TI1 DAC084S085CISDX/NOPB Dac084s085 8-bit micropower quad digital-to-analog converter with rail-to-rail output Datasheet

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DAC084S085
SNAS363F – MAY 2006 – REVISED MARCH 2016
DAC084S085 8-Bit Micropower QUAD Digital-to-Analog Converter With Rail-to-Rail Output
1 Features
3 Description
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The DAC084S085 is a full-featured, general-purpose
QUAD 8-bit voltage-output digital-to-analog converter
(DAC) that can operate from a single 2.7-V to 5.5-V
supply and consumes 1.1 mW at 3 V and 2.5 mW at
5 V. The DAC084S085 is packaged in 10-pin SON
and VSSOP packages. The 10-pin SON package
makes the DAC084S085 the smallest QUAD DAC in
its class. The on-chip output amplifier allows rail-torail output swing and the three wire serial interface
operates at clock rates up to 40 MHz over the entire
supply voltage range. Competitive devices are limited
to 25-MHz clock rates at supply voltages in the 2.7-V
to 3.6-V range. The serial interface is compatible with
standard SPI, QSPI, MICROWIRE, and DSP
interfaces.
1
Ensured Monotonicity
Low-Power Operation
Rail-to-Rail Voltage Output
Power-On Reset to 0 V
Simultaneous Output Updating
Wide Power Supply Range (2.7 V to 5.5 V)
Industry's Smallest Package
Power Down Modes
Key Specifications
– Resolution: 8 Bits
– INL: ±0.5 LSB (Maximum)
– DNL: +0.18 / −0.13 LSB (Maximum)
– Setting Time: 4.5 µs (Maximum)
– Zero Code Error: +15 mV (Maximum)
– Full-Scale Error: −0.75 %FS (Maximum)
– Supply Power:
– Normal: 1.1 mW (3 V) / 2.5 mW (5 V)
Typical
– Power Down: 0.3 µW (3 V) / 0.8 µW (5 V)
Typical
2 Applications
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The reference for the DAC084S085 serves all four
channels and can vary in voltage between 1 V and
VA, providing the widest possible output dynamic
range. The DAC084S085 has a 16-bit input shift
register that controls the outputs to be updated, the
mode of operation, the power-down condition, and
the binary input data. All four outputs can be updated
simultaneously or individually depending on the
setting of the two mode of operation bits.
Device Information(1)
PART NUMBER
Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
DAC084S085
PACKAGE
BODY SIZE (NOM)
VSSOP (10)
3.00 mm × 3.00 mm
WSON (10)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
DNL vs Code at VA = 3 V
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC084S085
SNAS363F – MAY 2006 – REVISED MARCH 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description .............................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
5
5
7
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 16
8.5 Programming........................................................... 16
9
Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical Application ................................................. 20
10 Power Supply Recommendations ..................... 21
10.1 Using References as Power Supplies................... 21
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 24
12 Device and Documentation Support ................. 25
12.1
12.2
12.3
12.4
12.5
Device Support ....................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
25
26
26
26
26
13 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2013) to Revision F
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changes from Revision D (March 2013) to Revision E
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 24
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5 Description
A power-on reset circuit ensures that the DAC output powers up to zero volts and remains there until there is a
valid write to the device. A power-down feature reduces power consumption to less than a microWatt with three
different termination options.
The low-power consumption and small packages of the DAC084S085 make it an excellent choice for use in
battery-operated equipment.
The DAC084S085 is one of a family of pin-compatible DACs, including the 10-bit DAC104S085 and the 12-bit
DAC124S085. The DAC084S085 operates over the extended industrial temperature range of −40°C to +105°C.
6 Pin Configuration and Functions
DSC Package
10-Pin WSON
Top View
VA 1
VOUTA 2
VOUTB 3
VOUTC 4
VOUTD 5
DGS Package
10-Pin VSSOP
Top View
10 SCLK
9 SYNC
SON 8 DIN
7 VREFIN
6 GND
VA
1
10
SCLK
VOUTA
2
9
VOUTB
VOUTC
3 VSSOP 8
4
7
5
6
SYNC
DIN
VOUTD
VREFIN
GND
Pin Functions
PIN
NO.
TYPE
NAME
DESCRIPTION
1
VA
Supply
Power supply input. Must be decoupled to GND.
2
VOUTA
Analog Output
Channel A Analog Output Voltage.
3
VOUTB
Analog Output
Channel B Analog Output Voltage.
4
VOUTC
Analog Output
Channel C Analog Output Voltage.
5
VOUTD
Analog Output
Channel D Analog Output Voltage.
6
GND
Ground
7
VREFIN
Analog Input
Unbuffered reference voltage shared by all channels. Must be decoupled
to GND.
8
DIN
Digital Input
Serial Data Input. Data is clocked into the 16-bit shift register on the
falling edges of SCLK after the fall of SYNC.
Ground reference for all on-chip circuitry.
9
SYNC
Digital Input
Frame synchronization input for the data input. When this pin goes low, it
enables the input shift register and data is transferred on the falling edges
of SCLK. The DAC is updated on the 16th clock cycle unless SYNC is
brought high before the 16th clock, in which case the rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
10
SCLK
Digital Input
Serial Clock Input. Data is clocked into the input shift register on the
falling edges of this pin.
11
PAD
(WSON only)
Ground
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance and
enhances package self-alignment during reflow.
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7 Specifications
7.1 Absolute Maximum Ratings (1) (2) (3)
MIN
Supply voltage, VA
−0.3
Voltage on any input pin
MAX
UNIT
6.5
V
6.5
V
10
mA
20
mA
150
°C
150
°C
Input current at any pin (4)
Package input current (4)
See (5)
Power consumption at TA = 25°C
Junction temperature
−65
Storage temperature, Tstg
(1)
(2)
(3)
(4)
(5)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Semiconductor Sales Office/Distributors for
availability and specifications.
When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin must be limited to 10 mA. The 20 mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of
10 mA to two.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation is reached only when the device is operated in a severe fault
condition (that is, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
±2500
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Human body model is 100-pF capacitor discharged through a 1.5-kΩ resistor. Machine model is 220 pF discharged through 0 Ω.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
See
(1)
Operating temperature
Supply voltage, VA
Reference voltage, VREFIN
Digital input voltage
(2)
Output load
SCLK frequency
(1)
(2)
MIN
MAX
UNIT
−40
105
°C
2.7
5.5
V
1
VA
V
0
5.5
V
0
1500
40
pF
MHz
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, does not cause errors in the
conversion result. For example, if VA is 3 V, the digital input pins can be driven with a 5-V logic device.
I/O
TO INTERNAL
CIRCUITRY
GND
4
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7.4 Thermal Information
DAC084S085
THERMAL METRIC (1) (2)
DGS (VSSOP)
DSC (WSON)
10 PINS
10 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
240
250
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
53.3
40.7
°C/W
RθJB
Junction-to-board thermal resistance
78.9
23.7
°C/W
ψJT
Junction-to-top characterization parameter
4.8
0.4
°C/W
ψJB
Junction-to-board characterization parameter
77.6
23.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
4.7
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Reflow temperature profiles are different for lead-free packages..
7.5 Electrical Characteristics
The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range
3 to 252. All limits are at TA = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (1)
MAX (1)
UNIT
STATIC PERFORMANCE
Resolution
TMIN ≤ TA ≤ TMAX
8
Monotonicity
TMIN ≤ TA ≤ TMAX
8
TA = 25°C
INL
Integral non-linearity
DNL
Differential non-linearity
VA = 2.7 V to 5.5 V
ZE
Zero code error
IOUT = 0 mA
FSE
Full-scale error
IOUT = 0 mA
GE
Gain error
All ones Loaded to
DAC register
ZCED
Zero code error drift
TC GE
Gain error tempco
Bits
Bits
±0.14
TMIN ≤ TA ≤ TMAX
LSB
±0.5
TA = 25°C
−0.02
+0.04
TMIN ≤ TA ≤ TMAX
−0.13
+0.18
TA = 25°C
LSB
+4
TMIN ≤ TA ≤ TMAX
mV
+15
−0.1
TA = 25°C
TMIN ≤ TA ≤ TMAX
−0.75
−0.2
TA = 25°C
TMIN ≤ TA ≤ TMAX
−1
−20
VA = 3 V
−0.7
VA = 5 V
−1
%FSR
%FSR
µV/°C
ppm/°C
OUTPUT CHARACTERISTICS
IOZ
(2)
, TMIN ≤ TA ≤ TMAX
Output voltage range
See
High-impedance output
leakage current (2)
TMIN ≤ TA ≤ TMAX
VA = 3 V, IOUT = 200 µA
ZCO
Zero code output
IOS
(1)
(2)
Full scale output
Output short-circuit current
(source)
VREFIN
V
±1
µA
1.3
VA = 3 V, IOUT = 1 mA
6
VA = 5 V, IOUT = 200 µA
7
VA = 5 V, IOUT = 1 mA
FSO
0
mV
10
VA = 3 V, IOUT = 200 µA
2.984
VA = 3 V, IOUT = 1 mA
2.934
VA = 5 V, IOUT = 200 µA
4.989
VA = 5 V, IOUT = 1 mA
4.958
VA = 3 V, VOUT = 0 V,
Input Code = FFh
–56
VA = 5 V, VOUT = 0 V,
Input Code = FFh
–69
V
mA
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing
Quality Level).
This parameter is specified by design and/or characterization and is not tested in production.
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Electrical Characteristics (continued)
The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range
3 to 252. All limits are at TA = 25°C, unless otherwise specified.
PARAMETER
Output short-circuit current
(sink)
IOS
MIN (1)
TEST CONDITIONS
IO
Continuous output
current (2)
CL
Maximum load capacitance
ZOUT
DC output impedance
TYP (1)
VA = 3 V, VOUT = 3 V,
Input Code = 00h
52
VA = 5 V, VOUT = 5 V,
Input Code = 00h
75
MAX (1)
UNIT
mA
Avaliable on each DAC output, TMIN ≤ TA ≤ TMAX
11
RL = ∞
1500
RL = 2 kΩ
1500
mA
pF
Ω
7.5
REFERENCE INPUT CHARACTERISTICS
Input range minimum
VREFIN
Input range maximum
0.2
TMIN ≤ TA ≤ TMAX
V
1
TMIN ≤ TA ≤ TMAX
VA
Input impedance
30
V
kΩ
LOGIC INPUT CHARACTERISTICS
IIN
Input current (2)
TMIN ≤ TA ≤ TMAX
TA = 25°C
VA = 3 V
VIL
Input low voltage
1.5
TMIN ≤ TA ≤ TMAX
0.8
TA = 25°C
1.4
TMIN ≤ TA ≤ TMAX
Input high voltage (2)
2.1
TMIN ≤ TA ≤ TMAX
V
V
V
2.4
TMIN ≤ TA ≤ TMAX
µA
V
2.1
TA = 25°C
VA = 5 V
Input capacitance (2)
0.6
TA = 25°C
VA = 3 V
CIN
0.9
TMIN ≤ TA ≤ TMAX
(2)
VA = 5 V
VIH
±1
3
pF
POWER REQUIREMENTS
VA
Supply voltage minimum
TMIN ≤ TA ≤ TMAX
Supply voltage maximum
TMIN ≤ TA ≤ TMAX
2.7
VA = 2.7 V
to 3.6 V
TA = 25°C
VA = 4.5 V
to 5.5 V
TA = 25°C
fSCLK = 30 MHz
IN
Normal supply current (output
unloaded)
fSCLK = 0 MHz
IPD
Power-down supply current
(output unloaded, SYNC = DIN
= 0 V after PD mode loaded)
fSCLK = 0 MHz
6
TMIN ≤ TA ≤ TMAX
485
500
TMIN ≤ TA ≤ TMAX
650
V
µA
µA
350
µA
VA = 4.5 V
to 5.5 V
460
µA
VA = 2.7 V
to 3.6 V
TA = 25°C
VA = 4.5 V
to 5.5 V
TA = 25°C
VA = 2.7 V
to 3.6 V
TA = 25°C
VA = 4.5 V
to 5.5 V
TA = 25°C
All PD Modes (2)
Normal supply power (output
unloaded)
370
VA = 2.7 V
to 3.6 V
fSCLK = 30 MHz
PN
V
5.5
0.1
TMIN ≤ TA ≤ TMAX
1
0.15
TMIN ≤ TA ≤ TMAX
1
1.1
TMIN ≤ TA ≤ TMAX
1.7
2.5
TMIN ≤ TA ≤ TMAX
3.6
µA
µA
mW
mW
VA = 2.7 V
to 3.6 V
1.1
mW
VA = 4.5 V
to 5.5 V
2.3
mW
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Electrical Characteristics (continued)
The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range
3 to 252. All limits are at TA = 25°C, unless otherwise specified.
PARAMETER
Power-down supply power
(output unloaded, SYNC = DIN
= 0 V after PD mode loaded)
PPD
MIN (1)
TEST CONDITIONS
VA = 2.7 V
to 3.6 V
TA = 25°C
VA = 4.5 V
to 5.5 V
TA = 25°C
All PD Modes (2)
TYP (1)
MAX (1)
UNIT
0.3
TMIN ≤ TA ≤ TMAX
µW
3.6
0.8
TMIN ≤ TA ≤ TMAX
µW
5.5
7.6 Timing Requirements
Values shown in this table are design targets and are subject to change before product release.
The following specifications apply for VA = 2.7 V to 5.5 V, VREFIN = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range
3 to 252. All limits are at TA = 25°C, unless otherwise specified.
MIN (1)
fSCLK
SCLK frequency
ts
Output voltage settling time (2)
SR
Output slew rate
Glitch impulse
TA = 25°C
TMIN ≤ TA ≤ TMAX
40h to C0h code change
RL = 2 kΩ, CL = 200 pF
30
TA = 25°C
3
TMIN ≤ TA ≤ TMAX
4.5
Code change from 80h to 7Fh
UNIT
MHz
µs
1
V/µs
12
nV-sec
0.5
nV-sec
Digital crosstalk
1
nV-sec
DAC-to-DAC crosstalk
3
nV-sec
Multiplying bandwidth
VREFIN = 2.5 V ± 0.1 Vpp
160
kHz
Total harmonic distortion
VREFIN = 2.5 V ± 0.1 Vpp
input frequency = 10 kHz
70
dB
VA = 3 V
6
µsec
VA = 5 V
39
µsec
tWU
Wake-up time
1/fSCLK
SCLK cycle time
tCH
SCLK high time
tCL
SCLK low Time
tSS
SYNC set-up time prior to SCLK
falling edge
TA = 25°C
tDS
Data set-up time prior to SCLK falling
edge
TA = 25°C
tDH
Data hold time after SCLK falling
edge
TA = 25°C
tCFSR
SCLK fall prior to rise of SYNC
tSYNC
SYNC high time
(2)
MAX (1)
40
Digital feedthrough
(1)
TYP (1)
TA = 25°C
TMIN ≤ TA ≤ TMAX
25
33
TA = 25°C
TMIN ≤ TA ≤ TMAX
7
10
TA = 25°C
TMIN ≤ TA ≤ TMAX
TMIN ≤ TA ≤ TMAX
TMIN ≤ TA ≤ TMAX
TMIN ≤ TA ≤ TMAX
7
10
4
10
1.5
3.5
1.5
3.5
TA = 25°C
TMIN ≤ TA ≤ TMAX
0
3
TA = 25°C
TMIN ≤ TA ≤ TMAX
6
10
ns
ns
ns
ns
ns
ns
ns
ns
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing
Quality Level).
This parameter is specified by design and/or characterization and is not tested in production.
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|
1 / fSCLK
SCLK
1
2
13
tSS
tSYNC
tCL
14
15
16
tCH
tCFSR
|
SYNC
DIN
| |
tDH
DB15
DB0
tDS
Figure 1. Serial Timing Diagram
FSE
255 x VREFIN
256
GE = FSE - ZE
FSE = GE + ZE
OUTPUT
VOLTAGE
ZE
0
0
255
DIGITAL INPUT CODE
Figure 2. Input / Output Transfer Characteristic
8
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7.7 Typical Characteristics
VREF = VA, fSCLK = 30 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated
Figure 3. INL at VA = 3 V
Figure 4. INL at VA = 5 V
Figure 5. DNL at VA = 3 V
Figure 6. DNL at VA = 5 V
Figure 7. INL/DNL vs VREFIN at VA = 3 V
Figure 8. INL/DNL vs VREFIN at VA = 5 V
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Typical Characteristics (continued)
VREF = VA, fSCLK = 30 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated
10
Figure 9. INL/DNL vs fSCLK at VA = 2.7 V
Figure 10. INL/DNL vs VA
Figure 11. INL/DNL vs Clock Duty Cycle at VA = 3 V
Figure 12. INL/DNL vs Clock Duty Cycle at VA = 5 V
Figure 13. INL/DNL vs Temperature at VA = 3 V
Figure 14. INL/DNL vs Temperature at VA = 5 V
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Typical Characteristics (continued)
VREF = VA, fSCLK = 30 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated
Figure 15. Zero Code Error vs VA
Figure 16. Zero Code Error vs VREFIN
Figure 17. Zero Code Error vs fSCLK
Figure 18. Zero Code Error vs Clock Duty Cycle
Figure 19. Zero Code Error vs Temperature
Figure 20. Full-Scale Error vs VA
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Typical Characteristics (continued)
VREF = VA, fSCLK = 30 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated
12
Figure 21. Full-Scale Error vs VREFIN
Figure 22. Full-Scale Error vs fSCLK
Figure 23. Full-Scale Error vs Clock Duty Cycle
Figure 24. Full-Scale Error vs Temperature
Figure 25. Supply Current vs VA
Figure 26. Supply Current vs Temperature
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Typical Characteristics (continued)
VREF = VA, fSCLK = 30 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated
Figure 27. 5V Glitch Response
Figure 28. Power-On Reset
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8 Detailed Description
8.1 Overview
The DAC084S085 is a full-featured, general-purpose QUAD 8-bit voltage-output digital-to-analog converter
(DAC) that can operate from a single 2.7-V to 5.5-V supply and consumes 1.1 mW at 3 V and 2.5 mW at 5 V.
The on-chip output amplifier allows rail-to-rail output swing and the three wire serial interface operates at clock
rates up to 40 MHz over the entire supply voltage range. The serial interface is compatible with standard SPI,
QSPI, MICROWIRE, and DSP interfaces.
The reference for the DAC084S085 serves all four channels and can vary in voltage between 1 V and VA,
providing the widest possible output dynamic range. The DAC084S085 has a 16-bit input shift register that
controls the outputs to be updated, the mode of operation, the power-down condition, and the binary input data.
All four outputs can be updated simultaneously or individually depending on the setting of the two mode of
operation bits.
A power-on reset circuit ensures that the DAC output powers up to zero volts and remains there until there is a
valid write to the device. A power-down feature reduces power consumption to less than a microWatt with three
different termination options.
8.2 Functional Block Diagram
VREFIN
DAC084S085
REF
POWER-ON
RESET
8 BIT DAC
VOUTA
BUFFER
8
2.5k
100k
REF
8 BIT DAC
VOUTB
BUFFER
8
DAC
REGISTER
2.5k
100k
REF
8 BIT DAC
BUFFER
VOUTC
8
2.5k
100k
8
REF
8 BIT DAC
VOUTD
BUFFER
8
2.5k
INPUT
CONTROL
LOGIC
SYNC
14
SCLK
100k
POWER-DOWN
CONTROL
LOGIC
DIN
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8.3 Feature Description
8.3.1 DAC Section
The DAC084S085 is fabricated on a CMOS process with an architecture that consists of switches and resistor
strings that are followed by an output buffer. The reference voltage is externally applied at VREFIN and is shared
by all four DACs.
For simplicity, a single resistor string is shown in Figure 29. This string consists of 256 equal valued resistors
with a switch at each junction of two resistors, plus a switch to ground. The code loaded into the DAC register
determines which switch is closed, connecting the proper node to the amplifier. The input coding is straight
binary with an ideal output voltage of:
VOUTA,B,C,D = VREFIN x (D / 256)
where
•
D is the decimal equivalent of the binary code that is loaded into the DAC register. D can take on any value
between 0 and 255. This configuration ensures that the DAC is monotonic.
(1)
VA
R
R
R
To Output Amplifier
R
R
Figure 29. DAC Resistor String
8.3.2 Output Amplifiers
The output amplifiers are rail-to-rail, providing an output voltage range of 0 V to VA when the reference is VA. All
amplifiers, even rail-to-rail types, exhibit a loss of linearity as the output approaches the supply rails (0 V and VA,
in this case). For this reason, linearity is specified over less than the full output range of the DAC. However, if the
reference is less than VA, there is only a loss in linearity in the lowest codes. The output capabilities of the
amplifier are described in Electrical Characteristics.
The output amplifiers are capable of driving a load of 2 kΩ in parallel with 1500 pF to ground or to VA. The zerocode and full-scale outputs for given load currents are available in Electrical Characteristics.
8.3.3 Reference Voltage
The DAC084S085 uses a single external reference that is shared by all four channels. The reference pin, VREFIN,
is not buffered and has an input impedance of 30 kΩ. TI recommends that VREFIN be driven by a voltage source
with low output impedance. The reference voltage range is 1 V to VA, providing the widest possible output
dynamic range.
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Feature Description (continued)
8.3.4 Power-On Reset
The power-on reset circuit controls the output voltages of the four DACs during power-up. Upon application of
power, the DAC registers are filled with zeros and the output voltages are 0 V. The outputs remain at 0 V until a
valid write sequence is made to the DAC.
8.4 Device Functional Modes
8.4.1 Power-Down Modes
The DAC084S085 has four power-down modes, two of which are identical. In power-down mode, the supply
current drops to 20 µA at 3 V and 30 µA at 5 V. The DAC084S085 is set in power-down mode by setting OP1
and OP0 to 11. Since this mode powers down all four DACs, the address bits, A1 and A0, are used to select
different output terminations for the DAC outputs. Setting A1 and A0 to 00 or 11 causes the outputs to be tristated (a high impedance state). While setting A1 and A0 to 01 or 10 causes the outputs to be terminated by
2.5 kΩ or 100 kΩ to ground respectively (see Table 1).
Table 1. Power-Down Modes
A1
A0
OP1
OP0
OPERATING MODE
0
0
1
1
High-Z outputs
0
1
1
1
2.5 kΩ to GND
1
0
1
1
100 kΩ to GND
1
1
1
1
High-Z outputs
The bias generator, output amplifiers, resistor strings, and other linear circuitry are all shut down in any of the
power-down modes. However, the contents of the DAC registers are unaffected when in power-down. Each DAC
register maintains its value prior to the DAC084S085 being powered down unless it is changed during the write
sequence which instructed it to recover from power down. Minimum power consumption is achieved in the
power-down mode with SYNC and DIN idled low and SCLK disabled. The time to exit power-down (Wake-Up
Time) is typically tWU µs as stated in Timing Requirements.
8.5 Programming
8.5.1 Serial Interface
The three-wire interface is compatible with SPI™, QSPI, and MICROWIRE, as well as most DSPs and operates
at clock rates up to 40 MHz. See Figure 1 for information on a write sequence.
A write sequence begins by bringing the SYNC line low. Once SYNC is low, the data on the DIN line is clocked
into the 16-bit serial input register on the falling edges of SCLK. To avoid misclocking data into the shift register,
it is critical that SYNC not be brought low simultaneously with a falling edge of SCLK (see Figure 1). On the 16th
falling clock edge, the last data bit is clocked in and the programmed function (a change in the DAC channel
address, mode of operation, and/or register contents) is executed. At this point the SYNC line may be kept low or
brought high. Any data and clock pulses after the 16th falling clock edge is ignored. In either case, SYNC must
be brought high for the minimum specified time before the next write sequence is initiated with a falling edge of
SYNC.
Because the SYNC and DIN buffers draw more current when they are high, they must be idled low between write
sequences to minimize power consumption.
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Programming (continued)
8.5.2 Input Shift Register
The input shift register, Figure 30, has 16 bits. The first two bits are address bits. They determine whether the
register data is for DAC A, DAC B, DAC C, or DAC D. The address bits are followed by two bits that determine
the mode of operation (writing to a DAC register without updating the outputs of all four DACs, writing to a DAC
register and updating the outputs of all four DACs, writing to the register of all four DACs and updating their
outputs, or powering down all four outputs). The final twelve bits of the shift register are the data bits. The data
format is straight binary (MSB first, LSB last), with all 0s corresponding to an output of 0 V and all 1s
corresponding to a full-scale output of VREFIN – 1 LSB. The contents of the serial input register are transferred to
the DAC register on the sixteenth falling edge of SCLK. See Figure 1.
LSB
MSB
A1
A0 OP1 OP0 D7 D6 D5 D4 D3 D2 D1 D0
X
X
X
X
DATA BITS
0
0
1
1
0
1
0
1
DAC A
DAC B
DAC C
DAC D
0
0
1
1
0
1
0
1
Write to specified register but do not update outputs.
Write to specified register and update outputs.
Write to all registers and update outputs.
Power-down outputs.
Figure 30. Input Register Contents
Normally, the SYNC line is kept low for at least 16 falling edges of SCLK and the DAC is updated on the 16th
SCLK falling edge. However, if SYNC is brought high before the 16th falling edge, the data transfer to the shift
register is aborted and the write sequence is invalid. Under this condition, the DAC register is not updated and
there is no change in the mode of operation or in the DAC output voltages.
8.5.3 DSP and Microprocessor Interfacing
Interfacing the DAC084S085 to microprocessors and DSPs is quite simple.
8.5.3.1 ADSP-2101 and ADSP2103 Interfacing
Figure 31 shows a serial interface between the DAC084S085 and the ADSP-2101 or ADSP2103. The DSP must
be set to operate in the SPORT Transmit Alternate Framing Mode. It is programmed through the SPORT control
register and must be configured for Internal Clock Operation, Active Low Framing and 16-bit Word Length.
Transmission is started by writing a word to the Tx register after the SPORT mode has been enabled.
ADSP-2101/
ADSP2103
TFS
DT
SCLK
DAC084S085
SYNC
DIN
SCLK
Figure 31. ADSP-2101 and 2103 Interface
8.5.3.2 80C51 and 80L51 Interface
Figure 32 shows a serial interface between the DAC084S085 and the 80C51 or 80L51 microcontroller. The
SYNC signal comes from a bit-programmable pin on the microcontroller. The example shown here uses port line
P3.3. This line is taken low when data is transmitted to the DAC084S085. Because the 80C51 and 80L51
transmits 8-bit bytes, only eight falling clock edges occur in the transmit cycle. To load data into the DAC, the
P3.3 line must be left low after the first eight bits are transmitted. A second write cycle is initiated to transmit the
second byte of data, after which port line P3.3 is brought high. The 80C51 and 80L51 transmit routine must
recognize that the 80C51 and 80L51 transmits data with the LSB first while the DAC084S085 requires data with
the MSB first.
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Programming (continued)
80C51/80L51
DAC084S085
P3.3
SYNC
TXD
SCLK
RXD
DIN
Figure 32. 80C51 and 80L51 Interface
8.5.3.3 68HC11 Interface
Figure 33 shows a serial interface between the DAC084S085 and the 68HC11 microcontroller. The SYNC line of
the DAC084S085 is driven from a port line (PC7 in the figure), similar to the 80C51 and 80L51.
The 68HC11 must be configured with its CPOL bit as a zero and its CPHA bit as a one. This configuration
causes data on the MOSI output to be valid on the falling edge of SCLK. PC7 is taken low to transmit data to the
DAC. The 68HC11 transmits data in 8-bit bytes with eight falling clock edges. Data is transmitted with the MSB
first. PC7 must remain low after the first eight bits are transferred. A second write cycle is initiated to transmit the
second byte of data to the DAC, after which PC7 must be raised to end the write sequence.
68HC11
DAC084S085
PC7
SYNC
SCK
SCLK
MOSI
DIN
Figure 33. 68HC11 Interface
8.5.3.4 Microwire Interface
Figure 34 shows an interface between a Microwire compatible device and the DAC084S085. Data is clocked out
on the rising edges of the SK signal. As a result, the SK of the Microwire device must be inverted before driving
the SCLK of the DAC084S085.
MICROWIRE
DEVICE
CS
SYNC
SK
SCLK
SO
DIN
DAC084S085
Figure 34. Microwire Interface
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Bipolar Operation
The DAC084S085 is designed for single-supply operation and thus has a unipolar output. However, a bipolar
output may be obtained with the circuit in Figure 35. This circuit provides an output voltage range of ±5 V. A railto-rail amplifier must be used if the amplifier supplies are limited to ±5 V.
10 pF
R2
+5V
+5V
10 PF
R1
+
-
0.1 PF
±5V
+
DAC084S085
-5V
SYNC
VOUT
DIN
SCLK
Figure 35. Bipolar Operation
The output voltage of this circuit for any code is found to be:
VO = (VA × (D / 256) × ((R1 + R2) / R1) – VA × R2 / R1)
where
•
D is the input code in decimal form.
(2)
With VA = 5 V and R1 = R2,
VO = (10 × D / 256) – 5 V
(3)
A list of rail-to-rail amplifiers suitable for this application are indicated in Table 2.
Table 2. Some Rail-to-Rail Amplifiers
AMP
PKGS
Typ VOS
Typ ISUPPLY
LMC7111
DIP-8
SOT23-5
0.9 mV
25 µA
LM7301
SO-8
SOT23-5
0.03 mV
620 µA
LM8261
SOT23-5
0.7 mV
1 mA
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9.2 Typical Application
+5V
Channel A
REF
SYNCB
DIN
Controller
+
Bridge
Sensor
+5V
RF
RI
REF
ADC121S705
RF
+
REF
Channel B
LMP7702
Av = 1 + 2
DAC084S085
SCLK
SCLK
DOUT
CSB
RF
RI
Figure 36. Driving an ADC Reference
9.2.1 Design Requirements
Figure 36 shows Channel A of the DAC084S085 providing the drive or supply voltage for a bridge sensor. By
having the sensor supply voltage adjustable, the output of the sensor can be optimized to the input level of the
ADC monitoring it.
9.2.2 Detailed Design Procedure
The output of the sensor is amplified by a fixed gain amplifier stage with a differential gain of 1 + 2 × (RF / RI).
The advantage of this amplifier configuration is the high input impedance seen by the output of the bridge
sensor. The disadvantage is the poor common-mode rejection ratio (CMRR). The common-mode voltage (VCM)
of the bridge sensor is half of DAC output of Channel A. The VCM is amplified by a gain of 1 V/V by the amplifier
stage and thus becomes the bias voltage for the input of the ADC121S705. Channel B of the DAC084S085 is
providing the reference voltage to the ADC121S705. The reference for the ADC121S705 may be set to any
voltage from 1 V to 5 V, providing the widest dynamic range possible.
The reference voltage for Channel A and B is powered by an external 5-V power supply. Because the 5-V supply
is common to the sensor supply voltage and the reference voltage of the ADC, fluctuations in the value of the
5-V supply has a minimal effect on the digital output code of the ADC. This type of configuration is often referred
to as a ratiometric design. For example, an increase of 5% to the 5-V supply causes the sensor supply voltage to
increase by 5%. This causes the gain or sensitivity of the sensor to increase by 5%. The gain of the amplifier
stage is unaffected by the change in supply voltage. The ADC121S705 on the other hand, also experiences a
5% increase to its reference voltage. This causes the size of the ADC's least significant bit (LSB) to increase by
5%. As a result of the gain of the sensor increasing by 5% and the LSB size of the ADC increasing by the same
5%, there is no net effect on the circuit's performance. It is assumed that the amplifier gain is set low enough to
allow for a 5% increase in the sensor output. Otherwise, the increase in the sensor output level may cause the
output of the amplifiers to clip.
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Typical Application (continued)
9.2.3 Application Curve
FSE
255 x VREFIN
256
GE = FSE - ZE
FSE = GE + ZE
OUTPUT
VOLTAGE
ZE
0
0
255
DIGITAL INPUT CODE
Figure 37. Input / Output Transfer Characteristic
10 Power Supply Recommendations
10.1 Using References as Power Supplies
While the simplicity of the DAC084S085 implies ease of use, it is important to recognize that the path from the
reference input (VREFIN) to the VOUTs has essentially zero power supply rejection ratio (PSRR). Therefore, it is
necessary to provide a noise-free supply voltage to VREFIN. To use the full dynamic range of the DAC084S085,
the supply pin (VA) and VREFIN can be connected together and share the same supply voltage. Because the
DAC084S085 consumes very little power, a reference source may be used as the reference input and/or the
supply voltage. The advantages of using a reference source over a voltage regulator are accuracy and stability.
Some low noise regulators can also be used. Listed below are a few reference and power supply options for the
DAC084S085.
10.1.1 LM4130
The LM4130, with its 0.05% accuracy over temperature, is a good choice as a reference source for the
DAC084S085. The 4.096-V version is useful if a 0-V to 4.095-V output range is desirable or acceptable.
Bypassing the LM4130 VIN pin with a 0.1-µF capacitor and the VOUT pin with a 2.2-µF capacitor improves
stability and reduces output noise. The LM4130 comes in a space-saving 5-pin SOT-23.
Input
Voltage
LM4132-4.1
C1
0.1 PF
C2
2.2 PF
C3
0.1 PF
VA VREFIN
DAC084S085
VOUT = 0V to 4.092V
SYNC
DIN
SCLK
Figure 38. LM4130 as a Power Supply
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Using References as Power Supplies (continued)
10.1.2 LM4050
Available with accuracy of 0.44%, the LM4050 shunt reference is also a good choice as a reference for the
DAC084S085. It is available in 4.096-V and 5-V versions, and comes in a space-saving 3-pin SOT-23.
Input
Voltage
R
IDAC
VZ
IZ
0.1 PF
0.47 PF
LM4050-4.1
or
LM4050-5.0
VA VREFIN
DAC084S085
VOUT = 0V to 5V
SYNC
DIN
SCLK
Figure 39. LM4050 as a Power Supply
The minimum resistor value in the circuit of Figure 39 must be chosen such that the maximum current through
the LM4050 does not exceed its 15-mA rating. The conditions for maximum current include the input voltage at
its maximum, the LM4050 voltage at its minimum, and the DAC084S085 drawing zero current. The maximum
resistor value must allow the LM4050 to draw more than its minimum current for regulation plus the maximum
DAC084S085 current in full operation. The conditions for minimum current include the input voltage at its
minimum, the LM4050 voltage at its maximum, the resistor value at its maximum due to tolerance, and the
DAC084S085 draws its maximum current. These conditions can be summarized as:
R(min) = ( VIN(max) − VZ(min) ) /IZ(max)
(4)
and
R(max) = ( VIN(min) − VZ(max) ) / ( (IDAC(max) + IZ(min) )
where
•
•
•
•
VZ(min) and VZ(max) are the nominal LM4050 output voltages ± the LM4050 output tolerance over
temperature,
IZ(max) is the maximum allowable current through the LM4050,
IZ(min) is the minimum current required by the LM4050 for proper regulation,
and IDAC(max) is the maximum DAC084S085 supply current.
(5)
10.1.3 LP3985
The LP3985 is a low-noise, ultra-low dropout voltage regulator with a 3% accuracy over temperature. It is a good
choice for applications that do not require a precision reference for the DAC084S085. It comes in 3-V, 3.3-V, and
5-V versions, among others, and sports a low 30-µV noise specification at low frequencies. Because low
frequency noise is relatively difficult to filter, this specification could be important for some applications. The
LP3985 comes in a space-saving 5-pin SOT-23 and 5-bump DSBGA packages.
Input
Voltage
LP3985
0.1 PF
1 PF
0.01 PF
0.1 PF
VA VREFIN
DAC084S085
VOUT = 0V to 5V
SYNC
DIN
SCLK
Figure 40. Using the LP3985 Regulator
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Using References as Power Supplies (continued)
An input capacitance of 1 µF without any ESR requirement is required at the LP3985 input, while a 1-µF ceramic
capacitor with an ESR requirement of 5 mΩ to 500 mΩ is required at the output. Careful interpretation and
understanding of the capacitor specification is required to ensure correct device operation.
10.1.4 LP2980
The LP2980 is an ultra-low dropout regulator with a 0.5% or 1% accuracy over temperature, depending upon
grade. It is available in 3-V, 3.3-V, and 5-V versions, among others.
VIN
Input
Voltage
LP2980
ON /OFF
VOUT
1 PF
0.1 PF
VA VREFIN
DAC084S085
VOUT = 0V to 5V
SYNC
DIN
SCLK
Figure 41. Using the LP2980 Regulator
Like any low dropout regulator, the LP2980 requires an output capacitor for loop stability. This output capacitor
must be at least 1 µF over temperature, but values of 2.2 µF or more provides even better performance. The
ESR of this capacitor must be within the range specified in the LP2980 data sheet. Surface-mount solid tantalum
capacitors offer a good combination of small size and ESR. Ceramic capacitors are attractive due to their small
size but generally have ESR values that are too low for use with the LP2980. Aluminum electrolytic capacitors
are typically not a good choice due to their large size and have ESR values that may be too high at low
temperatures.
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11 Layout
11.1 Layout Guidelines
For best accuracy and minimum noise, the printed-circuit board containing the DAC084S085 must have separate
analog and digital areas. The areas are defined by the locations of the analog and digital power planes. Both of
these planes must be located in the same board layer. There must be a single ground plane. A single ground
plane is preferred if digital return current does not flow through the analog ground area. Frequently a single
ground plane design uses a fencing technique to prevent the mixing of analog and digital ground current.
Separate ground planes must only be used when the fencing technique is inadequate. The separate ground
planes must be connected in one place, preferably near the DAC084S085. Special care is required to ensure
that digital signals with fast edge rates do not pass over split ground planes. They must always have a
continuous return path below their traces.
The DAC084S085 power supply must be bypassed with a 10-µF and a 0.1-µF capacitor as close as possible to
the device with the 0.1 µF right at the device supply pin. The 10-µF capacitor must be a tantalum type and the
0.1-µF capacitor must be a low ESL, low ESR type. The power supply for the DAC084S085 must only be used
for analog circuits.
Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the
board. The clock and data lines must have controlled impedances.
11.2 Layout Example
Figure 42. Typical Layout
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Device Nomenclature
12.1.1.1 Specification Definitions
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of
1 LSB, which is VREF / 256 = VA / 256.
DAC-to-DAC CROSSTALK is the glitch impulse transferred to a DAC output in response to a full-scale change
in the output of another DAC.
DIGITAL CROSSTALK is the glitch impulse transferred to a DAC output at mid-scale in response to a full-scale
change in the input register of another DAC.
DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital
inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the data bus.
FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFh) loaded
into the DAC and the value of VA x 255 / 256.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and
Full-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error.
GLITCH IMPULSE is the energy injected into the analog output when the input code to the DAC register
changes. It is specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line is measured
from the center of that code value. The end point method is used. INL for this product is specified over a limited
range, per Electrical Characteristics.
LEAST SIGNIFICANT BIT (LSB) is the bit that has the smallest value or weight of all bits in a word. This value is
LSB = VREF / 2n
where
•
•
VREF is the supply voltage for this product,
and "n" is the DAC resolution in bits, which is 8 for the DAC084S085.
(6)
MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output
stability maintained.
MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when
the input code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is
1/2 of VA.
MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3dB below the input sine wave
on VREFIN with a full-scale code loaded into the DAC.
POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from
the power supply. The difference between the supply and output currents is the power consumed by the device
without a load.
SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is
updated.
TOTAL HARMONIC DISTORTION (THD) is the measure of the harmonics present at the output of the DACs
with an ideal sine wave applied to VREFIN. THD is measured in dB.
WAKE-UP TIME is the time for the output to exit power-down mode. This is the time from the falling edge of the
16th SCLK pulse to when the output voltage deviates from the power-down voltage of 0 V.
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Device Support (continued)
ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 00h has been
entered.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
SPI is a trademark of Motorola, Inc..
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26
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Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: DAC084S085
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC084S085CIMM
NRND
VSSOP
DGS
10
1000
TBD
Call TI
Call TI
-40 to 105
X70C
DAC084S085CIMM/NOPB
ACTIVE
VSSOP
DGS
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
X70C
DAC084S085CIMMX/NOPB
ACTIVE
VSSOP
DGS
10
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
X70C
DAC084S085CISD/NOPB
ACTIVE
WSON
DSC
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
X71C
DAC084S085CISDX/NOPB
ACTIVE
WSON
DSC
10
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 105
X71C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DAC084S085CIMM
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DAC084S085CIMM/NOPB VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DAC084S085CIMMX/NOP VSSOP
B
DGS
10
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DAC084S085CISD/NOPB WSON
DSC
10
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
DSC
10
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
DAC084S085CISDX/NOP
B
WSON
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC084S085CIMM
VSSOP
DGS
10
1000
210.0
185.0
35.0
DAC084S085CIMM/NOPB
VSSOP
DGS
10
1000
210.0
185.0
35.0
DAC084S085CIMMX/NOP
B
VSSOP
DGS
10
3500
367.0
367.0
35.0
DAC084S085CISD/NOPB
WSON
DSC
10
1000
210.0
185.0
35.0
WSON
DSC
10
4500
367.0
367.0
35.0
DAC084S085CISDX/NOP
B
Pack Materials-Page 2
MECHANICAL DATA
DSC0010A
SDA10A (Rev A)
www.ti.com
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