Product Folder Order Now Support & Community Tools & Software Technical Documents DLPC230-Q1 DLPS127 – MAY 2018 DLPC230-Q1 Automotive DMD Controller 1 Features 2 Applications • • • • • • • • • • • Wide Field of View and Augmented Reality Head-up Display (HUD) High Resolution Headlight • 3 Description The DLPC230-Q1 DMD Display Controller for automotive applications is part of two DMD chipsets: DLP5530-Q1 (interior applications, such as HUD) and DLP5531-Q1 (exterior applications, such as high resolution headlight). Both chipsets include a 0.55” DMD and the TPS99000-Q1 System Management and Illumination controller. The DLPC230-Q1 integrates an embedded processor with error code correction, enabling host control and real-time feedback, on-chip diagnostics, and system monitoring functions. On-chip SRAM is included to remove the need for external DRAM. Combined with the TPS99000-Q1, the DLPC230-Q1 supports high dynamic range dimming of over 5000:1 for HUD applications. Sub-LVDS 600-MHz DMD interface allows high DMD refresh rates to generate seamless and brilliant digital images, while simultaneously reducing radiated emissions. Device Information(1) PART NUMBER DLPC230-Q1 PACKAGE BGA (324) BODY SIZE (NOM) 23.00 × 23.00 mm2 (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Standalone System VBATT Power Regulation Control & Monitor TPS99000-Q1 PROJ_ON 1.1V 1.8V 3.3V 6.5V Power sequencing and monitoring Reset & Power Good I2C HOST IRQ System Diagnostics: external watchdogs, over brightness, and other monitors DLPC230-Q1 Host SPI MPU SPI Internal Control Illumination Control & feedback Flash SPI 6.5V Ultra wide dimming LED Controller 2-TIA, 12bit ADC DAC, FET Drive, ... DMD Power Regulation OpenLDI 24-bit RGB & Syncs External Monitor SPI Image Scaling & Bezel adjustment LED drive LED Control FET Drive F E T s GPIO (configurable) eSRAM frame buffer Sub-LVDS TMP411 I2C DMD Power Photodiode DLP553X-Q1 0.55 s450 1.3MP DMD Copyright © 2018, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B DMD Display Controller Supporting: – DLP5530-Q1 Automotive Interior Chipset – DLP5531-Q1 Automotive Exterior Chipset Video Processing – Scales Input Image to Match DMD Resolution – Bezel Adjustment up ±50% Vertical Image Position and ±10% Horizontal Reducing the Need for Mechanical Alignment – Support for Pixel Doubling or Quadrupling to Allow Low Resolution Video Input – Gamma Correction Embedded Processor With Error Correction – On-Chip Diagnostic and Self-Test Capability – System Diagnostics Including Temperature Monitoring, Device Interface Monitoring, and Photodiode Monitoring – Integrated Management of Smooth Dimming – Configurable GPIO No External RAM Required, Internal SRAM for Image Processing 600-MHz Sub-LVDS DMD Interface for Low Power and Emission Spread Spectrum Clocking for Reduced EMI Video Input Interface – Single OpenLDI (FPD-Link I) Port up to 110 MHz – 24-bit RGB Parallel Interface up to 110 MHz Configurable Host Control Interface – Serial Peripheral Interface (SPI) 10 MHz – I2C (400 kHz) – Host IRQ Signal to Provide Real-Time Feedback for Critical System Errors Interface to TPS99000-Q1 System Management and Illumination Controller Flash 1 DLPC230-Q1 DLPS127 – MAY 2018 www.ti.com 4 Device and Documentation Support 4.1 Device Support 4.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 4.1.2 Device Nomenclature 4.1.2.1 Device Markings ADVANCE INFORMATION Line 1 Line 2 Line 3 Marking Definitions: Line 1: TI Part Number: Engineering Samples TI Part Number: Production X = Engineering Samples DLPC230 = Device ID blank or A, B, C ... = Part Revision T = Temperature designator ZDQ = Package designator Q1 = Automotive qualified DLPC230 = Device ID blank or A, B, C ... = Part Revision T = Temperature designator ZDQ = Package designator Q1 = Automotive qualified Line 2: Vendor Lot and Fab Information XXXXX = Fab lot number -XX = Fab sub-lot X (last X) = Assembly sub-lot The Fab is UMC12A. As such, the first character of the lot number is K Line 3: Vendor Year and Week code YY = Year WW = Week Example, 1614 - parts built the 14th week of 2016 4.2 Trademarks All trademarks are the property of their respective owners. 2 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: DLPC230-Q1 DLPC230-Q1 www.ti.com DLPS127 – MAY 2018 4.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information ADVANCE INFORMATION The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: DLPC230-Q1 3 PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DLPC230TZDQQ1 PREVIEW BGA ZDQ 324 25 TBD Call TI Call TI -40 to 105 XDLPC230TZDQQ1 ACTIVE BGA ZDQ 324 1 TBD Call TI Call TI -40 to 105 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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