BTA12, BTB12, T12xx 12 A Snubberless™, logic level and standard triacs Features A2 ■ Medium current triac ■ Low thermal resistance with clip bonding ■ Low thermal resistance insulation ceramic for insulated BTA ■ G A1 A2 A2 High commutation (4Q) or very high commutation (3Q) capability ■ BTA series UL1557 certified (File ref: 81734) ■ Packages are RoHS ( 2002/95/EC) compliant A1 A2 A1 A2 G G D2PAK (T12-G) I2PAK (T12-R) Applications A2 ON/OFF or phase angle function in applications such as static relays, light dimmers and appliance motors speed controllers. A1 A2 G A1 A2 G TO-220AB Insulated (BTA12) The snubberless versions (BTA/BTB...W and T12 series) are especially recommended for use on inductive loads, because of their high commutation performances. The BTA series provides an insulated tab (rated at 2500 V RMS). TO-220AB (BTB12) Order code See Ordering information on page 11 Description Available either in through-hole or surface-mount packages, the BTA12, BTB12 and T12xx triac series is suitable for general purpose mains power AC switching. Table 1. Device summary T12xx BTA12 (1) BTB12 12 12 12 Repetitive peak off-state voltage 600/800 600/800 600/800 IGT (Snubberless) Triggering gate current 10/35/50 5/10/35/50 5/10/35/50 IGT (Standard) Triggering gate current - 35/50 35/50 Symbol IT(RMS) VDRM/VRRM 1. Parameter RMS on-state current Insulated TM: Snubberless is a trademark of STMicroelectronics September 2007 Rev 9 1/12 www.st.com 12 Characteristics BTA12, BTB12, T12xx 1 Characteristics Table 2. Absolute maximum ratings Symbol IT(RMS) ITSM I2t dI/dt VDSM/VRSM IGM PG(AV) Tstg Tj Table 3. Parameter Value Unit 12 A I2PAK / D2PAK / TO-220AB Tc = 105° C TO-220AB Ins. Tc = 90° C Non repetitive surge peak on-state current (full cycle, Tj initial = 25° C) F = 50 Hz t = 20 ms 120 F = 60 Hz t = 16.7 ms 126 I2t Value for fusing tp = 10 ms Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Non repetitive surge peak off-state voltage Peak gate current RMS on-state current (full sine wave) A 78 A²s Tj = 125° C 50 A/µs tp = 10 ms Tj = 25° C VDRM/VRRM + 100 V tp = 20 µs Tj = 125° C 4 A Tj = 125° C 1 W - 40 to + 150 - 40 to + 125 °C Average gate power dissipation Storage junction temperature range Operating junction temperature range Electrical characteristics (Tj = 25°C, unless otherwise specified) Snubberless and logic level (3 quadrants) T12xx Symbol IGT (1) VGT Test conditions VD = 12 V RL = 30 Ω VGD VD = VDRM RL = 3.3 kΩ Tj = 125° C IH (2) IT = 100 mA IL IG = 1.2 IGT Unit T1250 TW SW CW BW 10 35 50 5 10 35 50 I - II - III MAX. 1.3 V I - II - III MIN. 0.2 V MAX. II VD = 67 %VDRM gate open Tj = 125° C (dV/dt)c = 10 V/µs Tj = 125° C 1. Minimum IGT is guaranted at 5% of IGT max 2. for both polarities of A2 referenced to A1 15 35 50 10 15 35 50 25 50 70 10 25 50 70 30 60 80 15 30 60 80 40 500 1000 20 40 500 1000 6.5 3.5 6.5 2.9 1 2.9 MAX. Without snubber Tj= 125° C 2/12 T1235 MAX. MIN. (dV/dt)c = 0.1 V/µs Tj = 125° C (dI/dt)c (2) T1210 I - II - III I - III dV/dt (2) BTA12 / BTB12 Quadrant MIN. mA mA mA 6.5 12 V/µs A/ms 6.5 12 BTA12, BTB12, T12xx Table 4. Characteristics Electrical characteristics (Tj = 25°C, unless otherwise specified) standard (4 quadrants) BTA12 / BTB12 Symbol IGT (1) Test Conditions VD = 12 V Quadrant RL = 30 Ω VGT VGD VD = VDRM RL = 3.3 kΩ Tj = 125° C IH (2) IT = 500 mA IL IG = 1.2 IGT Unit (dV/dt)c (2) B 25 50 50 100 I - II - III IV MAX. ALL MAX. 1.3 V ALL MIN. 0.2 V MAX. I - III - IV dV/dt (2) C 25 50 40 50 80 100 MAX. II mA mA mA VD = 67% VDRM gate open Tj = 125° C MIN. 200 400 V/µs (dI/dt)c = 5.3 A/ms MIN. 5 10 V/µs Tj = 125° C 1. Minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Static characteristics Symbol Test conditions VT (1) ITM = 17 A Vt0 (1) tp = 380 µs Value Unit Tj = 25° C MAX. 1.55 V Threshold voltage Tj = 125° C MAX. 0.85 V Rd (1) Dynamic resistance Tj = 125° C MAX. 35 mΩ IDRM IRRM 5 µA VDRM = VRRM 1 mA Value Unit Tj = 25° C MAX. Tj= 125° C 1. for both polarities of A2 referenced to A1 Table 6. Thermal resistance Symbol Parameter I2 2 1.4 TO-220AB insulated 2.3 D2PAK 45 PAK / D PAK / TO-220AB Rth(j-c) Junction to case (AC) Junction to ambient Rth(j-a) °C/W S(1) = 1 cm2 I2 TO-220AB / PAK TO-220AB insulated °C/W 60 1. Copper surface under tab. 3/12 Characteristics Figure 1. BTA12, BTB12, T12xx Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) P(W) IT(RMS)(A) 16 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 14 12 10 8 6 4 2 IT(RMS)(A) 0 0 RMS on-state current versus case temperature (full cycle) 1 2 Figure 3. 3 4 5 6 7 8 9 10 11 12 BTB / T12 BTA TC(°C) 0 25 Figure 4. RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) IT(RMS)(A) 50 75 100 125 Relative variation of thermal impedance versus pulse duration K=[Zth/Rth] 3.5 1E+0 D2PAK (S=1cm2) 3.0 Zth(j-c) 2.5 Zth(j-a) 2.0 1E-1 1.5 1.0 0.5 TC(°C) 0 25 Figure 5. 50 75 100 1E-3 125 ITM(A) Tj = Tj max. 10 Tj = 25°C. VTM(V) 1 4/12 1E-1 1E+0 1E+1 1E+2 5E+2 Surge peak on-state current versus number of cycles ITSM(A) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 Tj max. Vto = 0.85V Rd = 35 mΩ 1.0 1E-2 On-state characteristics (maximum Figure 6. values) 100 0.5 tp(s) 1E-2 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 t=20ms One cycle Non repetitive Tj initial=25°C Repetitive TC=90°C Number of cycles 1 10 100 1000 BTA12, BTB12, T12xx Characteristics Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Figure 7. IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] ITSM(A), I2t (A2s) 2.5 Tj initial=25°C dI/dt limitation: 50A/µs 1000 Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) 2.0 ITSM IGT 1.5 100 I2t IH & IL 1.0 0.5 Tj(°C) tp(ms) 0.0 10 0.01 0.10 Figure 9. 1.00 -40 10.00 Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (BW/CW/T1210/T1235) -20 0 20 40 60 80 100 120 140 Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (TW) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 5.0 2.8 4.5 2.4 4.0 TW 2.0 1.6 3.5 T1210/SW 3.0 C B 2.5 1.2 T1235/T1250/CW/BW 0.8 2.0 1.5 1.0 0.4 (dV/dt)c (V/µs) 0.5 0.0 0.1 1.0 10.0 100.0 Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature (dV/dt)c (V/µs) 0.0 0.1 1.0 10.0 100.0 Figure 12. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) (dI/dt)c [Tj] / (dI/dt)c [Tj specified] Rth(j-a)(°C/W) 6 80 70 5 60 4 50 3 D2PAK 40 30 2 20 1 10 Tj(°C) 0 25 50 S(cm²) 0 0 75 100 125 0 4 8 12 16 20 24 28 32 36 40 5/12 Ordering information scheme 2 BTA12, BTB12, T12xx Ordering information scheme Figure 13. BTA12 and BTB12 series BT A 12 - 600 BW RG Triac series Insulation A = insulated B = non insulated Current 12 = 12A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Packing mode RG = Tube Figure 14. T12xx series T 12 35 - 600 G (-TR) Triac series Current 12 = 12 A Sensitivity 50 = 50 mA 35 = 35 mA 10 = 10 mA Voltage 600 = 600 V 800 = 800 V Package G = D2PAK R = I2PAK Packing mode Blank = Tube -TR = Tape & Reel 6/12 BTA12, BTB12, T12xx Table 7. Ordering information scheme Product selector Order code(1) Voltage (xxx) Sensitivity Type Package X 50 mA Standard TO-220AB X X 50 mA Snubberless TO-220AB BTA/BTB12-xxxCRG X X 25 mA Standard TO-220AB BTA/BTB12-xxxCWRG X X 35 mA Snubberless TO-220AB BTA/BTB12-xxxSWRG X X 10 mA Logic Level TO-220AB BTA/BTB12-xxxTWRG X X 5 mA Logic Level TO-220AB T1210-800G - X 10 mA Logic Level D2PAK T1235-xxxG X X 35 mA Snubberless D2PAK T1235-xxxR X X 35 mA Snubberless I2PAK T1250-600G X - 50 mA Snubberless D2PAK 600 V 800 V BTA/BTB12-xxxBRG X BTA/BTB12-xxxBWRG 1. BTB: non insulated TO-220AB package 7/12 Packaging information 3 BTA12, BTB12, T12xx Packaging information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8. D2PAK dimensions Dimensions Ref. Millimeters Min. A E C2 L2 D L L3 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 1.40 0.048 0.055 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0° 8° Figure 15. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 8/12 3.70 0.016 0° 8° BTA12, BTB12, T12xx Table 9. Packaging information I2PAK dimensions Dimensions Ref. Millimeters Min. A E c2 L2 Typ. Max. Inches Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.20 1.38 0.047 0.054 b2 1.25 c 0.45 0.60 0.018 0.024 c2 1.21 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.44 2.64 0.096 0.104 E 10.00 10.28 0.394 0.405 L 13.10 13.60 0.516 0.535 V V4 D V L1 A1 b2 L 1.40 0.049 0.055 b1 V4 b e c L1 L2 3.75 1.27 0.148 1.40 0.050 0.055 V 5° 5° V4 45° 45° 9/12 Packaging information Table 10. BTA12, BTB12, T12xx TO-220AB dimensions (insulated and non-insulated) Dimensions Ref. Millimeters Min. A 15.20 a1 C B ØI Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 b2 L F A I4 l3 c2 a1 l2 a2 M b1 e c1 M 10/12 2.60 0.102 BTA12, BTB12, T12xx 4 Ordering information Ordering information Table 11. Ordering information Order code Marking Package Weight Base qty Delivery mode BTA/BTB12-xxxyzRG BTA/BTB12-xxxyz TO-220AB T1210-xxxG-TR T1210-xxxG T1235-xxxG T1235xxxG 2.3 g 50 Tube D2 PAK 1.5 g 1000 Tape and reel D2PAK 50 Tube 1.5 g 1000 Tape and reel T1235-xxxG-TR T1235xxxG T1235-xxxR T1235-xxxR I2PAK 1.5 g 50 Tube T1250xxxG 2PAK 1.5 g 1000 Tape and reel T1250-xxxG-TR D Note: xxx = voltage, y = sensitivity, z = type 5 Revision history Table 12. Revision history Date Revision Changes Sep-2002 6A 25-Mar-2005 7 1. I2PAK package added. 2. TO-220AB delivery mode changed from bulk to tube. 27-May-2005 8 T1210 added 28-Sep-2007 9 Reformatted to current standards. T1250 added Last update. 11/12 BTA12, BTB12, T12xx Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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