Anpec APX9132AI-TRG Hall effect micro switch ic Datasheet

APX9132
Hall Effect Micro Switch IC
Features
General Description
•
•
•
The APX9132, integrated circuit, is an ultra-sensitive, pole
independent Hall-effect switch with a latched digital output.
Micro Power Operation for Battery Applications
Chopper Stabilized Amplifier
A 2.5 volt to 3.5 volt operation and an unique clocking
s c h e m e r e d u c e t h e a ve r a g e o p e r a t i n g p o we r
Independent of North or South Pole Magnet,
Easy for Manufacture
•
•
requirements, either a north or south pole of sufficient
flux will turn the output on; in the absence of a magnetic
Small Size Package
field, the output is off. The polarity independence and
minimal power requirement allow this device to be easily
Lead Free and Green Devices Available
(RoHS Compliant)
replaced reed switch for superior for signal conditioning.
Advanced CMOS processing is used to take advantage of
Applications
•
•
•
•
low-voltage and low-power requirements, SOT-23-3 package provided a optimized package for most applications.
Micro Switch
Pin Configuration
Handheld Wireless Application Wake Up Switch
GND
Clamp Shell Type Application Switch
Magnet Switch in Low Duty Cycle Applications
APX9132
VDD
VOUT
SOT-23-3
Ordering and Marking Information
APX9132
Package Code
A : SOT-23-3
AT : TSOT-23-3
Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
Assembly Material
Handling Code
Temperature Range
Package Code
APX9132 A/AT:
X - Date Code
X32X
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
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APX9132
Absolute Maximum Ratings
Symbol
TA = 25°C unless otherwise noted
Parameter
Rating
Unit
VDD
Supply Voltage
5
V
VOUT
Output Voltage
5
V
IOUT
Output Current
±1
mA
TJ
Junction Temperature Range
150
°C
TSTG
Storage Temperature Range
-65 to +150
°C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air (Note 2)
SOT-23
TSOT-23
260
275
SOT-23
TSOT-23
0.385
0.364
ο
C/W
Power Dissipation, TA=25oC
PD
W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Electrical Characteristics
TA = 25°C, VDD=3V unless otherwise noted
APX9132
Symbol
VDD
IDD
IOFF
Characteristic
Supply Voltage Range
Supply Current
Output Leakage Current
Test Conditions
Unit
Min.
Typ.
Max.
2.5
-
3.5
V
Average
-
5
10
µA
Awake
-
1.2
2
mA
Sleep
-
2
8
µA
VOUT=3.5V, BRPN<B<BRPS
-
-
1.0
µA
-
-
V
Operating
VOH
Output High Voltage
IOUT=-1mA
VDD
-0.4
VOL
Output Low Voltage
IOUT=1mA
-
20
40
mV
tawake
Wake up Time
-
180
-
µs
tperiod
Period
-
60
-
ms
d.c.
Duty Cycle
-
0.3
-
%
Chopping Frequency
-
11
-
kHz
fc
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APX9132
Magnetic Characteristics
TA = 25°C, VDD=3V unless otherwise noted
APX9132
Symbol
Characteristic
Test Conditions
BOPS
Unit
Min.
Typ.
Max.
15
30
45
G
-45
-30
-15
G
10
20
40
G
-40
-20
-10
G
-
10
-
G
Operate Points
BOPN
BRPS
Release Points
BRPN
Bhys
Hysteresis
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APX9132
Typical Operating Characteristics
Switching Points vs. Ambient Temperature
Switching Points vs. Supply Voltage
40
40
BOPS
30
20
Switching Points (G)
Switching Points (G)
20
BRPS
10
0
BRPN
-10
-20
BRPS
10
0
-10
BRPN
-20
-30
-30
-40
-40
TA=25oC
BOPS
30
BOPN
BOPN
-40
-20
0
20
40
60
80
2.5
100
3
Ambient Temperature (°C)
3.5
4
4.5
Supply Voltage (V)
Average Supply Current vs.Supply Voltage
Average Supply Current vs. Ambient Temperature
10
20
TA=25oC
18
8
Average Supply Current (µA)
Average Supply Current (µA)
5
6
4
2
16
14
12
10
8
6
4
2
0
0
-40
-20
0
20
40
60
80
2.5
100
Ambient Temperature (°C)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
3
3.5
4
4.5
5
Supply Voltage (V)
4
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APX9132
Typical Operating Characteristics (Cont.)
Output Source Current vs. VDD-VOUT Voltage
Output Sink Current vs. Output Low Voltage
5
10
9
4
VDD=4V
8
Output Sink Current (mA)
Output Source Current (mA)
VDD=5V
VDD=4V
3
2
VDD=3V
1
7
VDD=5V
6
5
VDD=3V
4
3
2
1
0
0
0
0.2
0.4
0.6
0.8
1
0
0.2
0.4
0.6
0.8
1
Output Low Voltage (V)
VDD-VOUT Voltage (V)
Output Switch Waveform
Output Switch Waveform
VDD=3V
CL=12pF
VDD=3V
CL=12pF
Output Voltage (0.5V/div)
Output Voltage (0.5V/div)
0
VOUT (0.5V/div)
VOUT (0.5V/div)
Time (50µs/div)
Time (50µs/div)
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APX9132
Pin Description
PIN
FUNCTION
NO.
NAME
1
VDD
2
VOUT
When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN) the
output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN), the
output turns off (output is high).
3
GND
Ground Connection
Power Input
Block Diagram
VDD
Awake & Sleep Timing
Logic
Dynamic Offset
Cancellation
Hall Plane
Latch
Circuit
Chopper
Amplifier
VOUT
GND
Hysteresis Control
Typical Application Circuit
VOUT
VDD
+
APX9132
2.5V-3.5V
0.1µF
GND
-
SOT-23 (Top View)
Copyright  ANPEC Electronics Corp.
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APX9132
Function Description
Operation
The output of APX9132 switches low (turn-on) when in
presence of strong flux density facing the marked side of
package exceeds the operate point BOPS (or is less than
BOPN). After turn-on, the output is capable of sinking up to
1mA and the output voltage is low (turn-on). In absence of
flux density below the release point BRPS (or increased
above BRPN), the APX9132 output switches high (turns
off). After turn-off, the output is capable of sourcing up to
1mA and the output voltage is high (turn-off). The difference in the magnetic operated and released point is
the hysteresis (B hys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise.
OUTPUT OFF
BOPN
BOPS
OUTPUT VOLTAGE
5V
MAX
BRPN
0
-B
BRPS
0
OUTPUT ON
+B
MAGNETIC FLUX
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APX9132
Application Information
It is strongly recommended that an external bypass capacitor be connected (is close to the Hall sensor) between the supply and ground of the device to reduce both
external noise and noise generated by the chopper-stabilization technique. This is especially true due to the
relatively high impedance of battery supplies.
Pole-independent
The pole-independent sensing technique allows for
operation with either a north or south pole magnet
orientation, enhancing the manufacturability of the device.
The state-of-the-art technology provides the same output
polarity for either pole in presence.
Awake & Sleep
Internal awake & sleep timing block circuit activates the
sensor for 180 µs and deactivates it for the remainder of
the period (60 ms). A short “awake” time allows for stabilization prior to the sensor sampling and data latching on
the falling edge of the timing pulse. While in sleep cycle,
the output is latched in its previous state.
Chopper Stabilized Technique
The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and
temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique
produces devices have an extremely stable Hall output
voltage, therefore, the magnetic switch points are stable.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
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APX9132
Package Information
SOT-23-3
D
e
E
E1
SEE
VIEW A
c
b
0.25
A
L
GAUGE PLANE
SEATING PLANE
0
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-3
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
0.057
1.45
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
e
0.95 BSC
e1
0.071
0.037 BSC
1.90 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
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APX9132
Package Information
TSOT-23-3
D
e
E
E1
SEE VIEW A
b
c
0.25
A
GAUGE PLANE
SEATING PLANE
L
A1
A2
e1
VIEW A
TSOT-23-3
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.75
0.80
0.030
0.031
A1
0.03
0.05
0.001
0.002
A2
0.70
0.75
0.028
0.030
0.020
MILLIMETERS
INCHES
b
0.30
0.50
0.012
c
0.08
0.20
0.003
0.008
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
0.071
e
0.95 BSC
e1
1.90BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
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APX9132
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
OD1
B
A
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-3
Application
TSOT-23-3
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±
0.20
3.10±0.20
1.50±0.20
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.10
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±
0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
Devices Per Unit
Package Type
SOT-23-3
TSOT-23-3
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
Unit
Tape & Reel
Tape & Reel
Quantity
3000
3000
11
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APX9132
Taping Direction Information
(T)SOT-23-3
USER DIRECTION OF FEED
Classification Profile
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APX9132
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak
(Tp)*
package
body
Temperature
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3
Package
Thickness
<2.5 mm
Volume mm
<350
235 °C
Volume mm
≥350
220 °C
≥2.5 mm
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
ESD
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Apr., 2009
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD 78
13
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV, VMM≧200V
10ms, 1tr≧100mA
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APX9132
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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