AD ADM3232EARWZ-REEL Line driver/receiver Datasheet

±15 kV ESD Protected, 3.3 V, RS-232
Line Driver/Receiver
ADM3232E
FEATURES
FUNCTIONAL BLOCK DIAGRAM
+3.3V INPUT
Data rate: 460 kbps
2 Tx and 2 Rx
Meets EIA-232E specifications
0.1 μF charge pump capacitors
ESD protection to IEC 1000-4-2 (801.2) on RS-232 I/Os
Contact discharge: ±8 kV
Air gap discharge: ±15 kV
C2 +
0.1µF
10V
C2+ +6.6V TO –6.6V
VOLTAGE
C2–
INVERTER
+
V–
+
General-purpose RS-232 data link
Portable instruments
Handsets
Industrial/telecom diagnostic ports
C1+ +3.3V TO +6.6V VCC
VOLTAGE
C1–
V+
DOUBLER
C3
0.1µF
6.3V
C4
0.1µF
10V
T1IN
T1
T1OUT
T2IN
T2
T2OUT
TTL/CMOS
INPUTS
+
APPLICATIONS
ADM3232E
C1 +
0.1µF
10V
C5
0.1µF
RS-232
OUTPUTS
R1
R1OUT
TTL/CMOS
OUTPUTS
R1IN
5kΩ
R2
R2OUT
RS-232
INPUTS*
R2IN
5kΩ
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT.
06410-001
GND
Figure 1.
GENERAL DESCRIPTION
The ADM3232E transceiver is a high speed, 2-channel RS-232/V.28
interface device that operates from a single 3.3 V power supply.
Low power consumption makes it ideal for battery-powered
portable instruments. The ADM3232E conforms to the EIA-232E
and ITU-T V.28 specifications and operates at data rates up to
460 kbps.
Emissions are also controlled to within very strict limits. CMOS
technology is used to keep the power dissipation to an absolute
minimum, allowing maximum battery life in portable applications.
All RS-232 (TxOUT and RxIN) inputs and outputs are protected
against electrostatic discharges (up to ±15 kV ESD protection).
This ensures compliance with IEC 1000-4-2 requirements.
The ADM3232E is available in a 16-lead narrow and wide SOIC
packages, as well as a space-saving 16-lead TSSOP.
Four external 0.1 μF charge pump capacitors are used for the
voltage doubler/inverter, permitting operation from a single
3.3 V supply.
This device is ideally suited for operation in electrically harsh
environments or where RS-232 cables are frequently plugged/
unplugged, with the ±15 kV ESD protection of the ADM3232E
RS-232 input/output pins.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2011 Analog Devices, Inc. All rights reserved.
ADM3232E
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Applications....................................................................................... 1
Typical Performance Characteristics ..............................................6
Functional Block Diagram .............................................................. 1
Theory of Operation .........................................................................8
General Description ......................................................................... 1
Circuit Description .......................................................................8
Revision History ............................................................................... 2
High Baud Rate..............................................................................8
Specifications..................................................................................... 3
Outline Dimensions ..........................................................................9
Absolute Maximum Ratings............................................................ 4
Ordering Guide .......................................................................... 10
ESD Caution.................................................................................. 4
REVISION HISTORY
4/11—Rev. A to Rev. B
Changes to Features Section and General Description
Section ................................................................................................ 1
Change to ESD Protection (RS-232 I/O Pins) Parameter,
Table 1 ................................................................................................ 3
Change to ESD Protection on RS-232 Pins Section Heading..... 8
7/08—Rev. 0 to Rev. A
Added 16-Lead SOIC .........................................................Universal
Updated Outline Dimensions ......................................................... 9
Changes to Ordering Guide .......................................................... 10
12/06—Revision 0: Initial Version
Rev. B | Page 2 of 12
ADM3232E
SPECIFICATIONS
VCC = 3.3 V ± 0.3 V, C1 to C4 = 0.1 μF; all specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
DC CHARACTERISTICS
Operating Voltage Range
VCC Power Supply Current
LOGIC
Input Logic Threshold Low, VINL
Input Logic Threshold High, VINH
TTL/CMOS Output Voltage Low, VOL
TTLCMOS Output Voltage High, VOH
Logic Pull-Up Current
Transmitter Input Hysteresis
RS-232 RECEIVER
Input Voltage Range
Input Threshold Low
Input Threshold High
Input Hysteresis
Input Resistance
RS-232 TRANSMITTER
Output Voltage Swing (RS-232)
Output Voltage Swing (RS-562)
Transmitter Output Resistance
Output Short-Circuit Current (RS-232)
TIMING CHARACTERISTICS
Maximum Data Rate
Receiver Propagation Delay
tPHL
tPLH
Transmitter Propagation Delay
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Skew
Receiver Skew
Transition Region Slew Rate
Min
Typ
Max
Unit
Test Conditions/Comments
3.0
3.3
1.3
5.5
3
V
mA
No load
0.8
V
V
V
V
μA
V
2.0
0.4
VCC − 0.6
5
0.5
−30
0.6
3
±5.0
±3.7
300
10
+30
1.2
1.6
0.4
5
2.4
7
±5.2
±15
460
5.5
0.4
0.4
300
200
200
30
300
10
1
1
1.2
30
TIN
TIN
IOUT = 1.6 mA
IOUT = −1 mA
TIN = GND to VCC
V
V
V
V
kΩ
V
V
Ω
mA
VCC = 3.3 V, all transmitter outputs loaded with 3 kΩ to ground
VCC = 3.0 V
VCC = 0 V, VOUT = ±2 V
kbps
VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, one
Tx switching
μs
μs
μs
ns
ns
ns
ns
V/μs
RL = 3 kΩ, CL = 1000 pF
Measured from +3 V to −3 V or −3 V to +3 V, VCC = 3.3 V;
RL = 3 kΩ, CL = 1000 pF, TA = 25°C
ESD PROTECTION (RS-232 I/O PINS)
±15
±15
±8
kV
kV
kV
Rev. B | Page 3 of 12
Human body model
IEC 1000-4-2 air discharge
IEC 1000-4-2 contact discharge
ADM3232E
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
VCC
V+
V−
Input Voltages
TxIN
RxIN
Output Voltages
TxOUT
RxOUT
Short-Circuit Duration
TxOUT
Power Dissipation R-16/RW-16
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance
Power Dissipation RU-16
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance
Operating Temperature Range
Industrial (A Version)
Storage Temperature Range
Lead Temperature
(Soldering, 10 sec)
Rating
−0.3 V to +6 V
(VCC − 0.3 V) to 14 V
+0.3 V to –14 V
−0.3 V to (VCC + 0.3 V)
±30 V
ESD CAUTION
±15 V
−0.3 V to (VCC + 0.3 V)
Continuous
450 mW
158°C/W
500 mW
158°C/W
−40°C to +85°C
−65°C to +150°C
JEDEC industry-standard
J-STD-020
Rev. B | Page 4 of 12
ADM3232E
C1+
1
16
VCC
V+
2
15
GND
C1–
3
ADM3232E
14
4
TOP VIEW
(Not to Scale)
T1OUT
C2+
13
R1IN
C2–
5
12
R1OUT
V–
6
11
T1IN
T2OUT
7
10
T2IN
R2IN
8
9
R2OUT
06410-002
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 3
Mnemonic
C1+, C1–
2
4, 5
V+
C2+, C2–
6
7, 14
8, 13
V–
T2OUT, T1OUT
R2IN, R1IN
9, 12
10, 11
15
16
R2OUT, R1OUT
T2IN, T1IN
GND
VCC
Description
External Capacitor 1 is connected between these pins. A 0.1 μF capacitor is recommended, but larger capacitors
of up to 47 μF can be used.
Internally Generated Positive Supply (6 V Nominal).
External Capacitor 2 is connected between these pins. A 0.1 μF capacitor is recommended, but larger capacitors
of up to 47 μF can be used.
Internally Generated Negative Supply (−6 V Nominal).
Transmitter (Driver) Outputs. These are RS-232 signal levels (typically ±6 V).
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected
on each input.
Receiver Outputs. These are TTL/CMOS output logic levels.
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels.
Ground Pin. Must be connected to 0 V.
Power Supply Input (3.3 V ± 0.3 V).
Rev. B | Page 5 of 12
ADM3232E
TYPICAL PERFORMANCE CHARACTERISTICS
8
8
TxOUT (HIGH)
6
6
4
2
2
V+, V– (V)
0
–2
–2
–4
–4
TxOUT (LOW)
0
200
V–
–6
400
600
800
LOAD CAPACITANCE (pF)
1200
1000
–8
06410-003
–6
–8
0
0
2
4
6
8
LOAD CURRENT (mA)
10
12
06410-006
TxOUT (V)
V+
4
Figure 6. Charge Pump V+, V− vs. Load Current
Figure 3. Transmitter Output Voltage High/Low vs.
Load Capacitance @ 460 kbps
350
8
TxOUT HIGH
6
300
V+ (IMPEDANCE)
4
IMPEDANCE (Ω)
250
0
–2
200
V– (IMPEDANCE)
150
100
–4
TxOUT LOW
50
–6
2.9
3.1
VCC (V)
3.3
0
2.7
06410-004
–8
2.7
3.5
Figure 4. Transmitter Output Voltage vs. VCC
2.9
3.1
VCC (V)
3.3
06410-007
TxOUT (V)
2
3.5
Figure 7. Charge Pump Impedance vs. VCC
8
20
18
6
TxOUT HIGH
ICC @ 460kbps
16
4
ICC (mA)
0
–2
ICC @ 230kbps
10
8
6
–4
4
TxOUT LOW
–6
2
0
2
4
6
8
LOAD CURRENT (mA)
10
12
0
06410-005
–8
12
Figure 5. Transmitter Output Voltage High/Low vs. Load Current
0
1000
2000
LOAD CAPACITANCE (pF)
Figure 8. Power Supply Current vs. Load Capacitance
Rev. B | Page 6 of 12
3000
06410-008
TxOUT (V)
14
2
ADM3232E
T
1
T
CH 1
5.00V
CH 2
5.00V
M1.00µs
CH1
0V
06410-009
2
Figure 9. 460 kbps Data Transmission
Rev. B | Page 7 of 12
ADM3232E
THEORY OF OPERATION
The ADM3232E is a single-channel RS-232 line driver/receiver.
Step-up voltage converters, coupled with level-shifting transmitters
and receivers, allow RS-232 levels to be developed while operating
from a single 3.3 V supply.
S1
VCC
S3
C1
S2
+
C3
S4
V+ = 2VCC
+
VCC
06410-011
GND
INTERNAL
OSCILLATOR
CMOS technology is used to keep the power dissipation to an
absolute minimum, allowing maximum battery life in portable
applications.
Figure 11. Charge Pump Voltage Doubler
CIRCUIT DESCRIPTION
•
•
•
FROM
VOLTAGE
DOUBLER
A charge pump voltage converter
A 3.3 V logic to RS-232 transmitter
An RS-232 to 3.3 V logic receiver
Capacitor C3 and Capacitor C4 are used to reduce the output
ripple. Their values are not critical and can be increased, if desired.
Capacitor C3 is shown connected between V+ and VCC. It is also
acceptable to connect this capacitor between V+ and GND.
If desired, larger capacitors (up to 10 μF) can be used for
Capacitor C1 to Capacitor C4.
ADM3232E
+
T1
T1IN
+
V–
C3
0.1µF
6.3V
C4
0.1µF
10V
+
C2+ +6.6V TO –6.6V
VOLTAGE
C2–
INVERTER
R1
R1OUT
R1IN
5kΩ
R2
R2OUT
C4
V– = –(V+)
Figure 12. Charge Pump Voltage Inverter
3.3 V Logic to RS-232 Transmitter
The drivers convert 3.3 V logic input levels into RS-232 output
levels. With VCC = 3.3 V and driving an RS-232 load, the output
voltage swing is typically ±6 V.
RS-232 to 3.3 V Logic Receiver
The receivers are inverting level shifters that accept RS-232 input
levels and translate them into 3 V logic output levels. The inputs
have internal 5 kΩ pull-down resistors to ground and are protected against overvoltages up to ±30 V. Unconnected inputs
are pulled to 0 V by the internal 5 kΩ pull-down resistor. This
results in a Logic 1 output level for unconnected inputs or for
inputs connected to GND.
HIGH BAUD RATE
T2OUT
TTL/CMOS
OUTPUTS
S4
All RS-232 (TxOUT and RxIN) inputs and outputs are protected
against electrostatic discharges (up to ±15 kV). This ensures
compliance with IEC 1000-4-2 requirements.
RS-232
OUTPUTS
T2
C2
ESD Protection on RS-232 Pins
C5
0.1µF
T1OUT
TTL/CMOS
INPUTS
T2IN
S2
The receivers have Schmitt trigger inputs with a hysteresis level
of 0.4 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.
+3.3V INPUT
C2 +
0.1µF
10V
GND
+
INTERNAL
OSCILLATOR
The charge pump voltage converter consists of a 200 kHz
oscillator and a switching matrix. The converter generates a
±6.6 V supply from the input 3.3 V level. This is accomplished
in two stages by using a switched capacitor technique as shown
in Figure 10. First, the 3.3 V input supply is doubled to 6.6 V by
using Capacitor C1 as the charge storage element. The +6.6 V
level is then inverted to generate −6.6 V, using C2 as the storage
element.
C1+ +3.3V TO +6.6V VCC
VOLTAGE
C1–
V+
DOUBLER
S3
+
GND
Charge Pump Voltage Converter
C1 +
0.1µF
10V
S1
V+
06410-012
The internal circuitry consists of the following main sections:
RS-232
INPUTS*
R2IN
5kΩ
*INTERNAL 5kΩ PULL-DOWN RESISTOR
ON EACH RS-232 INPUT.
06410-010
GND
The ADM3232E features high slew rates, permitting data transmission at rates well in excess of the EIA-232E specifications.
RS-232 voltage levels are maintained at data rates up to 460 kbps,
even under worst-case loading conditions. The slew rate is
internally controlled to less than 30 V/μs to minimize EMI
interference.
Figure 10. Typical Operating Circuit
Rev. B | Page 8 of 12
ADM3232E
OUTLINE DIMENSIONS
10.00 (0.3937)
9.80 (0.3858)
4.00 (0.1575)
3.80 (0.1496)
9
16
1
6.20 (0.2441)
5.80 (0.2283)
8
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
0.50 (0.0197)
0.25 (0.0098)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AC
060606-A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 13. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters (and inches)
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.65
BSC
0.30
0.19
COPLANARITY
0.10
0.20
0.09
SEATING
PLANE
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 14. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Rev. B | Page 9 of 12
0.75
0.60
0.45
ADM3232E
10.50 (0.4134)
10.10 (0.3976)
9
16
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
8
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.75 (0.0295)
45°
0.25 (0.0098)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1.27 (0.0500)
0.40 (0.0157)
03-27-2007-B
1
Figure 15. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters (and inches)
ORDERING GUIDE
Model 1
ADM3232EARNZ
ADM3232EARNZ-REEL7
ADM3232EARUZ
ADM3232EARUZ-REEL7
ADM3232EARWZ
ADM3232EARWZ-REEL
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead TSSOP
16-Lead TSSOP
16-Lead SOIC_W
16-Lead SOIC_W
Z = RoHS Compliant Part.
Rev. B | Page 10 of 12
Package Option
R-16
R-16
RU-16
RU-16
RW-16
RW-16
ADM3232E
NOTES
Rev. B | Page 11 of 12
ADM3232E
NOTES
©2006–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06410-0-4/11(B)
Rev. B | Page 12 of 12
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