Product Folder Sample & Buy Support & Community Tools & Software Technical Documents AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 AM26C31 Quadruple Differential Line Driver 1 Features 3 Description • The AM26C31 device is a differential line driver with complementary outputs, designed to meet the requirements of TIA/EIA-422-B and ITU (formerly CCITT). The 3-state outputs have high-current capability for driving balanced lines, such as twistedpair or parallel-wire transmission lines, and they provide the high-impedance state in the power-off condition. The enable functions are common to all four drivers and offer the choice of an active-high (G) or active-low (G) enable input. BiCMOS circuitry reduces power consumption without sacrificing speed. 1 • • • • • • • • Meets or Exceeds the Requirements of TIA/EIA422-B and ITU Recommendation V.11 Low Power, ICC = 100 μA Typical Operates From a Single 5-V Supply High Speed, tPLH = tPHL = 7 ns Typical Low Pulse Distortion, tsk(p) = 0.5 ns Typical High Output Impedance in Power-Off Conditions Improved Replacement for AM26LS31 Device Available in Q-Temp Automotive – High-Reliability Automotive Applications – Configuration Control and Print Support – Qualification to Automotive Standards On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters. The AM26C31C device is characterized for operation from 0°C to 70°C, the AM26C31I device is characterized for operation from –40°C to 85°C, the AM26C31Q device is characterized for operation over the automotive temperature range of –40°C to 125°C, and the AM26C31M device is characterized for operation over the full military temperature range of –55°C to 125°C. Device Information(1) 2 Applications • • • • • • PART NUMBER Chemical and Gas Sensors Field Transmitters: Temperature Sensors and Pressure Sensors Military: Radars and Sonars Motor Control: Brushless DC and Brushed DC Military and Avionics Imaging Temperature Sensors and Controllers Using Modbus PACKAGE BODY SIZE (NOM) AM26C31J CDIP (16) 19.56 mm × 6.92 mm AM26C31N PDIP (16) 19.30 mm × 6.35 mm AM26C31NS SO (16) 10.30 mm × 5.30 mm AM26C31W CFP (16) 10.30 mm × 6.73 mm AM26C31D SOIC (16) 9.90 mm × 3.91 mm AM26C31DB SSOP (16) 6.20 mm × 5.30 mm AM26C31PW TSSOP (16) 5.00 mm × 4.40 mm AM26C31FK LCCC (20) 8.89 mm × 8.89 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Common Application Diagram VCC VCC 0.1 PF Input 1 Signal 1A 1Y Output 1 Differential Pair 1Z G 2Z Output 2 Differential Pair Input 2 Signal 2Y 2A 16 1 15 2 14 3 13 4 12 5 11 6 10 7 9 4A Input 4 Signal 4Y 4Z G Output 4 Differential Pair Active Low Enable Signal 3Z 3Y 3A Output 3 Differential Pair Input 3 Signal 8 GND Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 4 4 4 5 10 Power Supply Recommendations ..................... 13 11 Layout................................................................... 14 5 11.1 Layout Guidelines ................................................. 14 11.2 Layout Example .................................................... 14 6.6 6.7 6.8 6.9 7 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: AM26C31C and AM26C31I .................................................................. Electrical Characteristics: AM26C31Q and AM26C31M ................................................................ Switching Characteristics: AM26C31C and AM26C31I .................................................................. Switching Characteristics: AM26C31Q and AM26C31M ................................................................ Typical Characteristics .............................................. 8 Detailed Description ............................................ 10 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 10 10 11 11 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application ................................................. 12 12 Device and Documentation Support ................. 15 6 6 7 7 Parameter Measurement Information .................. 8 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision N (October 2011) to Revision O Page • Updated the Features section and added the Applications section, the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ..................................................................................................................... 1 • Deleted Ordering Information table, see POA at the end of the data sheet........................................................................... 1 • Changed Thermal Information table ....................................................................................................................................... 5 Changes from Revision M (June 2008) to Revision N • 2 Page Changed units to mA from µA to fix units typo....................................................................................................................... 4 Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 5 Pin Configuration and Functions J, W, D, DB, NS, N, or PW Package 16-Pin CDIP, CFP, SOIC, SSOP, SO, PDIP, or TSSOP Top View 13 4Z 5 12 G 2Y 6 11 3Z 2A 7 10 3Y GND 8 9 3A NC VCC 4A 19 1Z 4 18 4Y G 5 17 4Z NC 6 16 NC 2Z 7 15 G 2Y 8 14 3Z 13 4 9 G 2Z 1 4Y 20 4A 14 12 15 3 11 2 1Z 1A 1Y 2 VCC 10 16 1Y 1 3 1A FK Package 20-Pin LCCC Top View 3Y 3A NC GND 2A Not to scale Not to scale Pin Functions PIN CDIP, CFP, SOIC, SSOP, SO, PDIP, TSSOP LCCC 1A 1 2 I Driver 1 input 1Y 2 3 O Driver 1 output 1Z 3 4 O Driver 1 inverted output 2A 7 9 I Driver 2 input 2Y 6 8 O Driver 2 output 2Z 5 7 O Driver 2 inverted output 3A 9 12 I Driver 3 input 3Y 10 13 O Driver 3 output 3Z 11 14 O Driver 3 inverted output 4A 15 19 I Driver 3 input 4Y 14 18 O Driver 3 output 4Z 13 17 O Driver 3 inverted output G 4 5 I Active high enable G 12 15 I Active low enable GND 8 10 — Ground pin NC (1) — 1, 6, 11, 16 — No internal connection VCC 16 20 — Power pin NAME (1) I/O DESCRIPTION NC – No connection Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 3 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage (2) –0.5 7 V VI Input voltage –0.5 VCC + 0.5 V VID Differential input voltage –14 14 V VO Output voltage –0.5 7 IIK IOK Input or output clamp current ±20 mA IO Output current ±150 mA 200 mA VCC current GND current –200 TJ Operating virtual junction temperature Tstg Storage temperature (1) (2) mA –65 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground terminal. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) UNIT ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) V ±1000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX 4.5 5 5.5 UNIT VCC Supply voltage VID Differential input voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V IOH High-level output current –20 mA IOL Low-level output current 20 mA ±7 TA 4 Operating free-air temperature V 2 AM26C31C V 0 70 AM26C31I –40 85 AM26C31Q –40 125 AM26C31M –55 125 Submit Documentation Feedback V °C Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 6.4 Thermal Information AM26C31 THERMAL METRIC (1) D (SOIC) DB (SSOP) PW (TSSOP) NS (SO) N (PDIP) J (CDIP) W (CFP) FK (LCCC) UNIT 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance (2) (3) 75.3 93.1 102.1 75.6 44.5 — — — °C/W RθJC(top) Junction-to-case (top) thermal resistance 35.6 43.8 37.2 32.6 31.1 39.3 (4) 58.9 (4) 37.1 (4) °C/W RθJB Junction-to-board thermal resistance 32.5 43.6 47.0 36.4 24.5 56.4 (4) 109.3 (4) 36.2 (4) °C/W ψJT Junction-to-top characterization parameter 7.1 9.6 2.8 5.7 15.4 — — — °C/W ψJB Junction-to-board characterization parameter 32.3 43.1 46.4 36.0 24.4 — — — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 12.0 (4) 5.7 (4) 4.3 (4) °C/W (1) (2) (3) (4) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Modelling assumption: MIL-STD-883 for RθJC(top) and RθJC(bot) JESD51 for RθJB. 6.5 Electrical Characteristics: AM26C31C and AM26C31I over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VOH High-level output voltage IO = –20 mA VOL Low-level output voltage IO = 20 mA VOD Differential output voltage magnitude RL = 100 Ω, see Figure 2 Δ|VOD| Change in magnitude of differential output voltage (2) RL = 100 Ω, see Figure 2 VOC Common-mode output voltage Δ|VOC| II Input current VI = VCC or GND IO(off) Driver output current with power off VCC = 0 IOS Driver output short-circuit current VO = 0 0.2 2 MAX 3.4 UNIT V 0.4 3.1 V V V RL = 100 Ω, see Figure 2 3 V Change in magnitude of common-mode output voltage (2) RL = 100 Ω, see Figure 2 ±0.4 V ±1 μA High-impedance off-state output current ICC Quiescent supply current Ci Input capacitance (3) 2.4 ±0.4 IOZ (1) (2) MIN TYP (1) TEST CONDITIONS VO = 6 V 100 VO = –0.25 V –100 –30 –150 VO = 2.5 V 20 VO = 0.5 V –20 IO = 0 VI = 0 or 5 V VI = 2.4 V or 0.5 V (3) 1.5 μA mA μA 100 μA 3 mA 6 pF All typical values are at VCC = 5 V and TA = 25°C. Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. This parameter is measured per input. All other inputs are at 0 or 5 V. Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 5 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 6.6 Electrical Characteristics: AM26C31Q and AM26C31M over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VOH High-level output voltage IO = –20 mA VOL Low-level output voltage IO = 20 mA VOD Differential output voltage magnitude RL = 100 Ω, see Figure 2 Δ|VOD| Change in magnitude of differential output voltage (2) RL = 100 Ω, see Figure 2 VOC Common-mode output voltage Δ|VOC| Change in magnitude of common-mode output voltage (2) II Input current VI = VCC or GND IO(off) Driver output current with power off VCC = 0 IOS Driver output short-circuit current VO = 0 IOZ High-impedance off-state output current ICC Quiescent supply current Ci Input capacitance (1) (2) (3) MIN TYP (1) TEST CONDITIONS 2.2 MAX 3.4 0.2 2 UNIT V 0.4 3.1 V V ±0.4 V RL = 100 Ω, see Figure 2 3 V RL = 100 Ω, see Figure 2 ±0.4 V ±1 μA VO = 6 V 100 VO = –0.25 V –100 –170 VO = 2.5 V 20 VO = 0.5 V –20 IO = 0 μA mA μA VI = 0 or 5 V 100 μA VI = 2.4 V or 0.5 V (3) 3.2 mA 6 pF All typical values are at VCC = 5 V and TA = 25°C. Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. This parameter is measured per input. All other inputs are at 0 or 5 V. 6.7 Switching Characteristics: AM26C31C and AM26C31I over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 3 7 12 3 7 12 UNIT tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tsk(p) Pulse skew time (|tPLH – tPHL|) S1 is open, see Figure 3 0.5 4 ns tr(OD), tf(OD) Differential output rise and fall times S1 is open, see Figure 4 5 10 ns tPZH Output enable time to high level 10 19 tPZL Output enable time to low level 10 19 tPHZ Output disable time from high level 7 16 tPLZ Output disable time from low level 7 16 Cpd Power dissipation capacitance (each driver) (2) (1) (2) 6 S1 is open, see Figure 3 S1 is closed, see Figure 5 S1 is closed, see Figure 5 S1 is open, see Figure 3 170 ns ns ns pF All typical values are at VCC = 5 V and TA = 25°C. Cpd is used to estimate the switching losses according to PD = Cpd × VCC 2 × f, where f is the switching frequency. Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 6.8 Switching Characteristics: AM26C31Q and AM26C31M over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS Propagation delay time, low-to-high-level output tPLH MIN TYP (1) MAX 7 12 6.5 12 S1 is open, see Figure 3 UNIT ns tPHL Propagation delay time, high-to-low-level output tsk(p) Pulse skew time (|tPLH – tPHL|) S1 is open, see Figure 3 0.5 4 ns tr(OD), tf(OD) Differential output rise and fall times S1 is open, see Figure 4 5 12 ns tPZH Output enable time to high level 10 19 tPZL Output enable time to low level 10 19 tPHZ Output disable time from high level 7 16 tPLZ Output disable time from low level 7 16 Cpd Power dissipation capacitance (each driver) (2) (1) (2) S1 is closed, see Figure 5 S1 is closed, see Figure 5 S1 is open, see Figure 3 100 ns ns pF All typical values are at VCC = 5 V and TA = 25°C. Cpd is used to estimate the switching losses according to PD = Cpd × VCC 2 × f, where f is the switching frequency. 6.9 Typical Characteristics Figure 1. Supply Current vs Switching Frequency Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 7 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 7 Parameter Measurement Information Figure 2. Differential and Common-Mode Output Voltages A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. C2 = 40 pF Input RL/2 500 Ω C1 = 40 pF 1.5 V S1 C3 = 40 pF RL/2 See Note A TEST CIRCUIT 3V 1.3 V 0V Input A (see Note B) tPLH Output Y 50% tPHL 50% 1.3 V tsk(p) Output Z 50% tsk(p) 50% 1.3 V tPHL tPLH Figure 3. Propagation Delay Time and Skew Waveforms and Test Circuit 8 A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 Parameter Measurement Information (continued) Figure 4. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. C. Each enable is tested separately. Output C2 = 40 pF 0V 3V Enable Inputs (see Note B) Input A C1 = 40 pF C3 = 40 pF G G 50 Ω 500 Ω 1.5 V S1 50 Ω Output See Note A TEST CIRCUIT Enable G Input (see Note C) 3V 1.3 V1.3 V Enable G Input Output WIth 0 V to A Input 0V 1.5 V VOL + 0.3 V VOL tPLZ Output WIth 3 V to A Input 0.8 V VOH - 0.3 V tPZL VOH 2V 1.5 V tPHZ tPZH VOLTAGE WAVEFORMS Figure 5. Output Enable and Disable Time Waveforms and Test Circuit Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 9 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 8 Detailed Description 8.1 Overview The AM26C31 is a quadruple differential line driver with complementary outputs. The device is designed to meet the requirements of TIA/EIA-422-B and ITU (formerly CCITT), and it is generally used to communicate over relatively long wires in noisy environments. 8.2 Functional Block Diagrams 4 G G 12 2 1 1A 3 6 7 2A 5 10 3A 9 11 14 4A 15 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z Copyright © 2016, Texas Instruments Incorporated Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. Figure 6. Logic Diagram (Positive Logic) 10 Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 Functional Block Diagrams (continued) TYPICAL OF ALL OUTPUTS EQUIVALENT OF EACH INPUT VCC VCC Input Output GND GND Copyright © 2016, Texas Instruments Incorporated Figure 7. Schematics of Inputs and Outputs 8.3 Feature Description 8.3.1 Active-High and Active-Low The device can be configured using the G and G logic inputs to select transmitter output. A logic high on the G pin or a logic low on the G pin enables the device to operate. These pins are simply a way to configure the logic to match that of the receiving or transmitting controller or microprocessor. 8.3.2 Operates from a Single 5-V Supply Both the logic and transmitters operate from a single 5-V rail, making designs much more simple. The line drivers and receivers can operate off the same rail as the host controller or a similar low voltage supply, thus simplifying power structure. 8.4 Device Functional Modes Table 1 lists the functional modes of the AM26C31. Table 1. Function Table (Each Driver) (1) INPUT A (1) ENABLES OUTPUTS G G Y Z H H X H L H L H X L H X L H L L X L L H X L H Z Z H = High level, L = Low level, X = Irrelevant, Z = High impedance (off) Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 11 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information When designing a system that uses drivers, receivers, and transceivers that comply with RS-422, proper cable termination is essential for highly reliable applications with reduced reflections in the transmission line. Because RS-422 allows only one driver on the bus, if termination is used, it is placed only at the end of the cable near the last receiver. Factors to consider when determining the type of termination usually are performance requirements of the application and the ever-present factor, cost. The different types of termination techniques discussed are unterminated lines, parallel termination, AC termination, and multipoint termination. For laboratory experiments, 100 feet of 100-Ω, 24-AWG, twisted-pair cable (Bertek) was used. A single driver and receiver, TI AM26C31C and AM26C32C, respectively, were tested at room temperature with a 5-V supply voltage. To show voltage waveforms related to transmission-line reflections, the first plot shows output waveforms from the driver at the start of the cable (A/B); the second plot shows input waveforms to the receiver at the far end of the cable (Y). 9.2 Typical Application VCC VCC 0.1 PF Input 1 Signal 1A 1Y Output 1 Differential Pair 1Z G 2Z Output 2 Differential Pair Input 2 Signal 2Y 2A 16 1 15 2 14 3 13 4 12 5 11 6 10 7 9 4A Input 4 Signal 4Y 4Z G Output 4 Differential Pair Active Low Enable Signal 3Z 3Y 3A Output 3 Differential Pair Input 3 Signal 8 GND Copyright © 2016, Texas Instruments Incorporated Figure 8. Differential Terminated Configuration With All Channels and Active Low Enable Used 9.2.1 Design Requirements Resistor and capacitor (if used) termination values are shown for each laboratory experiment, but vary from system to system. For example, the termination resistor, RT, must be within 20% of the characteristic impedance, Zo, of the cable and can vary from about 80 Ω to 120 Ω. 12 Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 Typical Application (continued) 9.2.2 Detailed Design Procedure Ensure values in Absolute Maximum Ratings are not exceeded. Supply voltage, VIH, and VIL must comply with Recommended Operating Conditions. 9.2.3 Application Curve 5 4 Voltage (V) 3 2 1 0 ±1 ±2 Y A/B ±3 0 0.1 0.2 0.3 Time ( s) 0.4 0.5 C001 Figure 9. Differential 120-Ω Terminated Output Waveforms (Cat 5E Cable) 10 Power Supply Recommendations Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high impedance power supplies. Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 13 AM26C31 SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 www.ti.com 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 11.2 Layout Example Differential Output 1 0.1 PF Input 1 VCC 1 1A VCC 16 2 1Y 4A 15 3 1Z 4Y 14 4 G 4Z 13 AM26C31 Differential Output 2 Input 2 5 2Z G 12 6 2Y 3Z 11 7 2A 3Y 10 8 GND 3A Active Low Enable 9 Figure 10. Trace Layout on PCB and Recommendations 14 Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 AM26C31 www.ti.com SLLS103O – DECEMBER 1990 – REVISED JUNE 2016 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. Submit Documentation Feedback Copyright © 1990–2016, Texas Instruments Incorporated Product Folder Links: AM26C31 15 PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9163901M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629163901M2A AM26C31M 5962-9163901MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901ME A AM26C31M 5962-9163901MFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901MF A AM26C31M 5962-9163901Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629163901Q2A AM26C31 MFKB 5962-9163901QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901QE A AM26C31MJB 5962-9163901QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901QF A AM26C31MWB AM26C31CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31CDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI 0 to 70 AM26C31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C31 AM26C31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C31 AM26C31CDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31C AM26C31CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31C AM26C31CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31C AM26C31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31C Addendum-Page 1 AM26C31C Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AM26C31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C31C AM26C31CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26C31CN AM26C31CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 AM26C31CN AM26C31CNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C31 AM26C31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C31 AM26C31ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AM26C31IDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI -40 to 85 AM26C31IDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AM26C31I AM26C31IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AM26C31I AM26C31IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 AM26C31I AM26C31IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AM26C31I AM26C31IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AM26C31I AM26C31IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 AM26C31IN AM26C31INE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 AM26C31IN AM26C31INSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I Addendum-Page 2 AM26C31I Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AM26C31IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 26C31I AM26C31IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 26C31I AM26C31MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629163901Q2A AM26C31 MFKB AM26C31MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901QE A AM26C31MJB AM26C31MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9163901QF A AM26C31MWB AM26C31QD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AM26C31Q AM26C31QDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 26C31Q AM26C31QDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AM26C31Q AM26C31QDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 26C31Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2016 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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OTHER QUALIFIED VERSIONS OF AM26C31, AM26C31M : • Catalog: AM26C31 • Enhanced Product: AM26C31-EP, AM26C31-EP • Military: AM26C31M NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2016 • Military - QML certified for Military and Defense Applications Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device AM26C31CDBR Package Package Pins Type Drawing SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DB 16 2000 330.0 16.4 8.2 6.6 2.5 AM26C31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31IDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 AM26C31IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31IDR SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31IDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 AM26C31IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 AM26C31IPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 AM26C31QDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 AM26C31QDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26C31CDBR SSOP DB 16 2000 367.0 367.0 38.0 AM26C31CDR SOIC D 16 2500 333.2 345.9 28.6 AM26C31IDBR SSOP DB 16 2000 367.0 367.0 38.0 AM26C31IDR SOIC D 16 2500 333.2 345.9 28.6 AM26C31IDR SOIC D 16 2500 364.0 364.0 27.0 AM26C31IDRG4 SOIC D 16 2500 333.2 345.9 28.6 AM26C31IPWR TSSOP PW 16 2000 364.0 364.0 27.0 AM26C31IPWR TSSOP PW 16 2000 367.0 367.0 35.0 AM26C31IPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 AM26C31QDR SOIC D 16 2500 367.0 367.0 38.0 AM26C31QDRG4 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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