Littelfuse AQ1003 Aq1003 series - 30pf 30kv unidirectional discrete tv Datasheet

TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1003
AQ1003Series
Series
AQ1003 Series - 30pF 30kV Unidirectional Discrete TVS
RoHS Pb GREEN
Description
This diode is fabricated in a proprietary silicon avalanche
technology that protects each I/O pin at a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes at ±30kV
(contact discharge, IEC 61000-4-2) without performance
degradation. Additionally, the diode can safely dissipate
7A of 8/20µs surge current (IEC 61000-4-5 2nd edition) with
very low clamping voltages.
Pinout
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
1
• Lightning, IEC 61000-4-5
2nd edition, 7A (8/20µs)
2
• Low leakage current of
100nA (MAX) at 5V
Functional Block Diagram
• Tiny SOD882 (JEDEC
MO-236) package saves
board space
• Fits solder footprint of
industry standard 0402
(1005) components
• AEC-Q101 qualified
• Halogen free, Lead free
and RoHS compliant
Applications
1
• Mobile phones
• Digital cameras
• Smart phones
• Portable medical
components
• PDAs
• Portable navigation
components
• Automotive applications
2
Application Example
Outside World
Low - speed port
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
I/O port
Controller
B1
B2
B3
B4
(4) AQ1003-01
GND
Signal
Ground
TVS Diode Arrays (SPA® Diodes)
Series
General Purpose ESD Protection - AQ1003
SP1003 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
Units
IPP
Peak Pulse Current (tp=8/20μs)
7.0
A
TOP
Operating Temperature
-40 to 150
°C
TSTOR
Storage Temperature
-55 to 150
°C
Parameter
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
Rating
150
Units
°C
260
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
component at these or any other conditions above those indicated in the operational
sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Forward Voltage Drop
VF
IF = 10mA
Reverse Voltage Drop
VR
IR=1mA
Reverse Standoff Voltage
VRWM
IR≤1µA
Reverse Leakage Current
ILEAK
Clamp Voltage1
RDYN
ESD Withstand Voltage1
VESD
Diode Capacitance1
Typ
6.0
Max
Units
0.8
1.2
V
7.8
8.5
V
5.0
V
100
nA
VR=5V
Ipp=6A tp=8/20µs
VC
Dynamic Resistance2
Min
11.4
V
Ipp=7A tp=8/20µs
12.0
V
TLP, tp=100ns, I/O to GND
0.25
Ω
IEC 61000-4-2 (Contact Discharge)
±30
kV
IEC 61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V
30
pF
CD
Note: 1 Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Capacitance vs. Reverse Bias
Clamping Voltage vs. IPP
14.0
35.0
12.0
30.0
10.0
Clamp Voltage (VC)
Capacitance (pF)
40.0
25.0
20.0
15.0
10.0
6.0
4.0
2.0
5.0
0.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
DC Bias (V)
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
8.0
3.0
3.5
4.0
4.5
5.0
1
2
3
4
5
Peak Pulse Current-IPP (A)
6
7
TVS Diode Arrays (SPA® Diodes)
Series
General Purpose ESD Protection - AQ1003
SP1003 Series
Transmission Line Pulsing(TLP) Plot
Leakage vs. Temperature
20
35.0
18
30.0
Leakage Current (nA)
TLP Current (A)
16
14
12
10
8
6
4
2
25.0
20.0
15.0
10.0
5.0
0
0
2
4
6
8
10
12
14
16
0.0
18
0
10
20
TLP Voltage (V)
30
40
50
Temperature (ºC)
8/20μs Pulse Waveform
110%
100%
90%
Percent of IPP
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - AQ1003
SP1003 Series
Series
Part Numbering System
Product Characteristics
AQ 1003 – 01 E T G
Automotive Grade
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Series
Number of Channels
Pre-Plated Frame
Lead Material
Copper Alloy
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL Recognized epoxy meeting
flammability rating V-0.
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Package
E: SOD882
-01 = 1 Channel
Lead Plating
Part Marking System
SOD882
SOD723
C
C
Product ID
Pin1 Indicator
Part Number
Package
Marking
Min. Order Qty.
AQ1003-01ETG
SOD882
C
10000
Pin1 Indicator
Package Dimensions — SOD882
D
0.325
0.325
Symbol
E
0.650
A
1
0.975
Recommended Soldering Pad Layout
L
b
Product ID
Ordering Information
e
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
0.650
Package
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Max
Min
Max
A
0.36
0.42
0.014
0.017
b
0.45
0.55
0.018
0.022
L
0.20
0.30
0.008
0.012
0.65
e
0.026
D
0.93
1.07
0.037
0.042
E
0.53
0.67
0.021
0.026
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - AQ1003
SP1003 Series
Embossed Carrier Tape & Reel Specification — SOD882
Symbol
User Feeding Direction
Pin 1 Location
Millimetres
Inches
Min
Max
Min
Max
A
0.65
0.70
0.026
0.028
B
1.10
1.20
0.043
0.047
C
0.50
0.60
0.020
0.024
dØ
1.40
1.60
0.055
0.063
E
1.65
1.85
0.065
0.073
0.142
F
3.40
3.60
0.134
P0
3.90
4.10
0.154
0.161
P
1.90
2.10
0.075
0.083
P1
1.90
2.10
0.075
0.083
W
7.90
8.10
0.311
0.319
8mm TAPE AND REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
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