TI1 BUF20800 Programmable gamma-voltage generator and high slew rate vcom with integrated two-bank memory Datasheet

BU
BUF08832
F08
832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
Programmable Gamma-Voltage Generator and
High Slew Rate VCOM with Integrated Two-Bank Memory
Check for Samples: BUF08832
FEATURES
DESCRIPTION
•
•
•
•
•
•
The BUF08832 offers eight programmable gamma
channels and one programmable VCOM channel.
1
23
•
•
•
•
•
10-BIT RESOLUTION
8-CHANNEL P-GAMMA
1-CHANNEL P-VCOM
HIGH SLEW RATE VCOM: 45V/μs
16x REWRITABLE NONVOLATILE MEMORY
TWO INDEPENDENT PIN-SELECTABLE
MEMORY BANKS
RAIL-TO-RAIL OUTPUT
– 300mV Min Swing-to-Rail (10mA)
– > 300mA Max IOUT
LOW SUPPLY CURRENT
SUPPLY VOLTAGE: 9V to 20V
DIGITAL SUPPLY: 2V to 5.5V
TWO-WIRE INTERFACE: Supports 400kHz and
3.4MHz
TFT-LCD REFERENCE DRIVERS
Digital
(2.0V to 5.5V)
BKSEL
The BUF08832 has two separate memory banks,
allowing simultaneous storage of two different gamma
curves to facilitate switching between gamma curves.
All gamma and VCOM channels offer a rail-to-rail
output that typically swings to within 150mV of either
supply rail with a 10mA load. All channels are
programmed using a Two-Wire interface that
supports standard operations up to 400kHz and
high-speed data transfers up to 3.4MHz.
The BUF08832 is manufactured using Texas
Instruments’ proprietary, state-of-the-art, high-voltage
CMOS process. This process offers very dense logic
and high supply voltage operation of up to 20V. The
BUF08832 is offered in a HTSSOP-20 PowerPAD™
package, and is specified from –40°C to +85°C.
APPLICATIONS
•
The final gamma and VCOM values can be stored in
the on-chip, nonvolatile memory. To allow for
programming errors or liquid crystal display (LCD)
panel rework, the BUF08832 supports up to 16 write
operations to the on-chip memory.
Analog
(9V to 20V)
BUF08832
1
RELATED PRODUCTS
OUT1
DAC Registers
¼
¼
¼
¼
¼
DAC Registers
16x Nonvolatile Memory BANK0
16x Nonvolatile Memory BANK1
OUT2
OUT7
OUT8
FEATURES
PRODUCT
22-Channel Gamma Correction Buffer
BUF22821
16-Channel Gamma Correction Buffer
BUF16821
12-Channel Gamma Correction Buffer
BUF12800
18-/20-Channel Programmable Buffer, 10-Bit, VCOM
BUF20800
18-/20-Channel Programmable Buffer with Memory
BUF20820
Programmable VCOM Driver
BUF01900
18V Supply, Traditional Gamma Buffers
BUF11704
22V Supply, Traditional Gamma Buffers
BUF11705
VS (VCOM)
VCOM
GND (VCOM)
VCOM-FB
SDA
SCL
Control IF
A0
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
(1)
PRODUCT
PACKAGE
PACKAGE DESIGNATOR
PACKAGE MARKING
BUF08832
HTSSOP-20
PWP
BUF08832
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
BUF08832
UNIT
Supply Voltage
VS
+22
V
Supply Voltage
VSD
+6
V
Digital Input Pins, SCL, SDA, AO, BKSEL: Voltage
–0.5 to +6
V
Digital Input Pins, SCL, SDA, AO, BKSEL: Current
±10
mA
(V–) – 0.5 to (V+) + 0.5
V
Output Pins, OUT1 through OUT16, VCOM1 and VCOM2 (2)
Output Short-Circuit (3)
Continuous
Ambient Operating Temperature
–65 to +150
°C
+125
°C
Human Body Model
HBM
4000
V
Charged Device Model
CDM
1000
V
MM
200
V
Junction Temperature
Machine Model
(1)
(2)
(3)
2
°C
TJ
Ambient Storage Temperature
ESD Rating
–40 to +95
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
See the Output Protection section.
Short-circuit to ground, one amplifier per package.
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.
At TA = +25°C, VS = +18V, VSD = +2V, and CL = 200pF, unless otherwise noted.
BUF08832
PARAMETER
CONDITIONS
MIN
TYP
17.7
17.85
MAX
UNIT
ANALOG GAMMA BUFFER CHANNELS
Reset Value
Code 512
9
OUT 1, 8 Output Swing: High
Code = 1023, Sourcing 10mA
OUT 1, 8 Output Swing: Low
Code = 0, Sinking 10mA
OUT 2-7 Output Swing: High
Code = 1023, Sourcing 10mA
OUT 2-7 Output Swing: Low
Code = 0, Sinking 10mA
VCOM Output Swing: High (1)
Sourcing/Sinking 400mA, G = 2
VCOM Output Swing: Low (1)
Sourcing/Sinking 400mA, G = 2
3.8
RLOAD = 60Ω, CLOAD = 100pF
45
VCOM Slew Rate (2)
Continuous Output Current
Note
Output Accuracy (4)
17.5
17.85
0.07
14
(3)
V
0.3
V
V
0.5
15.3
V
V
5
V
V/μs
30
mA
VCOM, codes 0 - 960; OUT 1 - 8, codes 0 - 1023
±20
Code 512
±25
μV/°C
vs Temperature
Integral Nonlinearity (4)
0.07
V
±50
mV
INL
0.3
LSB
Differential Nonlinearity (4)
DNL
0.3
LSB
Load Regulation, 10mA
REG
Code 512 or VCC/2, IOUT = +5mA to –5mA Step
0.5
1.5
mV/mA
16
Cycles
OTP MEMORY
Number of OTP Write Cycles
Memory Retention
100
Years
ANALOG POWER SUPPLY
Operating Range
Total Analog Supply Current
9
IS
Outputs at Reset Values, No Load
8.5
Over Temperature
20
V
11
mA
11
mA
DIGITAL
Logic 1 Input Voltage
VIH
Logic 0 Input Voltage
VIL
Logic 0 Output Voltage
0.7 × VSD
VOL
ISINK = 3mA
Input Leakage
Clock Frequency
V
0.3 × VSD
fCLK
V
0.15
0.4
V
±0.01
±10
μA
Standard/Fast Mode
400
kHz
High-Speed Mode
3.4
MHz
DIGITAL POWER SUPPLY
Operating Range
Digital Supply Current (3)
VSD
ISD
2.0
Outputs at Reset Values, No Load, Two-Wire Bus Inactive
115
Over Temperature
5.5
V
180
μA
μA
115
TEMPERATURE RANGE
Specified Range
Junction Temperature < +125°C
Operating Range
Storage Range
Thermal Resistance (3)
(2)
(3)
(4)
(5)
+85
°C
–40
+95
°C
–65
+150
°C
θJA
HTSSOP-20
(1)
–40
See Note
(5)
40
°C/W
The BUF08832 VCOM DAC limits can be programmed. These default limits apply if the device is not programmed. See the
Programmable VCOM Limit Section.
See Figure 12, Large-Signal Step Response, VCOM.
Observe maximum power dissipation.
The VCOM output voltage is limited to codes 0 through 960; see Figure 3. This limitation is for VCOM only and does not affect DAC OUT,
1 through 8.
Thermal pad attached to printed circuit board (PCB), 0lfm airflow, and 76mm × 76mm copper area.
Copyright © 2009–2011, Texas Instruments Incorporated
3
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
PIN CONFIGURATION
PWP PACKAGE
HTSSOP-20
(TOP VIEW)
VCOM
1
20
VCOM-FB
(1)
GNDA
2
19
VS
OUT1
3
18
OUT8
17
OUT7
16
OUT6
15
OUT5
14
GNDA
PowerPAD
Lead-Frame
Die Pad
Exposed on
Underside
(must connect to
GNDA and GNDD)
OUT2
4
OUT3
5
OUT4
6
VS
7
VSD
8
13
GNDD
SCL
9
12
BKSEL
SDA
10
11
A0
(1)
(1)
NOTE: (1) GNDA and GNDD must be connected together.
PIN DESCRIPTIONS
4
PIN #
NAME
1
VCOM
VCOM
DESCRIPTION
2
GNDA
Analog ground; must be connected to digital ground (GNDD).
3
OUT1
DAC output 1
4
OUT2
DAC output 2
5
OUT3
DAC output 3
6
OUT4
DAC output 4
7
VS
VS connected to analog supply
8
VSD
Digital supply; connect to logic supply
9
SCL
Serial clock input; open-drain, connect to pull-up resistor.
10
SDA
Serial data I/O; open-drain, connect to pull-up resistor.
11
A0
12
BKSEL
Selects memory bank 0 or 1; connect to either logic 1 to select bank 1 or logic 0 to select bank 0.
13
GNDD
Digital ground; must be connected to analog ground at the BUF08832.
14
GNDA
Analog ground; must be connected to digital ground (GNDD).
15
OUT5
DAC output 5
16
OUT6
DAC output 6
17
OUT7
DAC output 7
18
OUT8
DAC output 8
19
VS
20
VCOM-FB
A0 address pin for Two-Wire address; connect to either logic 1 or logic 0. See Table 1.
VS connected to analog supply
VCOM feedback
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +18V, VSD = +2V, RL = 1.5kΩ connected to ground, and CL = 200pF, unless otherwise noted.
OUTPUT VOLTAGE vs OUTPUT CURRENT
(VCOM)
OUTPUT VOLTAGE vs OUTPUT CURRENT
(Channels 1–8)
20
18
Output Voltage (V)
Output Voltage (V)
16
14
12
10
8
6
4
2
0
0
50
100
150
200
250
250
250
18.0
17.5
17.0
16.5
16.0
15.5
15.0
3.0
2.5
2.0
1.5
1.0
0.5
0
Output Swing High
Output Swing Low
400
0
25
50
Output Current (mA)
75
Figure 1.
150
Figure 2.
VCOM OUTPUT VOLTAGE vs CODE
ANALOG SUPPLY CURRENT HISTOGRAM
20
1200
Code 960
18
1000
16
14
Occurrence
Output Voltage (V)
125
100
Output Current (mA)
12
10
8
800
600
400
6
4
200
VCOM output voltage limited to
codes 0 through 960.
2
0
0
0
128
256
384
512
640
768
896
1024
7.0
7.5
8.0
8.5
9.0
9.5
10.0
Analog Supply Current (mA)
Code
Figure 3.
Figure 4.
ANALOG SUPPLY CURRENT vs TEMPERATURE
OUTPUT VOLTAGE vs TEMPERATURE
11.0
9.020
10.5
9.015
10.0
9.010
Initial Voltage (V)
Analog Supply Current (mA)
10 Typical Units Shown
9.5
9.0
8.5
8.0
9.005
9.000
8.995
7.5
8.990
7.0
8.985
6.5
8.980
-50
-25
0
25
50
75
Temperature (°C)
Figure 5.
Copyright © 2009–2011, Texas Instruments Incorporated
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Figure 6.
5
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +18V, VSD = +2V, RL = 1.5kΩ connected to ground, and CL = 200pF, unless otherwise noted.
DIGITAL SUPPLY CURRENT vs TEMPERATURE
DIFFERENTIAL LINEARITY ERROR
120
0.15
0.10
116
114
Error (LSB)
Digital Supply Current (mA)
118
112
110
108
0.05
0
-0.05
106
104
-0.10
102
100
-0.15
-50
-25
0
25
50
75
100
0
125
256
512
768
1024
Input Code
Temperature (°C)
Figure 7.
Figure 8.
INTEGRAL LINEARITY ERROR
BKSEL SWITCHING TIME DELAY
0.15
0.10
Error (LSB)
BKSEL (2V/div)
0.05
780ms
0
9V
-0.05
DAC Channel
(2V/div)
-0.10
5V
-0.15
0
256
512
768
1ms/div
1024
Input Code
Figure 10.
LARGE-SIGNAL STEP RESPONSE
LARGE-SIGNAL STEP RESPONSE, VCOM
Output Voltage (2V/div)
Output Voltage (3V/div)
Figure 9.
6
Time (2ms/div)
Time (1ms/div)
Figure 11.
Figure 12.
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
APPLICATION INFORMATION
GENERAL
The BUF08832 programmable voltage reference
allows fast and easy adjustment of eight
programmable gamma reference outputs and a VCOM
output, each with 10-bit resolution. The BUF08832 is
programmed through a high-speed, Two-Wire
interface. The final gamma and VCOM values can be
stored in the onboard, nonvolatile memory. To allow
for programming errors or liquid crystal display (LCD)
panel rework, the BUF08832 supports up to 16 write
operations to the onboard memory. The BUF08832
has two separate memory banks, allowing
simultaneous storage of two different gamma curves
to facilitate dynamic switching between gamma
curves.
The BUF08832 can be powered using an analog
supply voltage from 9V to 20V, and a digital supply
from 2V to 5.5V. The digital supply must be applied
before the analog supply to avoid excessive current
and power consumption, or possibly even damage to
the device if left connected only to the analog supply
for extended periods of time. See Figure 13 and
Figure 14 for typical configurations of the BUF08832.
TWO-WIRE BUS OVERVIEW
The
BUF08832
communicates
over
an
industry-standard, two-wire interface to receive data
in slave mode. This model uses a two-wire,
open-drain interface that supports multiple devices on
a single bus. Bus lines are driven to a logic low level
only. The device that initiates the communication is
called a master, and the devices controlled by the
master are slaves. The master generates the serial
clock on the clock signal line (SCL), controls the bus
access, and generates the START and STOP
conditions.
To address a specific device, the master initiates a
START condition by pulling the data signal line (SDA)
from a HIGH to a LOW logic level while SCL is HIGH.
All slaves on the bus shift in the slave address byte
on the rising edge of SCL, with the last bit indicating
whether a read or write operation is intended. During
the ninth clock pulse, the slave being addressed
responds to the master by generating an
Acknowledge and pulling SDA LOW.
Data transfer is then initiated and eight bits of data
are sent, followed by an Acknowledge bit. During
data transfer, SDA must remain stable while SCL is
HIGH. Any change in SDA while SCL is HIGH is
interpreted as a START or STOP condition.
Once all data have been transferred, the master
generates a STOP condition, indicated by pulling
SDA from LOW to HIGH while SCL is HIGH. The
BUF08832 can act only as a slave device; therefore,
it never drives SCL. SCL is an input only for the
BUF08832.
ADDRESSING THE BUF08832
The address of the BUF08832 is 111010x, where x is
the state of the A0 pin. When the A0 pin is LOW, the
device acknowledges on address 74h (1110100). If
the A0 pin is HIGH, the device acknowledges on
address 75h (1110101). Table 1 shows the A0 pin
settings and BUF08832 address options.
Other valid addresses are possible through a simple
mask change. Contact your TI representative for
information.
Table 1. Quick Reference of BUF08832 Addresses
DEVICE/COMPONENT
BUF08832 ADDRESS
ADDRESS
A0 pin is LOW
(device acknowledges on address 74h)
1110100
A0 pin is HIGH
(device acknowledges on address 75h)
1110101
Table 2. Quick Reference of Command Codes
COMMAND
CODE
General-Call Reset
Address byte of 00h followed by a data byte of 06h.
High-Speed Mode
00001xxx, with SCL ≤ 400kHz; where xxx are bits unique to the Hs-capable master. This
byte is called the Hs master code.
Copyright © 2009–2011, Texas Instruments Incorporated
7
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
150W(1)
1.2kW(1)
34W(2)
Panel
BUF08832
1
VCOM
2
GNDA(3)
VCOM-FB
20
VS(4)
19
100nF
(5)
OUT1
OUT8
18
4
OUT2
OUT7
17
(5)
(5)
(5)
5
OUT3
OUT6
16
6
OUT4
OUT5
15
7
VS(4)
GNDA(3)
14
8
VSD
GNDD(3)
13
9
SCL
BKSEL
12
10
SDA
A0
11
(5)
VS
3.3V
1mF
VS
(5)
3
(5)
Source
Driver
10mF
Source
Driver
(5)
100nF
Timing
Controller
(1)
Values must be selected for the panel used.
(2)
Values must be selected for good phase margin when driving large capacitive loads.
(3)
GNDA and GNDD must be connected together.
(4)
Pins 7 and 19 are VS. The one set of capacitors shown on pin 19 are common to both pins.
(5)
RC combination for the OUT pins is not recommended; see the Output Protection section.
Figure 13. Typical Application Configuration (VCOM with Feedback)
8
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
BUF08832
1
VCOM
2
GNDA(1)
VCOM-FB
20
VS(2)
19
100nF
(3)
OUT1
OUT8
18
4
OUT2
OUT7
17
(3)
(3)
(3)
5
OUT3
OUT6
16
6
OUT4
OUT5
15
7
VS(4)
GNDA(1)
14
8
VSD
GNDD(1)
13
9
SCL
BKSEL
12
10
SDA
A0
11
(3)
VS
3.3V
1mF
VS
(3)
3
(3)
Source
Driver
10mF
Source
Driver
(3)
100nF
Timing
Controller
(1)
GNDA and GNDD must be connected together.
(2)
Pins 7 and 19 are VS. The one set of capacitors shown on pin 19 are common to both pins.
(3)
RC combination for the OUT pins is not recommended; see the Output Protection section.
Figure 14. Typical Application Configuration (VCOM without Feedback)
Copyright © 2009–2011, Texas Instruments Incorporated
9
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
DATA RATES
OUTPUT VOLTAGE
The two-wire bus operates in one of three speed
modes:
• Standard: allows a clock frequency of up to
100kHz;
• Fast: allows a clock frequency of up to 400kHz;
and
• High-speed mode (also called Hs mode): allows a
clock frequency of up to 3.4MHz.
Buffer output values are determined by the analog
supply voltage (VS) and the decimal value of the
binary input code used to program that buffer. The
value is calculated using Equation 1:
CODE10
VOUT = VS ´
1024
The BUF08832 is fully compatible with all three
modes. No special action is required to use the
device in Standard or Fast modes, but High-speed
mode must be activated. To activate High-speed
mode, send a special address byte of 00001 xxx, with
SCL ≤ 400kHz, following the START condition; where
xxx are bits unique to the Hs-capable master, which
can be any value. This byte is called the Hs master
code. Table 2 provides a reference for the
High-speed mode command code. (Note that this
configuration is different from normal address
bytes—the low bit does not indicate read/write
status.) The BUF08832 responds to the High-speed
command regardless of the value of these last three
bits. The BUF08832 does not acknowledge this byte;
the
communication
protocol
prohibits
acknowledgment of the Hs master code. Upon
receiving a master code, the BUF08832 switches on
its Hs mode filters, and communicates at up to
3.4MHz. Additional high-speed transfers may be
initiated without resending the Hs mode byte by
generating a repeat START without a STOP. The
BUF08832 switches out of Hs mode with the next
STOP condition.
GENERAL-CALL RESET AND POWER-UP
The BUF08832 responds to a General-Call Reset,
which is an address byte of 00h (0000 0000) followed
by a data byte of 06h (0000 0110). The BUF08832
acknowledges both bytes. Table 2 provides a
reference for the General-Call Reset command code.
Upon receiving a General-Call Reset, the BUF08832
performs a full internal reset, as though it had been
powered off and then on. It always acknowledges the
General-Call address byte of 00h (0000 0000), but
does not acknowledge any General-Call data bytes
other than 06h (0000 0110).
When the BUF08832 powers up, it automatically
performs a reset. As part of the reset, the BUF08832
is configured for all outputs to change to the last
programmed nonvolatile memory values, or
1000000000 if the nonvolatile memory values have
not been programmed.
10
(1)
The BUF08832 outputs are capable of a full-scale
voltage output change in typically 5μs; no
intermediate steps are required.
UPDATING THE DAC OUTPUT VOLTAGES
Because the BUF08832 features a double-buffered
register structure, updating the digital-to-analog
converter (DAC) and/or the VCOM register is not the
same as updating the DAC and/or VCOM output
voltage. There are two methods for updating the
DAC/VCOM output voltages.
Method 1: Method 1 is used when it is desirable to
have the DAC/VCOM output voltage change
immediately after writing to a DAC register. For each
write transaction, the master sets data bit 15 to a '1'.
The DAC/VCOM output voltage update occurs after
receiving the 16th data bit for the currently-written
register.
Method 2: Method 2 is used when it is desirable to
have all DAC/VCOM output voltages change at the
same time. First, the master writes to the desired
DAC/VCOM channels with data bit 15 a '0'. Then,
when writing the last desired DAC/VCOM channel, the
master sets data bit 15 to a '1'. All DAC/VCOM
channels are updated at the same time after
receiving the 16th data bit.
NONVOLATILE MEMORY
BKSEL Pin
The BUF08832 has 16x rewrite capability of the
nonvolatile memory. Additionally, the BUF08832 has
the ability to store two distinct gamma curves in two
different nonvolatile memory banks, each of which
has 16x rewrite capability. One of the two available
banks is selected using the external input pin,
BKSEL. When this pin is low, BANK0 is selected;
when this pin is high, BANK1 is selected.
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
When the BKSEL pin changes state, the BUF08832
acquires the last programmed DAC/VCOM values from
the nonvolatile memory associated with this newly
chosen bank. At power-up, the state of the BKSEL
pin determines which memory bank is selected.
The I2C master also has the ability to update
(acquire) the DAC registers with the last programmed
nonvolatile memory values using software control.
The bank to be acquired depends on the state of
BKSEL.
General Acquire Command
A general acquire command is used to update all
registers and DAC/VCOM outputs to the last
programmed values stored in nonvolatile memory. A
single-channel acquire command updates only the
register and DAC/VCOM output of the DAC/VCOM
corresponding to the DAC/VCOM address used in the
single-channel acquire command.
These are the steps of the sequence to initiate a
general channel acquire:
1. Be sure BKSEL is in its desired state and has
been stable for at least 1ms.
2. Send a START condition on the bus.
3. Send the appropriate device address (based on
A0) and the read/write bit = LOW. The BUF08832
acknowledges this byte.
4. Send a DAC/VCOM pointer address byte. Set bit
D7 = 1 and D6 = 0. Bits D5-D0 are any valid
DAC/VCOM address. Although the BUF08832
acknowledges 000000 through 010111, it stores
and returns data only from these addresses:
– 000000 through 000111
– 010010
It returns 0000 for reads from 001000 through
010001, and 010011 through 010111. See
Table 4 for valid DAC/VCOM addresses.
5. Send a STOP condition on the bus.
Approximately 750μs (±80μs) after issuing this
command, all DAC/VCOM registers and DAC/VCOM
output voltages change to the respective, appropriate
nonvolatile memory values.
xxx
xxx
Single-Channel Acquire Command
These are the steps to initiate a single-channel
acquire:
1. Be sure BKSEL is in its desired state and has
been stable for at least 1ms.
2. Send a START condition on the bus.
3. Send the device address (based on A0) and
read/write bit = LOW. The BUF08832
acknowledges this byte.
4. Send a DAC/VCOM pointer address byte using the
DAC/VCOM address corresponding to the output
and register to update with the OTP memory
value. Set bit D7 = 0 and D6 = 1. Bits D5-D0 are
the DAC/VCOM address. Although the BUF08832
acknowledges 000000 through 010111, it stores
and returns data only from these addresses:
– 000000 through 000111
– 010010
It returns 0000 reads from 001000 through
010001, and 010011 through 010111. See
Table 4 for valid DAC/VCOM addresses.
5. Send a STOP condition on the bus.
Approximately 36μs (±4μs) after issuing this
command, the specified DAC/VCOM register and
DAC/VCOM output voltage change to the appropriate
memory value.
MaxBank
The BUF08832 can provide the user with the number
of times the nonvolatile memory of a particular
DAC/VCOM channel nonvolatile memory has been
written to for the current memory bank. This
information is provided by reading the register at
pointer address 111111.
There are two ways to update the MaxBank register:
1. After initiating a single acquire command, the
BUF08832 updates the MaxBank register with a
code corresponding to how many times that
particular channel memory has been written to.
2. Following a general acquire command, the
BUF08832 updates the MaxBank register with a
code corresponding to the maximum number of
times the most used channel (OUT1-8 and
VCOMs) has been written to.
MaxBank is a read-only register and is only updated
by performing a general- or single-channel acquire.
Copyright © 2009–2011, Texas Instruments Incorporated
11
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
Table 3 shows the relationship between the number
of times the nonvolatile memory has been
programmed and the corresponding state of the
MaxBank Register.
Table 3. MaxBank Details
READ/WRITE OPERATIONS
Read and write operations can be done for a single
DAC/VCOM or for multiple DACs/VCOM. Writing to a
DAC/VCOM register differs from writing to the
nonvolatile memory. Bits D15–D14 of the most
significant byte of data determines if data are written
to the DAC/VCOM register or the nonvolatile memory.
NUMBER OF TIMES WRITTEN TO
RETURNS CODE
0
0000
1
0000
Read/Write: DAC/VCOM Register (volatile memory)
2
0001
3
0010
4
0011
5
0100
6
0101
7
0110
8
0111
The BUF08832 is able to read from a single
DAC/VCOM, or multiple DACs/VCOM, or write to the
register of a single DAC/VCOM, or multiple DACs/VCOM
in a single communication transaction. DAC pointer
addresses begin with 000000 (which corresponds to
OUT1) through 000111 (which corresponds to
OUT8). The VCOM address is 010010.
9
1000
10
1001
11
1010
12
1011
13
1100
14
1101
15
1110
16
1111
Parity Error Correction
The BUF08832 provides single-bit parity error
correction for data stored in the nonvolatile memory
to provide increased reliability of the nonvolatile
memory. If a single bit of nonvolatile memory for a
channel fails, the BUF08832 corrects for it and
updates the appropriate DAC with the intended value
when its memory is acquired.
If more than one bit of nonvolatile memory for a
channel fails, the BUF08832 does not correct for it,
and updates the appropriate DAC/VCOM with the
default value of 1000000000.
DIE_ID AND DIE_REV REGISTERS
The user can verify the presence of the BUF08832 in
the system by reading from address 111101. The
BUF08832 returns 0010001010000000 when read at
this address.
Write commands are performed by setting the
read/write bit LOW. Setting the read/write bit HIGH
performs a read transaction.
Writing: DAC/VCOM Register (Volatile Memory)
To write to a single DAC/VCOM register:
1. Send a START condition on the bus.
2. Send the device address and read/write bit =
LOW. The BUF08832 acknowledges this byte.
3. Send a DAC/VCOM pointer address byte. Set bit
D7 = 0 and D6 = 0. Bits D5–D0 are the
DAC/VCOM address. Although the BUF08832
acknowledges 000000 through 010111, it stores
and returns data only from these addresses:
– 000000 through 000111
– 010010
It returns 0000 for reads from 001000 through
010001, and 010011 through 010111. See
Table 4 for valid DAC/VCOM addresses.
4. Send two bytes of data for the specified register.
Begin by sending the most significant byte first
(bits D15–D8, of which only bits D9 and D8 are
used, and bits D15–D14 must not be 01),
followed by the least significant byte (bits
D7–D0). The register is updated after receiving
the second byte.
5. Send a STOP or START condition on the bus.
The user can also determine the die revision of the
BUF08832 by reading from register 111100.
BUF08832 returns 0000000000000000 when a RevA
die is present. RevB would be designated by
0000000000000001 and so on.
12
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
www.ti.com
The BUF08832 acknowledges each data byte. If the
master terminates communication early by sending a
STOP or START condition on the bus, the specified
register is not updated. Updating the DAC/VCOM
register is not the same as updating the DAC/VCOM
output voltage; see the Updating the DAC Output
Voltages section.
The process of updating multiple DAC/VCOM registers
begins the same as when updating a single register.
However, instead of sending a STOP condition after
writing the addressed register, the master continues
to send data for the next register. The BUF08832
automatically and sequentially steps through
subsequent registers as additional data are sent. The
process continues until all desired registers have
been updated or a STOP or START condition is sent.
To write to multiple DAC/VCOM registers:
1. Send a START condition on the bus.
2. Send the device address and read/write bit =
LOW. The BUF08832 acknowledges this byte.
3. Send either the OUT1 pointer address byte to
start at the first DAC, or send the pointer address
byte for whichever DAC/VCOM is the first in the
sequence of DACs/VCOM to be updated. The
BUF08832 begins with this DAC/VCOM and steps
through subsequent DACs/VCOM in sequential
order.
4. Send the bytes of data; begin by sending the
most significant byte (bits D15–D8, of which only
bits D9 and D8 have meaning, and bits D15–D14
must not be 01), followed by the least significant
byte (bits D7–D0). The first two bytes are for the
DAC/VCOM addressed in the previous step. The
DAC/VCOM register is automatically updated after
receiving the second byte. The next two bytes are
for the following DAC/VCOM. That DAC/VCOM
register is updated after receiving the fourth byte.
This process continues until the registers of all
following DACs/VCOM have been updated. The
BUF08832 continues to accept data for a total of
18 DACs; however, the two data sets following
the 16th data set are meaningless. The 19th data
set applies to VCOM. The 20th data set is
meaningless. The write disable bit cannot be
accessed using this method. It must be written to
using the write to a single DAC register
procedure.
Copyright © 2009–2011, Texas Instruments Incorporated
SBOS476C – AUGUST 2009 – REVISED JULY 2011
5. Send a STOP or START condition on the bus.
The BUF08832 acknowledges each byte. To
terminate communication, send a STOP or START
condition on the bus. Only DAC registers that have
received both bytes of data are updated.
Reading: DAC/VCOM/OTHER Register (Volatile
Memory)
Reading a register returns the data stored in that
DAC/VCOM/OTHER register.
To read a single DAC/VCOM/OTHER register:
1. Send a START condition on the bus.
2. Send the device address and read/write bit =
LOW. The BUF08832 acknowledges this byte.
3. Send the DAC/VCOM/OTHER pointer address
byte. Set bit D7 = 0 and D6 = 0; bits D5–D0 are
the DAC/VCOM/OTHER address. NOTE: The
BUF08832 stores and returns data only from
these addresses:
– 000000 through 000111
– 010010
– 111100 through 111111
It returns 0000 for reads from 001000 through
010001, and 010011 through 010111. See
Table 4 for valid DAC/VCOM/OTHER addresses.
4. Send a START or STOP/START condition.
5. Send the correct device address and read/write
bit = HIGH. The BUF08832 acknowledges this
byte.
6. Receive two bytes of data. They are for the
specified register. The most significant byte (bits
D15–D8) is received first; next is the least
significant byte (bits D7–D0). In the case of
DAC/VCOM channels, bits D15–D10 have no
meaning.
7. Acknowledge after receiving the first byte.
8. Send a STOP or START condition on the bus or
do not acknowledge the second byte to end the
read transaction.
13
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
Communication may be terminated by sending a
premature STOP or START condition on the bus, or
by not acknowledging.
To read multiple registers:
1. Send a START condition on the bus.
2. Send the device address and read/write bit =
LOW. The BUF08832 acknowledges this byte.
3. Send either the OUT1 pointer address byte to
start at the first DAC, or send the pointer address
byte for whichever register is the first in the
sequence of DACs/VCOM to be read. The
BUF08832 begins with this DAC/VCOM and steps
through subsequent DACs/VCOM in sequential
order.
4. Send a START or STOP/START condition on the
bus.
5. Send the correct device address and read/write
bit = HIGH. The BUF08832 acknowledges this
byte.
6. Receive two bytes of data. They are for the
specified DAC/VCOM. The first received byte is the
most significant byte (bits D15–D8; only bits D9
and D8 have meaning), next is the least
significant byte (bits D7–D0).
7. Acknowledge after receiving each byte of data.
8. When all desired DACs have been read, send a
STOP or START condition on the bus.
Communication may be terminated by sending a
premature STOP or START condition on the bus, or
by not sending the acknowledge bit. The reading of
registers DieID, DieRev, and MaxBank is not
supported in this mode of operation (these values
must be read using the single register read method).
Write: Nonvolatile Memory for the DAC Register
The BUF08832 is able to write to the nonvolatile
memory of a single DAC/VCOM in a single
communication transaction. In contrast to the
BUF20820, writing to multiple nonvolatile memory
words in a single transaction is not supported. Valid
DAC/VCOM pointer addresses begin with 000000
(which corresponds to OUT1) through 000111 (which
corresponds to OUT8). The VCOM address is 010010.
When programming the nonvolatile memory, the
analog supply voltage must be between 9V and 20V.
Write commands are performed by setting the
read/write bit LOW.
14
www.ti.com
To write to a single nonvolatile register:
1. Send a START condition on the bus.
2. Send the device address and read/write bit =
LOW. The BUF08832 acknowledges this byte.
Although the BUF08832 acknowledges 000000
through 010111, it stores and returns data only
from these addresses:
– 000000 through 000111
– 010010
It returns 0000 for reads from 001000 through
010001, and 010011 through 010111. See
Table 4 for DAC/VCOM addresses.
3. Send a DAC/VCOM pointer address byte. Set bit
D7 = 0 and D6 = 0. Bits D5–D0 are the
DAC/VCOM address.
4. Send two bytes of data for the nonvolatile register
of the specified DAC/VCOM. Begin by sending the
most significant byte first (bits D15–D8, of which
only bits D9 and D8 are data bits, and bits
D15–D14 must be 01), followed by the least
significant byte (bits D7–D0). The register is
updated after receiving the second byte.
5. Send a STOP condition on the bus.
The BUF08832 acknowledges each data byte. If the
master terminates communication early by sending a
STOP or START condition on the bus, the specified
nonvolatile register is not updated. Writing a
nonvolatile register also updates the DAC/VCOM
register and output voltage.
The DAC/VCOM register and DAC/VCOM output voltage
are updated immediately, while the programming of
the nonvolatile memory takes up to 250μs. Once a
nonvolatile register write command has been issued,
no communication with the BUF08832 should take
place for at least 250μs. Writing or reading over the
serial interface while the nonvolatile memory is being
written jeopardizes the integrity of the data being
stored.
Read: Nonvolatile Memory for the DAC Register
To read the data present in nonvolatile register for a
particular DAC/VCOM channel, the master must first
issue a general acquire command, or a single acquire
command with the appropriate DAC/VCOM channel
chosen. This action updates both the DAC/VCOM
register(s) and DAC/VCOM output voltage(s). The
master may then read from the appropriate
DAC/VCOM register as described earlier.
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
Programmable VCOM Limits
The BUF08832 VCOM output has a programmable
HIGH limit and LOW limit. The implementation and
interface of these limits are the same as with the
DAC registers. These registers are written to and
read back through the Two-Wire bus. Addresses for
limiters are 1E and 1F for the HIGH limit and LOW
limit, respectively. See Table 4 for register pointer
addresses.
Upon power-up or general-call reset, the DAC
registers (channels 1 though 8 and VCOM) are set to
200 (default) that corresponds to mid-scale output for
a 10-bit DAC. The HIGH and LOW limit registers are
set to 3FF and 000 respectively. Therefore, the limits
are transparent if not programmed.
The BUF08832 uses double-buffered registers. The
input of data is stored in the first layer. The input may
be latched to the DAC output, depending upon
application. The DACs update only when the second
layer of latches are enabled.
The HIGH and LOW limits can be programmed to any
desired value to limit the VCOM output. The limit can
be programmed before or after programming the
VCOM channel. Because the input of data is stored in
the first layer of latches, the VCOM output is limited
according to the following rule in either sequence:
1. If the VCOM OTP write is enabled, then the VCOM
input is always stored in the OTP. Limit
comparison happens only before the DAC output.
2. If the VCOM input is higher than the HIGH limit,
then the HIGH limit is latched to the DAC output.
Reading of the DAC register returns the HIGH
limit.
3. If the VCOM input is lower than the LOW limit, then
the LOW limit is latched to the DAC output.
Reading of the DAC register returns the LOW
limit.
4. If the VCOM input is in between the HIGH and
LOW limit, then the programmed value is latched
to DAC output. Reading of the DAC register
returns the programmed value.
5. If the HIGH limit is lower than the LOW limit, then
the BUF08832 ignores the limits and latches the
programmed value to the DAC output. Reading of
the DAC register returns the programmed value.
There are two banks of OTP associated with each of
the two limit registers. OTP operations on these two
addresses are valid, just like OTP for DAC registers.
Table 4. DAC Register Pointer Addresses
DAC REGISTER
POINTER ADDRESS
OUT1
000000
OUT2
000001
OUT3
000010
OUT4
000011
OUT5
000100
OUT6
000101
OUT7
000110
OUT8
000111
VCOM
010010
HIGH Limit
011110
LOW Limit
011111
OTHER REGISTER
POINTER ADDRESS
Die_Rev
111100
Die_ID
111101
MaxBank
111111
Copyright © 2009–2011, Texas Instruments Incorporated
15
16
Figure 15. Write DAC Register Timing
A6
A6
A6
SDA_In
Start
Device_Out
SCL
A4
A4
A3
A3
A5
A5
A4
A4
A5
A5
A4
A4
A3
A3
Device Address
A2
A2
A5
A5
A4
A4
A3
A3
Device Address
A2
A2
A1
A1
A1
A1
A3
A3
Device Address
Read multiple DAC registers. P4-P0 specify DAC address.
A6
SDA_In
Start
Device_Out
SCL
A5
A5
Read single DAC register. P4-P0 specify DAC address.
A6
A6
SDA_In
Start
Device_Out
SCL
A6
Device_Out
Device Address
A2
A2
A1
A1
A0
A0
A0
A0
A2
A2
W
W
Write
W
W
Write
A1
A1
A0
A0
A0
A0
D7
D7
Ackn
Ackn
Ackn
D7
D7
Read operation.
Ackn
Ackn
Ackn
W
W
Write
W
W
Write
Read operation.
Write multiple DAC registers. P4-P0 specify DAC address.
A6
SDA_In
SCL
Start
Write single DAC register. P4-P0 specify DAC address.
D7
D7
D7
D7
D5
D5
D6
D6
D5
D5
D5
D5
P4
P4
P3
P3
P2
P2
P4
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
P1
P1
P1
P1
P4
Start DAC address pointer. D7-D5 must be 000.
D6
D6
P4
P4
P3
P3
P2
P2
P0
P0
P0
P0
P3
P3
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
P2
P2
P1
P1
P1
P1
Start
Start
DAC address pointer. D7-D5 must be 000.
D6
D6
DAC address pointer. D7-D5 must be 000.
DAC address pointer. D7-D5 must be 000.
Ackn
Ackn
Ackn
Write Operation
Ackn
Ackn
Ackn
Write Operation
D14
D14
D15
D14
D14
A3
A3
A4
A3
A3
Device Address
A4
D14
D14
D15
D13
D13
D11
D11
D10
D10
D13
D13
D12
D12
D11
D11
D10
D10
DAC (pointer) MSbyte. D14 must be 0.
Device Address
A4
D12
D12
D9
D9
D8
D8
Ackn
Ackn
D7
D7
D9
D9
D8
D8
Ackn
Ackn
Ackn
D7
D7
A2
A2
A2
A2
A1
A1
A1
A1
A0
A0
A0
A0
D12
D12
D11
D11
D10
D10
D9
D9
D8
D8
R
R
Read
R
R
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
D7
D7
D15
D15
D15
D11
D11
D10
D10
D9
D9
D6
D6
D6
D6
D8
D8
D13
D12
D12
D11
D11
D10
D10
D14
D6
D6
D14
D13
D5
D5
D13
D12
D11
D11
D4
D4
D3
D3
DAC 20 LSbyte.
D12
D10
D2
D2
D10
D4
D4
D3
D3
DAC LSbyte
D9
D9
Ackn
Ackn
Ackn
D5
D5
D9
D1
D1
D9
D0
D0
D8
D8
D8
D8
D4
D4
Ackn
D1
D1
D0
D0
Ackn
Ackn
Ackn
D2
D1
D1
D0
D0
Ackn
Ackn
D7
D7
D6
D6
D5
D5
D5
D5
D4
D4
D2
D2
D4
D4
D3
D3
DAC LSbyte.
D3
D3
DAC 20 LSbyte
is updated at this moment.
Stop
D2
D2
D1
D1
D15
D15
D1
D1
D14
D14
D0
D0
D0
D0
Stop
Stop
No Ackn
No Ackn
Ackn
Ackn
Ackn
D13
D13
DAC (pointer + 1) MSbyte. D14 must be 0.
The entire DAC register D9-D0
D2
Ackn
is updated at this moment.
The entire DAC register D9-D0
D2
D2
Stop
D6
D6
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
D7
D7
D3
D3
DAC (pointer) LSbyte
D5
D5
DAC (pointer) MSbyte. D15-D10 have no meaning.
D14
D13
DAC MSbyte. D15-D10 have no meaning.
D14
D12
D13
D15
D12
D13
Ackn
Ackn
D14
D15
Read
D14
D15
DAC 20 (VCOM OUT2) MSbyte. D14 must be 0.
If D15 = 1, all DACs are updated when the current DAC register is updated.
D15
A4
D13
D13
Ackn
If D15 = 1, all DACs are updated when the current DAC register is updated.
D15
D15
DAC MSbyte. D14 must be 0.
DAC 20 (VCOM OUT2) MSbyte. D15-D10 have no meaning.
A5
A5
A5
A5
Ackn
Ackn
Ackn
Ackn
Ackn
D15
A6
A6
A6
A6
P0
P0
P0
P0
Ackn
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
Figure 16. Read Register Timing
Copyright © 2009–2011, Texas Instruments Incorporated
A6
A6
SDA_In
Device_Out
SCL
Start
A5
A5
A4
A4
A3
A3
Device Address
A1
Figure 17. Write Nonvolatile Register Timing
Copyright © 2009–2011, Texas Instruments Incorporated
A0
W
W
Ackn
Ackn
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
A5
A5
A4
A4
A3
A3
Device address.
A2
A2
A1
A1
P1
A0
A0
P1
A6
A6
SDA_In
Device_Out
Start
A5
A5
A4
A4
A3
A3
Device address.
A2
A2
A1
A1
A0
A0
P0
P0
W
W
Write
W
W
Write
Single channel acquire command. P4-P0 must specify and valid DAC address.
A6
Start
Device_Out
SCL
D7
D7
DAC address pointer. D7-D0 must be 000.
General acquire command. P4-P0 must specify and valid DAC address.
A0
Ackn
Write operation.
A6
SCL
A1
Write
D15
D15
D7
D7
Ackn
Ackn
Ackn
D7
D7
Write Operation
Ackn
Ackn
Ackn
Write Operation
Ackn
Ackn
Ackn
D14
D14
D12
D12
D11
D11
D10
D10
D9
D9
D5
D5
P4
P4
P3
P3
P2
P2
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
DAC address pointer. D7-D5 must be 010.
D6
D6
DAC address pointer. D7-D5 must be 100.
D13
D13
DAC MSbyte. D15-D14 must be 01.
D8
D8
P1
P1
P1
P1
Ackn
Ackn
Ackn
P0
P0
P0
P0
D7
D6
D6
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
D7
D5
Stop
Stop
D5
D4
D4
D2
D2
D1
D1
D0
D0
Ackn
Ackn
Ackn
Stop
The OTP memory update begins at this time and
requires up to 250ms to complete.
D3
D3
DAC LSbyte.
www.ti.com
SDA_In
A2
A2
Write single OTP register. P4-P0 specify DAC address.
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
Figure 18. Acquire Operation Timing
17
18
Figure 19. General-Call Reset Timing
SDA
SCL
SDA
SCL
Start
High-Speed Command
Start
General-Call Reset Command
Address Byte = 00h
Address Byte = 00001xxx (HS Master Code)
Ackn
Ackn
Device enters high-speed mode at ACK clock pulse.
Device exits high-speed mode with stop condition.
No Ackn
Device begins reset at arrow and is in reset until ACK clock pulse.
Then the device acquires memory, etc., as it does at power-up.
Address Byte = 06h
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
Figure 20. High-Speed Mode Timing
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
END-USER SELECTED GAMMA CONTROL
DYNAMIC GAMMA CONTROL
Because the BUF08832 has two banks of nonvolatile
memory, it is well-suited for providing two levels of
gamma control by using the BKSEL pin, as shown in
Figure 21. When the state of the BKSEL pin changes,
the BUF08832 updates all nine programmable buffer
outputs simultaneously after 750μs (±80μs).
Dynamic gamma control is a technique used to
improve the picture quality in LCD television
applications. This technique typically requires
switching gamma curves between frames. Using the
BKSEL pin to switch between two gamma curves
does not often provide good results because of the
750μs required to transfer the data from the
nonvolatile memory to the DAC register. However,
dynamic gamma control can still be accomplished by
storing two gamma curves in an external EEPROM
and writing directly to the DAC register (volatile).
To update all nine programmable output voltages
simultaneously via hardware, toggle the BKSEL pin to
switch between Gamma Curve 0 (stored in Bank0)
and Gamma Curve 1 (stored in Bank1).
All DAC/VCOM registers and output voltages are
updated simultaneously after approximately 750μs.
5V
BUF08832
BKSEL
OUT1
Change in
Output Voltages
BANK0
BANK1
Switch
OUT8
Two-Wire
The double register input structure saves
programming time by allowing updated DAC values to
be pre-stored into the first register bank. Storage of
this data can occur while a picture is still being
displayed. Because the data are only stored into the
first register bank, the DAC/VCOM output values
remain unchanged—the display is unaffected. At the
beginning or the end of a picture frame, the
DAC/VCOM outputs (and therefore, the gamma
voltages) can be quickly updated by writing a '1' in bit
15 of any DAC/VCOM register. For details on the
operation of the double register input structure, see
the Updating the DAC Output Voltages section.
To update all nine programmable output voltages
simultaneously via software, perform the following
actions:
STEP 1: Write to registers 1–9 with bit 15 always '0'.
STEP 2: Write any DAC/VCOM register a second time
with identical data. Make sure that bit 15 is set to '1'.
All DAC/VCOM channels are updated simultaneously
after receiving the last bit of data.
Figure 21. Gamma Control
Copyright © 2009–2011, Texas Instruments Incorporated
19
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
OUTPUT PROTECTION
The BUF08832 output stages can safely source and
sink the current levels indicated in Figure 1 and
Figure 2. However, there are other modes where
precautions must be taken to prevent to the output
stages from being damaged by excessive current
flow. The outputs (OUT1 through OUT8, and VCOM)
include ESD protection diodes, as shown in
Figure 22. Normally, these diodes do not conduct and
are passive during typical device operation. Unusual
operating conditions can occur where the diodes may
conduct, potentially subjecting them to high, even
damaging current levels. These conditions are most
likely to occur when a voltage applied to an output
exceeds (VS) + 0.5V, or drops below GND – 0.5V.
One common scenario where this condition can occur
is when the output pin is connected to a sufficiently
large capacitor, and the BUF08832 power-supply
source (VS) is suddenly removed. Removing the
power-supply source allows the capacitor to
discharge through the current-steering diodes. The
energy released during the high current flow period
causes the power dissipation limits of the diode to be
20
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exceeded. Protection against the high current flow
may be provided by placing current-limiting resistors
in series with the output, as shown in Figure 13.
Select a resistor value that restricts the current level
to the maximum rating for the particular pin.
VS
BUF08832
ESD Current
Steering Diodes
OUTX
or
VCOM
Figure 22. Output Pins ESD Protection
Current-Steering Diodes
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
GENERAL POWERPAD DESIGN
CONSIDERATIONS
The BUF08832 is available in a thermally-enhanced
PowerPAD package. This package is constructed
using a downset leadframe upon which the die is
mounted; see Figure 23(a) and Figure 23(b). This
arrangement results in the lead frame being exposed
as a thermal pad on the underside of the package;
see Figure 23(c). This thermal pad has direct thermal
contact with the die; thus, excellent thermal
performance is achieved by providing a good thermal
path away from the thermal pad.
3.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
must be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package into either a ground plane or other
heat-dissipating device. Soldering the PowerPAD to
the printed circuit board (PCB) is always required,
even with applications that have low power
dissipation. This technique provides the necessary
thermal and mechanical connection between the lead
frame die pad and the PCB.
5.
The PowerPAD must be connected to the most
negative supply voltage on the device, GNDA and
GNDD.
1. Prepare the PCB with a top-side etch pattern.
There should be etching for the leads as well as
etch for the thermal pad.
2. Place recommended holes in the area of the
thermal pad. Ideal thermal land size and thermal
via patterns for the HTSSOP-20 PWP package
can be seen in the technical brief, PowerPAD
Thermally-Enhanced
Package
(SLMA002),
available for download at www.ti.com. These
holes should be 13 mils (0,33mm) in diameter.
Keep them small, so that solder wicking through
the holes is not a problem during reflow. An
Copyright © 2009–2011, Texas Instruments Incorporated
4.
6.
7.
8.
example thermal land pattern mechanical drawing
is attached to the end of this data sheet.
Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad area
to help dissipate the heat generated by the
BUF08832 IC. These additional vias may be
larger than the 13-mil diameter vias directly under
the thermal pad. They can be larger because
they are not in the thermal pad area to be
soldered; thus, wicking is not a problem.
Connect all holes to the internal plane that is at
the same voltage potential as the GND pins.
When connecting these holes to the internal
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
useful for slowing the heat transfer during
soldering operations. This configuration makes
the soldering of vias that have plane connections
easier. In this application, however, low thermal
resistance is desired for the most efficient heat
transfer. Therefore, the holes under the
BUF08832 PowerPAD package should make
their connection to the internal plane with a
complete
connection
around
the
entire
circumference of the plated-through hole.
The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its twelve holes exposed. The
bottom-side solder mask should cover the holes
of the thermal pad area. This masking prevents
solder from being pulled away from the thermal
pad area during the reflow process.
Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
With these preparatory steps in place, simply
place the BUF08832 IC in position and run the
chip through the solder reflow operation as any
standard
surface-mount
component.
This
preparation results in a properly installed part.
21
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
Figure 23. Views of Thermally-Enhanced PWP Package
(
)
(2)
Where:
PD = maximum power dissipation (W)
TMAX = absolute maximum junction temperature
(+125°C)
TA = free-ambient air temperature (°C)
5.0
Maximum Power Dissipation (W)
For a given θJA (listed in the Electrical
Characteristics), the maximum power dissipation is
shown in Figure 24 and calculated by Equation 2:
TMAX - TA
PD =
qJA
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
TA, Free-Air Temperature (°C)
Figure 24. Maximum Power Dissipation
vs Free-Air Temperature
(with PowerPAD soldered down)
22
Copyright © 2009–2011, Texas Instruments Incorporated
BUF08832
SBOS476C – AUGUST 2009 – REVISED JULY 2011
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision September, 2009 (B) to Revision C
•
Page
Corrected error in x-axis value for Figure 11 ........................................................................................................................ 6
Changes from Revision September 2009 (A) to Revision B
Page
•
Changed the typ and max specifications for the Analog Power Supply, Total Ananlog Supply Current and Over
Temperature parameters of the Electrical Characteristics table ........................................................................................... 3
•
Added Figure 4 ..................................................................................................................................................................... 5
•
Moved Figure 7 ..................................................................................................................................................................... 6
Copyright © 2009–2011, Texas Instruments Incorporated
23
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
BUF08832AIPWPR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
HTSSOP
PWP
20
2000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU NIPDAU
Level-2-260C-1 YEAR
(4)
-40 to 95
BUF08832
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BUF08832AIPWPR
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
PWP
20
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BUF08832AIPWPR
HTSSOP
PWP
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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