Datasheet Low Consumption and High Accuracy Shunt Regulator Built-in High Efficiency and Low Standby Power, CCM corresponding Secondary Side Synchronous Rectification Controller IC BM1R00xxxF Key Specifications General Description BM1R00xxxF is a synchronous rectification controller to be used in the secondary-side output. It has a built-in ultra-low consumption and high accuracy shunt regulator, which significantly reduces standby power. The shunt regulator is constructed in a completely independent chip that enables it to operate as a GND reference even when used in high side. Input Voltage Range: 2.7V to 32V Circuit Current (No Switching): 800µA(Typ) Circuit Current (Auto Shutdown) : 120µA (Typ) DRAIN Terminal Absolute Voltage: 120V Operating Temperature Range: -40°C to +105°C Package W(Typ) x D(Typ) x H(Max) 5.00mm x 6.20mm x 1.71mm At continuous mode operation, further space saving can be realized when operating without the input switching synchronizing signal of the primary side. BM1R00xxxF also features a wide operating power supply voltage range of 2.7V to 32V for various output applications. Finally, by adopting the high-voltage 120V process, it is possible to monitor the drain voltage directly. SOP8 Features Built-in Ultra-Low Consumption Shunt Regulator Reducing Standby Power Consumption Synchronous Rectification FET Supports High and Low Side 120V High Voltage Process DRAIN terminal Wide Input Operating Voltage Range of 2.7V to 32V Supports LLC and PWM QR Controller No Input Required on the Primary-Side at CCM Built-in Overvoltage Protection for SH_IN and SH_OUT Terminal Built-in Thermal Shutdown Function Built-in Auto Shutdown Function SOP8 package Lineup Table Latch Protection Series Function Name BM1R00001 BM1R00002 BM1R00003 BM1R00004 BM1R00005 BM1R00006 BM1R00007 BM1R00008 BM1R00009 BM1R00010 BM1R00011 BM1R00012 BM1R00013 BM1R00014 BM1R00015 BM1R00016 BM1R00017 BM1R00018 BM1R00019 BM1R00020 BM1R00021 BM1R00022 BM1R00023 BM1R00024 BM1R00025 BM1R00026 BM1R00027 BM1R00028 BM1R00029 BM1R00030 Applications AC-DC Output Power Conversion Applications: Charger, Adapter, TV, Rice Cooker, Humidifier, Air Conditioning, Vacuum Cleaner, etc. 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. 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TSZ22111 • 14 • 001 Compulsion ON Time ( μs) 1 1 1 1 1 1.5 1.5 1.5 1.5 1.5 2.3 2.3 2.3 2.3 2.3 2.8 2.8 2.8 2.8 2.8 3.5 3.5 3.5 3.5 3.5 NONE NONE NONE NONE NONE Compulsion OFF Time ( μs) 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 Auto Restart Protection Series Function Name BM1R00121 BM1R00122 BM1R00123 BM1R00124 BM1R00125 BM1R00126 BM1R00127 BM1R00128 BM1R00129 BM1R00130 BM1R00131 BM1R00132 BM1R00133 BM1R00134 BM1R00135 BM1R00136 BM1R00137 BM1R00138 BM1R00139 BM1R00140 BM1R00141 BM1R00142 BM1R00143 BM1R00144 BM1R00145 BM1R00146 BM1R00147 BM1R00148 BM1R00149 BM1R00150 Compulsion ON Time ( μs) 1 1 1 1 1 1.5 1.5 1.5 1.5 1.5 2.3 2.3 2.3 2.3 2.3 2.8 2.8 2.8 2.8 2.8 3.5 3.5 3.5 3.5 3.5 NONE NONE NONE NONE NONE Compulsion OFF Time ( μs) 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 〇This product has no designed protection against radioactive rays 1/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 BM1R00xxxF Typical Application Circuits VOUT VOUT VCC DRAIN 8 2 SH_IN SR_GND 7 3 SH_OUT GATE 6 4 SH_GND MAX_TON 5 5 4 SH_GND MAX_TON 6 3 GATE SH_OUT Primary Controler + - 1 SR_GND 7 2 SH_IN DRAIN 8 1 Primary Controler VCC + - GND GND High Side Application (FLYBACK) Low Side Application (FLYBACK) Pin Configuration (TOP VIEW) 8 DRAIN 7 SR_GND 6 GATE 5 4 SH_GND 3 SH_OUT 2 SH_IN 1 VCC MAX_TON Pin Description Pin No. Pin Name Function Power supply 1 VCC 2 SH_IN 3 SH_OUT Shunt regulator output 4 SH_GND Shunt regulator ground 5 MAX_TON Set maximum on time 6 GATE 7 SR_GND 8 DRAIN www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Shunt regulator reference Gate drive Synchronous rectification ground DRAIN monitor 2/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Block Diagram VOUT + - GND Primary Side Controller SH_GND SH_OUT SH_IN GATE DRAIN VCC LDO BLOCK SHUNT_REGULATOR 2kohm + DRAIN_COMP 0.8V Driver + VCCx1.4 SET_COMP S + -100mV PROTECTION BLOCK ・SH_OUT_OVP ・SH_IN_OVP ・TSD Timer LATCH Q R MAX_TON BLOCK MAX_TON BM1R00001-030: Include Timer LATCH BM1R00121-150: Without Timer LATCH SR_GND Compulsion ON TIME RESET_COMP + - Compulsion OFF TIME AUTO SHUTDOWN BLOCK -6mV www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Description of Block 1. SET_COMP Block Monitors the DRAIN terminal voltage, and outputs a signal to turn ON the FET if the DRAIN terminal voltage is less than or equal to -100mV (Typ). 2. RESET_COMP Block Monitors the DRAIN terminal voltage and outputs a signal to turn OFF the FET if the DRAIN terminal voltage is more than or equal to -6mV (Typ). 3. Compulsion ON TIME Block When the FET is turned ON due to SET_COMP detection, noise occurs on the DRAIN terminal. To prevent the noise from turning OFF the FET, an ON state should be forced for a certain time. Compulsion ON time is within a range of 0µs (None) to 3.5µs, which is different for each series number (refer to page.1 table). 4. Compulsion OFF TIME Block When the FET is turned OFF due to RESET_COMP detection, resonance waveforms appear on the DRAIN terminal. To prevent the noise from turning ON the FET, an OFF state should be forced for a certain time. Compulsion OFF time is within a range of 1.3µs to 4.6µs, which is different for each series number (refer to page.1 table). Operation sequence of each block is shown on the figure below. 二次側 DRAIN VOUT 0V -6mV -6mV -6mV -100mV SET COMP 0V ON RESET VGATE 0V Compulsion 0V OFF Time -100mV ON RESET COMP 0V Compulsion 0V ON Time -6mV -100mV -100mV RESET ON ON ON TIME ON TIME OFF TIME OFF TIME Figure 1. Operation sequence About Maximum Input Frequency The Maximum Operating Frequency of the IC depends on the Compulsion ON/OFF Time. For example, BM1R00026F and BM1R00146F Compulsion ON and OFF Time is both equal to 0μs. Considering a variation of 9%, the maximum input frequency is given by the following: fMAX = 1 / ((0μs + 1.3μs) x 1.09) = 706kHz However, since the frequency varies greatly due to the input voltage and load, it will be necessary to select the series in accordance with each application. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Description of Block – continued 5. MAX_TON Block MAX_TON block sets the maximum ON time. DRAIN terminal voltage starts counting when the rising edge of the output voltage exceeds VCC × 1.4V (Typ). In addition, the recounting starts when it detects another rising edge. The synchronous rectification FET will be forced OFF after the set time has elapsed. The time can be adjusted by varying the resistance value of the resistor connected to the MAX_TON terminal. The relationship between the resistance value (RMAX_TON) and set time (TMAX_TON) is described as follows: RMAX _ TON k t MAX _ TON µs 10k / s Calculation Example: If you want to set the maximum ON time to 10µs, the value of RMAX_TON is as follows: 10µs 10k / s 100k However, the formula above is for an ideal approximation only; it is still strongly advised that the operation of the actual application should still be verified. By setting this time, it becomes possible to prevent the simultaneous ON operation of the primary side and the secondary side in continuous mode. The drive sequence in continuous mode operation is shown in the figure below: VOUT I2 I1 Primary Side Controller (3) (1) Np Ns VH Vf + - (1) VG1 GND LFB VG1 VG2 RDRAIN2 I1 RDRAIN1 D1 GATE DRAIN VCC VDS2 I2 LDO BLOCK VCC x 1.4 DRAIN_COMP - R1 Driver + VCCx1.4 SET_COMP S + C1 VDS2 -100mV 0V Q -Vf MAX_TON BLOCK MAX_TON RMAX_TON -100mV -100mV R (4) VG2 (6) SR_GND Compulsion OFF TIME (2) (5) tMAX_ON Period allotted for G1 and G2 to avoid concurrent ON state at continuous mode operation. Compulsion OFF -6mV tMAX_ON Timer Start MAX_TON TIMER Compulsion OFF + Timer Start Compulsion ON TIME RESET_COMP Figure 2. The drive sequence in continuous mode operation (1) (2) (3) (4) (5) (6) Primary side FET = ON. Current I1 flows to the primary side FET. Secondary side drain voltage VDS2 rises. The VDS2 = VCC × 1.4 detects the rise edge of the threshold, MAX_TON timer start. Primary side FET = OFF. Current I2 flows through the Body Diode of the secondary side FET (OFF state). Secondary side drain voltage VDS2＜－100mV by I2 Current, Secondary side FET=ON. Elapsed the set time in MAX_TON terminals, the secondary-side FET = compulsory OFF. Since the I2 current flows through the Body Diode, Vf voltage occurs. a capacitor C1 and a Moreover, in order to reduce as much as possible the influence of the switching noise, resistor R1 in series should be connected to the MAX_TON terminal. The capacitance should approximately be 1000pF, and the resistance value is recommended to be around 1kΩ.This also serves as phase compensation of MAX_TON terminal and therefore should be connected. This function may be disabled by pulling up the MAX_TON terminal to VCC pin in quasi-resonant and current resonance applications which do not operate on continuous mode. The 1000pF and 1kΩ resistor is also unnecessary. 6. AUTO SHUTDOWN Block The Auto Shutdown block automatically turns the synchronous rectification ON/OFF depending on the presence or absence of the DRAIN terminal pulse. Shutdown occurs if the input pulses on the DRAIN terminal has more than 200us between pulses. This stops the synchronous rectification operation. The IC will restart the synchronous rectification after it detects 256 occurrences of input pulses on the DRAIN terminal. 7. SHUNT REGULATOR Chip A high-accuracy shunt regulator with ultra-low consumption is used for controlling the output voltage of the AC/DC. Since the synchronous rectification and the shunt regulator are built in a completely different chip, GND separation is possible. Therefore, it becomes possible to place the shunt regulator on the secondary-side GND reference in the synchronous rectification applications in case of disposing the High Side FET. It can also be used as protection for the comparator, the secondary side OVP, FET overheat protection, etc. 8. PROTECTION Block When an abnormal condition is detected after the timer count is completed, the photo coupler from SH_OUT terminal is driven to stop the switching operation on the primary side. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Absolute Maximum Ratings (Ta = 25°C) Parameter VCC Input Voltage MAX_TON Input Voltage Symbol Rating VMAX_VCC -0.3 to +40 VMAX_MAX_TON -0.3 to +40 VMAX_SH_IN SH_IN Input Voltage (Note 1) V (Note 1) V (Note 2) V (Note 2) V (Note 1) V -0.3 to +40 VMAX_SH_OUT -0.3 to +40 Gate Input Voltage VMAX_GATE -0.3 to 15.5 Drain Input Voltage VMAX_DRAIN SH_OUT Input Voltage Maximum Junction Temperature Operating Temperature Range Storage Temperature Unit 120 (Note 1)(Note 3) Tjmax +150 V °C Topr -40 to +105 °C Tstr -55 to +150 °C (Note 1) Reference SR_GND (Note 2) Reference SH_GND (Note 3) When a negative voltage is applied, current flows through the ESD protection device. This current value is about 6mA or less and will require a current limiting resistor to the DRAIN terminal Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse in case the IC is operated over the absolute maximum ratings. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s (Note 3) 2s2p (Note 4) Unit SOP8 Junction to Ambient Junction to Top Characterization Parameter (Note 2) θJA 197.4 109.8 °C/W ΨJT 21 19 °C/W (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70µm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm 70µm Recommended Operating Conditions (Ta = 25°C) Parameter Supply Voltage MAX_TON Resistor Range Symbol Min Typ Max Unit VCC 2.7 20 32 V RMAX_TON 56 - 300 kΩ MAX_TON R1 R1 0.5 1 2 kΩ MAX_TON C1 C1 680 1000 2200 pF www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Electrical Characteristics (Unless otherwise specified VCC=20V Ta=25°C) MIN Spec TYP MAX ION1 0.5 1 2 mA ISLEEP IACT IOFF 60 350 18 120 800 35 200 1400 60 μA μA μA fSW=50KHz at Switching Mode (GATE=OPEN) At Shutdown Mode Switching STOP Mode, VCC=1.9V VUVLO1 VUVLO2 2.00 1.95 2.30 2.25 2.65 2.60 V V VCC Sweep Up VCC Sweep Down VGONN VGOFF -150 -10 -100 -6 -50 -1 mV mV tCON -9 - 9 % tCOFF -9 - 9 % VMAX_ON_START 24 28 32 V MAX_TON Timer tMAX_ON 9.4 10 10.6 μs MAX_TON Output Voltage Auto Shutdown BLOCK Auto Shutdown Detect Time Auto Shutdown Cancel Pulse Number Drain Monitor BLOCK Drain Sink Current Drain Terminal Source Current1 Drain Terminal Source Current2 Driver BLOCK GATE Terminal High Voltage High Side FET ON-Resistance (VCC=2.7V) High Side FET ON-Resistance (VCC=5V) High Side FET ON-Resistance (VCC=10V) Low Side FET ON-Resistance (VCC=2.7V) Low Side FET ON-Resistance (VCC=5V) Propagation Delay to FET Turn ON Propagation Delay to FET Turn OFF VMAX_ON 0.24 0.40 0.56 V tSHD PACT 120 - 200 265 320 - μs time ID_SINK IDRAIN_SO1 IDRAIN_SO2 130 -23 -3 250 -11 -1 550 -5 -0.3 μA μA μA VDRAIN=120V VDRAIN=0.1V VDRAIN=-0.2V VGATE_H1 11 12 14 V VCC=20V RHIONR1 12.0 23.0 50.0 Ω VCC=2.7V, IOUT= -10mA RHIONR2 6.0 12.0 24.0 Ω VCC=5.0V, IOUT= -10mA RHIONR3 4.0 9.0 18.0 Ω VCC=10V, IOUT= -10mA RLOWONR1 1.1 2.2 4.4 Ω VCC=2.7V, IOUT= +10mA RLOWONR2 0.9 1.8 3.6 Ω VCC=5.0V, IOUT= +10mA tDELAY_ON tDELAY_OFF - 50 100 - ns ns VDRAIN=-300mV to +300mV VDRAIN =-300mV to +300mV Parameter Symbol Unit Conditions Circuit Current Circuit Current1 Circuit Current at Sleep Mode Circuit Current at Normal Mode Circuit Current at UVLO Mode VCC Item VCC UVLO Threshold Voltage1 VCC UVLO Threshold Voltage2 SR Controller BLOCK GATE Turn ON Threshold GATE Turn OFF Threshold Compulsion ON Time (Note 5) (Note 5) Compulsion OFF Time MAX_TON BLOCK MAX_TON Timer Start Threshold Voltage VDRAIN=-300mV to +300mV VDRAIN=-300mV to +300mV Excluding BM1R00026-30 and BM1R00146-150 which has no Compulsion ON Time VCC=20V, DRAIN Terminal Voltage RMAX_TON=100kΩ, VCC=3V, VDRAIN=-0.3↔7V No Pulse to DRAIN Terminal Input Pulse to DRAN Terminal (Note 5) See the lineup table in page1. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Electrical Characteristics (Unless otherwise specified VSH_OUT=20V Ta=25°C) MIN Spec TYP MAX VSHREF 0.796 0.800 0.804 V Reference Voltage Changing Ratio by Temperature ∆VSHEMP - -4 - mV SH_OUT Coefficient of the Reference Voltage1 ∆VSHREF1 - 1 - mV SH_OUT Coefficient of the Reference Voltage2 ∆VSHREF2 - 2 - mV ISH_IN -0.2 0.0 0.2 μA Dynamic Impedance1 ZSH_OUT1 - 0.3 - Ω Dynamic Impedance2 ZSH_OUT2 - 0.2 - Ω ISH_OUT 20 40 75 μA VSH_OUT=5V SH_OUT Sink Current=100µA VSH_OUT=5V SH_OUT Sink Current=100µA Temperature=25°C to 105°C VSH_OUT=2.7V to 5V SH_OUT Sink Current=100µA VSH_OUT=5V to 20V SH_OUT Sink Current=100µA VSH_IN=2V SH_OUT Sink Current =100µA to 300µA (VSH_OUT=2.7V) SH_OUT Sink Current =100µA to 300µA (VSH_OUT=20V) VSH_IN=0V, VSH_OUT=20V ISH_OUT_MIN 1 - - mA VSH_IN=0.85V, VSH_OUT=2.7V VSHI_OVP1 0.90 0.85 32.5 31.5 100 1.00 0.95 35 34 200 1.10 1.05 37.5 36.5 300 V VSHI_OVP2 VSHO_OVP1 VSHO_OVP2 tLATCH2 V V V μs ILATCH_SH_IN_OVP 1.3 2.5 5 mA Parameter Symbol Unit Conditions Shunt Regulator BLOCK (Other Chip) Reference Voltage Reference Input Current SH_OUT Current at SH_IN=Low SH_OUT Sink Current SH_IN OVP Detection Voltage1 SH_IN OVP Detection Voltage2 SH_OUT OVP Detection Voltage SH_OUT OVP Detection Voltage2 LATCH Timer SH_OUT Sink Current at LATCH Mode www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/22 VSH_IN= Sweep Up VSH_IN= Sweep Down VSH_OUT Sweep Up VSH_OUT Sweep Down VSH_OUT=5V, VSH_IN=0V TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Typical Performance Curves 1.4 1.4 Ta=105°C 1.2 1.2 Circuit Current: IACT [mA] CircuitCurrent Circuit Current : IACT [mA] Circuit Current IACT [mA] Ta=25°C 1.0 0.8 0.6 Ta=-40°C 0.4 0.2 1.0 Ta=25°C 0.8 0.6 0.4 Ta=-40°C 0.2 0.0 0 5 10 15 20 25 Input Voltage Input Voltage : VVcc[V] CC [V] 0.0 30 0.0 Figure 3. Circuit Current vs Input Voltage (Stop Switching State) 0.5 1.0 1.5 2.0 2.5 3.0 InputVoltage Voltage: V Vcc[V] Input CC [V] 3.5 4.0 Figure 4. Circuit Current vs Input Voltage (Stop Switching State VCC Zoom) 200 80 SH_OUT Sink [µA] Sink Current Current I:SH_OUT ISH_OUT[µA ] SH_OUT 180 Circuit [µA] ISLEEP[µA ] Circuit Current Current:ISLEEP Ta=105°C Ta=105°C 160 Ta=25°C 140 120 100 Ta=-40°C 80 60 40 70 60 Ta=105°C Ta=25°C 50 40 30 20 Ta=-40°C 10 20 0 0 0 5 10 15 20 25 Input Voltage Vcc[V] Input Voltage : VCC [V] 30 0 Figure 5. Circuit Current vs Input Voltage (at Shut Down State) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 10 15 20 25 Input Voltage Vcc[V] SH_OUT Voltage : VSH_OUT [V] 30 Figure 6. Circuit Current vs SH_OUT Voltage (VSH_IN=0V) 9/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF 0.820 11.0 0.815 10.8 0.810 MAX_TON Timer : tMAX_ON [ µs ] TMAX_ON[µs] Timer MAX_TON SH_IN [V] VSHREF SHREF[V] SH_IN Voltage Voltage: V Typical Performance Curves - continued VSH_OUT=20V VSH_OUT=5V 0.805 0.800 0.795 VSH_OUT=3V 0.790 10.6 VCC=20V VCC=20V 10.4 10.2 10.0 0.785 VCC=3V VCC=3V 9.8 9.6 9.4 9.2 0.780 9.0 -40 -20 0 20 40 60 80 Temperature Temperature : Ta Ta [°C][℃] 100 -40 Figure 7. SH_IN Voltage vs Temperature (ISH_OUT=100µA) -20 0 20 40 60 80 Temperature Ta[°C] [℃] Temperature : Ta 100 Figure 8. MAX_TON Timer vs Temperature (RMAX_TON=100kΩ, VDRAIN=-0.3V<->VCC x 2) -90 0 Gate [mV] ThresholdVoltageV Voltage :GOFF VGOFF [mV] Off Threshold GateOFF Gate [mV] : GON VGON GateON On Threshold Threshold Voltage V [mV] VCC=5V VCC=5V -95 VSH_OUT=3V -100 VSH_OUT=5V VSH_OUT=20V -105 -110 -1 -2 -3 -4 VSH_OUT=20V -5 -6 VSH_OUT=3V -7 VSH_OUT=5V -8 -9 -10 -40 -20 0 20 40 60 80 Temperature Ta [℃] Temperature : Ta [°C] 100 -40 0 20 40 60 Temperature Ta [℃] Temperature : Ta [°C] 80 100 Figure 10. Gate OFF Threshold vs Temperature (DRAIN Sweep Up) Figure 9. Gate ON Threshold vs Temperature (DRAIN Sweep Down) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -20 10/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Typical Performance Curves - continued 300 SH_OUT ISH_OUT Current :ISH_OUT SH_OUT Current A] [ µ[µA] SH_OUT SH_OUT[ [µA] µA] SH_OUTCurrent Current: IISH_OUT 5000 4000 Ta=105°C V Ta=25°C 3000 2000 Ta=-40°C 1000 250 Ta=105°C V 200 150 Ta=25°C 100 Ta=-40°C 50 0 0 740 760 780 800 820 840 SH_IN Voltage VSH_IN [V] SH_IN Voltage : VSH_IN [mV] 760 860 840 Figure 12. SH_OUT Current vs SH_IN Voltage (VSH_OUT=5V, ZOOM UP) Figure 11. SH_OUT Current vs SH_IN Voltage (VSH_OUT=5V) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 780 800 820 SH_IN Voltage VSH_IN [V] SH_IN Voltage : VSH_IN [mV] 11/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Timing Chart DRAIN 5V 4V 2.3V ≒1.3V VOUT(VCC) REG4V(Internal IC) 0.5V BG_0.5V (Internal IC) BG_OK (Internal IC) 1V REF1V (Internal IC) 4V DRV4V (Internal IC) DRAIN 4COUNT 4V VCC_UVLO VCC=2.3V 0.4V MAX_TON GATE DRAIN 9COUNT AUTO_SHUTDOWN (Internal IC) 200us SHUTDOWN DRAIN 265COUNT Figure 13. Start Up Sequence www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Application Examples RVCC RSH_OUT1 VOUT RSH_OUT2 PC1 CVCC RDRAIN2 LFB 2 SH_IN SR_GND 7 3 SH_OUT GATE 6 4 SH_GND MAX_TON RFB1 8 1 DRAIN VCC D1 RDRAIN1 + COUT - CFB1 RFB2 CFB2 RMAX_TON 5 R1 C1 GND M1 Figure 14. Flyback Application Circuit (Low Side FET) M1 CVCC RDRAIN1 RSH_OUT2 D1 RDRAIN2 1 VCC DRAIN 8 2 SH_IN SR_GND 7 3 SH_OUT GATE 6 4 RFB1 RFB2 RVCC RSH_OUT1 PC1 VOUT LFB SH_GND MAX_TON + COUT - CFB1 CFB2 RMAX_TON 5 R1 C1 GND Figure 15. Flyback Application Circuit (High Side FET) Built-in shunt regulator in the IC has been completely separated from internal and synchronous rectification control IC. Therefore, the shunt regulator is possible to be used as a GND reference in High Side type of flyback application. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF RFB4 RFB3 CFB3 4 3 5 2 DRAIN 6 VCC 7 SR_GND SH_IN 8 GATE SH_OUT RDRAIN4 D2 MAX_TON RDRAIN3 SH_GND LFB2 1 M2 Shunt regulator used as overvoltage (OVP) protection CVCC2 RSH_OUT13 PC2 RSH_OUT1 VOUT RSH_OUT2 PC1 CVCC1 Disable MAX_TON by pulling up to VCC if not in continuous mode operation such as in current resonance and quasi-resonant applications 2 SH_IN SR_GND 7 3 SH_OUT GATE 6 4 SH_GND MAX_TON 8 1 DRAIN VCC RFB1 + COUT - CFB1 RFB2 CFB2 D1 RDRAIN2 RDRAIN1 5 Shunt regulator used in feedback operation LFB1 GND M1 Figure 16. Resonant Half-bridge Application Circuit Regarding Protection Applications The built-in shunt regulator is high-voltage, low current consumption, high accuracy, and also suitable as a comparator for protection application. On the above current resonant circuit, the shunt regulator is used as an overvoltage protection circuit. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Selection of Externally Connected Components 1. MAX_TON Pin Setting A resistance value which is connected to the MAX_TON terminal is used to set the timer to force the GATE output OFF. (For detailed operation, please see "each block Operation / MAX_TON blocks") Set timer is proportional to the resistance value which can be set in the range of 56k to 300k. This IC is capable of an accuracy of 10us ± 6% at 100kΩ. However, accuracy deteriorates as the resistance value gets further away from 100kΩ. For example, 5.6µs ±0.9µs at 56kΩ, 30µs ±4.5µs at 300kΩ. (See graph below) 34.5u tTp P 30u Jitter G1 G1 Set the MAX_TON timer so that the FET of the primary side (G1) and the secondary side (G2) is not simultaneously ON 10.6u 10.0u 9.4u MAX_TON TIMER 56k 100k MAX_TON Resistor [ohm] 300k TMAX_ON tMAX_ON Compulsion OFF G2 G 2 6.5u 5.6u 4.7u Timer Start MAX_TON Timer [s] 25.5u Figure 18. Primary FET and Secondary FET Sequence at CCM Mode Figure 17. MAX_TON Timer vs MAX_TON Resistor(RMAX_TON) To prevent destruction due to surge current in continuous mode, set the MAX_TON timer before turning on the primary side FET (G1) to forcibly OFF the secondary side FET (G2). Regarding such variations, select a resistance value of MAX_TON terminal so that the MAX_ON timer setting time is less than one cycle in the primary side (TP > TMAX_ON). - The primary side of the maximum frequency = fMAX [Hz] - The primary side of the maximum frequency accuracy = ∆fMAX [%] - The primary side of the jitter frequency = fJITTER [Hz] - Secondary side MAX_TON timer time = tMAX_ON - Secondary side MAX_TON timer time accuracy = ∆tMAX_ON - Secondary side MAX_TON When the connection resistance accuracy = ∆R 10000 [kΩ][kHz] RMAX_TON[kΩ] < (1+∆tMAX_ON[%]+∆R[%] +∆fMAX[%])×(fMAX[kHz]+fJITTER [kHz]) Frequency Variation Ratio 2. Maximum Frequency Value Calculation Example Primary side frequency 100kHz ± 5% Primary side jitter frequency 8kHz Secondary side MAX_TON timer accuracy = 7% Secondary side MAX_TON connection resistance accuracy = 1% 10000 [kΩ][kHz] RMAX_TON [kΩ] < = 81.94 [kΩ] (1+5%+1%+7%)×(100kHz+8kHz) With these conditions, MAX_TON Resistor(RMAX_TON) should be set to 81kΩ or less. In addition, it is recommended that the temperature characteristics of each component should also be taken into account. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF I/O Equivalent Circuits PIN 1: VCC / PIN 6: GATE / PIN 7: SR_GND PIN 8: DRAIN Internal REG 1.VCC 8.DRAIN SR block 6.GATE 7.SR_GND 7.SR_GND PIN 2: SH_IN / PIN 3: SH_OUT / PIN 4: SH_GND PIN 5: MAX_TON Internal REG 3.SH_OUT 2.SH_IN 4.SH_GND www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5.MAX_TON 16/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Notes on the layout R VC C R SH_ OUT1 VOUT R SH_ OU T2 PC1 (1) (5) CVCC (6) 4 SH_GND MAX_TON GATE 6 3 SH_OUT SR _GND 7 SH_IN 8 VCC 2 DRAIN 1 (2) RFB 1 + C OUT - C FB1 RFB 2 5 RDRAIN2 (3) RDRAIN1 R MAX_TON D1 CFB 2 R1 C1 (8) M1 LFB1 (5) GND Rsnb Csnb (7) (4) Figure 19. Flyback Application Circuit (Low Side FET) (1) VCC line may malfunction under the influence of switching noise. Therefore, it is recommended to insert a capacitor CVCC between the VCC and SR_GND terminal. (2) SH_IN terminal is a high impedance line. To avoid crosstalk, electrical wiring should be as short as possible and not in parallel with the switching line. (3) MAX_TON terminal has a 0.4V output. The external components of the MAX_TON terminal affects the forced OFF time due to switching. Thus, R1 and C1 should be connected to MAX_TON terminal as near as possible. It is also recommended to use an independent electrical wiring in connection with SR_GND terminal. (4) The synchronous rectification controller IC must accurately monitor the VDS generated in the FET. Accordingly, the electrical wiring between the DRAIN to DRAIN and SR_GND to SOURCE of the IC and FET respectively should be connected independently. (5) The SH_GND of the shunt regulator and the feedback resistors of VOUT are recommended to be connected to the GND of the output with an independent electrical wiring. (6) The DRAIN terminal is a 0↔100V switching line. Use a narrow wiring and connect as short as possible. (7) Use an independent wiring if connecting a snubber circuit between the DS of the FET. The connection of the transformer output and the SOURCE of the FET should be thick and short as possible. (8) Due to the DRAIN pin detects the small voltage, a malfunction which the switch turns ON/OFF caused by the surge voltage may occur. So that, the filters such as the ferrite bead are recommended for alleviating the surge voltage. (Note 6) Configuration example : LFB1 ( a ferrite bead for suppressing the surge voltage) : MMZ1608S202A D1 ( a schottky barrier diode) : RB751G-40 RDRAIN1 ( a filter resistor for the FET turn off ) : 0.3k - 2kΩ RDRAIN2 ( a current limiting resistor to the DRAIN terminal) : 150Ω (Note 6) The value is not a guaranteed value, but for reference. Please choose the optimum values of the components after sufficient evaluations based on the actual application. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Operational Notes - continued 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND Parasitic Elements Pin B B GND GND GND Parasitic Elements N Region close-by Figure 20. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) BM1R00121F – BM1R00150F (Auto Restart Protection Series) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. BM1R00001F – BM1R00030F (Latch Protection Series) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Ordering Information B M 1 R 0 0 x x Part Number x F - E2 Package F:SOP8 Packaging and forming specification E2: Embossed tape and reel (SOP8) Marking Diagram SOP8 (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Part Number Marking 00xxx Package SOP8 Orderable Part Number BM1R00xxxF-E2 Latch Protection Series Function Name BM1R00001 BM1R00002 BM1R00003 BM1R00004 BM1R00005 BM1R00006 BM1R00007 BM1R00008 BM1R00009 BM1R00010 BM1R00011 BM1R00012 BM1R00013 BM1R00014 BM1R00015 BM1R00016 BM1R00017 BM1R00018 BM1R00019 BM1R00020 BM1R00021 BM1R00022 BM1R00023 BM1R00024 BM1R00025 BM1R00026 BM1R00027 BM1R00028 BM1R00029 BM1R00030 Part Number Compulsion ON Time Marking ( μs) 00001 1 00002 1 00003 1 00004 1 00005 1 00006 1.5 00007 1.5 00008 1.5 00009 1.5 00010 1.5 00011 2.3 00012 2.3 00013 2.3 00014 2.3 00015 2.3 00016 2.8 00017 2.8 00018 2.8 00019 2.8 00020 2.8 00021 3.5 00022 3.5 00023 3.5 00024 3.5 00025 3.5 00026 NONE 00027 NONE 00028 NONE 00029 NONE 00030 NONE www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Auto Restart Protection Series Compulsion OFF Time ( μs) 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 Function Name BM1R00121 BM1R00122 BM1R00123 BM1R00124 BM1R00125 BM1R00126 BM1R00127 BM1R00128 BM1R00129 BM1R00130 BM1R00131 BM1R00132 BM1R00133 BM1R00134 BM1R00135 BM1R00136 BM1R00137 BM1R00138 BM1R00139 BM1R00140 BM1R00141 BM1R00142 BM1R00143 BM1R00144 BM1R00145 BM1R00146 BM1R00147 BM1R00148 BM1R00149 BM1R00150 20/22 Part Number Compulsion ON Time Marking ( μs) 00121 1 00122 1 00123 1 00124 1 00125 1 00126 1.5 00127 1.5 00128 1.5 00129 1.5 00130 1.5 00131 2.3 00132 2.3 00133 2.3 00134 2.3 00135 2.3 00136 2.8 00137 2.8 00138 2.8 00139 2.8 00140 2.8 00141 3.5 00142 3.5 00143 3.5 00144 3.5 00145 3.5 00146 NONE 00147 NONE 00148 NONE 00149 NONE 00150 NONE Compulsion OFF Time ( μs) 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 1.3 2 3 3.6 4.6 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Physical Dimension, Tape and Reel Information Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 BM1R00xxxF Revision History Date Revision 2.Mar.2016 20.Apr. 2016 20.Apr. 2016 20.Apr. 2016 001 002 002 002 Changes Data Sheet Revision1 Release. Modification: P4, P5 VOUT->VCC Modification: P6, 74.2mm2->74.2mm x 74.2mm Modification: P15, Fig17 graph. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/22 TSZ02201-0F4F0A2BM1R0-1-2 20. Apr. 2016 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet BM1R00149F - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BM1R00149F SOP8 2500 2500 Taping inquiry Yes