CYD02S36V/36VA FLEx36™ 3.3 V (64K x 36) Synchronous Dual-Port RAM Features Functional Description ■ True dual-ported memory cells that enable simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Pipelined output mode allows fast operation ■ 0.18 micron complementary metal oxide semiconductor (CMOS) for optimum speed and power ■ High speed clock to data access ■ 3.3 V low power ❐ Active as low as 225 mA (typ.) ❐ Standby as low as 55 mA (typ.) ■ Mailbox function for message passing ■ Global master reset ■ Separate byte enables on both ports ■ Commercial and industrial temperature ranges ■ IEEE 1149.1-compatible joint test action group (JTAG) boundary scan ■ 256 Ball fine-pitch ball grid array (FBGA) (1-mm pitch) ■ Counter wrap around control ❐ Internal mask register controls counter wrap-around ❐ Counter-interrupt flags to indicate wrap-around ❐ Memory block retransmit operation ■ Counter readback on address lines ■ Mask register readback on address lines ■ Dual chip enables on both ports for easy depth expansion ■ Seamless migration to next-generation dual-port family The FLEx36™ family includes 2-Mbit pipelined, synchronous, true dual-port static RAMs that are high speed, low power 3.3 V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. A particular port can write to a certain location while another port is reading that location. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap-around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). Seamless Migration to Next-Generation Dual-Port Family Cypress offers a migration path for all devices in this family to the next-generation devices in the Dual-Port family with a compatible footprint. Please contact Cypress Sales for more details. Table 1. Product Selection Guide 2 Mbit (64K x 36) Density Part number CYD02S36V/36VA Max. speed (MHz) 167 Max. access time – clock to data (ns) 4.4 Typical operating current (mA) 225 Package Cypress Semiconductor Corporation Document Number: 38-06076 Rev. *K 256 FBGA (17 mm x 17 mm) • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised December 17, 2012 CYD02S36V/36VA Logic Block Diagram FTSELL FTSELR CONFIG Block CONFIG Block PORTSTD[1:0]R PORTSTD[1:0]L DQ [35:0]L BE [3:0]L CE0L CE1L OEL IO Control IO Control DQ [35:0]R BE [3:0]R CE0R CE1R OER R/WR R/WL Dual Ported Array BUSYL A [15:0]L CNT/MSKL ADSL CNTENL CNTRSTL RETL CNTINTL CL Arbitration Logic Address & Counter Logic BUSYR Address & Counter Logic WRPL WRPR JTAG TRST TMS TDI TDO TCK RESET LOGIC MRST READYR LowSPDR Mailboxes INTL INTR READYL LowSPDL Document Number: 38-06076 Rev. *K A [15:0]R CNT/MSKR ADSR CNTENR CNTRSTR RETR CNTINTR CR Page 2 of 29 CYD02S36V/36VA Contents Pin Configurations ........................................................... 4 Pin Definitions .................................................................. 5 Master Reset ..................................................................... 6 Mailbox Interrupts ............................................................ 6 Address Counter and Mask Register Operations .......... 6 Counter Reset Operation ............................................ 7 Counter Load Operation .............................................. 7 Counter Increment Operation ...................................... 8 Counter Hold Operation .............................................. 8 Counter Interrupt ......................................................... 8 Counter Readback Operation ...................................... 8 Retransmit ................................................................... 8 Mask Reset Operation ................................................. 8 Mask Load Operation .................................................. 8 Mask Readback Operation .......................................... 8 Counting by Two ......................................................... 8 IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 10 Performing a TAP Reset ........................................... 10 Performing a Pause/Restart ...................................... 10 Maximum Ratings ........................................................... 12 Document Number: 38-06076 Rev. *K Operating Range ............................................................. 12 Electrical Characteristics ............................................... 12 Capacitance .................................................................... 12 Switching Characteristics .............................................. 13 JTAG Timing ................................................................... 14 JTAG Switching Waveform ............................................ 15 Switching Waveforms .................................................... 15 Ordering Information ...................................................... 25 64K × 36 (2-Mbit) 3.3 V Synchronous CYD02S36V Dual-Port SRAM ............................................................... 25 Ordering Code Definitions ......................................... 25 Package Diagram ............................................................ 26 Acronyms ........................................................................ 27 Document Conventions ................................................. 27 Units of Measure ....................................................... 27 Document History Page ................................................. 28 Sales, Solutions, and Legal Information ...................... 29 Worldwide Sales and Design Support ....................... 29 Products .................................................................... 29 PSoC Solutions ......................................................... 29 Page 3 of 29 CYD02S36V/36VA Pin Configurations Figure 1. Pin Diagram - 256-ball FBGA (Top View) CYD02S36V/36VA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A DQ32L DQ30L DQ28L DQ26L DQ24L DQ22L DQ20L DQ18L DQ18R DQ20R DQ22R DQ24R DQ26R DQ28R DQ30R DQ32R B DQ33L DQ31L DQ29L DQ27L DQ25L DQ23L DQ21L DQ19L DQ19R DQ21R DQ23R DQ25R DQ27R DQ29R DQ31R DQ33R C DQ34L DQ35L RETL [1,2] INTL NC [1,4] NC [1,4] REVL [1,3] TRST [1,4] MRST NC [1,4] NC [1,4] NC [1,4] INTR RETR [1,2] DQ35R DQ34R D A0L A1L WRPL [1,2] VREFL [1,3] VSS VTTL VTTL VSS LOWSP FTSEL DR [1,3] R [1,2] VREFL [1,3] WRPR [1,2] A1R A0R E A2L A3L CE0L CE1L VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO R VDDIO R VDDIO R CE1R CE0R A3R A2R F A4L A5L CNTINTL BE3L VDDIOL VSS VSS VSS VSS VSS VSS VDDIO R BE3R CNTINTR A5R A4R G A6L A7L BUSYL [1,4] BE2L REVL [1,2] VSS VSS VSS VSS VSS VSS VDDIO R BE2R BUSYR [1,4] A7R A6R H A8L A9L CL VTTL VCORE VSS VSS VSS VSS VSS VSS VCORE VTTL CR A9R A8R J A10L A11L VSS PORTST D1L [1,3] VCORE VSS VSS VSS VSS VSS VSS VCORE PORTSTD 1R [1,3] VSS A11R A10R K A12L A13L OEL BE1L VDDIOL VSS VSS VSS VSS VSS VSS VDDIO R BE1R OER A13R A12R L A14L A15L ADSL BE0L VDDIOL VSS VSS VSS VSS VSS VSS VDDIO R BE0R ADSR A15R M NC [1,4] NC [1,4] R/WL REVL [1,3] VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO R VDDIO R VDDIO R REVR [1,3] R/WR NC [1,4] NC [1,4] N NC [1,4] NC [1,4] CNT/ MSKL VREFL [1,3] VREFR [1,3] CNT/ MSKR NC [1,4] NC [1,4] P DQ16L DQ17L R DQ15L DQ13L DQ11L T DQ14L DQ12L DQ10L FTSELL LOWSP [1,2] DL [1,3] A14R PortST D0L [1,3] READY L [1,4] REVL [1,2] VTTL VTTL REVR [1,2] READY R [1,4] PortST D0R [1,3] NC [1,4] NC [1,4] TCK TMS TDO TDI NC [1,4] NC [1,4] DQ9L DQ7L DQ5L DQ3L DQ1L DQ1R DQ3R DQ5R DQ7R DQ9R DQ11R DQ13R DQ15R DQ8L DQ6L DQ4L DQ2L DQ0L DQ0R DQ2R DQ4R DQ6R DQ8R DQ10R DQ12R DQ14R CNTENL CNTRSTL CNTRSTR CNTENR DQ17R DQ16R Notes 1. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 2. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 3. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. 4. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. Document Number: 38-06076 Rev. *K Page 4 of 29 CYD02S36V/36VA Pin Definitions Left Port A0L–A15L Right Port A0R–A15R BE0L–BE3L BE0R–BE3R BUSYL[5,8] CL BUSYR[5,8] CR CE0L CE0R CE1L DQ0L–DQ35L OEL CE1R DQ0R–DQ35R OER INTL INTR CNT/MSKL ADSL CNTENL CNTRSTL CNTINTL CNT/MSKR ADSR CNTENR CNTRSTR CNTINTR WRPL[5,6] RETL[5,6] FTSELL[5,6] WRPR[5,6] RETR[5,6] FTSELR[5,6] VREFL[5,7] VREFR[5,7] VDDIOR REVR[5, 6, 7] Description Address inputs Byte enable inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. Port busy output. When the collision is detected, a BUSY is asserted. Input clock signal Active low chip enable input Active high chip enable input Data bus input/output. Output enable input. This asynchronous signal must be asserted LOW to enable the DQ data pins during read operations. Mailbox interrupt flag output. The mailbox permits communications between ports. The upper two memory locations can be used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. [5,7] [5,7] LowSPDL LowSPDR Port low speed select input. PORTSTD[1:0]L[5,7] PORTSTD[1:0]R[5,7] Port address/control/data io standard select inputs. R/WL R/WR Read/write enable input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. READYL[5,8] READYR[5,8] Port ready output. This signal is asserted when a port is ready for normal operation. VDDIOL REVL [5, 6, 7] MRST TRST[5,8] TMS TDI TCK TDO Port counter/mask select input. Counter control input. Port counter address load strobe input. Counter control input. Port counter enable input. Counter control input. Port counter reset input. Counter control input. Port counter interrupt output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all “1s”. Port counter wrap input. The burst counter wrap control input. Port counter retransmit input. Counter control input. Flow-through select. Use this pin to select Flow-Through mode. When is de-asserted, the device is in pipelined mode. Port external high-speed io reference input. Port I/O power supply. Reserved pins for future features. Master reset input. MRST is an asynchronous input signal and affects both ports. A maser reset operation is required at power up. JTAG reset input. JTAG test mode select input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. JTAG test data input. Data on the TDI input is shifted serially into selected registers. JTAG test clock input. JTAG test data output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. Ground inputs. VSS Notes 5. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 6. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 7. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. 8. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. Document Number: 38-06076 Rev. *K Page 5 of 29 CYD02S36V/36VA Pin Definitions (continued) Left Port Right Port VCORE[9] VTTL Description Core power supply. LVTTl power supply for JTAG IOs Master Reset The FLEx36 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx36 family devices after power up. Mailbox Interrupts The upper two memory locations may be used for message passing and permit communications between ports. Table 2 shows the interrupt operation for both ports of CYD02S36V/36VA. The highest memory location, FFFF is the mailbox for the right port and FFFE is the mailbox for the left port. Table 2 shows that to set the INTR flag, a Write operation by the left port to address FFFF asserts INTR LOW. At least one byte must be active for a Write to generate an interrupt. A valid Read of the FFFF location by the right port resets INTR HIGH. At least one byte must be active in order for a Read to reset the interrupt. When one port Writes to the other port’s mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-thru mode (i.e., it follows the clock edge of the writing port). Also, the flag is reset in a flow-thru mode (i.e., it follows the clock edge of the reading port). Each port can read the other port’s mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins must be left open. Address Counter and Mask Register Operations Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations, and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more “0s” in the most significant bits define the masked region, one or more “1s” in the least significant bits define the unmasked region. Bit 0 may also be “0,” masking the least significant counter bit and causing the counter to increment by two instead of one. The mirror register is used to reload the counter register on increment operations (see “retransmit,” below). It always contains the value last loaded into the counter register, and is changed only by the Counter Load, and Counter Reset operations, and by the MRST. Table 3 on page 7 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 3 on page 7 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port’s CLK. All these counter and mask operations are independent of the port’s chip enable inputs (CE0 and CE1). Table 2. Interrupt Operation Example [10, 11, 12, 13] Function Left Port R/WL CEL A0L–15L Right Port INTL R/WR CER A0R–15R INTR Set Right INTR Flag L L FFFF X X X X L Reset Right INTR Flag X X X X H L FFFF H Set Left INTL Flag X X X L L L FFFE X Reset Left INTL Flag H L FFFE H X X X X Notes 9. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses VCORE of 1.5 V or 1.8V. Please contact local Cypress FAE for more information. 10. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 11. OE is “Don’t Care” for mailbox operation. 12. At least one of BE0, BE1, BE2, or BE3 must be LOW. 13. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. Document Number: 38-06076 Rev. *K Page 6 of 29 CYD02S36V/36VA Counter Reset Operation Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port’s burst counter is loaded when the port’s address strobe (ADS) and CNTEN signals are LOW. When the port’s CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port’s clock signal. This Read’s or Write’s one word from/into each successive address location until CNTEN is deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to 0s. A counter-mask register is used to control the counter wrap. All unmasked bits of the counter and mirror registers are reset to “0.” All masked bits remain unchanged. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 0000, as does master reset (MRST). Counter Load Operation The address counter and mirror registers are both loaded with the address value presented at the address lines. Table 3. Address Counter and Counter-Mask Register Control Operation (Any Port) [14, 15] CLK MRST CNT/MSK CNTRST ADS CNTEN X L X X X X Masterreset Operation Reset address counter to all 0s and mask register to all 1s. Description H H L X X Counter reset Reset counter unmasked portion to all 0s. H H H L L Counter load Load counter with external address value presented on address lines. H H H L H Counter readback Read out counter internal value on address lines. H H H H L Counter increment Internally increment address counter value. H H H H H Counter hold Constantly hold the address value for multiple clock cycles. H L L X X Mask reset Reset mask register to all 1s. H L H L L Mask load Load mask register with value presented on the address lines. H L H L H Mask readback Read out mask register value on address lines. H L H H X Reserved Operation undefined Notes 14. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 15. Counter operation and mask register operation is independent of chip enables. Document Number: 38-06076 Rev. *K Page 7 of 29 CYD02S36V/36VA Counter Increment Operation Once the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a “1” for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are “1,” the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being “1s,” a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 0000 by externally connecting CNTINT to CNTRST.[16] An increment that results in one or more of the unmasked bits of the counter being “0” de-asserts the counter interrupt flag. The example in Figure 3 on page 10 shows the counter mask register loaded with a mask value of 003Fh unmasking the first 6 bits with bit “0” as the LSB and bit “16” as the MSB. The maximum value the mask register can be loaded with is FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment once the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value till it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value. Counter Hold Operation The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface. Counter Interrupt The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all “1s.” It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST. Counter Readback Operation The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2 after the next rising edge of the port’s clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 9 shows a block diagram of the operation. Retransmit Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal “mirror register” is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this “mirror register.” If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back to the value initially stored into the “mirror register.” Thus, the repeated access of the same data is allowed without the need for any external logic. Mask Reset Operation The mask register is reset to all “1s,” which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all “1s.” Mask Load Operation The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n – 1 or 2n – 2. From the most significant bit to the least significant bit, permitted values have zero or more “0s,” one or more “1s,” or one “0.” Thus FFFF, 03FE, and 0001 are permitted values, but F0FF, 03FC, and 0000 are not. Mask Readback Operation The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port’s clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 9 shows a block diagram of the operation. Counting by Two When the least significant bit of the mask register is “0,” the counter increments by two. This may be used to connect the x36 devices as a 72-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 72-bit data in even memory locations, and the other half in odd memory locations. Note 16. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. Document Number: 38-06076 Rev. *K Page 8 of 29 CYD02S36V/36VA Figure 2. Counter, Mask, and Mirror Logic Block Diagram[1] CNT/MSK CNTEN Decode Logic ADS CNTRST MRST Bidirectional Address Lines Mask Register Counter/ Address Register Address RAM Decode Array CLK From Address Lines Load/Increment 16 Mirror 1 From Mask Register From Mask From Counter Increment Logic Wrap 16 16 16 16 Bit 0 +1 Wrap Detect 1 +2 Wrap 0 1 0 Document Number: 38-06076 Rev. *K To Readback and Address Decode 0 0 16 Counter 1 16 To Counter Page 9 of 29 CYD02S36V/36VA Figure 3. Programmable Counter-Mask Register Operation[17] Example: Load Counter-Mask Register = 3F CNTINT H 0 0 0s 215 214 0 1 H X X L X X H X X 215 214 IEEE 1149.1 Serial Boundary Scan (JTAG)[18] The FLEx36 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1-compliant TAPs. The TAP operates using JEDEC-standard 3.3V IO logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Performing a TAP Reset 1 X 0 0 1 0 0 Xs X 1 1 1 1 Mask Register bit-0 0 26 25 24 23 22 21 20 215 214 Max + 1 Address Register 1 1 Unmasked Address Xs 215 214 Max Address Register 1 26 25 24 23 22 21 20 Masked Address Load Address Counter = 8 1 1 1 Address Counter bit-0 26 25 24 23 22 21 20 Xs X 0 0 1 0 0 0 26 25 24 23 22 21 20 devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up. Performing a Pause/Restart When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester must be configured to never enter the PAUSE-DR state. A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the Table 4. Identification Register Definitions Instruction Field Value Description Revision number (31:28) 0h Reserved for version number. Cypress device ID (27:12) C001h Defines Cypress part number for CYD02S36V/36VA Cypress JEDEC ID (11:1) 034h Allows unique identification of the DP family device vendor. ID register presence (0) 1 Indicates the presence of an ID register. Notes 17. The “X” in this diagram represents the counter upper bits. 18. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance. Document Number: 38-06076 Rev. *K Page 10 of 29 CYD02S36V/36VA Table 5. Scan Register Sizes Register Name Bit Size Instruction 4 Bypass 1 Identification 32 Boundary Scan n[19] Table 6. Instruction Identification Codes Instruction Code Description EXTEST 0000 Captures the input/output ring contents. Places the BSR between the TDI and TDO. BYPASS 1111 Places the BYR between TDI and TDO. IDCODE 1011 Loads the IDR with the vendor ID code and places the register between TDI and TDO. HIGHZ 0111 Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state. CLAMP 0100 Controls boundary to 1/0. Places BYR between TDI and TDO. SAMPLE/PRELOAD 1000 Captures the input/output ring contents. Places BSR between TDI and TDO. NBSRST 1100 Resets the non-boundary scan logic. Places BYR between TDI and TDO. RESERVED All other codes Other combinations are reserved. Do not use other than the above. Note 19. See details in the device BSDL files. Document Number: 38-06076 Rev. *K Page 11 of 29 CYD02S36V/36VA DC Input Voltage ............................ –0.5 V to VDD + 0.5 V[21] Maximum Ratings Exceeding maximum ratings[20] may shorten the useful life of the device. User guidelines are not tested. Output Current into Outputs (LOW)............................. 20 mA Static Discharge Voltage.......................................... > 2000 V Storage Temperature ................................ –65 °C to +150 °C (JEDEC JESD22-A114-2000B) Ambient Temperature with Latch-up Current..................................................... > 200 mA Power Applied .......................................... –55 °C to +125 °C Supply Voltage to Ground Potential..............–0.5 V to +4.6 V DC Voltage Applied to Outputs in High-Z State ........................ –0.5 V to VDD +0.5 V Operating Range Ambient Temperature Range Commercial VDDIO/VTTL VCORE[22] 0 °C to +70 °C 3.3 V±165 mV 1.8 V±100 mV Electrical Characteristics Over the Operating Range Parameter -167 Description Min Typ Max Unit VOH Output HIGH voltage (VDD = Min, IOH= –4.0 mA) 2.4 – – V VOL Output LOW voltage (VDD = Min, IOL= +4.0 mA) – – 0.4 V VIH Input HIGH voltage 2.0 – – V VIL Input LOWvoltage – – 0.8 V IOZ Output leakage current –10 – 10 A IIX1 Input leakage current except TDI, TMS, MRST –10 – 10 A IIX2 Input leakage current TDI, TMS, MRST –1.0 – 0.1 mA ICC Operating current for (VDD = Max.,IOUT = 0 mA), outputs disabled – 225 300 mA ISB1 Standby current (both ports TTL level) CEL and CER VIH, f = fMAX – 90 115 mA ISB2 Standby current (one port TTL level) CEL | CER VIH, f = fMAX – 160 210 mA ISB3 Standby current (both ports CMOS level) CEL and CER VDD – 0.2V, f = 0 – 55 75 mA ISB4 Standby current (one port CMOS level) CEL | CER VIH, f = fMAX – 160 210 mA ICORE[22] Core operating current for (VDD = Max, IOUT = 0 mA), outputs disabled – 0 0 mA Capacitance Part Number CYD02S36V/36VA/ Parameter[23] Description CIN Input capacitance COUT Output capacitance Test Conditions TA = 25 °C, f = 1 MHz, VDD = 3.3 V Max Unit 13 pF 10 pF Notes 20. The voltage on any input or IO pin cannot exceed the power pin during power up. 21. Pulse width < 20 ns. 22. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses VCORE of 1.5V or 1.8V. Please contact local Cypress FAE for more information 23. COUT also references CIO. Document Number: 38-06076 Rev. *K Page 12 of 29 CYD02S36V/36VA Figure 4. AC Test Load and Waveforms Z0 = 50 3.3 V R = 50 R1 = 590 OUTPUT OUTPUT C = 10 pF C = 5 pF VTH = 1.5 V (a) Normal Load (Load 1) (b) Three-state Delay (Load 2) 3.0 V ALL INPUT PULSES R2 = 435 90% 10% Vss < 2 ns 90% 10% < 2 ns Switching Characteristics Over the Operating Range -167 Parameter Description CYD02S36V/CYD02S36VA Min Max – 167 Unit fMAX2 Maximum operating frequency tCYC2 Clock cycle time 6.0 – ns tCH2 Clock HIGH time 2.7 – ns tCL2 Clock LOW time 2.7 – ns tR[24] Clock rise time – 2.0 ns tF[24] Clock fall time – 2.0 ns tSA Address setup time 2.3 – ns tHA Address hold time 0.6 – ns tSB Byte select setup time 2.3 – ns tHB Byte select hold time 0.6 – ns tSC Chip enable setup time 2.3 – ns tHC Chip enable hold time 0.6 – ns tSW R/W setup time 2.3 – ns tHW R/W hold time 0.6 – ns tSD Input data setup time 2.3 – ns tHD Input data hold time 0.6 – ns tSAD ADS setup time 2.3 – ns tHAD ADS hold time 0.6 – ns tSCN CNTEN setup time 2.3 – ns tHCN CNTEN hold time 0.6 – ns tSRST CNTRST setup time 2.3 – ns tHRST CNTRST hold time 0.6 – ns tSCM CNT/MSK setup time 2.3 – ns tHCM CNT/MSK hold time 0.6 – ns tOE Output enable to data valid – 4.4 ns MHz Note 24. Except JTAG signals (tr and tf < 10 ns [max.]). Document Number: 38-06076 Rev. *K Page 13 of 29 CYD02S36V/36VA Switching Characteristics Over the Operating Range (continued) -167 Parameter Description CYD02S36V/CYD02S36VA Min Max 0 – Unit tOLZ[25, 26] OE to Low Z tOHZ[25, 26] OE to High Z 0 4.0 ns tCD2 Clock to data valid – 4.4 ns tCA2 Clock to counter address valid – 4.0 ns tCM2 Clock to mask register readback valid – 4.0 ns tDC Data output hold after clock HIGH tCKHZ[25, 26] Clock HIGH to output high Z tCKLZ[25, 26] Clock HIGH to output low Z 1.0 4.0 ns tSINT Clock to INT set time 0.5 6.7 ns tRINT Clock to INT reset time 0.5 6.7 ns tSCINT Clock to CNTINT set time 0.5 5.0 ns tRCINT Clock to CNTINT reset time 0.5 5.0 ns Clock to clock skew 5.2 – ns ns 1.0 – ns 0 4.0 ns Port to Port Delays tCCS Master Reset Timing tRS Master reset pulse width 5.0 – cycles tRS Master reset setup time 6.0 – ns tRSR Master reset recovery time 5.0 – cycles tRSF Master reset to outputs inactive – 10.0 ns tRSINT Master reset to counter and mailbox interrupt flag reset time – 10.0 ns JTAG Timing Parameter fJTAG tTCYC tTH tTL tTMSS tTMSH tTDIS tTDIH tTDOV tTDOX Description Maximum JTAG TAP controller frequency TCK clock cycle time TCK clock HIGH time TCK clock LOW time TMS setup to TCK clock rise TMS hold After TCK clock rise TDI setup to TCK clock rise TDI hold after TCK clock rise TCK clock LOW to TDO valid TCK clock LOW to TDO invalid 167 Min – 100 40 40 10 10 10 10 – 0 Max 10 – – – – – – – 30 – Unit MHz ns ns ns ns ns ns ns ns ns Notes 25. This parameter is guaranteed by design, but it is not production tested. 26. Test conditions used are Load 2. Document Number: 38-06076 Rev. *K Page 14 of 29 CYD02S36V/36VA JTAG Switching Waveform tTH Test Clock TCK tTMSS tTL tTCYC tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOX tTDOV Switching Waveforms MRST ALL ADDRESS/ DATA LINES tRSF tRSS ALL OTHER INPUTS TMS Figure 5. Master Reset tRS tRSR INACTIVE ACTIVE tRSINT CNTINT INT TDO Document Number: 38-06076 Rev. *K Page 15 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 6. Read Cycle[27, 28, 29, 30, 31] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSB tHB tSW tSA tHW tHA tSC tHC BE0–BE3 R/W ADDRESS DATAOUT An An+1 1 Latency An+2 tDC tCD2 Qn tCKLZ An+3 Qn+1 tOHZ Qn+2 tOLZ OE tOE Notes 27. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK andcan be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 28. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 29. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 30. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 31. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. Document Number: 38-06076 Rev. *K Page 16 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 7. Bank Select Read[32, 33] tCH2 tCYC2 tCL2 CLK tHA tSA ADDRESS(B1) A0 A1 A3 A2 A4 A5 tHC tSC CE(B1) tCD2 tHC tSC tCD2 tHA tSA A0 ADDRESS(B2) tDC A1 tDC tCKLZ A3 A2 tCKHZ Q3 Q1 Q0 DATAOUT(B1) tCD2 tCKHZ A4 A5 tHC tSC CE(B2) tSC tCD2 tHC tCKHZ DATAOUT(B2) tCD2 Q4 Q2 tCKLZ tCKLZ Figure 8. Read-to-Write-to-Read (OE = LOW)[34, 35, 36, 37, 38] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W tSW tHW An ADDRESS tSA An+1 An+2 An+2 An+3 tSD tHD tHA DATAIN An+2 tCD2 tDC tCKHZ Dn+2 Qn DATAOUT READ NO OPERATION WRITE Notes 32. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx36 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 33. ADS = CNTEN= BE0 – BE3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. 34. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 35. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 36. During “No Operation,” data in memory at the selected address may be corrupted and must be rewritten to ensure data integrity. 37. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 38. CE0 = BE0 – BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK. Document Number: 38-06076 Rev. *K Page 17 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 9. Read-to-Write-to-Read (OE Controlled)[39, 40, 41, 42] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W ADDRESS tSW tHW An tSA An+1 An+2 tHA An+3 An+4 An+5 tSD tHD Dn+2 DATAIN Dn+3 tCD2 DATAOUT tCD2 Qn Qn+4 tOHZ OE READ WRITE READ Figure 10. Read with Address Counter Advance[41] tCH2 tCYC2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tSCN DATAOUT tHCN Qx–1 tCD2 Qx READ EXTERNAL ADDRESS tDC Qn READ WITH COUNTER Qn+1 COUNTER HOLD Qn+2 Qn+3 READ WITH COUNTER Notes 39. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 40. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 41. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 42. CE0 = BE0 – BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK. Document Number: 38-06076 Rev. *K Page 18 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 11. Write with Address Counter Advance [43] tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL ADDRESS An tSAD tHAD tSCN tHCN An+1 An+2 An+3 An+4 ADS CNTEN Dn DATAIN tSD tHD WRITE EXTERNAL ADDRESS Dn+1 Dn+1 WRITE WITH COUNTER Dn+2 WRITE COUNTER HOLD Dn+3 Dn+4 WRITE WITH COUNTER Note 43. CE0 = BE0 – BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. Document Number: 38-06076 Rev. *K Page 19 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 12. Counter Reset [44, 45] tCYC2 tCH2 tCL2 CLK tSA INTERNAL ADDRESS Ax tSW tHW tSD tHD An 1 0 Ap Am An ADDRESS tHA Ap Am R/W ADS CNTEN tSRST tHRST CNTRST DATAIN D0 tCD2 tCD2 [46] DATAOUT Q0 COUNTER RESET WRITE ADDRESS 0 tCKLZ READ ADDRESS 0 READ ADDRESS 1 Qn Q1 READ ADDRESS An READ ADDRESS Am Notes 44. CE0 = BE0 – BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. 45. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 46. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value Document Number: 38-06076 Rev. *K Page 20 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 13. Readback State of Address Counter or Mask Register[47, 48, 49, 50] tCYC2 tCH2 tCL2 CLK tCA2 or tCM2 tSA tHA EXTERNAL ADDRESS A0–A16 An* An INTERNAL ADDRESS An+1 An An+2 An+3 An+4 tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 LOAD EXTERNAL ADDRESS tCKHZ Qx-1 Qn READBACK COUNTER INTERNAL ADDRESS INCREMENT tCKLZ Qn+1 Qn+2 Qn+3 Notes 47. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 48. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 49. Address in input mode. Host can drive address bus after tCKHZ. 50. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines. Document Number: 38-06076 Rev. *K Page 21 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 14. Left_Port (L_Port) Write to Right_Port (R_Port) Read[51, 52, 53] tCH2 tCYC2 tCL2 CLKL tHA tSA L_PORT ADDRESS An tSW tHW R/WL tCKHZ tSD L_PORT tCKLZ Dn DATAIN CLKR tHD tCYC2 tCL2 tCCS tCH2 R_PORT ADDRESS tSA tHA An R/WR tCD2 R_PORT Qn DATAOUT tDC Notes 51. CE0 = OE = ADS = CNTEN = BE0 – BE3 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 52. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 53. If tCCS < minimum specified value, then R_Port Reads the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port Reads the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock. Document Number: 38-06076 Rev. *K Page 22 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 15. Counter Interrupt and Retransmit[54, 55, 56, 57, 58, 59] tCH2 tCYC2 tCL2 CLK tSCM tHCM CNT/MSK ADS CNTEN COUNTER INTERNAL ADDRESS FFFC FFFD FFFE tSCINT FFFF Last_Loaded Last_Loaded +1 tRCINT CNTINT Notes 54. X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 55. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. 56. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 57. CNTINT is always driven. 58. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 59. The mask register assumed to have the value of FFFFh. Document Number: 38-06076 Rev. *K Page 23 of 29 CYD02S36V/36VA Switching Waveforms (continued) Figure 16. MailBox Interrupt Timing[60, 61, 62, 63, 64] tCH2 tCYC2 tCL2 CLKL tSA L_PORT ADDRESS tHA FFFF An+1 An An+2 An+3 tSINT tRINT INTR tCH2 tCYC2 tCL2 CLKR tSA R_PORT ADDRESS tHA Am+1 Am FFFF Am+3 Am+4 Table 7. Read/Write and Enable Operation (Any Port)[65, 66, 67, 68] Inputs OE Operation CE0 CE1 R/W DQ0 – DQ35 X H X X High-Z Deselected X X L X High-Z Deselected X L H L DIN Write L L H H DOUT Read L H X High-Z Outputs disabled H CLK Outputs X Notes 60. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 61. Address “FFFF” is the mailbox location for R_Port of this device. 62. L_Port is configured for Write operation, and R_Port is configured for Read operation. 63. At least one byte enable (BE0 – BE3) is required to be active during interrupt operations. 64. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. 65. X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 66. OE is an asynchronous input signal. 67. When CE changes state, deselection and Read happen after one cycle of latency. 68. CE0 = OE = LOW; CE1 = R/W = HIGH. Document Number: 38-06076 Rev. *K Page 24 of 29 CYD02S36V/36VA Ordering Information 64K × 36 (2-Mbit) 3.3 V Synchronous CYD02S36V Dual-Port SRAM Speed (MHz) 167 Ordering Code CYD02S36VA-167BBC Package Name BB256 Package Type 256-ball BGA 17 mm × 17 mm with 1.7-mm pitch CYD02S36VA-167BBXC Operating Range Commercial 256-ball BGA 17 mm × 17 mm with 1.7-mm pitch Pb-free Ordering Code Definitions CY D 02 S 36 VA - 167 BB C Temperature Range: C = Commercial Package Type: BB = 256-ball BGA Speed Grade: 167 MHz VA = 3.3 V 36 = Width: × 36 S = Sync 02 = Density: 2 Mb D = Dual Port SRAM CY = Cypress Device Document Number: 38-06076 Rev. *K Page 25 of 29 CYD02S36V/36VA Package Diagram Figure 17. 256-ball FBGA (17 × 17 × 1.7 mm) BB256/BW0BD Package Outline, 51-85108 51-85108 *I Document Number: 38-06076 Rev. *K Page 26 of 29 CYD02S36V/36VA Acronyms Document Conventions Acronym Description Units of Measure BGA ball grid array CMOS complementary metal oxide semiconductor °C degrees Celsius FBGA very fine ball gird array A microamperes I/O input/output mA milliampere JTAG joint test action group MHz megahertz SRAM static random access memory Document Number: 38-06076 Rev. *K Symbol Unit of Measure ns nanoseconds pF picofarads V volts ohms W watts Page 27 of 29 CYD02S36V/36VA Document History Page Document Title: CYD02S36V/36VA, FLEx36™ 3.3 V (64 K × 36) Synchronous Dual-Port RAM Document Number: 38-06076 REV. ECN NO. Orig. of Change Submission Date ** 232012 WWZ See ECN New data sheet *A 244232 WWZ See ECN Changed pinout Changed FTSEL# to FTSEL in the block diagram *B 313156 YDT See ECN Changed pinout D10 from NC to VSS to reflect test mode pin swap, C10 from rev[2,4] to VSS to reflect SC removal. Changed tRSCNTINT to tRSINT Added tRSINT to the master reset timing diagram Added CYD01S36V to data sheet Added ISB5 and changed IIX2 *C 321033 YDT See ECN Added CYD18S36V-133BBI to the Ordering Information Section *D 327338 AEQ See ECN Change Pinout C10 from VSS to NC[2,5] Change Pinout G5 from VDDIOL to REVL[2,3] *E 365315 YDT See ECN Added note for VCORE Removed preliminary status *F 2193427 NXR/AESA See ECN Changed tCD2 and tOE Spec from 4ns to 4.4ns for -167. Template Update. *G 2623658 VKN/PYRS 12/17/08 Added CYD02S36VA-15AXC part *H 2899734 VKN 03/26/2010 Modified title on page 1 Removed 1M, 4M, 9M, and 18M densities and their related information Modified Logic block diagram and pin configuration Removed Industrial operating grade Removed 133 ns and 100ns speed bins Removed “BB256B” (23 x 23 x 1.7mm) 256-Ball FBGA package Updated Ordering Information table Updated “BB256” (17 x 17 x 1.7mm) 256-Ball FBGA package diagram *I 3110296 ADMU 12/14/2010 Updated Ordering Information. Added Ordering Code Definitions. *J 3202287 ADMU 03/22/2011 Updated as per template Updated notes Added Acronyms and Units of Measure table. *K 3843734 SMCH 12/17/2012 Updated Ordering Information: Added CYD02S36VA-167BBXC part. Description of Change Updated Package Diagram: spec 51-85108 - Changed revision from *H to *I. Document Number: 38-06076 Rev. *K Page 28 of 29 CYD02S36V/36VA Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control PSoC Solutions cypress.com/go/automotive cypress.com/go/clocks psoc.cypress.com/solutions cypress.com/go/interface PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing cypress.com/go/memory cypress.com/go/image PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/touch USB Controllers Wireless/RF cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2004-2012. The information contained herein is subject to change without notice. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-06076 Rev. *K Revised December 17, 2012 Page 29 of 29 FLEx36 and FLEx36-E are trademarks of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. All products and company names mentioned in this document may be the trademarks of their respective holders.