LCD and Camera EMI Filter Array with ESD Protection CM1451 Features Product Description • • • The CM1451 is an inductor-capacitor (L-C) based EMI filter array with integrated ESD protection in CSP. The CM1450-06 and CM1450-08 are configured in 6 and 8 channel formats respectively. Each channel is implemented as a 5-pole L-C filter with the component values 9.5pF-17nH-9.5pF-17nF9.5pF. The CM1451's roll-off frequency at -10dB attenuation is 500MHz. It can be used in applications where the data rates are as high as 200Mbps while providing greater than 35dB attenuation over the 800MHz to 2.7GHz frequency range. The device has ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of •15kV, exceeding the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than •30kV. • • • • • • • • • High bandwidth, high RF rejection filter array Six and eight channels of EMI filtering Utilizes Praetorian™ inductor-based design technology for true L-C filter implementation OptiGuard™ coating for improved reliability 15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Maintains signal integrity for signals that have a risetime and falltime as fast as 2ns Chip Scale Package (CSP) features extremely low lead inductance for optimum filter and ESD performance 15-bump, 3.006mm x 1.376mm footprint Chip Scale Package (CM1451-06CS/CP) 20-bump, 4.006mm x 1.376mm footprint Chip Scale Package (CM1451-08CS/CP) Lead-free version available Applications • • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computers Wireless handsets / cell phones Wireless Handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package and easy-to-use pin assignments. In particular, the CM1451 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets while maintaining the integrity of signals that have rise/fall times as fast as 2ns. The CM1451 incorporates OptiGuard™, a coating that results in improved reliability at assembly. The CM1451 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1451/D CM1451 Electrical Schematic 1 of n EMI Filtering + ESD Channels (n = 6 for CM1451-06, 8 for CM1451-08, m=n/2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 2 of 15 | www.onsemi.com CM1451 PIN DESCRIPTIONS CM1451-06 CM1451-08 CM1451-06 CM1451-08 PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1451-06CS N516 CM1451-06CP N516 20 CSP CM1451-08CS N518 CM1451-08CP N518 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C Current per Inductor 30 mA DC Package Power Rating 500 mW Storage Temperature Range Rev. 2 | Page 3 of 15 | www.onsemi.com CM1451 STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL LTOT L1, L2 RDC IN-OUT CTOT C1, C2, C3 f f C RO PARAMETER CONDITIONS MIN TYP MAX UNITS Total Channel Inductance (L1 + L2) 34 nH Inductance 17 nH DC Channel Resistance 18 Ω Total Channel Capacitance (C1+ C2 + C3 ) At 2.5V DC, 1MHz, 30mV AC 22.8 28.5 34.2 pF Capacitance At 2.5V DC, 1MHz, 30mV AC 7.6 9.5 11.4 pF Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 260 MHz Roll-off Frequency at -10dB Attenuation ZSOURCE=50Ω, ZLOAD=50Ω 500 MHz V VDIODE Diode Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current VDIODE=+3.3V 0.1 1 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 VESD RDYN 5.6 -1.5 Dynamic Resistance Positive Negative 30 kV 15 kV 2.30 0.90 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 4 of 15 | www.onsemi.com Ω Ω CM1451 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 2 | Page 5 of 15 | www.onsemi.com CM1451 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 2 | Page 6 of 15 | www.onsemi.com CM1451 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) Rev. 2 | Page 7 of 15 | www.onsemi.com CM1451 [pF] Performance Information (cont’d) D.C.Vo ltage Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Transient Response Characteristics Figure 10. Simulated Transient Response (input signal risetime and falltime= 2ns, clocked at 25, 50 and 75 MHz, 15Ω Source Resistance, 5pF Load) Rev. 2 | Page 8 of 15 | www.onsemi.com CM1451 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 9 of 15 | www.onsemi.com 260°C CM1451 Mechanical Details CM1451-06CS/CP CSP Mechanical Specifications CM1451-06CS/CP devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.961 3.006 3.051 0.1166 0.1183 0.1201 A2 1.331 1.376 1.421 0.0524 0.0542 0.0559 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.203 0.253 0.303 0.0080 0.0100 0.0119 C2 0.203 0.253 0.303 0.0080 0.0100 0.0119 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1451-06CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 10 of 15 | www.onsemi.com CM1451 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1451-06 3.01 X 1.38 X 0.644 3.10 X 1.45 X 0.74 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Figure 12. Tape and Reel Mechanical Data Rev. 2 | Page 11 of 15 | www.onsemi.com CM1451 Mechanical Details (cont’d) CM1451-08CS/CP Mechanical Specifications CM1451-08CS/CP devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.961 4.006 4.051 0.1559 0.1577 0.1595 A2 1.331 1.376 1.421 0.0524 0.0542 0.0559 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.203 0.253 0.303 0.0080 0.0100 0.0119 C2 0.203 0.253 0.303 0.0080 0.0100 0.0119 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1451-08CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 12 of 15 | www.onsemi.com CM1451 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1451-08 4.006 X 1.376 X 0.644 4.11 X 1.57 X 0.76 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 12mm 330mm (13") 3500 4mm 4mm Figure 13. Tape and Reel Mechanical Data Rev. 2 | Page 13 of 15 | www.onsemi.com CM1451 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1450-08 4.006 X 1.376 X 0.644 4.11 X 1.57 X 0.76 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 12mm 330mm (13") 3500 4mm 4mm Figure 15. Tape and Reel Mechanical Data Rev. 2 | Page 14 of 15 | www.onsemi.com CM1451 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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