ESDALY Automotive dual Transil™ array for ESD protection Features 3 ■ Dual unidirectional Transil functions ■ Low leakage current: IR max. < 20 µA at VBR ■ 300 W peak pulse power (8/20 µs) 2 1 Benefits ■ High ESD protection level: up to 25 kV ■ High integration ■ Suitable for high density boards ■ AEC-Q101 qualified SOT23-3L Figure 1. Functional diagram 1 Complies with the following standards ■ ISO 10605: C = 150 pF, R = 330 Ω – 30 kV (air discharge) – 30 kV (contact discharge) ■ ISO 10605: C = 330 pF, R = 330 Ω – 30 kV (air discharge) – 30 kV (contact discharge) ■ ISO 7637-2(a) – Pulse 1: VS = -100 V – Pulse 2a: VS = +50 V – Pulse 3a: VS = -150 V – Pulse 3b: VS = +100 V 3 2 Description The ESDALY is a monolithic array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. It can also be used as bidirectional suppressor by connecting only pin 1 and 2. Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Entertainment ■ Signal communications ■ Connectivity ■ Comfort and convenience a. Not applicable to parts with stand-off voltage lower than the average battery voltage (13.5 V) February 2012 TM: Transil is a trademark of STMicroelectronics. Doc ID 022075 Rev 1 1/10 www.st.com 10 Characteristics ESDALY 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP PPP Parameter Peak pulse voltage(1) Value ISO 10605 (C = 330 pF, R = 330 Ω): contact discharge air discharge ISO 10605: C = 150 pF, R = 330 Ω contact discharge air discharge Unit 30 30 kV 30 30 Peak pulse power (8/20µs) ESDA5V3LY ESDA6V1LY ESDA14V2LY ESDA25LY 300 W 25 18 14 7 A IPP Peak pulse current (8/20µs) Tj Operating junction temperature range -40 to 150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s at 5 mm from case 260 °C 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2. Electrical characteristics (definitions) Symbol VBR VCL IRM VRM IPP IR IPP Rd αT Cline 2/10 = = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current Breakdown current Forward current Dynamic resistance Voltage temperature coefficient Line capacitance Doc ID 022075 Rev 1 I IF VCL VBR VRM VF IRM IR Slope = 1/Rd IPP V ESDALY Characteristics Table 2. Electrical characteristics (values, Tamb = 25 °C) VBR @ IR Order code IRM @ VRM Max. VCL@IPP(1) Max. VF@ IF Max. Rd(2) αT(3) Cline Typ. Max. Typ. Min. Max. V V mA µA V V A V mA mΩ 10-4/°C pF ESDA5V3LY 5.3 5.9 1 2 3 19 25 1.25 200 280 5 220 ESDA6V1LY 6.1 7.2 1 20 5.2 16 18 1.25 200 350 6 140 ESDA14V2LY 14.2 15.8 1 5 12 21 14 1.25 200 650 10 90 ESDA25LY 25 30 1 1 24 43 7 1.2 10 1000 10 50 1. 8/20 µs waveform 2. Square pulse, Ipp = 15 A, tp= 2.5 µs. 3. Δ VBR = αT* (Tamb - 25 °C) * VBR (25 °C) Figure 3. Variation of peak pulse power versus initial junction temperature Ppp (W) 600.0 Figure 4. 10000 400.0 1000 200.0 100 0 25 Figure 5. 100.0 50 75 100 125 Ppp (W) 150 175 Variation of clamping voltage versus peak pulse current (max. values, 8/20 µs waveform) 10 1 Figure 6. Ipp (A) 8/20µs Tj initial = 25 °C ESDA5V3LY ESDA6V1LY ESDA14V2LY ESDA25LY 10.0 Tj initial = 25 °C tp (µs) Tj(°C) 0.0 Peak pulse power versus exponential pulse duration (typical values) 10000.0 10 100 1000 Relative variation of leakage current versus junction temperature (typical values) IR (nA) 1000.0 100.0 10.0 1.0 1.0 0.1 VCL (V) 0.1 0 4 8 12 16 20 24 28 32 36 40 Tj(°C) 0.0 44 25 Doc ID 022075 Rev 1 50 75 ESDA5V3LY (VR=VRM=3V) ESDA6V1LY (VR=VRM=5.2V) ESDA14V2LY (VR=VRM=12V) ESDA25LY (VR=VRM=24V) 100 125 150 3/10 Characteristics ESDALY Figure 7. ISO 7637-2 pulse 1 response (VS = -100 V) Figure 8. Figure 9. ISO 7637-2 pulse 3a response (VS = -150 V) Figure 10. ISO 7637-2 pulse 3b response (VS = 100 V) Note: ISO7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 V) like ESDA5V3LY and ESDA6V1LY. 4/10 Doc ID 022075 Rev 1 ISO 7637-2 pulse 2a response (VS = 50 V) ESDALY 2 Application and design guidelines Application and design guidelines More information is available in the application note: AN2689, “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 3 Ordering information scheme Figure 11. Ordering information scheme ESDA XXX LY ESD array Minimum breakdown voltage Package L = SOT23-3L Y = Automotive grade Doc ID 022075 Rev 1 5/10 Package information 4 ESDALY Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT23-3L dimensions Dimensions Ref. A Inches Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 E e B Millimeters D e1 S A1 L c H L S 0.6 typ. 0.35 0.65 Figure 12. Footprint (dimensions in mm) 0.95 0.61 1.26 0.73 6/10 Doc ID 022075 Rev 1 3.25 0.024 typ. 0.014 0.026 ESDALY Recommendation on PCB assembly Figure 13. Tape and reel specifications 2.0 Ø 1.55 4.0 8.0 3.5 2.1 2.9 1.75 0.21 3.1 4.0 1.24 All dimensions are typical values in mm User direction of unreeling 5 Recommendation on PCB assembly 5.1 Solder paste 5.2 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. Doc ID 022075 Rev 1 7/10 Recommendation on PCB assembly 5.3 5.4 ESDALY PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s to -3 °C/s -6 °C/s max 2 - 3 °C/s 60 sec (90 max) 200 150 100 0.9 °C/s 50 Time (s) 0 Note: 8/10 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 022075 Rev 1 ESDALY 6 Ordering information Ordering information Table 4. Ordering information Order code Marking(1) ESDA5V3LY EL5Y ESDA6V1LY EL6Y ESDA14V2LY EL1Y ESDA25LY EL2Y Package Weight Base qty Delivery mode SOT23-3L 8.7 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 7 Revision history Table 5. Document revision history Date Revision Changes 16-Feb-2012 1 Initial version. This document merges and updates the content of the datasheet ESDA25LY Revision 1, 01-Feb-2010. Doc ID 022075 Rev 1 9/10 ESDALY Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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