www.fairchildsemi.com FAN1589 2.7A, 1.2V Low Dropout Linear Regulator for VRM8.5 Features Description • • • • • • The FAN1589 is a low dropout three-terminal regulator with 2.7A output current capability. This device has been optimized for VTT bus termination, where transient response and minimum input voltage are critical. The FAN1589 offers fixed 1.2V with 2.7A current capability for a GTL+ bus VTT termination. Fast transient response Low dropout voltage at up to 2.7A Load regulation: 0.05% typical Trimmed current limit On-chip thermal limiting Standard TO-220, TO-263, TO-263 center cut and TO-252 (DPAK) packages Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and ambient temperature that would create excessive junction temperatures. Applications • A GTL+ bus supply for VRM 8.5 • Low voltage logic supply • Post regulator for switching supply The FAN1589 is available in the industry-standard TO-220, TO-263, TO-263 center cut and TO-252 (DPAK) power packages. Typical Application FAN1589 VOUT VIN VIN = 3.3V + 10µF GND 1.2V at 2.7A + 22µF REV. 1.0.5 11/10/03 FAN1589 PRODUCT SPECIFICATION Pin Assignments FAN1589T FRONT VIEW FAN1589M Tab is OUT FRONT VIEW 1 Tab is OUT 1 2 2 3 3 GND OUT IN GND OUT IN 3-Lead Plastic TO-263 θJC = 3°C/W* 3-Lead Plastic TO-220 θJC = 3°C/W FAN1589MC FRONT VIEW FAN1589D FRONT VIEW Tab is OUT 1 2 3 Tab is OUT 1 2 3 GND IN 3-Lead Plastic TO-263 Center Cut θJC = 3°C/W* GND OUT IN 3-Lead Plastic TO-252 θJC = 3°C/W* *With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane, ΘJA can vary from 30°C/W to more than 40°C/W. Other mounting techniques can provide a thermal resistance lower than 30°C/W. Absolute Maximum Ratings Parameter Min. Max. Unit 7 V 0 125 °C -65 150 °C 300 °C VIN Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec.) 2 REV. 1.0.5 11/10/03 PRODUCT SPECIFICATION FAN1589 Electrical Characteristics Tj = 25°C unless otherwise specified. The • denotes specifications which apply over the specified operating temperature range. Parameter Conditions Min. Typ. Max Units Output Voltage 3.3V ≤ VIN ≤ 7V 10mA ≤ IOUT ≤ 2.7A • 1.176 1.200 1.224 V Line Regulation1, 2 (VOUT + 1.5V) ≤ VIN ≤ 7V, IOUT = 10mA • 0.005 0.2 % Load Regulation1, 2 (VIN – VOUT) = 3V 10mA ≤ IOUT ≤ 2.7A • 0.15 1.5 % Dropout Voltage ∆VREF = 1%, IOUT = 2.7A • 1.150 1.300 V Current Limit (VIN – VOUT) = 2V • 3.1 Minimum Load Current 1.5V ≤ (VIN – VOUT) ≤ 5.75V • 10 Quiescent Current VIN = 5V • Ripple Rejection f = 120Hz, COUT = 22µF Tantalum, (VIN – VOUT) = 3V, IOUT = 2.7A Thermal Regulation TA = 25°C, 30ms pulse A mA 4 60 13 72 0.004 • Temperature Stability 4 mA dB 0.02 0.5 %/W % Long-Term Stability TA = 125°C, 1000 hrs. 0.03 RMS Output Noise (% of VOUT) TA = 25°C, 10Hz ≤ f ≤ 10kHz 0.003 % Thermal Resistance, Junction to Case TO-220 3 °C/W TO-263, TO-252 3 °C/W 150 °C Thermal Shutdown 1.0 % Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by input/output differential and the output currrent. Guaranteed maximum output power will not be available over the full input/ output voltage range. REV. 1.0.5 11/10/03 3 FAN1589 PRODUCT SPECIFICATION Typical Performance Characteristics 0.10 1.5 OUTPUT VOLTAGE DEVIATION (%) DROPOUT VOLTAGE (V) 1.4 1.3 1.2 1.1 1.0 T=0°C 0.9 T=125°C T=25°C 0.8 0.7 0.6 0.5 0 0.5 1 1.5 2 2.5 3.0 0.05 0 -0.05 -0.10 -0.15 -0.20 -75 -50 -25 OUTPUT CURRENT (A) Figure 1. Dropout Voltage vs. Output Current ∆I = 2.7A 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 2. Load Regulation vs. Temperature 5 1.30 MINIMUM LOAD CURRENT (mA) REFERENCE VOLTAGE (V) VOUT SET WITH 1% RESISTORS 1.20 1.10 1.00 0.90 0.80 -75 -50 -25 0 4 3 2 1 0 -75 -50 -25 25 50 75 100 125 150 175 Figure 3. Output Voltage vs. Temperature 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) JUNCTION TEMPERATURE (°C) Figure 4. Minimum Load Current vs. Temperature 90 5.0 RIPPLE REJECTIONS (dB) SHORT-CIRCUIT CURRENT (A) 80 4.5 4.0 3.5 70 60 50 40 30 20 10 3.0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 5. Short-Circuit Current vs. Temperature 4 0 10 (VIN – VOUT) ≤ 3V 0.5V ≤ VRIPPLE ≤ 2V IOUT = 2.7A 100 1K 10K 100K FREQUENCY (Hz) Figure 6. Ripple Rejection vs. Frequency REV. 1.0.5 11/10/03 PRODUCT SPECIFICATION FAN1589 Typical Performance Characteristics (continued) 2.5 15 10 5 0 50 60 70 80 90 100 110 120 130 140 150 CASE TEMPERATURE (°C) Figure 7. Maximum Power Dissipation OUTPUT CAPACITANCE ESR, (Ω) POWER (W) 20 2 1.5 Area of Instability 1 0.5 Stable Area 0 0 1000 2000 2700 LOAD CURRENT (mA) Figure 9. Stability Region REV. 1.0.5 11/10/03 5 FAN1589 PRODUCT SPECIFICATION Applications Information Load Regulation General The FAN1589 is a three-terminal regulator optimized for a GTL+ VTT termination applications. It is short-circuit protected, and offers thermal shutdown to turn off the regulator when the junction temperature exceeds about 150°C. The FAN1589 provides low dropout voltage and fast transient response. Frequency compensation uses capacitors with low ESR while still maintaining stability. This is critical in addressing the needs of low voltage high speed microprocessor buses like a GTL+. It is not possible to provide true remote load sensing because the FAN1589 is a three-terminal device. Load regulation is limited by the resistance of the wire connecting the regulators to the load. Load regulation per the data sheet specification is measured at the bottom of the package. For fixed voltage devices, negative side sensing is a true Kelvin connection with the ground pin of the device returned to the negative side of the load. This is illustrated in Figure 10. FAN1589 Stability VIN The FAN1589 requires an output capacitor as a part of the frequency compensation. It is recommended to use a 22µF solid tantalum or a 100µF aluminum electrolytic on the output to ensure stability. The frequency compensation of these devices optimizes the frequency response with low ESR capacitors. In general, it is suggested to use capacitors with an ESR of <1Ω. IN RP PARASITIC LINE RESISTANCE OUT GND RL Figure 9. Connection for Best Load Regulation Thermal Considerations Protection Diodes In normal operation, the FAN1589 does not require any protection diodes. A protection diode between the input and output pins is usually not needed. An internal diode between the input and output pins on the FAN1589 can handle microsecond surge currents of 50A to 100A. Even with large value output capacitors it is difficult to obtain those values of surge currents in normal operation. Only with large values of output capacitance, such as 1000µF to 5000µF, and with the input pin instantaneously shorted to ground can damage occur. A crowbar circuit at the input can generate those levels of current; a diode from output to input is then recommended, as shown in Figure 9. Usually, normal power supply cycling or system “hot plugging and unplugging” will not generate current large enough to do any damage. As with any IC regulator, exceeding the maximum input-tooutput voltage differential causes the internal transistors to break down and none of the protection circuitry is then functional. D1 1N4002 (OPTIONAL) The FAN1589 protects itself under overload conditions with internal power and thermal limiting circuitry. However, for normal continuous load conditions, do not exceed maximum junction temperature ratings. It is important to consider all sources of thermal resistance from junction-to-ambient. These sources include the junction-to-case resistance, the case-to-heat sink interface resistance, and the heat sink resistance. Thermal resistance specifications have been developed to more accurately reflect device temperature and ensure safe operating temperatures. For example, look at using an FAN1589 to generate 2.7A @ 1.2V ± 2% from a 3.3V source (3.2V to 3.6V). Assumptions: VIN = 3.6V worst case VOUT = 1.176V worst case IOUT = 2.7A continuous TA = 70°C θCase-to-Ambient = 3°C/W (assuming both a heatsink and a thermally conductive material) The power dissipation in this application is: • • • • • PD = (VIN – VOUT) * (IOUT) = (3.6 – 1.18) * (2.7) = 6.53W From the specification table: FAN1589 VIN C1 10µF + IN OUT GND + VOUT C2 22µF TJ = TA + (PD) * (θCase-to-Ambient + θJC) = 70 + (6.53) * (3 + 3) = 109°C The junction temperature is below the maximum rating. Figure 8. Optional Protection 6 REV. 1.0.5 11/10/03 PRODUCT SPECIFICATION FAN1589 Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. Proper mounting ensures the best thermal flow from this area of the package to the heat sink. Use of a thermally conductive material at the case-to-heat sink interface is recommended. Use a thermally conductive spacer if the case of the device must be electrically isolated and include its contribution to the total thermal resistance. The case of the FAN1589 is directly connected to the output of the device. U1 FAN1589 VIN 3.3V VIN C1 10µF + VOUT 1.2V VOUT GND + C3 100µF Figure 10. Application Circuit (FAN1589) Table 1. Bill of Materials for Application Circuit for the FAN1589 Item Quantity Manufacturer C1 1 Xicon L10V10 10µF, 10V Aluminum C3 1 Xicon L10V100 100µF, 10V Aluminum U1 1 Fairchild FAN1589T REV. 1.0.5 11/10/03 Part Number Description 2.7A Regulator 7 FAN1589 PRODUCT SPECIFICATION Mechanical Dimensions 3-Lead TO-263 Package Symbol Inches Millimeters Notes Min. Max. Min. Max. A b b2 c2 D E e .160 .020 .190 .036 4.06 0.51 4.83 0.91 L L1 L2 R α .575 .090 — .017 0° .049 .051 .045 .055 .340 .380 .380 .405 .100 BSC .625 .110 .055 .019 8° 1.25 1.30 1.14 1.40 8.64 9.65 9.65 10.29 2.54 BSC 14.61 2.29 — 0.43 0° Notes: 1. Dimensions are exclusive of mold flash and metal burrs. 2. Standoff-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface (at inner R). 4. Dimensiuon exclusive of dambar protrusion or intrusion. 5. Formed leads to be planar with respect to one another at seating place -C-. 15.88 2.79 1.40 0.78 8° E @PKG/ @HEATSINK L2 c2 D E-PIN L R (2 PLCS) b2 L1 b e -B- -A- A -C- 8 REV. 1.0.5 11/10/03 PRODUCT SPECIFICATION FAN1589 Mechanical Dimensions (continued) 3-Lead TO-263 Center Cut Package Inches Symbol Millimeters Notes Min. Max. Min. Max. A b b2 c2 D E e .160 .020 .190 .036 4.06 0.51 4.83 0.91 L L1 L2 .575 .090 — .050 .017 0° .049 .051 .045 .055 .340 .380 .380 .405 .100 BSC L3 R α .625 .110 .055 .070 .019 8° 1.25 1.30 1.14 1.40 8.64 9.65 9.65 10.29 2.54 BSC 14.61 2.29 — 1.27 0.43 0° Notes: 1. Dimensions are exclusive of mold flash and metal burrs. 2. Standoff-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface (at inner R). 4. Dimensiuon exclusive of dambar protrusion or intrusion. 5. Formed leads to be planar with respect to one another at seating place -C-. 15.88 2.79 1.40 1.78 0.78 8° E @PKG/ @HEATSINK L2 c2 D E-PIN L R (2 PLCS) b2 L1 L3 b e -B- -A- A -C- REV. 1.0.5 11/10/03 9 FAN1589 PRODUCT SPECIFICATION Mechanical Dimensions (continued) 3-Lead TO-220 Package Inches Symbol Min. A b b1 c1 øP D E e Millimeters Max. Min. .140 .190 .015 .040 .045 .070 .014 .022 .139 .161 .560 .650 .380 .420 .090 .110 .190 .210 .045 — .020 .055 .230 .270 .080 .115 .500 .580 .250 BSC .100 .135 3° 7° e1 e3 F H1 J1 L L1 Q α Notes Max. 3.56 4.83 .38 1.02 1.14 1.78 .36 .56 3.53 4.09 14.22 16.51 9.65 10.67 2.29 2.79 4.83 5.33 1.14 — .51 1.40 5.94 6.87 2.04 2.92 12.70 14.73 6.35 BSC 2.54 3.43 3° 7° Notes: 1. Dimension c1 apply for lead finish. H1 Q L e3 b1 e e1 E b L1 E-PIN øP α (5X) c1 A J1 D 10 F REV. 1.0.5 11/10/03 PRODUCT SPECIFICATION FAN1589 Mechanical Dimensions (continued) 3-Lead TO-252 Package Symbol Inches Millimeters Notes: Notes Min. Max. Min. Max. A b b2 b3 c c2 .086 .025 .030 .205 .018 .018 .094 .035 2.19 0.64 0.76 5.21 0.46 0.46 2.39 0.89 D E e H 5.33 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 1 L L1 .210 .245 .250 .265 .090 BSC .370 .410 .055 .070 .108 REF L3 L4 .035 .025 0.89 0.64 4 .045 .215 .024 .023 .080 .040 1.14 5.46 0.61 0.58 2.03 1.02 E @PKG/ @HEATSINK b3 4 1 1. Dimensions are exclusive of mold flash, metal burrs or interlead protrusion. 2. Stand off-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface. 4. Thermal pad contour optional within dimension b3 and L3. 5. Formed leads to be planar with respect to one another at seating place -C-. 6. Dimensions and tolerances per ASME Y14.5M-1994. 3 L3 c2 D E-PIN H L4 b2 L1 L b e -B- α = 0° – 10° -A- A -C- REV. 1.0.5 11/10/03 11 FAN1589 PRODUCT SPECIFICATION Ordering Information Product Number Package FAN1589MX TO-263 in tape and reel FAN1589MCX TO-263 center cut in tape and reel FAN1589T TO-220 FAN1589DX TO-252 in tape and reel DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. 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