ADPOW APTC60TDUM35P Triple dual common source super junction mosfet power module Datasheet

APTC60TDUM35P
Triple dual Common Source
Super Junction MOSFET
Power Module
D3
G1
G3
S1
S3
Application
• AC Switches
• Switched Mode Power Supplies
• Uninterruptible Power Supplies
D5
G5
S5
S1/S2
S3/S 4
S5/ S6
S2
S4
S6
G2
G4
G6
D2
D4
Features
•
D6
•
•
•
D1
D3
- Ultra low RDSon
- Low Miller capacitance
- Ultra low gate charge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
High level of integration
D5
Benefits
• Outstanding performance at high frequency operation
S1
S3
S5
S1/S2
S3/S4
S5/S6
• Direct mounting to heatsink (isolated package)
S2
S4
S6
• Low junction to case thermal resistance
G2
G4
G6
• Solderable terminals both for power and signal for
easy PCB mounting
D2
D4
D6
• Very low (12mm) profile
• Each leg can be easily paralleled to achieve a dual
common source configuration of three times the
current capability
Absolute maximum ratings
Symbol
Parameter
Max ratings
Unit
VDSS
Drain - Source Breakdown Voltage
600
V
Tc = 25°C
72
ID
Continuous Drain Current
A
Tc = 80°C
54
IDM
Pulsed Drain current
200
VGS
Gate - Source Voltage
±20
V
RDSon
Drain - Source ON Resistance
35
mΩ
PD
Maximum Power Dissipation
Tc = 25°C
416
W
IAR
Avalanche current (repetitive and non repetitive)
20
A
EAR
Repetitive Avalanche Energy
1
mJ
EAS
Single Pulse Avalanche Energy
1800
G1
G3
G5
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
APT website – http://www.advancedpower.com
1-6
APTC60TDUM35P – Rev 0 September, 2004
D1
VDSS = 600V
RDSon = 35mΩ max @ Tj = 25°C
ID = 72A @ Tc = 25°C
APTC60TDUM35P
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
IDSS
RDS(on)
VGS(th)
IGSS
Characteristic
Drain - Source Breakdown Voltage
Zero Gate Voltage Drain Current
Drain – Source on Resistance
Gate Threshold Voltage
Gate – Source Leakage Current
Dynamic Characteristics
Symbol
Ciss
Coss
Crss
Qg
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain Charge
Td(on)
Turn-on Delay Time
Tr
Td(off)
Test Conditions
VGS = 0V, ID = 375µA
VGS = 0V,VDS = 600V
VGS = 0V,VDS = 600V
Min
600
Tj = 25°C
Tj = 125°C
VGS = 10V, ID = 72A
VGS = VDS, ID = 5.4mA
VGS = ±20 V, VDS = 0V
Test Conditions
VGS = 0V
VDS = 25V
f = 1MHz
Turn-off Delay Time
Tf
Fall Time
Eon
Turn-on Switching Energy X
Eoff
Turn-off Switching Energy Y
Eon
Turn-on Switching Energy X
Eoff
Turn-off Switching Energy Y
VSD
dv/dt
trr
Characteristic
Continuous Source current
(Body diode)
Diode Forward Voltage
Peak Diode Recovery Z
Reverse Recovery Time
Qrr
Reverse Recovery Charge
1
40
375
35
3.9
±150
mΩ
V
nA
Max
Unit
3
Min
Typ
14
5.13
0.42
518
VGS = 10V
VBus = 300V
ID = 72A
µA
nC
222
21
30
Test Conditions
84
1340
µJ
1960
2192
µJ
2412
Min
Tc = 25°C
Tc = 80°C
ns
283
Inductive switching @ 25°C
VGS = 15V, VBus = 400V
ID = 72A, R G = 2.5Ω
Inductive switching @ 125°C
VGS = 15V, VBus = 400V
ID = 72A, R G = 2.5Ω
Typ
72
54
VGS = 0V, IS = - 72A
IS = - 72A
VR = 350V
diS/dt = 200A/µs
Unit
V
nF
58
Source - Drain diode ratings and characteristics
Symbol
IS
Max
2.1
Inductive Switching @ 125°C
VGS = 15V
VBus = 400V
ID = 72A
R G = 2.5Ω
Rise Time
Typ
Max
Unit
A
1.2
6
Tj = 25°C
580
V
V/ns
ns
Tj = 25°C
46
µC
X Eon includes diode reverse recovery.
Y In accordance with JEDEC standard JESD24-1.
Z dv/dt numbers reflect the limitations of the circuit rather than the device itself.
IS ≤ - 72A di/dt ≤ 200A/µs
VR ≤ VDSS
Tj ≤ 150°C
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2-6
APTC60TDUM35P – Rev 0 September, 2004
Symbol
BVDSS
APTC60TDUM35P
Thermal and package characteristics
Symbol
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Characteristic
Junction to Case
Min
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500
-40
-40
-40
3
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
M6
Typ
Max
0.3
150
125
100
5
250
Unit
°C/W
V
°C
N.m
g
Package outline
APT website – http://www.advancedpower.com
3-6
APTC60TDUM35P – Rev 0 September, 2004
5 places (3:1)
APTC60TDUM35P
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.35
0.3
0.9
0.25
0.7
0.2
0.5
0.15
0.3
0.1
0.1
0.05
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
Transfert Characteristics
VGS=15&10V
6.5V
6V
5.5V
5V
4.5V
4V
VDS > ID(on)xRDS (on)MAX
250µs pulse test @ < 0.5 duty cycle
240
200
160
120
80
TJ=125°C
40
TJ=25°C
TJ=-55°C
0
0
5
10
15
20
VDS, Drain to Source Voltage (V)
25
0
Normalized to
VGS=10V @ 36A
1.05
VGS =10V
VGS=20V
1
7
DC Drain Current vs Case Temperature
80
RDS(on) vs Drain Current
1.1
1
2
3
4
5
6
VGS, Gate to Source Voltage (V)
0.95
0.9
70
60
50
40
30
20
10
0
0
20
40
60
80
I D, Drain Current (A)
100
120
25
50
75
100
125
TC, Case Temperature (°C)
APT website – http://www.advancedpower.com
150
4-6
APTC60TDUM35P – Rev 0 September, 2004
RDS(on) Drain to Source ON Resistance
I D, Drain Current (A)
280
I D, DC Drain Current (A)
ID, Drain Current (A)
Low Voltage Output Characteristics
400
360
320
280
240
200
160
120
80
40
0
1.1
1.0
0.9
0.8
0.7
-50 -25
0
25
50
75 100 125 150
ON resistance vs Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
TJ, Junction Temperature (°C)
Threshold Voltage vs Temperature
Maximum Safe Operating Area
1000
1.1
I D, Drain Current (A)
VGS(TH), Threshold Voltage
(Normalized)
1.2
1.0
0.9
0.8
0.7
0.6
100 µs
limited by RDSon
100
1 ms
10
DC line
1
10 ms
Single pulse
TJ =150°C
0.1
-50 -25
0
25
50
75 100 125 150
1
Ciss
10000
Coss
1000
Crss
100
10
0
10
20
30
40
50
VDS, Drain to Source Voltage (V)
100
1000
Gate Charge vs Gate to Source Voltage
VGS , Gate to Source Voltage (V)
Capacitance vs Drain to Source Voltage
100000
10
VDS, Drain to Source Voltage (V)
TC, Case Temperature (°C)
C, Capacitance (pF)
V GS=10V
ID= 72A
14
ID=72A
TJ=25°C
12
10
V DS=120V
VDS=300V
8
V DS =480V
6
4
2
0
0
100
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200 300 400
Gate Charge (nC)
500
600
5-6
APTC60TDUM35P – Rev 0 September, 2004
BVDSS, Drain to Source Breakdown
Voltage (Normalized)
Breakdown Voltage vs Temperature
1.2
RDS(on), Drain to Source ON resistance
(Normalized)
APTC60TDUM35P
APTC60TDUM35P
Delay Times vs Current
350
td(off)
300
250
VDS=400V
RG=2.5Ω
TJ=125°C
L=100µH
200
150
100
50
80
40
40
60
80
100
tr
20
0
20
0
120
0
20
ID, Drain Current (A)
Switching Energy (mJ)
Eon
100
120
6
Eoff
Eon
4
2
0
40
60
80 100
ID, Drain Current (A)
120
ZCS
ZVS
100
80
VDS=400V
D=50%
RG=2.5Ω
TJ=125°C
TC=75°C
hard
switching
0
15 20 25 30 35 40 45 50 55 60 65
ID, Drain Current (A)
0
5
10
15
20
25
Gate Resistance (Ohms)
Source to Drain Diode Forward Voltage
1000
TJ=150°C
100
TJ =25°C
10
1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
VSD, Source to Drain Voltage (V)
“COOLMOS™ comprise a new family of transistors developed by Infineon Technologies AG. “COOLMOS” is a trademark of Infineon
Technologies AG”.
APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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6-6
APTC60TDUM35P – Rev 0 September, 2004
20
120
Frequency (kHz)
VDS=400V
ID=72A
T J=125°C
L=100µH
8
I DR, Reverse Drain Current (A)
Switching Energy (mJ)
Eoff
Operating Frequency vs Drain Current
20
80
Switching Energy vs Gate Resistance
140
40
60
10
VDS=400V
RG=2.5Ω
TJ=125°C
L=100µH
0
60
40
ID, Drain Current (A)
Switching Energy vs Current
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
tf
60
td(on)
0
VDS=400V
RG=2.5Ω
T J=125°C
L=100µH
100
tr and t f (ns)
td(on) and td(off) (ns)
Rise and Fall times vs Current
120
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