TI1 CC3120MOD Simplelink wi-fi certified network processor internet-of-things module solution for mcu application Datasheet

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CC3120MOD
SWRS205 – MARCH 2017
CC3120MOD SimpleLink™ Wi-Fi CERTIFIED™ Network Processor Internet-of-Things
Module Solution for MCU Applications
1 Module Overview
1.1
Features
• The CC3120MOD is a Wi-Fi® Module Which
Includes the CC3120RNMARGK Wi-Fi Network
Processor (NWP). The Fully Integrated, Industrial
Temperature Grade Module Includes All Required
Clocks, Serial Peripheral Interface (SPI) Flash, and
Passives.
• FCC, IC, TELEC, CE and China Certified
• Wi-Fi CERTIFIED™ Modules, With Ability to
Request Certificate Transfer for Wi-Fi Alliance
Members
• Featuring Wi-Fi Internet-on-a chip™ Dedicated
ARM® Cortex®-M3 Microcontroller Unit (MCU)
Completely Offloads Wi-Fi and Internet Protocols
from the Application MCU
• Wi-Fi Modes
– 802.11b/g/n Station
– 802.11b/g/n Access Point (AP) Supporting up to
Four Stations
– Wi-Fi Direct® Client/Group Owner
• WPA2 Personal and Enterprise Security: WEP,
WPA/WPA2 PSK, WPA2 Enterprise (802.1x)
• IPv4 and IPv6 TCP/IP Stack
– Industry-Standard BSD Socket Application
Programming Interfaces (APIs)
– 16 Simultaneous TCP or UDP Sockets
– 6 Simultaneous TLS and SSL Sockets
• IP Addressing: Static IP, LLA, DHCPv4, and
DHCPv6 With Duplicate Address Detection (DAD)
• SimpleLink™ Connection Manager for
Autonomous and Fast Wi-Fi Connections
• Flexible Wi-Fi Provisioning With SmartConfig™
Technology, AP Mode, and WPS2 Options
• RESTful API Support Using Internal HTTP Server
• Wide Set of Security Features
– Hardware Features
– Separate Execution Environments
– Device Identity
– Networking Security
– Personal and Enterprise Wi-Fi Security
– Secure Sockets (SSLv3, TLS1.0/1.1/TLS1.2)
– HTTPS Server
– Trusted Root-Certificate Catalog
– TI Root-of-Trust Public key
•
•
•
•
•
•
•
•
– Software IP Protection
– Secure Key Storage
– File System Security
– Software Tamper Detection
– Cloning Protection
Embedded Network Applications Running on a
Dedicated NWP
– HTTP/HTTPS Web Server With Dynamic User
Callbacks
– mDNS, DNS-SD, DHCP Server
– Ping
Recovery Mechanism – Ability to Recover to
Factory Defaults
Wi-Fi TX Power
– 17 dBm at 1 DSSS
– 13.5 dBm at 54 OFDM
Wi-Fi RX Sensitivity
– –94.7 dBm at 1 DSSS
– –73 dBm at 54 OFDM
Application Throughput
– UDP: 16 Mbps
– TCP: 13 Mbps
Power-Management Subsystem
– Integrated DC-DC Converters Support a Wide
Range of Supply Voltage:
– VBAT Wide-Voltage Mode: 2.3 V to 3.6 V
– Advanced Low-Power Modes
– Shutdown: 1 μA
– Hibernate: 6 μA
– Low-Power Deep Sleep (LPDS): 115 μA
– RX Traffic: 59 mA at 54 OFDM
– TX Traffic: 229 mA at 54 OFDM, Maximum
Power
– Idle Connected (MCU in LPDS): 690 μA at
DTIM = 1
Additional Integrated Components on Module
– 40.0-MHz Crystal With Internal Oscillator
– 32.768-kHz Crystal (RTC)
– 32-Mbit SPI Serial Flash RF Filter and Passive
Components
LGA Package
– 1.27-mm Pitch, 63-Pin, 20.5-mm × 17.5-mm
LGA Package for Easy Assembly and Low-Cost
PCB Design
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
1
CC3120MOD
SWRS205 – MARCH 2017
www.ti.com
• Operating Temperature
– Ambient Temperature Range: –40°C to +85°C
1.2
•
• Device Supports SimpleLink Developer's
Ecosystem
Applications
ADVANCE INFORMATION
For Internet-of-Things (IoT) applications, such as:
– Cloud Connectivity
– Internet Gateway
– Home and Building Automation
– Appliances
– Access Control
– Security Systems
– Smart Energy
– Industrial Control
– Smart Plug and Metering
– Wireless Audio
– IP Network Sensor Nodes
– Asset Tracking
– Medical Devices
1.3
Description
Add Wi-Fi® to low-cost, low-power MCU for IoT applications. The CC3120MOD is an FCC, IC, TELEC,
China, CE, and Wi-Fi CERTIFIED™ module that is part of the new SimpleLink™ Wi-Fi family, which
dramatically simplifies the implementation of Internet connectivity. The CC3120MOD integrates all
protocols for Wi-Fi and Internet, which greatly minimize host MCU software requirements. With built-in
security protocols, the CC3120MOD solution provides a robust and simple security experience.
Additionally, the CC3120MOD is a complete platform solution including various tools and software, sample
applications, user and programming guides, reference designs, and the TI E2E™ support community. The
CC3120MOD is available in an LGA package that is easy to lay out with all required components including
serial flash, RF filter, crystal, and passive components that are fully integrated.
The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-chip and contains an additional
dedicated ARM MCU that off-loads many of the networking activities from the host MCU. This subsystem
includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet
connections with 256-bit encryption. The CC3120MOD module supports station, access point, and Wi-Fi
direct modes. The module supports WPA2 personal and enterprise security. This subsystem includes
embedded TCP/IP, TLS/SSL stacks, an HTTP server, and multiple Internet protocols. The CC3120MOD
module supports a variety of Wi-Fi provisioning methods, including HTTP based on AP mode,
SmartConfig™ technology, and WPS2.0.
As part of TI’s SimpleLink Wi-Fi family second generation, the CC3120MOD module introduces the new
features and enhanced capabilities, such as the following:
• IPv6
• Enhanced Wi-Fi provisioning
• Optimized low-power management
• Wi-Fi AP connection with up to four stations
• More concurrently opened BSD sockets and up to 16 BSD sockets, of which 6 are secure
• HTTPS support
• RESTful API support
• Asymmetric keys
• Crypto library
2
Module Overview
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The power-management subsystem includes an integrated DC-DC converter with support for a wide range
of supply voltages. This subsystem enables low-power consumption modes such as hibernate with RTC
mode, which requires approximately 7 μA of current.The CC3120MOD module is delivered with a slim and
user-friendly host driver to simplify the integration and development of network applications. The host
driver can easily be ported to most platforms and operating systems (OS). It is written in strict ANSI-C
(C99) and requires minimal platform adaptation layer (porting layer). The CC3120MOD module can
connect to any 8-, 16-, or 32-bit MCU over the SPI or UART Interface. The device driver minimizes the
host memory footprint requirements of less than 7KB of code memory and 700B of RAM for a TCP client
application.
The CC3120MOD modules comes in an easy-to-layout LGA package and is delivered as a complete
platform solution including various tools and software, sample applications, user and programming guides,
reference designs, and the TI E2E™ support community. The module family is also part of the SimpleLink
MCU portfolio and supports the SimpleLink developers ecosystem. For more information, visit
www.ti.com/simplelink.
Table 1-1. Module Information (1)
PART NUMBER
CC3120MODRNMMOB
(1)
PACKAGE
BODY SIZE
MOB (63)
20.50 mm × 17.50 mm
For more information, see Section 10.
Module Overview
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3
ADVANCE INFORMATION
The CC3120MOD device is part of the SimpleLink™ microcontroller (MCU) platform which consists of WiFi, Bluetooth® low energy, Sub-1 GHz and host MCUs, which all share a common, easy-to-use
development environment with a single core software development kit (SDK) and rich tool set. A one-time
integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into
your design, allowing 100 percent code reuse when your design requirements change.
CC3120MOD
SWRS205 – MARCH 2017
1.4
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Functional Block Diagrams
Figure 1-1 shows the functional block diagram of the CC3120MOD module.
CC3x20
40 MHz
RF_ANT1
32 kHz
BGN
SPI
MAC/PHY
UART
WRF
F
nReset
HIB
ADVANCE INFORMATION
2.3 V to 3.6 V
VBAT
PM
32-Mbit
SFlash
External SPI
Programming
Copyright © 2017, Texas Instruments Incorporated
Figure 1-1. CC3120MOD Module Functional Block Diagram
4
Module Overview
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Figure 1-2 shows the CC3120MOD hardware overview.
External MCU
Wi-Fi Network Processor
Host Interface
Hardware
1x SPI
1x UART
NETWORK PROCESSOR
Application
Protocols
Wi-Fi Driver
TCP/IP Stack
RAM
ARM Cortex
Radio
Baseband
ROM
DC-DC
RTC
ADVANCE INFORMATION
Oscillators
MAC
Processor
Crypto Engines
POWER
MANAGEMENT
Synthesizer
Copyright © 2017, Texas Instruments Incorporated
Figure 1-2. CC3120 Hardware Overview
Figure 1-3 shows an overview of the CC3120MOD embedded software.
Customer Application
NetApp
BSD Socket
Wi-Fi
SimpleLink Driver APIs
Host Interface
Network Apps
WLAN Security
and Management
TCP/IP Stack
WLAN MAC and PHY
Copyright © 2017, Texas Instruments Incorporated
Figure 1-3. CC3120 Embedded Software Overview
Module Overview
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Table of Contents
1
2
3
Module Overview
5
1
Features .............................................. 1
1.2
Applications ........................................... 2
1.3
Description ............................................ 2
1.4
Functional Block Diagrams ........................... 4
6
Revision History ......................................... 6
Device Comparison ..................................... 7
Related Products ..................................... 8
3.1
4
........................................
1.1
Terminal Configuration and Functions .............. 9
4.1
CC3120MOD Pin Diagram ........................... 9
4.2
Pin Attributes ........................................ 10
4.3
Connections for Unused Pins ....................... 11
Specifications ........................................... 12
5.1
Absolute Maximum Ratings ......................... 12
5.2
ESD Ratings
........................................
Power-On Hours (POH) .............................
Recommended Operating Conditions ...............
Current Consumption Summary ....................
5.3
ADVANCE INFORMATION
5.4
5.5
5.6
13
Brownout and Blackout Conditions
Electrical Characteristics ............................ 17
5.9
....................
WLAN Transmitter Characteristics ..................
Reset Requirement .................................
5.10
5.11
5.12
18
18
18
5.13
Timing and Switching Characteristics ............... 19
5.14
External Interfaces
..................................
9
16
Thermal Resistance Characteristics for MOB
Package ............................................. 18
Overview
6.2
Module Features
25
25
29
29
30
30
31
31
32
32
35
Environmental Requirements and
Specifications ........................................... 41
Temperature ......................................... 41
..............................
8.3
Storage Condition ...................................
8.4
Baking Conditions ...................................
8.5
Soldering and Reflow Condition ....................
Device and Documentation Support ...............
9.1
Device Support ......................................
9.2
Documentation Support .............................
9.3
Trademarks..........................................
9.4
Electrostatic Discharge Caution .....................
9.5
Export Control Notice ...............................
9.6
Glossary .............................................
8.2
12
5.8
............................................
....................................
6.3
Power-Management Subsystem ....................
6.4
Low-Power Operating Modes .......................
6.5
Restoring Factory Default Configuration ............
6.6
Certification ..........................................
6.7
End Product Labeling ...............................
6.8
Manual Information to the End User ................
Applications, Implementation, and Layout .......
7.1
Application Information ..............................
7.2
PCB Layout Guidelines .............................
6.1
8.1
12
5.7
WLAN Receiver Characteristics
8
12
TX Power and IBAT versus TX Power Level
Settings .............................................. 14
.................
7
Detailed Description ................................... 25
Handling Environment
41
41
41
42
43
43
44
44
44
44
44
10 Mechanical, Packaging, and Orderable
Information .............................................. 45
22
10.1
Package Option Addendum ......................... 46
2 Revision History
6
Date
Revision
Notes
March 2017
SWRS205*
Initial Release
Revision History
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3 Device Comparison
Table 3-1 shows the features supported across different CC3x2x modules.
Table 3-1. Device Features Comparison
CC3120MOD
CC3220MODS
CC3220MODSF
Onboard Chip
CC3120
CC3220S
CC3220SF
Onboard ANT
No
No
No
sFlash
32-Mbit
32-Mbit
32-Mbit
Regulatory Certification
FCC, IC, CE, TELEC, China
FCC, IC, CE, TELEC, China
FCC, IC, CE, TELEC, China
Wi-Fi Alliance Certification
Yes
Yes
Yes
Input Voltage
2.3 V to 3.6 V
2.3 V to 3.6 V
2.3 V to 3.6 V
Package
17.5 mm × 20.5 mm LGA
17.5 mm × 20.5 mm LGA
17.5 mm × 20.5 mm LGA
Operating Temperature Range
–40° to 85°C
–40° to 85°C
–40° to 85°C
Classification
Wi-Fi Network Processor
Wireless Microcontroller
Wireless Microcontroller
Standard
802.11 b/g/n
802.11 b/g/n
802.11 b/g/n
Frequency
2.4 GHz
2.4 GHz
2.4 GHz
TCP / IP Stack
IPv4, IPv6
IPv4, IPv6
IPv4, IPv6
Sockets
16
16
16
Integrated MCU
-
ARM Cortex-M4 at 80 MHz
ARM Cortex-M4 at 80 MHz
RAM
-
256KB
256KB
Flash
-
-
1MB
Universal Asynchronous
1
Receiver and Transmitter (UART)
2
2
Serial Port Interface (SPI)
1
1
1
Multi-Channel Audio Serial Port
(McASP)- I2S or PCM
-
2-ch
2-ch
Inter-Integrated Circuit (I C)
-
1
1
Analog to Digital Converter
(ADC)
-
4-ch, 12-bit
4-ch, 12-bit
Parallel Interface (8-bit PI)
-
1
1
General Purposes Timers
-
4
4
Multimedia Card (MMC / SD)
-
1
1
Wi-Fi Level of Security
WEP, WPS, WPA / WPA2 PSK
WPA2 (802.1x)
WEP, WPS, WPA / WPA2 PSK
WPA2 (802.1x)
WEP, WPS, WPA / WPA2 PSK
WPA2 (802.1x)
Secure Sockets (SSL v3 or TLS
1.0 /1.1/ 1.2)
6
6
6
Additional Networking Security
Unique Device Identity
Trusted Root-Certificate
Catalog
TI Root-of-Trust Public key
Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Hardware Acceleration
Hardware Crypto Engines
Hardware Crypto Engines
Hardware Crypto Engines
Secure Boot
-
Yes
Yes
-
File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming
File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming
ADVANCE INFORMATION
DEVICE
FEATURE
On Chip Memory
Peripherals and Interfaces
2
Security Features
Enhanced Application Level
Security
Device Comparison
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Related Products
For information about other devices in this family of products or related products see the links below.
The SimpleLink™ MCU Portfolio Offers a single development environment that delivers flexible
hardware, software, and tool options for customers developing wired and wireless
applications. With 100% code reuse across host MCUs, Wi-Fi, Bluetooth low energy, Sub-1
GHz devices and more, choose the MCU or connectivity standard that fits your design. A
one-time investment with the SimpleLink software development kit (SDK) allows you to reuse
often, opening the door to create unlimited applications. For more information, visit
www.ti.com/simplelink.
SimpleLink™ Wi-Fi® Family Offers several Internet-on-a-chip solutions, which address the need of
battery operated, security enabled products. Texas Instruments offers a single chip wireless
microcontroller and a wireless network processor which can be paired with any MCU, to
allow developers to design new Wi-Fi products, or upgrade existing products with Wi-Fi
capabilities. For more information, visit www.ti.com/simplelinkwifi.
ADVANCE INFORMATION
MSP432™ Host MCU The MSP432P401R MCU features the ARM® Cortex®-M4 processor offering ample
processing capability with floating point unit and memory footprint for advanced processing
algorithm, communication protocols as well as application needs, while incorporating a 14-bit
1-msps ADC14 that provides a flexible and low-power analog with best-in-class performance
to enable developers to add differentiated sensing and measurement capabilities to their WiFi applications. For more information, visit www.ti.com/product/MSP432P401R.
Reference Designs for CC3100 and CC3120 Devices The TI Designs Reference Design Library is a
robust reference design library spanning analog, embedded processor, and connectivity.
Created by TI experts to help you jump start your system design, all TI Designs include
schematic or block diagrams, BOMs, and design files to speed your time to market. Search
and download designs at www.ti.com/tidesigns.
CC3120 SDK Plug In The CC3120 SDK Plug In contains drivers, many sample applications for Wi-Fi
features and Internet, and documentation needed to use the CC3120 solution. Learn more at
www.ti.com/cc3120sdk.
8
Device Comparison
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4 Terminal Configuration and Functions
4.1
CC3120MOD Pin Diagram
27
NC
NC
GND
RF_BG
GND
NC
SOP0
nRESET
VBAT_RESET
VBAT1
GND
NC
VBAT2
NC
NC
GND
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
CC3120MOD
44
UART1_nRTS
26
45
NC
NC
25
46
UART1_TX
SOP1
24
47
UART1_RX
SOP2
23
48
TEST_58
NC
22
49
TEST_59
50
TEST_60
51
UART1_nCTS
52
TEST_62
53
NC
54
NC
20
RESERVED
19
NC
18
61
GND
GND
60
59
58
GND
57
GND
17
GND
12
11
10
9
8
7
6
5
4
NC
NC
HOST_SPI_nCS
HOST_SPI_DOUT
HOST_SPI_DIN
HOST_SPI_CLK
nHIB
13
HOST_INTR
14
NC
15
FLASH_SPI_MISO
GND
16
FLASH_SPI_nCS_IN
GND
FLASH_SPI_CLK
FLASH_SPI_MOSI
55
56
3
2
1
GND
NC
62
GND
21
63
NC
RESERVED
GND
GND
NOTE: Figure 4-1 shows the approximate location of pins on the module. For the actual mechanical diagram, refer to
Section 10.
Figure 4-1. CC3120MOD Pin Diagram Bottom View
Terminal Configuration and Functions
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ADVANCE INFORMATION
GND
GND
Figure 4-1 shows the pin diagram for the CC3120MOD device.
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4.2
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Pin Attributes
Table 4-1 lists the pin descriptions of the CC3120MOD module.
NOTE
If an external device drives a positive voltage to signal pads when the CC3120MOD is not
powered, DC current is drawn from the other device. If the drive strength of the external
device is adequate, an unintentional wakeup and boot of the CC3120MOD can occur. To
prevent current draw, TI recommends one of the following:
• All devices interfaced to the CC3120MOD must be powered from the same power rail as
the CC3120MOD.
• Use level-shifters between the CC3120MOD and any external devices fed from other
independent rails.
• The nRESET pin of the CC3120MOD must be held low until the VBAT supply to the
device is driven and stable.
Table 4-1. Module Pin Attributes (1)
DEFAULT
FUNCTION
ADVANCE INFORMATION
PIN
(1)
10
STATE AT RESET
AND HIBERNATE
I/O TYPE
N/A
–
Ground
DESCRIPTION
1
GND
2
GND
N/A
–
Ground
4
nHIB
Hi-Z
I
Hibernate signal, active low
5
HOST_SPI_CLK
Hi-Z
I
Host interface SPI clock
6
HOST_SPI_DIN
Hi-Z
I
Host interface SPI data input
7
HOST_SPI_DOUT
Hi-Z
O
Host interface SPI data output
8
HOST_SPI_nCS
Hi-Z
I
Host interface SPI chip select (active low)
11
HOST_INTR
Hi-Z
O
Interrupt output
13
FLASH_SPI_MISO
Hi-Z
I
Serial flash interface: SPI data in
14
FLASH_SPI_nCS_IN
Hi-Z
O
Serial flash interface: SPI chip select (active low)
15
FLASH_SPI_CLK
Hi-Z
O
Serial flash interface: SPI clock
16
GND
N/A
–
Ground
17
FLASH_SPI_MOSI
Hi-Z
O
Serial flash interface: SPI data out
23
SOP2
Hi-Z
–
SOP[2:0] used for factory restore. See Section 6.5.
24
SOP1
Hi-Z
–
SOP[2:0] used for factory restore. See Section 6.5.
27
GND
N/A
–
Ground
28
GND
N/A
–
Ground
30
GND
N/A
–
Ground. Reference for RF signal
31
RF_BG
Hi-Z
I/O
32
GND
N/A
–
Ground. Reference for RF signal
34
SOP0
Hi-Z
–
SOP[2:0] used for factory restore. See Section 6.5.
35
nRESET
Hi-Z
I
Power on reset. TI recommends connecting the pin to a GPIO from
the host.
36
VBAT_RESET
Hi-Z
–
TI recommends leaving this unconnected. If the nRESET pin is not
connected to the host, then pull this pin to VBAT.
37
VBAT1
Hi-Z
–
Power supply for the module, can be connected to battery (2.3 V to
3.6 V)
38
GND
N/A
–
Ground
40
VBAT2
Hi-Z
–
Power supply for the module, can be connected to battery (2.3 V to
3.6 V)
43
GND
N/A
–
Ground
44
UART1_nRTS
Hi-Z
O
UART interface to host (request to send)
2.4-GHz RF input/output
Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin.
Terminal Configuration and Functions
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Table 4-1. Module Pin Attributes(1) (continued)
STATE AT RESET
AND HIBERNATE
I/O TYPE
DESCRIPTION
46
UART1_TX
Hi-Z
O
UART interface to host (transmit)
47
UART1_RX
Hi-Z
I
UART interface to host (receive)
50
TEST_60
Hi-Z
O
Connect to external test point.
51
UART1_nCTS
Hi-Z
I
UART interface to host (clear to send)
52
TEST_62
Hi-Z
O
Connect to external test point.
55
GND
N/A
–
Thermal Ground
56
GND
N/A
–
Thermal Ground
57
GND
N/A
–
Thermal Ground
58
GND
N/A
–
Thermal Ground
59
GND
N/A
–
Thermal Ground
60
GND
N/A
–
Thermal Ground
61
GND
N/A
–
Thermal Ground
62
GND
N/A
–
Thermal Ground
63
GND
N/A
–
Thermal Ground
4.3
ADVANCE INFORMATION
DEFAULT
FUNCTION
PIN
Connections for Unused Pins
All unused pins must be left as no connect (NC) pins. Table 4-2 provides a list of NC pins.
Table 4-2. Connections for Unused Pins
PIN
DEFAULT
FUNCTION
STATE AT RESET
AND HIBERNATE
I/O TYPE
3
NC
WLAN analog
–
Reserved. Do not connect.
DESCRIPTION
9
NC
WLAN analog
–
Reserved. Do not connect.
10
NC
WLAN analog
–
Reserved. Do not connect.
12
NC
WLAN analog
–
Reserved. Do not connect.
18
NC
WLAN analog
–
Reserved. Do not connect.
19
NC
WLAN analog
–
Reserved. Do not connect.
20
NC
WLAN analog
–
Reserved. Do not connect.
21
NC
WLAN analog
–
Reserved. Do not connect.
25
NC
WLAN analog
–
Reserved. Do not connect.
26
NC
WLAN analog
–
Reserved. Do not connect.
29
NC
WLAN analog
–
Reserved. Do not connect.
33
NC
WLAN analog
–
Reserved. Do not connect.
39
NC
WLAN analog
–
Reserved. Do not connect.
41
NC
WLAN analog
–
Reserved. Do not connect.
42
NC
WLAN analog
–
Reserved. Do not connect.
45
NC
WLAN analog
–
Reserved. Do not connect.
48
NC
WLAN analog
–
Reserved. Do not connect.
49
NC
WLAN analog
–
Reserved. Do not connect.
53
NC
WLAN analog
–
Reserved. Do not connect.
54
NC
WLAN analog
–
Reserved. Do not connect.
Terminal Configuration and Functions
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5 Specifications
All measurements are references of the module pins, unless otherwise indicated. All specifications are
over process and voltage, unless otherwise indicated.
5.1
Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured
under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term
reliability of the module (1) (2).
MIN
MAX
VBAT
–0.5
3.8
V
Digital I/O
–0.5
VBAT + 0.5
V
RF pin
–0.5
2.1
V
Analog pins
–0.5
2.1
V
Operating temperature, TA
–40
85
°C
Storage temperature, Tstg
–40
85
°C
120
°C
Junction temperature, Tj (3)
ADVANCE INFORMATION
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
Junction temperature is for the CC3120RNMARGK device that is contained within the module.
5.2
ESD Ratings
VALUE
VESD
(1)
(2)
UNIT
Electrostatic discharge (ESD)
performance
Human body model (HBM), per ANSI/ESDA/JEDEC JS001
Charged device model (CDM),
per JESD22-C101 (2)
(1)
All pins
UNIT
±2000
V
±500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3
Power-On Hours (POH)
NOTE
This information is provided solely for your convenience and does not extend or modify the
warranty provided under TI's standard terms and conditions for TI semiconductor products.
(1)
CONDITION
POH (hours)
TA up to 85°C (1)
87,600
The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device
can be in any other state.
5.4
Recommended Operating Conditions
Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect
long-term reliability of the module (1) (2) (3).
MIN
TYP
MAX
VBAT
2.3
3.3
3.6
V
Operating temperature
–40
25
85
°C
Ambient thermal slew
–20
20
°C/minute
(1)
(2)
(3)
12
UNIT
When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect
feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the transmission.
To ensure WLAN performance, ripple on the 2.3-V to 3.6-V supply must be less than ±300 mV.
The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is 2.1 V,
and care must be taken when operating at the minimum specified voltage.
Specifications
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Current Consumption Summary
TA = 25°C, VBAT = 3.6 V
1 DSSS
TX
6 OFDM
54 OFDM
RX (3)
(2)
MIN
TYP
TX power level = 0
272
TX power level = 4
188
TX power level = 0
248
TX power level = 4
179
TX power level = 0
223
TX power level = 4
160
1 DSSS
53
54 OFDM
53
MAX
UNIT
mA
mA
Idle connected (4)
715
µA
LPDS
115
µA
Hibernate
6
µA
Shutdown
1
µA
Peak calibration current (3) (5)
(1)
(2)
(3)
(4)
(5)
VBAT = 3.3 V
450
VBAT = 2.3 V
620
mA
TX power level = 0 implies maximum power (see Figure 5-1, Figure 5-2, and Figure 5-3). TX power level = 4 implies output power
backed off approximately 4 dB.
The CC3120MOD system is a constant power-source system. The active current numbers scale inversely on the VBAT voltage supplied.
The RX current is measured with a 1-Mbps throughput rate.
DTIM = 1
The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is performed
sparingly, typically when re-enabling the NWP and when the temperature has changed by more than 20°C. There are two additional
calibration modes that may be used to reduced or completely eliminate the calibration event. For further details, see the CC3120,
CC3220 SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
Specifications
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ADVANCE INFORMATION
TEST CONDITIONS (1)
PARAMETER
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TX Power and IBAT versus TX Power Level Settings
Figure 5-1, Figure 5-2, and Figure 5-3 show TX Power and IBAT versus TX power level settings for
modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively.
In Figure 5-1, the area enclosed in the circle represents a significant reduction in current during transition
from TX power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI
recommends using TX power level 4 to reduce the current.
ADVANCE INFORMATION
Figure 5-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
Figure 5-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
14
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Figure 5-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
Specifications
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Brownout and Blackout Conditions
The device enters a brownout condition when the input voltage dips below VBROWNOUT (see Figure 5-4 and
Figure 5-5). This condition must be considered during design of the power supply routing, especially if
operating from a battery. High-current operations, such as a TX packet or any external activity (not
necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a
brownout condition. The resistance includes the internal resistance of the battery, contact resistance of the
battery holder (four contacts for a 2× AA battery), and the wiring and PCB routing resistance.
NOTE
When the device is in the Hibernate state, brownout is not detected; only blackout is in effect
during the Hibernate state.
ADVANCE INFORMATION
Figure 5-4. Brownout and Blackout Levels (1 of 2)
Figure 5-5. Brownout and Blackout Levels (2 of 2)
In the brownout condition, all sections of the CC3120MOD (including the 32-kHz RTC) shut down except
for the Hibernate module, which remains on. The current in this state can reach approximately 400 µA.
The blackout condition is equivalent to a hardware reset event in which all states within the device are
lost.
16
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Table 5-1 lists the brownout and blackout voltage levels.
Table 5-1. Brownout and Blackout Voltage Levels
5.8
CONDITION
VOLTAGE LEVEL
UNIT
Vbrownout
2.1
V
Vblackout
1.67
V
Electrical Characteristics
TA = 25°C, VBAT = 3.3 V
MIN
CIN
Pin capacitance
VIH
High-level input voltage
0.65 × VDD
VIL
Low-level input voltage
–0.5
IIH
High-level input current
IIL
Low-level input current
VOH
VOL
IOH
IOL
VIL
(1)
(2)
Low-level output voltage
Low-level sink
current,
MAX
4
High-level output voltage
High-level
source
current,
NOM
pF
VDD + 0.5 V
0.35 × VDD
5
nA
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 8 mA; configured I/O drive
strength = 8 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.7
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.3 V ≤ VDD < 2.4 V
VDD × 0.75
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.7
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 8 mA; configured I/O drive
strength = 8 mA;
2.4 V ≤ VDD < 3.6 V
VDD × 0.2
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.3 V ≤ VDD < 2.4 V
VDD × 0.25
IL = 2 mA; configured I/O drive
strength = 2 mA;
VDD = 1.85 V
VDD × 0.35
2-mA drive
2
4-mA drive
4
6-mA drive
6
2-mA drive
2
4-mA drive
4
6-mA drive
6
nRESET (2)
0.6
V
nA
VDD × 0.8
VDD × 0.2
V
5
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤ VDD < 3.6 V
UNIT
ADVANCE INFORMATION
TEST CONDITIONS (1)
PARAMETER
V
V
mA
mA
V
TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
The nRESET pin must be held below 0.6 V for the device to register a reset.
Specifications
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WLAN Receiver Characteristics
TA = 25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz).
PARAMETER
RATE
Sensitivity
(8% PER for 11b rates, 10% PER for 11g or 11n rates)
(10% PER) (1)
Maximum input level
(10% PER)
(1)
(2)
MIN
TYP
1 DSSS
–94.7
2 DSSS
–92.6
11 CCK
–87.0
6 OFDM
–89.0
9 OFDM
–88.0
18 OFDM
–85.0
36 OFDM
–79.5
54 OFDM
–73.0
MCS7 (Mixed Mode) (2)
–69.0
802.11b
–3.0
802.11g
–9.0
MAX
UNIT
dBm
dBm
Sensitivity is 1-dB worse on channel 13 (2472 MHz).
Sensitivity for mixed mode is 1-dB worse.
ADVANCE INFORMATION
5.10 WLAN Transmitter Characteristics
TA = 25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz) (1).
PARAMETER
RATE
MIN
TYP
1 DSSS
Max RMS Output Power measured at 1 dB
from IEEE spectral mask or EVM
2 DSSS
17
11 CCK
17.25
6 OFDM
16.2
9 OFDM
16.25
18 OFDM
UNIT
dBm
16
36 OFDM
15
54 OFDM
13.5
MCS7 (Mixed Mode)
12
Transmit center frequency accuracy
(1)
MAX
17
–20
20
ppm
Channel-to-channel variation is up to 1 dB. The edge channels (2412 MHz and 2472 MHz) have reduced TX power to meet FCC
emission limits.
5.11 Reset Requirement
PARAMETER
VIH
MIN
Operation mode level
VIL
Shutdown mode level
(1)
0
Minimum time for nReset low for resetting the module
Tr and Tf
(1)
TYP
MAX
0.65 × VBAT
UNIT
V
0.6
V
5
ms
Rise and fall times
20
µs
The nRESET pin must be held below 0.6 V for the module to register a reset.
5.12 Thermal Resistance Characteristics for MOB Package
NAME
DESCRIPTION
°C/W
AIR FLOW (m/s)
RΘJC
Junction-to-case
11.4
0.00
RΘJB
Junction-to-board
8.0
0.00
RΘJA
Junction-to-free air
18.7
0.00
PsiJT
Junction-to-package top
5.3
0.00
PsiJB
Junction-to-board
7.7
0.00
18
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5.13 Timing and Switching Characteristics
5.13.1 Device Reset
When a device restart is required, the user may issue a negative pulse on either the nHIB pin (pin 4) or on
the nRESET pin (pin 35), keeping the other pulled high, depending on the configuration of the platform. If
the nRESET pin is used, the user must insure the following:
• A high-to-low reset pulse (on pin 35) of at least 200-ms duration
To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset.
5.13.1.1 nRESET Timing
Figure 5-6 shows the reset timing diagram for the first-time power-up and reset removal.
T1
T2
T3
VBAT
ADVANCE INFORMATION
nRESET
nHIB
STATE POWER RESET
OFF
HW INIT
Device ready to
serve API calls
FW INIT
32-kHz
XTAL
Figure 5-6. First-Time Power-Up and Reset Removal Timing Diagram
Table 5-2 describes the timing requirements for the first-time power-up and reset removal.
Table 5-2. First-Time Power-Up and Reset Removal Timing Requirements
ITEM
NAME
T1
Supply settling time
T2
Hardware wake-up time
T3
Initialization time
DESCRIPTION
Depends on application board
power supply, decoupling
capacitor, and so on
Internal 32-kHz XTAL settling plus
firmware initialization time plus
radio calibration
MIN
TYP
MAX
UNIT
3
ms
25
ms
1.35
s
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5.13.2 Wakeup From HIBERNATE Mode Timing
Figure 5-7 shows the timing diagram for wakeup from HIBERNATE mode.
Thib_min
Twake_from_hib
HIBERNATE
HW WAKEUP+FW INIT
VBAT
nRESET
nHIB
ACTIVE
ACTIVE
HIBERNATE
32-kHz
XTAL/CXO
ADVANCE INFORMATION
Figure 5-7. nHIB Timing Diagram
NOTE
The internal 32.768-kHz XTAL is kept enabled by default when the chip goes into
HIBERNATE mode in response to nHIB being pulled low.
Table 5-3 describes the timing requirements for nHIB.
Table 5-3. nHIB Timing Requirements
ITEM
NAME
Thib_min
Minimum hibernate time
Twake_from_hib
Hardware wakeup time plus
firmware initialization time
(1)
(2)
DESCRIPTION
Minimum pulse width of nHIB being low
See
MIN
(1)
TYP
10
(2)
MAX
UNIT
ms
50
ms
If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.
Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so
on).
5.13.3 Interfaces
This section describes the interfaces that are supported by the CC3120MOD module:
• Host SPI
• Flash SPI
20
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5.13.3.1 Host SPI Interface Timing
Figure 5-8 shows the host SPI timing diagram.
I2
CLK
I6
I7
MISO
I9
I8
MOSI
SWAS032-017
Figure 5-8. Host SPI Timing
PARAMETER
NUMBER
(1)
(2)
DESCRIPTION
MIN
MAX
Clock frequency at VBAT = 3.3 V
20
Clock frequency at VBAT = 2.3 V
12
UNIT
I1
F (1)
I2
tclk (1) (2)
Clock period
I3
tLP (1)
Clock low period
25
ns
I4
tHT (1)
Clock high period
25
ns
I5
D
(1)
I6
tIS (1)
RX data setup time
4
I7
tIH (1)
RX data hold time
4
I8
tOD (1)
TX data output delay
20
ns
I9
(1)
TX data hold time
24
ns
tOH
50
Duty cycle
45%
ADVANCE INFORMATION
Table 5-4. Host SPI Interface Timing Parameters
MHz
ns
55%
ns
ns
The timing parameter has a maximum load of 20 pf at 3.3 V.
Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. The nCS signal can be deasserted 10 ns after the
clock edge.
5.13.3.2 Flash SPI Timing
The CC3120MOD provides an interface for direct programming of the flash. Note that the time diagram
and interface parameters are provided as a reference. During normal operation, the Flash SPI should
remain unconnected. Figure 5-9 shows the Flash SPI timing diagram.
I2
CLK
I6
I7
MISO
I8
I9
MOSI
SWAS032-017
Figure 5-9. Flash SPI Timing
Specifications
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Table 5-5 lists the flash SPI timing parameters.
Table 5-5. Flash SPI Timing Parameters
PARAMETER
NUMBER
PARAMETER
PARAMETER NAME
MIN
MAX
UNIT
20
MHz
I1
F
Clock frequency
I2
tclk
Clock period
I3
tLP
Clock low period
25
ns
I4
tHT
Clock high period
25
ns
I5
D
Duty cycle
I6
tIS
RX data setup time
1
I7
tIH
RX data hold time
2
I8
tOD
TX data output delay
I9
tOH
TX data hold time
50
45%
ns
55%
ns
ns
8.5
ns
8
ns
5.14 External Interfaces
ADVANCE INFORMATION
5.14.1 SPI Host Interface
The device interfaces to an external host using the SPI. The CC3120MOD module can interrupt the
host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface
can work up to a speed of 20 MHz.
Figure 5-10 shows the SPI host interface.
CC3120MOD (slave)
MCU
HOST_SPI_CLK
SPI_CLK
HOST_SPI_nCS
SPI_nCS
HOST_SPI_MISO
SPI_MISO
HOST_SPI_MOSI
SPI_MOSI
HOST_INTR
INTR
nHIB
GPIO
Figure 5-10. SPI Host Interface
Table 5-6 lists the SPI host interface pins.
Table 5-6. SPI Host Interface
PIN NAME
DESCRIPTION
HOST_SPI_CLK
Clock (up to 20 MHz) from MCU host to CC3120MOD module
HOST_SPI_nCS
CS (active low) signal from MCU host to CC3120MOD module
HOST_SPI_MOSI
Data from MCU host to CC3120MOD module
HOST_INTR
Interrupt from CC3120MOD module to MCU host
HOST_SPI_MISO
Data from CC3120MOD module to MCU host
nHIB
Active-low signal that commands the CC3120MOD module to enter hibernate mode (lowest power state)
22
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5.14.2 Host UART Interface
The SimpleLink device requires the UART configuration described in Table 5-7.
Table 5-7. SimpleLink™ UART Configuration
PROPERTY
SUPPORTED CC3120 CONFIGURATION
Baud rate
115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command
Data bits
8 bits
Flow control
CTS/RTS
Parity
None
Stop bits
1
Bit order
Least significant bit (LSB) first
Host interrupt polarity
Active high
Host interrupt mode
Rising edge or level 1
Endianness
Little-endian only (1)
The SimpleLink device does not support automatic detection of the host length while using the UART interface.
5.14.2.1 5-Wire UART Topology
Figure 5-11 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ
line from the device to the host controller to allow efficient low power mode.
HOST MCU
UART
nRTS
nRTS
nCTS
nCTS
TX
TX
RX
RX
CC3120MOD SL
UART
HOST_INTR(IRQ)
HOST_INTR(IRQ)
Figure 5-11. Typical 5-Wire UART Topology
Figure 5-11 shows the typical and recommended UART topology because it offers the maximum
communication reliability and flexibility between the host and the SimpleLink device.
5.14.2.2 4-Wire UART Topology
The 4-wire UART topology eliminates the host IRQ line (see Figure 5-12). Using this topology requires
one of the following conditions to be met:
• Host is always awake or active.
• Host goes to sleep, but the UART module has receiver start-edge detection for automatic wake up and
does not lose data.
HOST MCU
UART
nRTS
nRTS
nCTS
nCTS
TX
TX
RX
RX
H_IRQ
X
CC3120MOD SL
UART
H_IRQ
Figure 5-12. 4-Wire UART Configuration
Specifications
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ADVANCE INFORMATION
(1)
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5.14.2.3 3-Wire UART Topology
The 3-wire UART topology requires only the following lines (see Figure 5-13).
• RX
• TX
• nCTS
nRTS
nRTS
X
nCTS
HOST MCU
UART
nCTS
TX
TX
RX
RX
H_IRQ
X
CC3120MOD SL
UART
H_IRQ
Figure 5-13. 3-Wire UART Topology
ADVANCE INFORMATION
Using 3-wire topology requires one of the following conditions to be met:
• Host always stays awake or active.
• Host goes to sleep, but the UART module has receiver start-edge detection for auto wake up and does
not lose data.
• Host can always receive any amount of data transmitted by the SimpleLink device because there is no
flow control in this direction.
Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the
following parameters must be carefully considered:
• Maximum baud rate
• RX character interrupt latency and low-level driver jitter buffer
• Time consumed by the user's application
24
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6 Detailed Description
6.1
Overview
The CC3120MOD Wi-Fi module contains a dedicated ARM MCU that offloads many of the networking
activities from the host MCU. Including an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto
engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3120MOD
module supports station, AP, and Wi-Fi Direct modes. The module also supports WPA2 personal and
enterprise security and WPS 2.0. The Wi-Fi network processor includes an embedded IPv6 and IPv4
TPC/IP stack.
6.2
Module Features
6.2.1
WLAN
NOTE
802.11n is supported only in Wi-Fi station, Wi-Fi direct, and P2P client modes.
•
•
•
•
•
Autocalibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna
without requiring expertise in radio circuit design.
Advanced connection manager with multiple user-configurable profiles stored in a serial flash allows
automatic, fast connection to an access point without user or host intervention.
Supports all common Wi-Fi security modes for personal and enterprise networks, with on-chip security
accelerators, including WEP, WPA/WPA2 PSK, and WPA2 Enterprise (802.1x).
Smart provisioning options deeply integrated within the device provide a comprehensive end-to-end
solution. Elaborate events notification to the host enable the application to control the provisioning
decision flow. The wide variety of Wi-Fi provisioning methods include:
– Access Point using HTTPS
– SmartConfig Technology: a 1-step, 1-time process to connect a CC3120MOD-enabled device to the
home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, the
device is usable by deeply embedded applications.
802.11 transceiver mode transmits and receives proprietary data through a socket without adding MAC
or PHY headers, and provides the option to select the working channel, rate, and transmitted power.
The receiver mode works together with the filtering options.
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ADVANCE INFORMATION
The WLAN features are as follows:
• 802.11 b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station,
AP, and Wi-Fi Direct client and group owner with CCK and OFDM rates in the 2.4-GHz ISM band,
channels 1 to 13.
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6.2.2
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Network Stack
The network stack features are as follows:
• Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any
MCU, microprocessor, or ASIC
NOTE
Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.
•
•
•
•
ADVANCE INFORMATION
•
•
•
Support of 16 simultaneous TCP, UDP, or RAW sockets
Support of 6 simultaneous SSL\TLS sockets
Built-in network protocols:
– Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and Stateless auto configuration
– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND
– DNS client for easy connection to the local network and the Internet
Built-in network application and utilities:
– HTTP/HTTPS
• Web page content stored on serial flash
• RESTful APIs for setting\configuring application content
• Dynamic user callbacks
Service discovery: Multicast DNS service discovery allows a client to advertise its service without a
centralized server. After connecting to the access point, the CC3120 device provides critical
information, such as device name, IP, vendor, and port number.
DHCP server
Ping
Table 6-1 summarizes the NWP features.
Table 6-1. NWP Features
FEATURES
DESCRIPTION
Wi-Fi standards
802.11b/g/n station
802.11b/g AP supporting up to four stations
Wi-Fi Direct client and group owner
Wi-Fi
Channels 1 to 13
Wi-Fi security
WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x)
Wi-Fi provisioning
SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP/HTTPS
web server
IP protocols
IPv4 and IPv6
IP addressing
Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and stateless auto configuration
Cross layer
ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP
Transport
UDP, TCP
SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2
RAW IP
26
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Table 6-1. NWP Features (continued)
FEATURES
DESCRIPTION
Network applications and utilities
Ping
HTTP/HTTPS web server
mDNS
DNS-SD
DHCP server
Host interface
UART/SPI
Security
Secure file system
Unique ID and private key for device authentication
Crypto utilities
Secure content delivery
Power management
Enhanced power policy management uses 802.11 power save and deep sleep power modes
Other
RF Transceiver
Programmable RX Filters with Events trigger mechanism including WoWLAN
Recovery mechanism – Restore to factory default
Security
The SimpleLink Wi-Fi CC3120MOD Internet-on-a-Chip module enhances the security capabilities
available for development of IoT devices, while completely offloading these activities from the MCU to the
networking subsystem. The security capabilities include the following key features:
Wi-Fi and Internet security
• Personal and enterprise Wi-Fi security
– Personal standards
• AES (WPA2-PSK)
• TKIP (WPA-PSK)
• WEP
• Enterprise standards
– EAP Fast
– EAP PEAPv0 MSCHAPv2
– EAP PEAPv0 TLS
– EAP PEAPv1 TLS EAP LS
– EAP TTLS TLS
– EAP TTLS MSCHAPv2
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6.2.2.1
CC3120MOD
SWRS205 – MARCH 2017
•
ADVANCE INFORMATION
•
•
•
•
•
6.2.3
Secure sockets
– Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2
– On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES
encryption for TLS and SSL connections
– Ciphers suites
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
– Server authentication
– Client authentication
– Domain name verification
– Socket upgrade to secure socket – STARTTLS
Secure HTTP server (HTTPS)
The trusted root-certificate catalog verifies that the CA used by the application is trusted and known
secure content delivery.
The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the
genuine origin of a given content using asymmetric keys.
Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel.
Code and data security
– Secured network information: Network passwords and certificates are encrypted
– Secured and authenticated service pack: SP is signed based on TI certificate
Host Interface and Driver
•
•
•
28
www.ti.com
Interfaces over a 4-wire SPI with any MCU or a processor at a clock speed of 20 MHz
Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided
for TI MCUs and is easily ported to any processor or ASIC.
Simple APIs enable easy integration with any single-threaded or multithreaded application.
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6.2.4
System
•
•
•
6.3
SWRS205 – MARCH 2017
Connects directly to a battery
Ultra-low leakage when disabled (hibernate mode) with a current of less than 7 µA with the RTC
running
Integrated clock sources
Power-Management Subsystem
The CC3120MOD power-management subsystem contains DC-DC converters to accommodate the
differing voltage or current requirements of the system.
The CC3120MOD is a fully integrated module-based WLAN radio solution used on an embedded system
with a wide-voltage supply range. The internal power management, including DC-DC converters and
LDOs, generates all of the voltages required for the module to operate from a wide variety of input
sources. For maximum flexibility, the module can operate in the modes described in the following sections.
VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the module can be directly connected to two AA alkaline batteries.
All other voltages required to operate the device are generated internally by the DC-DC converters. This
scheme is the most common mode for the device because it supports wide-voltage operation from 2.3 to
3.6 V.
6.4
Low-Power Operating Modes
This section describes the low-power modes supported by the module to optimize battery life.
6.4.1
Low-Power Deep Sleep
The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered
automatically during periods of inactivity based on internal power optimization algorithms. The module can
wake up in less than 3 ms from the internal timer or from any incoming host command. Typical battery
drain in this mode is 115 µA. During LPDS mode, the module retains the software state and certain
configuration information. The operation is transparent to the external host; thus, no additional handshake
is required to enter or exit this sleep mode.
6.4.2
Hibernate
The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small
section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept
running and the module wakes up when the n_HIB line is asserted by the host driver. The wake-up time is
longer than LPDS mode at about 50 ms.
6.4.3
Shutdown
Shutdown mode is the lowest power-mode system-wise. All device logics are off, including the realtime
clock (RTC). The wake-up time in this mode is longer than hibernate at approximately 1.1 seconds.
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6.3.1
CC3120MOD
SWRS205 – MARCH 2017
6.5
www.ti.com
Restoring Factory Default Configuration
The device has an internal recovery mechanism that allows rolling back the file system to its predefined
factory image or restoring the factory default parameters of the device. The factory image is kept in a
separate sector on the sFLASH in a secure manner and cannot be accessed from the host processor. The
following restore modes are supported:
• None—no factory restore settings
• Enable restore of factory default parameters
• Enable restore of factory image and factory default parameters
The restore process is performed by pulling or forcing SOP[2:0] = 110 pins and toggling the nRESET pin
from low to high.
The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The
restore process typically takes about 8 seconds, depending on the attributes of the serial flash vendor.
6.6
Certification
The CC3120MOD module is certified to the standards listed in Table 6-2 (with IDs where applicable):
ADVANCE INFORMATION
Table 6-2. CC3120MOD List of Certifications
REGULATORY BODY
SPECIFICATION
ID (IF APPLICABLE)
FCC (USA)
Part 15C + MPE FCC RF Exposure
TBD
IC (Canada)
RSS-102 (MPE) and RSS-247 (Wi-Fi)
TBD
EN300328 v2.1.1 (2.4 GHz Wi-Fi)
—
EN62311:2008 (MPE)
—
EN 301489-1 v2.1.1 (EMC General)
—
EN301489-17 v3.1.1 (EMC Wi-Fi)
—
EN50024:2010/A1:2015
—
EN55032:2012/AC:2013
—
ETSI/CE (Europe)
EN 60950—
1:2006/A11:2009/A1:2010/A12:2011/A2:2013
Japan MIC
TBD
TBD
SRRC (China)
TBD
TBD
6.6.1
Federal Communications Commission Statement
You are cautioned that changes or modifications not expressly approved by the part responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation of the device.
CAUTION
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. End users must follow the specific operating
instructions for satisfying RF exposure limits. This transmitter must not be
colocated or operating with any other antenna or transmitter.
30
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6.6.2
SWRS205 – MARCH 2017
Canada, Industry Canada (IC)
This device complies with Industry Canada licence-exempt RSS standards.
Operation is subject to the following two conditions:
• This device may not cause interference.
• This device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence.
L'exploitation est autorisée aux deux conditions suivantes:
• L'appareil ne doit pas produire de brouillage
• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must
not be co-located or operating in conjunction with any other antenna or
transmitter.
Pour se conformer aux exigences de conformité RF canadienne l'exposition,
cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en
conjonction avec une autre antenne ou transmetteur.
6.7
End Product Labeling
This module is designed to comply with the FCC statement, FCC ID: TBD. The host system using this
module must display a visible label indicating the following text:
Contains FCC ID: TBD
This module is designed to comply with the IC statement, IC: TBD. The host system using this module
must display a visible label indicating the following text:
Contains IC: TBD
6.8
Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual must include all required regulatory information/warning as shown in this manual.
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CAUTION
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7 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
7.1.1
Application Information
Typical Application
Figure 7-1 shows the typical application schematic using the CC3120MOD module. For a full operation
reference design, refer to the BoosterPack that uses the CC3120MOD module.
ADVANCE INFORMATION
32
Applications, Implementation, and Layout
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Optional:
Consider adding extra decoupling
capacitors if the battery cannot source
the peak cu rrents.
VCC
VCC
C3
0.1µF
GND
C6
100µF
U1
GND
VBAT1
HIB
VBAT2
VCC
36
R1
1.0k
TO HOST
SOP[2:0] USED FOR
1 FACTORY RESTORE
2
4
6
34
24
23
3
5
J1
EXTERNAL
PROGRAMMING
35
SFL_CLK
SFL_MOSI
SFL_MISO
SFL_nCS
15
17
13
14
3
9
10
12
18
20
22
25
26
29
33
39
41
42
45
53
54
19
21
VBAT_RESET
HOST_SPI_CLK
HOST_SPI_DIN
HOST_SPI_DOUT
HOST_SPI_CS
HOST_INTR
UART1_TX
UART1_RX
UART1_RTS
UART1_CTS
46
47
44
51
RESET
SOP0
SOP1
SOP2
FLASH_SPI_CLK
FLASH_SPI_MOSI
FLASH_SPI_MISO
FLASH_SPI_CS_IN
RF_BG
TEST_58
TEST_59
TEST_60
TEST_62
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
RESERVED
RESERVED
4
5
6
7
8
11
CC_nHIB
CC_SPI_CLK
CC_SPI_DIN
CC_SPI_DOUT
CC_SPI_CS
CC_IRQ
CC_UART1_TX
CC_UART1_RX
UART1_nRTS
UART1_nCTS
HOST INTERFACE
(Ensure that the nHIB line
does not float at any time)
HOST CONTROL
31
48
49
50
52
CC_WL_UART_TX
CC_NWP_UART_TX
TP1
TP2
Matching circuit shown below is for
the antenna. The module is matched
internally to 50Ω. Final solution
may require antenna matching
optimization
E1
1
2
16
27
28
30
32
38
43
55
56
57
58
59
60
61
62
63
L1
6.8nH
C1
1.8pF
GND
C2 GND GND
1.3pF
GND
CC3120MODRNMMOBR
GND
Note:
This is the reference schematic and not an actual board design. For the board files and BOM, refer to the CC3120MODBOOST in the CC3120MOD Tools Folder.
Figure 7-1. CC3120MOD Module Reference Schematic
Applications, Implementation, and Layout
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40
2
37
GND
GND
1
C5
100µF
C4
10µF
CC3120MOD
SWRS205 – MARCH 2017
www.ti.com
Table 7-1 lists the bill of materials for a typical application using the CC3120MOD module shown in
Figure 7-1.
Table 7-1. Bill of Materials
DESIGNATOR
VALUE
MANUFACTURER
1
C1
1.8 pF
MuRata
GCM1555C1H1R8BA16
CAP, CERM, 1.8 pF, 50 V,
±0.1 pF, C0G/NP0, 0402
1
C2
1.3 pF
MuRata
GCM1555C1H1R3BA16
CAP, CERM, 1.3 pF, 50 V, ±5%,
C0G/NP0, 0402
1
C3
0.1 µF
MuRata
GRM155R60J104KA01D
CAP, CERM, 0.1 µF, 6.3 V, ±10%,
X5R, 0402
1
C4
10 µF
MuRata
GRM21BR61A106KE19L
CAP, CERM, 10 µF, 10 V, ±10%,
X5R, 0805
2
C5, C6
100 µF
MuRata
GRM31CR60J107ME39L
CAP, CERM, 100 µF, 6.3 V,
±20%, X5R, 1206
1
E1
2.45-GHz Ant
AH316M245001-T
ANT BLUETOOTH W-LAN
ZIGBEE WIMAX, SMD
1
L1
6.8 nH
MuRata
1
R1
1.0 k
Vishay-Dale
ADVANCE INFORMATION
QUANTITY
1
34
U1
CC3120MOD
Taiyo Yuden
Texas Instruments
PART NUMBER
DESCRIPTION
LQP15MN6N8B02
6.8 nH Unshielded Thin Film
Inductor 130 mA 900 mΩ Max
0402
CRCW04021K00JNED
RES, 1.0 k, 5%, 0.063 W, 0402
CC3120MODRNMMOBR
SimpleLink Certified Wi-Fi Network
Processor Internet-of-Things
Module Solution for MCU
Applications, MOB0063A (SIP
MODULE-63)
Applications, Implementation, and Layout
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7.1.2
SWRS205 – MARCH 2017
Power Supply Decoupling and Bulk Capacitors
Depending upon routing resistors and battery type, TI recommends adding two 100-µF ceramic capacitors
to help provide the peak current drawn by the CC3120MOD module.
NOTE
The module enters a brown-out condition whenever the input voltage dips below VBROWN (see
Figure 5-4 and Figure 5-5). This condition must be considered during design of the power
supply routing specifically if operating from a battery. For more details on brown-out
consideration, see Section 5.7.
7.1.3
Reset
The module features an internal RC circuit to reset the device during power ON. The nRESET pin must be
held below 0.6 V for at least 5 ms for the device to successfully reset.
7.1.4
Unused Pins
7.2
PCB Layout Guidelines
This section details the PCB guidelines to speed up the PCB design using the CC3120MOD Module.
Follow these guidelines to ensure that the design minimizes the risk with regulatory certifications including
FCC, IC, CE, TELEC, and China.
7.2.1
General Layout Recommendations
Ensure that the following general layout recommendations are followed:
• Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.
• RF traces must have 50-Ω impedance.
• RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.
• RF traces must not have sharp corners.
• There must be no traces or ground under the antenna section.
• RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge
of the PCB product in consideration of the product enclosure material and proximity.
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All unused pins can be left unconnected without any concern to leakage current.
CC3120MOD
SWRS205 – MARCH 2017
7.2.2
www.ti.com
RF Layout Recommendations
The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF
section to be laid out correctly to ensure optimum performance from the device. A poor layout can cause
low-output power, EVM degradation, sensitivity degradation, and mask violations.
Figure 7-2 shows the RF placement and routing of the CC3120MOD module.
Chip
Antenna
Antenna Matching
U.FL (optional)
RF Trace
ADVANCE INFORMATION
CC3120MOD
Figure 7-2. RF Section Layout
36
Applications, Implementation, and Layout
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ADVANCE INFORMATION
To avoid the impact of mounting shift of the RF components, ensure the copper cut on the top layer
follows that indicated in Figure 7-3.
Figure 7-3. Top Layer Copper Pull Back on RF Pads
Applications, Implementation, and Layout
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7.2.3
www.ti.com
Antenna Placement and Routing
The antenna is the element used to convert the guided waves on the PCB traces to the free space
electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and
data rates. Table 7-2 provides a summary of the recommended antennas to use with the CC3120MOD
module.
Table 7-2. Antenna Guidelines
SR NO.
GUIDELINES
ADVANCE INFORMATION
1
Place the antenna on an edge or corner of the PCB.
2
Ensure that no signals are routed across the antenna elements on all the layers of the
PCB.
3
Most antennas, including the chip antenna used on the booster pack, require ground
clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers
as well.
4
Ensure that there is provision to place matching components for the antenna. These must
be tuned for best return loss when the complete board is assembled. Any plastics or
casing must also be mounted while tuning the antenna because this can impact the
impedance.
5
Ensure that the antenna impedance is 50 Ω because the device is rated to work only with
a 50-Ω system.
6
In case of printed antenna, ensure that the simulation is performed with the solder mask
in consideration.
7
Ensure that the antenna has a near omni-directional pattern.
8
The feed point of the antenna is required to be grounded. This is only for the antenna
type used on the CC3200MOD Launchpad. Refer to the specific antenna data sheets for
the recommendations.
9
To use the FCC certification of the module, refer to CC31xx and CC32xx Radio
Certifications wiki page on CC3200 Radio certification
Table 7-3 lists the recommended antennas to use with the CC3120MOD module.
Table 7-3. Recommended Components
CHOICE
1
38
PART NUMBER
AH316M245001-T
MANUFACTURER
Taiyo Yuden
Applications, Implementation, and Layout
NOTES
Can be placed at the edge of the PCB using the
least amount of PCB area.
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SWRS205 – MARCH 2017
Transmission Line Considerations
ADVANCE INFORMATION
The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPWG) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to
the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides
additional shielding. Figure 7-4 shows a cross section of the coplanar waveguide with the critical
dimensions.
Figure 7-4. Coplanar Waveguide (Cross Section)
Figure 7-5 shows the top view of the coplanar waveguide with GND and via stitching.
S
W
Figure 7-5. CPW With GND and Via Stitching (Top View)
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The recommended values for the PCB are provided for 2-layer boards in Table 7-4 and 4-layer boards in
Table 7-5.
Table 7-4. Recommended PCB Values for 2-Layer
Board (L1 to L2 = 41.8 mils)
PARAMETER
VALUE
UNIT
24.5
mils
S
6.5
mils
H
41.8
mils
Er (FR-4 substrate)
4.8
W
Table 7-5. Recommended PCB Values for 4-Layer
Board (L1 to L2 = 16 mils)
PARAMETER
ADVANCE INFORMATION
40
VALUE
UNITS
W
21
mils
S
10
mils
H
16
mils
Er (FR-4 substrate)
4.5
Applications, Implementation, and Layout
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8 Environmental Requirements and Specifications
8.1
8.1.1
Temperature
PCB Bending
The PCB bending specification will maintain planeness at a thickness of less than 0.1 mm.
8.2
8.2.1
Handling Environment
Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do
not touch the LGA portion by hand.
8.2.2
Falling
8.3
8.3.1
Storage Condition
Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.
8.3.2
Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
8.4
Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12–24 hours
Baking times: 1 time
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Environmental Requirements and Specifications
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ADVANCE INFORMATION
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product to malfunction.
CC3120MOD
SWRS205 – MARCH 2017
8.5
www.ti.com
Soldering and Reflow Condition
•
•
•
•
•
•
Heating method: Conventional convection or IR convection
Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
Solder paste composition: Sn/3.0 Ag/0.5 Cu
Allowable reflow soldering times: 2 times based on the reflow soldering profile
(see Figure 8-1)
Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
Peak temp: 245°C
ADVANCE INFORMATION
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink
module. This coating can lead to localized stress on the WCSP solder connections inside the
module and impact the device reliability. Use caution during the module assembly process to
the final PCB to avoid the presence of foreign material inside the module.
42
Environmental Requirements and Specifications
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CC3120MOD
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SWRS205 – MARCH 2017
9 Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of the MOD applications:
Software Development Tools:
Code Composer Studio Integrated Development Environment (IDE) includes Editor C/C++/Assembly
Code Generation and Debug plus additional development tools Scalable
Real-Time Foundation Software ( DSP/BIOS™) provides the basic run-time target software needed to
support any CC3120MOD application.
Extended Development System (XDS™) Emulator For a complete listing of development-support tools
for the CC3120MOD platform, visit the Texas Instruments website at www.ti.com. For
information on pricing and availability, contact the nearest TI field sales office or authorized
distributor.
9.1.1.1
Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing
changes, TI recommends that the user has the latest service pack in his or her module for production.
To stay informed, sign up for the SDK Alert
http://www.ti.com/tool/simplelink-wifi-cc3120-sdk-plugin.
9.1.2
Me
button
on
the
tools
page
or
visit
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3120MOD and support tools (see Figure 9-1).
X
CC
3 1 2 0 MOD R N M
MOB
PREFIX
X = preproduction device
no prefix = production device
R
PACKAGING
R = tape/reel
T = small reel
DEVICE FAMILY
CC = wireless connectivity
SERIES NUMBER
®
3 = Wi-Fi centric
PACKAGE DESIGNATOR
MOB = LGA
MOD = module
RNM = R device
Figure 9-1. CC3120MOD Device Nomenclature
For orderable part numbers of CC3120MOD devices in the MOB package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
Device and Documentation Support
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ADVANCE INFORMATION
Hardware Development Tools:
CC3120MOD
SWRS205 – MARCH 2017
9.2
www.ti.com
Documentation Support
The following documents describe the CC3120MOD processor/MPU. Copies of these documents are
available on the Internet at www.ti.com.
CC3120/CC3220 SimpleLink™ Wi-Fi® Interneton- a-Chip User's Guide _
9.2.1
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Established to help developers get started with Embedded Processors
from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
9.3
Trademarks
ADVANCE INFORMATION
Internet-on-a chip, SimpleLink, SmartConfig, E2E, Code Composer Studio are trademarks of Texas
Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG Inc.
Wi-Fi CERTIFIED is a trademark of Wi-Fi Alliance.
Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance.
9.4
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
9.5
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
9.6
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
44
Device and Documentation Support
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CC3120MOD
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10 Mechanical, Packaging, and Orderable Information
ADVANCE INFORMATION
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document.
Copyright © 2017, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
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45
CC3120MOD
SWRS205 – MARCH 2017
www.ti.com
10.1 Package Option Addendum
We offer 2 reel size options for flexibility: a 1000-unit reel and a 250-unit reel.
10.1.1 Packaging Information
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking (4)
(5)
CC3120MODRNMMOBR
PREVIEW
LGA
MOB
63
1000
Green (RoHS
and no Sb/Br)
Ni Au
3, 250°C
–40 to 85
CC3120MODRNMMOB
xCC3120MODRNMMOBR
ACTIVE
LGA
MOB
63
1000
Green (RoHS
and no Sb/Br)
Ni Au
3, 250°C
–40 to 85
CC3120MODRNMMOB
(1)
ADVANCE INFORMATION
(2)
(3)
(4)
(5)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
46
Mechanical, Packaging, and Orderable Information
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10.1.2 Tape and Reel Information
Emboss taping specification for MOC 1000 pin.
ADVANCE INFORMATION
10.1.2.1 Tape and Reel Specification
Surface resistance
Spec
Vendor No.
Figure 10-1. Tape Specification
Copyright © 2017, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information
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CC3120MOD
SWRS205 – MARCH 2017
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ADVANCE INFORMATION
25
1000
Figure 10-2. Reel Specification
48
Mechanical, Packaging, and Orderable Information
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Product Folder Links: CC3120MOD
Copyright © 2017, Texas Instruments Incorporated
PACKAGE OUTLINE
MOB0063A
QFM - 2.45 mm max height
SCALE 0.650
QUAD FLAT MODULE
17.75
17.25
A
B
PIN 1 INDEX
AREA
20.75
20.25
2X (0.42)
2X (0.38)
2.45 MAX
C
0.1
0.88
0.72
2X 12.7
(0.3) TYP
20X 1.27
30X 1.27
16
17
27
28
29
15
(0.3)
TYP
9X
2 0.05
1.5
(0.32)
PADS 1,16,28 & 43
60
57
2X
19.05
63
56
59
62
6X 3
61
55
58
54X
2
1
42
44
54
PIN 1 ID
(45 X1)
0.81
0.15
0.05
0.05
C A B
C
43
1.5
6X 3
4221462/B 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
MOB0063A
QFM - 2.45 mm max height
QUAD FLAT MODULE
SEE DETAIL
PKG
54X ( 0.81)
44
54
1
43
42
2
( 8.1)
9X ( 2)
0.05 MIN TYP
(45 X 1)
58
( 0.2) TYP
VIA
61
55
SOLDER MASK
OPENING
9X
METAL UNDER
SOLDER MASK
59
62
56
PKG
6X (3)
2X (19.1)
(1.5)
63
57
(0.65)
TYP
60
(1.5)
(0.65)
TYP
6X (3)
(1.27) TYP
15
29
16
(R0.05)
ALL PADS
28
17
27
2X (16.1)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE:6X
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SIGNAL PADS DETAIL
4221462/B 10/2016
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
MOB0063A
QFM - 2.45 mm max height
QUAD FLAT MODULE
PKG
54X ( 0.81)
54
(R0.05)
TYP
44
1
43
2
42
SOLDER MASK
EDGE, TYP
SOLDER MASK EDGE
58
55
SEE DETAILS
61
59
62
56
PKG
(3) TYP
2X (19.1)
(1.5) TYP
57
63
60
(1.5) TYP
(3) TYP
(1.27) TYP
15
29
16
28
17
27
2X (16.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
(1.54)
EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA
PAD 55: 77.5 %, PADS 56 - 63: 79%
SCALE:6X
(0.55) TYP
(0.55) TYP
(0.45)
2X ( 0.89)
(R0.05)
TYP
(0.55 TYP)
( 0.89) TYP
(0.55) TYP
METAL
TYP
(R0.05) TYP
PADS 56 - 63 DETAIL
PAD 55 DETAIL
SCALE:10X
SCALE:10X
4221462/B 10/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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