TI ADC121S101CIMFX/NOPB Single channel, 0.5 to 1 msps, 12-bit a/d converter Datasheet

ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
ADC121S101/ADC121S101–Q1 Single Channel, 0.5 to 1 Msps, 12-Bit A/D Converter
Check for Samples: ADC121S101
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
1
2
Specified Over a Range of Sample Rates
6-lead WSON and SOT-23 Packages
Variable Power Management
Single Power Supply with 2.7V - 5.25V Range
SPI™/QSPI™/MICROWIRE/DSP Compatible
AEC-Q100 Grade 1 Qualified
Portable Systems
Remote Data Acquisition
Instrumentation and Control Systems
Automotive
KEY SPECIFICATIONS
DNL: +0.5 / −0.3 LSB (typ)
INL: ±0.40 LSB (typ)
Power Consumption
– 3V Supply: 2.0 mW(typ)
– 5V Supply: 10 mW (typ)
•
•
•
DESCRIPTION
The ADC121S101 is a low-power, single channel CMOS 12-bit analog-to-digital converter with a high-speed
serial interface. Unlike the conventional practice of specifying performance at a single sample rate only, the
ADC121S101 is fully specified over a sample rate range of 500 ksps to 1 Msps. The converter is based upon a
successive-approximation register architecture with an internal track-and-hold circuit.
The output serial data is straight binary, and is compatible with several standards, such as SPI™, QSPI™,
MICROWIRE, and many common DSP serial interfaces.
The ADC121S101 operates with a single supply that can range from +2.7V to +5.25V. Normal power
consumption using a +3V or +5V supply is 2.0 mW and 10 mW, respectively. The power-down feature reduces
the power consumption to as low as 2.6 µW using a +5V supply.
The ADC121S101 is packaged in 6-lead WSON and SOT-23 packages. Operation over the temperature range of
−40°C to +125 °C is specified.
Pin-Compatible Alternatives by Resolution and Speed (1)
Resolution
(1)
Specified for Sample Rate Range of:
50 to 200 ksps
200 to 500 ksps
500 ksps to 1 Msps
12-bit
ADC121S021
ADC121S051
ADC121S101
10-bit
ADC101S021
ADC101S051
ADC101S101
8-bit
ADC081S021
ADC081S051
ADC081S101
All devices are fully pin and function compatible.
Connection Diagram
VA
1
GND
2
VIN
3
ADC121S101
6
CS
5
SDATA
4
SCLK
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2012, Texas Instruments Incorporated
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Block Diagram
VIN
T/H
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
SCLK
CONTROL
LOGIC
CS
SDATA
PIN DESCRIPTIONS
Pin No.
Symbol
Description
ANALOG I/O
3
VIN
Analog input. This signal can range from 0V to VA.
DIGITAL I/O
4
SCLK
5
SDATA
Digital clock input. This clock directly controls the conversion and readout processes.
6
CS
Chip select. On the falling edge of CS, a conversion process begins.
1
VA
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to
GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located within 1 cm of the power pin.
2
GND
The ground return for the supply and signals.
PAD
GND
For package suffix CISD(X) only, it is recommended that the center pad should be connected to ground.
Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin.
POWER SUPPLY
2
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Absolute Maximum Ratings (1) (2) (3)
−0.3V to 6.5V
Analog Supply Voltage VA
−0.3V to 6.5V
Voltage on Any Digital Pin to GND
−0.3V to (VA +0.3V)
Voltage on Any Analog Pin to GND
Input Current at Any Pin (4)
Package Input Current
±10 mA
(4)
±20 mA
See (5)
Power Consumption at TA = 25°C
ESD Susceptibility (6)
Human Body Model
3500V
Machine Model
300V
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
(1)
(2)
(3)
(4)
(5)
(6)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is
limited by the Analog Supply Voltage specification.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDmax = (TJmax − TA) / θJA. The values for maximum power dissipation listed above will be reached only when the device is operated
in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms.
Operating Ratings (1) (2)
−40°C ≤ TA ≤ +125°C
Operating Temperature Range
VA Supply Voltage
+2.7V to +5.25V
−0.3V to 5.25V
Digital Input Pins Voltage Range (regardless of supply voltage)
Analog Input Pins Voltage Range
0V to VA
Clock Frequency
25 kHz to 20 MHz
Sample Rate
(1)
(2)
up to 1 Msps
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance (1) (2)
(1)
(2)
Package
θJA
6-lead WSON
94°C / W
6-lead SOT-23
265°C / W
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to
www.national.com/packaging
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
3
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
ADC121S101 Converter Electrical Characteristics (1) (2)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 10 MHz to 20 MHz, CL = 15 pF, fSAMPLE = 500
ksps to 1 Msps, unless otherwise noted. Boldface limits apply for TA = -40°C to +125°C: all other limits TA = 25°C unless
otherwise noted.
Symbol
Parameter
Conditions
Typical
Limits (2)
Units
12
Bits
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing
Codes
VA = +2.7v to +3.6V −40°C ≤ TA ≤ 125°C
+0.4
SOT-23
-0.4
−40°C ≤ TA ≤ +85°C, VA = +2.7V to
+3.6V
+0.4
WSON
INL
-0.4
Integral Non-Linearity
SOT-23
TA = 125°C, VA = +2.7v to +3.6V
WSON
DNL
Differential Non-Linearity
+0.5
−40°C ≤ TA ≤ +85°C, VA = +2.7V to +3.6V
−0.3
TA = 125°C, VA = +2.7v to +3.6V
VOFF
Offset Error
−40°C ≤ TA ≤ 125°C, VA = +2.7v to +3.6V
GE
Gain Error
−40°C ≤ TA ≤ 125°C, VA = +2.7 to +3.6V
±1.0
+1.0
LSB (max)
LSB (min)
LSB (max)
-1.2
LSB (min)
+1.0
LSB (max)
-1.1
LSB (min)
+1.0
LSB (max)
-1.3
LSB (min)
+1.0
LSB (max)
-0.9
LSB (min)
±1.0
LSB (max)
LSB (max)
±0.1
±1.2
SOT-23
±0.20
±1.2
LSB (max)
WSON
±0.20
±1.5
LSB (max)
VA = +2.7 to 5.25V, −40°C ≤ TA ≤ 125°C
fIN = 100 kHz, −0.02 dBFS
72
70
dB (min)
VA = +2.7 to 5.25V, −40°C ≤ TA ≤ +85°C
fIN = 100 kHz, −0.02 dBFS
72.5
70.8
LSB (min)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
SNR
Signal-to-Noise Plus
Distortion Ratio
Signal-to-Noise Ratio
dB (min)
VA = +2.7 to 5.25V, TA = +125°C
fIN = 100 kHz, −0.02 dBFS
70.6
THD
Total Harmonic Distortion
VA = +2.7 to 5.25V, fIN = 100 kHz, −0.02 dBFS
−80
dB (max)
SFDR
Spurious-Free Dynamic
Range
VA = +2.7 to 5.25V, fIN = 100 kHz, −0.02 dBFS
82
dB (min)
ENOB
Effective Number of Bits
VA = +2.7 to 5.25V, fIN = 100 kHz, −0.02 dBFS
11.6
Intermodulation Distortion,
Second Order Terms
VA = +5.25V, fa = 103.5 kHz, fb = 113.5 kHz
−78
dB
Intermodulation Distortion,
Third Order Terms
VA = +5.25V, fa = 103.5 kHz, fb = 113.5 kHz
−78
dB
VA = +5V
11
MHz
VA = +3V
8
MHz
0 to VA
V
IMD
FPBW
-3 dB Full Power Bandwidth
11.3
Bits (min)
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
IDCL
DC Leakage Current
CINA
(1)
(2)
4
Input Capacitance
±1
µA (max)
Track Mode
30
pF
Hold Mode
4
pF
Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Data sheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
ADC121S101 Converter Electrical Characteristics(1)(2) (continued)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 10 MHz to 20 MHz, CL = 15 pF, fSAMPLE = 500
ksps to 1 Msps, unless otherwise noted. Boldface limits apply for TA = -40°C to +125°C: all other limits TA = 25°C unless
otherwise noted.
Symbol
Limits (2)
Units
VA = +5.25V
2.4
V (min)
VA = +3.6V
2.1
V (min)
VA = +5V
0.8
V (max)
VA = +3V
0.4
V (max)
±0.1
±1
µA (max)
2
4
pF (max)
ISOURCE = 200 µA
VA − 0.07
VA − 0.2
V (min)
ISOURCE = 1 mA
VA − 0.1
ISINK = 200 µA
0.03
0.4
V (max)
ISINK = 1 mA
0.1
Parameter
Conditions
Typical
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current
CIND
Digital Input Capacitance
VIN = 0V or VA
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output High Voltage
VOL
Output Low Voltage
IOZH,
IOZL
TRI-STATE Leakage
Current
COUT
TRI-STATE Output
Capacitance
V
V
±0.1
±10
µA (max)
2
4
pF (max)
Output Coding
Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS
VA
2.7
Supply Voltage
VA = +5.25V, fSAMPLE = 1 Msps
Supply Current, Normal
Mode (Operational, CS low) VA = +3.6V, fSAMPLE = 1 Msps
IA
PD
V (min)
5.25
V (max)
2.0
3.2
mA (max)
0.6
1.5
mA (max)
Supply Current, Shutdown
(CS high)
fSCLK = 0 MHz, VA = +5V, fSAMPLE = 0 ksps
500
nA
fSCLK = 20 MHz, VA = +5V, fSAMPLE = 0 ksps
60
µA
Power Consumption,
Normal Mode (Operational,
CS low)
VA = +5V
10
16
mW (max)
VA = +3V
2.0
4.5
mW (max)
Power Consumption,
Shutdown (CS high)
fSCLK = 0 MHz, VA = +5V, fSAMPLE = 0 ksps
2.5
µW
fSCLK = 20 MHz, VA = +5V, fSAMPLE = 0 ksps
300
µW
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency (3)
See (4)
fS
Sample Rate
See (4)
DC
SCLK Duty Cycle
tACQ
Minimum Time Required for
Acquisition
fSCLK = 20 MHz
50
(5)
10
MHz (min)
20
MHz (max)
500
ksps (min)
1
Msps (max)
40
% (min)
60
% (max)
350
ns (max)
50
ns (min)
tQUIET
See
tAD
Aperture Delay
3
ns
tAJ
Aperture Jitter
30
ps
(3)
(4)
(5)
This condition is for fSCLK = 20 MHz.
This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is
specified under Operating Ratings.
Minimum Quiet Time required by bus relinquish and the start of the next conversion.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
5
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
ADC121S101 Timing Specifications
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 10.0 MHz to 20.0 MHz, CL = 25 pF, fSAMPLE =
500 ksps to 1 Msps, Boldface limits apply for TA = -40°C to +125°C; all other limits TA = 25°C.
Symbol
Limits
Units
tCS
Minimum CS Pulse Width
Parameter
Conditions
Typical
10
ns (min)
tSU
CS to SCLK Setup Time
10
ns (min)
tEN
Delay from CS Until SDATA TRI-STATE Disabled (1)
20
ns (max)
tACC
Data Access Time after SCLK Falling Edge (2)
VA = +2.7 to +3.6
40
ns (max)
VA = +4.75 to +5.25
20
ns (max)
tCL
SCLK Low Pulse Width
0.4 x tSCLK
ns (min)
tCH
SCLK High Pulse Width
0.4 x tSCLK
ns (min)
7
ns (min)
tH
VA = +2.7V to +3.6V
SCLK to Data Valid Hold Time
VA = +4.75V to +5.25V
VA = +2.7V to +3.6V
tDIS
SCLK Falling Edge to SDATA High Impedance (3)
VA = +4.75V to +5.25V
tPOWER-UP
(1)
(2)
(3)
Power-Up Time from Full Power-Down
1
5
ns (min)
25
ns (max)
6
ns (min)
25
ns (max)
5
ns (min)
µs
Measured with the timing test circuit shown in Timing Diagrams and defined as the time taken by the output signal to cross 1.0V.
Measured with the timing test circuit shown in Timing Diagrams and defined as the time taken by the output signal to cross 1.0V or 2.0V.
tDIS is derived from the time taken by the outputs to change by 0.5V with the timing test circuit shown in Timing Diagrams. The
measured number is then adjusted to remove the effects of charging or discharging the output capacitance. This means that tDIS is the
true bus relinquish time, independent of the bus loading.
Timing Diagrams
IOL
200 PA
To Output Pin
1.6 V
CL
25 pF
IOH
200 PA
Figure 1. Timing Test Circuit
6
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Hold
Track
|
CS
tCS
tSU
tACQ
tCL
1
2
3
4
12
13
14
15
16
17
18
Z1
Z0
DB11
3 leading zero bits
19
20
tQUIET
tCH
tH
|
Z2
5
tACC
tEN
SDATA
|
SCLK
tDIS
TRI-STATE
DB3
DB2
DB1
DB0
12 data bits
Figure 2. ADC121S101 Serial Timing Diagram
SPECIFICATION DEFINITIONS
ACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold
capacitor to charge up to the input voltage. Acquisition time is measured backwards from the falling edge of CS
when the signal is sampled and the part moves from Track to Hold. The start of the time interval that contains
tACQ is the 13th rising edge of SCLK of the previous conversion when the part moves from hold to track. The user
must ensure that the time between the 13th rising edge of SCLK and the falling edge of the next CS is not less
than tACQ to meet performance specifications.
APERTURE DELAY is the time after the falling edge of CS to when the input signal is acquired or held for
conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample.
Aperture jitter manifests itself as noise in the output.
CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input
voltage to a digital word. This is from the falling edge of CS when the input signal is sampled to the 16th falling
edge of SCLK when the SDATA output goes into TRI-STATE.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and says that the converter is equivalent to
a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF − 1.5
LSB), after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
7
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in
the second and third order intermodulation products to the sum of the power in both of the original frequencies.
IMD is usually expressed in dB.
MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC121S101 is
guaranteed not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND +
0.5 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms
value of the sum of all other spectral components below one-half the sampling frequency, not including
harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral components below half the clock frequency, including
harmonics but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal
amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is
any signal present in the output spectrum that is not present at the input and may or may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the rms total of the first five
harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is
calculated as
2
THD = 20 ‡ log10
Af2 +
Af1
2
+ Af6
2
(1)
where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the
first 5 harmonic frequencies.
THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the
acquisition time plus the conversion time.
8
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Typical Performance Characteristics
TA = +25°C, fSAMPLE = 500 ksps to 1 Msps,fSCLK = 10 MHz to 20 MHz, fIN = 100 kHz unless otherwise stated.
DNL fSCLK = 10 MHz
INL fSCLK = 10 MHz
Figure 3.
Figure 4.
DNL fSCLK = 20 MHz
INL fSCLK = 20 MHz
Figure 5.
Figure 6.
DNL vs. Clock Frequency
INL vs. Clock Frequency
Figure 7.
Figure 8.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
9
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 500 ksps to 1 Msps,fSCLK = 10 MHz to 20 MHz, fIN = 100 kHz unless otherwise stated.
10
SNR vs. Clock Frequency
SINAD vs. Clock Frequency
Figure 9.
Figure 10.
SFDR vs. Clock Frequency
THD vs. Clock Frequency
Figure 11.
Figure 12.
Spectral Response, VA = 5.25V
fSCLK = 10 MHz
Spectral Response, VA = 5.25V
fSCLK = 20 MHz
Figure 13.
Figure 14.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 500 ksps to 1 Msps,fSCLK = 10 MHz to 20 MHz, fIN = 100 kHz unless otherwise stated.
Power Consumption vs.
Throughput, fSCLK = 20 MHz
Figure 15.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
11
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
APPLICATIONS INFORMATION
ADC121S101 OPERATION
The ADC121S101 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter core. Simplified schematics of the ADC121S101 in both track and hold
modes are shown in Figure 16 and Figure 17, respectively. In Figure 16, the device is in track mode: switch SW1
connects the sampling capacitor to the input, and SW2 balances the comparator inputs. The device is in this
state until CS is brought low, at which point the device moves to hold mode.
Figure 17 shows the device in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining
the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the chargeredistribution DAC to add or subtract fixed amounts of charge from the sampling capacitor until the comparator is
balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of
the analog input voltage. The device moves from hold mode to track mode on the 13th rising edge of SCLK.
CHARGE
REDISTRIBUTION
DAC
VIN
SAMPLING
CAPACITOR
SW1
SW2
GND
+
-
CONTROL
LOGIC
VA
2
Figure 16. ADC121S101 in Track Mode
CHARGE
REDISTRIBUTION
DAC
VIN
SAMPLING
CAPACITOR
SW1
SW2
GND
+
-
CONTROL
LOGIC
VA
2
Figure 17. ADC121S101 in Hold Mode
USING THE ADC121S101
The serial interface timing diagram for the ADC is shown in Figure 2. CS is chip select, which initiates
conversions on the ADC and frames the serial data transfers. SCLK (serial clock) controls both the conversion
process and the timing of serial data. SDATA is the serial data out pin, where a conversion result is found as a
serial data stream.
Basic operation of the ADC begins with CS going low, which initiates a conversion process and data transfer.
Subsequent rising and falling edges of SCLK will be labelled with reference to the falling edge of CS; for
example, "the third falling edge of SCLK" shall refer to the third falling edge of SCLK after CS goes low.
At the fall of CS, the SDATA pin comes out of TRI-STATE, and the converter moves from track mode to hold
mode. The input signal is sampled and held for conversion on the falling edge of CS. The converter moves from
hold mode to track mode on the 13th rising edge of SCLK (see Figure 2). It is at this point that the interval for the
tACQ specification begins. In the worst case, 350ns must pass between the 13th rising edge and the next falling
edge of SCLK. The SDATA pin will be placed back into TRI-STATE after the 16th falling edge of SCLK, or at the
rising edge of CS, whichever occurs first. After a conversion is completed, the quiet time tQUIET must be satisfied
before bringing CS low again to begin another conversion.
12
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Sixteen SCLK cycles are required to read a complete sample from the ADC. The sample bits (including leading
zeroes) are clocked out on falling edges of SCLK, and are intended to be clocked in by a receiver on subsequent
falling edges of SCLK. The ADC will produce three leading zero bits on SDATA, followed by twelve data bits,
most significant first.
If CS goes low before the rising edge of SCLK, an additional (fourth) zero bit may be captured by the next falling
edge of SCLK.
Determining Throughput
Throughput depends on the frequency of SCLK and how much time is allowed to elapse between the end of one
conversion and the start of another. At the maximum specified SCLK frequency, the maximum guaranteed
throughput is obtained by using a 20 SCLK frame. As shown in Figure 2, the minimum allowed time between CS
falling edges is determined by 1) 12.5 SCLKs for Hold mode, 2) the larger of two quantities: either the minimum
required time for Track mode (tACQ) or 2.5 SCLKs to finish reading the result and 3) 0, 1/2 or 1 SCLK padding to
ensure an even number of SCLK cycles so there is a falling SCLK edge when CS next falls.
For example, at the fastest rate for this family of parts, SCLK is 20MHz and 2.5 SCLKs are 125ns, so the
minimum time between CS falling edges is calculated by
12.5*50ns + 350ns + 0.5*50ns = 1000ns
(2)
(12.5 SCLKs + tACQ + 1/2 SCLK) which corresponds to a maximum throughput of 1MSPS. At the slowest rate for
this family, SCLK is 1MHz. Using a 20 cycle conversion frame as shown in Figure 2 yields a 20µs time between
CS falling edges for a throughput of 50KSPS.
It is possible, however, to use fewer than 20 clock cycles provided the timing parameters are met. With a 1MHz
SCLK, there are 2500ns in 2.5 SCLK cycles, which is greater than tACQ. After the last data bit has come out, the
clock will need one full cycle to return to a falling edge. Thus the total time between falling edges of CS is
12.5*1µs +2.5*1µs +1*1µs=16µs which is a throughput of 62.5KSPS.
ADC TRANSFER FUNCTION
The output format of the ADC is straight binary. Code transitions occur midway between successive integer LSB
values. The LSB width for the ADC is VA/4096. The ideal transfer characteristic is shown in Figure 18. The
transition from an output code of 0000 0000 0000 to a code of 0000 0000 0001 is at 1/2 LSB, or a voltage of
VA/8192. Other code transitions occur at steps of one LSB.
111...111
111...000
|
|
ADC CODE
111...110
1 LSB = VA/4096
011...111
000...010
|
000...001
000...000
0V
0.5 LSB
ANALOG INPUT
+VA-1.5 LSB
Figure 18. Ideal Transfer Characteristic
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
13
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
TYPICAL APPLICATION CIRCUIT
A typical application of the ADC is shown in Figure 19. Power is provided in this example by the National
Semiconductor LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output
voltages. The power supply pin is bypassed with a capacitor network located close to the ADC. Because the
reference for the ADC is the supply voltage, any noise on the supply will degrade device noise performance. To
keep noise off the supply, use a dedicated linear regulator for this device, or provide sufficient decoupling from
other circuitry to keep noise off the ADC supply pin. Because of the ADC's low power requirements, it is also
possible to use a precision reference as a power supply to maximize performance. The three-wire interface is
shown connected to a microprocessor or DSP.
LP2950
1 PF
5V
0.1 PF
1 PF
0.1 PF
VA
SCLK
VIN
ADC121S101
MICROPROCESSOR
DSP
CS
SDATA
GND
Figure 19. Typical Application Circuit
ANALOG INPUTS
An equivalent circuit for the ADC's input is shown in Figure 20. Diodes D1 and D2 provide ESD protection for the
analog inputs. At no time should the analog input go beyond (VA + 300 mV) or (GND − 300 mV), as these ESD
diodes will begin conducting, which could result in erratic operation. For this reason, the ESD diodes should not
be used to clamp the input signal.
The capacitor C1 in Figure 20 has a typical value of 4 pF, and is mainly the package pin capacitance. Resistor
R1 is the on resistance of the track / hold switch, and is typically 500Ω. Capacitor C2 is the ADC sampling
capacitor and is typically 26 pF. The ADC will deliver best performance when driven by a low-impedance source
to eliminate distortion caused by the charging of the sampling capacitance. This is especially important when
using the ADC to sample AC signals. Also important when sampling dynamic signals is an anti-aliasing filter.
VA
D1
R1
C2
26 pF
VIN
C1
4 pF
D2
Conversion Phase - Switch Open
Track Phase - Switch Closed
Figure 20. Equivalent Input Circuit
DIGITAL INPUTS AND OUTPUTS
The ADC digital inputs (SCLK and CS) are not limited by the same maximum ratings as the analog inputs. The
digital input pins are instead limited to +5.25V with respect to GND, regardless of VA, the supply voltage. This
allows the ADC to be interfaced with a wide range of logic levels, independent of the supply voltage.
14
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
MODES OF OPERATION
The ADC has two possible modes of operation: normal mode, and shutdown mode. The ADC enters normal
mode (and a conversion process is begun) when CS is pulled low. The device will enter shutdown mode if CS is
pulled high before the tenth falling edge of SCLK after CS is pulled low, or will stay in normal mode if CS remains
low. Once in shutdown mode, the device will stay there until CS is brought low again. By varying the ratio of time
spent in the normal and shutdown modes, a system may trade-off throughput for power consumption, with a
sample rate as low as zero.
Normal Mode
The fastest possible throughput is obtained by leaving the ADC in normal mode at all times, so there are no
power-up delays. To keep the device in normal mode continuously, CS must be kept low until after the 10th
falling edge of SCLK after the start of a conversion (remember that a conversion is initiated by bringing CS low).
If CS is brought high after the 10th falling edge, but before the 16th falling edge, the device will remain in normal
mode, but the current conversion will be aborted, and SDATA will return to TRI-STATE (truncating the output
word).
Sixteen SCLK cycles are required to read all of a conversion word from the device. After sixteen SCLK cycles
have elapsed, CS may be idled either high or low until the next conversion. If CS is idled low, it must be brought
high again before the start of the next conversion, which begins when CS is again brought low.
After sixteen SCLK cycles, SDATA returns to TRI-STATE. Another conversion may be started, after tQUIET has
elapsed, by bringing CS low again.
Shutdown Mode
Shutdown mode is appropriate for applications that either do not sample continuously, or it is acceptable to trade
throughput for power consumption. When the ADC is in shutdown mode, all of the analog circuitry is turned off.
To enter shutdown mode, a conversion must be interrupted by bringing CS high anytime between the second
and tenth falling edges of SCLK, as shown in Figure 21. Once CS has been brought high in this manner, the
device will enter shutdown mode; the current conversion will be aborted and SDATA will enter TRI-STATE. If CS
is brought high before the second falling edge of SCLK, the device will not change mode; this is to avoid
accidentally changing mode as a result of noise on the CS line.
Figure 21. Entering Shutdown Mode
Figure 22. Entering Normal Mode
To exit shutdown mode, bring CS back low. Upon bringing CS low, the ADC will begin powering up (power-up
time is specified in the ADC121S101 Timing Specifications table). This power-up delay results in the first
conversion result being unusable. The second conversion performed after power-up, however, is valid, as shown
in Figure 22.
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
15
ADC121S101
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
www.ti.com
If CS is brought back high before the 10th falling edge of SCLK, the device will return to shutdown mode. This is
done to avoid accidentally entering normal mode as a result of noise on the CS line. To exit shutdown mode and
remain in normal mode, CS must be kept low until after the 10th falling edge of SCLK. The ADC will be fully
powered-up after 16 SCLK cycles.
POWER MANAGEMENT
The ADC takes time to power-up, either after first applying VA, or after returning to normal mode from shutdown
mode. This corresponds to one "dummy" conversion for any SCLK frequency within the specifications in this
document. After this first dummy conversion, the ADC will perform conversions properly. Note that the tQUIET time
must still be included between the first dummy conversion and the second valid conversion.
When the VA supply is first applied, the ADC may power up in either of the two modes: normal or shutdown. As
such, one dummy conversion should be performed after start-up, as described in the previous paragraph. The
part may then be placed into either normal mode or the shutdown mode, as described in Normal Mode and
Shutdown Mode.
When the ADC is operated continuously in normal mode, the maximum throughput is fSCLK / 20 at the maximum
specified fSCLK. Throughput may be traded for power consumption by running fSCLK at its maximum specified rate
and performing fewer conversions per unit time, raising the ADC CS line after the 10th and before the 15th fall of
SCLK of each conversion. A plot of typical power consumption versus throughput is shown in the Typical
Performance Characteristics section. To calculate the power consumption for a given throughput, multiply the
fraction of time spent in the normal mode by the normal mode power consumption and add the fraction of time
spent in shutdown mode multiplied by the shutdown mode power consumption. Note that the curve of power
consumption vs. throughput is essentially linear. This is because the power consumption in the shutdown mode
is so small that it can be ignored for all practical purposes.
POWER SUPPLY NOISE CONSIDERATIONS
The charging of any output load capacitance requires current from the power supply, VA. The current pulses
required from the supply to charge the output capacitance will cause voltage variations on the supply. If these
variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore,
discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current
into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the
substrate that will degrade noise performance if that current is large enough. The larger the output capacitance,
the more current flows through the die substrate and the greater is the noise coupled into the analog channel,
degrading noise performance.
To keep noise out of the power supply, keep the output load capacitance as small as practical. It is good practice
to use a 100 Ω series resistor at the ADC output, located as close to the ADC output pin as practical. This will
limit the charge and discharge current of the output capacitance and improve noise performance.
16
Submit Documentation Feedback
Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: ADC121S101
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
ADC121S101CIMF
ACTIVE
SOT-23
DBV
6
1000
TBD
Call TI
Call TI
-40 to 125
X01C
ADC121S101CIMF/NOPB
ACTIVE
SOT-23
DBV
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X01C
ADC121S101CIMFX
ACTIVE
SOT-23
DBV
6
3000
TBD
Call TI
Call TI
-40 to 125
X01C
ADC121S101CIMFX/NOPB
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X01C
ADC121S101CISD
ACTIVE
WSON
NGF
6
1000
TBD
Call TI
Call TI
-40 to 125
X1C
ADC121S101CISD/NOPB
ACTIVE
WSON
NGF
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X1C
ADC121S101CISDX
ACTIVE
WSON
NGF
6
4500
TBD
Call TI
Call TI
-40 to 125
X1C
ADC121S101CISDX/NOPB
ACTIVE
WSON
NGF
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X1C
ADC121S101QIMF/NOPB
ACTIVE
SOT-23
DBV
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
ADC121S101QIMFX/NOPB
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ADC121S101, ADC121S101-Q1 :
• Catalog: ADC121S101
• Automotive: ADC121S101-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
SOT-23
DBV
6
1000
178.0
8.4
ADC121S101CIMF/NOPB SOT-23
ADC121S101CIMF
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
DBV
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-23
DBV
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-23
DBV
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
WSON
NGF
6
1000
178.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
ADC121S101CISD/NOPB WSON
NGF
6
1000
178.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
WSON
NGF
6
4500
330.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
WSON
NGF
6
4500
330.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
ADC121S101CIMFX
ADC121S101CIMFX/NOP
B
ADC121S101CISD
ADC121S101CISDX
ADC121S101CISDX/NOP
B
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADC121S101CIMF
SOT-23
DBV
6
1000
203.0
190.0
41.0
ADC121S101CIMF/NOPB
SOT-23
DBV
6
1000
203.0
190.0
41.0
ADC121S101CIMFX
SOT-23
DBV
6
3000
206.0
191.0
90.0
SOT-23
DBV
6
3000
206.0
191.0
90.0
ADC121S101CIMFX/NOP
B
ADC121S101CISD
WSON
NGF
6
1000
203.0
190.0
41.0
ADC121S101CISD/NOPB
WSON
NGF
6
1000
203.0
190.0
41.0
ADC121S101CISDX
WSON
NGF
6
4500
349.0
337.0
45.0
WSON
NGF
6
4500
349.0
337.0
45.0
ADC121S101CISDX/NOP
B
Pack Materials-Page 2
MECHANICAL DATA
NGF0006A
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated