 mW/℃.
TO252FP-5 : No heat sink. When Ta≥25℃, the power is reduced by 16 mW/℃.
Applied voltage: 200msec or less (tr≥1msec)
tr≧1msec
50V
35V
0V
MAX200msec
(Voltage Supply more than 35V)
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
BA00CC0xx
Input Power Supply Voltage
Vcc
BA00DD0xx
BA00CC0xx
Output Current
Io
BA00DD0xx
Output Control Terminal Voltage
VCTL
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Min.
4.0
3.0
－
－
0
3/17
Max.
25.0
25.0
1
2
Vcc
Unit
V
A
V
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
Datasheet
BA00DD0xx series BA00CC0xx series
●Electrical Characteristics
BA00CC0xx Series (Unless otherwise specified, Ta=25℃, VCTL=5V, Vcc=10V,Io=500mA,Vo=5V Setting)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Shut Down Current
Isd
－
0
10
μA
VCTL=0V
－
Bias Current
Ib
2.5
5.0
mA VCTL =2V, Io=0mA
Ｃ Terminal Voltage
Vc
1.200
1.225
1.250
V
Io=50mA
ΔVd
－
Vcc=Vo×0.95
Dropout Voltage
0.3
0.5
V
Peak Output Current
Io
1.0
－
－
A
f=120Hz, ein※4=1Vrms,
Ripple Rejection
R.R.
45
55
－
dB
Io=100mA
－
Line Regulation
Reg.I
20
100
mV Vcc=6→25V
Load Regulation
Reg.L
－
50
150
mV Io=5mA→1A
Temperature Coefficient of
Tcvo
－
±0.02
－
％/℃ Io=5mA,Tj=0℃ to 125℃
Output Voltage
※5
－
－
Output Short Current
Ios
0.40
A
Vcc=25V
ON Mode Voltage
VthH
2.0
－
－
V
ACTIVE MODE, Io=0mA
－
－
OFF Mode Voltage
VthL
0.8
V
OFF MODE, Io=0mA
Input High Current
ICTL
100
200
300
μA
VCTL=5V, Io=0mA
※4 ein : Input Voltage Ripple
※5 Not 100% tested
BA00DD0xx Series (Unless otherwise specified, Ta=25℃, Vcc=8V, VCTL=3V, Vo=5.0V setting)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Shut Down Current
Isd
－
0
10
μA
VCTL =0V, Io=0mA
Bias Current
Ib
－
0.9
2.0
mA Io=0mA
ADJ pin Voltage
Vadj
1.257
1.270
1.283
V
Io=100ｍA
ADJ pin Current ※6
Iadj
－
50
－
nA
Io=0mA
Dropout Voltage1
△Vd1
－
0.3
0.5
V
Vcc=0.95×Vo, Io=1A
Dropout Voltage2
△Vd2
－
0.45
0.7
V
Vcc=0.95×Vo, Io=2A
Peak Output Current
Io
2.0
－
－
A
7
f=120Hz, ein※ =-20dBV,
Ripple Rejection
R.R.
－
55
－
dB
Io=100mA
Line Regulation
Reg.I
－
15
35
mV Vcc=5.7V→25V, Io=200mA
－
Load Regulation
Reg.L
50
100
mV Io=0mA→2A
Temperature Coefficient of
Tcvo
－
±0.02
－
%/℃ Io=5mA, Tj=0℃ to 125℃
Output Voltage ※6
Output Short Current
Ios
－
0.4
－
A
Vcc=25V
－
CTL ON Mode Voltage
Von
2.0
Vcc
V
ACTIVE MODE, Io=0mA
CTL OFF Mode Voltage
Voff
－
－
0.8
V
OFF MODE, Io=0mA
－
CTL Input Current
ICTL
60
120
μA
VCTL =3V, Io=0mA
※6 Not 100% tested
※7 ein=Input Voltage Ripple
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Datasheet
BA00DD0xx series BA00CC0xx series
[V]
[mA]
●Typical Performance Curves
BA00CC0xx (3.3V preset voltage)
(Unless specified otherwise, Vcc=10V, VOUT=3.3V preset, VCTL=3V, Io=0mA, R1=2.2kΩ, and R2=6.8kΩ)
Fig.2
Input Stability
[V]
[V]
Fig.1
Circuit Current
Fig.4
Load Stability
Fig.3
Input Stability
（Io=500mA）
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Datasheet
BA00DD0xx series BA00CC0xx series
[mV]
[dB]
[dB]
●Typical Performance Curves - continued
10
100
1k
10k
100k
1000k
FREQUENCY:f[Hz]
Fig.6
Ripple Rejection Characteristics
（Io=100mA）
[V]
[mA]
Fig.5
Input/Output Voltage Difference
Io-ΔVd Characteristics（Vcc=2.95V）
Fig.7
Output Voltage
Temperature Characteristics
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Fig.8
Circuit Current by load Level
(IOUT=0mA→1A)
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Datasheet
BA00DD0xx series BA00CC0xx series
[V]
●Typical Performance Curves - continued
Fig.10
CTL Voltage vs. Output Voltage
Fig.9
CTL Voltage vs. CTL Current
4
3
3
2
2
1
1
[V]
4
Fig.12
Thermal Shutdown
Circuit Characteristics
Fig.11
Overvoltage Operating
Characteristics (Io=200mA)
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Datasheet
BA00DD0xx series BA00CC0xx series
●Typical Performance Curves - continued
[V]
[mA]
BA00DD0xx(5.0V preset voltage)
(Unless specified otherwise, Vcc=8V, VOUT=5V preset, VCTL=3V, Io=0mA, R1=15kΩ, and R2=44kΩ)
Fig.14
Input Stability
[V]
Fig.13
Circuit Current
Fig.16
Load Stability
Fig.15
Input Stability
（Io=2A）
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Datasheet
BA00DD0xx series BA00CC0xx series
[mV]
[dB]
●Typical Performance Curves - continued
Fig.18
Ripple Rejection Characteristics
（Iout=100mA）
[mA]
[V]
Fig.17
Input/Output Voltage Difference
Iout-ΔVd Characteristics（Vcc=4.75V）
Fig.20
Circuit Current by load Level
(IOUT=0mA→2A)
Fig.19
Output Voltage
Temperature Characteristics
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Datasheet
BA00DD0xx series BA00CC0xx series
[V]
●Typical Performance Curves - continued
Fig.21
CTL Voltage vs. CTL Current
[V]
[V]
Fig.22
CTL Voltage vs. Output Voltage
Fig.24
Thermal Shutdown
Circuit Characteristics
Fig.23
Overvoltage Operating
Characteristics (lo=200mA)
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Datasheet
BA00DD0xx series BA00CC0xx series
●I/O equivalence circuit
< BA00CC0WT/BA00CC0WFP/BA00CC0WT-V5/BA00CC0WCP-V5 >
Vcc
25kΩ
C
CTL
10 kΩ
25kΩ
5.5kΩ
VOUT
Fig.25
< BA00DD0WCP-V5/BA00DD0WHFP >
Vcc
Vcc
Vcc
10kΩ
39kΩ
2kΩ
VOUT
CTL
ADJ
31kΩ
500Ω
Fig.26
●Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.27.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large
values are used. The use of resistors with R1=2kΩ to 15 kΩ is recommended.
VOUT
Vo = Vc (VADJ) ×
BA00CC0xx
BA00DD0xx
1 ＋ R2
R1
R2
Vc : 1.225 (Typ.)
VADJ : 1.270 (Typ.)
C（ADJ）
Vc
（VADJ）
R1
Fig.27
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Datasheet
BA00DD0xx series BA00CC0xx series
●Power Dissipation
TO220FP-5
To225FP-5
HRP5
10
Board size : 70×70×1.6 ㎜ （board contains a thermal）
2
Board front copper foil area : 10.5×10.5 ㎜
2
①2-layer board (back surface copper foil area :15×15 ㎜ )
2
②2-layer board (back surface copper foil area :70×70 ㎜ )
2
③4-layer board (back surface copper foil area :70×70 ㎜ )
8
6
②5.5W
5
4
3
2
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-c=62.5(℃/W)
（1）20.0
③7.3W
7
（1）
（2）
20
Power Dissipation:Pd(W)
9
Power Dissipation:Pd(W)
25
3
15
10
5
①2.3W
（2）2.0
1
0
0
0
25
50
75
100
Ambient temperature:Ta(℃）
125
0
150
25
Fig.28
50
75
100
Ambient temperature:Ta(℃）
125
150
Fig.29
TO252-5
2.0
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
Power Dissipation:Pd(W)
1.6
1.30
1.2
0.8
0.4
0.0
0
25
50
75
100
Ambient temperature:Ta(℃）
125
150
Fig.30
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.28 through 30.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature TjMAX.
Fig.29 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
Vcc：Input voltage
The calculation method for power consumption Pc(W) is as follows:
Vo：Output voltage
Io：Load current
Icca：Circuit current
Pc = (Vcc-Vo)×Io＋Vcc×Icca
Acceptable loss Pd≦Pc
Solving this for load current Io in order to operate within the acceptable loss,
Io≦ Pd – Vcc×Icca
Vcc－Vo
（Please refer to Fig.8 and 20 for Icca.）
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
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Datasheet
BA00DD0xx series BA00CC0xx series
Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
1.04－8.3×Icca
Io≦
5
Io≦200mA (Icca : 2mA)
With the IC alone : θja=62.5℃/W → -16mW/℃
25℃=2000mW → 85℃=1040mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is:
Pc=Vcc×(Icca＋Ishort)
Ishort : Short circuit current
●Terminal Vicinity Settings and Cautions
・Vcc Terminal
Please attach a capacitor (greater than 0.33μF) between the Vcc and GND.
The capacitance values differ depending on the application, so please chose a capacitor with sufficient margin and verify
the operation on an actual board.
・CTL Terminal
The CTL terminal is turned ON at 2.0V and higher and OFF at 0.8V and lower within the operating power supply voltage
range.
CC0xx series, The power supply and the CTL terminal in any order without problems.
●Vo Terminal
Please attach an anti-oscillation capacitor between VOUT and GND. The capacitance of the capacitor may significantly
change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or
aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low
temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Fig.31 through 33. In cases where there
are sudden load fluctuations, the large capacitor is recommended.
OUT
22μF
C(ADJ)
Fig.31: Output equivalent circuit
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Unstable operating region
100
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
IC
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
100
10
Stable operating region
1
Unstable operating region
0.1
0
200
600
800
400
OUTPUT CURRENT：lo(mA)
1000
Fig.32:Io vs. ESR characteristics
(BA00CC0)
13/17
Unstable operating region
10
Stable operating region
1
0.1
Unstable operating region
1
1
100
10
OUTPUT
1000
CURRENT：lo(mA)
Fig.33: Io vs. ESR characteristics
(BA00DD0)
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
Datasheet
BA00DD0xx series BA00CC0xx series
●Operational Notes
1) Protection Circuits
Overcurrent Protection Circuit
A built-in overcurrent protection circuit corresponding to the current capacity prevents the destruction of the IC when there
are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is
restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance
capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,
it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the
overcurrent protection circuit has negative current capacity characteristics with regard to temperature (Refer to Fig.4 and
16).
Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As
shown above, this must be used within the range of acceptable loss, but if the acceptable loss happens to be
continuously exceeded, the chip temperature Tj increases, causing the temperature protection circuit to operate.
When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation
immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to
Fig.12 and 24 for the temperatures at which the temperature protection circuit operates).
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to
avoid leaving the IC in the overloaded state.
Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.34).
2) This IC is bipolar IC that has a P-board (substrate) and P+ isolation layer
between each devise, as shown in Fig.35. A P-N junction is formed between
this P-layer and the N-layer of each device, and the P-N junction operates as a
parasitic diode when the electric potential relationship is GND> Pin A, GND>
Pin B, while it operates as a parasitic transistor when the electric potential
relationship is Pin B GND> Pin A. Parasitic devices are intrinsic to the IC. The
operation of parasitic devices induces mutual interference between circuits,
causing malfunctions and eventually the destruction of the IC itself. It is
necessary to be careful not to use the IC in ways that would cause parasitic
elements to operate. For example, applying a voltage that is lower than the
GND (P-board) to the input terminal.
Transistor (NPN)
C
Vcc
OUT
CTL
GND
Fig.34: Bypass diode
Resistor
B
(Pin B)
Reverse current
(Pin A)
(Pin B)
E
B
GND
N
N
GND
P
N
P+
N
N
N
Parasitic element
or transistor
N
P
P
Parasitic element
or transistor
E
P+
P+
P
P+
C
Parasitic element
GND
(Pin A)
Parasitic element
GND
GND
Fig.35: Example of the basic structure of a bipolar IC
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BA00DD0xx series BA00CC0xx series
●Physical Dimension Tape and Reel Information
HRP5
<Tape and Reel information>
8.82 ± 0.1
(6.5)
0.08±0.05
1.2575
1
2
3
4
0.835±0.2
1.523±0.15
8.0±0.13
(7.49)
1.905±0.1
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
direction is the 1pin of product is at the upper right when you hold
( The
)
reel on the left hand and you pull out the tape on the right hand
1pin
5
+5.5°
4.5°−4.5°
+0.1
0.27 −0.05
S
0.73±0.1
0.08 S
1.72
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-5
<Tape and Reel information>
2.3±0.2
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
Tape
Embossed carrier tape
Quantity
2000pcs
0.5±0.1
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2.5
4 5
0.8
1 2 3
1.5
9.5±0.5
5.5±0.2
FIN
E2
0.5±0.1
0.5
1.27
1.0±0.2
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TO220CP-V5
1.444
<Tape and Reel information>
4.5±0.1
+0.2
2.8 -0.1
Embossed carrier tape
Quantity
500pcs
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
16.92
13.60
0.82±0.1
0.92
1.778
Tape
Direction
of feed
(1.0)
8.0 ± 0.2
1.0 ± 0.2
+0.4
15.2 -0.2
4.92 ± 0.2
12.0 ± 0.2
+0.3 φ3.2±0.1
10.0 -0.1
0.42±0.1
1.58
(2.85)
4.12
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
+0.3
4.5 −0.1
+0.2
2.8 −0.1
φ3.2±0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
8.0±0.2
0.7
12.0±0.2
+0.3
10.0−0.1
+0.3
7.0 −0.1
13.5Min.
+0.4
17.0 −0.2
1.8±0.2
TO220FP-5
1.2
0.8
1.778
0.5±0.1
2.85
1 2 3 4 5
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
15/17
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
Datasheet
BA00DD0xx series BA00CC0xx series
23.4
(2.0)
φ3.2±0.1
<Tape and Reel information>
+0.2
2.8 −0.1
17.5
+0.3
4.5 −0.1
0.3
7.0 +
− 0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
25.8
+ 0.3
10.0 − 0.1
8.0±0.2
0.7
+0.4
17.0 −0.2
12.0±0.2
31.5Max.
1.8±0.2
TO220FP-5(V5)
1.2
0.8
0.5±0.1
1.778
(2.85)
4.25
8.15
1 2 3 4 5
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
●Marking Diagrams
TO252-5
(TOP VIEW)
HRP5 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
TO220FP-5 (TOP VIEW)
TO220CP-V5 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
TO220FP-5 (V5) (TOP VIEW)
Part Number Marking
LOT Number
Orderable Part Number
BA00CC0WT
BA00CC0WCP-V5E2
BA00CC0WFP-E2
BA00CC0WT-V5
BA00DD0WCP-V5E2
BA00DD0WHFP-TR
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
16/17
Package
TO220FP-5
TO220CP-V5
TO252-5
TO220FP-5(V5)
TO220CP-V5
HRP5
Part Number Marking
00CC0W
00CC0W
00CC0W
00CC0W
00DD0W
00DD0W
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
Datasheet
BA00DD0xx series BA00CC0xx series
●Revision History
Date
Revision
26.Jun.2012
25.July.2013
001
002
Changes
New Release
Page-13 Changed CTL terminal description
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
17/17
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.001