SO T2 23 BTA204W-600B 3Q Hi-Com Triac 15 August 2014 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT223 surface mountable plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This triac will commutate the full rated RMS current at the maximum rated junction temperature without the aid of a snubber. 2. Features and benefits 3Q technology for improved noise immunity High commutation capability with maximum false trigger immunity High immunity to false turn-on by dV/dt Less sensitive gate for very high noise immunity Planar passivated for voltage ruggedness and reliability Surface mountable package 3. Applications • General purpose motor controls • Home appliances • Rectifier-fed DC inductive loads e.g. DC motors and solenoids 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM ITSM Conditions Min Typ Max Unit repetitive peak offstate voltage - - 600 V non-repetitive peak on- full sine wave; Tj(init) = 25 °C; state current tp = 20 ms; Fig. 4; Fig. 5 - - 10 A Scan or click this QR code to view the latest information for this product BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit IT(RMS) RMS on-state current full sine wave; Tsp ≤ 108 °C; Fig. 1; - - 1 A - - 50 mA - - 50 mA - - 50 mA Fig. 2; Fig. 3 Static characteristics IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 9 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 9 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 9 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate 4 mb mounting base; connected to T2 Graphic symbol 4 T2 sym051 1 2 T1 G 3 SC-73 (SOT223) 6. Ordering information Table 3. Ordering information Type number BTA204W-600B BTA204W-600B Product data sheet Package Name Description Version SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 2 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current Min Max Unit - 600 V - 1 A full sine wave; Tj(init) = 25 °C; tp 16.7 ms - 11 A full sine wave; Tj(init) = 25 °C; - 10 A full sine wave; Tsp ≤ 108 °C; Fig. 1; Fig. 2; Fig. 3 ITSM non-repetitive peak on-state current tp = 20 ms; Fig. 4; Fig. 5 I t I t for fusing tp = 10 ms; SIN - 0.5 A s dIT/dt rate of rise of on-state current IT = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C 2 2 over any 20ms period 003a a k837 6 003aak841 1.25 I T(RMS ) (A) 5 2 IT(RMS) (A) 1.00 108 °C 4 0.75 3 0.50 2 0.25 1 0 10-2 10-1 0 -50 1 10 s urge duration (s) f = 50 Hz; Tsp = 108 °C Fig. 1. Fig. 2. RMS on-state current as a function of surge duration; maximum values BTA204W-600B Product data sheet 50 100 Tsp (°C) 150 RMS on-state current as a function of solder point temperature; maximum values All information provided in this document is subject to legal disclaimers. 15 August 2014 0 © NXP Semiconductors N.V. 2014. All rights reserved 3 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 003aak839 1.6 Ptot (W) 1.2 0.8 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 101 Tsp(max) (°C) 107 α = 180° α 120° 90° 113 60° 30° 0.4 0 119 0 0.25 0.5 0.75 1.0 125 1.25 IT(RMS) (A) α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values 003aak840 103 ITSM IT t ITSM (A) tp Tj(init) = 25 °C max 102 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms Fig. 4. Non-repetitive peak on-state current as a function of pulse width; maximum values BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 4 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 003aak838 15 ITSM (A) 10 ITSM IT 5 t 1/f 0 Tj(init) = 25 °C max 1 102 10 number of cycles 103 f = 50 Hz Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 5 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle and half cycle; Fig. 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient printed circuit board mounted: minimum pad area; Fig. 7 - 70 - K/W printed circuit board mounted: minimum footprint; Fig. 8 - 156 - K/W 003aac210 102 Z th(j-sp) (K/W) 10 1 P 10-1 10-2 10-5 Fig. 6. tp 10-4 10-3 10-2 10-1 1 tp (s) t 10 Transient thermal impedance from junction to solder point as a function of pulse width BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 6 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 3.8 min 36 1.5 min 18 60 9 4.5 4.6 6.3 1.5 min (3×) 10 2.3 1.5 min 4.6 001aab508 7 All dimensions are in mm 15 Fig. 8. 50 001aab509 Minimum footprint SOT223 All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig. 7. Printed circuit board pad area: SOT223 BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 7 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; - - 50 mA - - 50 mA - - 50 mA - - 30 mA - - 45 mA - - 30 mA Static characteristics IGT gate trigger current Tj = 25 °C; Fig. 9 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 9 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 9 IL latching current VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 10 VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 10 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 10 IH holding current VD = 12 V; Tj = 25 °C; Fig. 11 - - 30 mA VT on-state voltage IT = 2 A; Tj = 25 °C; Fig. 12 - 1.2 1.5 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.7 1 V 0.25 0.4 - V VD = 600 V; Tj = 125 °C - 0.1 0.5 mA VDM = 402 V; Tj = 125 °C; (67% of 1000 - - V/µs 6 - - A/ms Fig. 13 VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 13 ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDRM); exponential waveform; gate open circuit dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 1 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 8 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 003aad600 3 003aad604 3 IGT IL IGT(25°C) IL(25°C) (1) 2 2 (2) (3) 1 1 0 -50 0 50 100 Tj (°C) 0 -50 150 (1) T2- G(2) T2+ G(3) T2+ G+ Fig. 9. 0 50 100 Tj (°C) 150 Fig. 10. Normalized latching current as a function of junction temperature Normalized gate trigger current as a function of junction temperature 003aad606 3 003aak836 3 IH IT (A) IH(25°C) 2 2 1 1 (1) 0 -50 0 50 100 Tj (°C) 0 150 0 (2) (3) 1 2 VT (V) 3 Vo = 1.27 V; Rs = 0.091 Ω Fig. 11. Normalized holding current as a function of junction temperature (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 12. On-state current as a function of on-state voltage BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 9 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 003aad596 1.6 VGT VGT(25°C) 1.2 0.8 0.4 -50 0 50 100 Tj (°C) 150 Fig. 13. Normalized gate trigger voltage as a function of junction temperature BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 10 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 10. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 e1 3 Lp bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA SC-73 EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 Fig. 14. Package outline SC-73 (SOT223) BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 11 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac 11. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4×) (4×) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 sot223_fr Fig. 15. Reflow soldering footprint for SC-73 (SOT223) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 1 2 8.7 Dimensions in mm 3 1.9 (3×) 2.7 occupied area preferred transport direction during soldering 2.7 1.1 1.9 (2×) sot223_fw Fig. 16. Wave soldering footprint for SC-73 (SOT223) BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 12 / 15 BTA204W-600B NXP Semiconductors 3Q Hi-Com Triac In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 12. Legal information 12.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. 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Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Limiting values .......................................................3 8 Thermal characteristics .........................................6 9 Characteristics ....................................................... 8 10 Package outline ................................................... 11 11 Soldering .............................................................. 12 12 12.1 12.2 12.3 12.4 Legal information .................................................13 Data sheet status ............................................... 13 Definitions ...........................................................13 Disclaimers .........................................................13 Trademarks ........................................................ 14 © NXP Semiconductors N.V. 2014. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 August 2014 BTA204W-600B Product data sheet All information provided in this document is subject to legal disclaimers. 15 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 15 / 15