AD AD9467BCPZRL7-250 16-bit, 200 msps/250 msps analog-to-digital converter Datasheet

16-Bit, 200 MSPS/250 MSPS
Analog-to-Digital Converter
AD9467
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
75.5 dBFS SNR to 210 MHz at 250 MSPS
90 dBFS SFDR to 300 MHz at 250 MSPS
SFDR at 170 MHz at 250 MSPS
92 dBFS at −1 dBFS
100 dBFS at −2 dBFS
60 fs rms jitter
Excellent linearity at 250 MSPS
DNL = ±0.5 LSB typical
INL = ±3.5 LSB typical
2 V p-p to 2.5 V p-p (default) differential full-scale
input (programmable)
Integrated input buffer
External reference support option
Clock duty cycle stabilizer
Output clock available
Serial port control
Built-in selectable digital test pattern generation
Selectable output data format
LVDS outputs (ANSI-644 compatible)
1.8 V and 3.3 V supply operation
AVDD1
(1.8V)
AVDD2
(3.3V)
AVDD3
(1.8V)
CSB
AD9467
SDIO
BUFFER
SCLK
VIN+
PIPELINE
ADC
VIN–
CLK+
CLK–
CLOCK
AND TIMING
MANAGEMENT
16
2
LVDS
OUTPUT
STAGING
16
2
OR+/OR–
D15+/D15–
TO
D0+/D0–
DCO+/DCO–
REF
AGND
XVREF
DRGND
Figure 1.
A data clock output (DCO) for capturing data on the output is
provided for signaling a new output bit.
APPLICATIONS
Multicarrier, multimode cellular receivers
Antenna array positioning
Power amplifier linearization
Broadband wireless
Radar
Infrared imaging
Communications instrumentation
The internal power-down feature supported via the SPI typically
consumes less than 5 mW when disabled.
Optional features allow users to implement various selectable
operating conditions, including input range, data format select,
and output data test patterns.
The AD9467 is available in a Pb-free, 72-lead, LFCSP specified
over the −40°C to +85°C industrial temperature range.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD9467 is a 16-bit, monolithic, IF sampling analog-todigital converter (ADC). It is optimized for high performance
over wide bandwidths and ease of use. The product operates at a
250 MSPS conversion rate and is designed for wireless receivers,
instrumentation, and test equipment that require a high
dynamic range.
1.
2.
The ADC requires 1.8 V and 3.3 V power supplies and a low
voltage differential input clock for full performance operation.
No external reference or driver components are required for
many applications. Data outputs are LVDS compatible (ANSI-644
compatible) and include the means to reduce the overall current
needed for short trace distances.
Rev. D
SPIVDD
DRVDD
(1.8V TO 3.3V) (1.8V)
3.
4.
5.
6.
IF optimization capability used to improve SFDR.
Outstanding SFDR performance for IF sampling
applications such as multicarrier, multimode 3G, and 4G
cellular base station receivers.
Ease of use: on-chip reference, high input impedance
buffer, adjustable analog input range, and an output clock
to simplify data capture.
Packaged in a Pb-free, 72-lead LFCSP package.
Clock duty cycle stabilizer (DCS) maintains overall ADC
performance over a wide range of input clock pulse widths.
Standard serial port interface (SPI) supports various
product features and functions, such as data formatting
(offset binary, twos complement, or Gray coding).
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2010–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
09029-001
FEATURES
AD9467
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Equivalent Circuits ......................................................................... 11
Applications ....................................................................................... 1
Typical Performance Characteristics ........................................... 12
General Description ......................................................................... 1
Theory of Operation ...................................................................... 19
Functional Block Diagram .............................................................. 1
Analog Input Considerations ................................................... 19
Product Highlights ........................................................................... 1
Clock Input Considerations ...................................................... 22
Revision History ............................................................................... 2
Serial Port Interface (SPI) .............................................................. 26
Specifications..................................................................................... 3
Hardware Interface ..................................................................... 26
AC Specifications.......................................................................... 4
Memory Map .................................................................................. 28
Digital Specifications ................................................................... 6
Reading the Memory Map Table .............................................. 28
Switching Specifications .............................................................. 7
Reserved Locations .................................................................... 28
Absolute Maximum Ratings ............................................................ 8
Default Values ............................................................................. 28
Thermal Impedance ..................................................................... 8
Logic Levels ................................................................................. 28
ESD Caution .................................................................................. 8
Outline Dimensions ....................................................................... 32
Pin Configuration and Function Descriptions ............................. 9
Ordering Guide .......................................................................... 32
REVISION HISTORY
2/13—Rev. C to Rev. D
Changes to Figure 1 .......................................................................... 1
Changes to Figure 2 .......................................................................... 7
Changes to VIN+, VIN− Parameter Rating, Table 5 ................... 8
Changes to Figure 51, Figure 52, and Figure 53 ......................... 20
Changes to Figure 54 and Figure 56............................................. 21
Changes to Digital Outputs and Timing Section ....................... 24
Deleted Addr. (Hex) 17 Row, Table 13......................................... 29
Updated Outline Dimensions ....................................................... 32
Changes to Ordering Guide .......................................................... 32
9/11—Rev. B to Rev. C
Changes to Figure 44 and Figure 45............................................. 17
2/11—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Added Figure 24 and Figure 25; Renumbered Sequentially ..... 14
Changes to Differential Configurations Section and
Figure 54 .......................................................................................... 21
Added Figure 55 to Figure 57 ....................................................... 21
Changes to Figure 65 and Figure 66 ............................................ 24
Changes to Addr. (Hex) 15, Bits[2:0], Addr. (Hex) 10, Bits[7:0],
and Addr. (Hex) 10, Default Notes Column ............................... 29
Changes to Addr. (Hex) 36, Default Value (Hex) Column and
Addr. (Hex) 107, Default Value (Hex) Column ......................... 30
10/10—Revision 0: Initial Version
3/11—Rev. A to Rev. B
Change Parameter Name to Full Power Bandwidth, Table 1...... 3
Changes to Switching Specifications, Table 4 ............................... 7
Change to VIN+, VIN− Parameter, Table 5 .................................. 8
Deleted Figure 43 ............................................................................ 17
Added New Figure 43..................................................................... 17
Rev. D | Page 2 of 32
Data Sheet
AD9467
SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.3 V, AVDD3 = 1.8 V, DRVDD = 1.8 V, specified maximum sampling rate, 2.5 V p-p differential input, 1.25 V
internal reference, AIN = −1.0 dBFS, DCS on, default SPI settings, unless otherwise noted.
Table 1.
AD9467BCPZ-200
Parameter 1
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error
Differential Nonlinearity (DNL) 2
Integral Nonlinearity (INL)2
TEMPERATURE DRIFT
Offset Error
Gain Error
ANALOG INPUTS
Differential Input Voltage Range (Internal VREF = 1 V to 1.25 V)
Common-Mode Voltage
Differential Input Resistance
Differential Input Capacitance
Full Power Bandwidth
XVREF INPUT
Input Voltage
Input Capacitance
POWER SUPPLY
AVDD1
AVDD2
AVDD3
DRVDD
IAVDD1
IAVDD2
IAVDD3
IDRVDD
Total Power Dissipation (Including Output Drivers)
Power-Down Dissipation
1
2
Temp
Full
Full
Full
Full
Full
Min
16
−150
−3.5
−0.8
−9.5
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Max
Guaranteed
0
+150
−0.2
+2.5
±0.4
+0.7
±5
+9.5
AD9467BCPZ-250
Min
16
−150
−3.5
−0.6
−11.8
±0.020
±0.011
2
25°C
25°C
25°C
25°C
Full
Full
Typ
2.5
2.3
530
3.5
900
1
Max
Guaranteed
0
+150
−0.1
+2.5
±0.5
+1.3
±3.5
+9.5
±0.023
±0.036
2.5
2
1.25
1
3
1.75
3.0
1.7
1.7
485
49
21
35
1.14
Typ
2.5
2.15
530
3.5
900
1.85
3.6
1.9
1.9
580
61
27
41
1.37
90
1.75
3.0
1.7
1.7
514
49
27
36
1.2
1.8
3.3
1.8
1.8
567
55
31
40
1.33
4.4
LSB
%FSR
LSB
LSB
%FSR/°C
%FSR/°C
2.5
V p-p
V
Ω
pF
MHz
1.25
V
pF
3
1.8
3.3
1.8
1.8
536
55
24
38
1.26
4.4
Unit
Bits
1.85
3.6
1.9
1.9
618
61
35
43
1.45
90
V
V
V
V
mA
mA
mA
mA
W
mW
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
Rev. D | Page 3 of 32
AD9467
Data Sheet
AC SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.3 V, AVDD3 = 1.8 V, DRVDD = 1.8 V, specified maximum sampling rate, 2.5 V p-p differential input,
1.25 V internal reference, AIN = −1.0 dBFS, DCS on, default SPI settings, unless otherwise noted.
Table 2.
Parameter 1
ANALOG INPUT FULL SCALE
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 5 MHz
fIN = 97 MHz
fIN = 97 MHz
fIN = 140 MHz
fIN = 170 MHz
fIN = 170 MHz
fIN = 210 MHz
fIN = 300 MHz
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD)
fIN = 5 MHz
fIN = 97 MHz
fIN = 97 MHz
fIN = 140 MHz
fIN = 170 MHz
fIN = 170 MHz
fIN = 210 MHz
fIN = 300 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 5 MHz
fIN = 97 MHz
fIN = 97 MHz
fIN = 140 MHz
fIN = 170 MHz
fIN = 170 MHz
fIN = 210 MHz
fIN = 300 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR) (INCLUDING
SECOND AND THIRD HARMONIC DISTORTION) 2
fIN = 5 MHz
fIN = 97 MHz
fIN = 97 MHz
fIN = 140 MHz
fIN = 170 MHz
fIN = 170 MHz
fIN = 210 MHz
fIN = 300 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR) (INCLUDING SECOND
AND THIRD HARMONIC DISTORTION)2
fIN = 5 MHz @ −2 dB Full Scale
fIN = 97 MHz @ −2 dB Full Scale
fIN = 140 MHz @ −2 dB Full Scale
fIN = 170 MHz @ −2 dB Full Scale
fIN = 210 MHz @ −2 dB Full Scale
fIN = 300 MHz @ −2 dB Full Scale
Temp
25°C
25°C
Full
25°C
25°C
Full
25°C
25°C
25°C
25°C
Full
25°C
25°C
Full
25°C
25°C
Min
2.5
75.1
73.8
74.7
73.1
Full
Full
Full
Full
Full
Full
AD9467BCPZ-250
Typ
Max
2/2.5
74.7/76.4
74.5/76.1
74.7
72.3
74.4/76.0
74.3/75.8
73.9/75.5
73.5/74.7
74.0/75.5
73.3/74.6
74.6/76.3
74.5/76.2
74.6/76.3
74.4/76.0
74.3/75.9
74.1/75.6
86
83
Min
2.5
74.6/76.4
74.5/76.2
74.3/76.0
74.2/75.8
25°C
25°C
Full
25°C
25°C
Full
25°C
25°C
25°C
25°C
Full
25°C
25°C
Full
25°C
25°C
AD9467BCPZ-200
Typ
Max
2/2.5
74.4
71.8
74.4/76.0
74.2/75.8
73.9/75.3
73.3/74.3
73.9/75.4
73.1/74.4
12.1/12.4
12.1/12.4
12.1/12.4
12.1/12.3
12.1/12.3
12.0/12.3
12.1/12.3
12.0/12.3
12.0/12.2
11.9/12.0
12.0/12.2
11.9/12.1
95/95
95/95
98/97
95/93
Unit
V p-p
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
Bits
Bits
Bits
Bits
Bits
Bits
Bits
Bits
93/88
92/86
93/92
93/90
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
100/96
100/98
98/96
96/93
94/93
90/89
100/100
97/97
100/95
100/100
93/93
90/90
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
94/93
95/90
Rev. D | Page 4 of 32
84
84
94/95
93/92
Data Sheet
Parameter 1
WORST OTHER (EXCLUDING SECOND AND THIRD HARMONIC
DISTORTION)2
fIN = 5 MHz
fIN = 97 MHz
fIN = 97 MHz
fIN = 140 MHz
fIN = 170 MHz
fIN = 170 MHz
fIN = 210 MHz
fIN = 300 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD)—
AIN1 AND AIN2 = −7.0 dBFS @ 2.5 V p-p FS
fIN1 = 70 MHz, fIN2 = 72 MHz
fIN1 = 170 MHz, fIN2 = 172 MHz
1
2
AD9467
Temp
25°C
25°C
Full
25°C
25°C
Full
25°C
25°C
25°C
25°C
Min
86
83
AD9467BCPZ-200
Typ
Max
Min
96/98
97/97
AD9467BCPZ-250
Typ
Max
96/97
95/95
97/95
97/95
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
95
93
97
91
dBFS
dBFS
97/96
98/98
98/97
97/93
Unit
90
87
97/95
97/93
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
See the SFDR Optimization—Buffer Current Adjustment section for optimum settings.
Rev. D | Page 5 of 32
AD9467
Data Sheet
DIGITAL SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.3 V, AVDD3 = 1.8 V, DRVDD = 1.8 V, specified maximum sampling rate, 2.5 V p-p differential input, 1.25 V
internal reference, AIN = −1.0 dBFS, DCS on, default SPI settings, unless otherwise noted.
Table 3.
AD9467BCPZ-200
Parameter 1
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Differential Input Voltage 2
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
LOGIC INPUTS (SCLK, CSB, SDIO)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
LOGIC OUTPUT (SDIO) 3
Logic 1 Voltage (IOH = 800 μA)
Logic 0 Voltage (IOL = 50 μA)
DIGITAL OUTPUTS (D0+ to D15+, D0− to
D15−, DCO+, DCO−, OR+, OR−)
Logic Compliance
Differential Output Voltage (VOD)
Output Offset Voltage (VOS)
Output Coding (Default)
1
2
3
Temp
Min
Full
Full
25°C
25°C
250
Full
Full
25°C
25°C
1.2
Typ
Max
AD9467BCPZ-250
Min
CMOS/LVDS/LVPECL
Max
0.8
20
2.5
mV p-p
V
kΩ
pF
0.8
20
2.5
3.6
0.3
1.2
30
0.5
3.6
0.3
30
0.5
1.7/3.1
1.7/3.1
0.3
0.3
LVDS
247
1.125
V
V
kΩ
pF
V
V
LVDS
545
1.375
Offset binary
Unit
CMOS/LVDS/LVPECL
250
Full
Full
Full
Full
Typ
247
1.125
545
1.375
mV
V
Offset binary
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
This is specified for LVDS and LVPECL only.
This depends on if SPIVDD is tied to a 1.8 V or 3.3 V supply.
Rev. D | Page 6 of 32
Data Sheet
AD9467
SWITCHING SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.3 V, AVDD3 = 1.8 V, DRVDD = 1.8 V, specified maximum sampling rate, 2.5 V p-p differential input, 1.25 V
internal reference, AIN = −1.0 dBFS, DCS on, default SPI settings, unless otherwise noted.
Table 4.
Parameter 1
CLOCK 2
Clock Rate
Clock Pulse Width High (tCH)
Clock Pulse Width Low (tCL)
OUTPUT PARAMETERS2, 3
Propagation Delay (tPD)
Rise Time (tR) (20% to 80%)
Fall Time (tF) (20% to 80%)
DCO Propagation Delay (tCPD)
DCO to Data Delay (tSKEW)
Wake-Up Time (Power-Down)
Pipeline Latency
APERTURE
Aperture Delay (tA)
Aperture Uncertainty (Jitter)
Out-of-Range Recovery Time
1
2
3
Temp
Min
Full
Full
Full
50
25°C
25°C
25°C
25°C
Full
Full
Full
AD9467BCPZ-200
Typ
Max
Min
200
50
250
2.5
2.5
2
2
3
200
200
3
3
200
200
3
Unit
MSPS
ns
ns
100
16
100
16
ns
ps
ps
ns
ps
ms
Clock cycles
1.2
60
1
1.2
60
1
ns
fs rms
Clock cycles
−200
+200
25°C
25°C
25°C
AD9467BCPZ-250
Typ
Max
−200
+200
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Can be adjusted via the SPI interface.
Measurements were made using a part soldered to FR-4 material.
Timing Diagrams
N–1
N+4
tA
N+5
N
N+3
VIN±
N+1
tCH
tCL
N+2
1/fs
CLK+
CLK–
tCPD
DCO+
DCO–
tSKEW
tPD
D15–/D14– (MSB)
D15
D14
N – 16
N – 16
N – 15
N – 15
N – 14
N – 13
N – 12
N – 11
N – 10
N – 10
D1
D0
N – 16
N – 16
N – 15
N – 15
N – 14
N – 13
N – 12
N – 11
N – 10
N – 10
D1–/D0– (LSB)
D1+/D0+ (LSB)
Figure 2. 16-Bit Output Data Timing
Rev. D | Page 7 of 32
09029-002
D15+/D14+ (MSB)
..
.
AD9467
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
AVDD1, AVDD3
AVDD2, SPIVDD
DRVDD
AGND
AVDD2, SPIVDD
AVDD1, AVDD3
AVDD2, SPIVDD
Digital Outputs (Dx+,
Dx−, OR+, OR−,
DCO+, DCO−)
CLK+, CLK−
VIN+, VIN−
XVREF
SCLK, CSB, SDIO
Environmental
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
Storage Temperature
Range (Ambient)
With
Respect To
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
AGND
AGND
DRGND
DRGND
AVDD1,
AVDD3
DRVDD
DRVDD
DRGND
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
AGND
AGND
AGND
AGND
−0.3 V to AVDD1 + 0.2 V
−0.3 V to +3.6 V
−0.3 V to AVDD1 + 0.2 V
−0.3 V to SPIVDD + 0.2 V
THERMAL IMPEDANCE
−2.0 V to +2.0 V
−2.0 V to +3.9 V
−0.3 V to DRVDD + 0.2 V
−40°C to +85°C
150°C
Table 6.
Air Flow Velocity (m/sec)
0.0
1.0
2.5
θJA1, 2
15.7°C/W
13.7°C/W
12.3°C/W
θJB1, 3, 4
7.5°C/W
N/A
N/A
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per JEDEC JESD51-8 (still air).
4
N/A = not applicable.
5
Per MIL-STD 883, Method 1012.1.
1
2
ESD CAUTION
300°C
−65°C to +150°C
Rev. D | Page 8 of 32
θJC1, 5
0.5°
N/A
N/A
Unit
°C/W
°C/W
°C/W
Data Sheet
AD9467
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
AVDD1
AVDD1
AVDD1
AVDD2
AVDD2
VIN–
VIN+
AVDD2
AVDD2
AVDD1
AVDD1
AVDD1
AVDD1
AVDD1
AVDD1
XVREF
AVDD1
AVDD1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
PIN 1
INDICATOR
AD9467
TOP VIEW
(Not to Scale)
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
AVDD1
AVDD1
AVDD1
SPIVDD
CSB
SCLK
SDIO
DNC
AVDD1
AGND
AVDD3
AGND
AVDD3
AGND
OR+
OR–
DRGND
DRVDD
NOTES
1. DNC = DO NOT CONNECT.
2. EXPOSED THERMAL PAD MUST BE CONNECTED TO AGND.
09029-003
D1–/D0–
D1+/D0+
D3–/D2–
D3+/D2+
D5–/D4–
D5+/D4+
D7–/D6–
D7+/D6+
DCO–
DCO+
D9–/D8–
D9+/D8+
D11–/D10–
D11+/D10+
D13–/D12–
D13+/D12+
D15–/D14–
D15+/D14+
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
AVDD1
AVDD1
AVDD1
AVDD1
CLK+
CLK–
AVDD1
AVDD1
AVDD1
AGND
AVDD1
AVDD1
AVDD1
AGND
AVDD1
AGND
DRGND
DRVDD
Figure 3. Pin Configuration, Top View
Table 7. Pin Function Descriptions
Pin No.
0
10, 14, 16, 41, 43, 45
1, 2, 3, 4, 7, 8, 9, 11, 12, 13, 15, 46, 52, 53, 54, 55,
56, 58, 59, 60, 61, 62, 63, 70, 71, 72
64, 65, 68, 69
42, 44
51
17, 38
18, 37
67
66
6
5
19
20
21
22
23
24
25
26
29
30
31
32
33
34
35
Mnemonic
EPAD
AGND
AVDD1
Description
Exposed Paddle. The exposed paddle must be connected to AGND.
Analog Ground.
1.8 V Analog Supply.
AVDD2
AVDD3
SPIVDD
DRGND
DRVDD
VIN−
VIN+
CLK−
CLK+
D1−/D0−
D1+/D0+
D3−/D2−
D3+/D2+
D5−/D4−
D5+/D4+
D7−/D6−
D7+/D6+
D9−/D8−
D9+/D8+
D11−/D10−
D11+/D10+
D13−/D12−
D13+/D12+
D15−/D14−
3.3 V Analog Supply.
1.8 V Analog Supply.
1.8 V or 3.3 V SPI Supply
Digital Output Driver Ground.
1.8 V Digital Output Driver Supply.
Analog Input Complement.
Analog Input True.
Clock Input Complement.
Clock Input True.
D1 and D0 (LSB) Digital Output Complement.
D1 and D0 (LSB) Digital Output True.
D3 and D2 Digital Output Complement.
D3 and D2 Digital Output True.
D5 and D4 Digital Output Complement.
D5 and D4 Digital Output True.
D7 and D6 Digital Output Complement.
D7 and D6 Digital Output True.
D9 and D8 Digital Output Complement.
D9 and D8 Digital Output True.
D11 and D10 Digital Output Complement.
D11 and D10 Digital Output True.
D13 and D12 Digital Output Complement.
D13 and D12 Digital Output True.
D15 (MSB) and D14 Digital Output Complement.
Rev. D | Page 9 of 32
AD9467
Pin No.
36
27
28
39
40
47
48
49
50
57
Data Sheet
Mnemonic
D15+/D14+
DCO−
DCO+
OR−
OR+
DNC
SDIO
SCLK
CSB
XVREF
Description
D15 (MSB) and D14 Digital Output True.
Data Clock Digital Output Complement.
Data Clock Digital Output True.
Out-of-Range Digital Output Complement.
Out-of-Range Digital Output True.
Do Not Connect (Leave Pin Floating).
Serial Data Input/Output.
Serial Clock.
Chip Select Bar.
External VREF Option.
Rev. D | Page 10 of 32
Data Sheet
AD9467
EQUIVALENT CIRCUITS
AVDD2
VIN+
AVDD2
BUF
265Ω
345Ω
SCLK, SDIO
AND CSB
VCML
2.15V/2.30V
BUF
AVDD2
30kΩ
265Ω
VIN–
09029-004
09029-008
BUF
Figure 7. Equivalent SCLK, SDIO, and CSB Input Circuit
Figure 4. Equivalent Analog Input Circuit
AVDD1
SPIVDD
10kΩ
10kΩ
0.8V
10kΩ
CLK+
10kΩ
CLK–
09029-005
09029-011
SDIO
Figure 8. Equivalent SDIO Output Circuit
Figure 5. Equivalent Clock Input Circuit
DRVDD
V
V
Dx+
V
DRGND
XVREF
09029-007
V
1kΩ
3pF
09029-109
Dx–
Figure 9. Equivalent External VREF Input Circuit (When Enabled)
Figure 6. Equivalent Digital Output Circuit
Rev. D | Page 11 of 32
AD9467
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
AVDD1 = 1.8 V, AVDD2 = 3.3 V, AVDD3 = 1.8 V, DRVDD = 1.8 V, specified maximum sampling rate, 2.5 V p-p differential input, 1.25 V
internal reference, AIN = −1.0 dBFS, DCS on, default SPI settings, unless otherwise noted, buffer current optimized for best SFDR
performance.
0
0
AIN = –1.0dBFS
SNR = 76.5dBFS
ENOB = 12.4 BITS
SFDR = 95.4dBFS
–60
–80
–80
–100
–120
–120
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
–140
0
100
Figure 10. Single-Tone FFT with fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-200
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
100
Figure 13. Single-Tone FFT with fIN = 170.3 MHz, 2.5 V p-p FS, AD9467-200
0
0
AIN = –1.0dBFS
SNR = 76.2dBFS
ENOB = 12.3 BITS
SFDR = 92.0dBFS
AMPLITUDE (dBFS)
–40
–60
–80
–40
–60
–80
–100
–120
–120
09029-111
–100
–140
0
10
20
30
40
50
60
70
FREQUENCY (MHz)
AIN = –1.0dBFS
SNR = 75.5dBFS
ENOB = 12.1 BITS
SFDR = 90.0dBFS
–20
80
90
09029-114
–20
–140
100
0
Figure 11. Single-Tone FFT with fIN = 97.3 MHz, 2.5 V p-p FS, AD9467-200
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
100
Figure 14. Single-Tone FFT with fIN = 210.3 MHz, 2.5 V p-p FS, AD9467-200
0
0
AIN = –1.0dBFS
SNR = 75.9dBFS
ENOB = 12.3 BITS
SFDR = 95.2dBFS
–20
AIN = –1.0dBFS
SNR = 74.7dBFS
ENOB = 12.0 BITS
SFDR = 86.5dBFS
–20
AMPLITUDE (dBFS)
–40
–60
–80
–100
–40
–60
–80
–100
–120
09029-112
–120
–140
0
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
09029-115
AMPLITUDE (dBFS)
–60
–100
0
AMPLITUDE (dBFS)
–40
09029-113
AMPLITUDE (dBFS)
–40
–140
AIN = –1.0dBFS
SNR = 75.8dBFS
ENOB = 12.3 BITS
SFDR = 94.1dBFS
–20
09029-110
AMPLITUDE (dBFS)
–20
–140
100
0
Figure 12. Single-Tone FFT with fIN = 140.3 MHz, 2.5 V p-p FS, AD9467-200
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
100
Figure 15. Single-Tone FFT with fIN = 290.3 MHz, 2.5 V p-p FS, AD9467-200
Rev. D | Page 12 of 32
Data Sheet
AD9467
0
0
AIN = –1.0dBFS
SNR = 76.4dBFS
ENOB = 12.4 BITS
SFDR = 100.0dBFS
–60
–80
–80
–100
–120
–120
20
40
60
80
FREQUENCY (MHz)
100
–140
0
120
Figure 16. Single-Tone FFT with fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-250
20
40
60
80
FREQUENCY (MHz)
100
120
Figure 19. Single-Tone FFT with fIN = 170.3 MHz, 2.5 V p-p FS, AD9467-250
0
0
AIN = –1.0dBFS
SNR = 75.9dBFS
ENOB = 12.3 BITS
SFDR = 94.8dBFS
AMPLITUDE (dBFS)
–40
–60
–80
–40
–60
–80
–100
–120
–120
09029-117
–100
–140
0
20
40
AIN = –1.0dBFS
SNR = 75.5dBFS
ENOB = 12.1 BITS
SFDR = 90.8dBFS
–20
60
80
FREQUENCY (MHz)
100
09029-120
–20
–140
0
120
Figure 17. Single-Tone FFT with fIN = 97.3 MHz, 2.5 V p-p FS, AD9467-250
20
40
60
80
FREQUENCY (MHz)
100
120
Figure 20. Single-Tone FFT with fIN = 210.3 MHz, 2.5 V p-p FS, AD9467-250
0
0
AIN = –1.0dBFS
SNR = 76.0dBFS
ENOB = 12.2 BITS
SFDR = 93.6dBFS
–20
AMPLITUDE (dBFS)
–40
–60
–80
–40
–60
–80
–100
–120
–120
09029-118
–100
–140
0
20
40
AIN = –1.0dBFS
SNR = 74.2dBFS
ENOB = 12.0 BITS
SFDR = 91.0dBFS
–20
60
80
FREQUENCY (MHz)
100
09029-121
AMPLITUDE (dBFS)
–60
–100
0
AMPLITUDE (dBFS)
–40
09029-119
AMPLITUDE (dBFS)
–40
–140
AIN = –1.0dBFS
SNR = 75.8dBFS
ENOB = 12.2 BITS
SFDR = 94.1dBFS
–20
09029-116
AMPLITUDE (dBFS)
–20
–140
0
120
Figure 18. Single-Tone FFT with fIN = 140.3 MHz, 2.5 V p-p FS, AD9467-250
20
40
60
80
FREQUENCY (MHz)
100
120
Figure 21. Single-Tone FFT with fIN = 300.3 MHz, 2.5 V p-p FS, AD9467-250
Rev. D | Page 13 of 32
AD9467
Data Sheet
78
110
77
105
100
SNR
96
100
76
94
75
90
74
85
SFDR (dBFS)
95
SFDR (dBFS)
SFDR
SNR (dBFS)
fIN = 4.3MHz
fIN = 97.3MHz
fIN = 170.3MHz
fIN = 300.3MHz
98
92
90
88
86
73
80
84
75
200
70
220
80
160
SAMPLE RATE (MSPS)
110
77
105
190
200
210
220
230
240
250
Figure 25. SFDR vs. fSAMPLE, 2.5 V p-p FS, AD9467-250
78
110
77
105
100
76
90
74
85
73
SNR (dBFS)
SFDR
SFDR (dBFS)
95
75
72
220
225
230
240
235
245
90
74
75
72
70
250
71
09029-125
215
95
75
SAMPLE RATE (MSPS)
80
75
70
0
50
100
150
200
250
300
ANALOG INPUT FREQUENCY (MHz)
Figure 23. SNR/SFDR vs. fSAMPLE, fIN = 97.3 MHz, 2.5 V p-p FS, AD9467-250
Figure 26. SNR/SFDR vs. fIN, 2.0/2.5 V p-p FS, AD9467-200
105
fIN = 4.3MHz
fIN = 97.3MHz
fIN = 170.3MHz
fIN = 290.3MHz
100
85
SNR = 2.0V p-p FS
SNR = 2.5V p-p FS
SFDR = 2.0V p-p FS
SFDR = 2.5V p-p FS
73
80
71
210
100
76
SNR
SNR (dBFS)
180
SAMPLE RATE (MSPS)
Figure 22. SNR/SFDR vs. fSAMPLE, fIN = 97.3 MHz, 2.5 V p-p FS, AD9467-200
78
170
78
110
77
105
100
SNR (dBFS)
90
95
75
90
74
85
SNR = 2.0V p-p FS
SNR = 2.5V p-p FS
SFDR = 2.0V p-p FS
SFDR = 2.5V p-p FS
73
85
80
72
80
100
120
140
160
180
200
220
SAMPLE RATE (MSPS)
75
70
71
09029-224
SFDR (dBFS)
76
95
09029-225
180
SFDR (dBFS)
160
09029-126
140
0
50
100
150
200
250
300
ANALOG INPUT FREQUENCY (MHz)
Figure 24. SFDR vs. fSAMPLE, 2.5 V p-p FS, AD9467-200
Figure 27. SNR/SFDR vs. fIN, 2.0/2.5 V p-p FS, AD9467-250
Rev. D | Page 14 of 32
SFDR (dBFS)
120
09029-123
71
100
82
09029-127
72
Data Sheet
AD9467
0
0
AIN1 AND AIN2 = –7dBFS
SFDR = 94.6dBFS
IMD2 = 94.6dBFS
IMD3 = 95.9dBFS
–40
–60
–80
–100
–40
–60
–80
–100
–120
–120
10
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
100
–140
0
Figure 28. Two-Tone FFT with fIN1 = 70 MHz and fIN2 = 72 MHz,
2.5 V p-p FS, AD9467-200
20
40
60
80
FREQUENCY (MHz)
120
Figure 31. Two-Tone FFT with fIN1 = 170 MHz and fIN2 = 172 MHz,
2.5 V p-p FS, AD9467-250
120
0
AIN1 AND AIN2 = –7dBFS
SFDR = 92.7dBFS
IMD2 = 98.2dBFS
IMD3 = 92.7dBFS
–20
100
SNR/SFDR (dB)
–40
–60
–80
80
60
SNR FS
SFDR FS
SFDR dBc
SNR dBc
40
–100
20
–120
–1
ANALOG INPUT LEVEL (dBFS)
09029-132
–3
–5
–7
–9
–11
–13
–15
–17
0
–19
100
–21
90
–23
80
–25
40
50
60
70
FREQUENCY (MHz)
–35
30
–45
20
–55
10
–65
0
09029-129
–140
Figure 32. SNR/SFDR vs. Analog Input Level, fIN = 97.3 MHz, 2.5 V p-p FS,
AD9467-200
Figure 29. Two-Tone FFT with fIN1 = 170 MHz and fIN2 = 172 MHz,
2.5 V p-p FS, AD9467-200
120
0
AIN1 AND AIN2 = –7dBFS
SFDR = 96.7dBFS
IMD2 = 103.2dBFS
IMD3 = 96.7dBFS
–20
100
SNR/SFDR (dB)
–40
–60
–80
80
60
SFDR FS
SFDR dBc
SNR FS
SNR dBc
40
–100
20
Figure 30. Two-Tone FFT with fIN1 = 70 MHz and fIN2 = 72 MHz,
2.5 V p-p FS, AD9467-250
–1
–3
–5
09029-133
ANALOG INPUT LEVEL (dBFS)
–7
–9
–13
–15
–17
–19
0
–21
120
–23
100
–25
60
80
FREQUENCY (MHz)
–35
40
–45
20
–55
0
–65
–140
–11
–120
09029-130
AMPLITUDE (dBFS)
100
09029-131
0
09029-128
–140
AMPLITUDE (dBFS)
AIN1 AND AIN2 = –7dBFS
SFDR = 91.3dBFS
IMD2 = 96.3dBFS
IMD3 = 91.3dBFS
–20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–20
Figure 33. SNR/SFDR vs. Analog Input Level, fIN = 97.3 MHz, 2.5 V p-p FS,
AD9467-250
Rev. D | Page 15 of 32
AD9467
Data Sheet
100
0.8
SFDR
0.6
DNL ERROR (LSB)
SNR/SFDR (dBFS)
95
90
85
80
0.4
0.2
0
–0.2
–0.4
SINAD
–0.6
09029-137
75
60000
54000
48000
42000
36000
30000
24000
18000
12000
TEMPERATURE (°C)
09029-134
–40
–35
–30
–25
–20
–15
–10
–5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
70
6000
–0.8
CODE
Figure 34. SINAD/SFDR vs. Temperature, fIN = 97.3 MHz,
2.5 V p-p FS, AD9467-200
Figure 37. DNL, fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-200
8
100
SFDR
6
95
INL ERROR (LSB)
85
80
2
0
–2
–4
SINAD
75
60000
50000
40000
30000
10000
TEMPERATURE (°C)
–8
09029-135
–40
–35
–30
–25
–20
–15
–10
–5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
70
09029-138
–6
20000
SNR/SFDR (dBFS)
4
90
CODE
Figure 35. SINAD/SFDR vs. Temperature, fIN = 97.3 MHz,
2.5 V p-p FS, AD9467-250
Figure 38. INL, fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-250
0.8
2.25
0.6
1.50
0.4
DNL ERROR (LSB)
3.00
0.75
0
0.75
–1.50
–2.25
0.2
0
–0.2
–0.4
CODE
60000
54000
48000
42000
36000
30000
24000
18000
6000
–0.8
12000
09029-136
60000
54000
48000
42000
36000
30000
24000
18000
12000
–3.75
09029-139
–0.6
–3.00
6000
INL ERROR (LSB)
3.75
CODE
Figure 36. INL, fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-200
Figure 39. DNL, fIN = 4.3 MHz, 2.5 V p-p FS, AD9467-250
Rev. D | Page 16 of 32
Data Sheet
AD9467
100
0
SFDR
–1
90
SNR
–3
AMPLITUDE (dB)
SNR/SFDR (dBFS/dBc)
–2
80
70
60
50
DEFAULT CMV
–3dB = 2.24GHz
–4
–5
–6
–7
40
–8
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
10M
100M
Figure 40. SNR/SFDR vs. Analog Input Common-Mode Voltage,
AIN = 100 MHz, 2.5 V p-p FS, AD9467-250
140,000
SFDR
3.427LSB rms
90
120,000
80
SNR
100,000
NUMBER OF HITS
70
60
50
DEFAULT CMV
80,000
60,000
40,000
40
20,000
09029-141
30
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
0
2.6
ANALOG INPUT COMMON-MODE VOLTAGE (V)
N – 17
N – 16
N – 15
N – 14
N – 13
N – 12
N – 11
N – 10
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N + 10
N + 11
N + 12
N + 13
N + 14
N + 15
N + 16
N + 17
SNR/SFDR (dBFS/dBc)
10G
Figure 43. Converter AC Bandwidth AD9467-250
100
20
1.6
1G
FREQUENCY (Hz)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
09029-143
1.6
–9
–10
1M
CODE
09029-144
20
1.5
09029-140
30
Figure 44. Input-Referred Noise Histogram, 2.5 V p-p FS, AD9467-200
Figure 41. SNR/SFDR vs. Analog Input Common-Mode Voltage,
AIN = 100 MHz, 2.5 V p-p FS, AD9467-200
0
140,000
–10
120,000
–20
100,000
60,000
–50
40,000
–60
20,000
–70
0
50
100
150
200
250
300
FREQUENCY (MHz)
Figure 42. Common-Mode Rejection Ratio (CMRR), AD9467-250
0
CODE
09029-145
–40
80,000
N – 17
N – 16
N – 15
N – 14
N – 13
N – 12
N – 11
N – 10
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N + 10
N + 11
N + 12
N + 13
N + 14
N + 15
N + 16
N + 17
NUMBER OF HITS
–30
09029-142
CMRR (dB)
3.385LSB rms
Figure 45. Input-Referred Noise Histogram, 2.5 V p-p FS, AD9467-250
Rev. D | Page 17 of 32
AD9467
Data Sheet
105
–55
–60
100
–65
95
AVDD1
–75
90
4MHz
97MHz
140MHz
170MHz
210MHz
290MHz
85
–80
DRVDD
–90
75
ANALOG INPUT FREQUENCY (MHz)
09029-146
80
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
270
280
290
300
–85
Figure 46. Power Supply Rejection (PSR), AD9467-250
0
95
85
4MHz
97MHz
140MHz
170MHz
210MHz
290MHz
70
0
50
100
150
200
250
BUFFER CURRENT PERCENTAGE (%)
300
09029-247
SFDR (dBFS)
90
75
100
150
200
250
BUFFER CURRENT PERCENTAGE (%)
300
Figure 48. SFDR Performance vs. Buffer Current Percentage Over Analog
Input Frequency, AD9467-250
100
80
50
09029-248
SFDR (dBFS)
PSRR (dB)
AVDD2
–70
Figure 47. SFDR Performance vs. Buffer Current Percentage Over Analog
Input Frequency, AD9467-200
Rev. D | Page 18 of 32
Data Sheet
AD9467
THEORY OF OPERATION
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
The output staging block aligns the data, corrects errors, and
passes the data to the output buffers.
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9467 is a differential buffer. For best
dynamic performance, the source impedances driving VIN+
and VIN− should be matched such that common-mode settling
errors are symmetrical. The analog input is optimized to provide
superior wideband performance and requires that the analog
inputs be driven differentially. SNR and SINAD performance
degrades significantly if the analog input is driven with a singleended signal.
Maximum SNR performance is achieved by setting the ADC to the
largest span in a differential configuration. In the default case of
the AD9467, the largest input span available is 2.5 V p-p. For other
input full-scale options, see the Full-Scale and Reference Options
section.
SFDR Optimization—Buffer Current Adjustment
Using Register 36 and Register 107, the buffer currents can be
changed as a percentage to optimize the SFDR over various input
frequencies and bandwidths of interest. As the input buffer currents
are set, this does change the amount of current required by AVDD2.
However, the current consumption is small in comparison to the
overall currents required by this supply. The current specifications
listed in Table 1 incorporate this variation. For a complete list of
buffer current settings, see Table 13 for more details.
The following buffer current settings reflect the performance
that can be achieved using the input networks as described in
Figure 51 and Figure 52. These curves describe the percentages
used to obtain data sheet typical specifications for both the
250 MSPS and 200 MSPS parts. For example, when using IFs
from 150 MHz to 250 MHz, 160% is actually the average of the
entire buffer current. Therefore, both Register 36 and Register 107
need to be set to 160%.
AD9467BCPZ-250 buffer current settings:
•
•
•
In either case, a small resistor in series with each input can help
reduce the peak transient current injected from the output stage
of the driving source. In addition, low Q inductors or ferrite beads
can be placed on each leg of the input to reduce high differential
capacitance at the analog inputs and, therefore, achieve the
maximum bandwidth of the ADC. Such use of low Q inductors
or ferrite beads is required when driving the converter front end at
high IF frequencies. Either a shunt capacitor or two single-ended
capacitors can be placed on the inputs to provide a matching
passive network. This ultimately creates a low-pass filter at the
input to limit unwanted broadband noise. See the AN-742
Application Note, the AN-827 Application Note, the AN-935
Application Note, and the Analog Dialogue article “TransformerCoupled Front-End for Wideband A/D Converters” (Volume 39,
April 2005) for more information. In general, the precise values
depend on the application.
Rev. D | Page 19 of 32
DC to 150 MHz at 80% (default setting)
150 MHz to 250 MHz at 160%
250 MHz and higher at 210%
100
80%
160%
210%
98
96
94
92
90
88
86
84
82
80
0
50
100
150
200
250
ANALOG INPUT FREQUENCY (MHz)
Figure 49. Buffer Current Sweeps, 2.5 V p-p, AD9467-250
300
09029-147
The input buffer provides a linear high input impedance (for
ease of drive) and reduces the kick-back from the ADC. The
buffer is optimized for high linearity, low noise, and low power.
The quantized outputs from each stage are combined into a final
16-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate with a new input
sample while the remaining stages operate with preceding samples.
Sampling occurs on the rising edge of the clock.
For best dynamic performance, the source impedances driving
VIN+ and VIN− should be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC.
SFDR (dBFS)
The AD9467 architecture consists of an input-buffered pipelined ADC that consists of a 3-bit first stage, a 4-bit second
stage, followed by four 3-bit stages and a final 3-bit flash. Each
stage provides sufficient overlap to correct for flash errors in
the preceding stage.
AD9467
Data Sheet
Differential Input Configurations
There are several ways to drive the AD9467, either actively or
passively; however, optimum performance is achieved by
driving the analog input differentially.
For applications where SNR and SFDR are key parameters,
differential transformer coupling is the recommended input
configuration (see Figure 51 and Figure 52) because the noise
performance of most amplifiers is not adequate to achieve the
true performance of the AD9467.
Regardless of the configuration, the value of the shunt capacitor, C,
is dependent on the input frequency and may need to be reduced
or removed (see Figure 51, Figure 52, and Figure 53)
Using the ADL5562 or ADL5201 differential drivers to drive the
AD9467 provides an excellent and flexible gain option to interface
to the ADC (see Figure 54 and Figure 56) for both baseband and
high IF applications. Using an amplifier also provides better
isolation from the preceding stages as well as better pass-band
flatness. Performance plots of these amplifiers can also be seen
in Figure 55 and Figure 57.
When using any dc-coupled amplifier, the user has the option to
disconnect the input common-mode voltage buffer from the analog
inputs. This allows the common-mode output pin of the amplifier
to set this voltage between the interface of the two devices. Otherwise, use an ac coupling capacitor in series on each of the analog
input as shown in Figure 54 for IF applications that do not require
dc coupling. See the Memory Map section for more details.
DC to 150 MHz at 80% (default setting)
150 MHz to 250 MHz at 100%
250 MHz and higher at 160%
100
80%
100%
160%
98
96
92
90
88
86
84
80
0
50
100
150
200
250
300
ANALOG INPUT FREQUENCY (MHz)
09029-148
82
Figure 50. Buffer Current Sweeps, 2.5 V p-p, AD9467-200
Note that for sample rates less than 150 MSPS and analog inputs
less than 100 MHz, it is recommended to set the buffer current
to 0%. Depending on the input network design and frequency
band of interest, the optimum buffer current settings may be
slightly different than the input network recommendations shown
in Figure 53 and Figure 54.
3.3V
SMA
10nH 0.1µF
ADT1-1WT
0.1µF
ADT1-1WT
33Ω
INPUT
Z = 50Ω
0.1µF
0.1µF
0.1µF
33Ω
AIN+
24Ω
4.7pF
33Ω
AD9467
530Ω
24Ω
0.1µF
33Ω
0.1µF
1.8V
AIN–
16
3.5pF
ADC
INTERNAL
INPUT Z
NOTES
1. ALL CONNECTIONS AND POWER SUPPLY DECOUPLING NOT SHOWN.
Figure 51. Differential Transformer-Coupled Configuration for Baseband Applications up to 150 MHz
3.3V
SMA
10nH 0.1µF
0.1µF
ADT1-1WT
ADT1-1WT
15Ω
INPUT
Z = 50Ω
0.1µF
0.1µF
0.1µF
33Ω
AIN+
20Ω
1.8pF
33Ω
15Ω
0.1µF
AD9467
530Ω
20Ω
0.1µF
1.8V
AIN–
16
3.5pF
ADC
INTERNAL
INPUT Z
NOTES
1. ALL CONNECTIONS AND POWER SUPPLY DECOUPLING NOT SHOWN.
09029-041
SFDR (dBFS)
94
Figure 52. Differential Transformer-Coupled Configuration for IF Applications from 150 MHz to 300 MHz
C1
0.1μF
ANALOG
IN
1
2
8
7
3
6
4
R5
15Ω
R3
50Ω
R1
33Ω
R2
33Ω
5
ANAREN
BD0205F5050A00
C2
0.1μF
R7
15Ω
C6
8.2pF
3.3V
1.8V
AIN+
C3
0.1μF
R6
15Ω
C5
8.2pF
R4
50Ω
16
AD9467
AIN–
R8
15Ω
NOTES
1. ALL CONNECTIONS AND POWER SUPPLY DECOUPLING NOT SHOWN.
09029-151
•
•
•
09029-040
AD9467BCPZ-200 buffer current settings:
Figure 53. Wideband Balun-Coupled Configuration for IF Applications Up Greater Than 100 MHz
Rev. D | Page 20 of 32
Data Sheet
AD9467
3.3V
3.3V
15Ω
0.1µF
1:1
RATIO
AC
40Ω
220nH
750Ω
ADL5562
50Ω
0.1µF
15Ω
0.1µF
1.8V
20Ω
16
AD9467
5pF
0.1µF 20Ω
220nH
NOTES
1. ALL CONNECTIONS AND POWER SUPPLY DECOUPLING NOT SHOWN.
Figure 54. Wideband Differential Amplifier Input Configuration Using the ADL5562
0
AIN = –1dBFS
SNR = 73.8dBFS
SFDR = 91.1dBFS
IF = 100MHz
fS = 250MSPS
–15
AMPLITUDE (dB)
–30
–45
–60
–75
–90
*23
5
4 6
–105
09029-255
–120
–135
0
15
30
45
60
75
FREQUENCY (MHz)
90
105
120
Figure 55. Single-Tone FFT Performance Plot Using the ADL5562 Amplifier, Gain = 6 dB, and the AD9467-250
5V
5V
3.3V
1µH
1:3
0.1µF
RATIO
0.1µF
75Ω
AD5201
50Ω
14pF
AD9467
16
75Ω
0.1µF
0.1µF
1µH
33Ω
47nH
DIGITAL
INTERFACE
5V
NOTES
1. ALL CONNECTIONS AND POWER SUPPLY DECOUPLING NOT SHOWN.
09029-256
AC
0.1µF
1.8V
33Ω
47nH
Figure 56. Wideband Differential VGA Input Configuration Using the ADL5201
0
AIN = –1dBFS
SNR = 69.2dBFS
SFDR = 88.8dBFS
IF = 100MHz
fS = 250MSPS
–15
AMPLITUDE (dB)
–30
–45
–60
–75
3
–90
2 *
5
6
–105
4
09029-257
–120
–135
0
15
30
60
45
75
FREQUENCY (MHz)
90
105
120
Figure 57. Single-Tone FFT Performance Plot Using the ADL5201 VGA, Gain = 20 dB, and the AD9467-250
Rev. D | Page 21 of 32
09029-254
40Ω
AD9467
Data Sheet
CLOCK INPUT CONSIDERATIONS
Clock Duty Cycle Considerations
For optimum performance, the AD9467 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled to the CLK+ and CLK− pins
via a transformer or capacitors. These pins are biased internally
and require no additional biasing.
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9467 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9467.
Figure 58 shows a preferred method for clocking the AD9467. The
low jitter clock source is converted from a single-ended signal
to a differential signal using an RF transformer. The back-toback Schottky diodes across the secondary transformer limit
clock excursions into the AD9467 to approximately 0.8 V p-p
differential. This helps prevent the large voltage swings of the
clock from feeding through to other portions of the AD9467,
and it preserves the fast rise and fall times of the signal, which
are critical to low jitter performance.
MINI-CIRCUITS®
CLOCK INPUT
50Ω
SNR = 20 × log 10(2 × π × fA × tJ)
ADC
0.1µF
CLK–
09029-056
SCHOTTKY
DIODES:
HSM2812
Figure 58. Transformer-Coupled Differential Clock
Another option is to ac-couple a differential PECL or LVDS
signal to the sample clock input pins, as shown in Figure 59 and
Figure 60. The AD9510/AD9511/AD9512/AD9513/AD9514/
AD9515/AD9516/AD9517/AD9520/AD9522/AD9523/AD9524
family of clock drivers offers excellent jitter performance.
0.1µF
CLOCK INPUT
CLOCK INPUT
150Ω
CLK+
100Ω
PECL DRIVER
CLK–
240Ω
50Ω1
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9467.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs.
ADC
0.1µF
CLK
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 61).
240Ω
130
09029-057
50Ω1
0.1µF
CLK
0.1µF
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(fA) due only to aperture jitter (tJ) can be calculated by
CLK+
100Ω
0.1µF
Clock Jitter Considerations
RESISTORS ARE OPTIONAL.
Figure 59. Differential PECL Sample Clock
0.1µF
0.1µF
150Ω
CLK+
LVDS DRIVER
100Ω
0.1µF
CLK
ADC
RESISTORS ARE OPTIONAL.
100
16 BITS
90
14 BITS
80
12 BITS
70
10 BITS
CLK–
60
50Ω1
09029-058
50Ω1
0.1µF
CLK
CLOCK INPUT
110
SNR (dB)
CLOCK INPUT
RMS CLOCK JITTER REQUIREMENT
120
Figure 60. Differential LVDS Sample Clock
8 BITS
50
40
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
30
1
10
100
ANALOG INPUT FREQUENCY (MHz)
Figure 61. Ideal SNR vs. Input Frequency and Jitter
Rev. D | Page 22 of 32
1000
09029-061
ADT1-1WT, 1:1 Z
0.1µF
XFMR
0.1µF
Any changes to the sampling frequency require several clock
cycles to allow the internal timing to acquire and lock at the
new sampling rate.
Data Sheet
AD9467
Power Supplies
As shown in Figure 62, the power dissipated by the AD9467 is
proportional to its sample rate. The output power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
To achieve the best dynamic performance of the AD9467, it is
recommended that each power supply pin be decoupled as
closely to the package as possible with 0.1 µF, X7R or X5R type
decoupling capacitors. For optimum performance, all supplies
should be at typical values or slightly higher to accommodate
elevated temperature drifts, which depend on the application.
0.6
1.2
0.5
1.1
0.4
1.0
0.9
0.3
TOTAL POWER
IAVDD1
IAVDD2
IDRVDD
0.2
Full-Scale and Reference Options
POWER (W)
CURRENT (mA)
Power Dissipation and Power-Down Mode
0.8
0.7
0.1
09029-157
0.6
0
100 110 120 130 140 150 160 170 180 190 200 210 220
SAMPLE RATE (MSPS)
1.20
0.5
1.18
0.4
1.16
0.3
1.14
TOTAL POWER
IAVDD1
IAVDD2
IDRVDD
0.2
1.12
1.10
0.1
0
210
215
220
225
230
235
240
245
250
1.08
SAMPLE RATE (MSPS)
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or to improve gain matching
when using multiple ADCs.
The internal reference can be disabled via the SPI, allowing the
use of an external reference. See the Memory Map section for
more details. The external reference is loaded by the input of an
internal buffer amplifier having 3 pF of capacitance to ground.
There is also a 1 kΩ internal resistor in series with the input of
that buffer. The external reference must be limited to a nominal
1.25 V for an input full-scale swing of 2.5 V p-p. Additional
capacitance may be necessary to keep this pin quiet depending
on the external reference used.
POWER (W)
0.6
09029-158
CURRENT (mA)
Figure 62. Supply Current vs. fSAMPLE for fIN = 5 MHz, AD9467-200
The analog inputs support both an input full scale of 2.5 V p-p
(default) and 2.0 V p-p differentially. Choosing one full-scale
input range over the other presents some trade-offs to the user.
Using an input full scale of 2.5 V p-p yields the best SNR
performance. If system trade-offs require improved SFDR
performance, then a 2.0 V p-p input full scale should be used.
However, in this mode, SNR degrades by roughly 2 dB. Other
input full-scale ranges are available for use between 2.0 V p-p
and 2.5 V p-p. See Register 18 in Table 13 and the Memory Map
section for details.
Figure 63. Supply Current vs. fSAMPLE for fIN = 5 MHz, AD9467-250
When not using the XVREF pin, it must be tied to ground
directly or through a 0.1 µF decoupling capacitor. However,
keep this pin quiet regardless.
Digital Outputs and Timing
By asserting the power-down option via the SPI register map
(0x08[1:0]), the AD9467 is placed into power-down mode. In
this state, the ADC typically dissipates 5 mW. During power-down,
the LVDS output drivers are placed in a high impedance state.
In power-down mode, low power dissipation is achieved by
shutting down the internal reference, reference buffer, digital
output, and biasing networks. The device requires approximately 100 ms to restore full operation.
See the Memory Map section for more details on using these
features.
The AD9467 differential outputs conform to the ANSI-644 LVDS
standard on default power-up. The LVDS driver current is
derived on chip and sets the output current at each output equal
to a nominal 3.0 mA. A 100 Ω differential termination resistor
placed at the LVDS receiver inputs results in a nominal 300 mV
swing at the receiver.
The AD9467 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs for superior switching
performance in noisy environments. Single point-to-point net
topologies are recommended with a 100 Ω termination resistor
placed as close to the receiver as possible. If there is no far-end
receiver termination or there is poor differential trace routing,
timing errors may result. To avoid such timing errors, it is
recommended that the trace length be no longer than 18 inches
and that the differential output traces be kept close together and
at equal lengths. An example of the DCO and data with proper
trace length and position is shown in Figure 64.
Rev. D | Page 23 of 32
AD9467
Data Sheet
400
CLOCK
300
200
VOLTAGE (mV)
1
DCO
2
100
0
–100
–200
3
–300
DATA
5.0ns/DIV
A CH2
20.0GS/s IT 25.0pt/pt
10.0V
09029-159
–400
CH1 500mV Ω
CH2 500mV Ω
CH3 500mV Ω
–2
Figure 64. Output Timing Example in LVDS Mode (Default), AD9467-250
400
300
40
35
30
25
20
15
10
5
0
–40
0
–20
20
0
TIME (ps)
–100
40
60
Figure 66. Data Eye for LVDS Outputs in ANSI-644 Mode with 18-Inch Trace
Lengths on Standard FR-4, AD9467-250
–200
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 8.
To change the output data format to twos complement or Gray
code, see the Memory Map section.
–300
–400
–2
TIE JITTER HISTOGRAM (Hits)
2
50
100
–1
0
TIME (ns)
1
2
14
Table 8. Digital Output Coding
12
Code
65,536
32,768
32,767
0
10
8
6
4
–10
0
10
TIME (ps)
20
30
40
09029-160
2
0
–20
1
09029-161
VOLTAGE (mV)
200
0
TIME (ns)
45
TIE JITTER HISTOGRAM (Hits)
An example of the LVDS output using the ANSI-644 standard
(default) data eye and a time interval error (TIE) jitter histogram
with trace lengths of six inches on standard FR-4 material is shown
in Figure 65. It is the responsibility of the user to determine if
the waveforms meet the timing budget of the design.
–1
(VIN+) − (VIN−), Input
Span = 2.5 V p-p (V)
+1.25
0.00
−0.000038
−1.25
Digital Output Offset Binary
(D15:D0)
1111 1111 1111 1111
1000 0000 0000 0000
0111 1111 1111 1111
0000 0000 0000 0000
An output clock is provided to assist in capturing data from the
AD9467. Data is clocked out of the AD9467 and must be
captured on the rising and falling edges of the DCO that supports
double data rate (DDR) capturing. See the timing diagram
shown in Figure 2 for more information.
Figure 65. Data Eye for LVDS Outputs in ANSI-644 Mode with 6-Inch Trace
Lengths on Standard FR-4, AD9467-250
Rev. D | Page 24 of 32
Data Sheet
AD9467
There are eight digital output test pattern options available that
can be initiated through the SPI. This is a useful feature when
validating receiver capture and timing. Refer to Table 10 for the
output bit sequencing options available. Some test patterns have
two serial sequential words and can be alternated in various
ways, depending on the test pattern chosen. Note that some
patterns may not adhere to the data format select option.
The PN sequence short pattern produces a pseudorandom bit
sequence that repeats itself every 29 − 1 or 511 bits. A description of the PN sequence and how it is generated can be found
in Section 5.1 of the ITU-T 0.150 (05/96) standard. The only
difference is that the starting value must be a specific value
instead of all 1s (see Table 9 for the initial values).
The PN sequence long pattern produces a pseudorandom bit
sequence that repeats itself every 223 – 1 or 8,388,607 bits. A
description of the PN sequence and how it is generated can be
found in Section 5.6 of the ITU-T 0.150 (05/96) standard. The
only differences are that the starting value must be a specific
value instead of all 1s (see Table 9 for the initial values) and the
AD9467 inverts the bit stream with relation to the ITU standard.
Table 9. PN Sequence
Sequence
PN 9 Sequence, Short
PN 23 Sequence, Long
Initial
Value
0xFFFF
0x7FFF
Consult the Memory Map section for information on how to
change these additional digital output timing features through
the SPI.
Overrange (OR) Output Pins
The OR+ and OR− output pins indicate when an applied analog
input is above or below the input full scale of the converter.
If the analog input is in an overrange condition, the OR bit goes
high, coinciding with output data hitting above or below fullscale. The delay between the time the part actually overranges
and the OR bit going high is the pipeline latency of the part.
SPI Pins: SCLK, SDIO, CSB
For normal SPI operation, these pins should be tied to AGND
through a 100 kΩ resistor on each pin. These pins are both
1.8 V and 3.3 V tolerant. However, the SDIO output logic level
is dependent on the bias of the SPIVDD pin. For 3.3 V output
logic, tie SPIVDD to 3.3 V (AVDD2). For 1.8 V output logic, tie
SPIVDD to 1.8 V (AVDD1).
The CSB pin should be tied to AVDD1 for applications that do
not require SPI mode operation. By tying CSB high, all SCLK
and SDIO information is ignored.
First Three Output
Samples (MSB First)
0x87BE, 0xAE64, 0x929D
0x7E00, 0x807C, 0x801F
Table 10. Flexible Output Test Modes
Output Test Mode Bit Sequence
0000
0001
0010
0011
0100
0101
0110
0111
1
2
Pattern Name
Off (default)
Midscale short
+Full-scale short
−Full-scale short
Checkerboard
PN sequence long 2
PN sequence short2
One-/zero-word toggle
Digital Output Word 1
N/A 1
1000 0000 0000 0000
1111 1111 1111 1111
0000 0000 0000 0000
1010 1010 1010 1010
N/A1
N/A1
1111 1111 1111 1111
Digital Output Word 2
N/A1
Same
Same
Same
0101 0101 0101 0101
N/A1
N/A1
0000 0000 0000 0000
N/A = not applicable.
All test mode options except PN sequence short and PN sequence long can support 8- to 14-bit word lengths to verify data capture to the receiver.
Rev. D | Page 25 of 32
Subject to Data
Format Select
N/A1
Yes
Yes
Yes
No
Yes
Yes
No
AD9467
Data Sheet
SERIAL PORT INTERFACE (SPI)
The AD9467 serial port interface allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. This gives
the user added flexibility and customization, depending on the
application. Addresses are accessed via the serial port and can
be written to or read from via the port. Memory is organized
into bytes that can be further divided down into fields, as
detailed in the Memory Map section. Detailed operational
information can be found in the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
In addition to the operation modes, the SPI port configuration
influences how the AD9467 operates. When operating in 2-wire
mode, it is recommended to use a 1-, 2-, or 3-byte transfer
exclusively. Without an active CSB line, streaming mode can be
entered but not exited.
In addition to word length, the instruction phase determines if
the serial frame is a read or write operation, allowing the serial
port to be used to both program the chip and read the contents
of the on-chip memory. If the instruction is a readback operation,
performing a readback causes the SDIO pin to change from an
input to an output at the appropriate point in the serial frame.
There are three pins that define the SPI: SCLK, SDIO, and CSB
(see Table 11). The SCLK pin is used to synchronize the read
and write data presented to the ADC. The SDIO pin is a dualpurpose pin that allows data to be sent to and read from the
internal ADC memory map registers. The CSB pin is an active
low control that enables or disables the read and write cycles.
Data can be sent in MSB- or LSB-first mode. MSB-first mode
is the default at power-up and can be changed by adjusting the
configuration register. For more information about this and
other features, see the AN-877 Application Note, Interfacing to
High Speed ADCs via SPI.
Table 11. Serial Port Pins
HARDWARE INTERFACE
Pin
SCLK
The pins described in Table 11 compose the physical interface
between the programming device of the user and the serial port
of the AD9467. The SCLK and CSB pins function as inputs
when using the SPI. The SDIO pin is bidirectional, functioning as
an input during write phases and as an output during readback.
The falling edge of the CSB, in conjunction with the rising edge
of the SCLK, determines the start of the framing sequence. During
an instruction phase, a 16-bit instruction is transmitted followed by
one or more data bytes, which is determined by Bit Field W0 and
Bit Field W1. An example of the serial timing and its definitions
can be found in Figure 68 and Table 12. During normal operation,
CSB is used to signal to the device that SPI commands are to be
received and processed. When CSB is brought low, the device
processes SCLK and SDIO to process instructions. Normally,
CSB remains low until the communication cycle is complete.
However, if connected to a slow device, CSB can be brought
high between bytes, allowing older microcontrollers enough
time to transfer data into shift registers. CSB can be stalled
when transferring one, two, or three bytes of data. When W0 and
W1 are set to 11, the device enters streaming mode and continues
to process data, either reading or writing, until CSB is taken
high to end the communication cycle. This allows complete
memory transfers without requiring additional instructions.
Regardless of the mode, if CSB is taken high in the middle of a
byte transfer, the SPI state machine is reset and the device waits
for a new instruction.
1.80
1.79
1.78
1.77
1.76
1.75
1.74
1.73
1.72
0
10
20
30
40
50
60
70
80
90
NUMBER OF SDIO PINS CONNECTED TOGETHER
100
09029-074
CSB
If multiple SDIO pins share a common connection, care should
be taken to ensure that proper VOH levels are met. Assuming the
same load for each AD9467, Figure 67 shows the number of SDIO
pins that can be connected together and the resulting VOH level.
VOH (V)
SDIO
Function
Serial clock. The serial shift clock input. SCLK is used to
synchronize serial interface reads and writes.
Serial data input/output. A dual-purpose pin. The typical
role for this pin is an input or output, depending on the
instruction sent and the relative position in the timing
frame.
Chip select bar (active low). This control gates the read
and write cycles.
Figure 67. SDIO Pin Loading
This interface is flexible enough to be controlled by either serial
PROMS or PIC mirocontrollers, providing the user with an
alternative method, other than a full SPI controller, to program
the ADC (see the AN-812 Application Note).
Rev. D | Page 26 of 32
Data Sheet
AD9467
tDS
tS
tCLK
tHIGH
tDH
tH
tLOW
CSB
DON’T CARE
R/W
SDIO DON’T CARE
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DON’T CARE
09029-072
SCLK DON’T CARE
Figure 68. Serial Timing Details
Table 12. Serial Timing Definitions
Parameter
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
Timing (Minimum, ns)
5
2
40
5
2
16
16
10
tDIS_SDIO
10
Description
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the clock
Setup time between CSB and SCLK
Hold time between CSB and SCLK
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge (not shown in Figure 68)
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK rising
edge (not shown in Figure 68)
Rev. D | Page 27 of 32
AD9467
Data Sheet
MEMORY MAP
READING THE MEMORY MAP TABLE
RESERVED LOCATIONS
Each row in the memory map register table (see Table 13) has
eight address locations. The memory map is divided into three
sections: the chip configuration register map (Address 0x00
to Address 0x02), the device index and transfer register map
(Address 0xFF), and the ADC functions register map
(Address 0x08 to Address 0x107).
Undefined memory locations should not be written to except
when writing the default values suggested in this data sheet.
Addresses that have values marked as 0 should be considered
reserved and have a 0 written into their registers during power-up.
DEFAULT VALUES
When the AD9467 comes out of a reset, critical registers are
preloaded with default values. These values are indicated in
Table 13, where an X refers to an undefined feature.
The leftmost column of the memory map indicates the register
address number, and the default value is shown in the second rightmost column. The (MSB) Bit 7 column is the start of the default
hexadecimal value given. For example, Address 0x2C, the analog
input register, has a default value of 0x00, meaning Bit 7 = 0,
Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and
Bit 0 = 0, or 0000 0000 in binary. This setting is the default for an
ac-coupled analog input condition. By writing a 1 to Bit 2 of this
address, the internal input common-mode buffer is disabled
allowing a dc-coupled input for which the input common mode
voltage can be set externally. For more information on this and
other functions, consult the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Table 13. Memory Map Register 1
Addr.
(MSB)
(Hex)
Parameter Name Bit 7
Chip Configuration Register
00
chip_port_config X
01
chip_id
02
chip_grade
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
(LSB)
Bit 0
LSB first
1 = on
0 = off
(default)
Soft
reset
1 = on
0 = off
(default)
1
1
X
X
X
8-Bit Chip ID Bits[7:0]
(AD9467 = 0x50, default)
X
Device Index and Transfer Register
FF
device_update
X
Child ID Bits[6:4]
(identify device variants of chip ID)
001 = 200 MSPS
010 = 250 MSPS
X
X
X
Default
Value
(Hex)
0x18
Read
only
X
X
X
X
Read
only
X
X
X
SW
transfer
1 = on
0 = off
(default)
0x00
Rev. D | Page 28 of 32
Default Notes/
Comments
The nibbles
should be
mirrored so
that LSB- or
MSB-first mode
is set correctly
regardless of
shift mode.
Default is
unique chip ID,
different for
each device.
This is a readonly register.
Child ID used to
differentiate
graded devices.
Synchronously
transfers data
from the
master shift
register to the
slave.
Data Sheet
AD9467
Addr.
(Hex)
Parameter Name
ADC Functions
08
modes
(MSB)
Bit 7
Bit 6
Bit 5
X
X
0D
test_io
X
X
0F
adc_input
XVREF
1 = on
0 = off
(default)
X
10
offset
14
output_mode
X
0
15
output_adjust
X
X
16
output_phase
X
18
vref
DCO
output
invert
1 = on
0 = off
(default)
X
Internal powerdown mode
00 = chip run
(default)
01 = full powerdown
Output test mode—see Table 10 in the
Reset PN Reset PN
Digital Outputs and Timing section
short gen
long
0000 = off (default)
1 = on
gen
0001 = midscale short
0 = off
1 = on
0010 = +FS short
(default)
0 = off
0011 = −FS short
(default)
0100 = checkerboard output
0101 = PN 23 sequence
0110 = PN 9 sequence
0111 = one-/zero-word toggle
Analog
X
X
X
X
X
disconnect
1 = on
0 = off
(default)
8-bit digital offset adjustment
0111 1111 = 127
0111 1110 = 126
…
0000 0010 = 2
0000 0001 = 1
0000 0000 = 0
1111 1111 = -1
1111 1110 = -2
…
1000 0001 = -126
1000 0000 = -127
Data format
Output
Digital
1
X
select
invert
output
1 = on
disable
00 = offset
0 = off
binary (default)
1 = on
(default)
0 = off
01 = twos
(default)
complement
10 = Gray code
Coarse
Output current drive adjust
X
X
LVDS
001 = 3.0 mA (default)
adjust
010 = 2.79 mA
0=
011 = 2.57 mA
3.0 mA
100 = 2.35 mA
(default)
101 = 2.14 mA
1=
110 = 1.93 mA
1.71 mA
111 = 1.71 mA
X
X
X
X
X
X
X
X
X
Bit 4
X
Bit 3
X
X
Bit 2
Bit 1
(LSB)
Bit 0
X
Input full-scale range adjust
0000 = 2.0 V p-p
0110 = 2.1 V p-p
0111 = 2.2 V p-p
1000 = 2.3 V p-p
1001 = 2.4 V p-p
1010 = 2.5 V p-p (default)
Rev. D | Page 29 of 32
Default
Value
(Hex)
Default Notes/
Comments
0x00
Determines
various generic
modes of chip
operation.
0x00
When this
register is set,
the test data is
placed on the
output pins in
place of normal
data.
0x00
Analog input
functions.
0x00
Bipolar, twos
complement
digital offset
adjustment in
LSBs.
0x08
Configures the
outputs and
the format of
the data.
0x00
Determines
LVDS or other
output
properties.
0x00
Determines
digital clock
output phase.
0x0A
AD9467
Addr.
(Hex)
2C
Parameter Name
analog_input
36
Buffer Current
Select 1
107
Buffer Current
Select 2
1
Data Sheet
(MSB)
Bit 7
X
Bit 6
X
Bit 5
X
Bit 4
X
Bit 3
X
110101 = +530%
110100 = +520%
…
001000 = +80% (default)
…
000010 = +20%
000001 = +10%
000000 = nominal, 0%
111111 = −10%
111110 = −20%
…
110111 = −90%
110110 = −100%
110101 = +530%
110100 = +520%
…
001000 = +80% (default)
…
000010 = +20%
000001 = +10%
000000 = nominal, 0%
111111 = −10%
111110 = −20%
…
110111 = −90%
110110 = −100%
X = undefined feature, don’t write.
Rev. D | Page 30 of 32
Bit 2
Input
coupling
mode
0 = ac
coupling
(default)
1 = dc
coupling
Bit 1
X
(LSB)
Bit 0
X
Default
Value
(Hex)
0x00
1
0
0x22
X
X
0x20
Default Notes/
Comments
Determines the
input coupling
mode.
Data Sheet
AD9467
Power and Ground Recommendations
Exposed Paddle Thermal Heat Slug Recommendations
When connecting power to the AD9467, it is recommended
that three separate supplies be used: one for analog AVDD1 and
AVDD3 (1.8 V), one for analog AVDD2 (3.3 V), and one for
digital output drivers DRVDD (1.8 V). If only one 1.8 V supply
is available, it should be routed to AVDD1 and AVDD3 first and
then tapped off and isolated with a ferrite bead or a filter choke
preceded by decoupling capacitors for the DRVDD. The user
can employ several different decoupling capacitors to cover
both high and low frequencies. These should be located close to
the point of entry at the PC board level and close to the parts,
with minimal trace lengths.
It is required that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9467. An
exposed continuous copper plane on the PCB should be connected to the AD9467 exposed paddle, Pin 0. The copper plane
should have several vias to achieve the lowest possible resistive
thermal path for heat dissipation to flow through the bottom of
the PCB. These vias should be solder-filled or plugged.
A single PC board ground plane should be sufficient when
using the AD9467. With proper decoupling and smart partitioning of the PC board’s analog, digital, and clock sections,
optimum performance can be easily achieved.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
several tie points between the ADC and PCB during the reflow
process, whereas using one continuous plane with no partitions
only guarantees one tie point. See Figure 69 for a PCB layout
example. For detailed information on packaging and the PCB
layout of chip scale packages, see the AN-772 Application Note,
A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
09029-073
SILKSCREEN PARTITION
PIN 1 INDICATOR
Figure 69. Typical PCB Layout
Rev. D | Page 31 of 32
AD9467
Data Sheet
OUTLINE DIMENSIONS
10.10
10.00 SQ
9.90
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
55
54
72
1
PIN 1
INDICATOR
PIN 1
INDICATOR
9.85
9.75 SQ
9.65
0.50
BSC
0.50
0.40
0.30
18
37
BOTTOM VIEW
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
0.25 MIN
8.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
06-25-2012-C
1.00
0.85
0.80
19
36
TOP VIEW
12° MAX
8.60
8.50 SQ
8.40
EXPOSED
PAD
Figure 70. 72-Lead Lead Frame Chip Scale Package, Exposed Pad [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9467BCPZ-200
AD9467BCPZRL7-200
AD9467BCPZ-250
AD9467BCPZRL7-250
AD9467-200EBZ
AD9467-250EBZ
AD9467-FMC-250EBZ
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
72-Lead LFCSP_VQ
AD9467-200 Evaluation Board
AD9467-250 Evaluation Board
AD9467-250 Native FMC Card
Z = RoHS Compliant Part.
©2010–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09029-0-2/13(D)
Rev. D | Page 32 of 32
Package Option
CP-72-5
CP-72-5
CP-72-5
CP-72-5