CPC1998 AC Power Switch INTEGRATED CIRCUITS DIVISION Characteristics Description Parameter Rating Units AC Operating Voltage 20-240 Vrms CPC1998J is an AC Solid State Switch utilizing dual power SCR outputs. This device also includes zero-cross turn-on circuitry and is specified with an 800VP blocking voltage. Load Current With 5°C/W Heat Sink 20 No Heat Sink 5 Arms On-State Voltage Drop 1.1 VP (at IL=2AP) Blocking Voltage 800 VP Thermal Resistance, Junction-to-Case, JC 0.35 °C/W Features • • • • • • • • • • • • Load Current up to 20Arms with 5°C/W Heat Sink 800VP Blocking Voltage 5mA Control Current Zero-Cross Switching Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications 2500Vrms Isolation, Input to Output DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity Machine Insertable, Wave Solderable Applications • • • • • • • • • • Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide exceptional noise immunity and 2500Vrms of isolation between the control and the output. As a result, the CPC1998 is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communications and control systems. The unique i4-PAC package pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal resistance (0.35 °C/W). Ordering Information Part Description CPC1998J i4-PAC Package (25 per tube) Pin Configuration ZC Approvals 1 2 AC Load • UL 508 Recognized Component: File E69938 3 4 + LED – LED e3 DS-CPC1998-R05 www.ixysic.com 1 CPC1998 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 I2t for Fusing (1/2 Sine Wave, 60Hz) Isolation Voltage, Input to Output ESD, Human Body Model Operational Temperature Storage Temperature 1 2 Min - Max 800 5 50 1 150 3.5 Units - 200 A2s - 40 - 40 2500 8 +85 +125 Vrms kV VP V mA A mW W Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. °C °C Derate linearly 1.33mW / °C. Free air, no heat sink. 1.2 Electrical Characteristics @ 25°C Parameter Output Characteristics Load Current Continuous Continuous Maximum Surge Current Off-State Leakage Current On-State Voltage Drop 1 Off-State dV/dt Switching Speeds Turn-On Turn-Off Zero-Cross Turn-On Voltage 2 Holding Current Latching Current Operating Frequency Load Power Factor for Guaranteed Turn-On 3 Input Characteristics Input Control Current to Activate 4 Input Dropout Voltage Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output 1 2 3 4 Conditions Symbol No Heat Sink, VL=20-240Vrms TC=25°C 1/2 Sine Wave, 60Hz VL=800V IL=2AP IF=0mA IP ILEAK IF=5mA ton toff IL - dV/dt Minimum Typical Maximum 0.1 0.1 1000 0.85 - 5 50 150 100 1.1 - 5 44 48 - 0.5 0.5 20 5 50 75 500 - Units Arms A AP VP V/s 1st half-cycle subsequent half-cycle f=60Hz PF 20 0.25 IL=1A Resistive, f=60Hz IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.4 10 mA V V A - CI/O - - 3 pF - IH IL cycles V mA mA Hz - Tested at a peak value equivalent. Zero-cross first half-cycle @ < 100Hz. Snubber circuits may be required at low power factors. For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use IF 10mA. R05 www.ixysic.com 2 CPC1998 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.35 °C/W Free Air JA 33 °C/W - TJ -40 to +125 °C Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating (TJ - TA) θCA = PD - θJC TJ = Junction Temperature (°C), TJ ≤ 125°C * TA = Ambient Temperature (°C) θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD = On-State Voltage (Vrms) • Load Current (Arms) * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 2.3 Thermal Performance Data Output Power vs. Load Current Output Power vs. Ambient Temperature 40 Output Power (W) 35 30 25 20 40 35 30 25 20 15 15 10 10 5 5 0 0 0 3 Output Power (W) Heat Sink 1ºC/W 2ºC/W 5ºC/W 10ºC/W 15ºC/W Free Air 5 10 15 20 25 30 Load Current (Arms) 35 40 0 25 www.ixysic.com 50 75 Temperature (ºC) 100 125 R05 CPC1998 INTEGRATED CIRCUITS DIVISION 3 Performance Data @ 25°C (Unless Otherwise Noted)* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 30 25 20 15 10 5 20 15 10 1.25 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 5 20 15 10 5 6.6 6.8 7.0 7.2 Zero-Cross Voltage (V) 5 1.3 1.2 20 40 60 Temperature (ºC) 80 LED Current to Operate vs. Load Frequency - Resistive Load (VP=71V, RL=10Ω, IL=7A) 4.0 3.5 3.0 878 880 882 884 Blocking Voltage (VP) 3.0 -20 0 20 40 60 Temperature (ºC) 80 LED Current to Operate vs. Load Frequency - Inductive Load (VL=200V, ZL=400mH/220Ω) 5.15 5.10 5.05 5.00 4.95 4.90 0 100 200 300 400 Load Frequency (Hz) 500 600 6.5 6.0 5.5 5.0 4.5 5.20 -20 0 20 40 60 Temperature (ºC) 80 100 LED Current to Operate vs. Load Frequency- Inductive Load (VL=200V, ZL=196mH/110Ω) 5.18 5.16 5.14 5.12 5.10 4.85 2.5 7.0 4.0 -40 100 886 LED Forward Current to Operate vs. Temperature - Inductive Load (IL=500mA, fL=60Hz, LL=400mH) 7.5 3.5 5.20 LED Forward Current (mA) 4.5 876 4.0 2.5 -40 100 874 LED Forward Current (mA) 1.4 7.4 LED Forward Current (mA) 1.5 LED Forward Current (mA) IF=50mA IF=20mA IF=10mA IF=5mA 0 10 LED Forward Current to Operate vs. Temperature - Resistive Load (IL=1A, fL=60Hz) 4.5 1.6 -20 15 0 6.4 Typical LED Forward Voltage Drop vs. Temperature 1.1 -40 0.856 0.859 0.862 0.865 0.868 0.871 0.874 Forward Voltage Drop (V) 2.90 Typical Blocking Voltage Distribution (N=50) Device Count (N) Device Count (N) 2.70 2.74 2.78 2.82 2.86 LED Forward Current (mA) Zero-Cross Voltage (N=50, IF=5mA) 6.2 LED Forward Voltage (V) 10 0 2.66 0 LED Forward Current (mA) 15 5 1.30 20 Forward Voltage Drop Distribution (N=50, IF=5mA, IL=2A) 20 0 0 5.0 25 Device Count (N) 35 Typical IF for Switch Operation with 1A Resistive Load (N=50, VL=120VAC/60Hz) 0 100 200 300 400 Load Frequency (Hz) 500 600 0 100 200 300 400 Load Frequency (Hz) 500 600 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 4 CPC1998 INTEGRATED CIRCUITS DIVISION 7.2 6.4 1.00 0 -5 0.95 0.90 0.85 IL=3A IL=2A IL=1A 0.80 -10 6.2 0 20 40 60 Temperature (ºC) 80 0.75 -15 -1.5 100 Holding Current vs. Temperature (RL=1.9Ω) -1.0 -0.5 0.0 0.5 Voltage (V) 1.0 Total Heat Sinking Required vs. Temperature 1000 30 60 50 40 30 IL=5Arms IL=7.5Arms IL=10Arms IL=15Arms IL=20Arms 25 20 15 10 5 0 -20 0 20 40 60 Temperature (ºC) 80 100 0 10 20 30 40 50 60 70 Temperature (ºC) 80 90 100 -20 0 20 40 60 Temperature (ºC) 80 100 Breakdown Voltage vs. Temperature (IF=0mA) 950 900 850 800 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Surge Current Non-Repetitive, Free Air Leakage Current vs. Temperature Measured Across Pins 1&2 1000 100 VL=800V VL=600V VL=400V 10 Current (A) Leakage current (μA) 0.70 -40 1.5 Breakdown Voltage (V) -20 70 20 -40 5 IL=10A IL=5A 1.05 VON (V) 6.6 80 Holding Current (mA) Current (A) 6.8 VON vs. Temperature 1.10 TA=-40ºC TA=25ºC TA=85ºC 10 7.0 6.0 -40 Output Voltage vs. Output Current (IF=5mA) 15 Thermal Resistance (ºC/W) Zero-Cross Voltage (V) 7.4 Zero-Cross Voltage vs. Temperature (IF=5mA, RL=120Ω) 1 0.1 100 10 0.01 0.001 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1 100μs 1ms 10ms 100ms Time 1s 10s * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R05 CPC1998 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1998J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1998J 245°C for 30 seconds NOTE: The exposed surface of the DCB substrate is not to be soldered. 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3 R05 www.ixysic.com 6 CPC1998 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.930 ± 0.381 (0.076 ± 0.015) 17.221 ± 0.254 (0.678 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 15.317 ± 0.254 (0.603 ± 0.010) 20.879 ± 0.254 (0.822 ± 0.010) DCB Substrate NOTE: Not to be soldered 2.362 ± 0.381 (0.093 ± 0.015) 20.396 ± 0.508 (0.803 ± 0.020) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 15.240 ± 0.508 (0.600 ± 0.020) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Metallized external surface of DCB substrate maintains 2500Vrms isolation to device internal structure and all external pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1998-R05 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/9/2015 7 www.ixysic.com R05